Packaging equipment for integrated circuit chip

Abstract

The invention provides packaging equipment for an integrated circuit chip. The packaging equipment comprises a chip conveying assembly; comprising a flexible positioning mechanism, the flexible positioning mechanism comprises a flexible conveying unit and a plurality of flexible positioning frames, the plurality of flexible positioning frames are arranged on the flexible conveying unit, and the flexible positioning frames are used for bearing chips; the carrier tape processing assembly comprises a heating unit and a pressing mechanism, the heating unit is arranged on the front side of the pressing mechanism, and the heating unit is used for preheating a bonding layer of the carrier tape; the pressing mechanism comprises a pressing unit and a lower abutting unit, the pressing unit and the lower abutting unit are correspondingly arranged, the pressing unit comprises a pressing plate, the lower abutting unit comprises an abutting plate, and the pressing plate and the abutting plate are matched to press the chip to the carrier tape. Through the interaction of the pressing plate and the abutting plate, the chip is accurately pressed on the carrier tape, and the packaging quality of the chip is further improved. In addition, the flexible positioning frame and the pressing mechanism are matched with each other, so that the packaging efficiency of the chip is also improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip production, and particularly relates to a packaging device for integrated circuit chips. BACKGROUND

[0002] An integrated circuit chip is a tiny electronic component that is made by interconnecting transistors, capacitors, resistors, inductors and other components and wiring on a semiconductor or dielectric substrate through a specific process. As a cornerstone of modern electronic technology, integrated circuits are widely used in many fields such as computers, communications and consumer electronics.

[0003] After the burning process is completed, the integrated circuit chip needs to be packaged by a carrier tape to form a reel shape for convenient transportation and mounting. In the current carrier tape packaging process, the chip needs to be embedded in the loading slot of the carrier tape, and then covered and sealed by a cover tape.

[0004] However, during the reel forming process of the current carrier tape packaging, there is a problem of incomplete bonding of the chip and the carrier tape. First, inaccurate positioning of the chip will cause incomplete bonding of the chip and the carrier tape, or even misalignment, which will affect the electrical performance and mechanical stability of the product. Second, in the packaging process, the adhesive layer of the carrier tape needs to be activated by heating to activate its adhesion, and then the chip is firmly fixed on the carrier tape by pressing. However, the existing packaging equipment often cannot accurately control the temperature and time of heating, as well as the pressure and speed of pressing, resulting in uneven adhesion of the adhesive layer and poor pressing effect, which further affects the bonding strength and sealing performance between the chip and the carrier tape. Such uneven bonding and sealing will cause the chip to delaminate, delaminate and other problems in the subsequent use process, thereby damaging the reliability and service life of the product. SUMMARY

[0005] In order to overcome some of the problems mentioned in the background, the present application provides a packaging device for integrated circuit chips.

[0006] The technical scheme adopted by the present application is as follows: a packaging device for integrated circuit chips, comprising: a chip conveying assembly, comprising a flexible positioning mechanism, the flexible positioning mechanism comprising a flexible conveying unit and a plurality of flexible positioning frames, the plurality of flexible positioning frames being arranged on the flexible conveying unit, the flexible positioning frames being used to carry chips, and the flexible positioning frames being provided with a positioning inductor; a carrier tape processing assembly, comprising a heating unit and a pressing mechanism, the heating unit being arranged on the front side of the pressing mechanism, and the heating unit being used to preheat the adhesive layer of the carrier tape; The pressing mechanism includes a pressing unit and a lower abutment unit, which are correspondingly arranged. The pressing unit includes a pressing plate and a receiver, and the lower abutment unit includes a stop plate. The positioning sensor and the receiver cooperate to position the chip. The lower abutment unit includes a stop plate, and the pressing plate and the stop plate cooperate to press the chip onto the carrier tape.

[0007] Furthermore, it also includes an operating table, with the chip delivery assembly and the carrier tape processing assembly connected to the operating table; The carrier tape processing assembly further includes a carrier tape unwinding mechanism, a cover tape unwinding mechanism, and a winding mechanism. The carrier tape unwinding mechanism, the heating unit, and the pressing mechanism are sequentially arranged above the flexible positioning mechanism. The cover tape unwinding mechanism is located at the lower part of the operating table, and the winding mechanism is located at the end of the flexible conveying unit for packaging and winding the finished product. The carrier tape unwinding mechanism is provided with a guide rod, which is used to guide the movement of the carrier tape; The winding mechanism includes a winding motor and a winding roller, wherein the winding motor drives the winding roller to rotate. The winding motor, the flexible positioning mechanism, and the pressing mechanism are electrically coupled.

[0008] Furthermore, the chip delivery assembly also includes a detection mechanism, which is disposed at the front end of the flexible delivery unit; The testing mechanism includes a testing frame and a testing probe. The testing probe is located at the lower part of the testing frame and is used to identify the positional deviation of the chip within the flexible positioning frame.

[0009] Furthermore, the flexible positioning mechanism also includes a drive unit, which is connected to the operating table; The driving unit includes a driving roller, a driving motor, and a transmission roller. The driving roller and the transmission roller are respectively located at both ends of the flexible conveying unit, and the driving motor is connected to the driving roller in a driving connection. The flexible conveying unit includes a transmission chain and a load-bearing chain disposed outside the transmission chain, the transmission chain meshing with the drive roller and the transmission roller; The carrier chain is provided with multiple mounting slots, the flexible positioning frame is embedded in the mounting slots, and the drive roller drives the transmission chain to move the carrier chain in a cyclic manner.

[0010] Furthermore, the heating mechanism includes a heating frame, a heating box, and multiple heating tubes. The heating frame is fixedly connected to the upper part of the operating table, and the multiple heating tubes are arranged in a U-shape within the heating box. The heating box is mounted on the heating frame, and the heating surfaces of the heating tubes face the carrier belt.

[0011] Furthermore, the pressing mechanism also includes a pressing frame, and the pressing unit is disposed at the lower part of the pressing frame; The pressing unit further includes a first telescopic rod, a connecting plate, and a damping rod. The first telescopic rod and the damping rod are respectively disposed on both sides of the connecting plate. The damping rod is connected to the pressing plate. The first telescopic rod drives the pressing plate to move toward the abutment plate. The lower abutment unit also includes a support frame and a second telescopic rod. The support frame is fixedly connected to the operating table. The two ends of the second telescopic rod are provided with support frames and connected to the abutment plate. The second telescopic rod drives the abutment plate to move towards the pressing plate.

[0012] Furthermore, the carrier tape processing assembly also includes a clamping guide rod disposed at the end of the flexible conveyor unit, the clamping guide rod being used to clamp the joint between the carrier tape and the cover tape.

[0013] Furthermore, the flexible positioning frame is made of rubber material.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: By working together with the flexible positioning frame and the flexible delivery unit, the positioning accuracy of the chip is significantly improved, thereby ensuring the precise alignment of the chip and the carrier tape and enhancing the precision of chip packaging.

[0015] The heating mechanism preheats the carrier tape to enhance its adhesion and prevent delamination. Subsequently, through the interaction of the pressing plate and the abutment, the chip is precisely pressed onto the carrier tape, further improving the chip packaging quality. Furthermore, the cooperation between the flexible positioning frame and the pressing mechanism also enhances the chip packaging efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a packaging device for integrated circuit chips according to an embodiment of the present invention; Figure 2 This is a front view schematic diagram of a packaging device for integrated circuit chips according to an embodiment of the present invention; Figure 3 This is a top view schematic diagram of a packaging device for integrated circuit chips according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a packaging device (excluding flexible conveyor unit) for integrated circuit chips according to an embodiment of the present invention; Figure 5 for Figure 1 Top view of the flexible conveyor unit; Figure 6 for Figure 5 Schematic diagram of the AA section along the middle edge; Figure 7 forFigure 6 Schematic diagram of a flexible positioning frame; Figure 8 for Figure 2 Schematic diagram of the medium-pressure composite unit; Figure 9 for Figure 2 Schematic diagram of the heating mechanism (excluding the heating frame); Figure 10 for Figure 2 Schematic diagram of the lower middle support unit.

[0017] In the picture: 1. Flexible positioning mechanism; 11. Flexible conveying unit; 111. Bearing chain; 112. Transmission chain; 12. Drive unit; 121. Drive roller; 122. Drive motor; 123. Transmission roller; 13. Flexible positioning frame; 2. Operating table; 3. Heating mechanism; 31. Heating frame; 32. Heating frame; 33. Heating tube; 4. Winding mechanism; 41. Winding motor; 42. Winding roller; 5. Pressing mechanism; 51. Pressing unit; 511. First telescopic rod; 512. Connecting plate; 513. Damping rod; 514. Pressing plate; 52. Pressing frame; 53. Lower abutment unit; 531. Support frame; 532. Second telescopic rod; 533. Abutment plate; 6. Carrier tape unwinding mechanism; 61. Guide rod; 7. Detection mechanism; 71. Detection frame; 72. Detection probe; 8. Cover tape unwinding mechanism; 9. Pressing guide rod. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] like Figures 1-9 As shown, in some embodiments, a packaging apparatus for integrated circuit chips includes: A chip delivery assembly ensures precise placement and transport of chips during the packaging process. It includes a flexible positioning mechanism 1, which sequentially packages the chips. Specifically, the flexible positioning mechanism 1 comprises a flexible delivery unit 11 and multiple flexible positioning frames 13. These flexible positioning frames 13 are positioned on the flexible delivery unit 11, and their main function is to support and position the chips, ensuring the stability and accuracy of the chips during the packaging process, thereby significantly improving packaging efficiency and quality. Specifically, multiple loading slots are provided on the carrier tape, and the positions of these loading slots correspond to the positions of the flexible positioning frames 13 to ensure that the chips can be accurately installed in the loading slots. Positioning sensors are also provided within the flexible positioning frames, cooperating with the pressing mechanism 5 to ensure accurate chip positioning.

[0021] The carrier tape processing assembly is an indispensable part of the packaging equipment. It is responsible for performing necessary pretreatment on the carrier tape to ensure that the chip can be correctly bonded to it. The carrier tape processing assembly includes a heating mechanism 3 and a bonding mechanism 5. The heating mechanism 3 is located in front of the bonding mechanism 5, and its main function is to preheat the adhesive layer of the carrier tape to improve its adhesion, thus preparing it for the subsequent bonding process. By controlling the temperature of the heating mechanism 3, the bonding performance of the carrier tape is avoided due to excessively high or low temperatures. The bonding mechanism 5, through precise pressure control, ensures that the bonding process between the chip and the carrier tape is both fast and stable, thereby improving the reliability and consistency of the packaging.

[0022] The bonding mechanism 5 is a key component in the packaging equipment responsible for bonding the chip to the carrier tape. It includes a bonding unit 51 and a lower abutment unit 53. These two units are arranged correspondingly to ensure they can work together to complete the chip bonding task. The bonding unit 51 includes a bonding plate 514 and a receiver, which positions the chip using a positioning sensor and the receiver. The lower abutment unit 53 includes an abutment plate 533. During the packaging process, the bonding plate 514 moves downward and the abutment plate 533 moves upward. The two work together to precisely bond the chip to the carrier tape, ensuring a strong bond between the chip and the carrier tape.

[0023] In this embodiment, during the chip's movement, it mainly passes through the loading area, heating area, pressing area, cover tape area, and winding area. The specific chip packaging operation flow is as follows: The feeding area is located at the front end of the flexible conveying unit 11. The chip is placed into the flexible positioning frame 13 by an external feeding device, and the chip is moved forward by the flexible conveying unit 11. The heating zone is located at the heating mechanism 3. The carrier tape is preheated by passing through the heating mechanism 3 and then moves synchronously with the chip to the pressing zone. In the pressing zone, the pressing plate 514 and the abutment plate 533 simultaneously press the chip and carrier tape together with a pressure of 0.5-2N, and hold the pressure for 0.5-1.5 seconds; Cover area: After covering the chip with the cover tape, seal it; The winding area is where the finished products are wound up.

[0024] It is worth noting that the coordinated operation of the flexible positioning frame 13 and the flexible conveying unit 11 significantly improves the positioning accuracy of the chip, thereby ensuring the precise alignment of the chip and the carrier tape and enhancing the precision of chip packaging.

[0025] The heating mechanism 3 preheats the carrier tape to enhance its adhesion and prevent delamination. Subsequently, through the interaction of the pressing plate 514 and the abutment 533, the chip is precisely pressed onto the carrier tape, further improving the chip packaging quality. In addition, the cooperation between the flexible positioning frame 13 and the pressing mechanism 5 also improves the chip packaging efficiency.

[0026] Furthermore, in some embodiments, the packaging device also includes an operating table 2, with the chip delivery assembly and the carrier tape processing assembly respectively connected to the operating table 2, enabling the chip delivery assembly and the carrier tape processing assembly to be effectively connected and work together.

[0027] Specifically, the carrier tape processing assembly also includes a carrier tape unwinding mechanism 6, a cover tape unwinding mechanism 8, and a winding mechanism 4. The carrier tape unwinding mechanism 6, heating mechanism 3, and pressing mechanism 5 are sequentially arranged above the flexible positioning mechanism 1 to ensure precise positioning and processing of the carrier tape during the packaging process. The cover tape unwinding mechanism 8 is located at the lower part of the operating table 2, while the winding mechanism 4 is located at the end of the flexible conveying unit 11 for winding the packaged finished products, ensuring that the finished products can be neatly wound up for subsequent storage and transportation.

[0028] Specifically, the carrier tape unwinding mechanism 6 is equipped with a guide rod 61, which guides the movement of the carrier tape, ensuring that the carrier tape can move smoothly and accurately above the chip during the unwinding process, thereby improving the packaging accuracy and efficiency. The guide rod 61 is equipped with a limiting block, which makes the movement of the carrier tape during the packaging process more stable, greatly improving the packaging efficiency and quality.

[0029] The winding mechanism 4 includes a winding motor 41 and a winding roller 42. The winding motor 41 drives the winding roller 42 to rotate. Through the precise control of the winding motor 41, the winding speed and force can be precisely adjusted, thereby ensuring the quality of the packaged product.

[0030] It should be noted that the winding motor 41, the flexible positioning mechanism 1, and the pressing mechanism 5 are electrically coupled. This electrical connection method can ensure effective cooperation between the various components, thereby ensuring the stable operation of the entire packaging equipment and the packaging quality.

[0031] Furthermore, in some embodiments, the chip delivery assembly also includes a detection mechanism 7, which is located at the front end of the flexible delivery unit 11, i.e., the feeding area, to monitor the position of the chip in real time and ensure that the chip maintains accurate position during the packaging process.

[0032] Specifically, the testing mechanism 7 includes a testing frame 71 and a testing probe 72, with the probe 72 mounted in the lower region of the testing frame 71. The probe 72 efficiently performs its tasks, its core function being to identify and detect the precise position of the chip within the flexible positioning frame 13. Precise chip positioning is crucial to ensure accurate placement of the chip on the carrier tape.

[0033] like Figures 1-6 As shown, in some embodiments, the flexible positioning mechanism 1 further includes a drive unit 12, which is connected to the operating table 2. Specifically, the drive unit 12 is provided to provide a stable and controllable power source during the packaging process of the integrated circuit chip, thereby ensuring that the flexible conveying unit 11 can stably drive the chip to move.

[0034] The drive unit 12 includes a drive roller 121, a drive motor 122, and a transmission roller 123. The drive roller 121 and transmission roller 123 are respectively positioned at both ends of the flexible conveying unit 11, ensuring uniform power distribution and transmission. The drive motor 122 is connected to the drive roller 121, and precise control of the flexible conveying unit 11 can be achieved by controlling the rotational speed of the drive motor 122. This design ensures that the chip can pass through the packaging equipment in a stable posture during the packaging process, thereby improving the accuracy and reliability of the packaging.

[0035] Furthermore, the flexible conveying unit 11 includes a drive chain 112 and a support chain 111 disposed outside the drive chain 112. The drive chain 112 is meshed with the drive roller 121 and the drive roller 123. This design not only ensures the stable operation of the flexible conveying unit 11, but also enables the support chain 111 to remain stable during the conveying process. Specifically, the carrier chain 111 has multiple mounting slots, which correspond one-to-one with the loading slots on the carrier tape, ensuring that the chip can be accurately mounted in the loading slot. The flexible positioning frame 13 is embedded in the mounting slot, and the drive roller 121 drives the transmission chain 112 to move the carrier chain 111 cyclically. This structural design allows the flexible positioning frame 13 to move flexibly on the carrier chain 111, thereby achieving precise position control of the integrated circuit chip and further improving the efficiency and packaging quality of the packaging equipment. The flexible positioning frame 13 can also be replaced according to the size and shape of the chip, enhancing the flexibility of the packaging equipment.

[0036] like Figure 4 and Figure 9 As shown, in some embodiments, the heating mechanism 3 includes a heating frame 31, a heating frame 32, and multiple heating tubes 33. Specifically, the heating frame 31 is a structure fixedly connected to the upper part of the operating table 2, ensuring the stability of the equipment. The heating frame 32 is mounted on the heating frame 31 and is a frame structure used to accommodate and fix the heating tubes 33.

[0037] The multiple heating elements 33 are arranged in a U-shape within the heating frame 32. This layout allows for more uniform heat distribution, thereby improving thermal efficiency during the packaging process. The heating surfaces of the heating elements 33 are oriented towards the carrier tape. This design ensures that heat is directly applied to the carrier tape to be packaged, achieving a rapid and uniform heating effect and further improving packaging quality and efficiency.

[0038] like Figure 4 and Figure 10 As shown, in some embodiments, the pressing mechanism 5 further includes a pressing frame 52, and the pressing unit 51 is disposed at the lower part of the pressing frame 52; the pressing frame 52 is designed to provide a stable structure to ensure that the pressing unit 51 can operate accurately.

[0039] Specifically, the pressing unit 51 also includes a first telescopic rod 511, a connecting plate 512, and a damping rod 513. The first telescopic rod 511 and the damping rod 513 are respectively disposed on both sides of the connecting plate 512. The first telescopic rod 511 is connected to the pressing frame 52 to form a stable structure. The damping rod 513 is then connected to the pressing plate 514, allowing the first telescopic rod 511 to drive the pressing plate 514 to move.

[0040] In addition, the lower abutment unit 53 also includes a support frame 531 and a second telescopic rod 532. Specifically, the support frame 531 is fixedly connected to the operating table 2, and the two ends of the second telescopic rod 532 are connected to the support frame 531 and the abutment plate 533. The abutment plate 533 is driven to move towards the pressing plate 514 by the second telescopic rod 532.

[0041] In this embodiment, the operation process of the pressing mechanism 5 is as follows: First, the first telescopic rod 511 pushes the pressing plate 514 closer to the abutment plate 533, causing the carrier tape to move towards the chip. Next, the second telescopic rod 532 drives the abutment plate 533 upwards. During this process, the abutment plate 533 penetrates deeper into the flexible positioning frame 13, lifting the chip upwards and ensuring a tight bond between the chip and the carrier tape. Furthermore, the damping rod 513 prevents excessive pressure applied by the pressing plate 514. By maintaining the pressure within a suitable range, it effectively avoids chip damage caused by excessive pressure, thereby improving packaging efficiency and chip packaging quality.

[0042] Furthermore, in some embodiments, the carrier tape processing assembly also includes a pressing guide rod 9, which is disposed at the end of the flexible conveying unit 11. The pressing guide rod 9 is used to press the joint of the carrier tape and the cover tape, so that the cover tape can be stably attached to the carrier tape. In particular, a limiting block is also specially provided on the pressing guide rod 9. The limiting block enables the carrier tape and the cover tape to maintain accurate position during attachment, thereby playing a role in correction.

[0043] like Figure 7 As shown, in some embodiments, the flexible positioning frame 13 is made of elastic rubber. This design allows the flexible positioning frame 13 to provide a certain degree of elastic support during the packaging of integrated circuit chips, absorbing minor vibrations or impacts that may occur during the packaging process, thereby protecting the chip from damage and ensuring packaging quality.

[0044] The typical working process of the above embodiments is as follows: Step 1: Chip Loading and Position Calibration In the feeding area, the chips arranged by the external sorting machine are embedded into the flexible positioning frame 13, and each flexible positioning frame 13 carries a single chip. The drive motor 122 moves the carrier chain 111 in step mode, so that the chip reaches the detection mechanism 7. The position of the chip is detected. If the position meets the requirements, the chip continues to move. If the position does not meet the requirements, the machine stops for correction.

[0045] Step 2: Carrier tape preheating and adhesive layer activation The carrier tape is released from the carrier tape unwinding mechanism 6 and pulled to the heating mechanism 3 via the guide rod 61; Preheating control: The U-shaped heating tubes 33 form a uniform heat field within the heating frame 32, and the temperature is set to 80-120℃ (preferably 100℃±5℃). The carrier belt passes through the heating zone and is heated for 1.5-3 seconds, allowing the adhesive layer to reach its optimal melt flow state.

[0046] Step 3: Bidirectional Cooperative Pressing The calibrated chip and the preheated carrier tape move synchronously to the pressing mechanism 5; Pressing process: The first telescopic rod 511 drives the pressing plate 514 to move down, and the second telescopic rod 532 pushes the abutment plate 533 to move up, and the distance between the two is adjusted to 1.2 times the chip thickness; The chip and the carrier tape come into contact and adhere together.

[0047] Step 4: Sealing with cover tape and winding up the finished product The cover tape is unwound from the bottom of the operating table 2, covering the pressed chip array. The clamping guide rod 9 makes the carrier tape and the cover tape adhere together, sealing the chip.

[0048] Rewinding control: Rewinding motor 41 drives rewinding roller 42 to rewind.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0050] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0051] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A packaging device for integrated circuit chips, characterized in that, include: The chip delivery assembly includes a flexible positioning mechanism (1), the flexible positioning mechanism (1) includes a flexible delivery unit (11) and a plurality of flexible positioning frames (13), the plurality of flexible positioning frames (13) are disposed on the flexible delivery unit (11), the flexible positioning frames (13) are used to carry the chip, and the flexible positioning frames are provided with positioning sensors; The carrier tape processing assembly includes a heating mechanism (3) and a pressing mechanism (5), wherein the heating mechanism (3) is disposed on the front side of the pressing mechanism (5), and the heating mechanism (3) is used to preheat the adhesive layer of the carrier tape; The pressing mechanism (5) includes a pressing unit (51) and a lower abutment unit (53). The pressing unit (51) and the lower abutment unit (53) are respectively arranged. The pressing unit (51) includes a pressing plate (514) and a receiver. The lower abutment unit (53) includes abutment plate (533). The positioning sensor and the receiver cooperate to position the chip. The pressing plate (514) and the abutment plate (533) cooperate to press the chip onto the carrier tape.

2. The packaging equipment for integrated circuit chips according to claim 1, characterized in that, It also includes an operating table (2), the chip delivery assembly and the carrier tape processing assembly being connected to the operating table (2); The carrier tape processing assembly also includes a carrier tape unwinding mechanism (6), a cover tape unwinding mechanism (8), and a winding mechanism (4). The carrier tape unwinding mechanism (6), the heating unit (32), and the pressing mechanism (5) are arranged sequentially above the flexible positioning mechanism (1). The cover tape unwinding mechanism (8) is located at the lower part of the operating table (2), and the winding mechanism (4) is located at the end of the flexible conveying unit (11) for packaging and winding the finished product. The carrier tape unwinding mechanism (6) is provided with a guide rod (61), which is used to guide the movement of the carrier tape; The winding mechanism (4) includes a winding motor (41) and a winding roller (42), wherein the winding motor (41) drives the winding roller (42) to rotate; The winding motor (41), the flexible positioning mechanism (1), and the pressing mechanism (5) are electrically coupled.

3. The packaging equipment for integrated circuit chips according to claim 1, characterized in that, The chip delivery assembly also includes a detection mechanism (7), which is disposed at the front end of the flexible delivery unit (11); The detection mechanism (7) includes a detection frame (71) and a detection probe (72). The detection probe (72) is located at the lower part of the detection frame (71) and is used to identify the positional deviation of the chip in the flexible positioning frame (13).

4. The packaging equipment for integrated circuit chips according to claim 2, characterized in that, The flexible positioning mechanism (1) further includes a drive unit (12), which is connected to the operating table (2); The drive unit (12) includes a drive roller (121), a drive motor (122) and a transmission roller (123). The drive roller (121) and the transmission roller (123) are respectively disposed at both ends of the flexible conveying unit (11). The drive motor (122) is connected to the drive roller (121) in a transmission connection. The flexible conveying unit (11) includes a transmission chain (112) and a load-bearing chain (111) disposed outside the transmission chain (112). The transmission chain (112) meshes with the drive roller (121) and the transmission roller (123). The carrier chain (111) is provided with multiple mounting slots, the flexible positioning frame (13) is embedded in the mounting slots, and the drive roller (121) drives the transmission chain (112) to drive the carrier chain (111) to move cyclically.

5. The packaging equipment for integrated circuit chips according to claim 2, characterized in that, The heating mechanism (3) includes a heating frame (31), a heating frame (32) and multiple heating tubes (33). The heating frame (31) is fixed to the upper part of the operating table (2). The multiple heating tubes (33) are arranged in a U-shape inside the heating frame (32). The heating frame (32) is set on the heating frame (31). The heating surface of the heating tubes (33) faces the carrier belt.

6. The packaging equipment for integrated circuit chips according to claim 2, characterized in that, The pressing mechanism (5) further includes a pressing frame (52), and the pressing unit (51) is disposed at the lower part of the pressing frame (52); The pressing unit (51) further includes a first telescopic rod (511), a connecting plate (512), and a damping rod (513). The first telescopic rod (511) and the damping rod (513) are respectively disposed on both sides of the connecting plate (512). The damping rod (513) is connected to the pressing plate (514). The first telescopic rod (511) drives the pressing plate (514) to move toward the abutment plate (533). The lower abutment unit (53) also includes a support frame (531) and a second telescopic rod (532). The support frame (531) is fixedly connected to the operating table (2). The two ends of the second telescopic rod (532) are provided with support frames (531) and the abutment plate (533) connected. The second telescopic rod (532) drives the abutment plate (533) to move toward the pressing plate (514).

7. The packaging equipment for integrated circuit chips according to claim 2, characterized in that, The carrier belt processing assembly also includes a clamping guide rod (9), which is disposed at the end of the flexible conveying unit (11) and is used to clamp the joint between the carrier belt and the cover belt.

8. The packaging equipment for integrated circuit chips according to claim 1, characterized in that, The flexible positioning frame (13) is made of rubber.

Images