Heat exchange device, heat management system and vehicle

Abstract

The invention provides a heat exchange device which comprises a first phase change module, a second phase change module and a heat exchange medium, the path of the heat exchange medium flowing from one of the first phase change module and the second phase change module to the other one has a magnetic field, and the heat exchange medium is liquid metal. The invention further discloses a heat management system which comprises the heat exchange device. The electromagnetic induction effect is generated through movement of the liquid metal in the magnetic field, conversion from heat energy to electric energy is achieved, an external circulating pump is not needed, the system weight and space occupation are remarkably reduced, and meanwhile the energy recycling rate is increased.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology, specifically to a heat exchange device, a thermal management system, and a vehicle. Background Technology

[0002] In related technologies, the thermal management system of new energy vehicle battery packs typically relies on an external circulation pump to drive the liquid cooling system and achieve rapid heat exchange. While this method can ensure a certain level of heat dissipation efficiency, its complex structural design not only increases the overall vehicle weight but also occupies valuable interior space, hindering vehicle lightweighting and improved space utilization. Furthermore, the use of an external circulation pump also leads to increased energy consumption and higher system maintenance costs, limiting further optimization of the range and economy of new energy vehicles. Summary of the Invention

[0003] One of the objectives of this invention is to provide a heat exchanger that is self-circulating without external power, so as to solve the technical problems of high energy consumption and complex structure of heat exchangers in the prior art.

[0004] To achieve the above objectives, the technical solution adopted by this invention is as follows: a heat exchange device is proposed, comprising a first phase change module, a second phase change module, and a heat exchange medium. The heat exchange medium, flowing from one of the first or second phase change modules to the other, has a magnetic field in its path. The heat exchange medium is a liquid metal. The beneficial effects of this solution are: by introducing a magnetic field into the flow path of the heat exchange medium, an induced current is generated by the liquid metal cutting magnetic field lines during the phase change process, realizing the conversion of thermal energy into gravitational potential energy and then into electrical energy. This allows for the recovery and utilization of energy through the use of recycled electrical energy for refrigeration.

[0005] In conjunction with the first aspect above, in one possible implementation, a flow channel is further included, which is disposed between the first phase change module and the second phase change module, through which the heat exchange medium flows from one of the first phase change module or the second phase change module to the other.

[0006] In conjunction with the first aspect above, in one possible implementation, the first phase change module, the flow channel, and the second phase change module are stacked sequentially along a first direction, where the first direction is the thickness direction of the heat exchange device.

[0007] In conjunction with the first aspect above, in one possible implementation, the flow channel includes an electromagnetic generation module for generating a magnetic field to produce an electric current as the heat exchange medium passes through the flow channel.

[0008] In conjunction with the first aspect above, in one possible implementation, the electromagnetic generating module includes multiple electromagnetic units, each electromagnetic unit having a through hole along the first direction, the hole wall having magnetic and conductive properties, and the hole walls of the multiple electromagnetic units being electrically connected to each other.

[0009] In conjunction with the first aspect above, in one possible implementation, the through hole is a regular hexagon, and the electromagnetic generating module has a honeycomb structure.

[0010] In conjunction with the first aspect above, in one possible implementation, the hole wall is a metal wall with a sandwich layer, in which a magnet is disposed, and two adjacent hole walls have opposite magnetic poles.

[0011] In conjunction with the first aspect above, in one possible implementation, the overall thickness of the hole wall is 1mm-5mm.

[0012] In conjunction with the first aspect above, in one possible implementation, the wall thickness of the hole is 2mm-4mm.

[0013] In conjunction with the first aspect above, in one possible implementation, the wall thickness of the hole is 3 mm.

[0014] In conjunction with the first aspect above, in one possible implementation, the flow channel further includes a conductive element that electrically connects the electromagnetic generation module to the first phase change module and the second phase change module to conduct the current to power the heat exchange device.

[0015] In conjunction with the first aspect above, in one possible implementation, the heat exchange device further includes an insulating element disposed between the first phase change module and the flow channel, and between the second phase change module and the flow channel, for fixing the flow channel.

[0016] In conjunction with the first aspect above, in one possible implementation, the insulating element provides insulation protection between the flow channel and the first phase change module and the second phase change module.

[0017] In conjunction with the first aspect mentioned above, in one possible implementation, the thickness of the insulating element is 5mm-15mm.

[0018] In conjunction with the first aspect mentioned above, in one possible implementation, the thickness of the insulating element is 10 mm.

[0019] In conjunction with the first aspect above, in one possible implementation, the first phase change module includes a first receiving cavity for receiving the heat exchange medium in the first phase state.

[0020] In conjunction with the first aspect above, in one possible implementation, a first microporous metal layer is disposed in the first receiving cavity, and the first microporous metal layer is placed perpendicular to the first direction.

[0021] In conjunction with the first aspect above, in one possible implementation, the first microporous metal layer has a microporous structure composed of one or more of nanometals, nanometal oxides, metal-organic framework compounds, nanononmetal oxides, nanometal nitrides, and nanoceramics.

[0022] In conjunction with the first aspect above, in one possible implementation, the thickness of the first microporous metal layer is 1 μm-5 mm.

[0023] In conjunction with the first aspect mentioned above, in one possible implementation, the thickness of the first microporous metal layer is 1 mm to 4 mm.

[0024] In conjunction with the first aspect above, in one possible implementation, the thickness of the first microporous metal layer is 3 mm.

[0025] In conjunction with the first aspect above, in one possible implementation, the second phase change module includes a second receiving cavity for receiving the heat exchange medium in the second phase.

[0026] In conjunction with the first aspect described above, in one possible implementation, a second microporous metal layer is disposed in the second receiving cavity, and the second microporous metal layer is placed perpendicular to the first direction.

[0027] In conjunction with the first aspect above, in one possible implementation, the second microporous metal layer has a microporous structure composed of one or more of nanometals, nanometal oxides, metal-organic framework compounds, nanononmetal oxides, nanometal nitrides, and nanoceramics.

[0028] In conjunction with the first aspect above, in one possible implementation, the thickness of the second microporous metal layer is 1 μm-5 mm.

[0029] In conjunction with the first aspect above, in one possible implementation, the thickness of the second microporous metal layer is 1mm-4mm.

[0030] In conjunction with the first aspect above, in one possible implementation, the thickness of the second microporous metal layer is 3 mm.

[0031] In conjunction with the first aspect above, in one possible implementation, the second phase change module further includes a cooling chip adapted to exchange heat with the heat exchange medium located in the second accommodating cavity.

[0032] In conjunction with the first aspect above, in one possible implementation, the material of the cooling chip includes Bi₂Te₃, Sb₂Te₃, Sb₂Se₃, and Bi-Sb (Bi₂Te₃, Sb₂Te₃, Sb₂Se₃, ...₂Sb (Bi� 85 Sb 15 One or more of the following.

[0033] In conjunction with the first aspect above, in one possible implementation, the thickness of the cooling chip is 1mm-10mm.

[0034] In conjunction with the first aspect above, in one possible implementation, the thickness of the cooling chip is 3mm-8mm.

[0035] In conjunction with the first aspect above, in one possible implementation, the thickness of the cooling chip is 5 mm.

[0036] In conjunction with the first aspect above, in one possible implementation, the cooling chip is a frequency conversion semiconductor cooling chip.

[0037] In conjunction with the first aspect above, in one possible implementation, the heat exchange medium is one or more of mercury, gallium, gallium-indium alloy, and gallium-indium-tin alloy.

[0038] A second aspect of the present invention is to provide a thermal management system comprising a heat exchange device as described in the first aspect above.

[0039] In conjunction with the second aspect above, in one possible implementation, the thermal management system further includes sensors and controllers.

[0040] A third aspect of the invention is to provide a vehicle including a heat exchange device as described in the first aspect above, or a thermal management system as described in the second aspect above. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is an overall schematic diagram of a heat exchange device according to a specific example of the present invention; Figure 2 This is a schematic diagram of an electromagnetic generation module of a heat exchange device according to a specific example of the present invention; Figure 3 This is a perspective view of the electromagnetic unit of a heat exchange device according to a specific example of the present invention; Figure 4This is a top view of the electromagnetic unit of a heat exchange device according to a specific example of the present invention; Figure 5 This is a schematic diagram of heat exchange in a heat exchange device according to a specific example of the present invention; Figure 6 This is a schematic diagram of a semiconductor refrigeration chip for a heat exchange device according to a specific example of the present invention.

[0043] The reference numerals in the attached figures are as follows: 100-First phase change module; 200-Second phase change module; 210-Cooling element; 300-Flow channel; 310-Electromagnetic generation module; 311-Electromagnetic unit; 312-Through hole; 313-Hole wall; 314-Metal wall; 315-Magnet; 320-Conductive component; 330-Insulating component; 340-First microporous metal layer; 350-Second microporous metal layer; 400-Heat exchange medium. Detailed Implementation

[0044] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0048] A heat exchange device according to an embodiment of the present invention will now be described. (See reference...) Figure 1 and Figure 5 As shown in the illustration, this application provides a heat exchange device comprising: a first phase change module 100, a second phase change module 200, and a heat exchange medium 400. The heat exchange medium 400 has a magnetic field in its path from one of the first phase change module 100 to the other, and the heat exchange medium 400 is a liquid metal. In the above embodiment, a magnetic field is introduced into the flow path of the liquid metal during the phase change process, and an induced current is generated by cutting magnetic field lines, thereby achieving the dual functions of heat recovery and electrical energy conversion.

[0049] In some embodiments, liquid metal is heated and evaporated at the evaporation end to generate metal vapor. The vapor condenses into droplets at the heat dissipation end through a medium channel, realizing the conversion of thermal energy into gravitational potential energy. As the droplets fall under gravity, they cut magnetic field lines, generating an induced current, thus converting gravitational potential energy into electrical energy. This electrical energy is then used to power the semiconductor cooling chip 210 via the electromagnetic generation module 310, forming a closed-loop cycle. This scheme combines liquid metal phase change with electromagnetic induction to achieve the conversion of thermal energy into gravitational potential energy and then into electrical energy, ultimately utilizing recovered electrical energy for cooling, thus realizing energy recovery and utilization.

[0050] In some embodiments, the heat exchange device further includes a flow channel 300 disposed between the first phase change module 100 and the second phase change module 200. The heat exchange medium 400 flows from one of the first phase change module 100 to the other through the flow channel 300. This design provides a channel for the flow of liquid metal vapor and droplets through the flow channel 300, and simultaneously generates an induced current through the magnetic field of the flow channel 300. This design uses the flow channel 300 as a directional flow channel for liquid metal, ensuring its circulation between the evaporation end and the condensation end, while also providing a structural basis for the application of the magnetic field.

[0051] In some embodiments, the first phase change module 100, the flow channel 300, and the second phase change module 200 are sequentially stacked along a first direction, which is the thickness direction of the heat exchange device. This scheme, by arranging the stacked structure along the thickness direction (such as perpendicular to the vehicle chassis), can reduce the lateral space occupied and adapt to the compact mechanical layout of the vehicle. When the liquid metal flows in the stacked path, gravity can assist it in flowing back from the condensation end to the evaporation end, reducing the dependence on the circulation pump.

[0052] refer to Figure 2As shown, in some embodiments, the flow channel 300 includes an electromagnetic generation module 310, which generates a magnetic field to produce current when the heat exchange medium 400 passes through the flow channel 300. This scheme consists of a permanent magnet array and an electromagnetic coil. The permanent magnets provide the basic magnetic field, and the electromagnetic coil adjusts the magnetic field strength through an external control circuit. When the liquid metal flows in the flow channel 300, its movement cuts magnetic field lines, generating an induced current. This current is transmitted through the conductive element 320 to the cooling element 210 of the second phase change module 200.

[0053] refer to Figure 3 and Figure 4 As shown, in some embodiments, the electromagnetic generation module 310 includes multiple electromagnetic units 311. Each electromagnetic unit 311 has a through-hole 312 along a first direction. The wall 313 of the through-hole 312 is magnetic and conductive, and the walls 313 of the multiple electromagnetic units 311 are electrically connected. This solution uses a modular design, where the through-hole wall of each unit is made of a magnetically conductive material. The walls are electrically connected through conductive adhesive or welding. When liquid metal flows through the through-hole, the magnetism and conductivity of the hole wall work synergistically to enhance the electromagnetic induction efficiency.

[0054] In some embodiments, the through-hole 312 is a regular hexagon, and the electromagnetic generation module 310 has a honeycomb structure. This solution maximizes the number of through-holes per unit area through the honeycomb structure of the regular hexagonal through-holes, increases the contact area between the liquid metal and the electromagnetic unit 311, and the hole walls 313 of the honeycomb structure support each other, enhancing the structural strength of the flow channel 300 while reducing the flow resistance of the liquid metal.

[0055] In some embodiments, the diagonal length of the regular hexagonal through hole 312 is 1mm-10mm.

[0056] Preferably, in some embodiments, the diagonal length of the regular hexagonal through hole 312 is 1mm-5mm.

[0057] Preferably, in some embodiments, the diagonal length of the regular hexagonal through hole 312 is 3mm.

[0058] In some embodiments, the hole wall 313 is a metal wall 314 with a sandwich layer, in which a magnet 315 is disposed, and two adjacent hole walls 313 have opposite magnetic poles. This scheme consists of an outer conductive metal layer and an inner magnet layer through a sandwich structure. The magnet sandwich layer provides a stable magnetic field, the outer metal layer enhances conductivity, and the magnetic poles of adjacent hole walls are arranged alternately (NSNS) to form a magnetic field gradient, which forces the liquid metal to continuously cut magnetic field lines as it flows.

[0059] In some embodiments, the overall thickness of the orifice wall 313 is 1mm-5mm. This scheme determines the orifice wall thickness range through thermodynamic simulation. A thickness of 1mm can meet the minimum magnetic field strength requirement, while a thickness of 5mm provides higher mechanical strength and magnetic field stability. The thickness selection needs to balance the flow resistance of liquid metal and the electromagnetic induction efficiency.

[0060] Preferably, in some embodiments, the wall thickness of the hole wall 313 is 2mm-4mm.

[0061] Preferably, in some embodiments, the wall thickness of the hole wall 313 is 3 mm. Experimental verification shows that a 3 mm thickness exhibits the best overall performance: a 20% reduction in liquid metal flow resistance, while simultaneously increasing electromagnetic induction efficiency by 15%. This thickness is suitable for the thermal management requirements of most new energy vehicles.

[0062] refer to Figure 1 As shown, in some embodiments, the flow channel 300 further includes a conductive element 320, which electrically connects the electromagnetic generation module 310 to the first phase change module 100 and the second phase change module 200 to conduct current to power the heat exchange device. This solution uses a multi-layer composite structure, including an inner conductive copper foil and an outer insulating layer, to ensure efficient current transmission while preventing short circuits. The conductive element 320 is connected to the electromagnetic generation module 310 and the cooling chip 210 by welding or crimping.

[0063] In some embodiments, the heat exchange device further includes an insulating element 330, which is disposed between the first phase change module 100 and the flow channel 300, and between the second phase change module 200 and the flow channel 300, for fixing the flow channel 300. This solution is made of high-temperature resistant ceramic material, which has high dielectric strength and low thermal conductivity, both fixing the position of the flow channel 300 and preventing heat conduction interference. The surface of the insulating element 330 is coated with an anti-corrosion coating to adapt to the chemical environment of liquid metal.

[0064] In some embodiments, the thickness of the insulating element 330 is 5mm-15mm.

[0065] Preferably, in some embodiments, the thickness of the insulating element 330 is 10 mm.

[0066] In some embodiments, the first phase change module 100 includes a first receiving cavity for containing the heat exchange medium 400. This design utilizes a high thermal conductivity material for casting, with the inner wall polished to Ra≤0.8μm to reduce the flow resistance of the liquid metal. The shape of the receiving cavity is designed as a multi-cavity structure according to the heat source distribution, with each cavity independently controlling the heat exchange rate.

[0067] refer to Figure 1As shown, in some embodiments, a first microporous metal layer (340) is disposed in the first receiving cavity, and the first microporous metal layer (340) is placed perpendicular to the first direction. This scheme is formed by stacking and sintering multiple layers of metal mesh, with the porosity controlled at 60%-80%, ensuring rapid penetration of liquid metal while providing sufficient capillary force, and the vertically placed microporous layer enhances the vertical component of the heat conduction path.

[0068] In some embodiments, the first microporous metal layer (340) has a microporous structure composed of one or more of nano-metals, nano-metal oxides, metal-organic framework compounds, nano-non-metal oxides, nano-metal nitrides, and nano-ceramics. This approach balances thermal conductivity and fluidity through a gradient pore size design. For example, nano-metals provide high thermal conductivity, metal-organic framework compounds enhance capillary forces, and the microporous nano-metals have a large specific surface area, significantly increasing the heat transfer area and the evaporation rate of the liquid metal.

[0069] In some embodiments, the thickness of the first microporous metal layer (340) is 1 μm-5 mm.

[0070] Preferably, in some embodiments, the thickness of the first microporous metal layer (340) is 1 mm to 4 mm.

[0071] Preferably, in some embodiments, the thickness of the first microporous metal layer (340) is 3 mm. The thickness range was determined experimentally: a 1 μm layer is suitable for high flow rate scenarios (flow rate > 100 mm / s), while a 5 mm layer provides greater heat capacity (heat capacity > 500 J / K). The thickness selection needs to balance the thermal conductivity rate and the liquid metal residence time (residence time 0.1-1 s), for example, a thicker layer of 3-5 mm is selected under low-temperature conditions to extend the phase change time (phase change time > 0.5 s). A thickness of 3 mm showed the best heat exchange efficiency in the tests: the phase change rate was increased by 25%, while the liquid metal backflow resistance was reduced by 18%. This thickness is suitable for most battery pack thermal management requirements, and the manufacturing cost is lower than that of a 5 mm metal layer.

[0072] In some embodiments, the second phase change module 200 includes a second receiving cavity for containing the heat exchange medium 400. This design utilizes a variable volume structure, adjusting the cavity volume via pressure sensors and actuators to adapt to the liquid metal phase change requirements under different operating conditions. The inner wall of the cavity is coated with a hydrophobic material to reduce thermal resistance.

[0073] refer to Figure 1As shown, in some embodiments, a second microporous metal layer 350 is disposed in the second receiving cavity, and the second microporous metal layer 350 is placed perpendicular to the first direction. This scheme enhances the reflux driving force of liquid metal by having a structure symmetrical with the first microporous metal layer but with a slightly lower porosity. The vertically placed microporous layer works synergistically with the cooling chip 210 to accelerate the release of phase change heat.

[0074] In some embodiments, the second microporous metal layer 350 has a microporous structure composed of one or more of nano-metals, nano-metal oxides, metal-organic framework compounds, nano-non-metal oxides, nano-metal nitrides, and nano-ceramics. This scheme optimizes the pore size distribution through a gradient, with smaller pores near the cooling element 210 and larger pores further away, to balance capillary action and flow resistance. Simultaneously, the microporous nano-metals have a large specific surface area, significantly increasing the heat transfer area and the evaporation rate of the liquid metal.

[0075] In some embodiments, the thickness of the second microporous metal layer 350 is 1 μm-5 mm.

[0076] Preferably, in some embodiments, the thickness of the second microporous metal layer 350 is 1 mm to 4 mm.

[0077] Preferably, in some embodiments, the thickness of the second microporous metal layer 350 is 3 mm. The thickness range was determined experimentally: a 1 μm layer is suitable for high flow rate scenarios (flow rate > 100 mm / s), while a 5 mm layer provides greater heat capacity (heat capacity > 500 J / K). The thickness selection needs to balance the thermal conductivity rate and the liquid metal residence time (residence time 0.1-1 s). For example, a thicker layer of 3-5 mm is selected under low-temperature conditions to extend the phase change time (phase change time > 0.5 s). A 3 mm thickness showed the best heat exchange efficiency in tests: the phase change rate was increased by 25%, while the liquid metal backflow resistance was reduced by 18%. This thickness is suitable for most battery pack thermal management requirements and the manufacturing cost is lower than that of a 5 mm metal layer.

[0078] refer to Figure 1 and Figure 6 As shown, in some embodiments, the second phase change module 200 further includes a cooling chip 210, which is adapted to exchange heat with the heat exchange medium 400 located in the second receiving cavity. This solution is bonded to the inner wall of the second receiving cavity with thermally conductive adhesive, with its cold end in direct contact with the liquid metal and its hot end convection with the outside air through heat dissipation fins. The operating current of the cooling chip 210 is provided by the electromagnetic generation module 310.

[0079] In some embodiments, the material of the cooling element 210 includes one or more of Bi2Te3, Sb2Te3, Sb2Se3, and Bi-SbBi85Sb15. This approach optimizes thermoelectric performance through gradient doping; for example, the ZT value of the Bi85Sb15 alloy is increased by 15% in the 100-200°C range.

[0080] In some embodiments, the cooling chip 210 is a variable frequency semiconductor cooling chip. This scheme utilizes the transition characteristics of electrons in a PN junction to achieve heat absorption at the cold end and heat release at the hot end. The higher the temperature of the heat source at the evaporation end, the more liquid metal vapor and condensed liquid metal are generated, resulting in a greater induced current cutting magnetic field lines, higher power of the variable frequency semiconductor cooling chip, and better cooling effect. The power variation of the variable frequency semiconductor cooling chip enables adaptive adjustment of the cold plate temperature, significantly improving the heat dissipation efficiency of the cold plate.

[0081] In some embodiments, the thickness of the cooling chip 210 is 1mm-10mm.

[0082] Preferably, in some embodiments, the thickness of the cooling chip 210 is 3mm-8mm.

[0083] Preferably, in some embodiments, the thickness of the cooling chip 210 is 5 mm. Experimental verification shows that a 5 mm thickness exhibits the best overall performance: a 20% increase in heat transfer efficiency, while maintaining a response time within 2 seconds. This thickness is suitable for the thermal management needs of most new energy vehicles.

[0084] In some embodiments, the heat exchange medium 400 is one or more of mercury, gallium, gallium-indium alloy, and gallium-indium-tin alloy. This approach selects a specific metal as the heat exchange medium and utilizes its properties of being liquid at room temperature, having high thermal conductivity, and low surface tension. This results in low flow resistance of the heat exchange medium 400 within the microporous metal layer, thereby improving heat exchange efficiency.

[0085] This application also provides a thermal management system, which includes the heat exchange device described above. This thermal management system eliminates the need for an external circulation pump, simplifying the structure and resulting in a smaller size and weight. It is applicable to a wider range of scenarios, and by utilizing the heat exchange device, it achieves energy recovery and utilization, making it more environmentally friendly and energy-efficient.

[0086] In some embodiments, the thermal management system further includes a temperature sensor and a controller, which dynamically adjust the magnetic field strength of the electromagnetic generator module and the power of the cooling chip 210.

[0087] This application also provides a vehicle that includes the heat exchange device or thermal management system described above. This solution, by equipping a self-circulating heat exchange device without external power, allows for more assembly space in the vehicle chassis, facilitating the installation of other system components. Simultaneously, thanks to the energy recovery and utilization principle of the heat exchange device, it saves energy consumption for the entire vehicle, especially reducing the energy consumption of new energy vehicles, thereby increasing driving range.

[0088] In some embodiments, the heat exchange device of the vehicle is integrated into the bottom of the battery pack, and the space occupied is reduced by conformal design with the chassis structure through the flow channel 300.

[0089] Although one or more specific embodiments of this disclosure have been shown and described, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the claims. In particular, with respect to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if structurally not equivalent to the disclosed structure. Furthermore, although specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous for any given or particular application. Moreover, with regard to the terms “comprising,” “owning,” “having,” “having,” or variations thereof as used in the specific embodiments or claims, such terms are intended to be inclusive in a manner similar to the term “including.”

[0090] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

[0091] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat exchange device, characterized in that, include: The system comprises a first phase change module (100), a second phase change module (200), and a heat exchange medium (400), wherein the heat exchange medium (400) has a magnetic field in the path from one of the first phase change module (100) or the second phase change module (200) to the other, and the heat exchange medium (400) is a liquid metal.

2. The heat exchange device according to claim 1, characterized in that, It also includes a flow channel (300) disposed between the first phase change module (100) and the second phase change module (200), through which the heat exchange medium (400) flows from one of the first phase change module (100) or the second phase change module (200) to the other.

3. The heat exchange device according to claim 2, characterized in that, The first phase change module (100), the flow channel (300) and the second phase change module (200) are stacked sequentially along the first direction.

4. The heat exchange device according to claim 3, characterized in that, The flow channel (300) includes an electromagnetic generation module (310) for generating a magnetic field to generate current as the heat exchange medium (400) passes through the flow channel (300).

5. The heat exchange device according to claim 4, characterized in that, The electromagnetic generating module (310) includes multiple electromagnetic units (311), each electromagnetic unit (311) having a through hole (312) along the first direction. The hole wall (313) of the through hole (312) has magnetic and conductive properties, and the hole walls (313) of the multiple electromagnetic units (311) are electrically connected to each other.

6. The heat exchange device according to claim 5, characterized in that, The through hole (312) is a regular hexagon, and the electromagnetic generation module (310) has a honeycomb structure.

7. The heat exchange device according to claim 5, characterized in that, The hole wall (313) is a metal wall (314) with a sandwich layer, in which a magnet (315) is provided, and two adjacent hole walls (313) have opposite magnetic poles.

8. The heat exchange device according to claim 7, characterized in that, The overall thickness of the hole wall (313) is 1mm-5mm.

9. The heat exchange device according to claim 4, characterized in that, The flow channel (300) also includes a conductive element (320) that electrically connects the electromagnetic generation module (310) to the first phase change module (100) and the second phase change module (200).

10. The heat exchange device according to claim 4, characterized in that, The heat exchange device further includes an insulating component (330), which is disposed between the first phase change module (100) and the flow channel (300), and between the second phase change module (200) and the flow channel (300), for fixing the flow channel (300).

11. The heat exchange device according to claim 1, characterized in that, The first phase change module (100) includes a first receiving cavity for receiving the heat exchange medium (400) in the first phase state.

12. The heat exchange device according to claim 11, characterized in that, The first accommodating cavity is provided with a first microporous metal layer (340), which is placed perpendicular to the first direction.

13. The heat exchange device according to claim 12, characterized in that, The first microporous metal layer (340) has a microporous structure composed of one or more of nano-metals, nano-metal oxides, metal-organic framework compounds, nano-non-metal oxides, nano-metal nitrides, and nano-ceramics.

14. The heat exchange device according to claim 13, characterized in that, The thickness of the first microporous metal layer (340) is 1μm-5mm.

15. The heat exchange device according to claim 1, characterized in that, The second phase change module (200) includes a second receiving cavity for receiving the heat exchange medium (400) in the second phase state.

16. The heat exchange device according to claim 15, characterized in that, The second cavity is provided with a second microporous metal layer (350), which is placed perpendicular to the first direction.

17. The heat exchange device according to claim 16, characterized in that, The second microporous metal layer (350) has a microporous structure composed of one or more of nano-metals, nano-metal oxides, metal-organic framework compounds, nano-non-metal oxides, nano-metal nitrides, and nano-ceramics.

18. The heat exchange device according to claim 17, characterized in that, The thickness of the second microporous metal layer (350) is 1μm-5mm, preferably 1mm-4mm, and optimally 3mm.

19. The heat exchange device according to claim 1, characterized in that, The second phase change module (200) further includes a cooling chip (210) adapted to exchange heat with the heat exchange medium (400) located in the second accommodating cavity.

20. The heat exchange device according to claim 19, characterized in that, The material of the cooling chip (210) includes one or more of Bi2Te3, Sb2Te3, Sb2Se3, and Bi-Sb.

21. The heat exchange device according to claim 20, characterized in that, The thickness of the cooling chip (210) is 1mm-10mm.

22. The heat exchange device according to claim 1, characterized in that, The heat exchange medium (400) is one or more of mercury, gallium, gallium-indium alloy, and gallium-indium-tin alloy.

23. A thermal management system, characterized in that, Includes the heat exchange device as described in any one of claims 1-22.

24. A vehicle, characterized in that, It includes the heat exchange device as described in any one of claims 1-22, or the thermal management system as described in claim 23.

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