Single-phase immersion liquid cooling system, control method, control equipment and storage medium

Abstract

The invention relates to a single-phase immersion liquid cooling system, a control method, control equipment and a storage medium, and relates to the technical field of liquid cooling heat dissipation. The system comprises a liquid cooling case, a first cooling loop and a second cooling loop, the first cooling loop comprises a current limiter; the current limiter is used for dividing an area in the liquid cooling case into a first cooling area and a second cooling area which are isolated from each other; the first cooling liquid area comprises cooling liquid entering the current limiter through the first cooling loop, and the second cooling area comprises cooling liquid entering the liquid cooling case through the second cooling loop; a heat dissipation demand difference exists between the first cooling area and the second cooling area; the first cooling loop and the second cooling loop are different in cooling liquid inlet and outlet in the liquid cooling case, and a flow velocity difference exists between the flow velocity of cooling liquid in the first cooling loop and the flow velocity of cooling liquid in the second cooling loop. By means of the system, the heat dissipation requirements of the corresponding cooling areas can be met through the cooling loops, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to a single-phase immersion liquid cooling system, control method, control device and storage medium. Background Technology

[0002] In today's digital age, a large amount of production and daily life rely on computing power. With the increasing demand for computing power, chip power consumption and heat flux density are also constantly increasing. To ensure the normal operation of equipment, heat dissipation is necessary, including single-phase immersion liquid cooling.

[0003] Single-phase immersion liquid cooling uses liquid as the heat transfer medium, carrying away heat through the flow of the cooling medium. Typically, a single-phase immersion liquid cooling system consists of several parts, including the cooling medium, the immersion tank, the liquid-cooled heat exchange unit, and the outdoor cooling equipment. Figure 1 A schematic diagram of a conventional single-phase immersion liquid cooling system is shown, such as... Figure 1 As shown, the tank cavity is filled with coolant, usually with a bottom-in, top-out layout. The large amount of heat generated by the electronic equipment in the tank cavity during operation is absorbed by the cooling medium, causing the temperature of the cooling medium to rise. Then, the high-temperature cooling medium flows upward and is collected and sent to the CDU (Coolant Distribution Unit) for heat exchange to dissipate the heat, so that the cooling medium returns to a low temperature and is injected into the immersion cavity again, so that the electronic equipment can operate stably.

[0004] However, while the above structural design achieves effective heat exchange for electronic devices to a certain extent, it cannot meet the heat dissipation requirements of high heat flux density electronic devices due to the large differences in power consumption of different components. This can easily lead to overheating of some high-power devices, causing the entire system to be unable to operate stably. Alternatively, increasing the circulation rate of the cooling medium can improve heat exchange efficiency, but this results in an increase in pump power due to the increased circulation rate of the cooling medium, leading to a waste of resources. Summary of the Invention

[0005] This application provides a single-phase immersion liquid cooling system, control method, control device, and storage medium, which can achieve independent cooling of areas with different heat dissipation requirements. This reduces the impact of slow heat transfer caused by factors such as different power consumption of electronic devices and immersion flow rate, while avoiding unnecessary resource waste. The technical solution is as follows:

[0006] On the one hand, a single-phase immersion liquid cooling system is provided, the system including a liquid cooling chassis, a first cooling circuit and a second cooling circuit;

[0007] The first cooling circuit includes a current limiter; the current limiter is used to divide the area inside the liquid cooling chassis into a first cooling area and a second cooling area that are isolated from each other; the first cooling area includes coolant that enters the current limiter through the first cooling circuit, and the second cooling area includes coolant that enters the liquid cooling chassis through the second cooling circuit; there is a difference in heat dissipation requirements between the first cooling area and the second cooling area;

[0008] The coolant inlet and outlet of the first cooling circuit on the liquid cooling chassis are different from those of the second cooling circuit on the liquid cooling chassis, and there is a flow rate difference between the coolant flow rate in the first cooling circuit and the coolant flow rate in the second cooling circuit.

[0009] In one possible implementation, when the coolant flow rate in the first cooling circuit is higher than the coolant flow rate in the second cooling circuit, the first coolant region corresponds to the region of a high-power electronic device; the second cooling region corresponds to the region of a low-power electronic device; and the heat dissipation of the high-power electronic device per unit time is higher than that of the low-power electronic device per unit time.

[0010] In one possible implementation, the system further includes a cooling distribution unit (CDU) and cooling equipment; the CDU includes a heat exchanger and a coolant circulation pump.

[0011] The heat exchanger is used to receive coolant flowing out of the liquid cooling box through the first cooling circuit and the second cooling circuit, and to transfer the heat absorbed by the coolant to the cooling device so that the cooling device can release the heat into the environment.

[0012] The coolant circulation pump is used to pump the coolant cooled by the heat exchanger into the cooling circuit; the cooling circuit includes the first cooling circuit and the second cooling circuit.

[0013] In one possible implementation, the CDU also includes a vacuum pump and at least two vacuum chambers;

[0014] The vacuum pump is used to evacuate the at least two vacuum chambers and maintain the vacuum environment in each vacuum chamber.

[0015] The at least two vacuum chambers are respectively connected to the first cooling circuit, and the at least two vacuum chambers are used to control the flow rate of the coolant in the first cooling circuit in turn by utilizing the pressure difference formed by the vacuum pump and the coolant circulation pump.

[0016] In one possible implementation, each vacuum chamber is equipped with a corresponding inflow control valve and an outflow control valve;

[0017] The inflow control valve is used to control the flow rate of coolant flowing into the vacuum chamber;

[0018] The outflow control valve is a three-way valve used to control the connection and disconnection between the vacuum chamber and the vacuum pump, as well as the connection and disconnection between the vacuum chamber and the heat exchanger.

[0019] In one possible implementation, each vacuum chamber is also equipped with a corresponding pressure relief valve;

[0020] If the CDU includes two vacuum chambers, when the coolant flow rate in the first cooling circuit is controlled by the first vacuum chamber, the first inflow control valve of the first vacuum chamber is in the open state, the first pressure relief valve of the first vacuum chamber is in the closed state, the first outflow control valve of the first vacuum chamber is connected to the vacuum pump, the second inflow control valve of the second vacuum chamber is in the closed state, the second pressure relief valve of the second vacuum chamber is in the open state, and the second outflow control valve of the second vacuum chamber is connected to the heat exchanger;

[0021] When the coolant flow rate in the first cooling circuit is controlled by the second vacuum chamber, the first inflow control valve is closed, the first pressure relief valve is open, the first outflow control valve is connected to the heat exchanger, the second inflow control valve is open, the second pressure relief valve is closed, and the second outflow control valve is connected to the vacuum pump.

[0022] In one possible implementation, the first cooling circuit and the second cooling circuit share a common conduit; one end of the common conduit is connected to the coolant circulation pump.

[0023] The coolant in the common pipeline enters the first cooling circuit through the inflow control valve of the first cooling circuit, flows through the first cooling area and the vacuum chamber, and then enters the heat exchanger.

[0024] The coolant in the common pipeline enters the second cooling circuit through the inflow control valve of the second cooling circuit, flows through the second cooling area, and then enters the heat exchanger.

[0025] In one possible implementation, the liquid cooling chassis and each vacuum chamber are respectively equipped with a corresponding liquid level sensor; the liquid level sensor is used to monitor the liquid level height in the corresponding space.

[0026] In one possible implementation, each vacuum chamber is equipped with a corresponding pressure sensor; the pressure sensor is used to monitor the vacuum level within the corresponding vacuum chamber.

[0027] In one possible implementation, a first temperature sensor is provided on the common pipeline, and a second temperature sensor is provided on the pipeline on the side of the first cooling circuit that flows out of the first cooling area. Each temperature sensor is used to monitor the temperature of the coolant flowing through the corresponding pipeline.

[0028] In one possible implementation, the current limiter further includes a turbulence radiator; the turbulence radiator is disposed in a current-limiting region within the first cooling region to enhance the fluid turbulence of the coolant flowing over the surface of the high-power electronic device; the current-limiting region is a region defined by the high-power electronic device.

[0029] In one possible implementation, the current limiter further includes a current limiter flow equalization plate; the current limiter flow equalization plate is disposed on the coolant inlet side of the first cooling region to ensure that the coolant entering the first cooling region is evenly distributed across the surface of the high-power electronic device.

[0030] In one possible implementation, the number of current limiters on the first cooling circuit is the same as the number of high-power electronic devices; when there are multiple high-power electronic devices, each high-power electronic device has a corresponding first cooling area.

[0031] On the other hand, a control method for a single-phase immersion liquid cooling system is provided, the method being executed by a control device for the single-phase immersion liquid cooling system, the method comprising:

[0032] Monitor the coolant level in the liquid-cooled enclosure;

[0033] When the coolant level in the liquid cooling chamber meets the liquid level adjustment conditions, a first control signal is sent to the single-phase immersion liquid cooling system. The first control signal is used to indicate the working power of the variable frequency coolant circulation pump and / or adjust the opening of the inflow control valve of the second cooling circuit to adjust the coolant flow rate of the second cooling circuit.

[0034] On the other hand, a control device for a single-phase immersion liquid cooling system is provided. The control device includes a processor and a memory. The memory stores at least one computer program, which is loaded and executed by the processor to implement the control method for the single-phase immersion liquid cooling system described above.

[0035] On the other hand, a computer-readable storage medium is provided, wherein at least one computer program is stored in the computer-readable storage medium, the computer program being loaded and executed by a processor to implement the control method of the single-phase immersion liquid cooling system described above.

[0036] On the other hand, a computer program product is provided, the computer program product including a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions, which, when executed by a computer, cause the computer to execute to implement the control method of the single-phase immersion liquid cooling system provided in the various optional implementations described above.

[0037] The single-phase immersion liquid cooling system provided in this embodiment includes a liquid cooling chassis, a first cooling circuit, and a second cooling circuit. A flow limiter on the first cooling circuit divides the area inside the liquid cooling chassis into isolated cooling zones corresponding to different heat dissipation requirements. Different cooling circuits have different coolant inlets and outlets on the liquid cooling chassis. By independently controlling the coolant flow rate in the first and second cooling circuits, the system adapts to the heat dissipation requirements of the corresponding cooling zones of each cooling circuit. This reduces the impact of slow heat transfer caused by factors such as different power consumption of various electronic devices and immersion flow rate, ensuring the heat dissipation effect for various electronic devices.

[0038] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0039] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0040] Figure 1 A schematic diagram of a conventional single-phase immersion liquid cooling system is shown.

[0041] Figure 2 A schematic diagram of a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown;

[0042] Figure 3 A schematic diagram of a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown;

[0043] Figure 4 A schematic diagram of a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown;

[0044] Figure 5 A schematic diagram of the piping configuration is shown when the flow rate of the coolant in the first cooling circuit is controlled by the first vacuum chamber.

[0045] Figure 6 A schematic diagram of the piping configuration is shown when the flow rate of the coolant in the first cooling circuit is controlled by the first vacuum chamber.

[0046] Figure 7A schematic diagram of a first cooling circuit provided in an exemplary embodiment of this application is shown;

[0047] Figure 8 A schematic diagram of a second cooling circuit provided in an exemplary embodiment of this application is shown;

[0048] Figure 9 A schematic diagram of the device configuration in the first cooling region is shown;

[0049] Figure 10 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown.

[0050] Figure 11 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in another exemplary embodiment of this application is shown;

[0051] Figure 12 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in another exemplary embodiment of this application is shown;

[0052] Figure 13 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in another exemplary embodiment of this application is shown;

[0053] Figure 14 A flowchart of a control method for a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown;

[0054] Figure 15 A structural block diagram of a computer device illustrated in an exemplary embodiment of this application is shown;

[0055] Figure 16 A structural block diagram of a computer device illustrated in an exemplary embodiment of this application is shown. Detailed Implementation

[0056] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0057] This application provides a single-phase immersion liquid cooling system that can independently cool areas with different heat dissipation requirements, reducing the impact of slow heat transfer caused by factors such as different power consumption of electronic devices and immersion flow rate, and improving heat dissipation effect. Figure 2A schematic diagram of a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown, as follows: Figure 2 As shown, the system includes a liquid-cooled chassis 1, a first cooling circuit, and a second cooling circuit;

[0058] The first cooling circuit includes a flow limiter 2; the flow limiter 2 is used to divide the area inside the liquid cooling chassis 1 into a first cooling area and a second cooling area that are isolated from each other; the first cooling area includes coolant that enters the flow limiter through the first cooling circuit, and the second cooling area includes coolant that enters the liquid cooling chassis through the second cooling circuit; there is a difference in heat dissipation requirements between the first cooling area and the second cooling area.

[0059] The coolant inlet and outlet of the first cooling circuit on the liquid-cooled housing 1 are different from those of the second cooling circuit on the liquid-cooled housing 1. There is a flow rate difference between the coolant flow rate in the first cooling circuit and the coolant flow rate in the second cooling circuit.

[0060] In this system, the coolant in each circuit is a single-phase coolant, which is a cooling medium that maintains a single physical state (usually liquid) in the system. The selection of single-phase coolant is based on its specific thermophysical properties, such as high specific heat capacity, good thermal conductivity, low viscosity, chemical stability, non-toxicity and environmental friendliness, to ensure efficient heat transfer and maintain long-term stable operation of the system. Schematic, the single-phase coolant can be deionized water, ethylene glycol aqueous solution, propylene glycol aqueous solution, silicone oil, fluorinated liquid, etc. The type of single-phase coolant can be determined based on application requirements, and this application does not impose any restrictions on it.

[0061] A single-phase immersion liquid cooling system drives the coolant to flow in a closed loop, passing through various areas of electronic equipment that require heat dissipation, absorbing heat, and then releasing the heat to the external environment.

[0062] The flow limiter configured on the first cooling circuit in this embodiment not only physically separates the internal space of the liquid-cooled chassis, forming independent first and second cooling zones, but also, in conjunction with the dual-loop flow channel configuration, ensures effective cooling of these two zones according to their respective heat dissipation requirements by regulating the flow rate / velocity of the coolant in different cooling circuits. The dual-loop flow channel configuration means that the coolant entering the chassis is divided into multiple parts corresponding to different cooling zones. Different cooling circuits have different coolant inlets and outlets on the liquid-cooled chassis to ensure independent operation of each cooling circuit. This allows for the separate management of coolant circulation in each zone and control of the coolant flow rate within each circuit, thereby meeting the different heat dissipation requirements of each cooling zone.

[0063] The heat dissipation power of each cooling zone is positively correlated with the coolant flow rate in the corresponding cooling circuit. That is, the higher the heat dissipation demand of a cooling zone, the faster the coolant flow rate and the greater the coolant volume in the corresponding cooling circuit. For example, if the heat dissipation demand of the electronic equipment corresponding to the first cooling zone is higher than that of the electronic equipment corresponding to the second cooling zone, then the coolant flow rate in the first cooling circuit will be higher than that in the second cooling circuit; conversely, if the heat dissipation demand of the electronic equipment corresponding to the first cooling zone is lower than that of the electronic equipment corresponding to the second cooling zone, then the coolant flow rate in the first cooling circuit will be lower than that in the second cooling circuit. The electronic equipment corresponding to each cooling zone can be configured based on actual needs.

[0064] In summary, the single-phase immersion liquid cooling system provided in this application embodiment includes a liquid cooling chassis, a first cooling circuit, and a second cooling circuit. A flow limiter on the first cooling circuit divides the area within the liquid cooling chassis into isolated cooling zones corresponding to different heat dissipation requirements. Different cooling circuits have different coolant inlets and outlets on the liquid cooling chassis. By independently controlling the coolant flow rates in the first and second cooling circuits, the system adapts to the heat dissipation requirements of each corresponding cooling zone, thereby reducing the impact of slow heat transfer caused by varying power consumption of electronic devices and immersion flow rates, and ensuring effective heat dissipation for various electronic devices.

[0065] In one possible implementation, the first and second cooling circuits can each correspond to a coolant circulation pump with different operating power, resulting in different coolant flow rates in the first and second cooling circuits. Alternatively, to reduce system construction costs and improve system practicality, the first and second cooling circuits can correspond to the same coolant circulation pump. By adding a device to generate negative pressure in one of the cooling circuits, the coolant flow rate of that circuit is increased, thus creating a difference in coolant flow rates between the first and second cooling circuits. In this embodiment, the first and second cooling circuits corresponding to the same coolant circulation pump are used as an example for illustration. Figure 3 A schematic diagram of a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown, as follows: Figure 3 As shown, the system includes a liquid-cooled chassis 1, a first cooling circuit, and a second cooling circuit;

[0066] The first cooling circuit includes a flow limiter 2; the flow limiter 2 is used to divide the area inside the liquid cooling chassis 1 into a first cooling area and a second cooling area that are isolated from each other; the first cooling area includes coolant that enters the flow limiter through the first cooling circuit, and the second cooling area includes coolant that enters the liquid cooling chassis 1 through the second cooling circuit; there is a difference in heat dissipation requirements between the first cooling area and the second cooling area.

[0067] The coolant inlet and outlet of the first cooling circuit on the liquid-cooled housing 1 are different from those of the second cooling circuit on the liquid-cooled housing 1. There is a flow rate difference between the coolant flow rate in the first cooling circuit and the coolant flow rate in the second cooling circuit.

[0068] In one possible implementation, such as Figure 3 As shown, the coolant inlet and outlet of the first cooling circuit on the liquid cooling housing 1 is top-in, bottom-out, while the coolant inlet and outlet of the second cooling circuit on the liquid cooling housing 1 is bottom-in, top-out. Figure 3 As shown, coolant outlet 18 is the outlet of the first cooling circuit corresponding to the liquid-cooled chassis 1, and coolant outlet 19 is the outlet of the second cooling circuit corresponding to the liquid-cooled chassis 1; or, in another possible implementation, the coolant inlets and outlets of both the first and second cooling circuits on the liquid-cooled chassis 1 are bottom-in, top-out. Figure 4 A schematic diagram of a single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown, as follows: Figure 4 As shown, outlet 18 is the outlet corresponding to the first cooling circuit, and outlet 19 is the outlet corresponding to the second cooling circuit; or, the inlet and outlet of the coolant in the first cooling circuit and the second cooling circuit on the liquid cooling housing 1 are both top inlet and bottom outlet; or, the inlet and outlet of the coolant in the first cooling circuit on the liquid cooling housing 1 are bottom inlet and top outlet, and the inlet and outlet of the coolant in the second cooling circuit on the liquid cooling housing 1 are top inlet and bottom outlet; the inlet and outlet of the coolant in each cooling circuit on the liquid cooling housing can be set according to actual needs, and this application does not impose any restrictions on this.

[0069] The system also includes a cooling distribution unit (CDU) and a cooling device 15; the CDU includes a heat exchanger 13 and a coolant circulation pump 14.

[0070] The heat exchanger 13 is used to receive the coolant flowing out of the liquid cooling box 1 through the first cooling circuit and the second cooling circuit, and transfer the heat absorbed by the coolant to the cooling device 15 for cooling, so that the cooling device 15 can release the heat into the environment.

[0071] The coolant circulation pump 14 is used to pump the coolant cooled by the heat exchanger 13 into the cooling circuit; the cooling circuit includes a first cooling circuit and a second cooling circuit.

[0072] In other words, the heat exchanger 13 is used to collect the high-temperature coolant after absorbing heat, and after absorbing heat based on the heat transfer mechanism, transfer the heat to the cooling device 15. The cooling device 15 can be an external cooling device, used to discharge heat into the environment using the circulating cooling medium in the cooling device 15. On the other hand, the coolant cooled by the heat exchanger 13 is pumped back into the first cooling circuit and the second cooling circuit by the coolant circulation pump 14, so as to deliver it back to the liquid cooling box 1, thereby completing the coolant circulation between the first cooling circuit and the second cooling circuit. The cooling device 15 can be reasonably selected according to the differences in system scale, construction area, etc. For example, in places with abundant water resources, open cooling towers and closed cooling towers can be used; in places with scarce water resources, dry coolers can be used; in places with high requirements for the cleanliness of the circulating refrigerant, air-cooled or water-cooled chilled water systems can be used. This application does not restrict the type of cooling device.

[0073] When the coolant flow rate in the first cooling circuit is higher than that in the second cooling circuit, the first cooling zone corresponds to the high-power electronic device; the second cooling zone corresponds to the low-power electronic device; and the heat dissipation of the high-power electronic device per unit time is higher than that of the low-power electronic device per unit time. For example... Figure 3 As shown, the first cooling area corresponding to the first cooling circuit contains a high-power electronic device 3. This high-power electronic device can be a high-power heat dissipation chip such as a CPU or GPU, or other electronic devices with high-power heat dissipation requirements. The second cooling area corresponding to the second cooling circuit contains a low-power electronic device 20. This low-power electronic device can be a power supply, hard drive, or other devices. It should be noted that the type of electronic device can be classified based on the relationship between heat dissipation per unit time and a heat dissipation threshold. Electronic devices with heat dissipation per unit time exceeding the heat dissipation threshold are considered high-power electronic devices, while those with heat dissipation per unit time below the heat dissipation threshold are considered low-power electronic devices. This heat dissipation threshold can be set based on the heat dissipation requirements in actual applications, and this application does not impose any restrictions on it. Furthermore... Figure 3 The areas of the first and second cooling zones shown are merely illustrative, and this application does not limit the area range of each zone.

[0074] Taking a high-power electronic device corresponding to the first cooling zone as an example, in the single-phase immersion liquid cooling system provided in this application embodiment, the flow rate of the coolant in the first cooling circuit can be controlled by configuring a vacuum pump and a vacuum chamber. In order to ensure the timeliness of the coolant flow rate control, the CDU of the system includes a vacuum pump and at least two vacuum chambers, so that the flow rate of the coolant in the first cooling circuit can be controlled by at least two vacuum chambers in turn.

[0075] The vacuum pump is used to evacuate at least two vacuum chambers and maintain the vacuum environment in each vacuum chamber.

[0076] At least two vacuum chambers are respectively connected to the first cooling circuit, and the at least two vacuum chambers are used to control the flow rate of coolant in the first cooling circuit in turn by utilizing the pressure difference formed by the vacuum pump and the coolant circulation pump.

[0077] Each vacuum chamber is equipped with a corresponding inflow control valve and an outflow control valve;

[0078] The inflow control valve is used to control the flow rate of coolant into the vacuum chamber;

[0079] The outflow control valve is a three-way valve used to control the connection and disconnection between the vacuum chamber and the vacuum pump, as well as the connection and disconnection between the vacuum chamber and the heat exchanger.

[0080] The inflow control valve is a two-way valve; it can be a solenoid valve. Furthermore, to adapt to system operation and ensure system stability, the inflow control valve can have good compatibility with coolant and fast, stable, and reliable start-stop. For the outflow control valve, it needs to have good sealing performance while maintaining stable and efficient switching.

[0081] Each vacuum chamber is also equipped with a corresponding pressure relief valve. This pressure relief valve needs to meet the requirements of rapid on / off switching and sealing.

[0082] In one possible implementation, the system can be configured with a number of vacuum pumps equal to the number of vacuum chambers, so that each vacuum pump evacuates the corresponding vacuum chamber. In another possible implementation, in order to reduce the system construction cost and improve the system's practicality, the number of vacuum pumps configured in the system is less than the number of vacuum chambers, and each vacuum pump is used to evacuate several vacuum chambers. For example, one vacuum pump and two vacuum chambers can be configured, with the vacuum pump used to evacuate two vacuum chambers; or, two vacuum pumps and three vacuum chambers can be configured, with one vacuum pump evacuating two vacuum chambers and the other vacuum pump evacuating the other vacuum chamber.

[0083] Taking a CDU with one vacuum pump 12 and two vacuum chambers as an example, such as Figure 3As shown, vacuum chamber 8 has a corresponding inflow control valve 7, an outflow control valve 10, and a pressure relief valve 31. Vacuum chamber 9 has a corresponding inflow control valve 6, an outflow control valve 11, and a pressure relief valve 32. When the corresponding outflow control valves are open, vacuum pump 12 is activated in both vacuum chambers to evacuate the vacuum chambers, reducing the pressure inside. Through the coordinated cooperation between the vacuum pump and the cooling circulation pump, a pressure difference is established in the first cooling circuit, thereby accelerating the flow rate of the coolant in the first cooling circuit. The vacuum pump can be a variable frequency vacuum pump, and the cooling circulation pump can be a variable frequency cooling circulation pump, thus enabling dynamic control of the coolant flow rate through dynamic adjustment of the operating power.

[0084] To illustrate, taking a CDU with one vacuum pump 12 and two vacuum chambers as an example, when each vacuum chamber controls the flow rate of the coolant in the first cooling circuit, the valve status and valve connection status of each vacuum chamber are as follows:

[0085] When the flow rate of the coolant in the first cooling circuit is controlled by the first vacuum chamber, the first inflow control valve of the first vacuum chamber is in the open state, the first pressure relief valve of the first vacuum chamber is in the closed state, the first outflow control valve of the first vacuum chamber is connected to the vacuum pump, the second inflow control valve of the second vacuum chamber is in the closed state, the second pressure relief valve of the second vacuum chamber is in the open state, and the second outflow control valve of the second vacuum chamber is connected to the heat exchanger.

[0086] When the coolant flow rate in the first cooling circuit is controlled by the second vacuum chamber, the first inflow control valve is closed, the first pressure relief valve is open, the first outflow control valve is connected to the heat exchanger, the second inflow control valve is open, the second pressure relief valve is closed, and the second outflow control valve is connected to the vacuum pump.

[0087] Table 1 shows the operating status of each component in the CDU when the coolant flow rate in the first cooling circuit is controlled by the first vacuum chamber 9. As shown in Table 1, the inflow control valve 6 of the first vacuum chamber 9 is in the open state, the pressure relief valve 32 is in the closed state, and the outflow control valve 11 is connected to the vacuum pump 12. The inflow control valve 7 of the second vacuum chamber 8 is in the closed state, the pressure relief valve 31 is in the open state, and the outflow control valve 10 is connected to the heat exchanger 13. Both the vacuum pump 12 and the coolant circulation pump 14 are in the working state. At this time, the first vacuum chamber 9 is in the state of coolant injection, and the second vacuum chamber 8 is in the state of coolant venting.

[0088] Table 1

[0089]

[0090]

[0091] Figure 5 A schematic diagram of the piping configuration is shown, where the coolant flow rate in the first cooling circuit is controlled via the first vacuum chamber 9. Figure 5 As shown in Table 1, the first vacuum chamber 9 is connected to the vacuum pump 12 for evacuation, and the second vacuum chamber 8 is connected to the heat exchanger 13 for coolant drainage.

[0092] Table 2 shows the operating status of each component in the CDU when the coolant flow rate in the first cooling circuit is controlled by the second vacuum chamber 8. As shown in Table 2, the inflow control valve 6 of the first vacuum chamber 9 is in the closed state, the pressure relief valve 32 is in the open state, and the outflow control valve 11 is connected to the heat exchanger 13. The inflow control valve 7 of the second vacuum chamber 8 is in the open state, the pressure relief valve 31 is in the closed state, and the outflow control valve 10 is connected to the vacuum pump 12. Both the vacuum pump 12 and the coolant circulation pump 14 are in the working state. At this time, the vacuum chamber 9 is in the state of coolant venting, and the vacuum chamber 8 is in the state of coolant injection.

[0093] Table 2

[0094]

[0095] Figure 6 A schematic diagram of the piping configuration is shown, where the coolant flow rate in the first cooling circuit is controlled via the first vacuum chamber 8. Figure 6 As shown in Table 2, the first vacuum chamber 9 is connected to the heat exchanger 13 to drain the coolant, and the second vacuum chamber 8 is connected to the vacuum pump 12 to perform vacuuming.

[0096] In one possible implementation, the coolant circulation pump 14 can pump coolant into the first cooling circuit and the second cooling circuit through different interfaces, with the piping of the two cooling circuits being independent of each other.

[0097] In another possible implementation, such as Figure 3 or Figure 4 As shown, the first cooling circuit and the second cooling circuit share a common pipe 17; the coolant in this common pipe 17 is cooled by the heat exchanger and then pumped back into the low-temperature coolant of the liquid-cooled casing 1 by the coolant circulation pump 14; one end of the common pipe 17 is connected to the coolant circulation pump 14. In this case, Figure 7 A schematic diagram of a first cooling circuit provided in an exemplary embodiment of this application is shown, as follows: Figure 7As shown, after the coolant circulation pump 14 pumps the cooled coolant into the common pipeline 17, the coolant in the common pipeline 17 enters the first cooling circuit through the inflow control valve 4 of the first cooling circuit, flows through the first cooling area and the vacuum chamber, and then enters the heat exchanger 13. Figure 8 A schematic diagram of a second cooling circuit provided in an exemplary embodiment of this application is shown, as follows: Figure 8 As shown, the coolant in the common pipeline 17 enters the second cooling circuit through the inflow control valve 5 of the second cooling circuit, flows through the second cooling area, and then enters the heat exchanger 13.

[0098] To minimize the flow resistance of the system's coolant piping, the system's connectors and piping can be made of non-metallic materials such as random copolymer polypropylene (PPR), polyvinylidene fluoride (PVDF), and fluoroethylene propylene (FEP).

[0099] In the system shown in the embodiments of this application, sensors can be configured in each component to monitor the working status of each component in the system, thereby facilitating the control of each component in the system.

[0100] In one possible implementation, the liquid cooling chassis and each vacuum chamber of the single-phase immersion liquid cooling system provided in this application embodiment are respectively equipped with corresponding liquid level sensors. The liquid level sensors are used to monitor the liquid level height in the corresponding space, so as to control the working state of the corresponding vacuum chamber and the flow rate of the coolant in the second cooling circuit by monitoring the liquid level height. For example, when the liquid level height in the vacuum chamber exceeds the corresponding maximum threshold, it indicates that the coolant needs to be drained. When the liquid level height in the vacuum chamber is lower than the corresponding minimum threshold, it indicates that the coolant in the vacuum chamber has been basically drained and a vacuuming operation can be performed. When the liquid level height in the liquid cooling chassis exceeds the corresponding maximum threshold, it indicates that there is too much coolant in the liquid cooling chassis, and the amount of coolant drained needs to be increased to reduce the amount of coolant in the liquid cooling chassis. When the liquid level height in the liquid cooling chassis is lower than the corresponding standard threshold, it indicates that there is too little coolant in the liquid cooling chassis, which may affect the heat dissipation effect of the second cooling area, and the amount of coolant injected needs to be increased to increase the amount of coolant in the liquid cooling chassis. The above thresholds can be set based on actual application requirements, and this application does not limit them.

[0101] Optionally, to ensure the accuracy of liquid level monitoring within the vacuum chamber, different liquid level sensors can be configured at different heights within the vacuum chamber. For example, illustratively, two liquid level sensors can be configured in each vacuum chamber. Figure 3As shown, a liquid level sensor 27 and a liquid level sensor 36 are configured in the vacuum chamber 9. The liquid level sensor 27 is used to monitor the high liquid level of the coolant in the vacuum chamber 9, and the liquid level sensor 36 is used to monitor the low liquid level of the coolant in the vacuum chamber 9. A liquid level sensor 26 and a liquid level sensor 37 are configured in the vacuum chamber 8. The liquid level sensor 26 is used to monitor the high liquid level of the coolant in the vacuum chamber 8, and the liquid level sensor 37 is used to monitor the low liquid level of the coolant in the vacuum chamber 8.

[0102] In one possible implementation, each vacuum chamber is equipped with a corresponding pressure sensor; the pressure sensor is used to monitor the vacuum level within the corresponding vacuum chamber, so as to adjust the power of the vacuum pump by monitoring the vacuum level, thereby controlling the pressure difference of the first cooling circuit. Figure 3 As shown, a pressure sensor 28 is configured in vacuum chamber 9, and a pressure sensor 25 is configured in vacuum chamber 8, to monitor the vacuum level of their respective vacuum chambers.

[0103] In one possible implementation, temperature sensors can also be configured on each cooling circuit to monitor the temperature of the coolant flowing through the corresponding pipe. Schematic, in the case where the first and second cooling circuits share a common pipe, a first temperature sensor is configured on the common pipe, and a second temperature sensor is configured on the pipe on the side of the first cooling circuit exiting the first cooling area. Each temperature sensor is used to monitor the temperature of the coolant flowing through its corresponding pipe. For example... Figure 3 As shown, a temperature sensor 22 is installed on the common pipeline 17 to monitor the temperature of the low-temperature coolant returning to the liquid cooling chamber; a temperature sensor 23 is installed on the pipeline on the side of the first cooling circuit flowing out of the first cooling area to monitor the temperature of the high-temperature coolant flowing out of the first cooling area. Optionally, a pressure sensor 24 can also be installed on this pipeline to monitor the pressure of the high-temperature coolant flowing out of the first cooling area. Furthermore, a temperature sensor 29 and a temperature sensor 30 can be respectively installed on the inlet and outlet pipelines between the heat exchanger 13 and the cooling equipment 15, wherein the temperature sensor 29 is used to monitor the working fluid temperature at the inlet of the cooling equipment, and the temperature sensor 30 is used to monitor the working fluid temperature at the outlet of the cooling equipment.

[0104] The temperature and pressure sensors used in the system should be selected as electronic transmission sensors with rapid dynamic response, good compatibility, and stable operation; the liquid level sensor can be a pressure-resistant and sensitive contact electronic level gauge. It should be noted that, depending on the specific application requirements, the required sensors can be installed on various components or pipelines within the system to acquire parameters at corresponding locations, thereby monitoring the system's operating status. The sensor locations, quantities, and types in the above embodiments are illustrative; depending on actual needs, more or fewer sensors may be used, and this application does not impose any limitations on this.

[0105] In one possible implementation, the current limiter 2 also includes a turbulence radiator; the turbulence radiator is configured in the current-limiting region within the first cooling region to enhance the fluid turbulence of the coolant flowing over the surface of the high-power electronic device; the current-limiting region is the region defined by the high-power electronic device. Figure 9 A schematic diagram of the device configuration in the first cooling region is shown, as follows. Figure 9 As shown, the current limiter 2 includes a turbulence radiator 40, which is configured in the current-limiting area near the surface of the high-power electronic device 3. After the coolant in the first cooling circuit enters the first cooling area through the coolant inlet 38, it passes through the turbulence radiator 40, which can enhance the turbulence of the fluid flowing over the surface of the high-power electronic device 3. The high-power electronic device 3 can be mounted on a PCB (Printed Circuit Board) board 39, or it can be fixed in other ways. The configuration of the turbulence radiator can improve the heat dissipation effect. The turbulence radiator can be a device with good thermal conductivity that can enhance heat exchange. Schematic, the turbulence radiator can be a copper radiator or a VC (Vapor Chamber) composite radiator.

[0106] In one possible implementation, the current limiter 2 also includes a current limiter flow equalization plate 34; the current limiter flow equalization plate 34 is disposed on the coolant inlet side of the first cooling region to ensure that the coolant entering the first cooling region is evenly distributed across the surface of the high-power electronic device, thereby improving the heat dissipation effect.

[0107] Based on the configuration of the single-phase immersion liquid cooling system described above, the flow rate of the coolant in the dual cooling circuits can be adjusted separately. Specifically, for the first cooling circuit, the flow rate / flow can be adjusted by regulating the pressure difference through the power of the coolant circulation pump or vacuum pump, and also by adjusting the opening degree of each control valve in the first cooling circuit. Similarly, for the second cooling circuit, the flow rate / flow can be adjusted by regulating the power of the coolant circulation pump, and also by adjusting the opening degree of each control valve in the second cooling circuit.

[0108] In summary, the single-phase immersion liquid cooling system provided in this application embodiment includes a liquid cooling chassis, a first cooling circuit, and a second cooling circuit. A flow limiter on the first cooling circuit divides the area within the liquid cooling chassis into isolated cooling zones corresponding to different heat dissipation requirements. Different cooling circuits have different coolant inlets and outlets on the liquid cooling chassis. By independently controlling the coolant flow rates in the first and second cooling circuits, the system adapts to the heat dissipation requirements of each corresponding cooling zone, thereby reducing the impact of slow heat transfer caused by varying power consumption of electronic devices and immersion flow rates. This ensures effective heat dissipation for various electronic devices while avoiding unnecessary resource waste.

[0109] The single-phase immersion liquid cooling system provided in this application embodiment can be applied to scenarios containing multiple high-power electronic devices. In this case, the number of current limiters on the first cooling circuit is the same as the number of high-power electronic devices; when there are multiple high-power electronic devices, each high-power electronic device has a corresponding first cooling area.

[0110] The single-phase immersion liquid cooling system provided in this application is applicable to both horizontal immersion and rack immersion. Taking the application of the single-phase immersion liquid cooling system in a scenario involving two high-power electronic devices (such as servers) as an example... Figure 10 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in an exemplary embodiment of this application is shown, as follows: Figure 10 As shown, the horizontal immersion cooling chassis 47 houses a first blade server 41 and a second blade server 42. Corresponding to each server, a current limiter is configured on the first cooling circuit to rapidly dissipate heat from the servers. The coolant in the first cooling circuit can flow in a top-in, bottom-out manner, while the coolant in the second cooling circuit flows in a bottom-in, top-out manner. Figure 10As shown, the coolant in the first cooling circuit flows into the corresponding first cooling zone through the coolant inlet 45 on each flow restrictor and flows out of the corresponding first cooling zone through the coolant outlet 46. The coolant inlet 45 is positioned higher than the coolant outlet 46. Similarly, the coolant in the second cooling circuit flows into the second cooling zone through the coolant inlet 43 on the liquid-cooled chassis and flows out of the second cooling zone through the coolant outlet 44. The coolant inlet 43 is positioned lower than the coolant outlet 44. Furthermore, to ensure the coolant fully fills the corresponding cooling zone, the coolant inlet and outlet can be positioned on two opposite and parallel planes. Alternatively, the coolant inlet and outlet can be positioned diagonally to ensure the coolant fully fills the cooling zone.

[0111] Figure 11 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in another exemplary embodiment of this application is shown, as follows: Figure 11 As shown, the horizontal immersion cooling chassis 47 houses a first blade server 41 and a second blade server 42. Corresponding to each server, a current limiter is configured on the first cooling circuit to rapidly dissipate heat from the servers. The coolant in both the first and second cooling circuits flows from bottom to top. Figure 11 As shown, the coolant in the first cooling circuit flows into the corresponding first cooling area through the coolant inlet 49 on each flow limiter, and flows out of the corresponding first cooling area through the coolant outlet 50. The coolant inlet 49 is positioned lower than the coolant outlet 50. The coolant in the second cooling circuit flows into the second cooling area through the coolant inlet 43 on the liquid cooling chassis, and flows out of the second cooling area through the coolant outlet 44. The coolant inlet 43 is positioned lower than the coolant outlet 44.

[0112] Figure 12 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in another exemplary embodiment of this application is shown, as follows: Figure 12 As shown, the coolant in the first cooling circuit can flow in a forward-backward (relative to the rack door) pattern, while the coolant in the second cooling circuit flows in a bottom-in, top-out pattern. Figure 12 As shown, the coolant in the first cooling circuit flows into the corresponding first cooling area through the coolant inlet 49 on each flow limiter, and flows out of the corresponding first cooling area through the coolant outlet 52; the coolant in the second cooling circuit flows into the second cooling area through the coolant inlet 53 on the liquid cooling chassis, and flows out of the second cooling area through the coolant outlet 54. The coolant inlet 53 is positioned lower than the coolant outlet 54.

[0113] Figure 13 A schematic diagram of a dual-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in another exemplary embodiment of this application is shown, as follows: Figure 13 As shown, the coolant flow pattern in the first cooling circuit can be rear-in, front-out (relative to the rack door), while the coolant flow pattern in the second cooling circuit is bottom-in, top-out. Figure 13 As shown, the coolant in the first cooling circuit flows into the corresponding first cooling area through the coolant inlet 56 on each flow limiter, and flows out of the corresponding first cooling area through the coolant outlet 57; the coolant in the second cooling circuit flows into the second cooling area through the coolant inlet 53 on the liquid cooling chassis, and flows out of the second cooling area through the coolant outlet 54. The coolant inlet 53 is positioned lower than the coolant outlet 54.

[0114] Optionally, the coolant in the second cooling circuit of each of the above single-phase immersion liquid cooling systems can also be replaced with a top-in, bottom-out flow pattern, and the configuration of the inlet and outlet can be set according to actual needs.

[0115] Furthermore, after the single-phase immersion liquid cooling system is installed, before starting operation, to ensure the safety of system operation, a pre-power-on check can be performed on each component of the system, such as... Figure 3 Taking the single-phase immersion liquid cooling system shown as an example, first, determine whether there is any visible physical damage or destruction to each component in the system. If so, repair or replace the component in time. If not, continue with the subsequent steps.

[0116] Next, add coolant to the liquid cooling housing 1, the first vacuum chamber 9, the second vacuum chamber 8, and the coolant circulation pump 14; open the inflow control valve 4, inflow control valve 5, inflow control valve 6, inflow control valve 7, outflow control valve 11, outflow control valve 10, and the coolant circulation pump 14 to fill the entire system pipeline with coolant; check whether any components of the entire system are leaking. If so, shut down the coolant circulation pump 14 and repair or replace the components in time. If not, continue with the subsequent steps.

[0117] Next, after the system check is completed, all components are powered on (but all electronic devices are not turned on); the inflow control valve 6 is closed, the pressure relief valve 32 is opened, and the coolant in the first vacuum chamber 9 is drained to the configuration height of the liquid level sensor 36, then the pressure relief valve 32 is closed; the outflow control valve 11 is opened, and the vacuum pump 12 is turned on; the vacuum pump 12 is powered on and started, and the working status of the sensor, pump, electronic devices, and external cooling equipment is checked. If there are any abnormal components, they are repaired or replaced in time. If the working status is good, the subsequent steps are continued.

[0118] Finally, after the entire system is running stably, the electronic equipment inside the liquid-cooled chassis is cooled by a single-phase immersion liquid cooling system.

[0119] In this embodiment, each sensor in the single-phase immersion liquid cooling system can send the monitored parameters to the system, enabling the control device to dynamically adjust each component based on the received parameters. This achieves heat dissipation adjustment over a wide range, thereby optimizing the system's power efficiency (PUE). Based on the single-phase immersion liquid cooling systems described in the above embodiments, Figure 14 This application illustrates a flowchart of a control method for a single-phase immersion liquid cooling system provided in an exemplary embodiment. This method can be executed by a control device for the single-phase immersion liquid cooling system shown in the above embodiments. This control device can be implemented as a server or a terminal, such as... Figure 14 As shown, the method includes the following steps:

[0120] Step 1410: Monitor the coolant level in the liquid-cooled chassis.

[0121] Step 1420: When the coolant level in the liquid cooling chamber meets the liquid level adjustment conditions, a first control signal is sent to the single-phase immersion liquid cooling system. The first control signal is used to indicate the working power of the variable frequency coolant circulation pump and / or adjust the opening of the inflow control valve of the second cooling circuit to adjust the coolant flow rate of the second cooling circuit.

[0122] In other words, the computer equipment can monitor the coolant level in the liquid cooling box through the liquid level sensor 33 configured in the liquid cooling box, and adjust the coolant flow rate of the second cooling circuit when it is determined that the coolant level in the liquid cooling box meets the liquid level adjustment conditions. The conditions for adjusting the coolant level in the liquid-cooled chassis include: when the coolant level exceeds the corresponding maximum threshold, it indicates that there is too much coolant in the chassis, requiring an increase in coolant discharge to reduce the amount of coolant in the chassis. In this case, the first control signal can instruct the frequency converter to reduce the operating power of the cooling circulation pump and / or decrease the opening of the inflow control valve of the second cooling circuit to reduce the coolant flow rate of the second cooling circuit; when the coolant level is below the corresponding standard threshold, it indicates that there is too little coolant in the chassis, which may affect the heat dissipation effect of the second cooling area, requiring an increase in coolant injection to increase the amount of coolant in the chassis. In this case, the first control signal can instruct the frequency converter to increase the operating power of the cooling circulation pump and / or increase the opening of the inflow control valve of the second cooling circuit to increase the coolant flow rate of the second cooling circuit; furthermore, when the coolant level is below the corresponding standard threshold, the computer equipment can also issue a corresponding system alarm message to indicate the current coolant level in the chassis.

[0123] In one possible implementation, when controlling the coolant flow rate of the first cooling circuit, the computer device may control it based on the coolant temperature monitored by temperature sensor 23, and the method further includes:

[0124] Monitor the target temperature of the coolant flowing out of the first cooling zone from the first cooling circuit;

[0125] A second control signal is sent to the single-phase immersion liquid cooling system based on the target temperature. The second control signal is used to indicate the working power of the variable frequency cooling liquid circulation pump, and / or the working power of the variable frequency vacuum pump, and / or the opening degree of each control valve on the first cooling circuit.

[0126] Among them, the pressure difference formed by the vacuum pump and the coolant circulation pump is positively correlated with the target temperature, and the opening degree of each control valve on the first cooling circuit is positively correlated with the target temperature.

[0127] In other words, when the target temperature is higher than the maximum temperature threshold, it indicates that the electronic equipment in the current first cooling area is dissipating more heat and needs to increase its heat dissipation capacity. At this time, the second control signal can instruct that the working power of the vacuum pump be increased by frequency conversion while keeping the working power of the coolant circulation pump constant, so as to increase the pressure difference between the vacuum pump and the coolant circulation pump; or, the second control signal can instruct that the working power of the vacuum pump be increased by frequency conversion at the same time as the working power of the coolant circulation pump, so as to increase the pressure difference between the vacuum pump and the coolant circulation pump; and / or, the second control signal can also instruct to increase the opening degree of each control valve on the first cooling circuit, wherein each control valve on the first cooling circuit includes the inflow control valve of the first cooling circuit, the inflow control valve corresponding to the vacuum pump, and the outflow control valve.

[0128] When the target temperature is below the minimum temperature threshold, it indicates that the heat dissipation capacity exceeds the heat dissipation of the electronic equipment in the current first cooling area. At this time, the second control signal can instruct the frequency converter to reduce the operating power of the vacuum pump while keeping the operating power of the coolant circulation pump constant, so as to reduce the pressure difference between the vacuum pump and the coolant circulation pump; or, the second control signal can instruct the frequency converter to reduce the operating power of the vacuum pump while reducing the operating power of the coolant circulation pump, thereby reducing the pressure difference between the vacuum pump and the coolant circulation pump; and / or, the second control signal can also instruct the reduction of the opening degree of each control valve on the first cooling circuit.

[0129] In one possible implementation, when the computer device controls the coolant flow rate in the first cooling circuit of each vacuum chamber in turn, it can determine the switching of the working state of the vacuum chamber based on the liquid level height of the coolant in the vacuum chamber; the method further includes:

[0130] If the coolant level in the first vacuum chamber is higher than the first maximum threshold and the coolant level in the second vacuum chamber is lower than the second minimum threshold, a third control signal is sent. The third control signal is used to instruct and control each control valve to accelerate the coolant flow rate in the first cooling circuit through the second vacuum chamber.

[0131] The status of each control valve indicated by the third control signal can be referenced as follows: Figure 3The states of each control valve in the illustrated embodiment when the coolant flow rate in the first cooling circuit is accelerated by the second vacuum chamber are not described in detail here. The computer equipment can monitor the high level of coolant in the first vacuum chamber 9 by the liquid level sensor 27 and the low level of coolant in the second vacuum chamber 8 by the liquid level sensor 37. When the liquid level in the first vacuum chamber 9 is determined to be higher than the first maximum threshold, it indicates that the first vacuum chamber 9 is full of coolant. When the liquid level in the second vacuum chamber 8 is determined to be lower than the second minimum threshold, it indicates that the second vacuum chamber 8 is emptied. At this time, by sending a third control signal, the acceleration of the coolant flow rate in the first cooling circuit by the first vacuum chamber is switched to acceleration of the coolant flow rate by the second vacuum chamber.

[0132] If the coolant level in the second vacuum chamber is detected to be higher than the second maximum threshold and the coolant capacity in the first vacuum chamber is lower than the first minimum threshold, a fourth control signal is sent. The fourth control signal is used to instruct and control each control valve to accelerate the coolant flow rate in the first cooling circuit through the first vacuum chamber.

[0133] The status of each control valve indicated by the fourth control signal can be referenced as follows: Figure 3 The states of each control valve in the illustrated embodiment when the coolant flow rate in the first cooling circuit is accelerated by the first vacuum chamber are not described in detail here. The computer equipment can monitor the high coolant level in the second vacuum chamber 8 by the liquid level sensor 26 and the low coolant level in the first vacuum chamber 9 by the liquid level sensor 36. When the liquid level in the second vacuum chamber 8 is determined to be higher than the second highest threshold, it indicates that the second vacuum chamber 8 is full of coolant. When the liquid level in the first vacuum chamber 9 is determined to be lower than the first lowest threshold, it indicates that the first vacuum chamber 9 is emptied. At this time, by sending a fourth control signal, the acceleration of the coolant flow rate in the first cooling circuit by the second vacuum chamber is switched to acceleration of the coolant flow rate by the first vacuum chamber.

[0134] With more vacuum chambers, the monitoring and switching process is similar to the process described above. By repeating the monitoring and switching control process described above, the effect of accelerating the flow rate of coolant in the first cooling circuit can be achieved by having at least two vacuum chambers alternately.

[0135] In one possible implementation, the computer device also includes a protection mechanism for the vacuum chamber to prevent malfunctions during operation; the method further includes:

[0136] If the height difference between the coolant in the first vacuum chamber and the first maximum threshold is greater than the first warning height threshold, a fifth control signal is sent, which is used to indicate that the first pressure relief valve of the first vacuum chamber is in the open state.

[0137] If the height difference between the coolant in the second vacuum chamber and the second maximum threshold is greater than the second warning height threshold, a sixth control signal is sent to indicate that the second pressure relief valve of the second vacuum chamber is in the open state.

[0138] In other words, for each vacuum chamber, when the vacuum chamber is full and exceeds the warning level, in order to prevent excessive pressure in the vacuum chamber from causing danger, the computer equipment opens the pressure relief valve of the vacuum chamber to protect the vacuum pump. Furthermore, the computer equipment can also feed back corresponding alarm information to remind relevant personnel to check the system and troubleshoot in time. For example, when the level sensor 27 detects that the first vacuum chamber 9 is full and exceeds the warning level, it feeds back the corresponding alarm information and issues a fifth control signal to instruct the pressure relief valve 32 to open to protect the first vacuum chamber 9; when the level sensor 26 detects that the second vacuum chamber 8 is full and exceeds the warning level, it feeds back the corresponding alarm information and issues a sixth control signal to instruct the pressure relief valve 31 to open to protect the second vacuum chamber 8.

[0139] In summary, the control method for the single-phase immersion liquid cooling system provided in this application embodiment is based on a dual-loop negative pressure enhanced single-phase immersion liquid cooling system. It monitors the parameter information of the single-phase immersion liquid cooling system through various sensors, and controls each component in the single-phase immersion liquid cooling system based on the monitored parameters, so as to maintain the safe and stable operation of the single-phase immersion liquid cooling system, improve the heat dissipation effect of the single-phase immersion liquid cooling system for various electronic devices, and avoid unnecessary waste of resources.

[0140] Figure 15A structural block diagram of a computer device 1500 illustrated in an exemplary embodiment of this application is shown. This computer device can be implemented as a control device for the single-phase immersion liquid cooling system described above in this application. The computer device 1500 includes a processor (e.g., a central processing unit (CPU)) 1501, a system memory 1504 including random access memory (RAM) 1502 and read-only memory (ROM) 1503, and a system bus 1505 connecting the system memory 1504 and the processor 1501. The computer device 1500 also includes a mass storage device 1506 for storing an operating system 1509, application programs 1514, and other program modules 1511. Without loss of generality, the computer-readable medium can include computer storage media and communication media. Computer storage media include volatile and non-volatile, removable and non-removable media implemented using any method or technology for storing information such as computer-readable instructions, data structures, program modules, or other data. Computer storage media include RAM, ROM, Erasable Programmable Read Only Memory (EPROM), Electronically Erasable Programmable Read-Only Memory (EEPROM), flash memory or other solid-state storage technologies, Compact Disc Read-Only Memory (CD-ROM), Digital Versatile Disc (DVD) or other optical storage, magnetic tape cassettes, magnetic tape, disk storage, or other magnetic storage devices. Of course, those skilled in the art will recognize that the computer storage media are not limited to the above-mentioned types. The system memory 1504 and mass storage device 1506 described above can be collectively referred to as memory. According to various embodiments of this application, the computer device 1500 can also be connected to a remote computer on a network, such as the Internet, for operation. That is, the computer device 1500 can be connected to a network via a network interface unit 1507 connected to the system bus 1505, or the network interface unit 1507 can be used to connect to other types of networks or remote computer systems (not shown). The memory also stores at least one computer program, which the processor 1501 executes to perform the above-mentioned computer program. Figure 14 All or part of the steps in the control method of the single-phase immersion liquid cooling system shown in the embodiment.

[0141] Figure 16A structural block diagram of a computer device 1600 illustrated in an exemplary embodiment of this application is shown. The computer device 1600 can be implemented as a control device for the single-phase immersion liquid cooling system described above. Typically, the computer device 1600 includes a processor 1601 and a memory 1602. The memory 1602 may include one or more computer-readable storage media for storing at least one instruction, which is executed by the processor 1601 to implement all or part of the steps in the data processing result verification method shown in the method embodiments of this application. In some embodiments, the computer device 1600 may also optionally include a peripheral device interface 1603 and at least one peripheral device. The processor 1601, memory 1602, and peripheral device interface 1603 can be connected via a bus or signal line. Various peripheral devices can be connected to the peripheral device interface 1603 via a bus, signal line, or circuit board. Specifically, the peripheral devices include at least one of a radio frequency circuit 1604, a display screen 1605, a camera assembly 1606, an audio circuit 1607, and a power supply 1608. In some embodiments, the computer device 1600 further includes one or more sensors 1609. These sensors 1609 include, but are not limited to, an accelerometer 1610, a gyroscope 1611, a pressure sensor 1612, an optical sensor 1613, and a proximity sensor 1614. Those skilled in the art will understand that... Figure 16 The structure shown does not constitute a limitation on the computer device 1600, and may include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0142] In one exemplary embodiment, a computer-readable storage medium is also provided, which stores at least one computer program that is loaded and executed by a processor to implement all or part of the steps in the control method for the single-phase immersion liquid cooling system described above. For example, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, or optical data storage device, etc.

[0143] In one exemplary embodiment, a computer program product is also provided, the computer program product including a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions that, when executed by a computer, cause the computer to perform the above-described actions. Figure 14 All or part of the steps of the embodiments shown in the examples.

[0144] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.

[0145] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A single-phase immersion liquid cooling system, characterized in that, The system includes a liquid-cooled chassis, a first cooling circuit, and a second cooling circuit; The first cooling circuit includes a current limiter; the current limiter is used to divide the area inside the liquid cooling chassis into a first cooling area and a second cooling area that are isolated from each other; the first cooling area includes coolant that enters the current limiter through the first cooling circuit, and the second cooling area includes coolant that enters the liquid cooling chassis through the second cooling circuit; there is a difference in heat dissipation requirements between the first cooling area and the second cooling area; The coolant inlet and outlet of the first cooling circuit on the liquid cooling chassis are different from those of the second cooling circuit on the liquid cooling chassis, and there is a flow rate difference between the coolant flow rate in the first cooling circuit and the coolant flow rate in the second cooling circuit.

2. The system according to claim 1, characterized in that, When the coolant flow rate in the first cooling circuit is higher than the coolant flow rate in the second cooling circuit, the first coolant region corresponds to the region of the high-power electronic device; the second cooling region corresponds to the region of the low-power electronic device; and the heat dissipation of the high-power electronic device per unit time is higher than the heat dissipation of the low-power electronic device per unit time.

3. The system according to claim 1, characterized in that, The system also includes a cooling distribution unit (CDU) and cooling equipment; the CDU includes a heat exchanger and a coolant circulation pump. The heat exchanger is used to receive coolant flowing out of the liquid cooling box through the first cooling circuit and the second cooling circuit, and to transfer the heat absorbed by the coolant to the cooling device so that the cooling device can release the heat into the environment. The coolant circulation pump is used to pump the coolant cooled by the heat exchanger into the cooling circuit; the cooling circuit includes the first cooling circuit and the second cooling circuit.

4. The system according to claim 3, characterized in that, The CDU also includes a vacuum pump and at least two vacuum chambers; The vacuum pump is used to evacuate the at least two vacuum chambers and maintain the vacuum environment in each vacuum chamber. The at least two vacuum chambers are respectively connected to the first cooling circuit, and the at least two vacuum chambers are used to control the flow rate of the coolant in the first cooling circuit in turn by utilizing the pressure difference formed by the vacuum pump and the coolant circulation pump.

5. The system according to claim 4, characterized in that, Each vacuum chamber is equipped with a corresponding inflow control valve and an outflow control valve; The inflow control valve is used to control the flow rate of coolant flowing into the vacuum chamber; The outflow control valve is a three-way valve, used to control the connection and disconnection between the vacuum chamber and the vacuum pump, as well as the connection and disconnection between the vacuum chamber and the heat exchanger.

6. The system according to claim 5, characterized in that, Each vacuum chamber is also equipped with a corresponding pressure relief valve; If the CDU includes two vacuum chambers, when the coolant flow rate in the first cooling circuit is controlled by the first vacuum chamber, the first inflow control valve of the first vacuum chamber is in the open state, the first pressure relief valve of the first vacuum chamber is in the closed state, the first outflow control valve of the first vacuum chamber is connected to the vacuum pump, the second inflow control valve of the second vacuum chamber is in the closed state, the second pressure relief valve of the second vacuum chamber is in the open state, and the second outflow control valve of the second vacuum chamber is connected to the heat exchanger; When the coolant flow rate in the first cooling circuit is controlled by the second vacuum chamber, the first inflow control valve is closed, the first pressure relief valve is open, the first outflow control valve is connected to the heat exchanger, the second inflow control valve is open, the second pressure relief valve is closed, and the second outflow control valve is connected to the vacuum pump.

7. The system according to claim 4, characterized in that, The first cooling circuit and the second cooling circuit share a common pipeline; one end of the common pipeline is connected to the coolant circulation pump; The coolant in the common pipeline enters the first cooling circuit through the inflow control valve of the first cooling circuit, flows through the first cooling area and the vacuum chamber, and then enters the heat exchanger. The coolant in the common pipeline enters the second cooling circuit through the inflow control valve of the second cooling circuit, flows through the second cooling area, and then enters the heat exchanger.

8. The system according to claim 4, characterized in that, The liquid cooling chassis and each vacuum chamber are equipped with a corresponding liquid level sensor; the liquid level sensor is used to monitor the liquid level height in the corresponding space.

9. The system according to claim 4, characterized in that, Each vacuum chamber is equipped with a corresponding pressure sensor; the pressure sensor is used to monitor the vacuum level in the corresponding vacuum chamber.

10. The system according to claim 7, characterized in that, A first temperature sensor is installed on the common pipeline, and a second temperature sensor is installed on the pipeline on the side of the first cooling circuit that flows out of the first cooling area. Each temperature sensor is used to monitor the temperature of the coolant flowing through the corresponding pipeline.

11. The system according to claim 2, characterized in that, The current limiter also includes a turbulence radiator; the turbulence radiator is disposed in the current-limiting region within the first cooling region to enhance the fluid turbulence of the coolant flowing over the surface of the high-power electronic device; the current-limiting region is a region defined by the high-power electronic device.

12. The system according to claim 2, characterized in that, The current limiter also includes a current limiter flow equalization plate; the current limiter flow equalization plate is disposed on the coolant inlet side of the first cooling region to ensure that the coolant entering the first cooling region is evenly distributed across the surface of the high-power electronic device.

13. The system according to claim 2, characterized in that, The number of current limiters on the first cooling circuit is the same as the number of high-power electronic devices; when there are multiple high-power electronic devices, each high-power electronic device has a corresponding first cooling area.

14. A control method for a single-phase immersion liquid cooling system, characterized in that, The method is performed by a control device of a single-phase immersion liquid cooling system as described in any one of claims 1 to 13, the method comprising: Monitor the coolant level in the liquid-cooled enclosure; When the coolant level in the liquid cooling chamber meets the liquid level adjustment conditions, a first control signal is sent to the single-phase immersion liquid cooling system. The first control signal is used to indicate the working power of the variable frequency coolant circulation pump and / or adjust the opening of the inflow control valve of the second cooling circuit to adjust the coolant flow rate of the second cooling circuit.

15. The method according to claim 14, characterized in that, The method further includes: Monitor the target temperature of the coolant flowing out of the first cooling zone from the first cooling circuit; Based on the target temperature, a second control signal is sent to the single-phase immersion liquid cooling system. The second control signal is used to instruct the frequency converter to adjust the working power of the coolant circulation pump, and / or, the frequency converter to adjust the working power of the vacuum pump, and / or, to adjust the opening degree of each control valve on the first cooling circuit. The pressure difference between the vacuum pump and the coolant circulation pump is positively correlated with the target temperature, and the opening degree of each control valve on the first cooling circuit is positively correlated with the target temperature.

16. The method according to claim 14, characterized in that, The method further includes: If the coolant level in the first vacuum chamber is higher than the first maximum threshold and the coolant level in the second vacuum chamber is lower than the second minimum threshold, a third control signal is sent. The third control signal is used to instruct the control valves to accelerate the coolant flow rate in the first cooling circuit through the second vacuum chamber. If the coolant level in the second vacuum chamber is detected to be higher than the second maximum threshold and the coolant volume in the first vacuum chamber is lower than the first minimum threshold, a fourth control signal is sent. The fourth control signal is used to instruct the control valves to accelerate the coolant flow rate in the first cooling circuit through the first vacuum chamber.

17. The method according to claim 16, characterized in that, The method further includes: If the height difference between the coolant in the first vacuum chamber and the first maximum threshold is greater than the first warning height threshold, a fifth control signal is sent, which is used to indicate that the first pressure relief valve of the first vacuum chamber is in the open state. If the height difference between the coolant in the second vacuum chamber and the second maximum threshold is greater than the second warning height threshold, a sixth control signal is sent, which is used to indicate that the second pressure relief valve of the second vacuum chamber is in the open state.

18. A control device for a single-phase immersion liquid cooling system, characterized in that, The control device includes a processor and a memory, the memory storing at least one computer program, which is loaded and executed by the processor to implement the control method for the single-phase immersion liquid cooling system as described in any one of claims 14 to 17.

19. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one computer program, which is loaded and executed by a processor to implement the control method for the single-phase immersion liquid cooling system as described in any one of claims 14 to 17.

20. A computer program product, characterized in that, The computer program product includes a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions that, when executed by a computer, cause the computer to perform a control method for a single-phase immersion liquid cooling system as described in any one of claims 14 to 17.

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