A film stripping and cleaning device for PCB production

Abstract

The application discloses a film stripping and cleaning device for PCB production and belongs to the technical field of integrated circuit manufacturing. The device comprises a support frame, a roller conveying module arranged on the support frame, and two groups of spraying modules arranged in the support frame. The spraying module comprises a liquid inlet pipe, the liquid inlet pipe is fixedly connected to the support frame, the liquid inlet pipe and the support frame are rotationally connected with symmetrically distributed spraying pipes, the spraying pipes are fixedly connected with connecting gears, symmetrically distributed rack frames are slidingly connected to the support frame, the connecting gears are engaged with the corresponding rack frames, and a pushing assembly is arranged on the support frame. The connecting gears drive the corresponding rotating liquid pipes to reciprocatingly swing, the rotating liquid pipes drive the nozzles on the rotating liquid pipes to synchronously swing, the cleaning position of the nozzles on the rotating liquid pipes on the line board is continuously changed, and the cleaning uniformity of the line board by the nozzles is improved.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a film removal and cleaning device for PCB circuit board production. Background Technology

[0002] A printed circuit board (PCB) is an indispensable core component in electronic devices. It is mainly used to connect various electronic components and realize the signal transmission and functional control of circuits. During the manufacturing process of PCBs, one or more protective films, such as solder resist and photoresist, are applied to the surface to protect the circuits and components. However, these films need to be removed in subsequent processing or use. For example, during soldering, component mounting, or signal testing, residual films may affect the performance and reliability of the circuit. The main purpose of decoction cleaning is to remove the protective film or other residual substances from the surface of the PCB, ensuring the cleanliness and functionality of the PCB surface, avoiding short circuits, signal interference, or other malfunctions caused by residues, thereby improving the reliability and service life of the PCB.

[0003] Existing decoction cleaning machines mainly work by spraying cleaning fluid onto the top and bottom sides of the circuit board, using chemical action to dissolve and peel off the protective film and attached impurities on its surface. However, because the nozzle position and spray angle are fixed, the coverage and impact direction of the cleaning fluid lack flexibility, resulting in cleaning blind spots in areas with complex circuit layouts or solder joint protrusions. These dead corners are difficult to be adequately flushed by the fluid flow, resulting in the protective film not being completely removed and impurities easily remaining in them. This not only affects the cleanliness and insulation performance of the circuit board, but also causes defects in subsequent processes. Summary of the Invention

[0004] In order to overcome the shortcomings mentioned in the background art, the present invention provides a film removal and cleaning device for PCB circuit board production.

[0005] Technical Solution: A PCB manufacturing stripping and cleaning device includes a support frame, on which a roller conveyor module for stably conveying the PCB is mounted. Two sets of spray modules are symmetrically distributed vertically within the support frame. Each spray module includes an inlet pipe, which is fixedly connected to the support frame. Symmetrically distributed spray pipes are rotatably connected to the inlet pipe and the support frame, and are connected to the inlet pipes. Connecting gears are fixedly connected to each spray pipe. Symmetrically distributed racks are slidably connected within the support frame, and the connecting gears mesh with corresponding racks. A pushing component is mounted on the support frame to drive the movement of all racks within the corresponding spray modules.

[0006] Furthermore, the spray pipe is composed of a rotating liquid pipe, a nozzle assembly, and several first flexible pipes. The rotating liquid pipe is sealed and rotatably connected to the liquid inlet pipe and communicates with it. The rotating liquid pipe is limited and slidably connected to the nozzle assembly. Several first flexible pipes are fixedly connected and communicate between the rotating liquid pipe and the adjacent nozzle assembly.

[0007] Furthermore, two symmetrically distributed limiting frames are fixedly connected to each position of the support frame near the nozzle assembly, and the nozzle assembly slides within the corresponding two limiting frames.

[0008] Furthermore, the pushing component includes a first servo motor, which is fixedly connected to the support frame. The output shaft of the first servo motor is fixedly connected to a lead screw that is rotatably connected to the support frame. A support shaft that is slidably connected to the corresponding rack is fixedly connected to the support frame. The lead screw and the corresponding rack are threadedly connected.

[0009] Furthermore, the lead screw above the support frame is provided with symmetrically distributed threaded portions, and the symmetrically distributed threaded portions on the lead screw are respectively threadedly connected to the corresponding rack frame.

[0010] Furthermore, a water curtain nozzle is fixedly connected between the support frame and the liquid inlet pipe above, the water curtain nozzle is connected to the liquid inlet pipe, and the water curtain nozzle is located in the middle of adjacent and symmetrically distributed spray pipes.

[0011] Furthermore, the support frame is provided with a plurality of inclined nozzle groups, the nozzle positions of the plurality of inclined nozzle groups are offset from the nozzle positions of the upper nozzle group, the plurality of inclined nozzle groups are all located between the roller conveying module and the upper spraying module, a connecting pipe is fixedly connected in the support frame, the inclined nozzle groups are fixedly connected to the connecting pipe and connected by a second flexible pipe, and the connecting pipe is connected to the liquid inlet pipe.

[0012] Furthermore, a three-way solenoid valve is provided at the connection point between the connecting pipe and the liquid inlet pipe to control the opening state of the tilting nozzle assembly and the nozzle assembly.

[0013] Furthermore, a support frame is fixedly connected inside the support frame, and several of the tilting nozzle groups are slidably connected to the support frame. A drive component for moving all the tilting nozzle groups is provided inside the support frame.

[0014] Furthermore, the drive assembly includes a second servo motor, which is fixedly connected to the support frame. The output shaft of the second servo motor is fixedly connected to a take-up shaft that is rotatably connected to the support frame. Each of the several tilting nozzle groups is fixedly connected to the take-up shaft with a pull rope. An elastic element is provided between the tilting nozzle group and the support frame.

[0015] The beneficial effects of the present invention are as follows: 1. The present invention drives the corresponding rotating liquid pipe to swing back and forth through the connecting gear. The swinging of the rotating liquid pipe drives the nozzle group on it to swing synchronously, thereby continuously changing the cleaning position of the nozzle group on the circuit board, thereby improving the cleaning uniformity of the circuit board by the multiple nozzle groups.

[0016] 2. The limit frame pushes the nozzle group to slide along the adjacent rotating liquid pipe, which compensates for the change in the spray distance to the circuit board during the deflection of the nozzle group, ensures that the rinsing distance of the nozzle group to the circuit board is consistent, and improves the cleaning efficiency of the circuit board.

[0017] 3. By reversing the rotation direction of the rotating liquid pipes on both sides of the circuit board, a rinsing water flow is formed from the middle to both sides of the circuit board, thereby reducing the residual degree of protective film and impurities on the upper side of the circuit board. At the same time, the water curtain nozzle in the middle compensates for the rinsing dead corner of the nozzle group, further improving the efficiency of film removal and cleaning of the circuit board.

[0018] 4. By staggering the positions of the flushing fluid nozzles of several tilting nozzle groups and nozzle groups, the cleaning dead angles at the solder joints of the circuit board are reduced, and the nozzle groups and tilting nozzle groups alternately flush the circuit board, avoiding the mutual influence of the two flushing water streams, and further improving the stripping and cleaning efficiency of the circuit board.

[0019] 5. Several pull ropes are released by winding up the reel, causing the tilting nozzle assembly to slide back and forth along the support frame, thereby continuously changing the rinsing position of the tilting nozzle assembly on the circuit board and improving the uniformity of rinsing the circuit board by the tilting nozzle assembly. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a three-dimensional cross-sectional view of the support frame of the present invention;

[0022] Figure 3 This is a three-dimensional structural diagram of the connecting gear and rack frame of the present invention;

[0023] Figure 4 This is a three-dimensional structural diagram of the rotating liquid pipe and nozzle assembly of the present invention;

[0024] Figure 5 This is a three-dimensional structural diagram of the lead screw and support shaft of the present invention;

[0025] Figure 6 This is a three-dimensional structural diagram of the tilting nozzle assembly of the present invention;

[0026] Figure 7 This is a three-dimensional structural diagram of the winding shaft of the present invention.

[0027] Explanation of reference numerals in the attached drawings: 1-Support frame, 2-Roller conveyor module, 3-Liquid inlet pipe, 4-Spray pipe, 5-Connecting gear, 6-Rack frame, 201-Rotating liquid pipe, 202-Nozzle assembly, 203-First flexible pipe, 204-Limiting frame, 301-First servo motor, 302-Lead screw, 303-Support shaft, 304-Water curtain nozzle, 401-Inclined nozzle assembly, 402-Connecting pipe, 403-Second flexible pipe, 404-Three-way solenoid valve, 405-Support frame, 501-Second servo motor, 502-Rewinding shaft, 503-Pull rope, 504-Elastic element. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely for explaining the invention and are not intended to limit the invention.

[0029] Existing film removal and cleaning machines use fixed nozzles to spray water from top to bottom. Because the spray angle and range are not adjustable, it is difficult to cover complex circuits or solder joint protrusions, which can easily create cleaning dead corners. The protective film and impurities remain, affecting the cleanliness and insulation of the board surface, which may lead to defects in subsequent processes, reduce the cleaning effect and product yield.

[0030] Example 1: This example provides a PCB circuit board production film removal and cleaning device to achieve uniform film removal and cleaning of circuit boards.

[0031] like Figures 1-3As shown, the system includes a support frame 1, on which a roller conveyor module 2 is mounted for stabilizing the transport of circuit boards. The roller conveyor module 2 is existing technology and is used to stabilize the transport of circuit boards from right to left. A cleaning fluid recovery device (not shown) is located at the bottom of the support frame 1. Two sets of spray modules are symmetrically distributed vertically within the support frame 1. The roller conveyor module 2 is located between the two spray modules. Each spray module includes an inlet pipe 3, which is connected to an external cleaning fluid injection device. The inlet pipe 3 is fixedly connected to the support frame 1. The inlet pipe 3 and the support frame 1 are connected together. Four spray pipes 4 are symmetrically distributed and rotatably connected. Each of the four spray pipes 4 is connected to an adjacent liquid inlet pipe 3. A connecting gear 5 is fixedly connected to the right end of each spray pipe 4. Two rack frames 6 are symmetrically distributed and slidably connected inside the support frame 1. Each rack frame 6 controls two spray pipes through two connecting gears 5. That is, two spray pipes 4 are divided into a group. The connecting gear 5 meshes with the corresponding rack frame 6. The rack frame 6 can drive the corresponding spray pipe 4 to swing through the connecting gear 5. A push component is provided on the support frame 1 to drive the movement of all rack frames 6 in the corresponding spray module.

[0032] like Figures 2-4 As shown, the spray pipe 4 consists of a rotating liquid pipe 201, a nozzle assembly 202, and several first flexible pipes 203. The rotating liquid pipe 201 is sealed and rotatably connected to the inlet pipe 3 and is in communication with it. The rotating liquid pipe 201 is limited and slidably connected to the nozzle assembly 202. The first flexible pipes 203 have a margin to accommodate changes in the position of the nozzle assembly 202. Several first flexible pipes 203 are fixedly connected and communicate between the rotating liquid pipe 201 and the adjacent nozzle assembly 202. Two symmetrically distributed limiting frames 204 are fixedly connected in the support frame 1 near the nozzle assembly 202. The number of limiting frames 204 is twice that of the nozzle assembly 202. The limiting frames 204 have an arc-shaped structure and the opening of the limiting frames 204 faces directly downwards. They are used to squeeze the corresponding nozzle assembly 202 to slide along the adjacent rotating liquid pipe 201. When the nozzle assembly 202 is at the top of the limiting frame 204, the nozzle assembly 202 sprays vertically toward the circuit board and slides within the corresponding two limiting frames 204.

[0033] Working principle: When cleaning the circuit board is required, the operator activates the roller conveyor module 2, which transports the circuit board from right to left. Then, the operator injects cleaning fluid into the two inlet pipes 3. The cleaning fluid enters the four rotating liquid pipes 201 along the inlet pipes 3. The cleaning fluid in the rotating liquid pipes 201 then enters the nozzle assembly 202 along several first flexible pipes 203. The cleaning fluid is then sprayed out along the nozzle assembly 202. Simultaneously, two pushing components are activated, causing the pushing components to drive two adjacent rack frames 6 to reciprocate along the support frame 1. The rack frames 6 rotate via adjacent connecting gears 5. The liquid pipe 201 oscillates back and forth, and the oscillation of the liquid pipe 201 drives the nozzle group 202 on it to oscillate synchronously, thereby continuously changing the cleaning position of the nozzle group 202 on the circuit board, thereby improving the cleaning uniformity of the circuit board by the nozzle group 202. Then, the staff begins to place the circuit board on the right side of the support frame 1 onto the roller conveyor module 2 in sequence, and place the circuit board in the center. The roller conveyor module 2 drives the circuit board to move from right to left. During this period, the two spray modules rinse the upper and lower surfaces of the circuit board respectively. This continues until the circuit board moves to the left side of the support frame 1. At this point, the circuit board defilming and cleaning is completed.

[0034] When the rotating liquid pipe 201 drives the nozzle assembly 202 on it to swing synchronously, the nozzle assembly 202 slides synchronously along the adjacent limiting frame 204. Taking the initial position of the nozzle assembly 202 on one side of the limiting frame 204 as an example, the rotating liquid pipe 201 drives the nozzle assembly 202 to swing, changing the spray position of the cleaning fluid on the circuit board. During the deflection process of the rotating liquid pipe 201, the nozzle assembly 202 gradually changes from tilting to vertical to rinse the circuit board, and then continues to deflect to the other side to tilt in the opposite direction to impact the circuit board. During the above process, the nozzle assembly 202 slides upward along the rotating liquid pipe 201 under the limitation of the limiting frame 204. When the nozzle assembly 202 is vertically facing the circuit board, the nozzle assembly 202 slides downward along the rotating liquid pipe 201, thereby compensating for the change in the spray distance of the nozzle assembly 202 on the circuit board during the deflection process, ensuring that the rinsing distance of the nozzle assembly 202 on the circuit board remains consistent, and improving the cleaning efficiency of the circuit board. This process is repeated until the circuit board cleaning is completed.

[0035] After the circuit board is cleaned and the film removed, the staff turns off the roller conveyor module 2 and the pushing component, and stops injecting cleaning fluid into the liquid inlet pipe 3. When the circuit board needs to be cleaned again, the above steps are repeated.

[0036] Example 2: This example provides a PCB circuit board production film removal and cleaning device, which is a further improvement on Example 1.

[0037] When removing the protective film from a circuit board, existing removal and cleaning devices place the circuit board horizontally and the water flow is vertical. After contacting the circuit board, the water spreads outwards, which cannot guide the protective film and impurities on it. As a result, the protective film and impurities on the upper side are difficult to separate from the circuit board with the help of the water flow, thus affecting the removal and cleaning efficiency of the circuit board.

[0038] like Figure 2 and Figure 5 As shown, the driving component includes a first servo motor 301, which is fixedly connected to the support frame 1. The output shaft of the first servo motor 301 is fixedly connected to a lead screw 302 that is rotatably connected to the support frame 1. A support shaft 303 is fixedly connected to the support frame 1 and slidably connected to two corresponding racks 6. The lead screw 302 is threadedly connected to the two corresponding racks 6. The upper lead screw 302 inside the support frame 1 has two symmetrically distributed threaded portions. The two symmetrically distributed threaded portions on the upper lead screw 302 are threadedly connected to the corresponding racks 6, respectively, to drive the two racks 6 to move in opposite directions, so as to realize the movement of two adjacent sets of racks 6. The reverse movement of the spray pipe 4 causes the nozzle group 202 of the two spray pipes 4 to swing in opposite directions, thereby forming a rinsing water flow from the middle to both sides of the circuit board, which reduces the residual degree of protective film and impurities on the side of the circuit board. The rack frame 6 is threadedly connected to the corresponding threaded part on the lead screw 302. A water curtain nozzle 304 is fixedly connected between the support frame 1 and the upper liquid inlet pipe 3. The water curtain nozzle 304 is connected to the liquid inlet pipe 3 and is located in the middle of the four adjacent and symmetrically distributed spray pipes 4. The water curtain nozzle 304 is used to rinse the middle of the circuit board with vertical water flow to compensate for the rinsing dead angle of the nozzle group 202 and further improve the stripping and cleaning efficiency of the circuit board.

[0039] Working principle: During the circuit board cleaning process, two first servo motors 301 are activated. At this time, the output shaft of the upper first servo motor 301 drives two adjacent symmetrically distributed rack frames 6 to reciprocate in opposite directions via the lead screw 302. This enables the two rack frames 6 to drive the rotating liquid pipe 201 to rotate through the four connecting gears 5, thereby realizing the oscillation of the nozzle group 202. Since the two rack frames 6 move in opposite directions, that is, the deflection directions of the two nozzle groups 202 corresponding to the two rack frames 6 are opposite, when all the nozzle groups 202 are flushing the circuit board from vertical to the edge of the circuit board... During lateral deflection, a flushing force is generated from the middle to both sides of the circuit board. This force, combined with the flushing force of the nozzle assembly 202, pushes the protective film and impurities away from the circuit board. Simultaneously, the cleaning fluid in the inlet pipe 3 enters the water curtain nozzle 304. The cleaning fluid in the water curtain nozzle 304 washes and falls into the middle of the circuit board, flowing to both sides of the circuit board. This compensates for the dead angles of the nozzle assembly 202's impact on the protective film and impurities, further improving the separation efficiency of the protective film and impurities from the circuit board. This process continues until the circuit board is cleaned and the film removal is completed. Then, the two first servo motors 301 are turned off. When the circuit board needs to be flushed again, the above steps are repeated.

[0040] Example 3: This example provides a film removal and cleaning device for PCB circuit board production, which is a further improvement on Example 2.

[0041] During the circuit board manufacturing process, the solder joint protrusions left after soldering can hinder the removal of protective film and impurities, making it difficult for the cleaning fluid to effectively carry these substances. This not only prevents the complete peeling of the protective film, but may also lead to impurity residue, thereby reducing the overall efficiency of circuit board stripping and cleaning, and affecting the quality and reliability of subsequent processes.

[0042] like Figure 6 and Figure 7 As shown, the nozzles of all the nozzle groups 202 above and the nozzles of all the inclined nozzle groups 401 are distributed in a staggered manner on the circuit board. Several inclined nozzle groups 401 are arranged inside the support frame 1. The actual spray positions of the several inclined nozzle groups 401 and the nozzle groups 202 are staggered. The spray direction of the flushing liquid from the inclined nozzle groups 401 is towards the lower right. The several inclined nozzle groups 401 are located between the roller conveyor module 2 and the upper spray module. A connecting pipe 402 is fixedly connected inside the support frame 1. The tilting nozzle assembly 401 is fixedly connected to the connecting pipe 402 and is connected to a second flexible pipe 403. The connecting pipe 402 is connected to the liquid inlet pipe 3. A three-way solenoid valve 404 is provided at the connection between the connecting pipe 402 and the liquid inlet pipe 3 to control the opening state of the tilting nozzle assembly 401 and the nozzle assembly 202. The three-way solenoid valve 404 is used to alternately guide the water flow in the liquid inlet pipe 3 into the nozzle assembly 202 and the tilting nozzle assembly 401, so that the two alternately flush the circuit board and avoid the mutual influence of the two water flows.

[0043] Working principle: During the stripping and cleaning process of the circuit board, when the nozzle assembly 202 swings from a vertical position to the edge of the circuit board to its limit position and begins to return to its original position, the three-way solenoid valve 404 is opened. This disconnects the connection between the rotating liquid pipes 201 and the water curtain nozzles 304 and the external cleaning fluid injection device, while connecting the connecting pipe 402 to the external cleaning fluid injection device. At this moment, the cleaning fluid in the inlet pipe 3 enters the connecting pipe 402, and the cleaning fluid in the connecting pipe 402 flows along the several second flexible pipes 403. The corresponding tilted nozzle group 401 is inserted, so that the rinsing direction of the tilted nozzle group 401 on the circuit board is perpendicular to the rinsing direction of the nozzle group 202, thereby improving the cleaning efficiency of the protective film around the solder joints. By perpendicularly intersecting the rinsing direction of the nozzle group 202 on the circuit board with the rinsing direction of the tilted nozzle group 401 on the circuit board, the cleaning dead angle at the solder joints of the circuit board is reduced. Furthermore, the nozzle group 202 and the tilted nozzle group 401 alternately rinse the circuit board, avoiding the mutual influence of the two rinsing water streams, and further improving the film removal and cleaning efficiency of the circuit board.

[0044] When the nozzle assembly 202 swings back to its limit and begins to switch direction from the center of the circuit board to its edge, the three-way solenoid valve 404 disconnects the connection between the connecting pipe 402 and the external cleaning fluid injection device, and connects several rotating liquid pipes 201 and water curtain nozzles 304 to the external cleaning fluid injection device. This process is repeated until the circuit board decoction cleaning is completed. When the circuit board needs to be rinsed again, the above steps are repeated.

[0045] Example 4: This example provides a PCB circuit board production film removal and cleaning device, which is a further improvement on Example 3.

[0046] like Figure 6 and Figure 7 As shown, a support frame 405 is fixedly connected inside the support frame 1. Several tilting nozzle groups 401 are slidably connected to the support frame 405. Each tilting nozzle group 401 can slide along the support frame 405 to change its rinsing position on the circuit board. The second flexible tube 403 has a margin to accommodate the position change of the corresponding tilting nozzle group 401. A drive assembly for moving all tilting nozzle groups 401 is provided inside the support frame 1. The drive assembly includes a second servo motor 501, which is fixedly connected to the support frame. Inside the frame 1, the output shaft of the second servo motor 501 is fixedly connected to a take-up shaft 502 that is rotatably connected to the support frame 1. Several tilting nozzle groups 401 are fixedly connected to pull ropes 503 between themselves and the take-up shaft 502. The output shaft of the second servo motor 501 can take up all the pull ropes 503 through the take-up shaft 502, thereby pulling the tilting nozzle group 401 to move. An elastic element 504 is provided between the tilting nozzle group 401 and the support frame 405. The elastic element 504 is a spring, which is used to drive the adjacent tilting nozzle group 401 to reset.

[0047] Working principle: When the circuit board begins to be de-filmed and cleaned, the second servo motor 501 is turned on, causing the output shaft of the second servo motor 501 to drive the take-up shaft 502 to rotate. The take-up shaft 502 winds up several pull ropes 503, which pull the corresponding tilting nozzle group 401 to slide along the support frame 405. At the same time, the elastic element 504 is compressed. When the tilting nozzle group 401 slides to its limit position along the support frame 405, the output shaft of the second servo motor 501 drives the take-up shaft 502 to start rotating in the opposite direction. The take-up shaft 502 releases several pull ropes 503. At this time, under the restoring force of the elastic element 504, the corresponding tilting nozzle group 401 is pushed to return to its original position. This achieves the reciprocating motion of the tilting nozzle group 401, thereby continuously changing the rinsing position of the tilting nozzle group 401 on the circuit board and improving the uniformity of rinsing the circuit board. This cycle continues until the circuit board de-filming and cleaning is completed. Then, the second servo motor 501 is turned off. When the circuit board needs to be rinsed again, the above steps are repeated.

[0048] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A PCB circuit board production film removal and cleaning device, comprising a support frame (1), wherein a roller conveying module (2) for stably conveying the circuit board is provided on the support frame (1), characterized in that, The support frame (1) is provided with two sets of spray modules symmetrically distributed vertically. Each spray module includes an inlet pipe (3), which is fixedly connected to the support frame (1). The inlet pipe (3) and the support frame (1) are rotatably connected to symmetrically distributed spray pipes (4). The spray pipes (4) are connected to the inlet pipe (3). The spray pipes (4) are fixedly connected to a connecting gear (5). The support frame (1) is slidably connected to symmetrically distributed racks (6). The connecting gear (5) meshes with the corresponding racks (6). The support frame (1) is provided with a pushing component for driving the movement of all the racks (6) in the corresponding spray module. The spray pipe (4) is composed of a rotating liquid pipe (201), a nozzle group (202) and a plurality of first flexible pipes (203). The rotating liquid pipe (201) is sealed and rotatably connected to the liquid inlet pipe (3) and communicates with it. The rotating liquid pipe (201) is limited and slidably connected to the nozzle group (202). The plurality of first flexible pipes (203) are fixedly connected and communicate between the rotating liquid pipe (201) and the adjacent nozzle group (202). Two symmetrically distributed limiting frames (204) are fixedly connected to each position of the support frame (1) near the nozzle assembly (202), and the nozzle assembly (202) slides within the corresponding two limiting frames (204); A water curtain nozzle (304) is fixedly connected between the support frame (1) and the liquid inlet pipe (3) above. The water curtain nozzle (304) is connected to the liquid inlet pipe (3). The water curtain nozzle (304) is located in the middle of the adjacent and symmetrically distributed spray pipes (4). The support frame (1) is provided with a plurality of inclined nozzle groups (401), the nozzle positions of the plurality of inclined nozzle groups (401) are offset from the nozzle positions of the upper nozzle group (202), the plurality of inclined nozzle groups (401) are all located between the roller conveying module (2) and the upper spraying module, a connecting pipe (402) is fixedly connected in the support frame (1), the inclined nozzle groups (401) and the connecting pipe (402) are fixedly connected and connected by a second flexible pipe (403), the connecting pipe (402) is connected to the liquid inlet pipe (3); A three-way solenoid valve (404) is provided at the connection point between the connecting pipe (402) and the liquid inlet pipe (3) to control the opening state of the tilting nozzle assembly (401) and the nozzle assembly (202).

2. The PCB circuit board production film removal and cleaning device according to claim 1, characterized in that, The pushing component includes a first servo motor (301), which is fixedly connected to the support frame (1). The output shaft of the first servo motor (301) is fixedly connected to a lead screw (302) that is rotatably connected to the support frame (1). The support frame (1) is fixedly connected to a support shaft (303) that is slidably connected to the corresponding rack frame (6). The lead screw (302) is threadedly connected to the corresponding rack frame (6).

3. A PCB circuit board production film removal and cleaning device according to claim 2, characterized in that, The upper lead screw (302) inside the support frame (1) is provided with symmetrically distributed threaded parts, and the symmetrically distributed threaded parts on the upper lead screw (302) are respectively threadedly connected to the corresponding rack frame (6).

4. A PCB circuit board production film removal and cleaning device according to claim 3, characterized in that, A support frame (405) is fixedly connected inside the support frame (1), and several tilting nozzle groups (401) are slidably connected to the support frame (405). A drive component for driving all the tilting nozzle groups (401) to move is provided inside the support frame (1).

5. A PCB circuit board production film removal and cleaning device according to claim 4, characterized in that, The drive assembly includes a second servo motor (501), which is fixedly connected to the support frame (1). The output shaft of the second servo motor (501) is fixedly connected to a take-up shaft (502) that is rotatably connected to the support frame (1). A pull rope (503) is fixedly connected between each of the inclined nozzle groups (401) and the take-up shaft (502). An elastic element (504) is provided between the inclined nozzle group (401) and the support frame (405).

Images