Jig convenient for wafer inspection

Abstract

The invention provides a jig convenient for wafer inspection, and relates to the field of semiconductor inspection. The jig convenient for wafer inspection comprises an inspection jig supporting seat structure, a movable groove is formed in the upper surface of the inspection jig supporting seat structure, an inspection jig angle adjusting and rotating structure is movably connected into the movable groove, and a wafer bearing structure is fixedly connected to the top end of the inspection jig angle adjusting and rotating structure. And a slot is formed in the right side of the inspection jig angle adjusting and rotating structure. According to the jig convenient for wafer inspection, through the mutual cooperation of the slot, the wafer position fixing structure, the moving hole, the open slot, the spring, the movable block and the pull rod, the wafer bearing structure can be positioned after being rotated, so that the current processing angle of the wafer does not generate displacement; the problem that the accuracy of the inspection position is affected due to the rotation of the bearing structure because the existing jig convenient for wafer inspection is not positioned after rotation is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor inspection technology, specifically to a fixture for easy wafer inspection. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer, or wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers. The main wafer processing methods are wafer fabrication and batch processing, i.e., processing one or more wafers simultaneously. As semiconductor feature sizes become smaller and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Simultaneously, the reduction in feature size increases the impact of the number of airborne particles on the quality and reliability of the wafer after processing. With improved cleanliness, the particle count also exhibits new data characteristics. Chemical vapor deposition (CVD) is a technique used in the manufacture of microelectronic devices to deposit thin films, which may be dielectric materials or semiconductors. Physical vapor deposition (PVD) uses inert gases to bombard a sputtering target, depositing the desired material on the wafer surface. The high temperature and vacuum environment within the process reaction chamber allows these metal atoms to crystallize into grains. After patterning and etching, the desired conductive circuit is obtained. Optical development transfers the pattern from the photomask onto the thin film. Optical development generally includes steps such as photoresist coating, baking, photo-alignment, exposure, and development. Dry etching is the most commonly used etching method, using gas as the primary etching medium and plasma to drive the reaction. Etching removes unwanted material from a surface.

[0003] Chemical Mechanical Polishing (CMP) is a technique that combines mechanical polishing with acid-base solution-based chemical polishing. It can make the wafer surface relatively flat, facilitating subsequent processes. During polishing, the polishing slurry is placed between the wafer and the polishing pad. Factors affecting CMP include: polishing head pressure and wafer flatness, rotational speed, and the chemical composition of the polishing slurry. Silicon wafers and silicon solar wafers are typical representatives of semiconductor materials and semiconductor devices, respectively. Semiconductor characteristic parameters measure and characterize the performance of materials and devices. Since charge carriers are the functional carriers of semiconductor materials and devices, their movement forms current and electric fields. Charge carriers also exhibit characteristics such as luminescence and thermal radiation. Therefore, charge carrier parameters are the basis for characterizing the charge carrier transport characteristics of semiconductor materials and devices; that is, charge carrier parameters are an important component of the characteristic parameters of silicon wafers and silicon solar wafers. After silicon wafers are processed and manufactured to form silicon solar wafers, the difference between the pn junction and the Fermi level causes charge carrier separation, forming voltage. This, in turn, results in electrical performance parameters such as saturation current, fill factor, and photoelectric conversion efficiency, which directly reflect and affect the volt-ampere characteristics of the solar wafer. In summary, the main characteristic parameters of silicon wafers include carrier parameters.

[0004] Charge carriers are divided into majority carriers and minority carriers, including electrons and holes. Carrier diffusion and drift form current, which is the basis for information transmission in semiconductor devices. Carrier transport parameters are fundamental parameters describing carrier movement and concentration, mainly including carrier lifetime, diffusion coefficient, and front and back surface recombination rates. These parameters directly reflect the physical and electrical properties of semiconductor materials, affecting carrier concentration and mobility. Doping concentration is another important parameter determining carrier concentration, influencing material resistivity and carrier lifetime, and ultimately determining device performance. After wafer production, inspection is required. Existing wafer inspection fixtures do not provide proper positioning after rotation, causing the support structure to rotate and affecting the accuracy of the inspection position. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer inspection fixture that solves the problem that existing wafer inspection fixtures do not perform positioning after rotation, causing the support structure to rotate and thus affecting the accuracy of the inspection position.

[0006] Technical solution To achieve the above objectives, the present invention provides the following technical solution: a wafer inspection fixture, comprising an inspection fixture support structure, wherein a movable groove is formed on the upper surface of the inspection fixture support structure, an inspection fixture angle adjustment rotating structure is movably connected inside the movable groove, a wafer holding structure is fixedly connected to the top of the inspection fixture angle adjustment rotating structure, a slot is formed on the right side of the inspection fixture angle adjustment rotating structure, a slot is formed on the front of the inspection fixture support structure, a movable hole communicating with the interior of the movable groove is formed on the left inner wall of the slot, a wafer position fixing structure is movably connected inside the movable hole, the left end of the wafer position fixing structure is inserted into the interior of the slot, a movable block is fixedly connected to the right end of the wafer position fixing structure, a spring is sleeved on the surface of the wafer position fixing structure, the left end of the spring is fixedly connected to the left inner wall of the slot, and the right end of the spring is fixedly connected to the left side of the movable block.

[0007] Furthermore, a pull rod is fixedly connected to the front of the movable block.

[0008] Furthermore, a threaded hole communicating with the interior of the wafer mounting structure is provided on the right side of the wafer mounting structure, and a control bolt is threaded into the interior of the threaded hole.

[0009] Furthermore, a support ring structure is fixedly connected to the surface of the inspection fixture angle adjustment and rotation structure, and the lower surface of the support ring structure overlaps with the upper surface of the inspection fixture support base structure.

[0010] Furthermore, the upper surface of the inspection fixture support structure is provided with an annular groove, and a support rod is movably connected inside the annular groove. The top end of the support rod is fixedly connected to the lower surface of the wafer holding structure. When the wafer is placed inside the wafer holding structure, the control bolt is turned to the left to position the wafer. When the wafer angle needs to be adjusted during processing, the pull rod is pulled to the right to pull the wafer position fixing structure out of the slot. The wafer holding structure is rotated to adjust the wafer position. Then the pull rod can be released, the spring contracts, and the movable block moves to the left. The movable block pushes the wafer position fixing structure to the left and inserts it into the corresponding slot to adjust the current wafer position.

[0011] This invention provides a wafer inspection fixture that facilitates wafer inspection. It offers the following advantages: This wafer inspection fixture, through the cooperation of slots, wafer positioning structure, moving holes, slots, springs, movable blocks, and pull rods, achieves positioning after the wafer support structure is rotated, ensuring that the current processing angle of the wafer does not shift. This solves the problem of existing wafer inspection fixtures failing to position themselves after rotation, causing the support structure to rotate and affecting the accuracy of the inspection position. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a front view of the structure of the present invention.

[0013] Among them, 1 is the inspection fixture support structure, 2 is the movable groove, 3 is the inspection fixture angle adjustment and rotation structure, 4 is the wafer holding structure, 5 is the support rod, 6 is the annular groove, 7 is the support ring structure, 8 is the slot, 9 is the wafer position fixing structure, 10 is the moving hole, 11 is the slot, 12 is the spring, 13 is the movable block, 14 is the pull rod, 15 is the threaded hole, and 16 is the control bolt. Detailed Implementation

[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0015] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0016] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0017] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0018] like Figure 1-2As shown, the present invention provides a wafer inspection fixture, including an inspection fixture support structure 1, an movable groove 2 is formed on the upper surface of the inspection fixture support structure 1, and an inspection fixture angle adjustment rotation structure 3 is movably connected inside the movable groove 2.

[0019] In Embodiment 1 of the present invention, a support ring structure 7 is fixedly connected to the surface of the inspection fixture angle adjustment rotating structure 3. The lower surface of the support ring structure 7 overlaps with the upper surface of the inspection fixture support base structure 1. An annular groove 6 is formed on the upper surface of the inspection fixture support base structure 1. A support rod 5 is movably connected inside the annular groove 6. The top end of the support rod 5 is fixedly connected to the lower surface of the wafer mounting structure 4. The top end of the inspection fixture angle adjustment rotating structure 3 is fixedly connected to the wafer mounting structure 4. A threaded hole 15 communicating with the inside of the wafer mounting structure 4 is formed on the right side of the wafer mounting structure 4. A control bolt 16 is threadedly connected inside the threaded hole 15. A slot 8 is formed on the right side of the inspection fixture angle adjustment rotating structure 3.

[0020] In Embodiment 2 of the present invention, the front of the inspection fixture support structure 1 is provided with a slot 11, and the left inner wall of the slot 11 is provided with a movable hole 10 that communicates with the interior of the movable slot 2. The interior of the movable hole 10 is movably connected to a wafer position fixing structure 9. The left end of the wafer position fixing structure 9 is inserted into the interior of the slot 8, and the right end of the wafer position fixing structure 9 is fixedly connected to a movable block 13. The front of the movable block 13 is fixedly connected to a pull rod 14, and a spring 12 is sleeved on the surface of the wafer position fixing structure 9. The left end of the spring 12 is fixedly connected to the left inner wall of the slot 11, and the right end of the spring 12 is fixedly connected to the left side of the movable block 13.

[0021] Working principle: Place the wafer into the wafer holding structure 4, turn the control bolt 16 to the left to position the wafer. When the wafer angle needs to be adjusted during processing, pull the lever 14 to the right to pull the wafer position fixing structure 9 out of the slot 8. Rotate the wafer holding structure 4 to adjust the wafer position. Then, release the lever 14, and the spring 12 will retract to move the movable block 13 to the left. The movable block 13 will push the wafer position fixing structure 9 to the left and insert it into the corresponding slot 8 to adjust the current wafer position.

[0022] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer inspection fixture, comprising an inspection fixture support structure (1), characterized in that: The upper surface of the inspection fixture support structure (1) is provided with a movable groove (2). The interior of the movable groove (2) is movably connected to an inspection fixture angle adjustment rotating structure (3). The top of the inspection fixture angle adjustment rotating structure (3) is fixedly connected to a wafer holding structure (4). The right side of the inspection fixture angle adjustment rotating structure (3) is provided with a slot (8). The front of the inspection fixture support structure (1) is provided with a slot (11). The left inner wall of the slot (11) is provided with a moving hole (10) that communicates with the interior of the movable groove (2). The interior of the moving hole (10) is movably connected to a wafer position fixing structure (9). The left end of the wafer position fixing structure (9) is inserted into the interior of the slot (8). The right end of the wafer position fixing structure (9) is fixedly connected to a movable block (13). The surface of the wafer position fixing structure (9) is fitted with a spring (12). The right end of the spring (12) is fixedly connected to the left side of the movable block (13).

2. The wafer inspection fixture according to claim 1, characterized in that: A pull rod (14) is fixedly connected to the front of the movable block (13).

3. The wafer inspection fixture according to claim 1, characterized in that: The wafer mounting structure (4) has a threaded hole (15) on its right side that communicates with the inside of the wafer mounting structure (4), and a control bolt (16) is threaded inside the threaded hole (15).

4. The wafer inspection fixture according to claim 1, characterized in that: The surface of the inspection fixture angle adjustment rotation structure (3) is fixedly connected to a support ring structure (7), and the lower surface of the support ring structure (7) overlaps with the upper surface of the inspection fixture support base structure (1).

5. A wafer inspection fixture according to claim 1, characterized in that: The upper surface of the inspection fixture support structure (1) is provided with an annular groove (6), and a support rod (5) is movably connected inside the annular groove (6).

6. The wafer inspection fixture according to claim 1, characterized in that: The left end of the spring (12) is fixedly connected to the left inner wall of the slot (11).

7. A wafer inspection fixture according to claim 5, characterized in that: The top end of the support rod (5) is fixedly connected to the lower surface of the wafer support structure (4).

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