Metal ceramic heating element, preparation method thereof, heating device and heating non-combustion device

Abstract

The invention relates to the technical field of ceramic heating bodies, in particular to a metal ceramic heating body, a preparation method thereof, a heating device and a heating non-combustion device. The metal ceramic heating body provided by the invention comprises a ceramic base material and a foil combined with at least one surface of the ceramic base material, wherein the foil contains active metal elements, and at least part of the active metal elements are bonded with the interface of the ceramic substrate. The foil containing the active metal component is adopted to replace printing thick film metal slurry commonly used on the surface of the ceramic base material, the cost is low, the metal ceramic heating body is easy to regulate and control in sheet resistance and good in durability, the performance consistency of the metal ceramic heating body is remarkably improved, and therefore the metal ceramic heating body has the good application prospect. And the device has a good application prospect when being used for heating a heater of a non-combustion device.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of ceramic heating bodies, and particularly relates to a metal ceramic heating body, a preparation method thereof, a heating device and a heat-not-burn device. BACKGROUND

[0002] A heat-not-burn (HNB) device is an aerosol generating device that realizes conversion of an aerosol substrate into aerosol (suspended particles) for use by a user through heating. The heat-not-burn device generally includes a battery, a heater, an aerosol generating substrate (such as a heat-not-burn cartridge), and other core components. The heat-not-burn device has the advantages of small harm, easy cleaning, and fashionable appearance.

[0003] The heater in the heat-not-burn device generally uses metal ceramic heater (MCH) material for heating, which has the advantages of high efficiency, environmental protection, and energy saving. However, the current metal ceramic metal heating body generally uses thick film printing metal paste, which needs to use thick film printing and sintering processes. Not only is the process complex, but there are also problems such as uneven printing film thickness, difficulty in sintering resistance value control, and defects such as pinholes / holes, edge serrations, and metal migration in the metal circuit, thereby causing certain bottlenecks in the performance consistency of the heating body. SUMMARY

[0004] The purpose of the present application is to provide a metal ceramic heating body, a preparation method thereof, a heating device, and a heat-not-burn device, aiming to solve the technical problem of how to improve the performance consistency of the metal ceramic heating body at low cost.

[0005] To achieve the above application purpose, the technical solution adopted by the present application is as follows:

[0006] In a first aspect, the present application provides a metal ceramic heating body, comprising: a ceramic base material and a foil combined with at least one surface of the ceramic base material; wherein the foil contains active metal elements, and at least part of the active metal elements are bonded with the interface of the ceramic base material.

[0007] The metal ceramic heating body provided by the present application includes a ceramic base material and a foil combined with at least one surface of the ceramic base material. Since the foil contains active metal elements, it can be bonded with the surface of the ceramic base material to form a stable metal ceramic heating body. At the same time, the present application uses a foil containing active metal elements to replace the commonly used thick film metal paste on the surface of the metal ceramic heating body, which realizes low cost. Moreover, the metal ceramic heating body of the present application has easy resistance control, good durability, and significantly improved performance consistency, and therefore has good application prospects in the related heating field such as the heater of the heat-not-burn device.

[0008] In some possible implementation manners, the active metal element comprises at least one of titanium, zirconium and hafnium. The active metal element refers to a metal element that can be bonded to the surface of the ceramic substrate through interfacial reaction under certain conditions (such as pressure and temperature). Titanium, zirconium and hafnium can be well interfacially reacted with most ceramic substrate surfaces under certain pressure and heat conditions, thereby forming a stable cermet heating body.

[0009] In some possible implementation manners, the active metal element comprises titanium, and the material of the foil comprises at least one of titanium metal, titanium-zirconium-nickel-copper alloy and titanium-copper-nickel alloy.

[0010] Alternatively, the active metal element comprises zirconium, and the material of the foil comprises at least one of zirconium metal, nickel-zirconium alloy and zirconium-niobium alloy.

[0011] Alternatively, the active metal element comprises hafnium, and the material of the foil comprises at least one selected from hafnium metal, nickel-hafnium alloy and hafnium-tantalum-molybdenum alloy.

[0012] By selecting the corresponding foil materials for different active metal elements (such as titanium, zirconium or hafnium), the foil materials not only can be easily obtained in the market, but also can be well interfacially bonded to the ceramic substrate.

[0013] In some possible implementation manners, the foil has a specific resistance of 10-200 μΩ·cm.

[0014] The foil containing the active metal element used in the cermet heating body has a high specific resistance, specifically, the specific resistance of the foil can be changed in the range of 10-200 μΩ·cm according to the selection of the material. Thus, by bonding the foil to the ceramic substrate and adjusting the thickness of the foil, the resistance of the cermet heating body can be well adjusted.

[0015] In some possible implementation manners, the foil has a thickness of 1-5 μm.

[0016] The thinner foil in the cermet heating body can better adjust the square resistance, so that the cermet heating body can have a suitable square resistance to adapt to the application scenario.

[0017] In some possible implementation manners, the ceramic substrate comprises at least one of silicon nitride, aluminum nitride, silicon carbide, aluminum oxide, zirconia-alumina and quartz ceramic; and / or the ceramic substrate is a ceramic layer, and the ceramic layer has a thickness of 0.1 mm-1 mm.

[0018] The ceramic substrate of the above type can be easily obtained and has good high-temperature resistance and corrosion resistance. The ceramic substrate with the above thickness can make the cermet heating body have good heating efficiency.

[0019] In some possible implementation manners, the foil is provided with a protective coating away from the surface of the ceramic substrate.

[0020] By providing the protective coating on the surface of the foil, the service life of the foil can be further improved, and the metal ceramic heating body has better durability.

[0021] In some possible implementation manners, the protective coating comprises at least one of glass, silicon nitride, aluminum nitride, aluminum oxide, zirconia-alumina, titanium oxide, zirconia, and chromium oxide.

[0022] The protective coating of the above-mentioned material can well protect the metal ceramic heating body.

[0023] In a second aspect, the application provides a preparation method of a metal ceramic heating body, comprising:

[0024] providing a ceramic substrate and a foil substrate, the foil substrate containing active metal elements;

[0025] after the foil substrate is attached to at least one surface of the ceramic substrate, performing a hot-pressing bonding reaction treatment, and then performing a cooling treatment;

[0026] performing a resistance adjustment treatment on the foil substrate bonded to the ceramic substrate to obtain a metal ceramic heating body.

[0027] In the application, the foil substrate containing active metal elements is hot-pressed with the ceramic substrate at high temperature, the active metal elements in the foil substrate and the ceramic substrate perform an interface bonding reaction, and then the foil substrate is subjected to resistance adjustment. Such a preparation method is not only easy to implement and has low process cost, but also can obtain a metal ceramic heating body with easily adjustable resistance, good durability, and significantly improved performance consistency.

[0028] In some possible implementation manners, the temperature of the hot-pressing bonding reaction treatment is 800-950℃, and the time is 5-30min.

[0029] The pressure of the hot-pressing bonding reaction treatment is 0.5-200Mpa.

[0030] The hot-pressing bonding reaction treatment is performed in a vacuum or inert atmosphere.

[0031] The interface bonding reaction can be sufficiently performed under the above-mentioned temperature and time conditions. By attaching the foil substrate to the ceramic substrate through the above-mentioned pressure, the solid-state diffusion effect can be increased, so that the interface reaction is better performed. The bonding reaction in a vacuum or inert atmosphere is more stable.

[0032] In some possible implementation manners, the cooling rate of the cooling treatment is 1-2℃ / min; and / or, the cooling treatment is to 25-30℃.

[0033] After the high-temperature thermal compression bonding reaction, the foil substrate and the ceramic substrate after bonding can be stabilized by the slow cooling rate, and are not prone to cracking. Moreover, the subsequent process can be well performed when the temperature is lowered to the vicinity of room temperature.

[0034] In some possible implementation manners, before the foil substrate is attached to the ceramic substrate, the foil substrate is subjected to surface pickling treatment, and the surface of the ceramic substrate is subjected to plasma activation treatment or acid pickling activation treatment.

[0035] The surface metal of the foil substrate is prone to oxidation in air, and the oxide layer can be removed by surface pickling treatment, so that the interface bonding reaction can be better performed. By activating the surface of the ceramic substrate, the interface bonding reaction between the active metal elements of the foil substrate and the surface of the ceramic substrate can be better performed.

[0036] In some possible implementation manners, after the surface of the ceramic substrate is subjected to plasma activation treatment or acid pickling activation treatment, at least one metal of titanium, zirconium and hafnium is deposited on the surface of the ceramic substrate.

[0037] By depositing at least one metal of titanium, zirconium and hafnium as active filler metal on the surface of the ceramic substrate, the bonding reaction can be better promoted between the ceramic substrate and the foil substrate, and high-strength connection of the ceramic substrate and the foil can be achieved.

[0038] In some possible implementation manners, the thickness of the foil substrate is 5-70μm, and after the part of the surface of the foil substrate away from the ceramic substrate and not subjected to bonding reaction is removed, the remaining thickness is 1-5μm; and / or,

[0039] The ceramic substrate is a ceramic layer, and the thickness of the ceramic layer is 0.1-1mm.

[0040] By thinning the foil after bonding on the surface of the ceramic substrate, the sheet resistance can be better adjusted, so that the metal ceramic heating element can have a suitable sheet resistance to adapt to the application scenario. Moreover, the ceramic substrate with the above thickness can make the metal ceramic heating element have good heating efficiency.

[0041] In some possible implementation manners, the resistance adjusting treatment of the foil substrate bonded to the ceramic substrate comprises: removing the part of the surface of the foil substrate away from the ceramic substrate and not subjected to bonding reaction by using a chemical etching method or a mechanical grinding method.

[0042] The unreacted part of the foil substrate surface can be removed by chemical etching or mechanical grinding.

[0043] In some possible implementation manners, the active metal element includes at least one of titanium, zirconium and hafnium; when the active metal element includes titanium, the foil substrate includes at least one of titanium metal, titanium-zirconium-nickel-copper alloy and titanium-copper-nickel alloy; when the active metal element includes zirconium, the foil substrate includes at least one of zirconium metal, nickel-zirconium alloy and zirconium-niobium alloy; and when the active metal element includes hafnium, the foil substrate includes at least one of hafnium metal, nickel-hafnium alloy and hafnium-tantalum-molybdenum alloy.

[0044] For different active metal elements (such as titanium, zirconium or hafnium), corresponding foil substrate materials can be selected, which are not only easy to obtain on the market, but also can be well bonded with the ceramic substrate.

[0045] In some possible implementation manners, the ceramic substrate includes at least one of silicon nitride, aluminum nitride, silicon carbide, aluminum oxide, zirconium oxide-aluminum oxide and quartz ceramic.

[0046] The ceramic substrate of the above type is easy to obtain and has good high-temperature resistance and corrosion resistance.

[0047] In some possible implementation manners, the ceramic substrate includes aluminum nitride, and the ceramic substrate is subjected to pre-oxidation treatment before the foil substrate is attached to the ceramic substrate.

[0048] Through the pre-oxidation treatment, aluminum oxide is generated on the surface of the aluminum nitride, so that the bonding reaction can be well controlled, and the bonding reaction at the interface is more uniform.

[0049] In some possible implementation manners, the method further includes: performing patterning treatment on the foil surface of the cermet heating element;

[0050] And / or, the foil connecting electrode lead of the cermet heating element is connected;

[0051] And / or, a protective coating is deposited on the foil surface of the cermet heating element.

[0052] The patterning treatment on the foil surface of the cermet heating element can obtain a heating pattern required by an application scenario. By connecting the foil connecting electrode lead of the cermet heating element to a power supply, the cermet heating element can be well electrically heated. The deposition of the protective coating on the foil surface of the cermet heating element can further improve the service life of the foil, so that the cermet heating element has better durability.

[0053] In a third aspect, the present application provides a heating device comprising the cermet heating element of the first aspect of the present application and / or the cermet heating element prepared by the preparation method of the second aspect of the present application.

[0054] The heating device provided by the present application comprises the cermet heating element specific to the present application, so that the heating device of the present application has the characteristics of good durability and significantly improved performance consistency, and such a heating device has good heating performance in various application scenarios.

[0055] In a fourth aspect, the present application provides a heat-not-burn device comprising an aerosol generating substrate and the heating device of the third aspect of the present application.

[0056] The heat-not-burn device provided by the present application uses the heating device specific to the present application, and because the heating device of the present application has the characteristics of good durability and significantly improved performance consistency, the heat-not-burn device of the present application can uniformly and stably heat the aerosol generating substrate.

[0057] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, the specific embodiments of the present application can be implemented according to the content of the description, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application will be described. BRIEF DESCRIPTION OF DRAWINGS

[0058] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0059] Figure 1 is a cross-sectional structure schematic diagram of the cermet heating element provided by the embodiments of the present application;

[0060] Figure 2 is a surface top view structure schematic diagram of the cermet heating element provided by the embodiments of the present application;

[0061] Figure 3 is a preparation method flowchart schematic diagram of the cermet heating element provided by the embodiments of the present application; wherein, the marks in the figure are: 1-ceramic substrate, 2-foil. DETAILED DESCRIPTION

[0062] In order to make the technical problems, technical solutions and beneficial effects to be solved in the present application clearer, the present application will be further described in detail below in conjunction with embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application and not to limit the present application.

[0063] In the present application, the term "and / or" describes the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. Wherein A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0064] In the present application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following" or similar expressions means any combination of these items, including any combination of single item or multiple items. For example, "at least one of a, b or c", or "at least one of a, b and c", can represent a, b, c, a-b (i.e. a and b), a-c, b-c, or a-b-c, wherein a, b and c can be single or multiple.

[0065] It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and part or all of the steps can be executed in parallel or in sequence, and the execution order of the processes should be determined according to their functions and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0066] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0067] The weight of the related components mentioned in the specification of the embodiments of the present application can not only refer to the specific content of each component, but also represent the proportional relationship between the weights of each component. Therefore, as long as the content of the related components in the specification of the embodiments of the present application is enlarged or reduced in proportion, it is within the scope disclosed in the specification of the embodiments of the present application. Specifically, the mass mentioned in the specification of the embodiments of the present application can be μg, mg, g, kg and other mass units commonly known in the chemical field.

[0068] The terms "first", "second", etc. are used only for the purpose of description and are used to distinguish one object from another, and are not to be interpreted as indicating or implying relative importance or indicating the number of the technical features indicated. For example, without departing from the scope of the embodiments of the present application, the first XX can also be referred to as the second XX, and similarly, the second XX can also be referred to as the first XX. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0069] The term "heat-not-burn device" is an aerosol generating device that converts a liquid, solid or paste aerosol substrate into an aerosol (suspended particles) for a user to use by an electric heating technology.

[0070] The term "aerosol generating substrate" refers to a basic component used in an aerosol generating device, such as a heat-not-burn cartridge, which is a raw material that generates an aerosol by heating.

[0071] The term "aerosol" refers to all colloids that can be suspended in the air, and in the present application, it mainly refers to a mixture of suspended particles / suspended particles generated when a heat-not-burn device is operated, which is formed by heating an aerosol generating substrate, and the "mist" inhaled by a user is such an aerosol.

[0072] The heat-not-burn device heats the aerosol generating substrate to be heated to atomize the aerosol generating substrate to form an aerosol. The common heat-not-burn device precisely heats a specially designed aerosol substrate to a specific temperature by using a built-in heating device, so that part of the material in the aerosol substrate evaporates, but does not reach the degree of combustion. The aerosol generating substrate is usually contained in an atomizer, and different atomizers can usually contain different types of aerosol substrates. When a user uses a heat-not-burn device, he or she can choose a suitable atomizer to connect to the heat-not-burn device according to personal preference. The heating device uses a heating element to heat the aerosol generating substrate.

[0073] Metal ceramic heater (MCH) is a high-efficiency, environmentally friendly and energy-saving ceramic heating element. The current metal ceramic heater is generally made by high-temperature co-firing of ceramic base material (such as alumina, etc.) and slurry containing tungsten, molybdenum and other high-melting point metals. The metal-ceramic composite structure has high thermal efficiency and can be widely used in intelligent toilet heating modules, portable drinking cups, hair curlers, automobile sensors, medical devices and other scenarios, and is commonly used in heating devices in heat-not-burn devices.

[0074] In the current preparation process of the metal ceramic heating body, thick film printing and sintering process are needed, and there are problems of uneven printing film thickness and difficult sintering resistance value regulation, and the metal line is prone to defects such as pinhole / hole, edge sawtooth, metal migration, etc., which leads to certain bottlenecks in the performance consistency and process cost of the heating body.

[0075] Based on this, the foil containing active metal elements is used to replace the thick film printing metal paste in the embodiments of the present application, so that the thick film printing process can be avoided, and the combination of the foil containing active metal elements and the ceramic substrate can make the metal ceramic heating body have great advantages in performance consistency and process cost. Specifically, the specific technical solutions of the embodiments of the present application are as follows.

[0076] In the first aspect, the embodiments of the present application provide a metal ceramic heating body. As shown in the figure, the metal ceramic heating body of the embodiments of the present application comprises a ceramic substrate 1 and a foil 2. The foil 2 is combined with at least one surface of the ceramic substrate 1, that is, one surface of the ceramic substrate 1 is combined with the foil 2, or both opposite surfaces of the ceramic substrate 1 are combined with the foil 2, which can be selected according to the actual application scene needs. Figure 1

[0077] In the metal ceramic heating body provided by the embodiments of the present application, the ceramic substrate 1 refers to a kind of inorganic non-metallic material formed by a ceramic material, which is a kind of inorganic non-metallic material formed by a natural or synthetic compound after shaping and high temperature sintering, and has the advantages of high melting point, high hardness, high wear resistance, oxidation resistance, etc. The foil 2 refers to a sheet-shaped material made of various metals (one metal or an alloy of multiple metals) by a calendering process, which has the physical properties of soft texture and strong ductility. The foil 2 of the metal ceramic heating body provided by the embodiments of the present application contains active metal elements, and the active metal elements refer to metal elements that can bond with the surface of the ceramic substrate under certain conditions (such as pressure and temperature).

[0078] Bonding generally refers to the combination of two pieces of atomically flat homogenous or heterogeneous materials after surface treatment under certain conditions, which makes the sheet material bonded into one through various ways such as van der Waals force, molecular force and even atomic force. The bonding of at least part of the active metal elements in the foil 2 of the metal ceramic heating body provided by the embodiments with the interface of the ceramic substrate 1 can be understood as follows: after the foil 2 is hot-pressed with the surface of the ceramic substrate 1, part of the active metal elements reacts with the interface of the ceramic substrate 1 to generate interface products, so that the foil 2 is combined with the ceramic substrate 1 to form a whole.

[0079] ​The metal ceramic heating body provided by the embodiment of the present application is formed by interface bonding of the active metal element contained in the foil 2 and the surface of the ceramic substrate 1. At the same time, the foil 2 containing the active metal component is used to replace the thick film metal paste commonly used on the surface of the metal ceramic heating body in the embodiment of the present application. Such a way not only has low cost, but also the metal ceramic heating body in the embodiment of the present application has easy resistance control, good durability, and the performance consistency can be significantly improved. Therefore, the metal ceramic heating body in the embodiment of the present application has good application prospect in the related heating field, such as the heater of the heat-not-burn device.

[0080] In some possible implementations, the active metal element in the foil 2 of the metal ceramic heating body includes at least one of titanium (Ti), zirconium (Zr) and hafnium (Hf). Exemplarily, the active metal element can be titanium, zirconium or hafnium, or two or three elements of titanium, zirconium and hafnium. These active metal elements can well interface react with the surface of the ceramic substrate 1 under certain pressure and temperature conditions to be bonded, thereby forming the stable metal ceramic heating body in the embodiment of the present application.

[0081] In some possible implementations, the active metal element in the foil 2 of the metal ceramic heating body includes titanium, and the material of the foil 2 includes at least one of titanium metal (the purity can reach more than 99%, for example, ≥99.5%), titanium-zirconium-nickel-copper (TiZrNiCu) alloy and titanium-copper-nickel (TiCuNi) alloy. By targeting titanium element, the above corresponding foil 2 materials can be selected, which are not only easy to obtain on the market, but also can well interface bond with the ceramic substrate 1. Among them, the titanium-zirconium-nickel-copper alloy can be Ti 35 Zr 35 Ni 15 Cu 15 or an alloy with a similar formula, and the titanium-copper-nickel alloy can be Ti 70 Ni 15 Cu 15 or an alloy with a similar formula.

[0082] In some possible implementations, the active metal element in the foil 2 of the metal ceramic heating body includes zirconium, and the material of the foil 2 includes at least one of zirconium metal (the purity can reach more than 99%, for example, ≥99.5%), nickel-zirconium (NiZr) alloy and zirconium-niobium (ZrNb) alloy. By targeting zirconium element, the above corresponding foil 2 materials can be selected, which are not only easy to obtain on the market, but also can well interface bond with the ceramic substrate 1. Among them, the nickel-zirconium alloy can be Ni 86 Zr 14 or an alloy with a similar formula, and the zirconium-niobium alloy can be Zr 96 Nb4or an alloy with a similar formula.

[0083] In some possible implementation manners, the active metal element in the foil 2 of the cermet heating element includes hafnium, and the material of the foil 2 includes at least one selected from a hafnium metal (the purity can reach more than 99%, for example, ≥99.5%), a nickel-hafnium (NiHf) alloy, and a hafnium-tantalum-molybdenum (HfTaMo) alloy. By targeting the hafnium element, the corresponding foil 2 materials described above can be selected, which are not only easy to obtain on the market, but also can be well implemented in interface bonding with the ceramic substrate 1.

[0084] In some possible implementation manners, the foil 2 of the cermet heating element has a resistivity of 10-200 μΩ·cm. For example, the resistivity of the foil 2 can be 10 μΩ·cm, 15 μΩ·cm, 20 μΩ·cm, 25 μΩ·cm, 30 μΩ·cm, 35 μΩ·cm, 40 μΩ·cm, 45 μΩ·cm, 50 μΩ·cm, 60 μΩ·cm, 70 μΩ·cm, 80 μΩ·cm, 90 μΩ·cm, 100 μΩ·cm, 110 μΩ·cm, 120 μΩ·cm, 140 μΩ·cm, 150 μΩ·cm, 160 μΩ·cm, 180 μΩ·cm, 185 μΩ·cm, 190 μΩ·cm, 200 μΩ·cm, or any point value or a range formed by any two thereof. For example, if the material of the foil 2 includes a titanium metal, the corresponding resistivity of the titanium alloy can be 40-50 μΩ·cm; if it is a titanium-zirconium-nickel-copper alloy, as a kind of amorphous high-entropy alloy, the corresponding resistivity can be 100-150 μΩ·cm; and if it is a titanium-copper-nickel alloy, the corresponding resistivity can be 25-35 μΩ·cm.

[0085] In the cermet heating element of the embodiment of the present application, the foil 2 containing the active metal element has the characteristic of high resistivity relative to the wire, and the higher the resistivity of the metal foil, the more likely it is used as an ohmic heating element in the power loop. Specifically, the foil 2 described above can change the resistivity in the range of 10-200 μΩ·cm according to the selection of the specific metal material. Thus, by bonding it with the ceramic substrate 1 and adjusting its own thickness, the resistance adjustment of the cermet heating element can be well achieved.

[0086] In some possible implementations, the foil 2 of the cermet heating body has a thickness of 1-5 μm. For example, the thickness of the foil 2 can be 1 μm, 1.2 μm, 1.5 μm, 1.8 μm, 2.0 μm, 2.2 μm, 2.5 μm, 2.8 μm, 3 μm, 4 μm, 5 μm, or any point value or a range formed by any two of the above values. It should be noted that the above thickness is the thickness after the original foil substrate and the ceramic substrate are bonded by hot pressing and then thinned. The thinner foil 2 can better adjust the square resistance in the cermet heating body, so that the cermet heating body has a suitable square resistance to adapt to the application scenario.

[0087] In some possible implementations, the ceramic substrate 1 of the cermet heating body includes at least one of silicon nitride (Si3N4), aluminum nitride (AlN), silicon carbide (SiC), aluminum oxide (Al2O3), zirconia-alumina (ZTA), and quartz ceramic (main component is SiO2). Zirconia-alumina (ZTA) is a zirconia toughened alumina ceramic, which is a zirconia phase transformation toughened ceramic based on alumina.

[0088] The above-mentioned ceramic substrate is easy to obtain and has good high-temperature resistance and corrosion resistance. Specifically, the above-mentioned ceramic substrate 1 can be matched with various foil substrates. For example, when the foil substrate includes titanium metal, the ceramic substrate can be silicon nitride, aluminum nitride, silicon carbide, aluminum oxide, or ZTA. When the foil substrate includes titanium-zirconium-nickel-copper alloy, the ceramic substrate can be silicon nitride, aluminum nitride, silicon carbide, aluminum oxide, ZTA, or quartz ceramic. When the foil substrate includes titanium-copper-nickel alloy, the ceramic substrate can be silicon nitride, aluminum nitride, or silicon carbide. When the foil substrate includes nickel-zirconium alloy or zirconium-niobium alloy, the ceramic substrate can be silicon nitride, aluminum nitride, aluminum oxide, or ZTA.

[0089] In some possible implementations, the ceramic substrate 1 of the cermet heating body is a ceramic layer, and the thickness of the ceramic layer is 0.1-1 mm (150-1000 μm). For example, the thickness of the ceramic substrate 1 can be 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, or any point value or a range formed by any two of the above values; for example, it can be 150-300 μm. The ceramic substrate 1 with the above thickness makes the cermet heating body have good heating efficiency.

[0090] In some possible implementations, the foil 2 of the cermet heating element is electrically connected with an electrode lead. For example, in some embodiments, the electrode lead is arranged on the surface of the foil 2 away from the ceramic substrate 1. By arranging the electrode lead on the surface of the foil 2, the electrode lead can be used to connect a power source, for example, a battery used to heat the heat-not-burn device. In this way, the cermet heating element can be well electrically heated by the power source. In some embodiments, the electrode lead can be welded on the foil by laser welding or butt welding.

[0091] In some possible implementations, the foil 2 of the cermet heating element has a pattern structure, for example, one or more heating loop patterns can be implemented, such as Figure 2 As shown in FIG. 2, the foil 2 has two heating loops. When the foil 2 has multiple heating loops, the different loops can share pads / electrodes / partial heating lines, or can be isolated from each other without sharing any pads / electrodes / heating lines. The multiple heating loops that are isolated from each other are more independent in terms of heating area, because the loops do not share lines through which heat can be transferred. The foil 2 can be prepared into various desired pattern structures, and the metal foil pattern formed is less likely to have risks such as pinholes / holes, edge sawteeth, and metal migration, so that the cermet heating element can independently and uniformly heat according to actual needs. For example, in some embodiments, the heating pattern can be prepared on the surface away from the ceramic substrate 1 by laser engraving or development etching.

[0092] In some possible implementations, the foil 2 of the cermet heating element is provided with a protective coating away from the surface of the ceramic substrate 1. By arranging the protective coating on the surface of the foil 2, the service life of the foil can be further improved, and the cermet heating element has better durability.

[0093] In some possible implementations, the protective coating of the cermet heating element includes at least one of glass, silicon nitride, aluminum nitride, aluminum oxide, zirconia-alumina, titanium oxide, zirconium oxide, and chromium oxide. The protective coating made of the above materials can well protect the cermet heating element. For example, a coating of Si3N4, AlN, ZTA, Al2O3, or glass can be deposited on the surface of the foil 2, or pure titanium, pure chromium, or pure zirconium can be deposited on the surface and then oxidized to form an oxidized protective coating.

[0094] In a second aspect, an embodiment of the present application provides a preparation method of a cermet heating element. Specifically, as shown in Figure 3 the preparation method of the embodiment of the present application includes the following steps:

[0095] S01: providing a ceramic substrate and a foil substrate; wherein the foil substrate contains active metal elements;

[0096] S02: after the foil substrate is attached to the ceramic substrate, a hot-press bonding reaction treatment is performed, and then a temperature reduction treatment is performed;

[0097] S03: resistance adjustment treatment is performed on the foil substrate bonded to the ceramic substrate, to obtain a metal ceramic heating body.

[0098] The embodiment of the present application adopts a foil substrate containing active metal elements and a ceramic substrate to be hot-pressed at high temperature, and the active metal elements in the foil substrate and the ceramic substrate are bonded at the interface, and then the resistance of the foil substrate is adjusted. Such a preparation method is not only easy to implement and has low process cost, but also can obtain a metal ceramic heating body with easy resistance adjustment, good durability, and especially significantly improved performance consistency.

[0099] In step S01, the preparation raw materials of the metal ceramic heating body are provided, i.e., the ceramic substrate and the foil substrate.

[0100] In some possible implementations, the foil substrate can be selected according to the type of the subsequent metal element. The active metal element includes at least one of titanium, zirconium, and hafnium; when the active metal element includes titanium, the foil substrate includes at least one of titanium metal, titanium-zirconium-nickel-copper alloy, and titanium-copper-nickel alloy; when the active metal element includes zirconium, the foil substrate includes at least one of zirconium metal, nickel-zirconium alloy, and zirconium-niobium alloy; and when the active metal element includes hafnium, the foil substrate includes at least one of hafnium metal, nickel-hafnium alloy, and hafnium-tantalum-molybdenum alloy. For different active metal elements (such as titanium, zirconium, or hafnium), corresponding foil substrate materials can be selected, which are not only easy to obtain on the market, but also can be well bonded at the interface with the ceramic substrate. The titanium-zirconium-nickel-copper alloy can be Ti 35 Zr 35 Ni 15 Cu 15 or an alloy with a similar formula, the titanium-copper-nickel alloy can be Ti 70 Ni 15 Cu 15 or an alloy with a similar formula; the nickel-zirconium alloy can be Ni 86 Zr 14 or an alloy with a similar formula, and the zirconium-niobium alloy can be Zr 96 Nb4or an alloy with a similar formula.

[0101] In some possible implementations, the ceramic substrate comprises at least one of silicon nitride (Si3N4), aluminum nitride (AIN), silicon carbide (SiC), aluminum oxide (AI2O3), zirconia-alumina (ZTA), and quartz ceramic (main component is SiO2). The ceramic substrate of the above-mentioned types is easy to obtain and has good high-temperature resistance and corrosion resistance. Moreover, the ceramic substrate can be matched with various foil substrates. Specifically, when the foil substrate comprises titanium metal, the ceramic substrate can be silicon nitride, aluminum nitride, silicon carbide, aluminum oxide, or ZTA. When the foil substrate comprises titanium-zirconium-nickel-copper alloy, the ceramic substrate can be silicon nitride, aluminum nitride, silicon carbide, aluminum oxide, ZTA, or quartz ceramic. When the foil substrate comprises titanium-copper-nickel alloy, the ceramic substrate can be silicon nitride, aluminum nitride, or silicon carbide. When the foil substrate comprises nickel-zirconium alloy or zirconium-niobium alloy, the ceramic substrate can be silicon nitride, aluminum nitride, aluminum oxide, or ZTA.

[0102] In some possible implementations, the ceramic substrate has a thickness of 0.1 mm to 1 mm. The ceramic substrate with the above-mentioned thickness makes the cermet heating element have good heating efficiency.

[0103] In some possible implementations, the ceramic substrate comprises aluminum nitride, and the ceramic substrate is subjected to pre-oxidation treatment before being bonded with the foil substrate. Through the pre-oxidation treatment, aluminum oxide is generated on the surface of the aluminum nitride, so that the bonding reaction can be well controlled, and the bonding reaction at the interface is more uniform.

[0104] In some possible implementations, in order to make the bonding reaction better, the foil substrate and the ceramic substrate are respectively subjected to surface pretreatment before being bonded.

[0105] For example, the foil substrate is subjected to surface pickling treatment. The surface metal of the foil substrate is easy to be oxidized in the air, and the oxide layer is removed through the surface pickling treatment, so that the interface bonding reaction can be better. The pickling treatment can be cleaning with a hydrofluoric acid aqueous solution.

[0106] For example, the surface of the ceramic substrate is subjected to plasma activation treatment or acid pickling activation treatment. Through the activation treatment of the surface of the ceramic substrate, the interface bonding reaction between the active metal elements of the foil substrate and the surface of the ceramic substrate is more favorable. The plasma activation can be surface treatment with oxygen plasma, and the acid pickling activation can be acid pickling activation with a mixed acid solution of one or more of dilute hydrochloric acid solution (concentration of 10-20 wt%), dilute nitric acid solution (concentration of 10-20 wt%), and dilute hydrofluoric acid solution (concentration of 1-3 wt%).

[0107] In some possible implementations, after the plasma activation treatment or the acid pickling activation treatment of the ceramic substrate surface, the ceramic substrate surface is further pre-processed, for example, at least one metal of titanium, zirconium and hafnium is deposited on the ceramic substrate surface. After the ceramic substrate is cleaned, an ultra-thin titanium layer, a zirconium layer, a hafnium layer or the like is deposited, and by depositing at least one metal of titanium, zirconium and hafnium on the ceramic substrate surface as an active filler metal, the bonding reaction can be better promoted between the ceramic substrate and the foil substrate, and high-strength connection of the ceramic substrate and the foil can be achieved. Specifically, the deposited metal can correspond to the type of active metal element in the foil 2.

[0108] Active filler metal is a kind of filler metal or interlayer material containing active elements such as Ti, Zr and Hf, which is used to realize high-strength connection of ceramic-ceramic or ceramic-metal. Its core feature is that it can break the inert surface of the ceramic through chemical reaction to form a metallurgical bond. Depositing at least one metal of titanium, zirconium and hafnium on the surface of the ceramic substrate for pre-treatment is equivalent to depositing active filler metal, which can better bond with the foil substrate in subsequent hot pressing.

[0109] Step S02 is a hot pressing bonding process of the ceramic substrate and the foil substrate.

[0110] In some possible implementations, the foil substrate can be bonded with at least one surface of the ceramic substrate, that is, the foil substrate can be bonded with one side or both sides of the ceramic substrate. In application scenarios, one side of the ceramic substrate is bonded with the foil substrate, or both sides of the ceramic substrate are bonded with the foil substrate, which can be selected according to actual application needs.

[0111] In some possible implementations, the temperature of the hot pressing bonding reaction treatment is 800-950℃, and the time is 5-30min. For example, the temperature of the hot pressing bonding reaction can be 800℃, 820℃, 830℃, 850℃, 860℃, 880℃, 900℃, 920℃, 930℃, 950℃ or any point value in the range formed by any two of the above, and the time of the hot pressing bonding reaction can be 5min, 8min, 10min, 12min, 15min, 18min, 20min, 22min, 25min, 28min, 30min or any point value in the range formed by any two of the above. Under the above temperature and time conditions of the hot pressing bonding reaction, the interface bonding reaction can be sufficiently performed.

[0112] In some possible implementations, the pressure of the hot-press bonding reaction treatment is 0.01-0.3 MPa. For example, the pressure can be 0.01 MPa, 0.04 MPa, 0.05 MPa, 0.08 MPa, 0.10 MPa, 0.15 MPa, 0.20 MPa, 0.25 MPa, 0.30 MPa, or any value between any two of the above values or within a range defined by any two of the above values, for example, the pressure of the hot-press bonding reaction treatment is 0.1-0.2 MPa. During the hot-press bonding reaction treatment, the foil substrate is bonded to the ceramic substrate by the above pressure, which can increase the solid-state diffusion effect and thus make the interface reaction better.

[0113] In some possible implementations, the hot-press bonding reaction treatment is performed in a vacuum or an inert atmosphere. The bonding reaction in a vacuum or an inert atmosphere is more stable.

[0114] For example, the foil substrate containing titanium metal and the silicon nitride ceramic substrate. The silicon nitride ceramic substrate has a shear strength of >100 MPa and a heat resistance of up to 800℃. The hot-press bonding reaction treatment conditions include: vacuum 10-3 Pa, pressure 0.5-20 MPa, 920℃ / 10 min. The bonding reaction mechanism is as follows:

[0115] Ti+Si3N4→TiN+Ti5Si3.

[0116] The cermet heating body prepared by using the foil substrate containing titanium metal and the silicon nitride ceramic substrate as raw materials includes the silicon nitride ceramic substrate and the foil containing titanium metal bonded to the surface of the silicon nitride ceramic substrate, and part of the titanium metal elements in the foil are bonded to the interface of the ceramic substrate to perform a bonding reaction. The foil includes at least one of titanium metal, titanium-zirconium-nickel-copper alloy, and titanium-copper-nickel alloy. Titanium nitride (TiN), titanium silicide (Ti5Si3, TiSi2), and free Si are generated at the interface between the silicon nitride ceramic substrate and the foil containing titanium metal.

[0117] For example, the foil substrate containing titanium metal (TiCuNi can be selected to better reduce activity) and the silicon carbide ceramic substrate. The bonding reaction is relatively intense, and the temperature and time need to be controlled well. The hot-press bonding reaction treatment conditions include: vacuum 10-3 Pa, pressure 0.5-20 MPa, 950℃ / 3 min, and prevention of TiC layer from being too thick. The bonding reaction mechanism is as follows:

[0118] Ti+SiC→TiC+TiSi2.

[0119] The metal ceramic heating body prepared by taking the foil substrate containing titanium metal and the silicon carbide ceramic substrate as raw materials comprises the silicon carbide ceramic substrate and the foil containing titanium metal bonded with the surface of the silicon carbide ceramic substrate, and part of titanium metal elements in the foil are bonded with the interface of the ceramic substrate to generate the interface reaction products such as titanium carbide (TiC), titanium silicide (Ti5Si3, TiSi2), ternary MAX phase (Ti3SiC2) and the like.

[0120] Taking the foil substrate containing titanium metal and the alumina or ZTA ceramic substrate as an example, the liquid aluminum promotes diffusion in the bonding reaction; the hot-pressing bonding reaction treatment conditions include: vacuum 10-3Pa or argon (Ar), pressure 0.5-20 MPa, heating to 900-950℃ for 10-30 minutes. The bonding reaction mechanism is as follows:

[0121] 3Ti+2Al2O3→3TiO2+4Al.

[0122] The metal ceramic heating body prepared by taking the foil substrate containing titanium metal and the alumina (or ZTA) ceramic substrate as raw materials comprises the alumina (or ZTA) ceramic substrate and the foil containing titanium metal bonded with the surface of the alumina (or ZTA) ceramic substrate, and part of titanium metal elements in the foil are bonded with the interface of the ceramic substrate to generate the interface reaction products such as titanium oxide (TiO, Ti2O3), titanium aluminum intermetallic compound (Ti3Al, TiAl), free aluminum (Al) and the like.

[0123] Taking the foil substrate containing titanium metal and the aluminum nitride ceramic substrate as an example, the aluminum nitride ceramic substrate is pre-oxidized, that is, 600℃ / 1h, an Al2O3 layer with a thickness of 5-10nm is formed on the surface of the AlN to control the reaction; the hot-pressing bonding reaction treatment conditions include: vacuum 10-3Pa, pressure 0.5-20 MPa, 890℃ / 5min (reducing the reaction time to avoid excessive reaction to generate porous TiN). The bonding reaction mechanism is as follows:

[0124] Ti+AlN→TiN+Al.

[0125] The metal ceramic heating body prepared by taking the foil substrate containing titanium metal and the aluminum nitride ceramic substrate as raw materials comprises the aluminum nitride ceramic substrate and the foil containing titanium metal bonded with the surface of the aluminum nitride ceramic substrate, and part of titanium metal elements in the foil are bonded with the interface of the ceramic substrate to generate interface reaction products such as TiN, Ti3Al, TiAl and free Al.

[0126] For example, the foil substrate containing zirconium metal and the silicon nitride ceramic substrate are taken as raw materials. The silicon nitride ceramic substrate has a shear strength of >100 MPa and a heat resistance of up to 800℃. The hot-pressing bonding reaction treatment conditions include a vacuum of 10-3 Pa, a pressure of 0.5-20 MPa, and 800-850℃ / 10-30 min. Under the above conditions, the interface bonding reaction is performed, and the interface reaction products can include ZrN, ZrSi2 and Si. The bonding reaction mechanism is as follows:

[0127] Zr+Si3N4→ZrN+ZrSi2+Si.

[0128] The metal ceramic heating body prepared by taking the foil substrate containing titanium metal and the aluminum nitride ceramic substrate as raw materials comprises the aluminum nitride ceramic substrate and the foil containing titanium metal bonded with the surface of the aluminum nitride ceramic substrate, and part of titanium metal elements in the foil are bonded with the interface of the ceramic substrate to generate interface reaction products such as TiN, Ti3Al, TiAl and free Al.

[0129] It should be noted that, during the hot-pressing bonding reaction, eutectic substances can also be generated at the interface if the temperature is high enough.

[0130] In some possible implementations, the cooling speed of the cooling treatment is 1-2℃ / min. Specifically, the cooling treatment is reduced to 25-30℃. After the hot-pressing bonding reaction at high temperature is completed, the foil substrate and the ceramic substrate after bonding are stable and are not prone to cracking by using the slow cooling speed for cooling. Moreover, the subsequent process can be well performed after being reduced to the room temperature.

[0131] Step S03 is a thinning process of the bonded foil substrate.

[0132] In some possible implementation manners, the thickness of the ceramic substrate is 0.1 mm to 1 mm, the thickness of the foil substrate is 5 μm to 70 μm, after the foil substrate is bonded to the ceramic substrate through a thermal pressure bonding reaction, the part of the surface of the foil substrate away from the ceramic substrate that is not bonded is removed, and the remaining thickness of the foil substrate is 1 μm to 5 μm. The foil substrate is thinned after being bonded to the ceramic substrate through a thicker foil substrate, so that the sheet resistance can be better adjusted, and the metal ceramic heating body can have a suitable sheet resistance to adapt to the application scenario. When the metal ceramic heating body material needs a smaller resistivity, the foil substrate can be thinned to a smaller thickness to achieve a suitable sheet resistance.

[0133] The resistivity of the foil substrate is 10 μΩ·cm to 200 μΩ·cm. For example, the resistivity can be 10 μΩ·cm, 15 μΩ·cm, 20 μΩ·cm, 25 μΩ·cm, 30 μΩ·cm, 35 μΩ·cm, 40 μΩ·cm, 45 μΩ·cm, 50 μΩ·cm, 60 μΩ·cm, 70 μΩ·cm, 80 μΩ·cm, 90 μΩ·cm, 100 μΩ·cm, 110 μΩ·cm, 120 μΩ·cm, 140 μΩ·cm, 150 μΩ·cm, 160 μΩ·cm, 180 μΩ·cm, 185 μΩ·cm, 190 μΩ·cm, 200 μΩ·cm, or any point value or a range formed by any two of the above values. For example, if the foil material includes titanium metal, the corresponding resistivity of the titanium alloy can be 40 μΩ·cm to 50 μΩ·cm; if it is a titanium-zirconium-nickel-copper alloy, as a kind of amorphous high-entropy alloy, the corresponding resistivity can be 100 μΩ·cm to 150 μΩ·cm; and if it is a titanium-copper-nickel alloy, the corresponding resistivity can be 25 μΩ·cm to 35 μΩ·cm.

[0134] In some possible implementation manners, the resistivity adjustment treatment of the foil substrate bonded to the ceramic substrate includes removing the part of the surface of the foil substrate away from the ceramic substrate that is not bonded by using a chemical etching method or a mechanical grinding method. The part of the surface of the foil substrate that is not bonded can be well removed by using the chemical etching method or the mechanical grinding method.

[0135] In some possible implementation manners, after the foil substrate bonded to the ceramic substrate is thinned, further including: performing a patterning treatment on the surface of the foil (i.e., the thinned foil substrate) of the metal ceramic heating body, and further performing a laser resistivity adjustment treatment. The patterning treatment on the surface of the foil of the metal ceramic heating body can obtain a heating pattern required by the application scenario, for example, a heating pattern is prepared by laser engraving or development etching; and the heating circuit pattern is not limited, for example, a fine line circuit loop in an "S" shape or a piece of square heating pattern. Further adjustment of the resistivity by laser can make the metal ceramic heating body have a suitable sheet resistance.

[0136] In some possible implementation manners, after the foil substrate bonded with the ceramic substrate is thinned, the method further includes: welding an electrode lead on the foil surface of the cermet heating element. For example, the electrode lead is welded on the foil surface of the cermet heating element by laser welding or butt welding. By welding the electrode lead on the foil surface of the cermet heating element, the cermet heating element can be well electrically heated for connecting the power supply.

[0137] In some possible implementation manners, after the foil substrate bonded with the ceramic substrate is thinned, the method further includes: depositing a protective coating on the foil surface of the cermet heating element. The foil surface of the cermet heating element is deposited with a protective coating, which can further improve the service life of the foil and make the cermet heating element have better durability. For example, the material of the protective coating includes at least one of glass, silicon nitride, aluminum nitride, aluminum oxide, zirconia-alumina, titanium oxide, zirconium oxide, and chromium oxide. The protective coating made of the above-mentioned materials can well protect the cermet heating element. For example, the foil surface of the cermet heating element can be deposited with a coating of Si3N4, AlN, ZTA, Al2O3, or glass, or a protective coating of oxidized pure titanium or pure chromium or pure zirconium is first deposited on the surface and then subjected to oxidation treatment.

[0138] For example, the protective coating includes but is not limited to a SiO2 coating, an Al2O3 coating, a ZrO2 coating, a Cr2O3 coating, a composite coating of Cr2O3 and CrN, an aluminosilicate glass coating, other glass-ceramic coating, an AlN coating, a diamond-like coating, or the like. The thickness of the protective coating can be 0.5-20 μm (optionally 1-5 μm). For example, the thickness of the SiO2 coating can be 0.5-5 μm (ordinary slurry spraying, or sol-gel spraying, or CVD), the thickness of the Al2O3 coating can be 1-10 μm (sol-gel method) or 20-50 μm (plasma spraying), the thickness of the AlN coating can be 0.5-5 μm (PVD / CVD), and the thickness of the ZrO2 coating can be 50-300 μm (plasma spraying).

[0139] In some possible implementation manners, the preparation process of the cermet heating element includes the following steps:

[0140] 1) Surface treatment: the ceramic substrate is activated by plasma or acid washing; the metal foil is deoxidized (cleaned with hydrofluoric acid).

[0141] 2) Assembly and pressurization: the foil is tightly attached to the ceramic substrate, and pressure (0.01-0.3 MPa) is applied.

[0142] 3) High-temperature reaction: heating at 800-950 °C in vacuum or Ar for 5-30 minutes, and the active metal components in the foil react with the ceramic to form an interface.

[0143] 4) Cooling: Slowly cool down (≤2℃ / min) to avoid cracking.

[0144] 5) Thinning: Thinning the foil thickness by mechanical grinding or chemical etching to remove the unreacted active component and increase the sheet resistance.

[0145] 6) Heating pattern processing: Heating pattern is prepared by laser engraving or developing etching.

[0146] 7) Laser resistance adjustment: Resistance is adjusted by laser.

[0147] 8) Lead welding: Electrode lead is welded on the foil by laser welding or bump welding.

[0148] 9) Surface protection: Surface is deposited with protective coating (such as Si3N4, AlN, ZTA, Al2O3, etc., or glass coating), or pure titanium or pure chromium or pure zirconium is deposited first and then surface oxidation treatment is performed.

[0149] In some possible implementation manners, the application adopts high-resistivity foil substrate containing active metal (at least one of titanium, zirconium and hafnium) to bond with ceramic substrate by interfacial reaction at high temperature and high pressure, and then the foil thickness is thinned by mechanical grinding or chemical etching to adjust the sheet resistance and remove the residual active component, and then the heating pattern is prepared by laser engraving or developing etching, and finally the resistance is adjusted by laser, the lead is welded and the surface is protected to obtain the metal ceramic heating body. The embodiment of the application eliminates the thick film printing process, and replaces the printed thick film precious metal material with the foil containing active metal component. The metal ceramic heating body prepared has good durability, and has better advantages in performance consistency and process cost, and therefore can be well applied to the heat-not-burn device.

[0150] In a third aspect, the embodiment of the application provides a heating device. Specifically, the heating device of the embodiment of the application comprises the metal ceramic heating body provided in the first aspect of the application and / or the metal ceramic heating body prepared by the preparation method provided in the second aspect of the application.

[0151] The heating device provided in the embodiment of the application comprises the metal ceramic heating body provided in the embodiment of the application, and therefore the heating device of the application has the characteristics of good durability and significantly improved performance consistency, and such a heating device has good heating performance in various application scenarios.

[0152] In a fourth aspect, the embodiment of the application provides a heat-not-burn device. Specifically, the heat-not-burn device of the embodiment of the application comprises an aerosol generating substrate and the heating device provided in the third aspect of the application.

[0153] The heating non-combustion device provided by the embodiments of the present application uses a heating device specific to the embodiments of the present application. The heating device has the characteristics of good durability and significantly improved performance consistency, so that the heating non-combustion device can uniformly and stably heat the aerosol generating substrate.

[0154] In some possible implementations, the heating non-combustion device is an aerosol generating device that realizes the conversion of an aerosol substrate into an aerosol (suspended particles) for use by a user through heating means, where the aerosol generating substrate can be a cartridge. It is a new product that combines a heating appliance and a cartridge. It uses a special heating device to heat a treated aerosol generating substrate (special cartridge) to a certain temperature, and heats the aerosol generating substrate to a sufficient degree to release an aerosol.

[0155] In some possible implementations, the heating temperature of the aerosol generating substrate of the heating non-combustion device is generally between 200-350°C (optionally between 250-350°C), and the heating device provided by the embodiments of the present application uniformly and stably heats the aerosol generating substrate to this temperature.

[0156] In some possible implementations, the heating non-combustion device includes a battery, a temperature control system, a heating device, a body, etc. The heating device uses a rechargeable battery as a power source, and the battery determines the continuous cruising of the heating non-combustion device. The heating device heats the aerosol generating substrate.

[0157] The heating device of the heating non-combustion device uses a metal ceramic heating element, which includes a ceramic base material and a foil combined with at least one surface of the ceramic base material. The foil contains active metal elements, and at least part of the active metal elements are bonded to the interface of the ceramic base material. The ceramic base material includes at least one of silicon nitride (Si3N4), aluminum nitride (AlN), silicon carbide (SiC), aluminum oxide (Al2O3), zirconia-alumina (ZTA), and quartz ceramic (main component is SiO2). The active metal elements include at least one of titanium, zirconium, and hafnium. When the active metal elements include titanium, the foil substrate includes at least one of titanium metal, titanium-zirconium-nickel-copper alloy, and titanium-copper-nickel alloy. When the active metal elements include zirconium, the foil substrate includes at least one of zirconium metal, nickel-zirconium alloy, and zirconium-niobium alloy. When the active metal elements include hafnium, the foil substrate includes at least one of hafnium metal, nickel-hafnium alloy, and hafnium-tantalum-molybdenum alloy. For different active metal elements (such as titanium, zirconium, or hafnium), corresponding foil substrate materials can be selected. These foil substrate materials are not only easy to obtain on the market, but also can be well bonded to the interface of the ceramic base material. The titanium-zirconium-nickel-copper alloy can be Ti 35 Zr 35 Ni15 Cu 15 or alloys of similar composition; the titanium-copper-nickel alloy can be Ti 70 Ni 15 Cu 15 or alloys of similar composition; the nickel-zirconium alloy can be Ni 86 Zr 14 or alloys of similar composition; the zirconium-niobium alloy can be Zr 96 Nb4or alloys of similar composition. The embodiments of the present application are easy to implement and have low process cost, and the square resistance is easy to adjust, the durability is good, and the performance consistency is significantly improved, so that the heating device uniformly and stably heats the aerosol generating substrate.

[0158] In some possible implementations, the heating device in the heat-not-burn device uses the metal ceramic heating body of the embodiments of the present application, and the specific heating mode of the aerosol generating substrate can be internal heating, external heating, or internal-external mixed heating.

[0159] The specific embodiments are described below.

[0160] Embodiment 1

[0161] A ceramic heating body includes a ceramic substrate (Al2O3), and a foil (Ti 35 Zr 35 Ni 15 Cu 15 ) bonded to the ceramic substrate.

[0162] The specific preparation steps include:

[0163] 1) Surface treatment: The Al2O3 ceramic substrate with a thickness of 0.3 mm is activated by pickling (first rinsed with deionized water, and then cleaned with a dilute hydrochloric acid solution); the Ti 35 Zr 35 Ni 15 Cu 15 foil with a thickness of 15 μm is cleaned with a hydrofluoric acid aqueous solution.

[0164] 2) Assembly and pressurization: The foil after the surface treatment is tightly attached to the ceramic substrate, and a pressure of 0.2 MPa is applied.

[0165] 3) High-temperature reaction: The tightly attached foil and ceramic substrate are heated to 900 °C in a vacuum for 10 minutes, and the active metal components in the foil react with the ceramic substrate at the interface.

[0166] 4) Cooling: Slowly cool down at a rate of 2°C / min to 25°C.

[0167] 5) Thinning: Thinning the foil thickness by mechanical grinding to remove unreacted active ingredients and increase the square resistance.

[0168] 6) Heating pattern processing: Prepare the heating pattern by laser engraving.

[0169] 7) Laser resistance adjustment: Adjust the resistance value by laser.

[0170] 8) Lead welding: Weld the electrode lead on the foil by laser welding.

[0171] Example 2

[0172] A ceramic heating element comprising a ceramic substrate (Si3N4) and a foil (Ti 35 Zr 35 Ni 15 Cu 15 ) bonded to the ceramic substrate.

[0173] The specific preparation steps include:

[0174] 1) Surface treatment: Activate the Si3N4 ceramic substrate with a thickness of 0.3 mm by pickling (first rinse with deionized water, then clean with dilute hydrochloric acid solution); clean the Ti 35 Zr 35 Ni 15 Cu 15 Foil with aqueous hydrofluoric acid solution.

[0175] 2) Assembly and pressurization: Press the above-mentioned foil after surface treatment tightly against the ceramic substrate, and apply a pressure of 0.2 MPa.

[0176] 3) High temperature reaction: Heat the tightly attached foil and ceramic substrate to 920°C in vacuum, and keep it for 10 minutes, so that the active metal components in the foil react with the ceramic substrate at the interface.

[0177] 4) Cooling: Slowly cool down at a rate of 2°C / min to 25°C.

[0178] 5) Thinning: Thinning the foil thickness by mechanical grinding to remove unreacted active ingredients and increase the square resistance.

[0179] 6) Heating pattern processing: Prepare the heating pattern by laser engraving.

[0180] 7) Laser resistance adjustment: Adjust the resistance value by laser.

[0181] 8) Lead welding: Weld the electrode lead on the foil by laser welding.

[0182] Example 3

[0183] A ceramic heating element comprising a ceramic substrate (Si3N4), and a foil (Ti 35 Zr 35 Ni 15 Cu 15 ) bonded to the ceramic substrate.

[0184] The specific preparation steps include:

[0185] 1) Surface treatment: the Si3N4 ceramic substrate with a thickness of 0.15 mm is activated by pickling (first rinsed with deionized water, then cleaned with a dilute hydrochloric acid solution), and then a pure titanium layer is deposited; the Ti 35 Zr 35 Ni 15 Cu 15 Foil with a thickness of 15 μm is cleaned with a hydrofluoric acid aqueous solution.

[0186] 2) Assembly and pressurization: the above surface-treated foil is tightly attached to the titanium layer of the ceramic substrate, and a pressure of 0.1 MPa is applied.

[0187] 3) High temperature reaction: the tightly attached foil and ceramic substrate are heated to 920°C in vacuum, and held for 10 minutes, and the active metal components in the foil react with the ceramic substrate at the interface.

[0188] 4) Cooling: slowly cool down at a rate of 2°C / min to 25°C.

[0189] 5) Thinning: the foil thickness is thinned by mechanical grinding, and the unreacted active components are removed to increase the resistance.

[0190] 6) Heating pattern processing: a heating pattern is prepared by laser engraving.

[0191] 7) Laser resistance adjustment: laser is used for resistance fine adjustment.

[0192] 8) Lead soldering: the electrode lead is soldered on the foil by laser soldering.

[0193] 9) Surface protection: the foil surface is deposited with a protective coating, i.e. a SiO2 coating: 0.5 μm.

[0194] Example 4

[0195] A ceramic heating element comprising a ceramic substrate (AlN), and a foil (Ti 35 Zr 35 Ni 15 Cu 15 ) bonded to the ceramic substrate.

[0196] The specific preparation steps include:

[0197] 1) Surface treatment: The AlN ceramic substrate with a thickness of 1.0 mm is activated by pickling (first rinsed with deionized water, then cleaned with dilute hydrochloric acid solution); the Ti 35 Zr 35 Ni 15 Cu 15 The foil is cleaned with hydrofluoric acid aqueous solution.

[0198] 2) Assembly and pressurization: The AlN ceramic substrate after surface treatment is pre-oxidized at 600°C for 1 h; then the foil is tightly attached to the pre-oxidized surface of the ceramic substrate, and a pressure of 0.3 MPa is applied.

[0199] 3) High-temperature reaction: The tightly attached foil and ceramic substrate are heated to 890°C in vacuum for 5 minutes, and the active metal components in the foil react with the ceramic substrate at the interface.

[0200] 4) Cooling: Slowly cool down at a rate of 2°C / min to 25°C.

[0201] 5) Thinning: The thickness of the foil is thinned by mechanical grinding, and the unreacted active components are removed to increase the sheet resistance.

[0202] 6) Heating pattern processing: A heating pattern is prepared by laser engraving.

[0203] 7) Laser resistance adjustment: The resistance is finely adjusted by laser.

[0204] 8) Lead soldering: The electrode lead is soldered on the foil by laser soldering.

[0205] 9) Surface protection: A protective coating, i.e. SiO2 coating, 0.5 μm, is deposited on the surface of the foil.

[0206] Example 5

[0207] A ceramic heating element, comprising a ceramic substrate (SiC), and a foil (Ti 70 Ni 15 Cu 15 ) bonded to the ceramic substrate.

[0208] The specific preparation steps include:

[0209] 1) Surface treatment: The SiC ceramic substrate with a thickness of 1.0 mm is activated by pickling (first rinsed with deionized water, then cleaned with dilute hydrochloric acid solution); the Ti 70 Ni 15 Cu 15 The foil is cleaned with hydrofluoric acid aqueous solution.

[0210] 2) Assembly and pressure: the foil after the above surface treatment is tightly attached to the ceramic substrate, and a pressure of 0.01 MPa is applied.

[0211] 3) High temperature reaction: the tightly attached foil and ceramic substrate are heated to 950°C in vacuum, and kept for 3 minutes, and the active metal component in the foil reacts with the ceramic substrate at the interface.

[0212] 4) Cooling: slowly cool down at a rate of 2°C / min to 25°C.

[0213] 5) Thinning: the thickness of the foil is thinned by mechanical grinding, and the unreacted active component is removed to increase the square resistance.

[0214] 6) Heating pattern processing: a heating pattern is prepared by laser engraving.

[0215] 7) Laser resistance adjustment: laser is used for resistance fine adjustment.

[0216] 8) Lead welding: the electrode lead is welded on the foil by laser welding.

[0217] Example 6

[0218] A ceramic heating body comprises a ceramic substrate (Si3N4), and a foil (Ni 86 Zr 14 ) bonded to the ceramic substrate.

[0219] The specific preparation steps include:

[0220] 1) Surface treatment: the Si3N4 ceramic substrate with a thickness of 0.15 mm is activated by pickling (first rinsed with deionized water, and then cleaned with dilute sulfuric acid solution); the Ni 86 Zr 14 Foil with a thickness of 15m is cleaned with aqueous hydrofluoric acid solution.

[0221] 2) Assembly and pressure: the foil after the above surface treatment is tightly attached to the ceramic substrate, and a pressure of 0.2 MPa is applied.

[0222] 3) High temperature reaction: the tightly attached foil and ceramic substrate are heated to 800°C in vacuum, and kept for 10 minutes, and the active metal component in the foil reacts with the ceramic substrate at the interface.

[0223] 4) Cooling: slowly cool down at a rate of 2°C / min to 25°C.

[0224] 5) Thinning: the thickness of the foil is thinned by mechanical grinding, and the unreacted active component is removed to increase the square resistance.

[0225] 6) Heating pattern processing: a heating pattern is prepared by laser engraving.

[0226] 7) Laser resistance adjustment: resistance fine adjustment by laser.

[0227] 8) Lead soldering: electrode lead soldering on the foil by laser soldering.

[0228] 9) Surface protection: deposition of protective coating on the foil surface, Al2O3 coating: 1 μm.

[0229] Comparative Example 1

[0230] A ceramic heating element comprising a ceramic substrate (Al2O3) and a metal film layer co-sintered with the ceramic substrate.

[0231] The specific preparation steps include:

[0232] a. Preparation of circuit slurry and green layer, the circuit slurry comprising tungsten and / or molybdenum, and the green layer comprising zirconia; b. Coating or printing the circuit slurry on the green layer, and coating or printing the insulating medium on the circuit slurry; c. Co-sintering the green layer and the circuit slurry in a vacuum environment and / or a reduction environment filled with a reduction protective gas, the green layer being turned into porcelain, and the circuit slurry being turned into a heating circuit. (Refer to patent CN108503391A).

[0233] Comparative Example 2

[0234] A stainless steel thick film heating element, the preparation steps including:

[0235] Stainless steel substrate preparation → insulation layer preparation and sintering → electrode layer printing and sintering → heating layer printing and sintering → electrode lead soldering and sintering → protective layer spraying and sintering.

[0236] (Refer to http: / / www.leed-ink.cn / productbig0021.html).

[0237] Performance test

[0238] (1) Resistance change rate test.

[0239] Test steps: power on to warm up to 400℃ and keep for a short time (total of 20 seconds for the heating time and the holding time), then power off for 40 seconds, then power on to warm up to about 400℃ and keep (total of 20 seconds for the heating time and the holding time), then power off for 40 seconds, and so on for 3000 times, measure the resistance change rate at room temperature (25℃).

[0240] (2) Durability test.

[0241] Test procedure: power on to 400℃ and keep for a short time (20 seconds in total), then power off for 40 seconds, then power on to about 400℃ and keep (20 seconds in total), then power off for 40 seconds, and so on for 10000 times, and count the sample ratio of cracking or falling off.

[0242] Results are shown in Table 1.

[0243] Table 1

[0244]

[0245] Note: Good durability in Table 1 means: no cracking or falling off. The resistance change data of Comparative Example 2 (stainless steel thick film heating element) are shown in Table 2.

[0246] Table 2

[0247]

[0248] From the data in the table, it can be seen that the metal foil bonded on the surface of the ceramic substrate in the embodiments of the present application has low resistance change rate and good durability, which meets the requirements. Moreover, since the metal foil is directly bonded on the surface of the ceramic substrate, such process is easy to implement, the sheet resistance is easy to control, and defects such as cracks and holes are less likely to occur, and the consistency of performance is significantly improved, so the performance consistency of the metal-ceramic heating element can be improved at low cost. The ceramic heating element prepared by co-sintering in Comparative Example 1 can meet the requirements in terms of resistance change rate and durability, but the preparation process is complex, the cost is high, and the size precision (including roundness) of the heating element is poor, and cracks are likely to occur during sintering in practice, and the overall consistency is not ideal. The resistance change rate and durability of Comparative Example 2 are more difficult to meet the requirements.

[0249] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for part or all of the technical features; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application. In particular, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A metal-ceramic heating element, characterized in that, include: A ceramic substrate and a foil bonded to at least one surface of the ceramic substrate; wherein the foil contains an active metal element, and at least a portion of the active metal element is bonded to the interface of the ceramic substrate.

2. The metal-ceramic heating element as described in claim 1, characterized in that, The active metal element includes at least one of titanium, zirconium, and hafnium.

3. The metal-ceramic heating element as described in claim 2, characterized in that, The active metal element includes titanium, and the foil material includes at least one of titanium metal, titanium-zirconium-nickel-copper alloy, and titanium-copper-nickel alloy. Alternatively, the active metal element may include zirconium, and the foil material may include at least one of zirconium metal, nickel-zirconium alloy, and zirconium-niobium alloy; Alternatively, the active metal element may include hafnium, and the material of the foil may include at least one selected from hafnium metal, nickel-hafnium alloy, and hafnium-tantalum-molybdenum alloy.

4. The metal-ceramic heating element as described in claim 1, characterized in that, The resistivity of the foil is 10–200 μΩ·cm.

5. The metal-ceramic heating element as described in claim 4, characterized in that, The thickness of the foil is 1–5 μm.

6. The metal-ceramic heating element according to any one of claims 1-5, characterized in that, The ceramic substrate includes at least one of silicon nitride, aluminum nitride, silicon carbide, alumina, zirconium oxide-alumina, and quartz ceramic; and / or, the ceramic substrate is a ceramic layer with a thickness of 0.1 mm to 1 mm.

7. The metal-ceramic heating element according to any one of claims 1-5, characterized in that, The foil has a protective coating on its surface away from the ceramic substrate.

8. The metal-ceramic heating element as described in claim 7, characterized in that, The protective coating includes at least one of glass, silicon nitride, aluminum nitride, aluminum oxide, zirconium oxide-alumina, titanium oxide, zirconium oxide, and chromium oxide.

9. A method for preparing a metal-ceramic heating element, characterized in that, include: A ceramic substrate and a foil substrate are provided, wherein the foil substrate contains an active metal element; The foil substrate is bonded to at least one surface of the ceramic substrate and then subjected to a hot-press bonding reaction, followed by a cooling process. The foil substrate bonded to the ceramic substrate is subjected to resistance adjustment treatment to obtain a metal-ceramic heating element.

10. The preparation method according to claim 9, characterized in that, And / or, the temperature of the hot-press bonding reaction treatment is 800-950℃, and the time is 5-30 min; And / or, the pressure of the hot-press bonding reaction treatment is 0.01-0.3 MPa; And / or, the hot-press bonding reaction is carried out in a vacuum or inert atmosphere.

11. The preparation method according to claim 9, characterized in that, The cooling rate of the cooling process is 1-2°C / min; and / or the cooling process reduces the temperature to 25-30°C.

12. The preparation method according to claim 9, characterized in that, Before bonding the foil substrate to the ceramic substrate, the process includes: performing surface pickling on the foil substrate, and performing plasma activation treatment or pickling activation treatment on the surface of the ceramic substrate.

13. The preparation method according to claim 12, characterized in that, After the surface of the ceramic substrate is subjected to plasma activation treatment or acid pickling activation treatment, at least one metal selected from titanium, zirconium, and hafnium is deposited on the surface of the ceramic substrate.

14. The preparation method according to claim 9, characterized in that, The foil substrate has a thickness of 5 μm to 70 μm, and after removing the unbonded portions of the foil substrate away from the ceramic substrate, the remaining thickness is 1 to 5 μm; and / or, The ceramic substrate is a ceramic layer, and the thickness of the ceramic layer is 0.1 mm to 1 mm.

15. The preparation method according to any one of claims 9-14, characterized in that, The resistance adjustment process for the foil substrate bonded to the ceramic substrate includes: removing the unbonded portions of the foil substrate surface away from the ceramic substrate using chemical etching or mechanical polishing.

16. The preparation method according to any one of claims 9-14, characterized in that, The active metal element includes at least one of titanium, zirconium, and hafnium; wherein, when the active metal element includes titanium, the foil substrate includes at least one of titanium metal, titanium-zirconium-nickel-copper alloy, and titanium-copper-nickel alloy; when the active metal element includes zirconium, the foil substrate includes at least one of zirconium metal, nickel-zirconium alloy, and zirconium-niobium alloy; when the active metal element includes hafnium, the foil substrate includes at least one of hafnium metal, nickel-hafnium alloy, and hafnium-tantalum-molybdenum alloy.

17. The preparation method according to any one of claims 9-14, characterized in that, The ceramic substrate includes at least one of silicon nitride, aluminum nitride, silicon carbide, alumina, zirconium oxide-alumina, and quartz ceramic.

18. The preparation method according to claim 17, characterized in that, The ceramic substrate includes aluminum nitride. Before bonding the foil substrate to the ceramic substrate, the ceramic substrate is pre-oxidized.

19. The preparation method according to any one of claims 9-14, characterized in that, Also includes: The foil surface of the metal-ceramic heating element is patterned. And / or, electrically connect the foil of the metal-ceramic heating element to the electrode leads; And / or, deposit a protective coating on the foil surface of the metal-ceramic heating element.

20. A heating device, characterized in that, The metal-ceramic heating element includes the metal-ceramic heating element according to any one of claims 1-8 and / or the metal-ceramic heating element prepared by the preparation method according to any one of claims 9-19.

21. A heating non-combustible device, characterized in that, It includes an aerosol-generating matrix and the heating device as described in claim 20.

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