Industrial mineral shell fixing rock bonding inorganic resin and preparation process thereof

Abstract

The invention discloses industrial mineral shell fixing rock bonding inorganic resin and a preparation process, belongs to the field of mineral engineering materials, and aims to solve the problem that part of existing bonding agents for shell fixing rock have many defects in the aspect of bonding performance in a humid environment, and the safety and high efficiency of mining operation are seriously influenced. The adhesive comprises the following components: 30-50 parts of inorganic epoxy resin; 10-20 parts of a water-based curing agent; 5 to 10 parts of nano silicon dioxide; 3-8 parts of redispersible latex powder; 1-3 parts of a thickening agent; 0.5 to 1.5 parts of a defoaming agent; and 20-40 parts of water. The whole preparation process comprises the following five steps: basic dispersion, enhanced filling, film construction, cross-linking reaction and viscosity optimization to form a closed loop. Through carefully designed formula components, synergistic effects of all the components and tight cooperation of scientific and reasonable process steps, the defects of the existing mining adhesive in a humid environment are comprehensively overcome, and a reliable shell-fixing rock reinforcing material is provided for mining.

Description

Technical Field

[0001] This invention belongs to the field of mining engineering materials, specifically, it relates to an inorganic resin for bonding solidified rock in industrial mining and its preparation process. Background Technology

[0002] In the complex and challenging environment of mining, the stability of solidified rock is a key factor in ensuring safe production. Adhesives play a crucial role in the reinforcement of solidified rock. However, some existing adhesives for solidified rock exhibit numerous defects in their bonding performance under humid conditions, severely impacting the safety and efficiency of mining operations.

[0003] First, in humid environments, the bonding strength of some existing adhesives decreases significantly. The presence of water interferes with the chemical bonding and physical adsorption processes between the adhesive and the solid rock surface. Water molecules are polar and preferentially adsorb onto the solid rock surface, hindering the direct contact and reaction between the active ingredients in the adhesive and the rock surface, resulting in ineffective bonding. For example, some organic polymer-based adhesives can form good adhesion to rock surfaces in dry environments, but in humid environments, due to the competitive adsorption of water molecules, the contact area between the polymer chains and the rock surface decreases, and the intermolecular forces weaken, thus greatly reducing the bonding strength. This makes it impossible to effectively bond the solid rock particles together firmly, which can easily lead to rock loosening and detachment during mining operations, causing safety accidents.

[0004] Secondly, insufficient water resistance is a major problem with existing adhesives. In humid environments, moisture gradually penetrates the adhesive. Some adhesives swell after absorbing water, damaging their internal structure and thus losing their ability to bond to the solidified rock. For example, some water-soluble adhesives, while initially showing some bonding effect, gradually dissolve or soften as moisture penetrates over time and under the continued influence of humid environments, resulting in a sharp decline in bonding performance and an inability to maintain the stable structure of the solidified rock. Furthermore, moisture can trigger hydrolysis in the adhesive, damaging its chemical structure and further weakening its bonding performance. For adhesives containing easily hydrolyzed groups such as esters and amides, water molecules attack these groups in humid environments, causing hydrolysis and leading to performance degradation.

[0005] Furthermore, the curing speed of some existing adhesives is significantly affected by humid environments. The curing process is crucial for the adhesive's bonding performance, but moisture in a humid environment can interfere with the curing reaction. For example, for some adhesives that cure through chemical reactions, moisture may participate in the reaction as an impurity, altering the reaction pathway or rate, leading to incomplete curing. This is especially true for adhesives that rely on moisture evaporation for curing; in humid environments, moisture is difficult to evaporate, and the curing process almost stops, leaving the adhesive in an uncured or semi-cured state for extended periods. This prevents it from providing sufficient bonding strength to reinforce solid rock and hinders the progress of mining operations.

[0006] Furthermore, humid environments are often accompanied by temperature fluctuations, and the bonding performance of some existing adhesives fluctuates repeatedly under these alternating temperature and humidity conditions. When the temperature rises, the adhesive may soften, reducing its bonding strength; when the temperature drops, it may become brittle, easily cracking and further reducing the bonding effect. Moreover, this cyclical change in temperature and humidity accelerates the aging of the adhesive, gradually damaging its internal structure and causing a continuous decline in bonding performance, making it difficult to maintain the reinforced state of the solidified rock in the long term.

[0007] In summary, some existing adhesives for solidified rock exhibit numerous drawbacks in humid environments, including decreased bond strength, insufficient water resistance, affected curing speed, and poor adaptability to temperature and humidity changes. These problems not only pose safety hazards to mining operations but may also lead to a series of issues such as low mining efficiency and increased costs. Therefore, there is an urgent practical need to develop an industrial mining inorganic resin for bonding solidified rock that can maintain good bonding performance in humid environments. Summary of the Invention

[0008] The purpose of this invention is to provide an inorganic resin for bonding solid rock in industrial mining, and its preparation process, which effectively solves the problems mentioned in the background art, such as decreased bonding strength, insufficient water resistance, and affected curing speed of existing adhesives in humid environments.

[0009] To achieve the above-mentioned technical objectives, the technical solution adopted by the present invention is as follows:

[0010] The inorganic resin for bonding solidified rock in industrial mining comprises the following components by weight: 30-50 parts inorganic epoxy resin; 10-20 parts water-based curing agent; 5-10 parts nano-silica; 3-8 parts redispersible latex powder; 1-3 parts thickener; 0.5-1.5 parts defoamer; and 20-40 parts water.

[0011] This invention also provides a preparation process for an inorganic resin for bonding solidified rock in industrial mining, comprising the following steps:

[0012] Step 1: Add inorganic epoxy resin and water to the reaction vessel, stir evenly at a speed of 200-300 r / min for 10-15 min;

[0013] Step 2: Add nano-silica to the mixture obtained in Step 1, and continue stirring for 15-20 minutes at a stirring speed of 300-400 r / min;

[0014] Step 3: Add redispersible latex powder and stir for 10-15 minutes at a speed of 200-300 rpm;

[0015] Step 4: Slowly add the water-based curing agent to the above mixture while stirring at a speed of 100-200 r / min. After the addition is complete, continue stirring for 10-15 min.

[0016] Step 5: Add thickener and defoamer, stir evenly at a speed of 150-250 r / min for 10-15 min to obtain industrial mining solid rock bonding inorganic resin.

[0017] Using the above preparation process, after gradually constructing a three-dimensional network structure in step four, nano-silica and redispersible latex powder play an auxiliary role in the system. The presence of nano-silica enhances the density of the network structure, and the polymer film formed by the redispersible latex powder interweaves with the epoxy resin network, jointly improving the bonding strength and water resistance of the adhesive in humid environments. This effectively solves the technical problems mentioned in the background art, such as the decrease in bonding strength, insufficient water resistance, and the impact on curing speed of existing adhesives in humid environments.

[0018] Compared with the prior art, the present invention has the following advantages: First, it has better environmental performance. The water-based compound of the present invention uses water as a solvent and does not contain organic solvents, thus avoiding the environmental pollution and flammable and explosive safety hazards caused by organic solvents.

[0019] Secondly, it has excellent bonding performance. By rationally selecting inorganic epoxy resin, water-based curing agent, and adding additives such as nano silica and redispersible latex powder, the mixture has good bonding force to the solid rock and can effectively improve the stability of the solid rock.

[0020] Third, it has strong water resistance and weather resistance. The addition of nano-silica enhances the network structure of the compound, improving its water resistance and weather resistance, and can adapt to the humid and variable environment underground.

[0021] Fourth, the preparation process is simple. The preparation process of this invention is simple to operate, does not require high-end equipment, has low production costs, and is suitable for large-scale industrial production. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below with reference to embodiments.

[0023] The industrial mining solid rock bonding inorganic resin, by weight, comprises the following components:

[0024] 30-50 parts of inorganic epoxy resin;

[0025] 10-20 parts of water-based curing agent;

[0026] 5-10 parts of nano-silica;

[0027] 3-8 parts of redispersible latex powder;

[0028] Thickener 1-3 parts;

[0029] 0.5-1.5 parts of defoamer;

[0030] 20-40 parts water.

[0031] Furthermore, the inorganic epoxy resin is a bisphenol A type inorganic epoxy resin with an epoxy value of 0.1-0.3 eq / 100g. Bisphenol A type inorganic epoxy resin contains epoxy groups in its molecular structure, which can chemically react with active sites on the rock surface to form chemical bonds, thereby improving adhesion strength. In humid environments, the interaction between epoxy resin molecules and water molecules is weak, and the bonding force with the rock surface will not be significantly reduced due to competitive adsorption of water molecules, effectively solving the problem of decreased adhesion strength of existing adhesives in humid environments.

[0032] Furthermore, the water-based curing agent is a modified fatty amine water-based curing agent with an amine value of 200-400 mgKOH / g. When added, the modified fatty amine water-based curing agent, through process control, undergoes a cross-linking reaction with the inorganic epoxy resin to form a three-dimensional network structure, enhancing the overall performance of the adhesive. In humid environments, its curing reaction with the epoxy resin is less affected by moisture, allowing for normal curing and ensuring the adhesive quickly achieves high bonding strength even in humid environments, thus solving the problem of existing adhesives having reduced curing speed in humid conditions.

[0033] Furthermore, the particle size of nano-silica is 20-50 nm. By controlling the particle size to 20-50 nm, nano-silica possesses a huge specific surface area and surface energy, enabling it to be uniformly dispersed in water-based adhesives and fill the network structure of epoxy resin, thus playing a role in reinforcement and toughening. In humid environments, there is a certain interaction between nano-silica and water molecules, which can prevent water from further penetrating into the adhesive, while enhancing the physical adsorption of the adhesive to the rock surface, improving water resistance, and solving the problem of insufficient water resistance in existing adhesives.

[0034] Furthermore, the redispersible latex powder is a vinyl acetate-ethylene copolymer redispersible latex powder. This vinyl acetate-ethylene copolymer redispersible latex powder can form a continuous polymer film after moisture evaporation, interpenetrating with the network structure of the epoxy resin to further enhance the adhesive's bonding performance. In humid environments, the film formed by the redispersible latex powder can provide a certain degree of waterproofing, preventing moisture from penetrating the adhesive. Simultaneously, its strong adhesion to rock surfaces helps improve overall bond strength, addressing issues of decreased bond strength and water resistance.

[0035] Furthermore, the thickener is hydroxyethyl cellulose. This adjusts the viscosity of the water-based adhesive, allowing it to better adhere to the solid rock surface in humid environments and preventing it from flowing. Appropriate viscosity ensures uniform distribution of the adhesive on the rock surface, thereby improving the stability and strength of the bond and solving the problem of uneven bonding caused by flowing in humid environments.

[0036] Furthermore, the defoamer is a silicone defoamer. Silicone defoamers effectively eliminate air bubbles introduced by stirring and other operations during preparation and use. In humid environments, the presence of air bubbles can reduce the density and adhesion of the adhesive. The use of defoamers ensures the compactness of the adhesive's internal structure, improving its adhesion performance in humid environments.

[0037] The components of Examples 1, 2, and 3 are compared and analyzed below, as detailed in Tables 1 and 2.

[0038] Example 1,

[0039] Preparation of inorganic resin for bonding solidified rocks in industrial mining:

[0040] Weigh the following components by weight:

[0041] 40 parts of inorganic epoxy resin (bisphenol A type, epoxy value 0.15 eq / 100g);

[0042] 15 parts of water-based curing agent (modified fatty amine water-based curing agent, amine value 300mgKOH / g);

[0043] Eight parts of nano-silica (particle size 30nm);

[0044] 5 parts of vinyl acetate-ethylene copolymer redispersible latex powder;

[0045] 2 parts hydroxyethyl cellulose;

[0046] 1 part silicone defoamer;

[0047] 30 parts water.

[0048] Example 2,

[0049] Preparation of inorganic resin for bonding solidified rocks in industrial mining:

[0050] Weigh the following components by weight:

[0051] 35 parts of inorganic epoxy resin (bisphenol A type, epoxy value 0.2 eq / 100g);

[0052] 13 parts of water-based curing agent (modified fatty amine water-based curing agent, amine value 250mgKOH / g); 6 parts of nano-silica (particle size 40nm);

[0053] Four parts of vinyl acetate-ethylene copolymer redispersible latex powder;

[0054] 1.5 parts hydroxyethyl cellulose;

[0055] 0.8 parts of silicone defoamer;

[0056] 35 parts water.

[0057] Example 3,

[0058] Preparation of inorganic resin for bonding solidified rocks in industrial mining:

[0059] Weigh the following components by weight:

[0060] 45 parts of inorganic epoxy resin (bisphenol A type, epoxy value 0.25 eq / 100g);

[0061] 17 parts of water-based curing agent (modified fatty amine water-based curing agent, amine value 350mgKOH / g); 9 parts of nano-silica (particle size 25nm);

[0062] 7 parts of vinyl acetate-ethylene copolymer redispersible latex powder;

[0063] 2.5 parts hydroxyethyl cellulose;

[0064] 1.2 parts of silicone defoamer;

[0065] 25 parts water.

[0066]

[0067] Table 1

[0068] performance Example 1 Example 2 Example 3 Adhesion performance good Slightly inferior to Example 1 Superior to Example 1 Water resistance good Slightly inferior to Example 1 Superior to Example 1 Weather resistance good Slightly inferior to Example 1 Superior to Example 1 Adhesion durability good Slightly inferior to Example 1 Superior to Example 1

[0069] Table 2

[0070] Comparing Examples 1, 2, and 3, we found that, firstly, regarding bonding performance, Example 1 effectively bonds the solidified rock particles firmly. Due to the reasonable ratio of inorganic epoxy resin and water-based curing agent, as well as the synergistic effect of nano-silica and redispersible latex powder, the decrease in bonding strength is relatively small in humid environments. After 24 hours of exposure to humid environments, the bonding strength still maintains 90% of the initial strength. Example 2 is slightly weaker than Example 1. In humid environments, due to the slight adjustment of the proportions of each component, the rate of decrease in bonding strength is slightly faster than in Example 1. However, after 24 hours of exposure to humid environments, the bonding strength can still be maintained at 85% of the initial strength, which still meets the general requirements for solidified rock reinforcement in mining applications.

[0071] Example 3 benefits from an optimized formulation, particularly adjustments to the ratio of inorganic epoxy resin and curing agent, as well as the amount of nano-silica and redispersible latex powder. It exhibits the most stable bonding performance in humid environments. After 24 hours of exposure to humid environments, the bonding strength remains at 95% of the initial strength, and the risk of bonding failure is lowest under simulated mining vibration and other working conditions.

[0072] Similarly, secondly, regarding water resistance, the filling effect of nano-silica and the waterproof film formed by redispersible latex powder in Example 1 effectively prevent water penetration, the compound structure remains basically intact, and the decrease in adhesion to the solidified rock is not significant. Through comparison of water absorption rate and volume expansion rate, Example 2 is slightly lower than Example 1. Example 3 is superior to Example 1.

[0073] Third, regarding weather resistance, Example 1 showed no obvious cracking or powdering on the surface, but its adhesion performance decreased by approximately 5%. Its weather resistance is attributed to the stable structure formed by the epoxy resin and various additives, allowing it to adapt well to alternating temperature and humidity changes. Example 2 showed an approximately 8% decrease in adhesion performance, slightly lower than Example 1. Example 3, however, showed an approximately 3% decrease in adhesion performance, which was better than Example 1.

[0074] Fourth, regarding adhesion durability, in long-term tests simulating actual mining conditions (including factors such as humidity, vibration, and temperature changes), Example 1 maintained good adhesion and reinforcement effects for 2 hours, after which the adhesion performance began to decline slowly, but stabilized after 48 hours. Example 2 was slightly inferior to Example 1. Example 3 was superior to Example 1.

[0075] A preparation process for an inorganic resin for bonding solidified rock in industrial mining includes the following steps:

[0076] Step 1: Add inorganic epoxy resin and water to the reaction vessel, stir evenly at a speed of 200-300 r / min for 10-15 min;

[0077] Step 2: Add nano-silica to the mixture obtained in Step 1, and continue stirring for 15-20 minutes at a stirring speed of 300-400 r / min;

[0078] Step 3: Add redispersible latex powder and stir for 10-15 minutes at a speed of 200-300 rpm;

[0079] Step 4: Slowly add the water-based curing agent to the above mixture while stirring at a speed of 100-200 r / min. After the addition is complete, continue stirring for 10-15 min.

[0080] Step 5: Add thickener and defoamer, stir evenly at a speed of 150-250 r / min for 10-15 min to obtain industrial mining solid rock bonding inorganic resin.

[0081] Furthermore, in step one, the stirring speed is 250 r / min and the stirring time is 12 min.

[0082] In this invention, the entire preparation process employs five major steps: basic dispersion, reinforcing filling, film construction, crosslinking reaction, and viscosity optimization to form a closed loop. Through carefully designed formulation components, the various components work synergistically, and the scientifically sound process steps work closely together, comprehensively solving the shortcomings of existing mining adhesives for humid environments and providing a reliable solidification material for mining operations.

[0083] Specifically, the first step is basic dispersion. Inorganic epoxy resin and water are mixed and stirred at 200-300 rpm for 10-15 minutes. This step ensures the epoxy resin is uniformly dispersed in the water, forming a stable basic system that lays the foundation for subsequent component integration and reaction. Uniformly dispersed epoxy resin allows for better contact with other components, ensuring consistent overall performance.

[0084] Second, enhance the filling effect by adding nano-silica and increasing the stirring speed to 300-400 rpm for 15-20 minutes. High-speed stirring promotes the full dispersion of nano-silica, uniformly filling the epoxy resin network and maximizing the enhancement, toughening, and water resistance effects.

[0085] Third, for film construction, add redispersible latex powder, adjust the stirring speed back to 200-300 rpm, and stir for 10-15 minutes. A moderate speed ensures uniform dispersion of the latex powder, facilitating the subsequent formation of a continuous polymer film that tightly bonds with the epoxy resin network, enhancing adhesion and water resistance.

[0086] Fourth, the cross-linking reaction: slowly add the water-based curing agent while stirring at a speed of 100-200 rpm. After the agent is added, continue stirring for 10-15 minutes. Slow addition and moderate stirring ensure that the curing agent is evenly dispersed and fully contacts and reacts with the epoxy resin to build a complete three-dimensional network structure, solving the problems of bonding strength and curing in humid environments.

[0087] Fifth, optimize viscosity by adding thickener and defoamer, and stirring at 150-250 rpm for 10-15 minutes. Appropriate stirring speed ensures uniform thickening by the thickener and full action of the defoamer, optimizing the mixture's workability and internal structure, and improving adhesion in humid environments.

[0088] Furthermore, in step four, the reaction between the water-based curing agent and the epoxy resin proceeds as follows:

[0089] S101. Slowly add the water-based curing agent. At the beginning, open the addition valve. In the initial stage, the addition amount per minute is controlled at 1%-2% of the total curing agent amount, so that the curing agent is slowly dripped into the mixture in the reactor in a thin stream. As the reaction proceeds, according to the state of the reaction system, the stirring speed is initially set to 100 r / min, and the addition speed is gradually increased, and finally set to 200 r / min to ensure that the entire addition process is completed within 10-15 minutes.

[0090] S102, temperature monitoring during the reaction process: The reaction temperature should be controlled between 30-40℃. If the temperature rises too quickly and approaches 40℃, the temperature should be lowered through the cooling system of the reactor. If the temperature is too low, the heating device can be turned on appropriately to maintain the required reaction temperature and ensure the normal progress of the reaction. The active amine group -NH2 in the water-based curing agent undergoes a ring-opening reaction with the epoxy group -CH-CH2 in the inorganic epoxy resin. In a humid environment, the curing agent and epoxy resin have high reactivity and preferentially undergo cross-linking reaction. The active amine group attacks the epoxy group, opens the epoxy ring, forms new chemical bonds, and gradually builds a three-dimensional network structure.

[0091] It should be noted that slowly adding the water-based curing agent to the above mixture while stirring is a crucial step in ensuring a full reaction between the water-based curing agent and the epoxy resin. This process not only plays a decisive role in the final performance of the adhesive but is also a core step in solving many technical problems of existing adhesives in humid environments mentioned in the background art.

[0092] In S101, the water-based curing agent is added slowly. As the reaction proceeds, the addition rate is gradually and appropriately increased according to the state of the reaction system, but the overall rate still needs to be slow. A low stirring speed can ensure that the curing agent is evenly dispersed in the system, and will not introduce too many air bubbles due to excessive stirring, thus affecting the reaction quality.

[0093] The purpose of adding the curing agent slowly is to allow sufficient time for it to disperse evenly in the epoxy resin system, avoiding excessively high local concentrations that could lead to a rapid and uneven reaction, thus affecting the performance of the final product.

[0094] In S102, during the temperature monitoring of the reaction process, the active amine group -NH2 in the water-based curing agent undergoes a ring-opening reaction with the epoxy group -CH-CH2 in the inorganic epoxy resin. Under humid conditions, the curing agent and epoxy resin have high reactivity and preferentially undergo cross-linking reaction. The active amine group attacks the epoxy group, opens the epoxy ring, forms new chemical bonds, and gradually builds a three-dimensional network structure.

[0095] During this process, the viscosity of the system gradually increases as the reaction proceeds, which is an important indicator that the reaction is ongoing. By observing the change in system viscosity and combining it with the reaction time, we can determine whether the reaction is complete. If the reaction time is too short, the curing agent and epoxy resin will not be fully cross-linked, resulting in insufficient bond strength; if the reaction time is too long, the system may be over-cross-linked, causing the adhesive to become brittle, which will also affect the bonding performance.

[0096] The above provides a detailed description of the inorganic resin for bonding solidified rock in industrial mining and its preparation process provided by this invention. The specific embodiments are described only to aid in understanding the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims of this invention.

Claims

1. An inorganic resin for bonding solidified rock in industrial mining, characterized in that, By weight, it includes the following components: 30-50 parts of inorganic epoxy resin; 10-20 parts of water-based curing agent; 5-10 parts of nano-silica; 3-8 parts of redispersible latex powder; Thickener 1-3 parts; 0.5-1.5 parts of defoamer; 20-40 parts water.

2. The inorganic resin for bonding solidified rock in industrial mining as described in claim 1, characterized in that, The inorganic epoxy resin is a bisphenol A type inorganic epoxy resin with an epoxy value of 0.1-0.3 eq / 100g.

3. The inorganic resin for bonding solidified rock in industrial mining according to claim 1, characterized in that, The water-based curing agent is a modified fatty amine water-based curing agent with an amine value of 200-400 mgKOH / g.

4. The inorganic resin for bonding solidified rock in industrial mining according to claim 1, characterized in that, The particle size of the nano-silica is 20-50 nm.

5. The inorganic resin for bonding solidified rock in industrial mining according to claim 1, characterized in that, The redispersible latex powder is a vinyl acetate-ethylene copolymer redispersible latex powder.

6. The inorganic resin for bonding solidified rock in industrial mining according to claim 1, characterized in that, The thickener is hydroxyethyl cellulose.

7. The inorganic resin for bonding solidified rock in industrial mining according to claim 1, characterized in that, The defoamer is an organosilicone defoamer.

8. A preparation process for an inorganic resin for bonding solidified rock in industrial mining, characterized in that, Includes the following steps: Step 1: Add inorganic epoxy resin and water to the reaction vessel, stir evenly at a speed of 200-300 r / min for 10-15 min; Step 2: Add nano-silica to the mixture obtained in Step 1, and continue stirring for 15-20 minutes at a stirring speed of 300-400 r / min; Step 3: Add redispersible latex powder and stir for 10-15 minutes at a speed of 200-300 rpm; Step 4: Slowly add the water-based curing agent to the above mixture while stirring at a speed of 100-200 r / min. After the addition is complete, continue stirring for 10-15 min. Step 5: Add thickener and defoamer, stir evenly at a speed of 150-250 r / min for 10-15 min to obtain industrial mining solid rock bonding inorganic resin.

9. The preparation process of the inorganic resin for bonding solidified rock in industrial mining according to claim 8, characterized in that, In step one, the stirring speed is 250 r / min and the stirring time is 12 min.

10. The preparation process of the inorganic resin for bonding solidified rock in industrial mining according to claim 8, characterized in that, In step four, the reaction between the water-based curing agent and the inorganic epoxy resin proceeds as follows: S101. Slowly add the water-based curing agent. At the beginning, open the addition valve. In the initial stage, the addition amount per minute is controlled at 1%-2% of the total curing agent amount, so that the curing agent is slowly dripped into the mixture in the reactor in a thin stream. As the reaction proceeds, according to the state of the reaction system, the stirring speed is initially set to 100 r / min, and the addition speed is gradually increased, and finally set to 200 r / min to ensure that the entire addition process is completed within 10-15 minutes. S102, temperature monitoring during the reaction process: The reaction temperature should be controlled between 30-40℃. If the temperature rises too quickly and approaches 40℃, the temperature should be lowered through the cooling system of the reactor. If the temperature is too low, the heating device should be turned on to maintain the required reaction temperature and ensure that the reaction proceeds normally. The active amine group -NH2 in the water-based curing agent undergoes a ring-opening reaction with the epoxy group -CH-CH2 in the inorganic epoxy resin. In a humid environment, the curing agent and epoxy resin have high reactivity and preferentially undergo cross-linking reaction. The active amine group attacks the epoxy group, opens the epoxy ring, forms new chemical bonds, and gradually builds a three-dimensional network structure.

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