Wafer loading mechanism

Abstract

The application provides a wafer feeding mechanism, and relates to the technical field of automatic wafer feeding machinery, and comprises a mounting plate fixedly installed on a crystal vibration point glue machine, the upper surface of the mounting plate is provided with a gap distribution assembly for wafer conveying and receiving feeding, the gap distribution assembly comprises a plurality of guide grooves which are uniformly distributed in a circle and arranged on one side of the upper surface of the mounting plate, wherein the inner walls of every four adjacent guide grooves are movably connected with sliding frame plates, and the upper surfaces of the sliding frame plates are fixedly connected with positioning discs. The positioning gear connected by the fixed shaft between the two side plates is sleeved with the rack strip with a uniformly installed limiting support plate on the surface, the driving structure provides power for the rack strip, wafer feeding and conveying are carried out at equal intervals, wafer feeding and conveying can be carried out at equal intervals, wafer stacking and mutual influence are prevented, and the quality of crystal vibration point glue is reduced.

Description

Technical Field

[0001] This invention relates to the field of automated silicon wafer feeding machinery, and more specifically, to a wafer feeding mechanism. Background Technology

[0002] The wafer feeding mechanism in a crystal oscillator dispensing machine is an automated feeding system specifically designed for quartz crystal wafers. Its core function is to efficiently and non-destructively separate and transport thin, brittle crystal wafers to the dispensing station. This mechanism typically employs layer-by-layer wafer separation technology, using brushes or air flotation devices (such as air jets) to separate stacked crystal wafers layer by layer, creating buffer gaps. A vacuum chuck then precisely picks up the top layer of wafers, preventing breakage caused by mechanical compression. Simultaneously, it integrates visual positioning and high-precision guide rails to ensure wafer posture correction and stable transport, ultimately achieving single-wafer, orderly wafer feeding, meeting the high precision and low breakage rate requirements of the dispensing process.

[0003] During the wafer loading process of a crystal oscillator dispensing machine, the lifting mechanism is used to adjust the vertical position of the wafer. However, when multiple wafers are stacked and lifted synchronously, the lower wafers are prone to microcracks or breakage due to excessive pressure. This mechanical stress damage not only reduces the mechanical strength of the wafers but also affects the accuracy and yield of subsequent dispensing processes.

[0004] For example, the Chinese invention patent (application number: 201910327227.X) discloses an "automatic silicon wafer sorting and feeding mechanism," the specification of which states: This invention provides an automatic silicon wafer sorting and feeding mechanism, which includes a worktable set on the top of the mounting frame, a feeding mechanism that vertically penetrates the worktable, the feeding mechanism including a support component and a lifting component, a limiting mechanism set around the support component, and a layering mechanism installed on the top of the material area formed by the limiting mechanism. It uses a brush in conjunction with the lifting component to drive the silicon wafer stacks that are set up and lowered. The brush separates the silicon wafers on the top of the stack from the stack. At the same time, the air nozzle separates the uppermost silicon wafer from the adjacent silicon wafer below to form a buffer zone. When the vacuum suction cup moves down to pick up the silicon wafer, there is a downward pressure buffer zone, which avoids the silicon wafers from being squeezed and broken. This solves the technical problem of silicon wafers being easily broken by pressure when being picked up, and realizes the automatic, orderly sorting and output of silicon wafers one by one. The above patent can corroborate the defects of the prior art.

[0005] Therefore, we have made improvements to this by proposing a wafer loading mechanism. Summary of the Invention

[0006] The purpose of this invention is to address the problem that when multiple wafers are stacked and simultaneously raised and lowered, the lower wafers are prone to microcracks or breakage due to excessive pressure. This mechanical stress damage not only reduces the mechanical strength of the wafers but also affects the accuracy and yield of subsequent dispensing processes.

[0007] To achieve the above-mentioned objectives, the present invention provides a wafer loading mechanism to improve the aforementioned problems.

[0008] The application is as follows:

[0009] A wafer loading mechanism includes a mounting plate fixedly installed on a crystal oscillator dispensing machine. The upper surface of the mounting plate is provided with a gap distribution assembly for wafer transport and loading. The gap distribution assembly includes a plurality of guide grooves evenly distributed circumferentially on one side of the upper surface of the mounting plate. A sliding frame plate is movably connected to the inner wall of four adjacent guide grooves. A positioning plate is fixedly connected above the sliding frame plate. A support rod is fixedly connected to the center of the upper surface of the positioning plate. Two side plates are symmetrically and evenly distributed above the support rod. Two fixed shafts are movably connected symmetrically and evenly distributed between the two side plates. Positioning gears are provided on the outer wall of the fixed shafts. A rack belt is movably connected between the two positioning gears. A plurality of limiting support plates for receiving wafers are evenly distributed on the outer wall of the rack belt.

[0010] As a preferred technical solution of this application, a side frame is fixedly connected to the lower side of one of the side plates, and a drive motor is fixedly connected to the side frame near the side plate. The output shaft end of the drive motor is fixedly installed at one end of a fixed shaft located below the side frame.

[0011] As a preferred technical solution of this application, a limiting ring is movably connected above several positioning disks. Four arc-shaped grooves are evenly distributed on one side of the upper surface of the limiting ring. The arc-shaped grooves are movably connected to the support rod. A cleaning component is provided below the limiting ring.

[0012] As a preferred technical solution of this application, the cleaning component includes a support groove cylinder movably installed on the inner wall of the limiting ring. The support groove cylinder is fixedly installed on the surface of the mounting plate below. A protective cover is fixedly installed on the bottom surface of the mounting plate. Fan blades are movably installed on the inner wall of the protective cover. Several side tube columns are evenly distributed and fixedly connected on the upper surface of the mounting plate, and the lower ends of the side tube columns penetrate the mounting plate and are located within the protective cover. A side cone frame plate is fixedly connected to the side tube column near the support groove cylinder. A vertical groove for concentrating airflow is provided on the side of the side cone frame plate away from the support groove cylinder. An auxiliary component is provided on one side of the upper surface of the mounting plate and is located directly above the support groove cylinder.

[0013] As a preferred technical solution of this application, the outer surface of the protective cover is provided with a number of air inlet slots evenly distributed around the circumference, and a filter screen is provided above the fan blades and is fixedly installed directly above the protective cover.

[0014] As a preferred technical solution of this application, a base plate is fixedly connected to the bottom of the protective cover, an auxiliary motor is fixedly connected to the side of the base plate, and the output shaft end of the auxiliary motor passes through the protective cover and is fixedly installed directly below the fan blade.

[0015] As a preferred technical solution of this application, the auxiliary component includes two inclined frames that are symmetrically and evenly distributed and fixedly installed on the surface of the mounting plate. A semi-circular plate for enveloping the airflow is fixedly connected above the two inclined frames. A cover plate is fixedly installed above the semi-circular plate. A fixed corner frame is provided below the cover plate. An arc-shaped brush plate is fixedly connected to the end of the fixed corner frame away from the arc-shaped plate.

[0016] As a preferred technical solution of this application, an arc-shaped plate is movably connected above the side of the semi-circular plate, and a telescopic rod is fixedly connected to the side of the arc-shaped plate away from the side plate.

[0017] As a preferred technical solution of this application, a right-angle frame is fixedly connected to the end of the telescopic rod away from the arc-shaped plate, and one side of the right-angle frame is fixedly installed above the semi-circular plate.

[0018] As a preferred technical solution of this application, two guide rail grooves are symmetrically and evenly distributed on the upper surface of the mounting plate away from the limiting ring. Slide plates are movably connected to the inner walls of the two guide rail grooves, and a receiving plate is fixedly connected above the two slide plates.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] In the scheme of this application:

[0021] 1. To address the issue in existing technologies where lower-layer wafers are prone to microcracks or breakage due to excessive pressure when multiple wafers are stacked and simultaneously lifted, resulting in mechanical stress damage that not only reduces the mechanical strength of the wafers but also affects the accuracy and yield of subsequent dispensing processes, a positioning gear connected by a fixed shaft between two side plates is used. A rack belt with uniformly mounted limiting support plates is fitted between the gears. The drive structure provides power to the rack belt to load and transport wafers at equal intervals. This allows for the loading and transport of wafers at equal intervals, preventing wafers from piling up and interfering with each other, thus reducing the quality of crystal oscillator dispensing.

[0022] 2. To address the problem of incomplete cleaning of impurities on the wafer surface caused by a single airflow blowing on the wafer in the existing technology, a rotating fan blade drives the airflow through the air inlet slot of the protective cover. After entering the area below the mounting plate, part of the airflow enters the support slot and blows towards the bottom of the wafer, which is guided sequentially by the conveyor structure to the rack belt. The other part of the airflow enters the side column and moves upward, exiting through the vertical groove on the side of the side cone frame plate. It blows through the gaps between several wafers to perform a secondary cleaning of the wafer surface. This allows for double airflow cleaning of the wafers during loading and transportation, thereby improving the quality of crystal oscillator dispensing.

[0023] 3. The wafer conveying side is wrapped by a semi-circular plate and a cover plate is installed on top to seal it, forming a semi-enclosed structure. This can prevent external airflow from affecting the cleaning process. The arc plate on one side of the semi-circular plate is driven by a telescopic rod to move the wafer for unloading. This allows it to switch flexibly between the semi-enclosed protective structure and the conveying structure, thereby improving the flexibility of wafer loading.

[0024] 4. During the wafer loading process, the positioning gear drives the rack belt to perform transmission motion, which causes the surface limiting support plate to perform interval transmission of the wafer. During the wafer cleaning process, the limiting support plate separates several wafers at equal intervals, and the airflow is guided by the vertical groove in the side cone frame plate so that the airflow can flow over the surface of the wafer. This allows it to flexibly switch between the interval transmission structure and the separation air guiding structure, thereby improving the efficiency and quality of wafer transmission.

[0025] 5. The airflow from the vertical groove in the side cone frame plate blows onto several wafers, which initially cleans the impurities on the wafer surface. When the wafer is discharged from the limiting support plate of the toothed strip, the impurities adhering to the wafer surface are brushed and cleaned by the bristles under the arc-shaped brush plate. This double cleaning of impurities on the wafer surface solves the problem of adhering impurities that the airflow cannot clean, so as to ensure the quality of the crystal oscillator processing. Attached Figure Description

[0026] Figure 1 Schematic diagram of the overall structure of the wafer loading mechanism provided in this application Figure 1 ;

[0027] Figure 2 Schematic diagram of the overall structure of the wafer loading mechanism provided in this application Figure 2 ;

[0028] Figure 3 A partial structural diagram of the wafer loading mechanism provided in this application. Figure 1 ;

[0029] Figure 4 An exploded view of the wafer loading mechanism provided in this application;

[0030] Figure 5 A partial structural diagram of the wafer loading mechanism provided in this application. Figure 2 ;

[0031] Figure 6 A partial structural schematic diagram of the gap feeding component in the wafer loading mechanism provided in this application;

[0032] Figure 7 A partial exploded view of the wafer loading mechanism provided in this application;

[0033] Figure 8 This is an engineering schematic diagram of the crystal oscillator dispensing machine provided in this application.

[0034] The image shows:

[0035] 1. Mounting plate; 2. Gap material distribution assembly; 201. Guide groove; 202. Sliding frame plate; 203. Limiting ring; 204. Arc groove; 205. Support rod; 206. Side plate; 207. Fixed shaft; 208. Positioning gear; 209. Rack belt; 210. Limiting support plate; 211. Side frame; 212. Drive motor; 213. Positioning disc; 3. Cleaning assembly; 301. Side column; 302. Protective cover; 303. 304 Base plate; 305 Auxiliary motor; 306 Fan blade; 307 Support groove cylinder; 308 Filter screen plate; 309 Vertical groove; 310 Air inlet groove; 4. Side cone frame plate; 5. Guide rail groove; 6. Auxiliary components; 501 Inclined frame; 502 Semi-circular plate; 503 Right angle frame; 504 Telescopic rod; 505 Arc plate; 506 Fixed corner frame; 507 Arc brush plate; 508 Cover plate; 6. Slide plate; 7. Support plate. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0037] As described in the background art, when multiple wafers are stacked and moved synchronously, the lower wafers are prone to microcracks or breakage due to excessive pressure. This mechanical stress damage not only reduces the mechanical strength of the wafers, but also affects the accuracy and yield of subsequent dispensing processes.

[0038] To address this technical problem, the present invention provides a wafer loading mechanism, which is applied in the field of automated silicon wafer loading machinery.

[0039] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0040] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0042] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 A wafer loading mechanism includes a mounting plate 1 fixedly installed on a crystal oscillator dispensing machine. The upper surface of the mounting plate 1 is provided with a wafer transport and loading gap distribution assembly 2. The gap distribution assembly 2 includes a plurality of guide grooves 201 evenly distributed circumferentially on one side of the upper surface of the mounting plate 1. A sliding frame plate 202 is movably connected to the inner wall of four adjacent guide grooves 201. A positioning plate 213 is fixedly connected above the sliding frame plate 202. A support rod 205 is fixedly connected to the middle of the upper surface of the positioning plate 213. Two side plates 206 are symmetrically and evenly distributed and fixedly connected above the support rod 205, with the two middle sets of side plates 206 being lower in height than the two adjacent sets of side plates 206. Two fixed shafts 207 are symmetrically and evenly distributed and movably connected between the two side plates 206. The outer wall of the 7th section is equipped with positioning gears 208, and a rack belt 209 is movably connected between two positioning gears 208. The outer wall of the rack belt 209 is evenly distributed with several limiting support plates 210 for receiving wafers. During the wafer dispensing process, the wafers are sequentially fed into the limiting support plates 210 at the same height on the four rack belts 209 along the conveying structure. Then, the drive motor 212 is started, which drives the fixed shaft 207 to rotate, providing power to the positioning gears 208 connected to the fixed shaft 207 and to the rack belts 209 connected to the positioning gears 208. This allows the rack belt 209, which is equipped with another positioning gear 208, to move upwards with the limiting support plates 210, thereby transporting the wafers at equal intervals during the feeding process.

[0043] The positioning gear 208, which is connected between two side plates 206 by a fixed shaft 207, and the rack belt 209, which is fitted between them with a uniformly mounted limiting support plate 210, provide power to the rack belt 209 through the drive structure, so as to feed and transport the wafers at equal intervals. This allows the wafers to be fed and transported at equal intervals, preventing the wafers from piling up together and affecting each other, thus reducing the quality of crystal oscillator dispensing.

[0044] Furthermore, such as Figure 4 and Figure 6 As shown, a side frame 211 is fixedly connected to the lower side of one of the side plates 206. A drive motor 212 is fixedly connected to the side frame 211 near the side plate 206. The output shaft end of the drive motor 212 is fixedly installed at one end of the fixed shaft 207 located below the side frame 211. The side frame 211 positions the drive motor 212 under one side of the side frame 211, thereby increasing the stability of the drive motor 212 during operation.

[0045] Furthermore, such as Figure 6 and Figure 8 As shown, a limiting ring 203 is movably connected above several positioning disks 213. Four arc-shaped grooves 204 are evenly distributed on one side of the upper surface of the limiting ring 203. The arc-shaped grooves 204 are movably connected to the support rod 205. A cleaning component 3 is provided below the limiting ring 203. The rotation of the limiting ring 203 drives the support rod 205 to move in the arc-shaped grooves 204 on its surface. The sliding frame plate 202 below the support rod 205 is longitudinally limited in the guide groove 201, thereby adjusting the distance between the four sets of side plates 206 to accommodate wafers of different sizes.

[0046] Example 2 further optimizes the wafer loading mechanism provided in Example 1, specifically, as follows: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 7As shown, the cleaning component 3 includes a support groove 306 movably mounted on the inner wall of the limiting ring 203. The support groove 306 is fixedly mounted on the surface of the mounting plate 1 below. A protective cover 302 is fixedly mounted on the bottom surface of the mounting plate 1. Fan blades 305 are movably mounted on the inner wall of the protective cover 302. Several side columns 301 are evenly distributed and fixedly connected to the upper surface of the mounting plate 1, with the lower ends of the side columns 301 penetrating the mounting plate 1 and located within the protective cover 302. A side cone frame plate 310 is fixedly connected to the side column 301 near the support groove 306. A vertical groove 308 for concentrating airflow is provided on the side of the side cone frame plate 310 away from the support groove 306. An auxiliary component 5 is provided on one side of the upper surface of the mounting plate 1, directly above the support groove 306. During the wafer loading and transportation process, the auxiliary component... The machine 304 drives the fan blades 305 to rotate, causing the airflow to pass through the air inlet slot 309 of the protective cover 302. The airflow moves upward and passes through the filter plate 307. Part of the airflow enters the support slot cylinder 306 and blows towards the bottom of the wafers that are sequentially guided by the conveying structure to the rack belt 209, thereby initially cleaning the impurities carried by the wafers during the conveying and feeding process. The other part of the airflow enters the side column 301 and moves upward, and is discharged through the vertical slot 308 on the side of the side cone frame plate 310, blowing towards several vertically fed wafers. The airflow blows through the gaps between several wafers to perform a secondary cleaning of the wafer surface. The airflow passing through the wafers hits the semi-circular plate 502 and then adheres to the inner surface of the semi-circular plate 502 and moves to both sides, thereby performing a double blowing cleaning of the wafer surface.

[0047] The rotating fan blades 305 drive the airflow through the air inlet slots 309 of the protective cover 302. After entering the area below the mounting plate 1, part of the airflow enters the support slot cylinder 306 and blows towards the bottom of the wafers that are sequentially guided by the conveying structure to the rack belt 209. The other part of the airflow enters the side column 301 and moves upward. It is discharged through the vertical slots 308 on the side of the side cone frame plate 310 and blows through the gaps between several wafers to perform secondary cleaning on the surface of the wafers. This allows for double air blowing cleaning of the wafers during loading and transportation, thereby increasing the quality of crystal oscillator dispensing.

[0048] Furthermore, such as Figure 2 , Figure 3 and Figure 4 As shown, the outer surface of the protective cover 302 has several air inlet slots 309 evenly distributed around its circumference. A filter screen 307 is provided above the fan blade 305 and is fixedly installed directly above the protective cover 302. The filter screen 307 filters the airflow guided by the fan blade 305 to prevent the airflow from carrying impurities and reducing the quality of cleaning.

[0049] Furthermore, such as Figure 8As shown, a base plate 303 is fixedly connected to the bottom of the protective cover 302, and an auxiliary motor 304 is fixedly connected to the side of the base plate 303. The output shaft of the auxiliary motor 304 passes through the protective cover 302 and is fixedly installed directly below the fan blade 305. The auxiliary motor 304 provides power to the fan blade 305 mounted in the protective cover 302, enabling it to guide airflow.

[0050] Example 3 further optimizes the wafer loading mechanism provided in Examples 1 and 2, specifically, as follows: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 7 As shown, the auxiliary component 5 includes two inclined brackets 501 symmetrically and evenly distributed and fixedly installed on the surface of the mounting plate 1. A semi-circular plate 502 for enveloping the airflow is fixedly connected above the two inclined brackets 501. A cover plate 508 is fixedly installed above the semi-circular plate 502. A fixed corner bracket 506 is provided below the cover plate 508. An arc-shaped brush plate 507 is fixedly connected to the end of the fixed corner bracket 506 away from the arc-shaped plate 505. The airflow is guided out by the side cone frame plate 310 and blown into the gaps between several wafers. The airflow carries impurities from the wafer surface to the inner surface of the semicircular plate 502. Due to the cover plate 508 mounted above the semicircular plate 502, the airflow is discharged from below the semicircular plate 502. After the top wafer is transported to the highest point and detaches from the two sets of toothed belts 209 in the middle, the telescopic rod 504 is activated to push the arc plate 505 out of the side surface of the semicircular plate 502 and push it towards the edge of the top wafer. The toothed belts 209 from which the wafer detaches are picked up and carried away by the material picking structure and placed on the receiving plate 7 for material conveying and standby.

[0051] The semi-circular plate 502 wraps around the wafer conveying side, and a cover plate 508 is installed on top of it to seal it, forming a semi-enclosed structure. This can prevent external airflow from affecting the cleaning process. The arc-shaped plate 505 on one side of the semi-circular plate 502 is driven by the telescopic rod 504 to carry the wafer for unloading. This allows it to flexibly switch between the semi-enclosed protective structure and the conveying structure, thereby improving the flexibility of wafer loading.

[0052] Furthermore, such as Figure 2 and Figure 4 As shown, an arc-shaped plate 505 is movably connected to the upper side of the semi-circular plate 502. A telescopic rod 504 is fixedly connected to the side of the arc-shaped plate 505 away from the side plate 206, and the telescopic rod 504 provides power for the lateral displacement of the arc-shaped plate 505.

[0053] Furthermore, such as Figure 2 and Figure 4As shown, a right-angle bracket 503 is fixedly connected to the end of the telescopic rod 504 away from the arc plate 505. One side of the right-angle bracket 503 is fixedly installed above the semi-circular plate 502. The position of the telescopic rod 504 is fixed by the right-angle bracket 503, which increases the stability of the displacement of the arc plate 505.

[0054] Furthermore, such as Figure 1 and Figure 5 As shown, two guide rail grooves 4 are symmetrically and evenly distributed on the side of the upper surface of the mounting plate 1 away from the limiting ring 203. Slide plates 6 are movably connected to the inner walls of the two guide rail grooves 4. A receiving plate 7 is fixedly connected above the two slide plates 6. The receiving plate 7 is moved by the slide plates 6 to limit the movement, and the guide rail grooves 4 are laterally displaced.

[0055] The wafer loading mechanism provided by this invention is used as follows:

[0056] Working principle: The operator uses mounting plate 1 to install the overall structure on the upper surface of the crystal oscillator dispensing machine, and then starts the conveying structure to guide the wafers to the four sets of side plates 206 of mounting plate 1 in sequence;

[0057] Loading: Before loading, the limiting ring 203 is rotated. The rotation of the limiting ring 203 drives the support rod 205 to move in the arc groove 204 on its surface. The sliding frame plate 202 below the support rod 205 is longitudinally limited in the guide groove 201, thereby adjusting the distance between the four sets of side plates 206 to accommodate wafers of different sizes. After the appropriate size is reached, the wafers are carried along the conveying structure and enter the limiting support plate 210 at the same height of the four rack belts 209. Then, the drive motor 212 is started, which drives the fixed shaft 207 to rotate, providing power to the positioning gear 208 connected to the fixed shaft 207 and to the rack belt 209 connected to the positioning gear 208. This allows the rack belt 209, which is equipped with another positioning gear 208, to move upward with the limiting support plate 210, thereby transporting the wafers at equal intervals during the loading process.

[0058] Cleaning: During the upward movement of the wafer, the auxiliary motor 304 at the bottom of the protective cover 302 is started, which drives the fan blade 305 to rotate, and drives the airflow through the air inlet slot 309 of the protective cover 302. The airflow moves upward and passes through the filter plate 307. Part of the airflow enters the support slot cylinder 306 and blows towards the bottom of the wafer that is sequentially guided by the conveying structure to the rack belt 209, thereby initially cleaning the impurities carried by the wafer during the conveying process. The other part of the airflow enters the side column 301 and moves upward, and is discharged through the vertical slot 308 on the side of the side cone frame plate 310, blowing towards several vertically fed wafers. The airflow blows through the gaps between several wafers to perform secondary cleaning on the surface of the wafer. The airflow passing through the wafer hits the semi-circular plate 502 and then moves to both sides along the inner surface of the semi-circular plate 502, thereby performing double blowing cleaning on the surface of the wafer.

[0059] Unloading: The wafer is moved upward by four sets of toothed belts 209. The top wafer is transported to the highest point and after it is separated from the middle two sets of toothed belts 209, the telescopic rod 504 is activated to push the arc plate 505 out of the side surface of the semi-circular plate 502 and push it towards the edge of the top wafer, so that it is separated from the toothed belts 209. It is then picked up and carried away by the picking structure and placed on the receiving plate 7 for material conveying and standby.

[0060] Brush cleaning: During the process of the arc plate 505 pushing the top wafer away from the limiting support plate 210 of the toothed belt 209, the upper surface of the wafer comes into contact with the bristles of the arc brush plate 507. As the bristles sweep across the surface of the wafer, they brush and clean the impurities that the airflow cannot carry away, preventing impurities from adhering to the surface of the wafer.

[0061] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0062] Obviously, the embodiments described above are merely some embodiments of the present invention, not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms; rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this invention.

Claims

1. A wafer feeding mechanism comprising a mounting plate (1) fixedly mounted on a crystal vibrating point dispenser, characterized in that, The upper surface of the mounting plate (1) is provided with wafer conveying receiving and feeding gap separating assembly (2), the gap separating assembly (2) includes a plurality of guide grooves (201) which are uniformly distributed on one side of the upper surface of the mounting plate (1), wherein the inner walls of the adjacent four guide grooves (201) are movably connected with sliding frame plates (202), the upper surface of the sliding frame plate (202) is fixedly connected with a positioning disc (213), the upper surface of the positioning disc (213) is fixedly connected with a support rod (205), the upper surface of the support rod (205) is fixedly connected with two side plates (206) which are symmetrically and uniformly distributed, two fixed shafts (207) are movably connected between the two side plates (206), the outer wall of the fixed shaft (207) is provided with a positioning gear (208), a rack belt (209) is movably connected between the two positioning gears (208), and the outer wall of the rack belt (209) is uniformly provided with a plurality of limiting support plates (210) for receiving wafers; One of the side plates (206) is fixedly connected with a side frame (211) below the side plate (206), the side frame (211) is fixedly connected with a drive motor (212) close to the side plate (206), and the output shaft end of the drive motor (212) is fixedly installed on one end of the fixed shaft (207) below the side frame (211); A plurality of positioning discs (213) are movably connected with limiting circular rings (203) above the positioning discs (213), four arc-shaped grooves (204) are uniformly arranged on one side of the upper surface of the limiting circular ring (203), the arc-shaped grooves (204) are movably connected with the support rod (205), and a cleaning assembly (3) is arranged below the limiting circular ring (203); The cleaning assembly (3) includes a support groove cylinder (306) movably installed on the inner wall of the limiting circular ring (203), the support groove cylinder (306) is fixedly installed on the surface of the mounting plate (1) below, a protective cover (302) is fixedly installed on the bottom surface of the mounting plate (1), a fan blade (305) is movably installed on the inner wall of the protective cover (302), a plurality of side pipe columns (301) are fixedly connected on the upper surface of the mounting plate (1) in a uniform distribution, the lower end of the side pipe column (301) penetrates through the mounting plate (1) and is located in the protective cover (302), a side tapered frame plate (310) is fixedly connected on the side of the side pipe column (301) close to the support groove cylinder (306), and a vertical groove (308) for concentrating airflow is arranged on the side of the side tapered frame plate (310) away from the support groove cylinder (306).

2. A wafer loading mechanism according to claim 1, wherein An auxiliary assembly (5) is arranged on one side of the upper surface of the mounting plate (1) and directly above the support groove cylinder (306).

3. A wafer loading mechanism according to claim 2, wherein A plurality of air inlet grooves (309) are uniformly and circumferentially arranged on the outer surface of the protective cover (302), a filter screen (307) is arranged above the fan blade (305) and is fixedly installed directly above the protective cover (302).

4. A wafer loading mechanism according to claim 2, wherein The bottom frame plate (303) is fixedly connected below the protective cover (302), the side surface of the bottom frame plate (303) is fixedly connected with an auxiliary motor (304), and the output shaft end of the auxiliary motor (304) penetrates through the protective cover (302) and is fixedly installed below the fan blade (305).

5. A wafer loading mechanism according to claim 2, wherein The auxiliary assembly (5) comprises two inclined frames (501) fixedly installed on the surface of the mounting plate (1) in a symmetrical and uniform distribution, a semicircular plate (502) for wrapping airflow is fixedly connected above the two inclined frames (501), a cover plate (508) is fixedly installed above the semicircular plate (502), a fixed corner frame (506) is arranged below the cover plate (508), and an arc-shaped brush plate (507) is fixedly connected to the end of the fixed corner frame (506) away from the arc-shaped plate (505).

6. A wafer loading mechanism according to claim 5, wherein The semicircular plate (502) is movably connected with an arc-shaped plate (505) on the side surface thereof, and the arc-shaped plate (505) is fixedly connected with an extension rod (504) on the side away from the side plate (206).

7. A wafer loading mechanism according to claim 6, wherein The extension rod (504) is fixedly connected with a right-angle frame (503) at the end away from the arc-shaped plate (505), and the right-angle frame (503) is fixedly installed above the semicircular plate (502) on one side.

8. A wafer loading mechanism according to claim 7, wherein Two guide rail grooves (4) are arranged on the upper surface of the mounting plate (1) in a symmetrical and uniform distribution away from the limiting circular ring (203), and a sliding plate (6) is movably connected to the inner wall of each guide rail groove (4), and a supporting plate (7) is fixedly connected above the two sliding plates (6).

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