Substrate wet processing apparatus and substrate processing apparatus

Abstract

This application discloses a substrate wet processing apparatus and equipment, relating to the field of semiconductor equipment technology. The apparatus includes a processing tank for storing processing liquid and performing wet processing on multiple substrates within the tank. The multiple substrates are configured to be spaced apart along a first direction. The processing tank includes an inner tank and an outer tank, with the processing liquid in the inner tank capable of overflowing into the outer tank. A rotational drive includes a rotating shaft and an impeller. The rotating shaft extends along the first direction and is used to contact the outer edge of the substrate. The impeller is disposed within the outer tank and connected to the rotating shaft. The rotational drive is configured such that the processing liquid overflowing into the outer tank falls onto the impeller to drive its rotation, which in turn drives the rotating shaft to rotate, thereby rotating the substrate. This application can effectively improve the in-plane uniformity of the substrate during wet processing, achieving a more uniform etching rate and depth during wet etching, and enhancing the consistency of substrate surface cleanliness during wet cleaning.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, specifically to a substrate wet processing apparatus and substrate processing equipment. Background Technology

[0002] In semiconductor manufacturing processes, wet processing (including wet etching and wet cleaning) is a crucial step, primarily used to remove specific materials or contaminants from the substrate surface. Currently, tank-type wet processing is one of the commonly used methods. This method typically involves immersing multiple substrates in a processing tank (such as an etching tank or a cleaning tank), and treating the substrates with a processing solution (such as an etching solution or a cleaning solution) within the tank.

[0003] However, in practice, the processing solution in the processing tank often exhibits uneven distribution. For example, the concentration or temperature of the processing solution may differ in different areas of the upper and lower layers of the processing tank. These differences can lead to varying processing rates for substrates placed vertically in the tank at different locations on the upper and lower layers. For wet etching, this can cause abnormal etching uniformity on the substrate surface, thus affecting product yield; for wet cleaning, it can result in uneven surface cleanliness of the substrate, affecting subsequent processes and even leading to a decrease in device performance.

[0004] Taking wet etching as an example, the unevenness of the etching solution concentration and temperature directly affects the etching reaction rate. Areas with higher concentrations or higher temperatures will have faster etching reactions, and vice versa. This unevenness will cause differences in etching rate and etching depth within the substrate surface, resulting in unevenness on the substrate surface, affecting subsequent processes, and even leading to a decrease in device performance.

[0005] Similarly, in wet cleaning processes, uneven concentration and temperature of the cleaning solution can also affect the cleaning effect. This unevenness can lead to inconsistent surface cleanliness of the substrate, affecting subsequent processes and even causing a decline in device performance. Summary of the Invention

[0006] The technical problem to be solved by this application is to overcome the problem of uneven distribution of the processing liquid in different areas of the substrate wet processing device in the prior art, and to provide a substrate wet processing device and substrate processing equipment.

[0007] This application solves the above-mentioned technical problems through the following technical solution:

[0008] A substrate wet processing apparatus, comprising:

[0009] A processing tank for storing processing liquid and performing wet processing on multiple substrates, wherein the multiple substrates are configured to be spaced apart along a first direction, the processing tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the processing liquid in the inner tank being able to overflow into the outer tank;

[0010] A rotary drive includes a rotary shaft and an impeller. The rotary shaft extends along a first direction and is used to contact the outer edge of the substrate. The impeller is disposed in the outer groove and connected to the rotary shaft. The rotary drive is configured such that treatment liquid overflowing into the outer groove falls onto the impeller to drive the impeller to rotate, and the rotation of the impeller drives the rotary shaft to rotate, thereby driving the substrate to rotate.

[0011] Preferably, the treatment tank further includes a guide plate, which is disposed on the outer wall of the inner tank, and a liquid outlet is provided at the lower end of the guide plate, which is located above the impeller.

[0012] Preferably, the inner tank includes an overflow surface, through which the treatment liquid in the inner tank overflows into the outer tank, and the guide plate is disposed on the overflow surface.

[0013] Preferably, the size of the flow channel enclosed by the guide plate decreases downward in the vertical direction.

[0014] Preferably, the two rotary driving members are respectively disposed on both sides of the plurality of substrates, and the two rotary driving members rotate in the same direction.

[0015] Preferably, it also includes a substrate support portion disposed in the inner groove. The substrate support portion is used to support the plurality of substrates. The substrate support portion is configured such that when the rotation drive member drives the substrate to rotate, the substrate support portion descends to disengage from the substrate.

[0016] Preferably, the rotating shaft includes a first end that passes through the inner groove and is disposed within the outer groove, and the impeller is connected to the first end.

[0017] Preferably, the rotating shaft includes a second end disposed within the inner groove, and the processing groove further includes a limiting member disposed on the side of the inner groove facing the second end, with the second end located within the limiting member.

[0018] Preferably, it also includes:

[0019] A treatment fluid supply unit is used to supply treatment fluid to the inner tank;

[0020] A circulation pipeline, connected between the treatment fluid supply unit and the outer tank, is used to transport the treatment fluid in the outer tank to the treatment fluid supply unit; and

[0021] A circulation pump is installed on the circulation pipeline; and / or

[0022] A bubble generating section is disposed below the plurality of substrates and is used to generate bubbles in the processing liquid.

[0023] Preferably, it also includes a limiting caliper, which is disposed above the plurality of substrates for limiting the plurality of substrates.

[0024] A substrate wet processing apparatus, comprising:

[0025] A processing tank for storing a processing liquid and performing wet processing on a plurality of substrates, wherein the plurality of substrates are configured to be spaced apart along a first direction;

[0026] A rotary drive includes a rotary shaft and an impeller, the rotary shaft extending along the first direction and used to contact the outer edge of the substrate, the impeller being connected to the rotary shaft;

[0027] A nozzle is disposed within the processing tank and faces the impeller. The nozzle is configured to spray fluid toward the impeller to drive the impeller to rotate the rotating shaft, thereby causing the substrate to rotate.

[0028] Preferably, the treatment tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the treatment liquid in the inner tank being able to overflow into the outer tank;

[0029] The impeller is disposed in the outer groove and is connected to the rotating shaft;

[0030] The nozzle is disposed inside the outer groove.

[0031] Preferably, the two rotary driving members are respectively disposed on both sides of the plurality of substrates, and the two rotary driving members rotate in the same direction.

[0032] Preferably, it also includes a substrate carrier disposed in the processing groove. The substrate carrier is used to carry the plurality of substrates. The substrate carrier is configured such that when the rotation drive causes the substrate to rotate, the substrate carrier descends to disengage from the substrate.

[0033] Preferably, the rotating shaft includes a second end disposed within the inner groove, and the processing groove further includes a limiting member disposed on the side of the inner groove facing the second end, with the second end located within the limiting member, and the limiting member used to restrict the swaying of the second end.

[0034] Preferably, it also includes:

[0035] A treatment fluid supply unit is used to supply treatment fluid to the inner tank;

[0036] A circulation pipeline, connected between the treatment fluid supply unit and the outer tank, is used to transport the treatment fluid in the outer tank to the treatment fluid supply unit; and

[0037] A circulation pump is installed on the circulation pipeline; and / or

[0038] A bubble generating section is disposed below the plurality of substrates and is used to generate bubbles in the processing liquid.

[0039] A substrate processing apparatus includes the substrate wet processing device described above, and the substrate processing apparatus further includes:

[0040] Single-wafer cleaning unit, used for cleaning a single substrate;

[0041] Drying equipment for drying individual substrates;

[0042] A substrate transfer device is used to transfer a substrate between the substrate wet processing device and the single-wafer cleaning device, and / or to transfer a substrate in the single-wafer cleaning device to the drying device.

[0043] The positive advancements of this application lie in the fact that multiple substrates rotate within the processing tank, causing the relative positions of various points on the substrates in the processing solution to continuously change. This reduces the problem of uneven processing rates caused by differences in processing solution concentration and temperature at different heights or in different areas of the processing tank. Consequently, it effectively improves the in-plane uniformity of the substrate during wet processing, achieving a more uniform etching rate and depth during wet etching, and enhancing the consistency of substrate surface cleanliness during wet cleaning. Furthermore, the centrifugal force generated by the substrate rotation promotes the removal of byproducts (such as bubbles and etching residues) from the substrate surface. This improves the quality of substrate processing, ensuring the smooth progress of subsequent processes and enhancing device performance and product yield. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the substrate wet processing apparatus according to Embodiment 1 of this application;

[0045] Figure 2This is a schematic diagram of the structure at the overflow surface of the inner tank in Embodiment 1 of this application;

[0046] Figure 3 This is another schematic diagram of the substrate wet processing apparatus of Embodiment 1 of this application;

[0047] Figure 4 This is a schematic diagram of the internal structure of the processing tank in Embodiment 1 of this application;

[0048] Figure 5 This is a schematic diagram of the substrate wet processing apparatus according to Embodiment 2 of this application;

[0049] Figure 6 This is another schematic diagram of the substrate wet processing apparatus of Embodiment 2 of this application;

[0050] Figure 7 This is a front view of the inner groove structure in Embodiment 2 of this application;

[0051] Figure 8 This is a schematic diagram of the substrate processing device according to Embodiment 3 of this application. Detailed Implementation

[0052] The present application is further illustrated below by way of embodiments, but this does not limit the present application to the scope of the embodiments.

[0053] Example 1

[0054] like Figure 1 and Figure 2 As shown, this embodiment provides a substrate wet processing apparatus, which includes a processing tank 100, a substrate support portion 200, and a rotary drive 300. The processing tank 100 is used to store processing liquid and to perform wet processing on multiple substrates 400 in the processing tank 100. The multiple substrates 400 are arranged at intervals along a first direction X. The processing tank 100 includes an inner tank 110 and an outer tank 120. The outer tank 120 is disposed outside the inner tank 110, and the processing liquid in the inner tank 110 can overflow into the outer tank 120. The rotary drive 300 includes a rotating shaft 310 and an impeller 320. The rotating shaft 310 extends along the first direction X and is used to contact the outer edge of the substrate 400. The impeller 320 is disposed in the outer tank 120 and is connected to the rotating shaft 310. The rotary drive 300 is configured such that the treatment liquid overflowing into the outer tank 120 falls onto the impeller 320 to drive the impeller 320 to rotate, and the rotation of the impeller 320 drives the rotary shaft 310 to rotate to drive the substrate 400 to rotate.

[0055] The processing solution overflowing into the outer tank 120 falls onto the impeller 320, driving the impeller 320 and the rotating shaft 310 to rotate. This, in turn, causes multiple substrates 400 to rotate within the processing tank 100, resulting in a continuous change in the relative positions of various points on the substrates 400 within the processing solution. This reduces the uneven processing rate caused by differences in processing solution concentration and temperature at different heights or in different areas of the processing tank 100. Therefore, it effectively improves the in-plane uniformity of the substrates 400 during wet processing, achieving a more uniform etching rate and depth during wet etching, and enhancing the consistency of surface cleanliness during wet cleaning. Furthermore, the centrifugal force generated by the rotation of the substrates 400 promotes the removal of byproducts (such as bubbles and etching residues) from the substrate surface. This improves the quality of substrate 400 processing, ensuring the smooth progress of subsequent processes and enhancing device performance and product yield. The impeller 320 is powered by the kinetic energy of the treatment fluid overflowing into the outer tank 120. The substrate 400 can be rotated without the need for an additional power mechanism, which simplifies the drive structure and avoids the drive complexity caused by the introduction of additional drive components (such as motors or cylinders) and the problem of contamination of the treatment fluid.

[0056] In some embodiments, such as Figure 2 As shown, the treatment tank 100 also includes a guide plate 130, which is disposed on the outer wall of the inner tank 110. A liquid outlet 131 is provided at the lower end of the guide plate 130, positioned above the impeller 320. By providing the guide plate 130 on the inner tank 110 and the liquid outlet 131 at the lower end of the guide plate 130, the overflowing treatment liquid can be effectively guided to the top of the impeller 320, avoiding energy loss caused by disordered flow of the treatment liquid. This makes the impeller 320 more concentrated and efficient in the impact of the liquid flow, thereby improving the driving effect and rotational stability of the impeller 320 and ensuring that the substrate 400 can achieve more uniform rotation within the treatment tank 100.

[0057] In some embodiments, the inner tank 110 includes an overflow surface 111, through which the treatment liquid in the inner tank 110 overflows to the outer tank 120. A guide plate 130 is disposed on the overflow surface 111. Wherein, as... Figure 2 As shown, the overflow surface 111 includes an overflow portion 1111, which is specifically a groove structure. The treatment liquid in the inner tank 110 overflows to the outer tank 120 through the overflow portion 1111. In some embodiments, the overflow portion 1111 may also be a through hole structure.

[0058] In some embodiments, such as Figure 2As shown, the size of the flow channel enclosed by the guide plate 130 decreases vertically downwards. The gradual decrease in the size of the flow channel vertically downwards can accelerate the overflowing treatment liquid, making the liquid flow more concentrated and at a higher velocity when it approaches the impeller 320, thereby enhancing the impact force of the liquid flow on the impeller 320 and increasing the driving force of the impeller 320.

[0059] In some embodiments, such as Figure 2 As shown, two rotary drive members 300 are respectively disposed on both sides of multiple substrates 400. The two rotary drive members 300 rotate in the same direction, which is the same as the rotation direction of the impeller 320 and the rotating shaft 310. By distributing two rotary drive members 300 on each side of the lower part of multiple substrates 400 and making their rotation directions the same, a rotary driving force can be applied to the outer edge of the substrates 400 from both sides simultaneously. This avoids the uneven force distribution that may be caused by a single drive member, thus enabling the multiple substrates 400 to maintain a stable rotation state. This is beneficial for further improving the in-plane uniformity of the substrates 400 during wet processing and enhancing the overall processing effect. Two guide plates 130 are also provided, each corresponding to one of the impellers 320 of each rotary drive member 300. To ensure that the rotary drive unit 300 rotates in the same direction, the outlets 131 of the two guide plates 130 are located on the same side of the two impellers 320, so that the processing liquid flowing out of the outlets 131 can drive the two impellers 320 to rotate in the same direction. Specifically, the rotary drive unit 300 is located at the lower part of the plurality of substrates 400. The low position of the rotary drive unit 300 results in a large potential energy for the gravitational overflow of the processing liquid.

[0060] In some embodiments, the number of rotary drive members 300 is not limited to two, and one or more may be provided.

[0061] In some embodiments, the substrate carrier 200 is disposed in the inner groove 110, and the substrate carrier 200 is used to carry a plurality of substrates 400.

[0062] In some embodiments, the rotating shaft 310 may be connected to the substrate support portion 200 via a bearing to fix the rotating shaft 310.

[0063] In some embodiments, the substrate carrier 200 is configured such that when the rotary drive 300 rotates the substrate 400, the substrate carrier 200 descends to disengage from the substrate 400. The substrate carrier 200 includes multiple slots, with the substrate 400 located within each slot. The descent distance of the substrate carrier 200 is controlled within the depth range of the slots. When the substrate 400 wobbles during rotation, the substrate carrier 200 can limit its movement. The wet substrate processing apparatus also includes a lifting device, to which the substrate carrier 200 is connected, and the lifting device drives the substrate carrier 200 to rise and fall.

[0064] By configuring the substrate support portion 200 to descend when the rotating drive member 300 drives the substrate 400 to rotate, thereby disengaging the substrate support portion 200 from the substrate 400, frictional resistance or local jamming caused by continuous contact between the substrate support portion 200 and the substrate 400 during rotation can be avoided, thus ensuring the smoothness and stability of the substrate 400's rotation. Furthermore, in conventional systems, the contact points between the substrate support portion 200 and the substrate 400 are fixed, and the processing liquid cannot cover the contact point area, easily forming marks on the contact point area of ​​the substrate 400. In this embodiment, by transforming the static contact between the substrate 400 and the substrate support portion 200 into a dynamic contact between the substrate 400 and the rotating shaft 310, the position of the contact points on the substrate 400 changes with the rotation of the substrate 400, and each contact point is only blocked for a short time. Therefore, no obvious marks are formed on the substrate 400.

[0065] In some embodiments, the rotating shaft 310 includes a first end 311, which passes through the inner groove 110 and is disposed within the outer groove 120, and the impeller 320 is connected to the first end 311. Specifically, the first end 311 passes through the overflow surface 111 of the inner groove 110.

[0066] In some embodiments, such as Figure 3As shown, the rotating shaft 310 also includes a second end 312, which is disposed within the inner groove 110. The processing groove 100 also includes a limiting member 140, which is disposed on the side of the inner groove 110 facing the second end 312. The second end 312 is located within the limiting member 140, which is used to limit the wobbling of the second end 312. By providing the limiting member 140 on the side of the inner groove 110 facing the second end 312 of the rotating shaft 310, and ensuring that the second end 312 is located within the limiting member 140, the wobbling of the second end 312 during rotation can be effectively limited, preventing the rotating shaft 310 from becoming unstable due to offset or from having uneven contact with the outer edge of the substrate 400. Specifically, the limiting member 140 is a limiting groove surrounding the second end 312. There is a certain gap between the second end 312 and the limiting member 140. Under normal rotation, the second end 312 does not contact the limiting member 140. Only when abnormal shaking occurs will the second end 312 contact the limiting member 140, thereby playing a limiting role.

[0067] In some embodiments, the material of the rotating shaft 310 can be quartz or PTFE (polytetrafluoroethylene). The surface roughness of the area where the rotating shaft 310 contacts the substrate 400 is greater than the surface roughness of the first end 311 and / or the second end 312. Specifically, this can be achieved by surface sandblasting the area where the rotating shaft 310 contacts the substrate 400. This increases the friction between the rotating shaft 310 and the substrate 400, making it easier to rotate the substrate 400. The lower surface roughness of the first end 311 and / or the second end 312 helps reduce friction with the inner groove.

[0068] In some embodiments, such as Figure 3 As shown, a bearing 700 is provided between the first end 311 of the rotating shaft 310 and the overflow surface 111 to reduce the friction between the first end 311 and the overflow surface 111, and to improve the rotational stability of the rotating shaft 310. The bearing 700 can be made of corrosion-resistant materials such as ceramic or PTFE.

[0069] In some embodiments, such as Figure 4As shown, the substrate wet processing apparatus also includes a processing liquid supply unit 510, a circulation pipeline 520, and a circulation pump 530. The processing liquid supply unit 510 supplies processing liquid to the processing tank 100. The circulation pipeline 520 connects the processing liquid supply unit 510 and the outer tank 120, and is used to transport the processing liquid in the outer tank 120 to the processing liquid supply unit 510. The circulation pump 530 is installed on the circulation pipeline 520. By providing the processing liquid supply unit 510 below the substrate support 200, and combining it with the circulation pipeline 520 and the circulation pump 530, the processing liquid in the outer tank 120 can be recycled. This not only ensures a continuous supply and flow of the processing liquid in the processing tank 100, but also improves the utilization rate of the processing liquid and reduces operating costs. Furthermore, the circulation effect makes the concentration and temperature of the processing liquid in the processing tank 100 more uniform. The processing liquid supply unit 510 is located below the substrate support 200.

[0070] In some embodiments, the substrate wet processing apparatus further includes a bubble generation unit 540 disposed below the substrate support portion 200 for forming bubbles in the processing liquid. By providing the bubble generation unit 540 below the substrate support portion 200 and forming bubbles in the processing liquid, liquid flow and convection can be promoted, improving the exchange efficiency of the processing liquid on the surface of the substrate 400, thereby enhancing the etching or cleaning effect and further improving product yield.

[0071] In some embodiments, the substrate wet processing apparatus further includes a limiting caliper disposed above multiple substrates to limit the multiple substrates and prevent large displacement of the substrates during rotation.

[0072] Example 2

[0073] This embodiment is basically the same as the solution in Embodiment 1, except that the impeller 320 is driven in a different way. In this embodiment, as shown in the example... Figure 5 As shown, the substrate wet processing apparatus includes a processing tank 100, a substrate support 200, a rotary drive 300, and a nozzle 600. The processing tank 100 stores processing fluid and allows multiple substrates 400 to undergo wet processing within it, wherein the multiple substrates 400 are arranged at intervals along a first direction X. The rotary drive 300 includes a rotating shaft 310 and an impeller 320. The rotating shaft 310 extends along the first direction X and is used to contact the outer edge of the substrate 400. The impeller 320 is connected to the rotating shaft 310. The nozzle 600 is disposed within the processing tank 100 and faces the impeller 320. The nozzle 600 is configured to spray fluid (e.g., airflow and / or liquid flow) toward the impeller 320 to drive the impeller 320 to rotate the rotating shaft 310, thereby rotating the substrates 400. The rotating shaft 310 can be connected to the processing tank 100 via a bearing to fix the rotating shaft 310.

[0074] By placing a nozzle 600 within the treatment tank 100 as a power source and directing the nozzle 600 toward the impeller 320, the airflow and / or liquid flow ejected from the nozzle 600 directly impacts the impeller 320, thereby driving the impeller 320 to rotate and in turn causing the rotating shaft 310 to rotate, thus enabling multiple substrates 400 to rotate. This method utilizes the kinetic energy of the jet fluid to achieve the rotation of the substrates 400, eliminating the need for additional complex mechanical drive structures, simplifying the device structure, and avoiding potential sources of mechanical contamination and maintenance complexity.

[0075] In some embodiments, such as Figure 6 and Figure 7 As shown, the treatment tank 100 includes an inner tank 110 and an outer tank 120. The outer tank 120 is located outside the inner tank 110, and the treatment liquid in the inner tank 110 can overflow into the outer tank 120. An impeller 320 is located inside the outer tank 120 and is connected to a rotating shaft 310. A nozzle 600 is located inside the outer tank 120. By employing an inner tank 110 and an outer tank 120 structure in the treatment tank 100, allowing the treatment liquid in the inner tank 110 to overflow into the outer tank 120, extending the first end 311 of the rotating shaft 310 to the outer tank 120 and connecting it to the impeller 320, and then placing the nozzle 600 inside the outer tank 120, the airflow and / or liquid flow ejected by the nozzle 600 can directly impact the impeller 320 inside the outer tank 120, thereby driving the rotating shaft 310. This structural design avoids the potential interference to the flow field of the treatment fluid on the substrate 400 that might be caused by directly arranging the nozzle 600 in the inner tank 110.

[0076] Specifically, the rotating shaft 310 includes a first end 311, which passes through the inner groove 110 and is disposed in the outer groove 120. The impeller 320 is connected to the first end 311.

[0077] In some embodiments, a bearing is provided between the first end 311 of the rotating shaft 310 and the inner groove 110 to reduce the friction between the first end 311 and the inner groove 110 and to improve the rotational stability of the rotating shaft 310. The bearing may be made of corrosion-resistant materials such as ceramic or PTFE.

[0078] In some embodiments, two rotary drive members 300 are respectively disposed on both sides of the plurality of substrates 400, and the two rotary drive members 300 rotate in the same direction. Specifically, the rotary drive members 300 are disposed at the lower part of the plurality of substrates 400.

[0079] In some embodiments, a substrate carrier 200 is further included, disposed in the processing groove 100, for carrying a plurality of substrates 400. The substrate carrier 200 is configured such that when the rotation drive 300 drives the substrates 400 to rotate, the substrate carrier 200 descends to disengage from the substrates 400.

[0080] In some embodiments, the rotating shaft 310 includes a second end 312 disposed within the inner groove 110. The processing groove 100 also includes a limiting member disposed on the side of the inner groove 110 facing the second end 312. The second end 312 is located within the limiting member, and the limiting member is used to limit the swaying of the second end 312.

[0081] In some embodiments, refer to the appendix of embodiment 1 Figure 4 The substrate wet processing apparatus also includes a processing liquid supply unit 510, a circulation pipeline 520, and a circulation pump 530. The processing liquid supply unit 510 supplies processing liquid to the inner tank 110. The circulation pipeline 520 connects the processing liquid supply unit 510 and the outer tank 120, and is used to transport the processing liquid in the outer tank 120 to the processing liquid supply unit 510. The circulation pump 530 is installed on the circulation pipeline 520. The processing liquid supply unit 510 is located below the substrate support portion 200.

[0082] In some embodiments, the substrate wet processing apparatus further includes a bubble generating unit 540 disposed below the substrate support unit 200 for generating bubbles in the processing liquid.

[0083] Example 3

[0084] like Figure 8 As shown, this embodiment provides a substrate processing apparatus, including the substrate wet processing device 810 as described above. The substrate processing apparatus further includes a single-substrate cleaning device 820, a drying device 830, and a substrate transfer device 840. The single-substrate cleaning device 820 is used to clean a single substrate. The drying device 830 is used to dry a single substrate. The substrate transfer device 840 is used to transfer a substrate between the substrate wet processing device 810 and the single-substrate cleaning device 820, and / or to transfer a substrate from the single-substrate cleaning device 820 to the drying device 830.

[0085] The drying device 830 includes, but is not limited to, a supercritical drying device, an isopropyl alcohol (IPA) drying device, a supercritical (Ultra Thermodry, UTD) drying device, and a surface modification treatment (SMT) drying device.

[0086] While specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the protection scope of this application.

Claims

1. A substrate wet processing apparatus, characterized in that, include: A processing tank for storing processing liquid and performing wet processing on multiple substrates, wherein the multiple substrates are configured to be spaced apart along a first direction, the processing tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the processing liquid in the inner tank being able to overflow into the outer tank; A rotary drive includes a rotary shaft and an impeller. The rotary shaft extends along a first direction and is used to contact the outer edge of the substrate. The impeller is disposed in the outer groove and connected to the rotary shaft. The rotary drive is configured such that treatment liquid overflowing into the outer groove falls onto the impeller to drive the impeller to rotate, and the rotation of the impeller drives the rotary shaft to rotate, thereby driving the substrate to rotate.

2. The substrate wet processing apparatus according to Claim 1, wherein The treatment tank also includes a guide plate, which is disposed on the outer wall of the inner tank. The lower end of the guide plate is provided with a liquid outlet, which is located above the impeller.

3. The substrate wet processing apparatus according to Claim 2, wherein The inner tank includes an overflow surface, through which the treatment liquid in the inner tank overflows into the outer tank, and the guide plate is disposed on the overflow surface.

4. The substrate wet processing apparatus according to Claim 2, wherein The size of the flow channel enclosed by the guide plate decreases downward in the vertical direction.

5. The substrate wet processing apparatus according to claim 1, wherein The two rotating drive members are respectively disposed on both sides of the plurality of substrates, and the two rotating drive members rotate in the same direction.

6. The substrate wet processing apparatus according to claim 1, wherein It also includes a substrate support portion disposed in the inner groove. The substrate support portion is used to support the plurality of substrates. The substrate support portion is configured such that when the rotation drive member drives the substrate to rotate, the substrate support portion descends to disengage from the substrate.

7. The substrate wet processing apparatus as described in claim 1, characterized in that, The rotating shaft includes a first end, which passes through the inner groove and is disposed in the outer groove, and the impeller is connected to the first end.

8. The substrate wet processing apparatus as described in claim 1, characterized in that, The rotating shaft includes a second end, which is disposed within the inner groove. The processing groove also includes a limiting member, which is disposed on the side of the inner groove facing the second end, and the second end is located within the limiting member.

9. The substrate wet processing apparatus as described in claim 1, characterized in that, Also includes: A treatment fluid supply unit is used to supply treatment fluid to the inner tank; A circulation pipeline is connected between the treatment liquid supply unit and the outer tank, for transporting the treatment liquid in the outer tank to the treatment liquid supply unit; as well as A circulation pump is installed on the circulation pipeline; and / or A bubble generating section is disposed below the plurality of substrates and is used to generate bubbles in the processing liquid.

10. The substrate wet processing apparatus as described in claim 1, characterized in that, It also includes a limiting caliper, which is set above the plurality of substrates to limit the plurality of substrates.

11. A substrate wet processing apparatus, characterized in that, include: A processing tank for storing a processing liquid and performing wet processing on a plurality of substrates, wherein the plurality of substrates are configured to be spaced apart along a first direction; A rotary drive includes a rotary shaft and an impeller, the rotary shaft extending along the first direction and used to contact the outer edge of the substrate, the impeller being connected to the rotary shaft; A nozzle, disposed within the processing tank and facing the impeller, is configured to: spray fluid toward the impeller to drive the impeller to rotate the rotating shaft, thereby rotating the substrate; and A substrate carrier is disposed in the processing groove. The substrate carrier is used to carry the plurality of substrates. The substrate carrier is configured such that when the rotation drive causes the substrate to rotate, the substrate carrier descends to disengage from the substrate. The substrate carrier includes a plurality of slots, and the substrate is configured to be located in the slots. The distance by which the substrate carrier descends is controlled within the depth range of the slots.

12. The substrate wet processing apparatus as described in claim 11, characterized in that, The treatment tank includes an inner tank and an outer tank, the outer tank being disposed outside the inner tank, and the treatment liquid in the inner tank being able to overflow into the outer tank; The impeller is disposed in the outer groove and is connected to the rotating shaft; The nozzle is disposed inside the outer groove.

13. The substrate wet processing apparatus as described in claim 11 or 12, characterized in that, The two rotating drive members are respectively disposed on both sides of the plurality of substrates, and the two rotating drive members rotate in the same direction.

14. The substrate wet processing apparatus as described in claim 12, characterized in that, The rotating shaft includes a second end, which is disposed within the inner groove. The processing groove also includes a limiting member, which is disposed on the side of the inner groove facing the second end. The second end is located within the limiting member, and the limiting member is used to limit the shaking of the second end.

15. The substrate wet processing apparatus as described in claim 12, characterized in that, Also includes: A treatment fluid supply unit is used to supply treatment fluid to the inner tank; A circulation pipeline is connected between the treatment liquid supply unit and the outer tank, for transporting the treatment liquid in the outer tank to the treatment liquid supply unit; as well as A circulation pump is installed on the circulation pipeline; and / or A bubble generating section is disposed below the plurality of substrates and is used to generate bubbles in the processing liquid.

16. A substrate processing apparatus, characterized in that, The substrate wet processing apparatus, as described in any one of claims 1-15, further includes: Single-wafer cleaning unit, used for cleaning a single substrate; Drying equipment for drying individual substrates; A substrate transfer device is used to transfer a substrate between the substrate wet processing device and the single-wafer cleaning device, and / or to transfer a substrate in the single-wafer cleaning device to the drying device.

Images