MLCC high-precision low-cost misregistration printing reverse lamination method and electronic component

Abstract

The application provides a MLCC high-precision low-cost misregistration printing reverse lamination method and an electronic component, and comprises the following steps: S1, ceramic slurry is cast on a flexible substrate to obtain a ceramic film strip; S2, the ceramic film strip is cut to obtain a ceramic film sheet; S3, an electrode pattern is printed on the front surface of the ceramic film sheet to obtain a printed sheet, including a printed sheet A and a printed sheet B; wherein the electrode pattern on the printed sheet A is the same as that on the printed sheet B, and the electrode pattern on the printed sheet B is offset along the X-axis or Y-axis direction with the center point of the electrode pattern on the printed sheet A as a reference; S4, positioning holes are processed at one position of the printed sheet A and the printed sheet B; and S5, the printed sheet A and the printed sheet B are alternately and reversely laminated, including sequentially laminating the printed sheet A and the printed sheet B through the positioning holes in a reverse manner with the upper layer, then heat-pressing, removing the flexible substrate, and repeating the reverse lamination until the required number of layers.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of MLCC processing method, and particularly relates to a high-precision low-cost misprint reverse lamination method for MLCC and an electronic component. BACKGROUND

[0002] With the rapid development of electronic information industry, communication equipment such as electronic computers, mobile terminals and smart wearings are increasingly miniaturized and multifunctional. In order to meet the demand, multi-layer ceramic capacitors (MLCC) are also developing in the direction of miniaturization and high capacity.

[0003] MLCC uses ceramic material as dielectric, is composed of two or more alternating ceramic layers and metal layers used as electrodes, and is formed into a ceramic chip through high-temperature sintering. Then, metal layers (i.e. external electrodes) are sealed on both ends of the chip, thereby forming a structure similar to a monolithic stone, so it is also called monolithic capacitor.

[0004] With the improvement of the reliability and integration of MLCC products, its application range is also increasingly wide, including various military and civilian electronic complete machines and electronic equipment, such as computers, program-controlled switches, automotive electronics, medical electronics, communications, precision measuring instruments, etc. With the expansion of application fields, the market demand for the performance of MLCC is gradually increasing, especially for high-capacity MLCC products, which puts higher requirements on the lamination process technology.

[0005] The preparation process of MLCC includes slurry preparation, flow casting, printing, lamination, lamination, cutting, glue removal, sintering, chamfering, end sealing, end burning, appearance, testing and packaging. Based on the performance requirements of high-precision MLCC devices, the more the number of lamination layers, the higher the precision requirement. The main principle of the conventional MLCC lamination process is as follows:

[0006] The device spreads the film with screen-printed electrode pattern at a constant tension, cuts the film electrode pattern to a specified size, uses a special workbench to vacuum adsorb and peel off the film, scans and positions the film through an image positioning system, and then conveys the film to a predetermined lamination workbench. The film is laminated on the positioned carrier plate, the pattern is misprinted to form two electrodes according to the product production process, and the capacitor body green body is formed by stacking the required number of layers at a pre-pressing pressure. Then, the carrier plate together with the capacitor body green body is sent to a protective film covering station to add a protective film, and then sent to a compaction station to apply pressure for a certain time to make the capacitor body green body dense. Finally, the material is sent to a material receiving frame to complete the whole working cycle.

[0007] Wherein the step of peeling off the film, the peeling effect of the laminating equipment on the dielectric film when peeling off the film from the carrier tape is an important prerequisite for realizing the accurate alignment of the internal electrode. Because the ceramic film tape in the MLCC industry is generally 0.5-20 μm in thickness, the film peeling is particularly difficult, and there is a risk of damage. The peeling effect may be due to the poor adsorption of the film on the adsorption plate of the laminating equipment, the film slightly wrinkled on the adsorption plate, resulting in laminating displacement phenomenon, affecting the yield of the MLCC element.

[0008] The laminating process has high requirements on the number of laminated layers and the laminating accuracy of the laminating machine. The number of laminated layers of the internal electrode is sometimes as high as 1000 or more. If there is a slight misalignment in actual operation, the capacitance of the MLCC will change greatly, and even the yield will be greatly reduced. Therefore, this process is usually completed by a high-precision fully automatic intelligent laminating machine with positioning of a CCD (Charge Coupled Device, also known as Charge Coupled Device) visual alignment system.

[0009] At present, high-end laminating machines are still mainly imported, and the equipment is expensive and has a very long delivery period. At present, they are mainly produced by Japanese and Korean manufacturers, which poses a "neck" risk. In actual production, there are also defects such as high processing cost, low actual yield and difficulty in control.

[0010] Therefore, while ensuring accuracy and yield, reducing the equipment cost required for MLCC laminating and film peeling process is an important problem to be solved in the field, which helps to reduce the processing threshold of high-precision MLCC products and improve overall yield and efficiency. SUMMARY

[0011] The purpose of the present application is to solve the problems of difficulty in peeling off the film of the ultra-thin ceramic film tape of the MLCC, high cost of the required equipment and complex process in the prior art. Therefore, the present application provides a MLCC high-precision low-cost misalignment printing reverse laminating method.

[0012] To achieve the above purpose, the present application proposes the following technical solutions:

[0013] A MLCC high-precision low-cost misalignment printing reverse laminating method, comprising the following steps:

[0014] S1, casting ceramic slurry on a flexible substrate to obtain a ceramic film tape;

[0015] S2, cutting the ceramic film tape to obtain a ceramic film piece;

[0016] S3, defining the ceramic diaphragm modified with a flexible substrate as the reverse side, and the other side opposite to it as the front side; printing electrode patterns on the front side of the ceramic diaphragm to obtain printed sheets, including printed sheet A and printed sheet B; wherein the electrode patterns on the printed sheet A and the printed sheet B are the same, and the electrode patterns on the printed sheet B are offset in the X-axis or Y-axis direction based on the center point of the electrode patterns on the printed sheet A;

[0017] S4, processing positioning holes at the same positions of the printed sheet A and the printed sheet B, respectively;

[0018] S5, alternately and reversely stacking the printed sheet A and the printed sheet B, the reverse stacking including sequentially stacking the printed sheet A and the printed sheet B with the reverse side up through the positioning holes, then hot-pressing, and then removing the flexible substrate, and repeating the reverse stacking to the required number of layers.

[0019] Further, the following steps are included:

[0020] S1, casting ceramic slurry on a flexible substrate to obtain a ceramic film strip;

[0021] S2, cutting the ceramic film strip to obtain a roll-type ceramic film strip, the roll-type ceramic film strip including a plurality of ceramic diaphragms of the same specification;

[0022] S3, printing electrode patterns on the front side of the ceramic diaphragm of the same roll-type ceramic film strip to obtain printed ceramic film strips A and B, respectively, including printed sheet A and printed sheet B; wherein the electrode patterns on the printed sheet A and the printed sheet B are the same, and the electrode patterns on the printed sheet B are offset in the X-axis or Y-axis direction based on the center point of the electrode patterns on the printed sheet A;

[0023] S4, processing positioning holes at the same positions of the printed sheet A and the printed sheet B, respectively;

[0024] S5, conveying the printed ceramic film strip A and the printed ceramic film strip B with the flexible substrate to a designated stacking position, and alternately and reversely stacking the printed sheet A and the printed sheet B, the reverse stacking including sequentially stacking the printed sheet A and the printed sheet B with the reverse side up through the positioning holes, then hot-pressing, and then removing the flexible substrate, and repeating the reverse stacking to the required number of layers.

[0025] Further, in the S3, the electrode patterns on the printed sheet B are offset in the X-axis direction by a distance corresponding to the length of the MLCC device; and the electrode patterns on the printed sheet B are offset in the Y-axis direction by a distance corresponding to the width of the MLCC device.

[0026] Further, the S5 includes the following content:

[0027] The ceramic film without printed electrode pattern is defined as blank film, and positioning holes are processed on the blank film. The blank films are processed in turn and repeated in reverse order to the required thickness to make the upper cover sheet and the lower cover sheet respectively;

[0028] The printed sheet A and the printed sheet B are placed on the lower cover sheet and processed in turn in reverse order, and the reverse order is repeated to the required number of layers;

[0029] The upper cover sheet is placed on the uppermost printed sheet, and hot pressing is processed to make the bar block.

[0030] Further, the upper cover sheet or the lower cover sheet preparation step comprises:

[0031] S511, the blank film is placed on the stacking positioning device with the front face upward according to the positioning holes, and is fixed on the hot press workbench;

[0032] S512, another blank film is placed on the previous blank film with the back face upward according to the positioning holes for reverse stacking, and the flexible substrate is removed after hot pressing;

[0033] S513, the S512 is repeated, and the subsequent blank films are sequentially stacked in reverse order and hot pressed, and the flexible substrate is removed after hot pressing, and the stacking is repeated to the required thickness of the blank film;

[0034] The printed sheet reverse stacking preparation step comprises:

[0035] S521, the lower cover sheet is placed on the stacking positioning device according to the positioning holes, and is fixed on the hot press workbench. The printed sheet A or the printed sheet B is placed on the lower cover sheet with the back face upward according to the positioning holes, and the flexible substrate is removed after hot pressing;

[0036] S522, another printed sheet B or printed sheet A is placed on the previous printed sheet A or printed sheet B with the back face upward according to the positioning holes for alternating reverse stacking, and the flexible substrate is removed after hot pressing;

[0037] S523, the S522 is repeated, and the printed sheet A and the printed sheet B are alternately stacked in reverse order and hot pressed, and the flexible substrate is removed after hot pressing, and the stacking is repeated to the required number of layers of the printed sheet;

[0038] The upper cover sheet is placed on the uppermost printed sheet, and hot pressing is processed to make the bar block.

[0039] Further, the S5 comprises the following steps:

[0040] S51, define the ceramic film without printed electrode pattern as blank film, and process positioning holes on the blank film, place the blank film on the laminating positioning device according to the positioning holes with the front face upward, and fix it on the worktable of the hot press;

[0041] S52, place another blank film on the previous blank film according to the positioning holes with the back face upward to perform reverse lamination, remove the flexible substrate after hot pressing, and then place subsequent blank films in turn to perform reverse lamination, remove the flexible substrate after hot pressing, and repeat until the blank films are stacked to the required thickness;

[0042] S53, place the printed film A or the printed film B on the uppermost blank film according to the positioning holes with the back face upward to perform reverse lamination, remove the flexible substrate after hot pressing, and then place another printed film B or the printed film A on the previous printed film A or the printed film B according to the positioning holes to perform alternating reverse lamination, remove the flexible substrate after hot pressing, and repeat until the printed films are stacked to the required number of layers;

[0043] S54, place the blank film on the uppermost printed film according to the positioning holes with the back face upward to perform reverse lamination, and remove the flexible substrate after hot pressing;

[0044] S55, place another blank film on the previous blank film according to the positioning holes with the back face upward to perform reverse lamination in turn, remove the flexible substrate after hot pressing, and repeat until the blank films are stacked to the required thickness.

[0045] Further, the blank film and the printed film are the same size, and positioning holes are processed at the same position of the blank film and the printed film.

[0046] Further, the laminating positioning device comprises a supporting plate and a pin, and the supporting plate is provided with a substrate positioning hole;

[0047] The pin is provided in a position and number corresponding to the substrate positioning hole, and the pin is fixed to the supporting plate through the substrate positioning hole;

[0048] The size of the supporting plate is greater than or equal to the size of the printed film;

[0049] The position of the substrate positioning hole is the same as the positions of the blank film positioning hole and the printed film positioning hole;

[0050] The printed film or the blank film is sleeved on the supporting plate through the pin based on the printed film positioning hole or the blank film positioning hole.

[0051] An electronic component made of the above method, after laminating, cutting, degreasing, sintering, chamfering, end sealing, end burning, and electroplating treatment.

[0052] Further, the electronic component includes and is not limited to MLCC, LTCC, HTCC device.

[0053] The beneficial effects of the present application are:

[0054] (1) The present application avoids the offset superposition operation realized by high-precision equipment in processing by making two sets of screen printing plates in the staggered and non-staggered modes under the condition that the staggered patterns in the multi-layer ceramic capacitor are stacked in the same reference position, and transferring the problem solved by high-precision equipment to the previous step, removing the part of vacuum adsorption and high-precision CCD recognition in the original processing procedure, simplifying the process steps of MLCC, reducing the processing threshold, and reducing the cost of high-end equipment from nearly ten million yuan of imported equipment to several hundred thousand yuan of domestic equipment, reducing the risk of high-end equipment, and greatly reducing the cost of equipment.

[0055] (2) The present application realizes the same processing effect of high-precision roll-to-roll lamination equipment through sheet printing, avoids the use of expensive roll-to-roll printing, roll-to-roll lamination and high-precision positioning equipment, controls the precision through screen printing design, flexibly adjusts the corresponding parameters according to the printing pattern requirements and has low cost, avoids the use of high-precision CDD visual alignment system, and the process steps and yield are controllable, which greatly improves the overall yield and processing efficiency of MLCC.

[0056] (3) The present application combines the split staggered screen printing design and sheet printing machine, and converts the steps of fine and tedious control of high-precision equipment and system into simple design and replacement of printing screen, and when processing capacitors with different specifications and patterns, only one new printing screen needs to be made for use, which greatly reduces the process difficulty and equipment cost.

[0057] (4) The present application realizes the staggered lamination of the inner electrode in the MLCC by using the staggered printing and positioning hole cooperation through the reverse lamination method, taking the process of first lamination, then hot pressing, and finally removing the flexible substrate, and using the simple lamination positioning equipment, which removes the part of vacuum adsorption and high-precision CCD recognition in the original processing procedure, solves the problem of high-precision equipment and high-cost equipment through simple process, simplifies the process steps of MLCC, and reduces the processing threshold.

[0058] (5) The present application realizes film strip adhesion self-transferring through transverse lamination hot pressing, peels off the flexible substrate after hot pressing and adhesion of the blank film sheet or the printed sheet, increases the thickness and strength of the ceramic film sheet which has been adhered together, avoids the damage risk in the flexible substrate peeling process, is beneficial to the peeling of the ultra-thin ceramic film strip, avoids the problems of poor peeling effect of the flexible substrate, further causes lamination displacement, and further affects the device performance, the process steps and the yield are controllable, and the overall yield and processing efficiency of the MLCC are greatly improved.

[0059] (6) The present application separates the protective cover sheet and the inner electrode lamination process in the MLCC device, hot presses the blank film sheet and the printed sheet respectively, greatly shortens the processing time, simplifies the processing flow,

[0060] It should be understood that all combinations of the aforementioned concepts and additional concepts described in greater detail below can be seen as part of the subject matter of the present disclosure as long as such concepts are not mutually inconsistent.

[0061] The foregoing and other aspects, embodiments and features of the present teachings can be better understood from the following description of the present teachings with reference to the drawings. Other aspects and features of the present teachings will become apparent from the following description of the present teachings and from the practices of the present teachings. The summary provided above does not necessarily encompass all aspects of the present teachings. BRIEF DESCRIPTION OF DRAWINGS

[0062] The accompanying drawings are not necessarily drawn to scale. In the drawings, each identical, or nearly identical, component that is illustrated in various figures is represented with a like numeral. For purposes of clarity, not every component is called out in every drawing. There is no implied relationship or dependency between elements or embodiments that are illustrated in the drawings. Embodiments of various aspects of the present teachings will now be described, by way of example only, with reference to the accompanying drawings in which:

[0063] Figure 1 is a process flow diagram of the MLCC high-precision low-cost misregistration printing transverse lamination method of the embodiments of the present application;

[0064] Figure 2 is a screen printing schematic diagram without misregistration printing of the embodiments of the present application;

[0065] Figure 3 is a screen printing schematic diagram with misregistration printing (Y-axis offset) of the embodiments of the present application;

[0066] Figure 4 is a process flow diagram of the transverse lamination method of the embodiments of the present application;

[0067] Figure 5is a schematic diagram of a laminated positioning device according to an embodiment of the present application;

[0068] Figure 6 is a cross-sectional view of an MLCC element according to an embodiment of the present application.

[0069] Reference Signs:

[0070] 1, support plate; 11, substrate positioning hole; 12, pin; 2, blank diaphragm; 21, blank diaphragm positioning hole; 3, printed sheet; 31, printed sheet positioning hole; 32, electrode pattern area; 320, internal electrode; 33, offset distance; 41, MLCC device length; 42, MLCC device width. DETAILED DESCRIPTION

[0071] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the usual meanings understood by those of ordinary skill in the art to which the present application belongs.

[0072] The terms such as "include" or "contain" and the like used in the patent application specification and claims of the present application mean that the elements or objects appearing before "include" or "contain" cover the features, whole, steps, operations, elements and / or components listed after "include" or "contain", and do not exclude the existence or addition of one or more other features, whole, steps, operations, elements, components and / or sets thereof. "Up", "down", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0073] The main raw materials of the following embodiments and comparative examples of the present application can be purchased from the market.

[0074] Referring to the drawings Figure 1 , the present embodiment provides a high-precision low-cost misregistration printing method for MLCC, which specifically comprises:

[0075] S1, casting ceramic slurry on a flexible substrate to obtain a ceramic film strip.

[0076] The ceramic slurry composition comprises doped ceramic powder 55%~60%, organic solvent 30%~40%, dispersing agent 0.6%~1.5%, binder 2%~4%, and plasticizer 0.5%~1.5% by weight, and the specific steps are as follows:

[0077] (1) Take each raw material according to the above ratio;

[0078] (2) Add organic solvent, dispersant and plasticizer into the ceramic powder in sequence, and ball mill to make the ceramic powder uniformly dispersed in the solvent to obtain a premix, the ball milling time is preferably 6-12 h, and the ball milling speed is preferably 300 rpm;

[0079] (3) Add the binder to the premix obtained in step (2) and ball mill to mix thoroughly, the ball milling time is preferably 6-12 h, and the ball milling speed is preferably 300 rpm. After completion, filter through a filter screen or filter core to obtain the ceramic slurry, the mesh number of the filter screen is preferably 500, and the viscosity of the ceramic slurry is preferably 500 cps.

[0080] Take the ceramic slurry prepared above, and use a steel belt casting machine or a film casting machine to cast a ceramic film tape with a desired thickness. The thickness of the ceramic film tape is controlled by adjusting the slurry viscosity, casting speed, slurry supply pressure and PET tension. If a steel belt casting machine is used, the film is automatically cut into a piece-shaped ceramic film tape of a desired size after being formed at the tail of the machine; if a film casting machine is used, the film is wound at the tail of the machine to obtain a roll-shaped ceramic film tape.

[0081] Preferably, the casting speed is 1-100 m / min, and the casting thickness is 1-40 μm.

[0082] The flexible substrate material includes PET, and the flexible substrate tension is 20-40 N.

[0083] After the above steps, a ceramic dielectric layer is prepared which covers the surface of the flexible substrate film.

[0084] S2, the ceramic film tape is cut to obtain a ceramic film piece.

[0085] The ceramic film tape is transferred to an automatic cutting machine and cut into a piece-shaped ceramic film piece of a desired size, and the size of the film piece is determined according to the size of the printed pattern.

[0086] Specifically, the ceramic film tape refers to a blank ceramic film tape without printing of metal electrode slurry; the ceramic film piece includes a piece-shaped ceramic film piece cut to a set size without printing of metal electrode slurry; and the printed piece 3 includes a piece-shaped printed piece 3 cut to a set size with printing of metal electrode slurry.

[0087] S3, printing the electrode pattern in the electrode pattern area 32 on the ceramic diaphragm to obtain a printed sheet 3, including a printed sheet A and a printed sheet B, wherein the electrode pattern on the printed sheet A is the same as that on the printed sheet B, and the electrode pattern on the printed sheet B is offset in the X-axis or Y-axis direction, and the offset distance 33 corresponds to the length 41 or width 42 of the MLCC device.

[0088] The electrode pattern printed in the above electrode pattern area 32 is composed of a plurality of inner electrode 320 patterns, which can be set according to actual processing needs.

[0089] The side of the printed sheet 3 provided with the electrode pattern is defined as the front side, and the side of the printed sheet 3 decorated with the flexible substrate is defined as the back side.

[0090] Specifically, the chip multilayer ceramic capacitor is formed by stacking the ceramic diaphragm printed with the inner electrode 320 in a staggered manner, sintering at high temperature to form a ceramic block, and then sealing the outer electrode on both ends of the ceramic block. The inner electrode 320 on the ceramic diaphragm is printed by screen printing the inner electrode 320 paste onto the ceramic diaphragm, and after drying, a clear and complete dielectric diaphragm is obtained. Then, the printed ceramic diaphragms are offset in the Y-axis direction, and the printed diaphragms are stacked together in a certain offset to form a ceramic block with uniform thickness. Finally, after subsequent lamination and cutting, a green body of a chip multilayer ceramic capacitor is obtained. High-precision CDD vision alignment system and vacuum suction equipment are required to peel off the flexible substrate material, which is expensive. In this embodiment, the printed ceramic diaphragms are not offset and stacked using the above expensive high-precision equipment, but are offset and stacked using the offset printing method, which has more advantages in equipment cost and process steps.

[0091] In the above S3, a printing screen is made, including a printing screen A and a printing screen B, and the printing screen A and the printing screen B are used to print the electrode pattern on the ceramic diaphragm to obtain a printed sheet A and a printed sheet B.

[0092] The printing screen A refers to a non-offset screen, and the printing screen B refers to an offset screen; the printed sheet A refers to a non-offset printed sheet, and the printed sheet B refers to an offset printed sheet.

[0093] The above order of reference can be replaced according to actual needs.

[0094] Specifically, the processing method of the above electrode pattern includes but is not limited to screen printing, thin film sputtering, photolithography, electroplating, and chemical plating.

[0095] Specifically, the above printing screen is made by using equipment including but not limited to a chip printer, and the electrode pattern is printed by using equipment including but not limited to a chip printer.

[0096] The present application is characterized in that the patterns of the multi-layer ceramic capacitor are staggered and overlapped, and two sets of printing plates 3 are made according to the staggered and non-staggered modes under the condition that the patterns are staggered and overlapped at the same reference position, and the printing plate positioning holes 31 are processed at the same position of the two sets of printing plates 3, and the two sets of printing plates 3 are overlapped based on this, and a simple positioning jig is used for overlapping positioning, so that the automatic staggering of the electrode patterns is realized, and the overlapping offset error in the prior art is effectively avoided. The two sets of screen patterns of the staggered and non-staggered modes are overlapped at the same position to form the inner electrode 320 pattern of the multi-layer capacitor.

[0097] When the inner electrode 320 of the capacitor with different specifications and patterns is processed, only a new set of printing screen is needed to be made for use, which greatly reduces the process difficulty and equipment cost.

[0098] S4, the printing plate positioning hole 31 is processed at the same position of the printing plate A and the printing plate B.

[0099] The printing plate A and the printing plate B are transferred to an automatic punching machine for punching to obtain the punched printing plate A and the punched printing plate B.

[0100] Specifically, the number of the positioning holes is at least three.

[0101] Preferably, the circular Mark points at the same positions of the four corners of the printing plate A and the printing plate B are punched, and the distance between the positioning holes and the edge of the electrode pattern area 32 is greater than the offset distance 33 in the corresponding direction, which can be set according to actual needs.

[0102] S5, the printing plate A and the printing plate B are alternately stacked and hot-pressed. The specific steps are shown in the accompanying drawings, which include the following steps: Figure 4

[0103] S51, the ceramic film sheet without printed electrode patterns is defined as a blank film sheet 2, and the positioning holes are processed on the blank film sheet 2, and the blank film sheet 2 is placed on the stacking positioning device with the front face upward and fixed on the workbench of the hot press according to the blank film positioning holes 21;

[0104] S52, another blank film sheet 2 is placed on the previous blank film sheet 2 with the back face upward to perform reverse stacking, and the flexible substrate is removed after hot pressing;

[0105] S53, S52 is repeated, and the subsequent blank film sheets 2 are sequentially and reversely stacked and hot-pressed, and the flexible substrate is removed after hot pressing, and the blank film sheets 2 are repeated until the desired cover sheet thickness is reached.

[0106] ​S54, place the printed sheet A or printed sheet B with the reverse side upward on the uppermost blank film sheet 2 according to the printed sheet positioning hole 31 to perform reverse type stacking, remove the flexible substrate after hot pressing processing;

[0107] S55, place another printed sheet B or printed sheet A with the reverse side upward on the previous printed sheet A or printed sheet B according to the printed sheet positioning hole 31 to perform alternating reverse type stacking, remove the flexible substrate after hot pressing processing;

[0108] S56, repeat S55 to alternately stack the printed sheet A and printed sheet B, remove the flexible substrate after hot pressing processing, and repeat until the printed sheet 3 is stacked to the required number of layers;

[0109] S57, place the blank film sheet 2 with the reverse side upward on the uppermost printed sheet 3 according to the blank film sheet positioning hole 21 to perform reverse type stacking, remove the flexible substrate after hot pressing processing;

[0110] S58, place another blank film sheet 2 with the reverse side upward on the previous blank film sheet 2 according to the positioning hole to perform reverse type stacking, remove the flexible substrate after hot pressing processing;

[0111] S59, repeat S58 to sequentially stack the blank film sheet 2, remove the flexible substrate after hot pressing processing, and repeat until the blank film sheet 2 is stacked to the required cover thickness.

[0112] The specific structure of the above stacking positioning device is shown in the accompanying drawings Figure 5 , and specifically includes a support plate 1 and a pin 12. The support plate 1 is provided with a substrate positioning hole 11. The pin 12 is provided in a position and number corresponding to the substrate positioning hole 11, and is fixed to the support plate 1 through the substrate positioning hole 11.

[0113] The size of the support plate 1 is greater than the size of the printed sheet 3.

[0114] The position of the substrate positioning hole 11 is the same as the position and aperture of the blank film sheet positioning hole 21 and the printed sheet positioning hole 31.

[0115] The aperture of the substrate positioning hole 11, the blank film sheet positioning hole 21 and the printed sheet positioning hole 31 is the same, and the aperture error is not more than 20 μm.

[0116] The length of the pin 12 is greater than the thickness of the blank film sheet 2.

[0117] Specifically, at the beginning of stacking, the front side of the bottommost blank film sheet 2 is upward, and the blank film sheet 2 is placed on the support plate 1 through the pin 12 based on the blank film sheet positioning hole 21, the reverse side with the flexible substrate is in contact with the support plate 1, and another blank film sheet 2 is placed on it with the reverse side upward through the pin 12 by hand or mechanically, the flexible substrate is peeled off after hot pressing, and another blank film sheet 2 is transferred above it, and the reverse type stacking is repeated, and then the printed sheet A and the printed sheet B are alternately stacked in reverse.

[0118] Preferably, the supporting plate 1 is in contact with the reverse side of the ceramic membrane, in order to ensure accurate positioning, the surface roughness Ra of the side of the supporting plate in contact with the ceramic membrane is less than 0.1 μm.

[0119] Specifically, the above method realizes self-transfer of the film strip by reverse laminating and hot pressing, and the flexible substrate is peeled off after the blank membrane or the printed sheet 3 is hot pressed and bonded, the thickness and strength of the ceramic membrane which has been bonded together are increased, the damage risk in the peeling process of the flexible substrate is removed, and the peeling of the ultra-thin ceramic membrane strip is facilitated.

[0120] In some optional embodiments, the alternative laminating and hot pressing of the printed sheet A and the printed sheet B further includes the following steps:

[0121] The upper cover sheet or the lower cover sheet preparation step includes:

[0122] S511, place the blank membrane 2 with the front side upward according to the blank membrane positioning hole 21 on the laminating and positioning device, and fix it on the hot press workbench;

[0123] S512, place another blank membrane 2 with the reverse side upward on the previous blank membrane 2 according to the blank membrane positioning hole 21 to perform reverse lamination, and remove the flexible substrate after hot pressing;

[0124] S513, repeat S512, and sequentially perform reverse lamination and hot pressing of the subsequent blank membrane 2 to remove the flexible substrate, and repeat until the blank membrane 2 is laminated to the required thickness.

[0125] The printed sheet 3 reverse lamination preparation step includes:

[0126] S521, place the lower cover sheet on the laminating and positioning device according to the blank membrane positioning hole 21, and fix it on the hot press workbench, place the printed sheet A or the printed sheet B with the reverse side upward on the lower cover sheet according to the printed sheet positioning hole 31, and remove the flexible substrate after hot pressing;

[0127] S522, place another printed sheet B or printed sheet A with the reverse side upward on the previous printed sheet 3 according to the printed sheet positioning hole 31 to perform alternative reverse lamination, and remove the flexible substrate after hot pressing;

[0128] S523, repeat S522, and alternately perform reverse lamination and hot pressing of the printed sheet A and the printed sheet B to remove the flexible substrate, and repeat until the printed sheet 3 is laminated to the required number of layers;

[0129] Place the upper cover sheet on the uppermost printed sheet 3 according to the blank membrane positioning hole 21, and hot press to make a bar.

[0130] The hot pressing processing condition is that the pressure is 10-100 T, the temperature is 40-60 DEG C, and the processing time is 10-60 s.

[0131] The above method separately processes the upper and lower cover sheets of the MLCC device, divides the complete bar block which is processed continuously into several working conditions, and pre-processes the upper and lower cover sheets of different specifications, and then stacks and processes the printed sheet 3. This method can effectively speed up the processing process and simplify the overall processing flow and related processes.

[0132] In order to ensure the peeling effect of the flexible substrate, the lower cover sheet is sleeved on the supporting plate 1, and the reverse stacking and processing of the printed sheet 3 is performed thereon. After the printed sheet 3 is stacked to the required number of layers, the previously prepared upper cover sheet is sleeved thereon for hot pressing, so that when the flexible substrate of the printed sheet 3 is peeled off, the problems such as damage of the printed sheet 3 or incomplete peeling are avoided.

[0133] In some optional embodiments, the ceramic film strip is cut to obtain a roll-type ceramic film strip, and the roll-type ceramic film strip includes a plurality of ceramic film pieces with the same specification; the front surface of the ceramic film pieces in the same roll-type ceramic film strip is printed with an electrode pattern to obtain printed ceramic film strips A and B including printed sheets A and B, respectively; during reverse stacking and processing, the printed ceramic film strips A and B are conveyed to a specified stacking position with the flexible substrate, and the printed sheets A and B are alternately and reversely stacked and processed according to the above method.

[0134] Specifically, the ceramic film strip refers to a blank ceramic film strip without printing of metal electrode paste; the ceramic film piece includes a ceramic piece cut to a specified size without printing of metal electrode paste, and a roll-type ceramic film strip connected to the back flexible substrate; the printed ceramic film strips A and B include printed sheets A and B cut to a specified size with printing of metal electrode paste, and connected to the back flexible substrate.

[0135] During reverse stacking and processing of the printed sheet 3, the printed ceramic film strips A and B are prepared, and the corresponding printed sheet 3 is pulled to the top of the previous printed sheet 3 to alternately and repeatedly reverse stack.

[0136] Specifically, at the beginning of stacking, the front surface of the bottom blank film piece 2 is upward, the blank film piece is sleeved on the supporting plate 1 based on the positioning hole 21 of the blank film piece and the pin 12, the reverse surface of the flexible substrate is in contact with the supporting plate 1, the reverse surface of another blank film piece 2 adjacent to the flexible substrate is upward and sleeved on the flexible substrate through the pin 12, the flexible substrate is peeled off after hot pressing, and another blank film piece 2 adjacent to the flexible substrate is pulled to the top of the flexible substrate to repeatedly reverse stack, and subsequent reverse stacking and processing of the printed sheet 3 is to alternately pull the printed ceramic film strips A and B to the top of the printed sheet 3 to alternately and repeatedly reverse stack.

[0137] The flexible substrate film strip after peeling can be reused, and the connected flexible substrate is on the top and is easier to peel. In order to facilitate the lamination processing, the blank film 2 is separately processed to obtain the upper cover sheet and the lower cover sheet, and then the printing sheet 3 is laminated on the lower cover sheet. After laminating to the required number of layers, the upper cover sheet is placed on it, and it is bonded by hot pressing.

[0138] S6, isostatic pressing process

[0139] The MLCC bar obtained above is laminated, and the lamination processing pressure is 80-200 MPa, the temperature is 80℃, and the time is 0.5-2.0h.

[0140] S7, cutting process

[0141] The MLCC green body device of the designed size is obtained by cutting the laminated MLCC bar by an automatic cutting machine.

[0142] The subsequent preparation process is the same as the conventional MLCC preparation process: the green body device is subjected to glue removal, sintering, chamfering, end sealing, end burning, electroplating and other processes to form an ultra-thin, high-precision, high-layer MLCC device, and a multilayer ceramic capacitor element as shown in FIG. 1 is obtained. Figure 6

[0143] Example 1

[0144] The embodiment provides a MLCC high-precision low-cost misprint method, which specifically comprises the following steps:

[0145] S1, ceramic slurry is cast on a flexible substrate to obtain a ceramic film strip, and the specific steps are as follows:

[0146] (1) weigh each raw material, including 550 g of doped 500 nm barium titanate ceramic powder, 200 g of ethanol, 200 g of toluene, 15 g of SC-0505K, 15 g of dioctyl phthalate, 20 g of polyvinyl butyral, and 3.6 kg of 0.8 mm zirconium balls;

[0147] (2) add ethanol and toluene, dioctyl phthalate, and 0.8 mm zirconium balls to the ceramic powder in sequence, and ball mill to uniformly disperse the ceramic powder in the solvent to obtain a premix, the ball milling time is 6-12h, and the ball milling speed is 300rpm;

[0148] (3) add polyvinyl butyral to the premix obtained in step (2) and ball mill to mix thoroughly, the ball milling time is 6-12h, and the ball milling speed is 300rpm. After the end, filter through a filter screen to obtain the ceramic slurry, the filter screen mesh size is 500 meshes, and the ceramic slurry viscosity is 500cps.

[0149] The casting speed is 100 m / min, and the casting thickness is 1 μm. ​

[0150] Wherein the flexible substrate material is PET, and the PET tension is 20 N.

[0151] After the above steps, a ceramic dielectric layer with a thickness of 1 μm is formed on the surface of the PET film.

[0152] S2, the ceramic film strip is cut to obtain a ceramic film sheet.

[0153] The ceramic film strip is transferred to an automatic sheet cutting machine and cut into a ceramic film sheet with a desired size. The size of the film sheet is determined according to the size of the printed pattern, and in this embodiment, the size is 160 mm X 160 mm.

[0154] Specifically, the ceramic sheet is cut together with the flexible substrate to obtain a sheet ceramic film sheet.

[0155] S3, printing an electrode pattern on the ceramic film sheet to obtain a printed sheet 3, including a printed sheet A and a printed sheet B, wherein the electrode pattern on the printed sheet A is the same as that on the printed sheet B, and the electrode pattern on the printed sheet B is offset in the Y-axis direction with the center point of the electrode pattern on the printed sheet A as the reference. The offset distance 33 is the same as the width 42 of the MLCC device, and can be set according to the structure of the MLCC device. In this embodiment, the offset distance is 1.6 mm.

[0156] The front surface of the printed sheet 3 is defined as the surface provided with the electrode pattern, and the back surface of the printed sheet 3 is defined as the surface provided with the flexible substrate.

[0157] S4, positioning holes are processed at the same position of the printed sheet A and the printed sheet B.

[0158] The printed sheet A and the printed sheet B are transferred to an automatic punching machine for punching. Circular Mark points at the same position of the four corners of the printed sheet A and the printed sheet B are punched to obtain the printed sheet A and the printed sheet B after punching.

[0159] The distance between the printed sheet positioning hole 31 and the edge of the electrode pattern area 32 is greater than the offset distance 33, and can be set according to actual needs. In this embodiment, the distance is 5 mm, taking the printed sheet A as an example.

[0160] S5, the printed sheet A and the printed sheet B are alternately stacked and hot-pressed to obtain a bar block. The steps include:

[0161] S51, a ceramic film sheet without an electrode pattern is defined as a blank film sheet 2, and positioning holes are processed on the blank film sheet 2. The blank film sheet 2 is placed on the stacking positioning device with the front surface upward, and is fixed on the workbench of the hot press according to the blank film sheet positioning hole 21.

[0162] S52, another blank film 2 is placed on the previous blank film 2 in reverse order according to the positioning hole with the reverse side up, and the flexible substrate is removed after hot pressing;

[0163] S53, repeat S52, and the subsequent blank film 2 is sequentially stacked in reverse order, and the flexible substrate is removed after hot pressing, and the process is repeated until the blank film 2 is stacked to the required thickness of the cover sheet, and the lower cover sheet with a thickness of 425 μm is obtained;

[0164] S54, the printed sheet A or the printed sheet B is placed on the uppermost blank film 2 in reverse order according to the positioning hole with the reverse side up, and the flexible substrate is removed after hot pressing;

[0165] S55, another printed sheet B or printed sheet A is placed on the previous printed sheet A or printed sheet B in reverse order according to the positioning hole with the reverse side up, and the flexible substrate is removed after hot pressing;

[0166] S56, repeat S55, and the printed sheet A and the printed sheet B are alternately stacked in reverse order, and the flexible substrate is removed after hot pressing, and the process is repeated until the printed sheet 3 is stacked to the required number of layers, which is 500 layers;

[0167] S57, the blank film 2 is placed on the uppermost printed sheet 3 in reverse order according to the blank film positioning hole 21 with the reverse side up, and the flexible substrate is removed after hot pressing;

[0168] S58, another blank film 2 is placed on the previous blank film 2 in reverse order according to the positioning hole with the reverse side up, and the flexible substrate is removed after hot pressing;

[0169] S59, repeat S58, and the blank film 2 is sequentially stacked in reverse order, and the flexible substrate is removed after hot pressing, and the process is repeated until the blank film 2 is stacked to the required thickness of the cover sheet, and the upper cover sheet with a thickness of 425 μm is obtained.

[0170] The hot pressing conditions are: pressure 10 T, temperature 50 ℃, and processing time 60 s. In order to ensure the hot pressing effect, the hot pressing pressure gradually increases as the blank film 2 or the printed sheet 3 is gradually stacked.

[0171] In the above stacking positioning device, the size of the supporting plate 1 is 200 mm X 200 mm; the hole diameter of the substrate positioning hole 11, the blank film positioning hole 21 and the printed sheet positioning hole 31 is 2 mm, and the hole diameter error is not more than 20 μm; the outer diameter of the pin 12 is 1.98 mm, and the length of the pin 12 is 3 mm.

[0172] S6, isostatic pressing process

[0173] The MLCC bar block prepared above is laminated, the pressure of the lamination process is 80 MPa, the temperature is 80°C, and the time is 30 min.

[0174] S7, cutting process

[0175] The MLCC bar block after lamination is cut by an automatic cutting machine to obtain a 1206 specification MLCC green body device of a designed size.

[0176] The subsequent preparation process is the same as the conventional MLCC preparation process: the bar block is subjected to glue removal, sintering, chamfering, end sealing, end burning, electroplating and other processes to produce an ultra-thin, high-precision, high-layer MLCC device, thereby obtaining a multilayer ceramic capacitor element.

[0177] The MLCC device prepared in this embodiment has a capacitance of 33 μF and a rated voltage of 6.3 V.

[0178] According to the above method, 5000 multilayer ceramic capacitor elements of the same specification are prepared, the device processing yield is more than 98%, and the overall equipment procurement and processing energy consumption cost is less than 200,000 yuan.

[0179] Example 2

[0180] The embodiment provides a MLCC high-precision low-cost misprint method, which specifically comprises:

[0181] S1, casting ceramic slurry on a flexible substrate to obtain a ceramic film strip, the specific steps are as follows:

[0182] (1) weigh each raw material, including 550 g of doped 500 nm barium titanate ceramic powder, 200 g of ethanol and 200 g of toluene, 15 g of SC-0505K, 15 g of dioctyl phthalate, 20 g of polyvinyl butyral, and 3.6 kg of 0.8 mm zirconium balls;

[0183] (2) add ethanol and toluene, dioctyl phthalate, and 0.8 mm zirconium balls to the ceramic powder in sequence, and ball mill to uniformly disperse the ceramic powder in the solvent to obtain a premix, the ball milling time is 6-12 h, and the ball milling speed is 300 rpm;

[0184] (3) add polyvinyl butyral to the premix obtained in step (2) and ball mill to mix thoroughly, the ball milling time is 6-12 h, and the ball milling speed is 300 rpm. After the end, filter through a filter screen to obtain the ceramic slurry, the filter screen mesh size is 500 meshes, and the ceramic slurry viscosity is 500 cps.

[0185] The casting speed is 20 m / min, and the casting thickness is 40 μm.

[0186] The flexible substrate material is PET, and the PET tension is 40 N.

[0187] After the above steps, a ceramic dielectric layer with a thickness of 40 μm is prepared on the surface of the PET film.

[0188] S2, the ceramic film strip is cut to obtain a ceramic film sheet.

[0189] The ceramic film strip is transferred to an automatic sheet cutting machine and cut into a sheet-shaped ceramic film sheet of a desired size. The size of the film sheet is determined according to the size of the printed pattern, and in this embodiment, is 160 mm X 160 mm.

[0190] Specifically, the ceramic sheet is cut together with the flexible substrate to obtain a sheet-shaped ceramic film sheet.

[0191] S3, printing an electrode pattern on the ceramic film sheet to obtain a printed sheet 3, including a printed sheet A and a printed sheet B, wherein the electrode pattern on the printed sheet A is the same as that on the printed sheet B, and the electrode pattern on the printed sheet B is offset in the X-axis direction with the center point of the electrode pattern on the printed sheet A as the reference. The offset distance 33 is the same as the length 41 of the MLCC device, and can be set according to the structure of the MLCC device. In this embodiment, the offset distance is 3.2 mm.

[0192] The front surface of the printed sheet 3 on which the electrode pattern is provided is defined as the front surface, and the back surface of the printed sheet 3 on which the flexible substrate is provided is defined as the back surface.

[0193] S4, positioning holes are processed at the same position of the printed sheet A and the printed sheet B.

[0194] The printed sheet A and the printed sheet B are transferred to an automatic punching machine for punching. Circular Mark points at the same position of the four corners of the printed sheet A and the printed sheet B are punched to obtain the printed sheet A and the printed sheet B after punching.

[0195] The distance between the printed sheet positioning hole 31 and the edge of the electrode pattern area 32 is greater than the offset distance 33, and can be set according to actual needs. In this embodiment, the distance between the printed sheet A and the edge of the electrode pattern area 32 is 5 mm.

[0196] S5, the printed sheet A and the printed sheet B are alternately stacked and hot-pressed to obtain a bar block. The steps include the following steps:

[0197] S51, a ceramic film sheet without an electrode pattern is defined as a blank film sheet 2, and positioning holes are processed on the blank film sheet 2. The blank film sheet 2 is placed on the stacking positioning device with the front surface upward and fixed on the workbench of the hot press according to the blank film sheet positioning hole 21.

[0198] S52, another blank film sheet 2 is placed on the previous blank film sheet 2 with the back surface upward to perform reverse stacking, and the flexible substrate is removed after hot pressing.

[0199] S53, repeat S52, sequentially stack the subsequent blank film 2 in reverse, remove the flexible substrate after hot pressing, and repeat until the blank film 2 is stacked to the required cover thickness to obtain the lower cover, with a thickness of 250 μm;

[0200] S54, place the printed sheet A or printed sheet B with the reverse side up on the uppermost blank film 2 according to the positioning hole for reverse stacking, remove the flexible substrate after hot pressing;

[0201] S55, place another printed sheet B or printed sheet A with the reverse side up on the previous printed sheet A or printed sheet B based on the positioning hole for alternating reverse stacking, remove the flexible substrate after hot pressing;

[0202] S56, repeat S55, alternately stack the printed sheet A and printed sheet B, remove the flexible substrate after hot pressing, and repeat until the printed sheet 3 is stacked to the required number of layers, which is 50 layers;

[0203] S57, place the blank film 2 with the reverse side up on the uppermost printed sheet 3 according to the blank film positioning hole 21 for reverse stacking, remove the flexible substrate after hot pressing;

[0204] S58, place another blank film 2 with the reverse side up on the previous blank film 2 according to the positioning hole for reverse stacking, remove the flexible substrate after hot pressing;

[0205] S59, repeat S58, sequentially stack the blank film 2 in reverse, remove the flexible substrate after hot pressing, and repeat until the blank film 2 is stacked to the required cover thickness to obtain the upper cover, with a thickness of 250 μm.

[0206] The hot pressing conditions are: pressure of 10 T, temperature of 60 °C, and processing time of 60 s. To ensure the hot pressing effect, the hot pressing pressure gradually increases as the blank film 2 or printed sheet 3 is gradually stacked.

[0207] In the above stacking positioning device, the support plate 1 has a size of 200 mm X 200 mm; the base plate positioning hole 11, the blank film positioning hole 21, and the printed sheet positioning hole 31 have a hole diameter of 2 mm, with a hole diameter error of not more than 20 μm; the pin 12 has an outer diameter of 1.98 mm, and a length of 3 mm.

[0208] S6, isostatic pressing process

[0209] The MLCC bar obtained above is laminated, and the lamination processing pressure is 80 MPa, the temperature is 80 °C, and the time is 30 min.

[0210] S7, cutting process

[0211] The laminated MLCC bar is cut by a CCD automatic cutting machine to obtain 1206 specification MLCC green body devices of designed size.

[0212] The subsequent preparation process is the same as the conventional MLCC preparation process: the bar is subjected to glue removal, sintering, chamfering, end sealing, end burning, electroplating and other processes to produce an ultra-thin, high-precision, high-layer MLCC device, thereby obtaining a multilayer ceramic capacitor element.

[0213] The MLCC device prepared in this embodiment has a capacitance of 100 nF and a rated voltage of 500 V.

[0214] According to the above method, 5000 multilayer ceramic capacitor elements of the same specification are prepared, the device processing yield is more than 98%, and the overall equipment procurement and processing energy consumption cost is less than 200,000 yuan.

[0215] Example 3

[0216] The embodiment provides a high-precision low-cost misprint printing method for MLCC, which specifically comprises:

[0217] S1, casting ceramic slurry on a flexible substrate to obtain a ceramic film strip, the specific steps are as follows:

[0218] (1) weigh each raw material, including 550 g of doped 500 nm barium titanate ceramic powder, 200 g of ethanol, 200 g of toluene, 15 g of SC-0505K, 15 g of dioctyl phthalate, 20 g of polyvinyl butyral, and 3.6 kg of 0.8 mm zirconium balls;

[0219] (2) add ethanol and toluene, dioctyl phthalate, and 0.8 mm zirconium balls to the ceramic powder in sequence, and ball mill to uniformly disperse the ceramic powder in the solvent to obtain a premix, the ball milling time is 6-12 h, and the ball milling speed is 300 rpm;

[0220] (3) add polyvinyl butyral to the premix obtained in step (2) and ball mill to mix thoroughly, the ball milling time is 6-12 h, and the ball milling speed is 300 rpm. After the end, filter through a filter screen to obtain the ceramic slurry, the filter screen mesh size is 500 meshes, and the ceramic slurry viscosity is 500 cps.

[0221] The casting speed is 50 m / min, and the casting thickness is 20 μm.

[0222] The flexible substrate material is PET, and the PET tension is 30 N.

[0223] After the above steps, a ceramic dielectric layer covering the surface of the PET film is prepared, and the thickness of the ceramic dielectric layer is 20 μm.

[0224] S2, cutting the ceramic film strip to obtain a ceramic film piece.

[0225] The ceramic film strip is transferred to an automatic cutting machine to cut ceramic film pieces of a desired size. The size of the film pieces is determined according to the size of the printed pattern. In this embodiment, the size is 100 mm x 100 mm.

[0226] Specifically, the ceramic pieces are cut together with the flexible substrate to obtain the piece-type ceramic film pieces.

[0227] S3, printing electrode patterns on the ceramic film pieces to obtain printed pieces 3, including printed piece A and printed piece B, wherein the electrode patterns on the printed piece A and the printed piece B are the same, and the electrode pattern on the printed piece B is offset in the Y-axis direction with the center point of the electrode pattern on the printed piece A as the reference. The offset distance 33 is the same as the width 42 of the MLCC device, and can be set according to the structure of the MLCC device. In this embodiment, the offset distance is 1.6 mm.

[0228] The side of the printed piece 3 on which the electrode pattern is provided is defined as the front side, and the side of the printed piece 3 on which the flexible substrate is provided is defined as the back side.

[0229] S4, positioning holes are processed at the same positions of the printed piece A and the printed piece B.

[0230] The printed piece A and the printed piece B are transferred to an automatic punching machine for punching. Circular Mark points at the same positions of the four corners of the printed piece A and the printed piece B are punched to obtain the printed piece A and the printed piece B after punching.

[0231] The distance between the printed piece positioning hole 31 and the edge of the electrode pattern area 32 is greater than the offset distance 33, and can be set according to actual needs. In this embodiment, the distance is 5 mm, taking the printed piece A as an example.

[0232] S5, the printed piece A and the printed piece B are alternately stacked and processed by hot pressing to obtain a bar piece. The steps include the following steps:

[0233] Preparation of the upper cover piece and the lower cover piece:

[0234] S511, a ceramic film piece without printed electrode patterns is defined as a blank film piece 2, positioning holes are processed on the blank film piece 2, the blank film piece 2 is placed on the stacking positioning equipment with the front side upward and fixed on the workbench of the hot pressing machine according to the positioning holes;

[0235] S512, another blank film piece 2 is placed on the previous blank film piece 2 with the back side upward to perform reverse stacking, and the flexible substrate is removed after hot pressing;

[0236] S513, S512 is repeated, and subsequent blank film pieces 2 are sequentially stacked in reverse, processed by hot pressing, and the flexible substrate is removed after hot pressing. The blank film pieces 2 are stacked to a desired thickness of the cover piece, and the upper cover piece and the lower cover piece are prepared. The thicknesses of the upper cover piece and the lower cover piece are 300 μm, respectively.

[0237] Printed sheet 3 transverse lamination processing:

[0238] S521, the lower cover sheet is placed on the lamination positioning device according to the blank film sheet positioning hole 21, fixed on the workbench of the hot press, the printed sheet A or the printed sheet B is placed on the lower cover sheet with the reverse side upward according to the printed sheet positioning hole 31, and the flexible substrate is removed after hot pressing;

[0239] S522, another printed sheet B or printed sheet A is placed on the previous printed sheet 3 with the reverse side upward based on the printed sheet positioning hole 31 to perform alternating transverse lamination, and the flexible substrate is removed after hot pressing;

[0240] S523, repeat S522, alternately transverse laminate printed sheet A and printed sheet B, remove the flexible substrate after hot pressing, and repeat until the printed sheet 3 is laminated to the required number of layers; the number of layers is 50 layers.

[0241] The upper cover sheet is placed on the uppermost printed sheet 3 according to the blank film sheet positioning hole 21, and hot pressing is performed to make a bar block.

[0242] The hot pressing conditions are: pressure is 50 T, temperature is 50 ℃, and processing time is 30 s. In order to ensure the hot pressing effect, the hot pressing pressure is gradually increased as the blank film sheet 2 or the printed sheet 3 is gradually laminated.

[0243] In the above lamination positioning device, the size of the supporting plate 1 is 200 mm X 200 mm; the hole diameter of the base plate positioning hole 11, the blank film sheet positioning hole 21 and the printed sheet positioning hole 31 is 2 mm, and the hole diameter error is not more than 20 μm; the outer diameter of the pin 12 is 1.98 mm, and the length of the pin 12 is 3 mm.

[0244] S6, isostatic pressing process

[0245] The MLCC bar block prepared above is laminated, and the lamination processing pressure is 80 MPa, the temperature is 80 ℃, and the time is 30 min.

[0246] S7, cutting process

[0247] The above laminated MLCC bar block is cut by a CCD automatic cutting machine to obtain a 1206 specification MLCC green body device with a designed size.

[0248] The subsequent preparation process is the same as the conventional MLCC preparation process: the bar block is subjected to glue removal, sintering, chamfering, end sealing, end burning, electroplating and other processes to produce an ultra-thin, high-precision, high-layer MLCC device, and a multilayer ceramic capacitor element is obtained.

[0249] The MLCC device prepared in this embodiment has a capacitance of 200 nF and a rated voltage of 200 V.

[0250] According to the above method, 5000 multilayer ceramic capacitor elements of the same specification are prepared, the device processing yield reaches more than 98%, and the overall equipment procurement and processing energy consumption cost is less than 200,000 yuan.

[0251] Embodiment 4

[0252] The embodiment provides a high-precision and low-cost misprint method for an MLCC, and specifically comprises the following steps:

[0253] S1, casting ceramic slurry on a flexible substrate to obtain a ceramic film strip, and the specific steps are as follows:

[0254] (1) weigh each raw material, including 550 g of doped 500 nm barium titanate ceramic powder, 200 g of ethanol, 200 g of toluene, 15 g of SC-0505K, 15 g of dioctyl phthalate, 20 g of polyvinyl butyral, and 3.6 kg of 0.8 mm zirconium balls;

[0255] (2) add ethanol and toluene, dioctyl phthalate, and 0.8 mm zirconium balls into the ceramic powder in sequence, and ball mill to uniformly disperse the ceramic powder in the solvent to obtain a premix, the ball milling time is 6-12 h, and the ball milling speed is 300 rpm;

[0256] (3) add polyvinyl butyral into the premix obtained in step (2) and ball mill to fully mix, the ball milling time is 6-12 h, and the ball milling speed is 300 rpm. After the end, filter through a filter screen to obtain the ceramic slurry, the mesh number of the filter screen is 500 meshes, and the viscosity of the ceramic slurry is 500 cps.

[0257] The casting speed is 50 m / min, and the casting thickness is 5 μm.

[0258] The flexible substrate material is PET, and the PET tension is 30 N.

[0259] After the above steps, the ceramic dielectric layer covering the surface of the PET film is prepared, and the thickness of the ceramic dielectric layer is 5 μm.

[0260] S2, cutting the ceramic film strip to obtain a ceramic film piece.

[0261] The ceramic film strip is transferred to an automatic cutting machine, and is cut into a roll-shaped ceramic film piece with a required size, and the size of the film piece is determined according to the size of the printing pattern, and in this embodiment, the size is 100 mm X 100 mm.

[0262] Specifically, the ceramic piece is cut together with the flexible substrate to obtain a sheet-shaped ceramic film piece.

[0263] S3, print electrode patterns on the ceramic film to obtain printed sheets 3, including printed sheet A and printed sheet B, wherein the electrode patterns on the printed sheet A and the printed sheet B are the same, and the electrode patterns on the printed sheet B are offset in the X-axis direction based on the center point of the electrode patterns on the printed sheet A. The offset distance 33 is the same as the length 41 of the MLCC device, and can be set according to the structure of the MLCC device. In this embodiment, the offset distance 33 is 1.6 mm.

[0264] The side of the printed sheet 3 provided with the electrode patterns is defined as the front side, and the side of the printed sheet 3 provided with the flexible substrate is defined as the back side.

[0265] S4, perform positioning hole processing on the same positions of the printed sheet A and the printed sheet B.

[0266] Transfer the printed sheet A and the printed sheet B to an automatic punching machine to punch holes. Punch the circular Mark points at the same positions of the four corners of the printed sheet A and the printed sheet B to obtain the printed sheet A and the printed sheet B after punching.

[0267] The distance between the positioning hole 31 of the printed sheet and the edge of the electrode pattern area 32 is greater than the offset distance 33, which can be set according to actual needs. In this embodiment, the distance between the positioning hole 31 of the printed sheet A and the edge of the electrode pattern area 32 is 5 mm.

[0268] S5, alternately stack and hot-press the printed sheet A and the printed sheet B to obtain a bar block. The steps include the following steps:

[0269] Preparation of the upper cover sheet and the lower cover sheet:

[0270] S511, define the ceramic film without printed electrode patterns as a blank film 2, and process positioning holes on the blank film 2. Place the blank film 2 with the front side upward on the stacking positioning equipment according to the positioning holes, and fix the blank film 2 on the workbench of the hot press;

[0271] S512, place another blank film 2 with the back side upward on the previous blank film 2 according to the positioning holes to perform reverse stacking. Remove the flexible substrate after hot-pressing;

[0272] S513, repeat S512 to sequentially perform reverse stacking and hot-pressing on the subsequent blank films 2, and remove the flexible substrate after hot-pressing. Repeat until the blank films 2 are stacked to the required thickness of the cover sheet to obtain the upper cover sheet and the lower cover sheet. The thicknesses of the upper cover sheet and the lower cover sheet are 250 μm, respectively.

[0273] Reverse stacking processing of the printed sheet 3:

[0274] S521, place the lower cover sheet on the stacking positioning equipment according to the blank film positioning hole 21, and fix the lower cover sheet on the workbench of the hot press. Place the printed sheet A or the printed sheet B with the back side upward on the lower cover sheet according to the printed sheet positioning hole 31, and remove the flexible substrate after hot-pressing;

[0275] S522, alternately and reversely stack another printing sheet B or the reverse of printing sheet A on the previous printing sheet 3 based on the printing sheet positioning hole 31, and remove the flexible substrate after hot pressing;

[0276] S523, repeat S522 to alternately and reversely stack the printing sheet A and the printing sheet B, and remove the flexible substrate after hot pressing, and repeat until the printing sheet 3 is stacked to the required number of layers; the number of layers is 200 layers.

[0277] Place the upper cover sheet on the uppermost layer of printing sheet 3 according to the blank film sheet positioning hole 21, and hot press to make a Ba block.

[0278] The hot pressing conditions are: pressure 50 T, temperature 50℃, and processing time 30s. In order to ensure the hot pressing effect, the hot pressing pressure is gradually increased as the blank film sheet 2 or the printing sheet 3 is gradually stacked.

[0279] In the above stacking positioning device, the size of the supporting plate 1 is 200mm X 200mm; the hole diameter of the substrate positioning hole 11, the blank film sheet positioning hole 21 and the printing sheet positioning hole 31 is 2mm, and the hole diameter error is not more than 20μm; the outer diameter of the pin 12 is 1.98mm, and the length of the pin 12 is 3mm.

[0280] S6, isostatic pressing process

[0281] Laminate the above prepared MLCC Ba block, and the pressure for laminating is 80MPa, the temperature is 80℃, and the time is 30min.

[0282] S7, cutting process

[0283] Cut the above laminated MLCC Ba block by a CCD automatic cutting machine to obtain a 1206 specification MLCC green body device with a designed size.

[0284] The subsequent preparation process is the same as the conventional MLCC preparation process: the Ba block is subjected to glue removal, sintering, chamfering, end sealing, end burning, electroplating and other processes to produce an ultra-thin, high-precision and high-layer MLCC device, thereby obtaining a multilayer ceramic capacitor element.

[0285] The MLCC device prepared in this embodiment has a capacitance value of 3μF and a rated voltage of 25V.

[0286] According to the above method, 5000 multilayer ceramic capacitor elements of the same specification are prepared, the device processing yield is more than 98%, and the overall equipment procurement and processing energy consumption cost is less than 200,000 yuan.

[0287] Example 5

[0288] The embodiment provides a MLCC high-precision low-cost misprint method, which specifically comprises:

[0289] S1, the ceramic slurry is cast on a flexible substrate to obtain a ceramic film tape, the specific steps are as follows:

[0290] (1) weigh each raw material, including 550 g of doped 500 nm barium titanate ceramic powder, 200 g of ethanol, 200 g of toluene, 15 g of SC-0505K, 15 g of dioctyl phthalate, 20 g of polyvinyl butyral, and 3.6 kg of 0.8 mm zirconium balls;

[0291] (2) add ethanol and toluene, dioctyl phthalate, and 0.8 mm zirconium balls to the ceramic powder in sequence, ball mill to uniformly disperse the ceramic powder in the solvent, obtain a premix, ball mill for 6-12 hours, ball mill speed 300 rpm;

[0292] (3) add polyvinyl butyral to the premix obtained in step (2) and ball mill to mix thoroughly, ball mill for 6-12 hours, ball mill speed 300 rpm. After completion, filter with a filter screen to obtain the ceramic slurry, the filter screen has a mesh size of 500 meshes, and the ceramic slurry has a viscosity of 500 cps.

[0293] The casting speed is 50 m / min, and the casting thickness is 5 μm.

[0294] The flexible substrate material is PET, and the PET tension is 30 N.

[0295] After the above steps, a ceramic dielectric layer covering the surface of the PET film is obtained, and the thickness of the ceramic dielectric layer is 5 μm.

[0296] S2, the ceramic film tape is cut and processed to obtain a roll-type ceramic film tape.

[0297] The ceramic film tape is transferred to an automatic cutting machine and cut into a roll-type ceramic film piece of a desired size. The size of the film piece is determined according to the size of the printed pattern. In this embodiment, the size of the film piece is 100 mm X 100 mm.

[0298] Specifically, the ceramic pieces are cut separately, and the flexible substrates of adjacent ceramic pieces are connected, i.e., the printed pieces 3 and the blank film pieces 2 of the same size are located on the continuous flexible substrate film tape, and a roll-type ceramic film tape is obtained.

[0299] S3, print electrode patterns on the ceramic film pieces to obtain a roll-type printed film tape, including a roll-type printed film tape A and a roll-type printed film tape B, which respectively include a printed piece A and a printed piece B. The electrode patterns on the printed piece A and the printed piece B are the same, and the electrode pattern on the printed piece B is offset in the X-axis direction with the center point of the electrode pattern on the printed piece A as the reference. The offset distance 33 corresponds to the same length 41 of the MLCC device, which can be set according to the structure of the MLCC device. In this embodiment, the offset distance is 1.6 mm.

[0300] The side of the printed sheet 3 provided with the electrode pattern is defined as the front side, and the side of the printed sheet 3 decorated with the flexible substrate is defined as the back side.

[0301] S4, positioning hole processing is performed on the same position of the printed sheet A and the printed sheet B.

[0302] The roll-type printed film strip A and the roll-type printed film strip B are transferred to the automatic punching machine, and the printed sheet A and the printed sheet B are punched, and the circular Mark points at the same position of the four corners of the printed sheet A and the printed sheet B are punched to obtain the punched printed sheet A and the printed sheet B.

[0303] The distance between the printed sheet positioning hole 31 and the edge of the electrode pattern area 32 is greater than the offset distance 33, which can be set according to actual needs. In this embodiment, the distance is 5 mm, taking the printed sheet A as an example.

[0304] S5, the printed sheet A and the printed sheet B are alternately stacked and hot-pressed to form a bar block. The steps include:

[0305] Preparation of the upper cover sheet and the lower cover sheet:

[0306] S511, the ceramic film sheet without printed electrode pattern is defined as a blank film sheet 2, and a positioning hole is processed on the blank film sheet 2. The blank film sheet 2 is placed on the stacking positioning device with the front side upward, and is fixed on the workbench of the hot press;

[0307] S512, the roll-type blank printed film strip decorated with the blank film sheet 2 is prepared, and another blank film sheet 2 is placed on the previous blank film sheet 2 with the back side upward to perform reverse stacking, and the flexible substrate is removed after hot-pressing processing;

[0308] S513, S512 is repeated, and another blank film sheet 2 is placed on the previous blank film sheet 2 with the back side upward to perform reverse stacking, and the flexible substrate is removed after hot-pressing processing; the above steps are repeated until the blank film sheet 2 is stacked to the desired thickness of the cover sheet, and the upper cover sheet and the lower cover sheet are prepared, and the thicknesses are 250 μm respectively;

[0309] Reverse stacking processing of the printed sheet 3:

[0310] S521, the lower cover sheet is placed on the stacking positioning device according to the blank film positioning hole 21, and is fixed on the workbench of the hot press. The printed ceramic film strip A and the printed ceramic film strip B are prepared, and the printed sheet A or the printed sheet B is placed on the lower cover sheet with the back side upward according to the printed sheet positioning hole 31, and the flexible substrate is removed after hot-pressing processing;

[0311] S522, another printed sheet B or printed sheet A is placed on the previous printed sheet 3 with the back side upward to perform reverse stacking, and the flexible substrate is removed after hot-pressing processing;

[0312] S523, repeat S522, after the printing sheet A and printing sheet B are alternately and reversely stacked and hot-pressed, the flexible substrate is removed, and the process is repeated until the printing sheet 3 is stacked to the required number of layers; the number of layers is 200 layers.

[0313] The upper cover sheet is placed on the uppermost printing sheet 3 according to the blank film sheet positioning hole 21, and hot-pressed to form a bar block.

[0314] The hot-pressing conditions are: pressure 50 T, temperature 50 DEG C, and processing time 30 s. In order to ensure the hot-pressing effect, as the blank film sheet 2 or the printing sheet 3 is gradually stacked, the hot-pressing pressure is gradually increased.

[0315] In the above-mentioned stacking positioning device, the size of the supporting plate 1 is 200 mm X 200 mm; the hole diameter of the substrate positioning hole 11, the blank film sheet positioning hole 21 and the printing sheet positioning hole 31 is 2 mm, and the hole diameter error is not more than 20 μm; the outer diameter of the pin 12 is 1.98 mm, and the length of the pin 12 is 3 mm.

[0316] S6, isostatic pressing process

[0317] The MLCC bar block prepared above is laminated, and the lamination processing pressure is 80 MPa, the temperature is 80 DEG C, and the time is 30 min.

[0318] S7, cutting process

[0319] The MLCC bar block after lamination is cut by a CCD automatic cutting machine to obtain a 1206 specification MLCC green body device of a designed size.

[0320] The subsequent preparation process is the same as the conventional MLCC preparation process: the bar block is subjected to glue removal, sintering, chamfering, end sealing, end burning, electroplating and other processes to form an ultra-thin, high-precision, high-layer MLCC device, and a multilayer ceramic capacitor element is obtained.

[0321] The MLCC device prepared in this embodiment has a capacitance value of 3 μF and a rated voltage of 25 V.

[0322] According to the above method, 5000 multilayer ceramic capacitor elements of the same specification are prepared, the device processing yield is more than 98%, and the overall equipment procurement and processing energy consumption cost is less than 200,000 yuan.

[0323] Example 6

[0324] The embodiment provides a reverse stacking method suitable for all film thickness LTCCs, which specifically comprises:

[0325] S1, laser drilling process

[0326] According to the method of Example 1, the ceramic membrane sheet is prepared by casting and cutting, and the ceramic membrane sheet is processed by a laser machine to prepare positioning holes, cavities, signal holes and the like, wherein the positioning holes are located at the four corner positions of the ceramic substrate.

[0327] S2, thin film circuit pattern processing technology

[0328] The ceramic substrate is processed by thin filmization using a vacuum sputtering machine, and the metal layer is modified. Then, through the steps of glue spraying, exposure and development, etching, and electroplating, a thin film circuit substrate with a circuit pattern is obtained, and the substrate size is 120 mm X 120 mm. The side of the thin film circuit modified with PET is defined as the reverse side, and the other side opposite to it is defined as the front side.

[0329] S3, reverse lamination process

[0330] (1) Place the thin film circuit substrate with the front side upward on the lamination positioning equipment according to the positioning holes;

[0331] (2) Place another thin film circuit substrate with the reverse side upward on the uppermost thin film circuit substrate according to the positioning holes to perform reverse lamination. After hot pressing processing, remove the PET. The subsequent thin film circuit substrates are sequentially reverse laminated, and after hot pressing processing, the PET is removed. Repeat the lamination to the required number of layers to obtain a stacked block.

[0332] The pressure of the hot pressing processing is 10-100 T, the temperature is 50-80 ℃, and the processing time is 10-60 s;

[0333] In the lamination positioning equipment, the supporting plate has a size of 200 mm x 200 mm, a surface roughness Ra<0.1 μm, and a metal plate material.

[0334] The position of the substrate positioning hole 11 and the aperture of the thin film circuit positioning hole are 2 mm, and the aperture error is not more than 20 μm.

[0335] The number of pins is 4, the outer diameter of the pin 12 is 1.98 mm, and the length of the pin 12 is greater than the thickness of the stacked block, which is 3 mm.

[0336] S4, curing process

[0337] The stacked block prepared above is kept in a 200 ℃ oven for 10 min, and after cooling, the laminated circuit board substrate is taken out from the lamination positioning equipment.

[0338] S5, cutting process

[0339] A 0.2 mm diamond sand cutter is assembled on a grinding wheel cutting machine to cut the laminated and cured circuit board substrate to obtain a 0603 specification LTCC ceramic component.

[0340] The LTCC device prepared in the embodiment has a rated power of 2W and an electrostatic discharge protection of no less than 4kV.

[0341] According to the above method, 500 elements of the same specification are prepared, the device processing yield is more than 98%, and the overall equipment procurement and processing energy consumption cost is less than 200,000 yuan.

[0342] Comparative Example 1

[0343] The difference between the present comparative example and Example 1 is that the present comparative example comprises the following steps:

[0344] S1, preparing ceramic slurry to obtain the same slurry as in Example 1.

[0345] S2, casting the ceramic slurry on a flexible substrate to obtain a roll-type ceramic membrane strip.

[0346] The ceramic slurry prepared in step S1 is used to prepare a roll-type ceramic membrane strip with a desired thickness by using a film casting machine. The thickness of the ceramic membrane strip is controlled by adjusting the slurry viscosity, casting speed, slurry supply pressure, and PET tension.

[0347] The casting speed is 1 m / min and the casting thickness is 1 μm.

[0348] The PET tension of the flexible substrate is 20 N.

[0349] S3, roll-to-roll printing: using a roll-to-roll printing machine to print metal electrodes on the ceramic membrane and dry to obtain a roll-type printed membrane strip, which is then transferred to a roll-to-roll laminating machine for lamination.

[0350] S4, roll-to-roll lamination, comprising the following steps:

[0351] S41, feeding: placing the roll-type printed ceramic membrane strip at a designated position of the roll-to-roll processing equipment;

[0352] S42, conveying the roll-type printed ceramic membrane strip with the PET substrate to a designated picking position;

[0353] S43, picking: the equipment cuts the roll-type printed ceramic membrane strip into printed ceramic membrane pieces of a set size, the upper die of the equipment is lowered to contact the surface of the printed ceramic membrane piece, the printed piece is then vacuum-sucked and transferred to above the lower die;

[0354] S44, lamination: the lower die printed ceramic membrane piece Mark point is recognized by a high-precision CCD, the printed piece is programmed to be misaligned based on the lower die printed ceramic membrane piece Mark point by the upper die, and the printed ceramic membrane piece is placed on the existing printed ceramic membrane piece in the lower die and subjected to hot pressing. This process is repeated until the set number of layers is reached. The prepared Bak block has an upper cover piece and a lower cover piece with a thickness of 425 μm, and 500 layers of printed pieces, and the specification parameters are the same as those of the device prepared in Example 1.

[0355] The subsequent preparation process is the same as the conventional MLCC preparation process: the bar is laminated, cut, de-bonded, sintered, chamfered, end-capped, end-burned, and electroplated to form a 1206-specification MLCC device with ultra-thin, high-precision, and high-layer number, thereby obtaining a multilayer ceramic capacitor element.

[0356] The MLCC device prepared in the present comparative example has a capacitance of 33 μF and a rated voltage of 6.3 V, which is basically the same as the performance of the element prepared in Example 1.

[0357] According to the above method, 500 multilayer ceramic capacitor elements of the same specification are prepared, and the device processing yield fails to reach the expectation, being only about 95%, mainly because the high-precision recognition stacking offset error and the poor peeling effect in the flexible substrate separation process cause the yield to decrease slightly; in the actual processing process, the imported equipment used in Comparative Example 1 costs about 7-10 million yuan, in which the power consumption of the equipment in the vacuum adsorption printing process is large, the high-precision CCD recognition accuracy fails to reach the expectation, leading to the performance of the MLCC device being insufficient, and the process cost being extremely high.

[0358] Although the present application has been disclosed with reference to the preferred embodiments above, it is not intended to limit the present application. Those skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be defined by the claims.

[0359] In addition, it should be understood that although the present specification is described in terms of embodiments, each embodiment does not contain only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be properly combined to form other embodiments that those skilled in the art can understand. The technical details not described in detail in the present application can be realized by any existing technology in the art. In particular, all technical features not described in detail in the present application can be realized by any existing technology.

Claims

1. A high-precision, low-cost misaligned printing reverse lamination method for MLCCs, characterized in that, Includes the following steps: S1. A ceramic film tape is obtained by casting ceramic slurry onto a flexible substrate; S2. The ceramic membrane strip is cut to obtain a roll-type ceramic membrane strip, which includes several ceramic membrane sheets of the same specifications. S3. Print electrode patterns on the front side of the ceramic film on the same roll-type ceramic film tape to obtain printed ceramic film tape A and printed ceramic film tape B, respectively including printed sheet A and printed sheet B; wherein the electrode patterns on printed sheet A and printed sheet B are the same, and the electrode pattern on printed sheet B is offset along the X-axis or Y-axis direction with the center point of the electrode pattern on printed sheet A as a reference. S4. Positioning holes are machined at the same position on printed sheet A and printed sheet B respectively; S5. The printed ceramic film strip A and the printed ceramic film strip B are conveyed to the designated stacking position along with the flexible substrate. The printed sheet A and the printed sheet B are alternately stacked in reverse. The reverse stacking process includes stacking the printed sheet A and the printed sheet B in reverse face to face through the positioning hole, then hot pressing, then removing the flexible substrate, and repeating the reverse stacking until the required number of layers is reached. The S5 also includes: The ceramic film without printed electrode patterns is defined as a blank film, and positioning holes are processed on the blank film. The blank films are then processed by reverse stacking in sequence, and the reverse stacking is repeated until the required thickness is reached, to make an upper cover and a lower cover respectively. The printed sheet A and the printed sheet B are placed on the lower cover sheet and alternately laminated in reverse, and the reverse lamination is repeated until the required number of layers is reached. The top cover sheet is placed on the topmost printed sheet and hot-pressed to form a block.

2. The high-precision, low-cost misaligned printing reverse lamination method for MLCCs according to claim 1, characterized in that, In step S3, the electrode pattern of the printed wafer B is offset by the same distance along the X-axis as the length of the MLCC device; the electrode pattern of the printed wafer B is offset by the same distance along the Y-axis as the width of the MLCC device.

3. The high-precision, low-cost misaligned printing reverse lamination method for MLCCs according to claim 1, characterized in that, The preparation steps of the upper cover sheet or the lower cover sheet include: S511. Place the blank film face up on the stacking positioning device according to the positioning hole, and fix it on the hot press workbench. S512. Place another blank film on the previous blank film with the opposite side of the positioning hole facing up to perform reverse lamination, and remove the flexible substrate after hot pressing. S513. Repeat S512, sequentially reverse-stack the blank films, hot-press them, and remove the flexible substrate, repeating until the blank films are stacked to the required thickness. The reverse lamination preparation steps of the printed sheet include: S521. Place the lower cover sheet on the stacking positioning device according to the positioning hole, fix it on the hot press workbench, place the printed sheet A or the printed sheet B with the reverse side facing up on the lower cover sheet according to the positioning hole, and remove the flexible substrate after hot pressing. S522. Place another printed sheet B or printed sheet A with its reverse side facing up on top of the previous printed sheet A or printed sheet B based on the positioning holes, and perform alternating reverse stacking. After hot pressing, remove the flexible substrate. S523. Repeat S522, alternately stack the printed sheet A and the printed sheet B in reverse, hot press them and then remove the flexible substrate, repeat until the printed sheets are stacked to the required number of layers; The top cover sheet is placed on the topmost printed sheet and hot-pressed to form a block.

4. The high-precision, low-cost misaligned printing reverse lamination method for MLCCs according to claim 1, characterized in that, S5 includes the following steps: S51. Define the ceramic film without printed electrode pattern as a blank film, process positioning holes on the blank film, place the blank film face up on the stacking positioning device according to the positioning holes, and fix it on the hot press workbench. S52. Place another blank film on the previous blank film with the opposite side of the positioning hole facing up for reverse stacking, and remove the flexible substrate after hot pressing; then repeat the reverse stacking and hot pressing of subsequent blank films until the blank films are stacked to the required thickness. S53. Place the printed sheet A or the printed sheet B with its reverse side facing up on the uppermost blank film according to the positioning holes for reverse stacking. After hot pressing, remove the flexible substrate. Then, place another printed sheet B or printed sheet A with its reverse side facing up on the previous printed sheet A or printed sheet B according to the positioning holes for alternating reverse stacking. After hot pressing, remove the flexible substrate. Repeat until the printed sheets are stacked to the required number of layers. S54. Place the blank film with its reverse side facing up on the top printed film according to the positioning holes for reverse lamination, and remove the flexible substrate after hot pressing. S55. Another blank film is placed on the previous blank film with the opposite side of the positioning hole facing up, and then stacked in reverse order. After hot pressing, the flexible substrate is removed, and the process is repeated until the blank films are stacked to the required thickness.

5. A high-precision, low-cost misaligned printing reverse lamination method for MLCCs according to claim 3 or 4, characterized in that, The blank film is the same size as the printed film, and positioning holes are machined at the same position on the blank film and the printed film.

6. A high-precision, low-cost misaligned printing reverse lamination method for MLCCs according to claim 3 or 4, characterized in that, The stacking positioning device includes a support plate and pins, and the support plate is provided with a substrate positioning hole; The position and number of the pins are set to correspond to the positioning holes of the substrate, and the pins are fixed to the support plate through the positioning holes of the substrate. The size of the support plate is greater than or equal to the size of the printed sheet; The positions of the substrate positioning holes correspond to the positions of the blank film positioning holes and the printed film positioning holes; The printed sheet or the blank film is placed on the support plate through the pin sleeve based on the positioning hole of the printed sheet or the positioning hole of the blank film.

7. An electronic component, characterized in that, The electronic components are made from blocks produced by the high-precision, low-cost misaligned printing reverse lamination method of MLCC as described in claim 1 or 3, and are then processed by lamination, cutting, glue removal, sintering, chamfering, end sealing, end burning, and electroplating.

8. An electronic component according to claim 7, characterized in that, The electronic components include, but are not limited to, MLCC, LTCC, and HTCC devices.

Images