PCB (Printed Circuit Board) defect detection marking device

Abstract

The invention discloses a PCB (Printed Circuit Board) defect detection marking device, which comprises a detection machine and a turnover machine, and is characterized in that the detection machine comprises a conveying mechanism used for conveying a PCB along a preset path; the positioning mechanism is arranged corresponding to the detection station of the conveying mechanism and is used for fixing the position of the PCB conveyed in place and acquiring the coordinates of the PCB; the optical detection mechanism is used for collecting a PCB image and identifying defects on the appearance of the PCB; the seal marking mechanism is in signal connection with the optical detection mechanism and is used for receiving the defect position signal output by the optical detection mechanism and correspondingly marking the defect position of the PCB; the bidirectional moving mechanism is in signal interaction with the positioning mechanism, and the optical detection mechanism and the seal marking mechanism which are arranged on the bidirectional moving mechanism are moved to target positions according to the coordinates obtained by the positioning mechanism; wherein the turnover machine is connected in series between the front and back detection stations of the conveying mechanism and is used for turning over a PCB (Printed Circuit Board); the detection mechanism and the turnover machine adopt a split structure design and are connected through a standardized interface.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automatic detection in PCB (Printed Circuit Board) manufacturing process, and particularly relates to a PCB defect detection and marking device. BACKGROUND

[0002] As the nerve center of electronic equipment, the circuit integrity of PCB directly determines the performance and reliability of electronic equipment. With the development of the electronic industry towards miniaturization and high density, the PCB line width has been reduced from the traditional 0.2mm to below 0.05mm, which puts forward higher requirements on the detection precision and efficiency of line defects. At present, the PCB defect detection and marking link mainly relies on manual detection and marking and traditional automatic detection scheme, but they all have significant defects and are difficult to meet the needs of large-scale and high-precision production: the manual scheme has low efficiency, high misjudgment and omission rate, and high labor cost; the traditional automatic scheme has low automation degree, insufficient precision, bulky and heavy equipment, and poor flexibility. SUMMARY

[0003] In view of the above-mentioned defects of the prior art, the purpose of the present application is to solve the problems of low automation degree and high labor cost in the detection and marking of PCB.

[0004] The present application provides a PCB defect detection and marking device, which comprises a detection machine and a turnover machine, and the detection machine comprises:

[0005] A conveying mechanism for conveying the PCB along a preset path;

[0006] A positioning mechanism arranged corresponding to the detection station of the conveying mechanism, for fixing the position of the conveyed PCB and obtaining the coordinates of the PCB;

[0007] An optical detection mechanism for collecting PCB images and identifying defects on the appearance of the PCB;

[0008] A seal marking mechanism connected with the optical detection mechanism, for receiving the defect position signal output by the optical detection mechanism and marking the defect position of the PCB;

[0009] A bidirectional moving mechanism connected with the positioning mechanism and moving the optical detection mechanism and the seal marking mechanism arranged on the bidirectional moving mechanism to the target position according to the coordinates obtained by the positioning mechanism;

[0010] The turnover machine is connected in series between the front and back detection stations of the conveying mechanism, and is used for turning over the PCB; the detection mechanism and the turnover machine adopt a split structure design and are connected through a standardized interface.

[0011] Specifically, the positioning mechanism comprises a detection platform and a positioning unit; the positioning unit is installed above the detection platform, used to obtain the coordinates of the PCB board and send the coordinate data to the optical detection mechanism; the detection platform uses negative pressure adsorption to fix the position of the PCB board.

[0012] Further, the detection platform has a plurality of support columns, which are of a segmented structure and comprise a plurality of support column segments, gaps being reserved between adjacent support column segments and being fixed by a clamping ring for disassembly and replacement of the conveying belt.

[0013] Specifically, the bidirectional moving mechanism is a gantry double-shaft module, which can move along the X-axis and Y-axis directions, and comprises two X-axis modules arranged in parallel and two Y-axis modules arranged in parallel, the Y-axis modules being respectively connected to the X-axis modules to form a mouth-shaped or cross-shaped structure; the two Y-axis modules comprise a first Y-axis module and a second Y-axis module, the optical detection mechanism being arranged in the first Y-axis module and the stamp marking mechanism being arranged in the second Y-axis module.

[0014] Specifically, the stamp marking mechanism comprises at least two independent stamp assemblies and a plurality of stamp effect detection units arranged on one side of the stamp assemblies; the stamp assemblies are mounted on the second Y-axis module, can independently move and mark the defects of the PCB board in different regions, and can stamp different marks corresponding to different defect types; the stamp effect detection units are used to detect the quality of the marked stamp patterns.

[0015] Specifically, the optical detection mechanism comprises a Z-axis sliding table, a high-definition color camera arranged on the Z-axis sliding table, and a displacement sensor; the displacement sensor is used to detect the distance between the surface of the PCB board and the camera lens and feed back the distance signal to the Z-axis sliding table; the Z-axis sliding table is used to adjust the height of the high-definition color camera according to the distance signal; and the high-definition color camera is used to collect the defect image of the PCB board.

[0016] Further, the optical detection mechanism further comprises a blowing assembly arranged at the lower end of the optical detection mechanism, the air outlet of the blowing assembly facing the surface of the PCB board to blow the PCB board flat during detection.

[0017] Specifically, the conveying mechanism comprises a conveying power unit, a plurality of parallel conveying belts, a conveying belt support groove, and a conveying belt jacking unit; the conveying power unit drives the plurality of conveying belts to run synchronously; the conveying belt support groove is arranged below the conveying belt to limit the lateral deviation of the conveying belt; the conveying belt adopts a spring tensioning structure, and the conveying belt jacking unit can drive the whole conveying belt to rise and fall, and the spring tensioning structure can maintain the tension of the conveying belt during the rising and falling process.

[0018] Specifically, the turnover machine comprises a blocking unit, a roller conveying assembly, a suction cylinder, a suction disc and a conveying assembly; the blocking unit can extend to the conveying path of the roller conveying assembly to block the PCB and make it accurately in place on the roller conveying assembly; the suction cylinder drives the suction disc to move up and down to adsorb the PCB in place, and the suction disc is used to turn over the PCB; the conveying assembly is used to send out the turned-over PCB.

[0019] Specifically, the upper and lower transmission wheels of the conveying assembly adopt double-sided tooth synchronous belt transmission, so that the upper and lower transmission wheels rotate in opposite directions and the conveying power direction of the PCB is consistent, avoiding force deviation when the PCB is warped.

[0020] Further, the detection machine further comprises a code scanning module, which is arranged at the incoming end of the conveying mechanism and is used to scan the two-dimensional code on the surface of the PCB to obtain the identity information of the board.

[0021] Further, an AI control and detection system is further included, which is in communication connection with the code scanning module, the positioning mechanism, the optical detection mechanism, the stamp marking mechanism and the turnover machine; the AI control and detection system is used to assist the optical detection mechanism in identifying defects on the image of the PCB.

[0022] The improvements of the present application bring the following advantages: the PCB defect detection and marking device provided by the present application realizes automatic detection and marking of double-sided PCB, reduces labor cost and maintenance difficulty. Each part adopts a split structure design and is connected through a standardized interface, which can be connected in series with front and rear production equipment to form a flow line operation, or can be used alone as an offline machine, which is flexible and suitable for the maintenance link of large-scale PCB production scenes. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor based on the drawings shown.

[0024] Figure 1 The three-dimensional structure schematic diagram of a PCB defect detection and marking device according to an embodiment of the present application;

[0025] Figure 2 The three-dimensional structure schematic diagram of a detection machine according to an embodiment of the present application;

[0026] Figure 3A three-dimensional structure schematic diagram of the turnover machine in the embodiment of the application;

[0027] Figure 4 A three-dimensional structure schematic diagram of the detection platform in the embodiment of the application;

[0028] Figure 5 A three-dimensional structure schematic diagram of the positioning unit in the embodiment of the application;

[0029] Figure 6 A three-dimensional structure schematic diagram of the conveying mechanism in the embodiment of the application;

[0030] Figure 7 A three-dimensional structure schematic diagram of the bidirectional moving mechanism in the embodiment of the application;

[0031] Figure 8 A three-dimensional structure schematic diagram of the seal marking mechanism in the embodiment of the application.

[0032] 1, detection machine; 2, turnover machine; 21, blocking unit; 22, roller conveying assembly; 23, suction cylinder; 25, conveying assembly; 251, transmission wheel; 3, conveying mechanism; 31, conveying power unit; 311, servo motor; 312, transmission shaft; 32, conveying belt; 33, conveying belt jacking unit; 34, conveying belt support groove; 4, positioning mechanism; 41, detection platform; 411, multi-hole suction plate; 412, air suction assembly; 413, cavity piece; 42, positioning unit; 43, support column; 431, support column section; 432, holding ring; 5, optical detection mechanism; 51, Z-axis sliding table; 52, high-definition color camera; 53, displacement sensor; 54, air blowing assembly; 6, seal marking mechanism; 61, seal assembly; 611, seal body; 612, lifting unit; 62, seal effect detection unit; 7, bidirectional moving mechanism; 71, X-axis module; 72, Y-axis module.

[0033] The purposes, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0035] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly.

[0036] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. For example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection claimed by the present application.

[0037] The embodiment discloses a PCB defect detection marking device, aiming to solve the problems of high manual dependence, slow beat, and high misjudgment rate in the existing PCB detection, and realize full-automatic, high-precision, and high-efficiency PCB appearance defect detection and marking, which is suitable for various PCB semi-finished product circuit defect (such as circuit gap, circuit short circuit, etc.) maintenance scenes.

[0038] Please refer to Figures 1-8 , the PCB defect detection marking device includes a detection machine 1 and a turnover machine 2, each part adopts a split structure design, and is connected through a standardized interface, which can be connected in series to form a production line operation, or can be used alone as an offline machine, and has high flexibility.

[0039] As shown in Figure 2 , the detection machine 1 is used for positioning, optical detection, and defect marking of the PCB, and includes a conveying mechanism 3, a positioning mechanism 4, an optical detection mechanism 5, a seal marking mechanism 6, and a bidirectional moving mechanism 7.

[0040] As shown in Figure 3 , the turnover machine 2 is connected between the front and back detection stations of the detection machine 1, realizes 180° turnover of the PCB, and ensures that the front and back surfaces can complete detection.

[0041] As shown in Figure 6As shown, the conveying mechanism 3 is used for conveying the PCB board along a preset path, ensuring accurate flow between stations, including a conveying power unit 31, a plurality of parallel conveying belts 32 and a conveying belt jacking unit 33.

[0042] The conveying power unit 31 preferably adopts a servo motor 311 as a power source, which disperses power to the plurality of parallel conveying belts 32 through a transmission shaft 312, realizing synchronous operation of the conveying belts 32, ensuring stable PCB board conveying and avoiding deviation.

[0043] The conveying belt jacking unit 33 preferably adopts a cylinder as an executing element, which can drive the whole conveying belt 32 to lift, when the PCB board is conveyed to the detection station, the cylinder jacks up the conveying belt 32 to send the whole conveying belt 32 to the positioning height, after positioning, the cylinder is lowered, and the PCB board falls on the detection platform 41, realizing seamless connection of "conveying-positioning".

[0044] The conveying belt 32 can specifically use a belt and adopt a spring tensioning structure, which can automatically stretch and contract to maintain tension when the conveying belt 32 is jacked up, preventing the belt from relaxing and causing the board to jam.

[0045] The conveying belt 32 is provided with a conveying belt support groove 34 below to limit the lateral deviation of the conveying belt 32, further improving the conveying stability.

[0046] The positioning mechanism 4 is provided corresponding to the detection station of the conveying mechanism 3, used for position fixing and coordinate acquisition of the PCB board, providing accurate positioning reference for subsequent detection and marking.

[0047] As shown in Figure 2 , 4 , the positioning mechanism 4 includes a detection platform 41 and a positioning unit 42, and the positioning unit 42 preferably adopts a MARK point positioning camera.

[0048] As shown in Figure 4 , the detection platform 41 adopts a negative pressure adsorption method to fix the PCB board, ensuring no warping and displacement during board detection. The detection platform 41 includes a porous suction plate 411 and a suction assembly 412, and a cavity member 413 connected between the porous suction plate 411 and the suction assembly 412, providing an air flow channel for the porous suction plate 411 and the suction assembly 412. The suction assembly 412 is used to provide negative pressure, and air enters the cavity of the cavity member 413 through the orifice of the porous suction plate 411, and flows into the suction assembly 412 through the cavity, thereby forming a negative pressure on the surface of the porous suction plate 411 to adsorb and fix the PCB board.

[0049] As shown in Figure 2 , the detection platform 41 is provided with the positioning unit 42 above, as shown in Figure 4As shown, multiple segmented support columns 43 are provided below. Each support column 43 is composed of multiple support segments 431. Gaps are reserved between adjacent support segments 431, and the gaps are fixed by clamps 432. This facilitates the removal and replacement of the conveyor belt 32 by disassembling the support columns 43, thus reducing maintenance costs. The testing platform 41 preferably adopts a negative pressure adsorption method with a blower to create a vacuum.

[0050] The positioning process is as follows: After the PCB board is placed on the inspection platform 41, the positioning unit 42 collects the MARK point image of the board, calibrates the coordinates and sends them to the bidirectional moving mechanism 7. The bidirectional moving mechanism 7 moves the optical inspection mechanism 5 and the stamp marking mechanism 6 to the target position according to the coordinates.

[0051] like Figure 7 As shown, the bidirectional moving mechanism 7 can move bidirectionally along the X-axis and Y-axis, which is used to drive the optical inspection mechanism 5 and the stamp marking mechanism 6 to accurately reach the target position.

[0052] The bidirectional moving mechanism 7 preferably adopts the form of a gantry dual-axis module. The gantry dual-axis module includes two parallel X-axis modules 71 and two parallel Y-axis modules 72. The Y-axis modules 72 are respectively mounted on the X-axis modules 71 and can move back and forth along the X-axis under the drive of the X-axis modules 71, forming a square or grid-like structure to ensure that the movement range covers the entire inspection platform 41. The X-axis modules 71 preferably use X-axis dual-actuator linear motors, and the Y-axis modules 72 preferably use Y-axis dual-actuator linear motors.

[0053] The two Y-axis modules 72 have a clear division of labor: the first Y-axis module 72 is equipped with an optical inspection mechanism 5, which is responsible for moving and taking pictures for inspection; the second Y-axis module 72 is equipped with a stamp marking mechanism 6, which is responsible for marking defects following the inspection results, so as to realize the "inspection-marking" is carried out simultaneously and improve the cycle speed.

[0054] like Figure 5 As shown, the optical inspection mechanism 5 is used to acquire images of the PCB board and identify appearance defects. The core design revolves around "high-precision imaging" and "low false positive rate". The optical inspection mechanism 5 includes a Z-axis slide 51 and a high-definition color camera 52 and a displacement sensor 53 mounted on the Z-axis slide 51.

[0055] The displacement sensor 53 detects the distance between the PCB board surface and the camera lens in real time and feeds the distance signal back to the Z-axis slide 51. The Z-axis slide 51 adjusts the height of the high-definition color camera 52 according to the feedback signal, ensuring that the image height accuracy is controlled within ±0.5mm to avoid image blurring due to insufficient depth of field. The high-definition color camera 52, in conjunction with a customized high-definition light source, can reproduce the actual colors of the PCB board, clearly capture circuit details, and provide high-quality images for defect identification.

[0056] The lower end of the optical detection mechanism 5 is provided with a blowing assembly 54, and the air outlet of the blowing assembly 54 faces the surface of the PCB board. When the inner layer board is detected, the blowing assembly 54 is started to blow the PCB board flat, so as to prevent the board from being warped due to uneven adsorption under negative pressure, and further ensure the accuracy of image acquisition.

[0057] As shown in Figure 8 , the seal marking mechanism 6 is signal connected with the optical detection mechanism 5, and corresponding marks are made on the PCB board according to the defect position signal. It includes two independent seal assemblies 61 and seal effect detection units 62, which are mounted on the second Y-axis module 72.

[0058] The two seal assemblies 61 can be independently moved, and the marking range is divided according to the area of the PCB board. At the same time, the defects in different areas are marked, which matches the detection speed of the optical detection mechanism 5, and ensures that the beat reaches 5pnl / min (5 points on one side, ≤30% need to be detected).

[0059] The seal assembly 61 can stamp different marks corresponding to different defect types, such as "△" mark for line gap and "□" mark for line short circuit. The defect type is visualized, which is convenient for subsequent maintenance.

[0060] The seal assembly 61 includes a seal body 611 and a lifting unit 612 for driving the seal body 611 to lift. The lifting unit 612 preferably adopts a lifting cylinder.

[0061] The seal effect detection unit 62 takes a real-time photo after marking, checks the clarity of the seal pattern, and if the pattern is blurred, immediately reminds the operator to add ink to avoid missing marks and wrong marks. The seal effect detection unit 62 preferably uses a detection camera.

[0062] As shown in Figure 3 , the turnover machine 2 is used to realize 180° turnover of the PCB board, so as to ensure that the front and back of the board can be detected. The turnover machine 2 includes a blocking unit 21, a roller conveying assembly 22, a suction cylinder 23, a suction disc and a conveying assembly 25.

[0063] The turnover process is as follows: first, after the PCB board is detected on the front side, it is sent to the turnover machine 2 by the conveying mechanism 3; then, the blocking unit 21 is extended to the conveying path of the roller conveying assembly 22, blocks the PCB board and makes it accurate; then, the suction cylinder 23 drives the suction disc to descend and adsorb the PCB board in place; then, the suction disc drives the PCB board to rotate 180° to complete the turnover; finally, the conveying assembly 25 sends the turned-over PCB board to the back detection station of the detection machine 1 or the next other station.

[0064] The blocking unit 21 preferably adopts a blocking cylinder.

[0065] The upper and lower transmission wheels 251 of the conveying assembly 25 adopt double-sided tooth synchronous belt transmission, so that the upper and lower transmission wheels 251 rotate in opposite directions but the conveying power directions of the PCB boards are consistent, the stress deviation of the PCB board when being warped is avoided, and the conveying after turning over is stable.

[0066] The code scanning module is arranged at the incoming material starting end of the conveying mechanism 3, obtains board identity information (such as a model, a batch, a production order number and the like) by scanning a two-dimensional code on the surface of the PCB board, and uploads the information to the AI control and detection system, so as to realize board whole-process tracing.

[0067] The AI control and detection system is used as a control unit, is in communication connection with each mechanism, and realizes defect identification, data statistics and equipment linkage control.

[0068] The AI control and detection system is provided with a large computing power core module, adopts CUDA programming and SIMD (single instruction multiple data) programming acceleration processing, realizes hardware level model reasoning, and the single defect detection time is less than or equal to 100 ms. The AI control and detection system can assist the optical detection mechanism 5 in identifying defects, and outputs three results of NG (unqualified), OK (qualified) and uncertain. The uncertain result only needs one staff to rejudge in the central server (1 person can control 4 devices, and the labor is reduced by 50%). The AI control and detection system also supports original data archiving, exporting and SPC analysis, can calculate real-time yield, bad product rate and bad product type distribution, triggers an alarm for continuous bad products (such as three consecutive unqualified boards), provides customized reports (such as defect type quantity and defect area statistics), and can be connected with a factory ERP system to realize data closed-loop management.

[0069] The working process of the PCB board defect detection and marking device provided by the application is as follows:

[0070] 1. Incoming material code scanning: the PCB board is fed by a conveying line, a code scanning module scans a two-dimensional code of the board, obtains board information and uploads the information to an AI system;

[0071] 2. Front surface detection: a conveying belt 32 conveys the PCB board to a front surface detection station, a cylinder lifts the conveying belt 32, completes secondary positioning and then descends, the PCB board falls on a detection platform 41 (fixed by negative pressure adsorption), a positioning unit 42 calibrates coordinates, a bidirectional moving mechanism 7 drives an optical detection mechanism 5 to take a picture and detect defects according to the coordinates, and then the bidirectional moving mechanism 7 drives a seal marking mechanism 6 to stamp the defect position;

[0072] 3. First turning over: after the front surface detection is completed, the conveying belt 32 sends the PCB board to a turning machine 2, a blocking unit 21 positions and adsorbs by a suction cup and turns over by 180°, and a conveying assembly 25 sends the board to a back surface detection station;

[0073] 4. Back surface detection: the back surface detection process is consistent with the front surface (secondary positioning, picture taking, detection and defect marking);

[0074] 5. Second time flip: after the reverse side detection is completed, the PCB board enters the flipper 2 again to flip 180° (restore the initial posture);

[0075] 6. Flow to the next station: the flipped PCB board is sent out of the device by the conveying belt 32 and enters the subsequent production link.

[0076] The PCB board defect detection and marking device realizes full-automatic detection and marking of double-sided PCB boards, meets the detection rhythm, misjudgment rate and data traceability requirements, reduces the labor cost and maintenance difficulty, and is suitable for the maintenance link of large-scale PCB production scenes.

[0077] The above is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation, direct / indirect application in other related technical fields, or direct / indirect application in other related technical fields within the inventive concept of the present application and the content of the specification and drawings are included in the patent protection scope of the present application.

Claims

1. A PCB board defect detection and marking device, characterized in that, The machine includes an inspection machine and a flipping machine, wherein the inspection machine includes: A conveying mechanism for conveying PCB boards along a preset path; The positioning mechanism, corresponding to the detection station of the conveying mechanism, is used to fix the position of the PCB board that has been conveyed to the designated location and to obtain the coordinates of the PCB board. Optical inspection agencies are used to acquire images of PCB boards and identify defects in their appearance. The stamp marking mechanism is connected to the optical inspection mechanism and is used to receive the defect location signal output by the optical inspection mechanism and mark the corresponding defect location on the PCB board. The bidirectional moving mechanism interacts with the positioning mechanism via signals, and moves the optical detection mechanism and the stamp marking mechanism mounted on the bidirectional moving mechanism to the target position according to the coordinates obtained by the positioning mechanism. The flipping machine is connected in series between the front and back inspection stations of the conveying mechanism and is used to flip the PCB board; the inspection mechanism and the flipping machine adopt a split structure design and are connected through a standardized interface.

2. The PCB board defect detection and marking device according to claim 1, characterized in that, The positioning mechanism includes a detection platform and a positioning unit; the positioning unit is installed above the detection platform to obtain the coordinates of the PCB board and send the coordinate data to the optical detection mechanism; the detection platform uses negative pressure adsorption to fix the position of the PCB board.

3. The PCB board defect detection and marking device according to claim 2, characterized in that, The testing platform has multiple support columns, which are segmented structures consisting of multiple support segments. Gaps are reserved between adjacent support segments, and the gaps are fixed by clamps to facilitate the disassembly and replacement of the conveyor belt.

4. The PCB board defect detection and marking device according to claim 1, characterized in that, The bidirectional moving mechanism is specifically a gantry dual-axis module, which can move along the X-axis and Y-axis directions. It includes two parallel X-axis modules and two parallel Y-axis modules. The Y-axis modules are respectively driven and connected to the X-axis modules to form a square or grid structure. The two Y-axis modules include a first Y-axis module and a second Y-axis module. The optical detection mechanism is located in the first Y-axis module, and the stamp marking mechanism is located in the second Y-axis module.

5. The PCB board defect detection and marking device according to claim 4, characterized in that, The stamp marking mechanism includes at least two independent stamp components and several stamp effect detection units respectively located on one side of the stamp components; the stamp components are all mounted on the second Y-axis module, and the stamp components can move independently and mark the defects of the PCB board in different areas, and the stamp components can stamp different marks according to different defect types; the stamp effect detection unit is used to detect the quality of the marked stamp pattern.

6. The PCB board defect detection and marking device according to claim 1, characterized in that, The optical inspection mechanism includes a Z-axis slide and a high-definition color camera and a displacement sensor mounted on the Z-axis slide. The displacement sensor is used to detect the distance between the PCB board surface and the camera lens, and feeds back the distance signal to the Z-axis slide. The Z-axis slide is used to adjust the height of the high-definition color camera according to the distance signal. The high-definition color camera is used to acquire images of defects on the PCB board.

7. The PCB board defect detection and marking device according to claim 6, characterized in that, The optical inspection mechanism also includes an air blowing component disposed at the lower end of the optical inspection mechanism. The air outlet of the air blowing component faces the PCB board surface to flatten the PCB board during inspection.

8. The PCB board defect detection and marking device according to any one of claims 1-7, characterized in that, The conveying mechanism includes a conveying power unit, multiple parallel conveyor belts, a conveyor belt support groove, and a conveyor belt lifting unit; the conveying power unit drives the multiple conveyor belts to operate synchronously; the conveyor belt support groove is fitted under the conveyor belt to limit the lateral displacement of the conveyor belt; the conveyor belt adopts a spring tensioning structure, and the conveyor belt lifting unit can drive the conveyor belt to rise and fall as a whole, and the spring tensioning structure can maintain the tension of the conveyor belt during the rising and falling process.

9. The PCB board defect detection and marking device according to any one of claims 1-7, characterized in that, The flipping machine includes a blocking unit, a roller conveying assembly, a suction cylinder, a suction cup, and a conveying assembly. The blocking unit can extend into the conveying path of the roller conveying assembly to block the PCB board and make it accurately positioned on the roller conveying assembly. The suction cylinder drives the suction cup to move up and down to pick up the PCB board after it has been positioned. The suction cup is used to flip the PCB board. The conveying assembly is used to send the flipped PCB board out.

10. The PCB board defect detection and marking device according to claim 9, characterized in that, The upper and lower transmission wheels of the conveying component adopt double-sided toothed synchronous belt drive, so that the upper and lower transmission wheels rotate in opposite directions and the conveying power to the PCB board is in the same direction, thus avoiding the force deviation when the PCB board is tilted.

Images