Aerosol generating device

Abstract

The invention relates to an aerosol generating device which comprises a microwave heating assembly, the microwave heating assembly comprises an outer conductor unit and an inner conductor unit, the outer conductor unit is provided with a cavity, the inner conductor unit is arranged in the cavity, and the aerosol generating device further comprises a radio frequency board and an oscillator arranged on the radio frequency board. A part of the structure of the radio frequency board is inserted into the cavity and is magnetically coupled with the inner conductor unit. According to the aerosol generating device, microwave energy is directly transmitted by using the radio frequency board, and a microwave feed-in terminal is omitted and a simpler energy coupling structure is formed by directly inserting a part of the structure of the radio frequency board into the outer conductor unit to be magnetically coupled with the inner conductor unit.

Description

Technical Field

[0001] This invention relates to the field of aerosol generation technology, and more particularly to an aerosol generating device. Background Technology

[0002] The aerosol generating device can use microwave heating to heat the aerosol-generated products.

[0003] In related technologies, aerosol generating devices include a microwave generating component and a microwave heating component; wherein, the microwave heating component includes a microwave feed terminal and an inner conductor unit; the microwave generating component needs to transfer microwave energy to the inner conductor unit through the microwave feed terminal. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an aerosol generating device.

[0005] The technical solution adopted by the present invention to solve its technical problem is: to construct an aerosol generating device, including a microwave heating component, the microwave heating component including an outer conductor unit and an inner conductor unit, the outer conductor unit having a cavity, the inner conductor unit being disposed in the cavity, the aerosol generating device further including a radio frequency board and an oscillator mounted on the radio frequency board, a portion of the structure of the radio frequency board being inserted into the cavity and magnetically coupled to the inner conductor unit.

[0006] In some embodiments, the radio frequency board includes a board body and a transmission line structure formed on the board body; a portion of the transmission line structure is disposed in the cavity and magnetically coupled to the inner conductor unit.

[0007] In some embodiments, the board includes a main board and a plug-in board connected to the main board; the main board is disposed outside the outer conductor unit, and the plug-in board is used to be inserted into the cavity;

[0008] The transmission line structure includes a second microstrip line formed on the motherboard and a first microstrip line formed on the plug-in board; the oscillator is connected to the first microstrip line through the second microstrip line, and the first microstrip line is used for magnetic coupling with the inner conductor unit.

[0009] In some embodiments, the shape and structure of the first conductive strip of the first microstrip line includes one or a combination of strip structure and planar structure.

[0010] In some embodiments, the shape of the first conductive strip of the first microstrip line includes one or a combination of at least two of the following shapes: spiral, grid, square, and trapezoidal.

[0011] In some embodiments, the first microstrip line is disposed outside the inner conductor unit;

[0012] The insert includes a first dielectric layer and a first conductive layer, wherein the first conductive layer is disposed on the side of the first dielectric layer facing away from the inner conductor unit; and the first conductive strip of the first microstrip line is disposed on the first conductive layer.

[0013] Alternatively, the insert includes a first dielectric layer and a first conductive layer, wherein the first conductive layer is disposed on the side of the first dielectric layer facing the inner conductor unit; and the first conductive strip of the first microstrip line is disposed on the first conductive layer.

[0014] Alternatively, the insert includes a first conductive layer, a first dielectric layer, and a first ground layer, with the first dielectric layer disposed between the first conductive layer and the first ground layer; the first conductive strip of the first microstrip line is disposed on the first conductive layer and faces the inner conductor unit.

[0015] In some embodiments, the outer conductor unit is cylindrical and includes a first end and a second end opposite to the first end;

[0016] The insert plate is configured to be inserted into the cavity from the end wall of the first end.

[0017] In some embodiments, the inner conductor unit has a longitudinally elongated structure, the first microstrip line is disposed on the outer circumferential direction of the inner conductor unit, and the plane in which the first microstrip line is located is parallel to the axial direction of the inner conductor unit.

[0018] In some embodiments, the inner conductor unit includes a conductor post and a probe, one end of the conductor post being connected to the end wall of the first end, and the probe being connected to the other end of the conductor post;

[0019] The insert plate is disposed on the outer circumference of the conductor post, and the plane in which the insert plate is located is parallel to the axial direction of the conductor post.

[0020] In some embodiments, the inner conductor unit further includes a conductor disk coupled to the end of the conductor post away from the first end; the probe is embedded in the conductor disk.

[0021] The present invention has the following advantages: This aerosol generating device uses a radio frequency board to directly transmit microwave energy. By directly inserting part of the radio frequency board into the outer conductor unit and magnetically coupling it with the inner conductor unit, the microwave feed terminal is omitted, and a simpler energy coupling structure is formed. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0023] Figure 1 This is a schematic diagram of the structure of the microwave heating component and the radio frequency board in some embodiments of the present invention;

[0024] Figure 2 This is a longitudinal cross-sectional view of the microwave heating component and the radio frequency board in embodiment 1 of the present invention at a first angle.

[0025] Figure 3 This is a partial structural schematic diagram of the radio frequency board of Embodiment 1 of the present invention;

[0026] Figure 4 This is a longitudinal cross-sectional view of the microwave heating assembly and the radio frequency board in embodiment 1 of the present invention at a second angle.

[0027] Figure 5 This is a circuit diagram of the microwave heating component and the radio frequency board in one embodiment of the present invention;

[0028] Figure 6 This is a longitudinal cross-sectional view of the microwave heating component and the radio frequency board in embodiment 2 of the present invention at a second angle.

[0029] Figure 7 This is a partial structural schematic diagram of the radio frequency board of Embodiment 2 of the present invention.

[0030] Figure label:

[0031] Microwave heating component 200; aerosol generating product 300;

[0032] RF board 1; board body 11; insert plate 111; first conductive layer 1111; first dielectric layer 1112; first ground layer 1113; main board 112; second conductive layer 1121; second dielectric layer 1122; second ground layer 1123; transmission line structure 12; first microstrip line 121; first conductive strip 1211; second microstrip line 122; second conductive strip 1221; outer conductor unit 2; first end 21; second end 22; cavity 23; conductor sidewall 24; conductor endwall 25; socket 26; inner conductor unit 3; conductor post 31; conductor disk 32; probe 33; housing base 4; housing part 41; housing cavity 42; air passage 43. Detailed Implementation

[0033] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0034] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0035] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0036] This invention provides an aerosol generating device that can utilize microwave heating to generate aerosol products 300 (see reference). Figure 3 However, it should be noted that Figure 3Only a portion of the aerosol generating article 300 is shown, which is used to atomize and generate an aerosol for inhalation or inhalation by a user. In some embodiments, the aerosol generating article 300 is a solid aerosol generating article 300, such as a processed plant leaf product. It will be understood that in other embodiments, the aerosol generating article 300 may also be a liquid aerosol generating article 300.

[0037] For reference Figure 1 The aerosol generating device may include a microwave generating component and a microwave heating component 200. The microwave generating component generates microwave energy, which can be transferred to the interior of the microwave heating component 200 and form a microwave field acting on the aerosol generating article 300 therein, thereby achieving microwave heating.

[0038] In some embodiments, reference may be made to Figure 2 The microwave heating assembly 200 may include an outer conductor unit 2 and an inner conductor unit 3. The outer conductor unit 2 has a first end 21 and a second end 22 opposite to the first end 21, and defines a cavity 23 between the first end 21 and the second end 22. At least its inner wall surface is electrically conductive. The inner conductor unit 3 has a fixed end and a free end opposite to the fixed end. The fixed end of the inner conductor unit 3 is in ohmic contact with the first end 21 of the outer conductor unit 2, forming a short-circuit terminal of the microwave heating assembly 200. The free end of the inner conductor unit 3 is located in the cavity 23 but is not in contact with the outer conductor unit 2, forming an open-circuit terminal of the microwave heating assembly 200.

[0039] Understandably, when using this aerosol generating device, it is possible to... Figure 2 As shown, the aerosol generating product 300 is first inserted into the cavity 23. At this time, the free end of the inner conductor unit 3 can be inserted into the interior of the aerosol generating product 300. Of course, the free end of the inner conductor unit 3 can also be located on the periphery of the aerosol generating product 300, which is not specifically limited here. During the operation of this aerosol generating device, the microwave energy transmitted from the microwave generating component can be released from the free end of the inner conductor unit 3 and act on the aerosol generating product 300.

[0040] In some embodiments, reference may be made to Figure 1 The microwave generating assembly may include an RF board 1 and an oscillator (not shown) disposed on the RF board 1. The oscillator can generate microwave signals, while the RF board 1 can transmit, modulate, amplify, and process microwave signals.

[0041] The radio frequency board 1 may include a board body 11 and a transmission line structure 12 formed on the board body 11, the transmission line structure 12 being used to transmit microwave signals. Furthermore, in this invention, reference can be made to… Figure 2Part of the plate 11 and transmission line structure 12 is configured to be directly inserted into the cavity 23 from the outside of the outer conductor unit 2, located outside the inner conductor unit 3, so that this part of the transmission line structure 12 can transmit microwave energy to the inner conductor unit 3 by magnetic coupling. It should be noted that magnetic coupling has the characteristic of contactless transmission, that is, this method can transmit energy without physical contact.

[0042] It can be noted that in related technologies, energy between the RF board 1 and the inner conductor unit 3 needs to be transferred via a microwave feed terminal. One end of the microwave feed terminal is connected to the RF board 1, and the other end is connected to the inner conductor unit 3. However, the microwave feed terminal and the inner conductor unit 3 are prone to poor contact and tip discharge due to thermal expansion and contraction, component size deviation, insertion loss, etc., which leads to low energy utilization efficiency and damage to the RF board 1. In contrast, this invention directly inserts a portion of the RF board 1 into the cavity 23 and magnetically couples it with the inner conductor unit 3. This not only forms a simpler energy coupling structure and saves on the cost of the microwave feed terminal, but also avoids the problems of poor contact and tip discharge.

[0043] Continue as Figure 2 As shown, the board body 11 can be a PCB circuit board, which may include a main board 112 and a plug-in board 111 connected to the main board 112. The main board 112 is disposed outside the outer conductor unit 2, while the plug-in board 111 is configured to be inserted into and disposed within the cavity 23, located outside the inner conductor unit 3. Optionally, the main board 112 and the plug-in board 111 can be integrally formed, for example, cut from a single piece of board; the main board 112 and the plug-in board 111 can also be joined by a connection method such as adhesive bonding, which is not limited here.

[0044] The transmission line structure 12 can be formed on the board 11 by printing. This transmission line structure 12 can be a microstrip line; wherein, for example... Figure 2 As shown, the microstrip line may include a second microstrip line 122 formed on the motherboard 112 and a first microstrip line 121 formed on the insert board 111. Understandably, the second microstrip line 122 and the first microstrip line 121 are located on the same plane, the oscillator is connected to the first microstrip line 121 through the second microstrip line 122, and the first microstrip line 121 is configured to be magnetically coupled to the inner conductor unit 3.

[0045] Further optional, may refer to Figure 3The motherboard 112 may include a second conductive layer 1121, a second dielectric layer 1122, and a second ground layer 1123. The second conductive layer 1121 provides a foundation for circuit layout; the second dielectric layer 1122 is an insulating layer disposed between the second signal layer and the second ground layer 1123; the ground layer is a metal ground plane. The second microstrip line 122 includes a second conductive strip 1221, which may be disposed on the second conductive layer 1121 of the motherboard 112.

[0046] The plug-in board 111 may include at least a first conductive layer 1111 and a first dielectric layer 1112. The first conductive layer 1111 provides the foundation for circuit layout and is laid on the first dielectric layer 1112; the first dielectric layer 1112 is an insulating layer. The first microstrip line 121 includes a first conductive strip 1211, which may be disposed on the first conductive layer 1111 of the plug-in board 111.

[0047] Understandably, since a grounding layer would affect the magnetic coupling between the conductive strip of the microstrip line and the inner conductor unit 3, no grounding layer is provided between the conductive strip and the inner conductor unit 3 in this invention. In other words, when the first conductive strip 1211 faces the inner conductor unit 3, the insert plate 111 may include a first conductive layer 1111, a first dielectric layer 1112, and a first grounding layer 1113. The first grounding layer 1113 is disposed on the side of the first dielectric layer 1112 facing away from the inner conductor unit 3, and the first conductive layer 1111 is disposed on the side of the first dielectric layer 1112 facing the inner conductor unit 3; the first conductive strip 1211 is located between the inner conductor unit 3 and the first dielectric layer 1112. However, when the first conductive strip 1211 is positioned relatively away from the inner conductor unit 3, i.e., as shown... Figure 4 As in the illustrated embodiment, the insert plate 111 may include a first conductive layer 1111 and a first dielectric layer 1112. In this case, the insert plate 111 does not have a first grounding layer 1113 on at least its structural portion located inside the cavity 23. The first conductive layer 1111 is disposed on the side of the first dielectric layer 1112 facing away from the inner conductor unit 3. The surface of the first dielectric layer 1112 facing the inner conductor unit 3 may be directly facing the inner conductor unit 3. The first conductive strip 1211 is located between the first dielectric layer 1112 and the cavity wall of the outer conductor unit 2.

[0048] Optionally, review Figure 3The second conductive strip 1221 can be elongated, with one end connected to the oscillator and the other end connected to the first conductive strip 1211. The first conductive strip 1211 can be a strip structure such as a spiral or grid. Alternatively, it can be a planar structure such as a square or trapezoidal shape; there is no limitation on this. Understandably, the shape and length of the second and first conductive strips 1221 can be designed and adjusted according to product requirements to ensure high-quality microwave signal transmission. For example, the characteristic impedance can be affected by changing the shape of the conductive strips (e.g., by creating bends or corners).

[0049] The following experimental data illustrates the function of the radio frequency board 1 of this invention:

[0050] Please see Figure 5 , Figure 5 The diagram shows the electric field distribution of the radio frequency board 1 and the microwave heating assembly 200 under operation in one embodiment. The electric field distribution refers to the variation of the electric field intensity of the microwave in space, reflecting the energy density and propagation direction of the microwave. It can be seen that although there is no contact between the radio frequency board 1 and the inner conductor unit 3, microwave energy can still be transferred. The transferred microwave energy can be mainly released at the free end of the inner conductor unit 3.

[0051] To further illustrate the present invention, several specific embodiments are listed below to provide a detailed description of the microwave generating assembly and the microwave heating assembly 200. Furthermore, for ease of explanation and understanding, the side / end of the component closest to the second end 22 of the outer conductor unit 2 is referred to as the top / top end, and the side / end of the component furthest from the second end 22 of the outer conductor unit 2 is referred to as the bottom / bottom end.

[0052] Example 1

[0053] Please first examine the structure of the microwave heating assembly 200. As described above, the microwave heating assembly 200 may include an outer conductor unit 2 and an inner conductor unit 3. Additionally, please refer to... Figure 4 The microwave heating assembly 200 may also include a receiving base 4, which can be fixedly or detachably mounted at the second end 22 of the outer conductor unit 2 (it should be noted that...). Figure 4 Only a portion of the structure of the housing 4 is shown (the structure of the housing 4 for mounting on the outer conductor unit 2 is omitted), and it defines a housing cavity 42 for housing the aerosol generating article 300, the free end of the inner conductor unit 3 can extend into the housing cavity 42.

[0054] Of course, the receiving seat 4 is not a necessary component in this invention. It is used as a preferred embodiment to protect the cavity 23 and part of the inner conductor unit 3 from or minimize contamination by mist. In other embodiments, the receiving cavity 42 can also be formed directly in the cavity 23. For example, the aerosol generating article 300 can be directly inserted into the cavity 23 from the second end 22 of the outer conductor unit 2. In this case, the space occupied by the aerosol generating article 300 in the cavity 23 can be regarded as the receiving cavity 42.

[0055] See also Figure 4 The outer conductor unit 2 may include a conductive conductor sidewall 24 and a conductor endwall 25. The conductor sidewall 24 may be cylindrical, but it is not limited to a cylindrical shape; it may also be square, irregularly shaped, or other shapes. The conductor endwall 25 seals the bottom end of the conductor sidewall 24, forming the first end 21 described above; while the top end of the conductor sidewall 24 forms the second end 22 described above. The conductor sidewall 24 and the conductor endwall 25 together define the cavity 23 described above, which is cylindrical. In addition, an axially penetrating insertion hole 26 is provided at the conductor endwall 25, which allows the insertion plate 111 of the RF board 1 to be inserted into the cavity 23.

[0056] The inner conductor unit 3 can be an elongated structure, which may include a microwave matching structure and a microwave radiation structure. The microwave matching structure is arranged between the conductor end wall 25 of the outer conductor unit 2 and the receiving base 4, and is connected to the conductor end wall 25 of the outer conductor unit 2. The microwave radiation structure is integrated with the microwave matching structure, and at least a portion of its structure is located in the receiving cavity 42 for the aerosol generation article 300 to be inserted thereon.

[0057] The microwave matching structure may include conductor pillars 31 and conductor disks 32.

[0058] like Figure 4 As shown, the conductor post 31 can be cylindrical, with a diameter smaller than the inner diameter of the outer conductor unit 2. Of course, the conductor post 31 is not limited to a cylindrical shape; it can also be square, elliptical, stepped, irregular, or other shapes, which are not limited here. The conductor post 31 can stand on the conductor end wall 25 of the outer conductor unit 2. The bottom end of the conductor post 31 can be considered as the fixed end of the inner conductor unit 3.

[0059] The conductor disk 32 can be disc-shaped, and its diameter can be smaller than the inner diameter of the outer conductor unit 2 and larger than the diameter of the conductor post 31. Of course, the shape of the conductor disk 32 is not limited to a disc shape; it can also be a square prism shape, a frustum shape, etc., which are not limited here. The conductor disk 32 can be directly integrally formed on the top of the conductor post 31, or it can be in ohmic contact with the conductor post 31.

[0060] Understandably, the conductor disk 32 is used to increase inductance and capacitance, thereby further reducing the overall size of the microwave heating assembly 200. In other embodiments, the microwave matching structure may consist only of the conductor post 31, with the microwave radiation structure directly bonded to the conductor post 31.

[0061] Continue as Figure 4 As shown, the microwave radiation structure may include an elongated probe 33; the bottom end of the probe 33 is embedded in the microwave matching structure and forms a good ohmic contact with the microwave matching structure, while the top end of the probe 33 extends into the receiving cavity 42. Optionally, the probe 33 may be embedded in the conductor disk 32, or it may be inserted into the conductor post 31 through the conductor disk 32.

[0062] The housing 4 can be made of a high-temperature resistant material with low dielectric loss to effectively prevent microwave absorption. (See reference...) Figure 4 The receiving base 4 may include a receiving part 41 and a fixing part (not shown) connected to the receiving part 41. The receiving part 41 is used to receive the aerosol generating article 300; the fixing part is used to axially seal the second end 22 of the outer conductor unit 2 and fix the receiving part 41 in the cavity 23.

[0063] The fixing part can be annular and coaxially coupled to the top of the receiving part 41. The outer diameter of the fixing part is slightly larger than the inner diameter of the outer conductor unit 2, and it can be installed at the second end 22 of the outer conductor unit 2.

[0064] The receiving portion 41 may be cylindrical, with an outer diameter smaller than the inner diameter of the outer conductor unit 2, and together with the fixing portion, defines an axial receiving cavity 42 for receiving the aerosol generating article 300. The top of the receiving portion 41 is open and communicates with the interior of the fixing portion; and the bottom of the receiving portion 41 can support the aerosol generating article 300. The aerosol generating article 300 can extend through the fixing portion into the receiving portion 41 and sit on the bottom of the receiving portion 41.

[0065] In addition, a number of air passages 43 may be formed in the housing 4. These air passages 43 may be formed on the inner side wall of the fixing part, the inner side wall of the housing part 41 and its inner bottom wall, so that ambient air can reach the bottom of the aerosol generating product 300 through the air passages 43.

[0066] Next, consider the microwave generating component. As described above, the microwave generating component may include an RF board 1 and an oscillator disposed on the RF board 1.

[0067] For reference Figure 2The structure of the radio frequency board 1 is configured to be able to be directly inserted into the cavity 23 from the outside of the outer conductor unit 2 to transmit microwave energy to the inner conductor unit 3 in a magnetic coupling manner; and when the radio frequency board 1 is installed on the outer conductor unit 2, it can be connected parallel to the axial direction of the outer conductor unit 2.

[0068] The radio frequency board 1 may include a board body 11 and a transmission line structure 12 formed on the board body 11; the board body 11 may include a motherboard 112 and a plug-in board 111; the transmission line structure 12 may be a microstrip line, including a second microstrip line 122 formed on the motherboard 112 and a first microstrip line 121 formed on the plug-in board 111.

[0069] Please continue reading. Figure 4 The insert plate 111 can be inserted into the cavity 23 through the socket 26 on the outer conductor unit 2. Optionally, the insert plate 111 can be fixedly connected to the socket 26 by means of snap-fit, adhesive or other methods. After the insert plate 111 is inserted, the insert plate 111 is located on the outer circumferential direction of the conductor post 31 and maintains a distance from the conductor post 31; and the plane on which the insert plate 111 is located is parallel to the axial direction of the conductor post 31.

[0070] In this embodiment, such as Figure 4 As shown, the motherboard 112 may include a second conductive layer 1121, a second dielectric layer 1122, and a second ground layer 1123.

[0071] The insert plate 111 may include a first conductive layer 1111 and a first dielectric layer 1112. After the insert plate 111 is inserted into the cavity 23, the first conductive layer 1111 is located on the side of the first dielectric layer 1112 facing away from the conductor post 31. The first conductive strip 1211 of the first microstrip line 121 has a spiral strip structure, is formed on the first conductive layer 1111, and faces the conductor sidewall 24 of the outer conductor unit 2.

[0072] It can be noted that the closer the first microstrip line 121 is to the conductor post 31, the higher the coupling efficiency. However, if it is too close to the conductor post 31, it may cause tip discharge. Secondly, since the shape, size and other factors of the microstrip line can affect the coupling efficiency, the distance between the first microstrip line 121 and the conductor post 31 needs to be adjusted according to the design of the microstrip line, which is not limited here.

[0073] Example 2

[0074] You can refer to this. Figure 6 The microwave generating assembly in this embodiment is an improvement upon embodiment 1. Specifically, the improvement involves adjusting the orientation of the first microstrip line 121 and changing the shape of the first conductive strip 1211 of the first microstrip line 121. The structure of the microwave heating assembly 200 can be referred to in embodiment 1, and will not be repeated here.

[0075] In this embodiment, such as Figure 6 As shown, the insertion plate 111 of the radio frequency board 1 may include a first conductive layer 1111, a first dielectric layer 1112 and a first ground layer 1113; wherein the first conductive layer 1111 is disposed on the side facing the conductor post 31, and the first ground layer 1113 is located on the side of the first conductive layer 1111 that is away from the inner conductor unit 3.

[0076] The first conductive strip 1211 of the first microstrip line 121 is formed on the first conductive layer 1111, with its surface facing the conductor pillar 31. In this embodiment, as... Figure 7 As shown, the first conductive strip 1211 of the first microstrip line 121 has a grid-like strip structure.

[0077] In summary, two embodiments have been provided in this invention to illustrate the structure of the radio frequency board 1 and the microwave heating assembly 200, as well as the connection between them. In these embodiments, a portion of the structure of the radio frequency board 1 can be directly inserted into the cavity 23 and magnetically coupled to the inner conductor unit 3. This allows for a simpler energy coupling structure, saving on the cost of the microwave feed terminal, and avoids problems such as poor contact and tip discharge.

[0078] It should be noted that this can be used as a reference. Figure 4 The insert plate 111 can be further divided into a first structural part (not shown) located within the cavity 23 and a second structural part (not shown) located within the socket 26. Since magnetic coupling cannot be interfered with by a grounding layer, there cannot be a grounding layer between the conductive strip and the conductor post 31. That is, the first structural part can only have a conductive layer and a dielectric layer, while whether the second structural part has a grounding layer does not affect the magnetic coupling and can be set according to product requirements.

[0079] Secondly, although the above embodiments only illustrate the case where the insert plate 111 and the first microstrip line 121 are located below the conductor disk 32, in reality, the insert plate 111 and the first microstrip line 121 can also be extended upwards, for example, located on the outer circumference of the microwave radiation structure (probe 33). Moreover, this arrangement can make the design of the microstrip line easier and reduce the difficulty of achieving the desired coupling efficiency. In summary, the insert plate 111 and the first microstrip line 121 can be located on the outer circumference of the inner conductor unit (3).

[0080] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. An aerosol generating device comprising a microwave heating assembly (200), the microwave heating assembly (200) comprising an outer conductor unit (2) and an inner conductor unit (3), the outer conductor unit (2) being provided with a cavity (23), the inner conductor unit (3) being arranged in the cavity (23), characterized in that the aerosol generating device further comprises a radio frequency board (1) and an oscillator mounted on the radio frequency board (1), a part of the structure of the radio frequency board (1) being arranged in the cavity (23) and magnetically coupled with the inner conductor unit (3). The radio frequency board (1) comprises a board body (11) and a transmission line structure (12) formed on the board body (11); a part of the structure of the transmission line structure (12) is arranged in the cavity (23) and magnetically coupled with the inner conductor unit (3).

2. An aerosol generation device according to claim 1, wherein, The board body (11) comprises a main board (112) and a plug-in board (111) connected with the main board (112); the main board (112) is arranged outside the outer conductor unit (2), and the plug-in board (111) is used for being inserted into the cavity (23).

3. An aerosol generation device according to claim 2, wherein, The transmission line structure (12) comprises a second microstrip line (122) formed on the main board (112) and a first microstrip line (121) formed on the plug-in board (111); the oscillator is connected with the first microstrip line (121) through the second microstrip line (122), and the first microstrip line (121) is used for being magnetically coupled with the inner conductor unit (3). The shape structure of the first conductive strip (1211) of the first microstrip line (121) comprises one or a combination of strip structure and plane structure.

4. An aerosol generation device according to claim 3, wherein, The shape of the first conductive strip (1211) of the first microstrip line (121) comprises one or a combination of at least two patterns of spiral shape, lattice shape, square shape and trapezoidal shape.

5. An aerosol generation device according to claim 4, wherein, The first microstrip line (121) is arranged outside the inner conductor unit (3).

6. An aerosol generation device according to claim 3, wherein, The plug-in board (111) comprises a first dielectric layer (1112) and a first conductive layer (1111), the first conductive layer (1111) being arranged on the side of the first dielectric layer (1112) away from the inner conductor unit (3); the first conductive strip (1211) of the first microstrip line (121) is arranged on the first conductive layer (1111). Alternatively, the plug-in board (111) comprises a first dielectric layer (1112) and a first conductive layer (1111), the first conductive layer (1111) being arranged on the side of the first dielectric layer (1112) facing the inner conductor unit (3); the first conductive strip (1211) of the first microstrip line (121) is arranged on the first conductive layer (1111). ​ Alternatively, the plug-in board (111) comprises a first conductive layer (1111), a first dielectric layer (1112) and a first ground layer (1113), the first dielectric layer (1112) is arranged between the first conductive layer (1111) and the first ground layer (1113); the first conductive strip (1211) of the first microstrip line (121) is arranged on the first conductive layer (1111) and faces the inner conductor unit (3).

7. An aerosol generation device according to claim 3, wherein, The outer conductor unit (2) is in a cylindrical shape, comprising a first end (21) and a second end (22) opposite to the first end (21); The plug-in board (111) is arranged to be inserted into the cavity (23) from the end wall of the first end (21).

8. An aerosol generation device according to claim 7, wherein, The inner conductor unit (3) is in an elongated structure, the first microstrip line (121) is arranged on the outer circumference of the inner conductor unit (3), and the plane where the first microstrip line (121) is located is parallel to the axial direction of the inner conductor unit (3).

9. An aerosol generation device according to claim 7, wherein, The inner conductor unit (3) comprises a conductor column (31) and a probe (33), one end of the conductor column (31) is connected to the end wall of the first end (21), and the probe (33) is connected to the other end of the conductor column (31). The plug-in board (111) is arranged on the outer circumference of the conductor column (31), and the plane where the plug-in board (111) is located is parallel to the axial direction of the conductor column (31).

10. An aerosol generation device according to claim 9, wherein, The inner conductor unit (3) further comprises a conductor disc (32), which is combined at the end of the conductor column (31) away from the first end (21); the probe (33) is embedded in the conductor disc (32).

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