Satellite payload heat dissipation surface expansion device and thermal control method thereof

By combining flexible heat pipes and drive components, intelligent and dynamic adjustment of the satellite payload heat dissipation surface is achieved, solving the problems of thermal control coating degradation and radiation plate deployment interference, and improving the system's stability and lifespan.

CN121201412BActive Publication Date: 2026-04-10BEIJING LASER STARCOM SCIENCE & TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING LASER STARCOM SCIENCE & TECHNOLOGY CO LTD
Filing Date
2025-12-01
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

In existing technologies, the temperature of the heat dissipation surface of a satellite payload increases due to the degradation of the thermal control coating performance during its on-orbit lifespan. Furthermore, the radiating plate is prone to interference with other components during deployment, affecting system stability and thermal control power consumption.

Method used

The heat dissipation surface expansion device, composed of flexible heat pipes and driving components, uses temperature sensing to drive the cold end of the flexible heat pipes to fit into the heat dissipation surface expansion area, realizing the conduction of heat from the original area to the expansion area, thus avoiding mechanical deployment.

Benefits of technology

It achieves active heat dissipation at high temperatures, improves energy utilization efficiency, ensures that the load operates within the optimal temperature range, extends lifespan, maintains system stability, and avoids interference caused by deployment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of satellite heat dissipation, and provides a satellite load heat dissipation surface expansion device and a thermal control method thereof. The expansion device comprises a heat generating load, a load heat dissipation plate, a flexible heat pipe and at least one driving component. In the case that the temperature value of the heat generating load is greater than or equal to a predetermined high temperature threshold, the driving component drives the cold end of the flexible heat pipe to be attached to the corresponding heat dissipation surface expansion area, so that the heat of the original area of the load heat dissipation surface is conducted to the heat dissipation surface expansion area through the flexible heat pipe to dissipate heat, the heat dissipation surface expansion of the load is realized, the temperature of the load is reduced, and the on-orbit working life of the load is prolonged. In addition, during the expansion process of the heat dissipation surface of the load, the size of the load heat dissipation plate does not change, and no expansion action needs to be set; the cold end of the flexible heat pipe is only driven to be attached to the corresponding heat dissipation surface expansion area through the driving component, so that the heat dissipation surface expansion of the load can be realized, the normal work of surrounding components is not affected, and the stability of the system is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of satellite heat dissipation, in particular to a satellite load heat dissipation surface expansion device and a thermal control method thereof. BACKGROUND

[0002] The satellite load heat dissipation surface usually uses a professional thermal control coating to ensure that the on-orbit heat dissipation surface can still maintain a low temperature range when it is illuminated. However, due to the influence of various space environments, the performance (solar absorptivity) of the thermal control coating gradually declines during use, which causes the temperature of the same load heat dissipation surface to gradually rise at different life stages, indirectly affecting the on-orbit life of the load. In order to meet the requirements of the temperature index of the load at the end of the life, the thermal control design stage will increase the heat dissipation area, which will inevitably increase the thermal control power consumption of the load at the initial stage of the on-orbit. In addition, the expansion of the heat dissipation surface in the prior art needs to expand the radiation panel to increase the heat dissipation area, which will interfere with other systems during the expansion of the radiation panel, affecting the stability of the system. SUMMARY

[0003] The present application provides a satellite load heat dissipation surface expansion device to solve the problems of large initial thermal control compensation power consumption of the load and interference with other systems during the expansion of the radiation panel in the prior art.

[0004] The present application provides a satellite load heat dissipation surface expansion device, comprising:

[0005] a heat-generating load;

[0006] a load heat dissipation panel having a load heat dissipation surface original area and at least one heat dissipation surface expansion area, the heat-generating load being arranged in the load heat dissipation surface original area;

[0007] a flexible heat pipe, a hot end of the flexible heat pipe being in thermal connection with the load heat dissipation surface original area, and a cold end of the flexible heat pipe being arranged in the heat dissipation surface expansion area one by one;

[0008] at least one driving component, the driving component being connected with the cold end of the flexible heat pipe one by one, and in the case that the temperature value of the heat-generating load is greater than or equal to a predetermined high temperature threshold, the driving component drives the cold end of the flexible heat pipe to be attached to the corresponding heat dissipation surface expansion area, so as to conduct the heat of the load heat dissipation surface original area to the heat dissipation surface expansion area for heat dissipation through the flexible heat pipe.

[0009] The present application also provides a satellite load heat dissipation surface expansion device, the heat-generating load being arranged on one side of the load heat dissipation panel, and the flexible heat pipe and the driving component being arranged on the other side of the load heat dissipation panel.

[0010] The application further provides a satellite load heat dissipation surface expansion device, and the flexible heat pipe comprises:

[0011] A hot end heat conduction component is arranged on the other side of the load heat dissipation plate to form a hot end of the flexible heat pipe.

[0012] A cold end heat conduction component is arranged on the other side of the load heat dissipation plate to form a cold end of the flexible heat pipe, and the cold end heat conduction component is connected with the hot end heat conduction component through a flexible heat conduction member.

[0013] The application further provides a satellite load heat dissipation surface expansion device, and the number of the cold end heat conduction components is at least two, and adjacent two cold end heat conduction components are connected through a flexible heat conduction member.

[0014] The application further provides a satellite load heat dissipation surface expansion device, and the hot end heat conduction component comprises:

[0015] A hot end mounting fin is arranged on the other side of the load heat dissipation plate.

[0016] A hot end pipe shell main body is arranged on the side, away from the load heat dissipation plate, of the hot end mounting fin, and the hot end pipe shell main body is connected with one end of the flexible heat conduction member.

[0017] The application further provides a satellite load heat dissipation surface expansion device, and the cold end heat conduction component comprises:

[0018] A cold end mounting fin is arranged on the other side of the load heat dissipation plate.

[0019] A cold end pipe shell main body is arranged on the side, away from the load heat dissipation plate, of the cold end mounting fin, and the cold end pipe shell main body is connected with the other end of the flexible heat conduction member.

[0020] A cold end fixing fin is arranged on the cold end pipe shell main body and connected with the driving component.

[0021] The application further provides a satellite load heat dissipation surface expansion device, and the driving component comprises:

[0022] Two driving mechanisms are arranged at intervals, the cold end fixing fin is located between the two driving mechanisms and connected with the driving mechanisms.

[0023] The application further provides a satellite load heat dissipation surface expansion device, and the driving mechanism comprises:

[0024] A fixing seat is arranged on the other side of the load heat dissipation plate.

[0025] A transmission assembly is arranged in the fixing seat and connected with the cold end fixing fin;

[0026] A driving motor is connected with the transmission assembly, and is used for driving the cold end fixing fin to approach the load heat dissipation plate to make the cold end mounting fin adhere to the corresponding heat dissipation surface expansion region when the temperature value of the heat generating load is greater than or equal to a predetermined high temperature threshold.

[0027] The application further provides a satellite load heat dissipation surface expansion device, and the thermal resistance between the original region of the load heat dissipation surface and the heat dissipation surface expansion region is greater than the thermal resistance of the flexible heat pipe.

[0028] The application further provides a thermal control method of a satellite load heat dissipation surface expansion device, and the thermal control method is based on any one of the satellite load heat dissipation surface expansion devices.

[0029] The temperature value of the heat generating load is acquired.

[0030] The driving motor is controlled to work to drive the cold end fixing fin to approach the load heat dissipation plate through the driving motor when the temperature value of the heat generating load is greater than or equal to a predetermined high temperature threshold.

[0031] The driving motor is controlled to be powered off after the cold end mounting fin adheres to the corresponding heat dissipation surface expansion region, and the heat of the original region of the load heat dissipation surface is conducted to the heat dissipation surface expansion region through the flexible heat pipe for heat dissipation.

[0032] The satellite load heat dissipation surface expansion device provided by the application realizes the expansion of the heat dissipation surface of the load, reduces the temperature of the load and prolongs the on-orbit working life of the load by driving the cold end of the flexible heat pipe to adhere to the corresponding heat dissipation surface expansion region through the driving component when the temperature value of the heat generating load is greater than or equal to a predetermined high temperature threshold, conducting the heat of the original region of the load heat dissipation surface to the heat dissipation surface expansion region through the flexible heat pipe for heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to make the technical solutions in the present application or prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without any creative work based on the embodiments in the present application shall fall into the protection scope of the present application.

[0034] Figure 1 is a structural schematic view of the satellite payload heat dissipation surface expansion device provided by the present application.

[0035] Figure 2 is a structural schematic view of the satellite payload heat dissipation surface expansion device provided by the present application.

[0036] Figure 3 is a structural schematic view of the satellite payload heat dissipation surface expansion device provided by the present application.

[0037] Figure 4 is a flow chart of the heat control method of the satellite payload heat dissipation surface expansion device provided by the present application.

[0038] Reference signs:

[0039] 10, heat generating load; 20, load heat dissipation plate; 21, original area of load heat dissipation surface; 22, expanded area of heat dissipation surface; 30, flexible heat pipe; 31, heat conducting component at hot end; 32, mounting fin at hot end; 33, main body of pipe shell at hot end; 34, heat conducting component at cold end; 35, mounting fin at cold end; 36, main body of pipe shell at cold end; 37, fixed fin at cold end; 38, flexible heat conducting member; 40, driving component; 41, fixed seat; 42, transmission component; 43, driving motor. DETAILED DESCRIPTION

[0040] In order to make the technical solutions in the present application or prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without any creative work based on the embodiments in the present application shall fall into the protection scope of the present application.

[0041] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0042] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0043] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0044] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0045] As Figure 1 and Figure 2As shown, the satellite payload heat dissipation surface extension device includes a heat-generating load 10, a load heat dissipation plate 20, a flexible heat pipe 30, and at least one driving component 40. The load heat dissipation plate 20 has an original load heat dissipation surface area 21 and at least one heat dissipation surface extension area 22. The heat-generating load 10 is disposed in the original load heat dissipation surface area 21. The hot end of the flexible heat pipe 30 is thermally connected to the original load heat dissipation surface area 21. The cold ends of the flexible heat pipe 30 are correspondingly disposed in the heat dissipation surface extension areas 22. The driving component 40 is correspondingly connected to the cold ends of the flexible heat pipe 30. When the temperature value of the heat-generating load 10 is greater than or equal to a predetermined high temperature threshold, the driving component 40 drives the cold ends of the flexible heat pipe 30 to fit against the corresponding heat dissipation surface extension area 22, so as to conduct the heat of the original load heat dissipation surface area 21 to the heat dissipation surface extension area 22 for heat dissipation through the flexible heat pipe 30.

[0046] The satellite payload heat dissipation surface expansion device provided by the present invention has the following advantages:

[0047] First, the satellite payload heat dissipation surface extension device provided by this invention will only start working when the temperature of the heat-generating load 10 is greater than or equal to a predetermined high temperature threshold. This "on-demand response" working mode based on actual temperature realizes proactive and intelligent management of the heat dissipation function, ensuring that the extended heat dissipation is only activated when the satellite payload is at a high temperature, avoiding unnecessary heat loss under normal or low temperature conditions of the satellite, thereby greatly improving the energy utilization efficiency and thermal control accuracy of the satellite.

[0048] Secondly, the starting drive component 40 drives the cold end of the flexible heat pipe 30 towards the load heat sink 20, bringing it into contact with the pre-set heat dissipation surface extension area 22. Through this action, the flexible heat pipe 30 acts as a highly efficient heat transfer bridge, rapidly transferring the heat accumulated in the original area 21 of the load heat sink to the extended area 22 for dissipation. This controllable "contact-type" heat transfer enables dynamic adjustment of the heat dissipation capacity. Based on the real-time heat load of the load, additional heat dissipation paths can be quickly and effectively established or disconnected, thereby achieving precise control of the load temperature. This ensures the load operates stably within its optimal temperature range, ultimately extending the load's on-orbit service life.

[0049] Furthermore, the entire expansion process of the heat dissipation surface is completed while maintaining the overall size and external contour of the load heat dissipation plate 20, without any external unfolding action. This expansion method differs from traditional unfolding heat sinks, fundamentally eliminating the possibility of unfolding failure, structural vibration, and interference with other surrounding components caused by mechanical unfolding actions, significantly improving the stability and reliability of the entire system.

[0050] In one embodiment of the present invention, such as Figure 1 andFigure 2 As shown, the load heat sink 20 not only is the key interface for heat radiation, but also provides a unified mounting base for the heat-generating load 10, the flexible heat pipe 30 and the driving component 40. With this highly integrated design, unnecessary support structures and connectors are reduced, effectively reducing the total mass and volume of the system.

[0051] The heat-generating load 10 is arranged on one side of the load heat sink 20, and the flexible heat pipe 30 and the driving component 40 are arranged on the other side of the load heat sink 20.

[0052] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The flexible heat pipe 30 includes a hot-end heat-conducting component 31 and a cold-end heat-conducting component 34. The hot-end heat-conducting component 31 is arranged on the other side of the load heat sink 20 to form the hot end of the flexible heat pipe 30. The cold-end heat-conducting component 34 is arranged on the other side of the load heat sink 20 to form the cold end of the flexible heat pipe 30, and is connected to the hot-end heat-conducting component 31 through a flexible heat-conducting member 38. The cold-end heat-conducting component 34 is connected to the hot-end heat-conducting component 31 through the flexible heat-conducting member 38, which ensures efficient heat transfer between the hot end and the cold end while providing the necessary mechanical freedom for the displacement of the cold-end heat-conducting component 34. It is the flexible nature of the flexible heat pipe 30 that allows the cold-end heat-conducting component 34 to smoothly complete the attachment and separation actions to the heat dissipation surface under the action of the driving component 40.

[0053] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The flexible heat pipe 30 has a hot end and at least one cold end. The working medium inside the flexible heat pipe 30 evaporates and absorbs heat at the hot end of the flexible heat pipe 30, can receive the heat of the heat-generating load 10, flows from the hot end of the flexible heat pipe 30 to the cold end of the flexible heat pipe 30, and condenses and releases heat at the cold end of the flexible heat pipe 30, releasing heat to the heat dissipation surface expansion area 22, and dissipating heat outward through the heat dissipation surface expansion area 22.

[0054] The flexible heat pipe 30 can deform to allow the relative position of the cold end of the flexible heat pipe 30 and the hot end of the flexible heat pipe 30 to change. The cold end of the flexible heat pipe 30 can be switched between a heat-conducting position and a heat-isolating position. The deformation of the flexible heat pipe 30 provides mechanical feasibility for the switching of the cold end of the flexible heat pipe 30 between the heat-conducting position and the heat-isolating position, and ensures the structural integrity of the flexible heat pipe 30 is not damaged.

[0055] When the cold end of the flexible heat pipe 30 is switched to the heat conduction position, a heat conduction path is formed between the cold end of the flexible heat pipe 30 and the heat dissipation surface expansion area 22, and the heat released by the working medium at the cold end of the flexible heat pipe 30 can be transmitted to the heat dissipation surface expansion area 22. When the cold end of the flexible heat pipe 30 is switched to the heat isolation position, there is a certain gap between the cold end of the flexible heat pipe 30 and the heat dissipation surface expansion area 22, thereby forming a heat isolation area, and the heat released by the working medium at the cold end of the flexible heat pipe 30 cannot be transmitted to the heat dissipation surface expansion area 22.

[0056] In an embodiment of the present application, as shown in Figure 3 The number of cold end heat conduction assemblies 34 is designed to be at least two, and the adjacent two cold end heat conduction assemblies 34 are connected by flexible heat conduction members 38. By adopting this modular series design, the flexibility and coverage capability of the heat dissipation surface expansion are significantly enhanced. By providing multiple cold ends, a larger area or irregularly shaped heat dissipation surface expansion area 22 can be covered, and the adoption of flexible heat conduction members 38 ensures the flexible and deformable characteristics of the entire assembly chain during the driving process.

[0057] Specifically, the number of cold end heat conduction assemblies 34 is two, and the two cold end heat conduction assemblies 34 are arranged at intervals along the length direction of the load heat dissipation plate 20, that is, along the left-right direction in Figure 3 The left cold end pipe shell body 36 is connected to the hot end pipe shell body 33 through a flexible heat conduction member 38, and the right cold end pipe shell body 36 is connected to the left cold end pipe shell body 36 through another flexible heat conduction member 38. This "one-two" connection structure forms a continuous and segmented flexible heat pipe 30, which not only can realize simultaneous coverage of two separated heat dissipation surface expansion areas 22, but also can realize hierarchical heat dissipation through step-by-step control. For example, only the first cold end is enabled when the heat load is low, and the second cold end is enabled when the heat load is further increased, realizing more refined heat management.

[0058] In an embodiment of the present application, as shown in Figure 1 and Figure 2As shown, the hot end heat conducting assembly 31 includes a hot end mounting fin 32 and a hot end tube shell body 33, the hot end mounting fin 32 is arranged on the other side of the load heat sink 20, the arrangement of the hot end mounting fin 32 increases the effective contact area between the hot end assembly and the load heat sink 20, thereby significantly reducing the interface contact thermal resistance, ensuring that the heat conducted from the heat-generating load 10 to the load heat sink 20 can be efficiently and quickly conducted to the hot end of the flexible heat pipe 30. The hot end tube shell body 33 is arranged on the side of the hot end mounting fin 32 away from the load heat sink 20, and the hot end tube shell body 33 is connected to one end of the flexible heat conducting piece 38. The hot end tube shell body 33 can directly receive heat from the hot end mounting fin 32, realizing the shortest heat conduction path from collection to evaporation, reducing the loss of heat in the transmission process.

[0059] In an embodiment of the present application, as shown in Figure 1 and Figure 2 As shown, the cold end heat conducting assembly 34 includes a cold end mounting fin 35, a cold end tube shell body 36 and a cold end fixing fin 37, the cold end mounting fin 35 is arranged on the other side of the load heat sink 20. Its preferred scheme is to additionally arrange a layer of flexible heat conducting interface material between the cold end mounting fin 35 and the load heat sink 20. By arranging the heat conducting interface material, the gap between the mounting fin and the heat sink due to the unevenness of the contact surface can be effectively filled, so that when the two are in contact, the minimization of the contact thermal resistance can be realized, thereby ensuring that the heat from the heat pipe can be efficiently conducted to the expanded heat dissipation surface.

[0060] The cold end tube shell body 36 is arranged on the side of the cold end mounting fin 35 away from the load heat sink 20, and the cold end tube shell body 36 is connected to the other end of the flexible heat conducting piece 38, and the cold end fixing fin 37 is arranged on the cold end tube shell body 36 and connected with the driving component 40. As the core of the heat pipe condensing section, the cold end tube shell body 36 can directly release heat to the mounting fin closely attached thereto, realizing the shortest path from internal condensation to external conduction, reducing the loss of heat in the internal components of the assembly, and ensuring the overall heat transfer efficiency of the heat pipe.

[0061] In an embodiment of the present application, as shown in Figure 1 and Figure 2As shown, the driving component 40 includes two driving mechanisms, which are arranged at intervals, and the cold end fixed fin 37 is located between the two driving mechanisms and connected with the driving mechanisms. The symmetrical layout of the double driving enables synchronous application of driving force from both sides of the cold end of the flexible heat pipe 30 during driving, so as to drive the cold end heat conduction assembly 34 to move along the thickness direction of the load heat dissipation plate 20. In addition, the arrangement of the two driving mechanisms also ensures that the forces on both sides of the cold end fixed fin 37 are balanced, effectively eliminates the deflection torque that may be caused by single-point driving, and enables the cold end mounting fin 35 to be more closely attached to the entire heat dissipation surface expansion area 22 with a uniform pressure, which is crucial for minimizing the interfacial contact thermal resistance and achieving the most efficient heat transfer, and is a key guarantee for ensuring that the heat dissipation expansion function achieves the expected effect.

[0062] In one embodiment of the present application, as shown in Figure 1 and Figure 2 As shown, the driving mechanism includes a fixed seat 41, a transmission assembly 42 and a driving motor 43. The fixed seat 41 is arranged on the other side of the load heat dissipation plate 20. The transmission assembly 42 is arranged on the fixed seat 41 and connected with the cold end fixed fin 37. The rotating shaft of the driving motor 43 is connected with the transmission assembly 42. In the case that the temperature value of the heat generating load 10 is greater than or equal to a predetermined high temperature threshold value, the driving motor 43 is used to drive the cold end fixed fin 37 to approach the load heat dissipation plate 20 through the transmission assembly 42, so that the cold end mounting fin 35 is attached to the corresponding heat dissipation surface expansion area 22.

[0063] After receiving the temperature control instruction, the driving motor 43 drives the cold end fixed fin 37 to approach the load heat dissipation plate 20 through the transmission assembly 42. The transmission assembly 42 can efficiently convert the rotary motion of the motor into linear motion, ensuring that the system can generate sufficient and uniform pressure to enable the cold end mounting fin 35 to be closely attached to the corresponding heat dissipation surface expansion area 22, thereby minimizing the interfacial contact thermal resistance and providing a reliable mechanical guarantee for efficient heat transfer. The entire process is automatically completed under the instruction of the temperature control system, responds quickly and controls accurately, and the expansion of the heat dissipation surface can be achieved in 1-2 seconds.

[0064] The transmission assembly 42 includes a gear and rack transmission assembly 42 or a lead screw and nut transmission assembly 42. Both of the two transmission assemblies 42 are high-reliability transmission modes, which can efficiently convert the rotary motion of the driving motor 43 into the linear motion required by the cold end of the flexible heat pipe 30, and realize the switching of the cold end of the flexible heat pipe 30 between the heat conduction position and the heat isolation position.

[0065] Meanwhile, the gear-rack transmission assembly 42 or the screw-nut transmission assembly 42 has the advantages of smooth transmission, simple and compact structure, and high positioning accuracy, thereby ensuring that the cold end of the flexible heat pipe 30 can be tightly attached to the heat dissipation surface expansion area 22 to form a low-thermal-resistance heat conduction path when the cold end is in the heat conduction position, and can maintain a stable isolation gap when the cold end is in the heat isolation position.

[0066] When the specific structure of the transmission assembly 42 is the screw-nut transmission assembly 42, the screw of the screw-nut transmission assembly 42 is arranged along the thickness direction of the load heat dissipation plate 20, the screw of the screw-nut transmission assembly 42 is connected with the rotating shaft of the driving motor 43, and the nut of the screw-nut transmission assembly 42 is connected with the cold end fixed fin 37. When the driving motor 43 rotates, the cold end fixed fin 37 drives the cold end mounting fin 35 and the cold end tube shell main body 36 to move along the thickness direction of the load heat dissipation plate 20 under the cooperation of the nut and the screw, and the cold end of the flexible heat pipe 30 can be switched between the heat conduction position and the heat isolation position. In the heat conduction position, the cold end mounting fin 35 is tightly attached to the heat dissipation surface expansion area 22, and in the heat isolation position, the cold end mounting fin 35 is separated from the heat dissipation surface expansion area 22. The movement range of the cold end of the flexible heat pipe 30 should not be too large (e.g., <1 cm), so as to avoid the heat transfer performance degradation caused by excessive bending of the heat pipe.

[0067] In an embodiment of the present application, the structure type of the load heat dissipation plate 20 can be the combination of an aluminum alloy heat dissipation plate and an externally attached heat pipe, or the combination of a honeycomb plate and a pre-embedded heat pipe. The load heat dissipation surface original area 21 and the heat dissipation surface expansion area 22 can be heat-isolated by reducing the cross-sectional area between the two areas or by pre-embedding heat pipes in the load heat dissipation surface original area 21 and the heat dissipation surface expansion area 22.

[0068] When the cold end mounting fin 35 is not attached to the heat dissipation surface expansion area 22, due to the large thermal resistance of the load heat dissipation plate 20 itself, it is extremely difficult for heat to be conducted from the load heat dissipation surface original area 21 to the heat dissipation surface expansion area 22, thereby making the heat dissipation surface expansion area 22 in an “heat isolation” state when it is unnecessary, effectively avoiding unnecessary heat dissipation to the cold space through the heat dissipation surface expansion area 22 when the satellite is in a low-temperature working condition, which is of great significance to the overall thermal balance and energy saving of the satellite. When the cold end mounting fin 35 is attached to the heat dissipation surface expansion area 22, the thermal resistance of the flexible heat pipe 30 is much smaller than that of the load heat dissipation plate 20, and heat will preferentially choose this low-resistance path for transmission, thereby achieving a large and instantaneous improvement in heat dissipation capacity.

[0069] As shown in Figure 4 The present application also provides a thermal control method of the satellite load heat dissipation surface expansion device, which is based on the satellite load heat dissipation surface expansion device according to any one of the above embodiments, and includes the following steps:

[0070] Step S100, the temperature value of the heat load 10 is acquired.

[0071] The temperature sensor is arranged on the heat load 10, which detects the temperature value of the heat load 10 in real time.

[0072] Step S200, in the case that the temperature value of the heat load 10 is greater than or equal to the predetermined high temperature threshold, the driving motor 43 is controlled to work, and the cold end fixed fin 37 is driven to the load heat dissipation plate 20 by the driving motor 43.

[0073] In the case that the temperature value of the heat load 10 is less than the predetermined high temperature threshold, the temperature sensor continues to detect the temperature value of the heat load 10. In the case that the temperature value of the heat load 10 is greater than or equal to the predetermined high temperature threshold, the driving motor 43 is controlled to work, and the cold end fixed fin 37 is driven to the load heat dissipation plate 20 by the driving motor 43; so that the cold end fixed fin 37 is attached to the heat dissipation surface expansion area 22.

[0074] Step S300, after the cold end fixed fin 37 is attached to the corresponding heat dissipation surface expansion area 22, the driving motor 43 is controlled to be powered off, and the heat of the load heat dissipation surface original area 21 is conducted to the heat dissipation surface expansion area 22 for heat dissipation through the flexible heat pipe 30.

[0075] After the driving motor 43 is powered off, the cold end of the flexible heat pipe 30 remains in the locked state, so that the cold end fixed fin 37 continues to be attached to the heat dissipation surface expansion area 22, which increases the heat dissipation area, reduces the temperature of the load, and prolongs the service life of the equipment.

[0076] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A satellite payload heat dissipation surface expansion device, characterized in that, include: Thermal load (10); The load heat sink (20) has an original load heat sink area (21) and at least one extended heat sink area (22), and the heat load (10) is disposed in the original load heat sink area (21). A flexible heat pipe (30) is provided, with its hot end being thermally connected to the original area (21) of the load heat dissipation surface; and its cold end being provided in the extended area (22) of the heat dissipation surface. At least one driving component (40) is connected to the cold end of the flexible heat pipe (30) in a one-to-one correspondence. When the temperature value of the heat load (10) is greater than or equal to a predetermined high temperature threshold, the driving component (40) drives the cold end of the flexible heat pipe (30) to fit with the corresponding heat dissipation surface extension area (22) so as to conduct the heat of the original area (21) of the load heat dissipation surface to the heat dissipation surface extension area (22) through the flexible heat pipe (30) for heat dissipation. The flexible heat pipe (30) includes: A hot-end heat-conducting component (31) is disposed on the other side of the load heat sink (20) to form the hot end of the flexible heat pipe (30); A cold-end heat-conducting component (34) is disposed on the other side of the load heat dissipation plate (20) to form the cold end of the flexible heat pipe (30). The cold-end heat-conducting component (34) is connected to the hot-end heat-conducting component (31) through a flexible heat-conducting element (38). The hot-end heat-conducting component (31) includes: Hot end mounting fins (32) are provided on the other side of the load heat sink (20); Hot end shell body (33), the hot end shell body (33) is disposed on the side of the hot end mounting fins (32) away from the load heat dissipation plate (20), and the hot end shell body (33) is connected to one end of the flexible heat conductor (38); The cold-end heat-conducting component (34) includes: Cold end mounting fins (35) are provided on the other side of the load heat dissipation plate (20); The cold end shell body (36) is disposed on the side of the cold end mounting fins (35) away from the load heat dissipation plate (20), and the cold end shell body (36) is connected to the other end of the flexible heat conductor (38). Cold end fixing fin (37), the cold end fixing fin (37) is disposed on the cold end tube shell body (36) and connected to the driving component (40); The drive component (40) includes: Two drive mechanisms are arranged at intervals, and the cold end fixing fin (37) is located between the two drive mechanisms and connected to the drive mechanisms; The drive mechanism includes: A fixing seat (41) is provided on the other side of the load heat sink (20); A transmission assembly (42) is disposed on the fixed base (41) and connected to the cold end fixed fin (37); The drive motor (43) has its shaft connected to the transmission assembly (42). When the temperature value of the heat load (10) is greater than or equal to a predetermined high temperature threshold, the drive motor (43) drives the cold end fixed fin (37) to move closer to the load heat sink (20) through the transmission assembly (42) so that the cold end mounting fin (35) fits against the corresponding heat dissipation surface extension area (22).

2. The satellite payload heat dissipation surface expansion device according to claim 1, characterized in that, The heat load (10) is disposed on one side of the load heat sink (20), and the flexible heat pipe (30) and the driving component (40) are both disposed on the other side of the load heat sink (20).

3. The satellite payload heat dissipation surface expansion device according to claim 2, characterized in that, The number of cold end heat conduction components (34) is at least two, and two adjacent cold end heat conduction components (34) are connected by a flexible heat conduction element (38).

4. The satellite payload heat dissipation surface expansion device according to claim 3, characterized in that, The thermal resistance between the original area (21) of the load heat dissipation surface and the extended area (22) of the heat dissipation surface is greater than the thermal resistance of the flexible heat pipe (30).

5. A thermal control method for a satellite payload heat dissipation surface extension device, the thermal control method being based on the satellite payload heat dissipation surface extension device according to claim 4, characterized in that, include: Obtain the temperature value of the heat load (10); When the temperature value of the heat load (10) is greater than or equal to a predetermined high temperature threshold, the drive motor (43) is controlled to work, and the cold end fixed fin (37) is driven to move closer to the load heat dissipation plate (20) by the drive motor (43). After the cold end mounting fins (35) are attached to the corresponding heat dissipation surface extension area (22), the drive motor (43) is powered off, and the heat of the original area (21) of the load heat dissipation surface is conducted to the heat dissipation surface extension area (22) through the flexible heat pipe (30) for heat dissipation.

Citation Information

Patent Citations

  • Heat dissipation surface expansion device based on high-thermal-conductivity graphene film

    CN119421385A