A heat sink with a fin structure

Abstract

The finned heat sink of the present invention comprises a base in the XY plane supporting a plurality of uniformly distributed vertical fins, the fins forming first separate channels in the YZ plane. Each fin is equipped with a single fin on its inner surface facing the -Y vector direction, and the terminal end of each fin is provided with a protrusion structure facing the +X direction. The invention aims to promote uniform heat distribution across the surface of the fins by introducing fins in the fins that guide the airflow characteristics for redirecting the buoyancy-driven airflow, thereby enhancing the overall convective heat transfer efficiency, reducing the peak temperature of the fins, and improving thermal uniformity without significantly increasing the size or complexity of the heat sink.

Description

Technical Field

[0001] This invention belongs to the field of radiator technology, and particularly relates to a radiator with a finned structure. Background Technology

[0002] In recent years, advancements in power electronics technology have enabled devices to achieve higher power densities and higher switching frequencies. Components such as metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs), power diodes, and rectifiers now need to operate reliably under high current loads while maintaining efficiency and minimizing heat loss. The heat generated by these devices originates from conduction losses, switching losses, and on-resistance. Ineffective heat dissipation can lead to thermal runaway, decreased efficiency, shortened lifespan, and even catastrophic failures.

[0003] Despite advancements in radiator design, traditional solutions, such as rectangular straight-blade aluminum radiators, still have limitations in fully utilizing the overall volume of the fins. The upper area of ​​vertical fins, particularly the top leading edge angle, typically suffers from low heat flux and underutilized surface area, leading to uneven temperature distribution and reduced overall heat dissipation efficiency.

[0004] In addition, existing technologies have proposed various strategies, including improving heat sink geometry, selecting suitable materials, and optimizing airflow management. Technologies such as pin-shaped heat sinks, louvered heat sinks, and microchannel structures aim to improve the convective heat transfer coefficient and enhance overall heat dissipation. However, these solutions typically require significant modifications to the heat sink manufacturing process or involve complex geometries, thereby increasing costs, assembly difficulty, and reducing mechanical strength. Summary of the Invention

[0005] This invention aims to overcome the aforementioned limitations by innovatively improving the traditional radiator structure. It proposes a radiator with a finned structure, which introduces an airfoil-shaped extended finned structure on the inner surface of the vertical heat sink near the top leading edge angle to guide airflow, promote uniform heat distribution inside the heat sink, enhance convective heat dissipation, and alleviate local hot spots.

[0006] Specifically, the finned heat sink of this invention defines +Z vector as representing the upward direction, -Z vector as representing the downward direction; +X vector as representing the right direction, -X vector as representing the left direction; -Y vector as representing the front direction, and +Y vector as representing the rear direction; the heat sink includes:

[0007] A base located on the XY plane supports several evenly distributed vertical heat sinks, which form a first separation channel on the YZ plane; each heat sink is equipped with a single fin on its inner surface facing the -Y vector direction, and each heat sink has a protruding structure at its end facing the +X direction.

[0008] This invention aims to alleviate this limitation by introducing a guiding airflow feature, called a vane, into the heat sink. The vane is designed to redirect buoyancy-driven airflow, thereby promoting a more uniform distribution of heat across the heat sink surface. By enhancing the interaction between the rising hot air and previously underutilized areas of the heat sink, the vane improves overall convective heat transfer efficiency, reduces peak heat sink temperature, and improves thermal uniformity, without significantly increasing the size or complexity of the heat sink.

[0009] Preferably, the fins extend from the apex of the +Z vector of the heat sink to the XZ plane, and the fins are rotated by a preset negative angle relative to the +X vector. When the forced cooling fluid flows along the +X direction, it is guided towards the base through the fins.

[0010] The negative rotation preset angle is set between –10° and –55° depending on the size of the radiator and the airflow rate.

[0011] Preferably, the vane includes a flow guide groove and baffles disposed on both sides of the flow guide groove.

[0012] Preferably, the baffle near the heat sink is fixedly attached to the heat sink.

[0013] Preferably, the length of the fins is set between 5 and 20 mm according to the spacing between the heat sink fins and the airflow requirements.

[0014] Preferably, the width of the protrusion structure in the Y-vector direction is 0.2-2.5 times the width of the winglet, in order to pressurize the forced cooling fluid.

[0015] Preferably, the length of the protrusion structure in the X-vector direction is between one-sixth and one-eighth of the length of the heat sink.

[0016] Preferably, a second separation channel is formed between the protruding structures, and the width of the second separation channel in the Y vector direction is between 0.1 and 0.5 times the width of the first separation channel.

[0017] Preferably, the protruding structure is at an inclined angle at the connection point with the heat sink.

[0018] Preferably, fixed sidewalls are provided on both sides of the radiator in the Y-vector direction.

[0019] Preferably, the wing is configured as a rectangular thin sheet, a trapezoidal structure, or an L-shaped structure.

[0020] This invention maximizes the effective surface area of ​​each heat sink by strategically managing airflow driven by natural buoyancy. This optimization enables the heat sink to dissipate heat more efficiently while utilizing the inherent physical properties of air buoyancy, thereby achieving superior heat sink geometry and excellent thermal performance with minimal modifications to conventional heat sink structures.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention effectively guides cooling air through fins, maximizing the utilization of available airflow and enhancing convective heat transfer without increasing fan speed or airflow velocity, thus maintaining system energy efficiency. Furthermore, FEA results verify that the heat sink of this invention offers technical advantages over traditional rectangular designs in terms of lower and more uniform operating temperature, stable and optimized airflow distribution, resulting in improved thermal management efficiency and increased material utilization. It is particularly suitable for high-requirement power electronics applications that are sensitive to reliability, efficiency, and cost. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a radiator structure with fins in this embodiment.

[0024] Figure 2 This is a schematic diagram of the heat sink and its different orientations in this embodiment.

[0025] Figure 3 This diagram shows a traditional heat sink of similar size, as simulated in this embodiment.

[0026] Figure 4 The FEA results in this embodiment are shown in the diagram of the temperature distribution effect of the traditional radiator.

[0027] Figure 5 The FEA results in this embodiment are shown in the diagram of the pressure characteristic distribution of the traditional radiator.

[0028] Figure 6 This diagram illustrates the significantly uniform temperature distribution of the heat sink in this embodiment.

[0029] Figure 7 This is a diagram showing the airflow pressure characteristic distribution of the radiator of the present invention in this embodiment.

[0030] Among them, 10-heat sink base; 11-heat sink fin; 12-fin; 13-protruding structure; 14-separation channel. Detailed Implementation

[0031] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0032] In this embodiment, to more clearly describe the technical solution, the following definitions are made in three-dimensional Cartesian space: +Z vector represents the upward direction, -Z represents the downward direction; +X represents the right direction, -X represents the left direction; -Y represents the front direction, and +Y represents the rear direction.

[0033] Specifically, such as Figure 1-2 As shown, the present invention provides a finned heat sink, the heat sink comprising:

[0034] A base is located on the XY plane, supporting several evenly distributed vertical heat sinks. The heat sinks are located on the YZ plane to form a first separation channel. Each heat sink is equipped with a single fin on its inner surface facing the -Y vector direction, and each heat sink has a protruding structure at its end facing the +X direction.

[0035] In this embodiment, the vanes are designed to redirect buoyancy-driven airflow, thereby promoting a more uniform distribution of heat across the heat sink surface. By enhancing the interaction between the rising hot air and previously underutilized areas of the heat sink, the vanes improve overall convective heat transfer efficiency, reduce peak heat sink temperature, and improve thermal uniformity, without significantly increasing the size or complexity of the heat sink.

[0036] It should be noted that in this embodiment, the winglet can be designed as a rectangular sheet or other structural shapes according to actual needs, such as trapezoidal or L-shaped structures, and is not limited to these. Furthermore, different winglet structures are technically consistent with the simulation results, which helps maintain flexibility in manufacturing processes and expands the scope of rights protection to cover different forms of winglet structures.

[0037] It should also be noted that as long as the heat sink fins are arranged vertically at the working fluid inlet, the fin structure can be applied to any vertical heat sink fin. On the other hand, the protruding structures on the heat sink fins should be located at the downstream end of the radiator to force cooling and guide the working fluid after the airflow passes through the heat sink fins, thereby enhancing the overall heat dissipation effect.

[0038] It should be noted that, in this embodiment, taking a rectangular wing as an example, the size of the wing can be adjusted according to different requirements.

[0039] Preferably, the fins extend from the apex of the +Z vector of the heat sink towards the XZ plane. The fins are rotated by a preset negative angle relative to the +X vector. When the forced cooling fluid flows along the +X direction, it is guided towards the base through the fins. Note that there are no fins on the XZ plane facing the +Y direction. The fin dimensions and their negative rotation angle relative to the +X vector are precisely calculated to guide the incoming airflow downwards, thereby mitigating the thermal buoyancy effect.

[0040] The negative rotation preset angle is set between –10° and –55° depending on the size of the radiator and the airflow rate.

[0041] Preferably, the vane includes a rectangular guide groove and baffles disposed on both sides of the guide groove.

[0042] Preferably, the baffle near the heat sink is fixedly attached to the heat sink.

[0043] Preferably, the length of the fins is set between 5 and 20 mm according to the spacing between the heat sink fins and the airflow requirements.

[0044] Preferably, the width of the protrusion structure in the Y-vector direction is 0.2-2.5 times the width of the winglet, in order to pressurize the forced cooling fluid.

[0045] Preferably, the length of the protrusion structure in the X-vector direction is between one-sixth and one-eighth of the length of the heat sink.

[0046] Preferably, a second separation channel is formed between the protruding structures, and the width of the second separation channel in the Y vector direction is between 0.1 and 0.5 times the width of the first separation channel.

[0047] Preferably, the protruding structure is at an inclined angle at the connection point with the heat sink.

[0048] Preferably, fixed sidewalls are provided on both sides of the radiator along the Y-vector direction. It should be noted that the heat transfer coefficient of the fixed sidewalls on both sides of the radiator is... This design creates defined cooling air channels to ensure consistent airflow direction and prevents cooling fluid leakage, ensuring a complete cooling path. This ensures uniform airflow through the heatsink channels, optimizing convective heat transfer in the radiator.

[0049] To better illustrate this technical solution, taking a thin and light consumer electronics device as an example, the heat sink base is designed with XY plane dimensions of 40mm × 30mm and a thickness of 2mm. It is made of 6063 aluminum alloy with an anodized surface treatment, an oxide layer thickness of 6μm, and a bottom bonding surface roughness Ra≤0.6μm, facilitating tight bonding with the consumer electronics chip. Vertical heat sinks are arranged on the base, preferably six in number, evenly distributed on the base. The height of the heat sink in the +Z direction is set to 10mm, the thickness in the X direction is set to 1mm, and the spacing between the heat sinks in the Y direction is set to 5mm, forming five first separation channels with a channel width of 5mm. The heat sinks and the base are integrally die-cast, and the material is the same as that of the base.

[0050] The rectangular thin-plate structure extends from the apex of the +Z vector of the heat sink to the XZ plane, with a length of 8mm along the extension direction, a width of 3mm along the Y direction, and a thickness of 0.5mm. The negative rotation angle relative to the +X vector is preset to –15°, which is suitable for the low airflow rate environment in consumer electronics. The wing includes a guide groove, preferably with a width of 1mm, a depth of 0.2mm, and a height of 0.5mm for the baffles on both sides. The baffles near the heat sink are fixed to the heat sink by laser welding, with a welding strength ≥40N.

[0051] Furthermore, the protruding structure is trapezoidal, with a width in the Y-vector direction that is 0.8 times the width of the fin, or 2.4 mm, to achieve moderate pressurization of the forced cooling fluid; its length in the X-vector direction is one-seventh the length of the heat sink, or about 4.3 mm; and it is inclined at a 30° angle to the heat sink; four second separation channels are formed between the protruding structures, with a width in the Y-vector direction that is 0.3 times the width of the first separation channel, or 1.5 mm.

[0052] Side walls are set on both sides of the heat sink in the Y-vector direction. The height of the side walls is the same as that of the heat sink, which is 10mm and the thickness is 1mm. They are integrally formed with the base and the heat sink, and serve to fix the heat sink and guide the airflow.

[0053] This heatsink measures 40mm × 30mm × 12mm and weighs 22g. It is suitable for CPU / GPU cooling in ultra-thin laptops, tablets, and other consumer electronics devices. Under natural convection conditions, it can dissipate up to 10W of heat, with a low thermal resistance. When used with the built-in mini fan, the airflow... The heat dissipation power is increased to 15W, and the thermal resistance is reduced to 2.0℃ / W. In this embodiment, the -15° negative rotation angle of the vane can effectively guide the buoyancy-driven airflow. The combination of the trapezoidal platform protrusion structure and the second separation channel optimizes the flow path of the forced airflow, taking into account both thinness and heat dissipation efficiency.

[0054] In another preferred embodiment, to better illustrate this technical solution, taking a heat sink for industrial equipment as an example, the preferred base has XY plane dimensions of 100mm × 50mm and a thickness of 4mm. It is made of ADC12 die-cast aluminum alloy, with a surface coated with high-temperature resistant insulating paint, and a temperature resistance ≥120℃. Four M3 mounting holes are pre-drilled at the bottom to accommodate industrial control module installation standards. There are 15 vertical heat sinks, each 18mm high and 1.5mm thick, with a spacing of 6mm between them, forming 14 first separation channels with a channel width of 6mm. The heat sinks are brazed to the base, with a brazing layer thickness of 0.15mm and an interface thermal resistance of [missing information]. Preferably, the wing adopts an L-shaped structure, extending from the apex of the +Z vector of the heat sink to the XZ surface, with a length of 12mm, a width of 4mm, and a thickness of 0.8mm; the preset negative rotation angle relative to the +X vector is –30°, which is suitable for medium airflow rates in industrial equipment; the wing guide groove is 1.5mm wide and 0.3mm deep, and the baffles on both sides are 0.8mm high. The baffles near the heat sink are riveted to the heat sink, with 2 riveting points per wing.

[0055] In this application scenario, the protruding structure is designed as a semi-cylindrical shape, with a Y-direction width of 1.5 times the width of the fin (6mm) to enhance the pressurization effect; an X-direction length of one-sixth the length of the heat sink (approximately 8.3mm); and a 45° angle at the connection point with the heat sink. The Y-direction width of the second separation channel is 0.2 times the width of the first separation channel (1.2mm). Fixed sidewalls are designed on both sides in the Y-direction, with a height of 18mm and a thickness of 2mm, and are welded to the base. The inner side of the sidewalls has guide patterns to further optimize airflow distribution.

[0056] It should be noted that this heat sink has dimensions of 100mm × 50mm × 22mm and weighs 180g. It is suitable for industrial control equipment such as PLC modules and industrial power supplies. Its heat dissipation power is 25W under natural convection, and its thermal resistance is... In terms of air volume The forced air cooling power is increased to 70W, and the thermal resistance is reduced to 1.1℃ / W. The L-shaped fins combined with a -30° negative rotation angle enhance the interaction between airflow and the heat sink surface; the semi-cylindrical protrusion structure has a significant pressurizing effect, and together with the side wall guide pattern, it can achieve efficient heat dissipation in the compact space of industrial equipment, meeting the heat dissipation requirements of medium power devices.

[0057] In another preferred embodiment, to better illustrate this technical solution, taking a high-power automotive electronic heat sink as an example, the preferred design features a base with XY plane dimensions of 200mm × 80mm and a thickness of 6mm, made of 1070 pure aluminum with a surface micro-arc oxidation treatment and a thickness of 12μm. The bottom is covered with thermally conductive gel, resulting in a thermal conductivity coefficient of... It is fitted to the automotive electronic power module and has sealing grooves around its perimeter. There are 30 vertical heat sinks, each 30mm high and 2.5mm thick, with a 7mm spacing, forming 29 first separation channels, each 7mm wide. The heat sinks are manufactured using an extrusion molding process and connected to the base via friction stir welding, ensuring strong welds. In this embodiment, the optional winglet adopts a trapezoidal structure, extending from the apex of the +Z vector of the heat sink to the XZ surface, with an upper base of 5mm, a lower base of 8mm, a length of 18mm, and a thickness of 1.2mm; the preset negative rotation angle relative to the +X vector is -50°, which is suitable for the higher airflow rate in automotive electronics; the winglet guide groove is 2mm wide and 0.4mm deep, and the baffles on both sides are 1.2mm high, with the baffles near the heat sink being vacuum brazed to the heat sink.

[0058] It should be noted that this specification of radiator measures 200mm × 80mm × 36mm and weighs 1.2kg. It is suitable for high-power automotive electronic devices such as DC / DC converters and on-board chargers in new energy vehicles. When used in conjunction with automotive cooling systems, such as airflow... Coolant flow rate At this time, the heat dissipation power can reach 200W, which can reduce the peak temperature of the power module by 15-20℃ and improve the thermal uniformity by 25%. The trapezoidal fins and the -50° negative rotation angle design effectively cope with the heat exchange requirements under high airflow rates; the strong pressurization effect of the rectangular block protrusion structure and the wide second separation channel ensure the efficient flow of a large amount of cooling fluid, while the side wall reinforcement enhances the reliability of the radiator in the vibration environment of automobile driving.

[0059] The raised structure is a rectangular block, with a Y-direction width of 2.2 times the width of the fin, or 17.6mm, maximizing the pressurization effect; its X-direction length is one-eighth the length of the heat sink, approximately 25mm; and it is inclined at a 60° angle to the heat sink. The second separation channel has a Y-direction width of 0.4 times the width of the first separation channel, or 2.8mm. Fixed sidewalls are located on both sides of the Y-direction, with a height of 30mm and a thickness of 3mm, integrally extruded with the base and heat sink. Reinforcing ribs are provided on the outer side of the sidewalls to improve the structure's vibration resistance.

[0060] The wing structure proposed in this invention increases along the negative rotation angle with increasing airflow rate, ensuring directional airflow guidance at different flow velocities. The wing length is within the range of 5-20mm, and combined with the adjustment of the heat sink spacing, airflow blockage is avoided. Furthermore, this invention balances the pressurization effect and airflow resistance through the setting of a protruding structure and the relationship between the width and length of the protruding structure. The width multiple of the second separation channel is further controlled within 0.1-0.5 times, achieving secondary airflow distribution while avoiding excessive pressure loss. Based on this, in order to further enhance airflow control, the structural design of the fixed sidewall takes into account both airflow guidance and the reliability requirements of the installation environment.

[0061] To verify the efficiency of the embodiments, Figure 3 A conventional radiator of similar size was strategically placed on a 60W heatsink along the XY plane to ensure efficient heat conduction. Thermal performance under specific operating conditions was simulated using thermal imaging (FEA). Air was selected as the cooling fluid, maintained at room temperature and standard atmospheric pressure, with a flow velocity controlled at 2 m / s. This velocity establishes laminar flow, reduces turbulence, and improves heat transfer stability. Laminar flow along the +X direction ensures effective cooling air contact with the radiator surface. Furthermore, fixed sidewalls were installed on both sides of the radiator, with a heat transfer coefficient of [missing value]. This design creates defined cooling air channels to ensure consistent airflow direction and prevents cooling fluid leakage, ensuring a complete cooling path. This ensures uniform airflow through the heatsink channels, optimizing convective heat transfer in the radiator.

[0062] Figure 4 The FEA results show that the traditional radiator has an uneven temperature distribution, with some areas having lower temperatures and others having significantly higher temperatures, proving that the traditional design has failed to achieve the optimal temperature distribution. Figure 5The pressure characteristics show that the buoyancy effect actually affects the flow of cooling fluid, reduces heat dissipation efficiency, and leads to material waste.

[0063] To evaluate the thermal and hydrodynamic performance of the radiator of the present invention, a detailed FEA was performed under the same conditions as that of a conventional radiator. Figure 6 The results show that the heat sink of this invention exhibits significantly more uniform temperature distribution, representing a marked improvement over traditional designs. The improved heat sink geometry, particularly the fins on the inner surface, effectively enhances airflow and avoids stagnant areas. Consequently, hot spots, a feature present in traditional heat sinks, are almost completely eliminated.

[0064] Quantitative analysis shows that the heat sink of this invention reduces the average operating temperature by approximately 2.4°C compared to conventional heat sinks. In power electronics applications, this temperature reduction can significantly improve system reliability, extend the lifespan of semiconductor devices, and reduce the risk of thermal runaway. Furthermore, the uniform temperature distribution ensures no localized stress concentration, reducing the risk of material fatigue or deformation.

[0065] FEA also analyzed the airflow pressure characteristics ( Figure 7 The results show that the design of this invention achieves a more uniform pressure distribution, with a maximum pressure of [value missing]. Although slightly higher than the maximum pressure of 4.297 for conventional radiators. However, the key difference lies in the uniform distribution: the present invention maintains a stable and uniform pressure field in the heat sink channel, eliminates disturbances caused by buoyancy and unnecessary backflow effects, ensures a stable cooling process and achieves consistent convective heat transfer.

[0066] It is important to note that the slight increase in pressure is not a drawback, but rather indicates more thorough contact between the air and the heatsink surface. By effectively guiding cooling air through the fins, this invention maximizes the utilization of available airflow, achieving enhanced convective heat transfer without increasing fan speed or airflow velocity, thereby maintaining system efficiency.

[0067] In summary, the FEA results validate the technical advantages of the heat sink of this invention compared to traditional rectangular designs: lower and more uniform operating temperature, stable and optimized airflow distribution, resulting in improved thermal management efficiency and increased material utilization. This embodiment is particularly suitable for demanding power electronics applications that are sensitive to reliability, efficiency, and cost.

[0068] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A radiator with a finned structure, characterized in that, Define the +Z vector as representing the upward direction and the -Z vector as representing the downward direction; +X indicates the right direction, -X indicates the left direction; -Y indicates the front direction, +Y indicates the rear direction; the heat sink includes: A base located on the XY plane supports several evenly distributed vertical heat sinks, which form a first separation channel on the YZ plane; each heat sink is equipped with a single fin on its inner surface facing the -Y vector direction, and each heat sink has a protruding structure at its end facing the +X direction; The fins extend from the apex of the +Z vector of the heat sink to the XZ plane. The fins rotate a preset angle relative to the +X vector. When the forced cooling fluid flows along the +X direction, it is guided towards the base through the fins. The negative rotation preset angle is set between –10° and –55° depending on the size of the radiator and the airflow rate; there are no blades on the XZ plane facing the +Y direction. The winglet includes a flow guide groove and baffles disposed on both sides of the flow guide groove; The length of the fins is set between 5 and 20 mm according to the spacing between the heat sinks and the airflow requirements; The width of the protruding structure in the Y-vector direction is 0.2-2.5 times the width of the winglet, in order to pressurize the forced cooling fluid; The length of the protrusion structure in the X-vector direction is between one-sixth and one-eighth of the length of the heat sink; A second separation channel is formed between the protruding structures, and the width of the second separation channel in the Y vector direction is between 0.1 and 0.5 times the width of the first separation channel; The protruding structure is at an inclined angle at the connection point with the heat sink.

2. A radiator with a finned structure according to claim 1, characterized in that, The baffle near the heatsink is fixedly attached to the heatsink.

3. A finned radiator according to any one of claims 1-2, characterized in that, Fixed sidewalls are installed on both sides of the radiator in the Y-vector direction; The wing is configured as a rectangular thin sheet, a trapezoidal structure, or an L-shaped structure.

Images