Heating disc, ejector pin dismounting and mounting method and storage medium

Abstract

The invention provides a heating plate, an ejector pin dismounting and mounting method and a computer readable storage medium. The heating disc comprises a heating disc body, a heating disc cover body, a plurality of ejector pins and a plurality of heavy hammer assemblies. A plurality of first through holes are formed in the heating plate body. The first size of the first through hole is larger than the second size of the heavy hammer assembly. The heating plate cover body covers the heating plate body and is provided with a plurality of second through holes aligned with the first through holes. The third size of the second through hole is larger than the fourth size of the ejector pin and smaller than the second size of the heavy hammer assembly and the fifth size of the mushroom head. The tops of the ejector pins are connected with mushroom heads arranged on the heating plate body, and the bottoms of the ejector pins penetrate through the corresponding second through holes downwards so as to be connected with the tops of the corresponding heavy hammer assemblies. The bottoms of the multiple heavy hammer assemblies penetrate through the corresponding first through holes downwards so as to drive the corresponding ejector pins to ascend and descend in the corresponding second through holes.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor device processing, and in particular to a heating plate, a method for disassembling a probe needle, and a computer readable storage medium. BACKGROUND

[0002] In the process of semiconductor film deposition, the heating plate is one of the key components, which is used to carry the semiconductor wafer to be deposited and provide a uniform heating environment. The heating plate usually uses a probe needle to lift and lower the wafer. However, the probe needle connected to the bottom of the heavy hammer assembly needs to be disassembled or the heating plate needs to be disassembled for disassembly. Alternatively, the heavy hammer assembly is installed in a plug-in manner, and the disassembly of the heavy hammer assembly is unstable and prone to falling off. Ultimately, it leads to an increase in the time required to replace the probe needle or the heavy hammer assembly is prone to falling off during the process, which destroys the stability of the process.

[0003] In order to overcome the above-mentioned defects existing in the prior art, the present application provides an improved heating plate, which can replace the probe needle and the heavy hammer assembly without disassembling the heating plate, thereby improving the efficiency of the semiconductor processing process. SUMMARY

[0004] The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0005] In order to overcome the above-mentioned defects existing in the prior art, the present application provides a heating plate, a method for disassembling a probe needle, and a computer readable storage medium, which can disassemble the probe needle and the heavy hammer assembly connected to the bottom thereof from the heating plate cover by setting an independently detachable heating plate cover, thereby replacing the probe needle and the heavy hammer assembly without disassembling the heating plate, thereby improving the efficiency of the semiconductor processing process.

[0006] Specifically, the heating plate according to the first aspect of the present application comprises a heating plate body, a heating plate cover, a plurality of top pins and a plurality of weight assemblies. The heating plate body is provided with a plurality of first through holes. The first size of the first through holes is greater than the second size of the weight assemblies. The heating plate cover covers the heating plate body and is provided with a plurality of second through holes corresponding to the first through holes. The third size of the second through holes is greater than the fourth size of the top pins and less than the second size of the weight assemblies and the fifth size of the mushroom heads. The top of the plurality of top pins is connected to the mushroom heads provided on the heating plate body, and the bottom of the top pins penetrates the corresponding second through holes downward to connect the top of the corresponding weight assemblies. The bottom of the plurality of weight assemblies penetrates the corresponding first through holes downward to drive the corresponding top pins to rise and fall in the corresponding second through holes.

[0007] Further, in some embodiments of the present application, a detachable part is provided between the mushroom head and the top pin, and / or between the top pin and the weight assembly, to mount the mushroom head and the weight assembly on both sides of the second through hole respectively and connect them through the top pin penetrating the second through hole.

[0008] Further, in some embodiments of the present application, the weight assembly comprises a weight shell, a first guide rod, a second guide rod and a spring. The top of the weight shell is provided with a mounting hole. The first guide rod is provided in the weight shell and the top of the first guide rod is connected to the lower end of the top pin extending into the mounting hole. The second guide rod is provided in the weight shell and the top of the second guide rod is connected to the bottom of the first guide rod through a spring, and the bottom of the second guide rod is connected to the bottom of the weight shell. The spring is provided between the first guide rod and the second guide rod to make the first distance between the top of the top pin of the heating plate in the first position in the initial state and the heating plate cover smaller than the second distance between the top of the weight assembly of the heating plate in the second position in the process state and the heating plate cover, to prevent the upper surface of the weight assembly from colliding with the lower surface of the heating plate cover when the top pin is lifted.

[0009] Further, in some embodiments of the present application, the bottom of the weight shell is a first stepped shape expanding downward. The sixth size of the first guide rod is greater than the seventh size of the mounting hole and less than the eighth size of the first stepped inner wall of the weight shell. The second guide rod is a second stepped shape contracting upward, the ninth size of the second stepped part of the second guide rod is less than the eighth size, and the tenth size of the first stepped part of the second guide rod is greater than the eighth size and less than the eleventh size of the second stepped bottom of the weight shell.

[0010] Further, in some embodiments of the present application, the inner side of the mounting hole of the weight shell is provided with an internal thread. The lower end of the top pin is provided with a matching external thread.

[0011] Further, in some embodiments of the present application, a locking bolt is arranged on the heating disc cover body for locking the heating disc cover body on the heating disc body.

[0012] Further, in some embodiments of the present application, three first through holes are arranged on the heating disc body, and a plurality of second through holes are correspondingly arranged on the heating disc cover body. The heating disc comprises three top pins with mushroom heads and three weight assemblies correspondingly.

[0013] Further, the top pin dismounting method according to the second aspect of the present application comprises the following steps: dismounting the heating disc cover body upward from the heating disc body of the heating disc according to the first aspect of the present application, wherein the heating disc cover body is provided with a plurality of top pins and a plurality of weight assemblies; and dismounting the top pins upward and the weight assemblies downward from the heating disc cover body via detachable parts between the mushroom head and the top pin, and / or between the top pin and the weight assembly.

[0014] Further, in some embodiments of the present application, the top pin dismounting method further comprises the following steps: passing each top pin through a corresponding second through hole; mounting the mushroom head on the upper side of the second through hole via a first detachable part between the mushroom head and the top pin, and / or mounting the weight assembly on the lower side of the second through hole via a second detachable part between the top pin and the weight assembly; and aligning each weight assembly with a corresponding first through hole, and covering the heating disc cover body on the heating disc body.

[0015] Further, the computer readable storage medium according to the third aspect of the present application has computer instructions stored thereon. When the computer instructions are executed by a processor, the top pin dismounting method according to the second aspect of the present application is implemented. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above features and advantages of the present application can be better understood by reading the detailed description of embodiments of the present application in conjunction with the following drawings, in which: the components are not necessarily drawn to scale, and components of similar or identical function or features can have the same or similar reference label.

[0017] Figure 1 A structural schematic diagram of a heating disc according to some embodiments of the present application is shown.

[0018] Figure 2 A structural schematic diagram of a weight assembly according to some embodiments of the present application is shown.

[0019] Figure 3A cross-sectional view of a weight assembly according to some embodiments of the present application is shown.

[0020] Figure 4 A schematic view of the position of the pushpin in the initial state and in the process state of a heating disc according to some embodiments of the present application is shown.

[0021] Figure 5 A schematic view of the position of the pushpin in the initial state of a heating disc according to some embodiments of the present application is shown.

[0022] Figure 6 A schematic view of the position of the pushpin in the process state of a heating disc according to some embodiments of the present application is shown.

[0023] Figure 7 A flowchart of a pushpin mounting and dismounting method according to some embodiments of the present application is shown.

[0024] Figure 8 A schematic view of the principle of a pushpin mounting and dismounting method according to some embodiments of the present application is shown. DETAILED DESCRIPTION

[0025] Objects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description or can be learned by practice of the application. The application will be described with reference to the accompanying drawings, wherein the

[0026] In the description of the present application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] In addition, "upper", "lower", "left", "right", "top", "bottom", "horizontal", "vertical" as used in the following description and shown in the drawings should be understood to be relative terms, and not absolute terms, and are used for convenience only. These relative terms are intended to encompass different orientations of the described apparatus, e.g., device, in addition to the orientations depicted in the figures. Therefore, the term "upper" encompasses both an orientation of above and below. The term "horizontal" encompasses both an orientation of left and right, independently of the orientation depicted in the figures. The apparatus, e.g., device, can be otherwise oriented (rotated 90 degrees or at other orientations) and the relative terms used herein should be interpreted accordingly.

[0028] It is to be understood that the terms "first", "second", "third", and so on, as used in describing various components, regions, layers and / or sections, should not be construed to limit these components, regions, layers and / or sections to the terms "first", "second", "third", and so on, and these terms are merely used to distinguish different components, regions, layers and / or sections. Therefore, the first components, regions, layers and / or sections discussed below can be referred to as the second components, regions, layers and / or sections without departing from some embodiments of the present application.

[0029] In the semiconductor thin film deposition process, the heating plate is one of the key components, which is used to carry the semiconductor wafer to be deposited and provide a uniform heating environment. The heating plate usually uses a needle to lift and lower the wafer. However, the needle connected with the bottom of the heavy hammer assembly needs to be disassembled or the heating plate needs to be disassembled for disassembly. Alternatively, the heavy hammer assembly is installed in a plug-in manner, and the disassembly of the heavy hammer assembly is unstable and easy to fall off. Ultimately, it leads to an increase in the time required to replace the needle or the heavy hammer assembly is easy to fall off and damage the process stability during the process.

[0030] In order to overcome the above-mentioned defects existing in the prior art, the present application provides a heating plate, a needle disassembly method and a computer readable storage medium, which can disassemble the needle and the heavy hammer assembly connected with the bottom of the needle from the heating plate cover body, so as to replace the needle and the heavy hammer assembly without disassembling the heating plate, thereby improving the efficiency of the semiconductor processing process.

[0031] In some non-limiting embodiments, the above-mentioned heating plate provided by the first aspect of the present application can be implemented based on the above-mentioned needle disassembly method provided by the second aspect of the present application.

[0032] For details, please refer to Figure 1 . Figure 1 A structural schematic diagram of a heating plate provided according to some embodiments of the present application is shown.

[0033] In Figure 1In the embodiment shown, the heating plate provided by the first aspect of the present application comprises a heating plate body 11, a heating plate cover 12, a plurality of pins 13, and a plurality of weight assemblies 14. In this embodiment, the heating plate body 11 is provided with a plurality of first through holes, and the first dimension of the first through holes is greater than the second dimension of the weight assemblies. The heating plate cover 12 covers the heating plate body 11 and is provided with a plurality of second through holes corresponding to the plurality of first through holes. The third dimension of the second through holes is greater than the fourth dimension of the pins and smaller than the second dimension of the weight assemblies 14 and the fifth dimension of the mushroom heads 15. The top portions of the plurality of pins 13 are connected to the mushroom heads 15 provided on the heating plate body 11, and the bottom portions of the plurality of pins 13 pass through the corresponding second through holes downward to connect to the top portions of the corresponding weight assemblies 14. The bottom portions of the plurality of weight assemblies 14 pass through the corresponding first through holes downward to drive the corresponding pins 13 to rise and fall in the corresponding second through holes.

[0034] Further, in Figure 1 In the embodiment shown, the mushroom heads 15 and the pins 13, and / or the pins 13 and the weight assemblies 14, are provided with detachable portions that cooperate with each other to mount the mushroom heads 15 and the weight assemblies 14 on both sides of the second through holes, respectively, and are connected through the pins 13 passing through the second through holes.

[0035] Please refer to Figure 2 and Figure 3 for further details. Figure 2 A structural schematic diagram of a weight assembly according to some embodiments of the present application is shown. Figure 3 A sectional schematic diagram of a weight assembly according to some embodiments of the present application is shown.

[0036] In Figure 2 and Figure 3 the embodiment shown, the weight assembly 14 comprises a weight shell 141, a first guide rod 142, a second guide rod 143, and a spring 144. In this embodiment, the top portion of the weight shell 141 is provided with a mounting hole 1411. The first guide rod 142 is arranged in the weight shell 141, and the top portion of the first guide rod 142 is connected to the lower end of the pin 13 extending into the mounting hole 1411. The second guide rod 143 is arranged in the weight shell 141, and the top portion of the second guide rod 143 is connected to the bottom portion of the first guide rod 142 through the spring 144, and the bottom portion of the second guide rod 143 is connected to the bottom portion of the weight shell 141.

[0037] In this way, the weight assembly 14 of the heating plate provided by the first aspect of the present application can be provided with the upper guide rod 142 and the lower guide rod 143 to prevent the spring 144 from being eccentric, thereby preventing the anti-loose structure between the weight assembly 14 and the pin 13 from failing and avoiding the weight assembly 14 from affecting the process stability of the semiconductor processing process.

[0038] Please refer to Figure 4 for further details. Figure 4The diagram shows the positions of the ejector pins in the initial and process states of the heating plate according to some embodiments of the present invention.

[0039] like Figure 4 As shown, the spring 144 is disposed between the first guide rod 142 and the second guide rod 143, and is used to make the first distance D1 between the top of the ejector pin 13 of the heating plate in the first position of the initial state and the heating plate cover 12 smaller than the second distance D2 between the top of the counterweight assembly 14 of the heating plate in the second position of the process state and the heating plate cover 12, so as to prevent the upper surface of the counterweight assembly 14 from colliding with the lower surface of the heating plate cover 12 when the ejector pin 13 is lifted, thereby avoiding affecting the process stability of the semiconductor processing technology.

[0040] In addition, the first gap GAP1 between the heating plate cover 12 and the ejector pin 13 is smaller than the second gap GAP2 between the counterweight assembly 14 and the heating plate body 11. This is to ensure that when the ejector pin 13 and the counterweight assembly 14 are raised, they do not collide with or interfere with the heating plate body 11 in the circumferential direction, thereby avoiding affecting the process stability of the semiconductor processing technology.

[0041] Furthermore, in Figure 3 In the illustrated embodiment, the bottom of the counterweight housing 141 is a downwardly expanding first step. The sixth dimension of the first guide rod 142 is larger than the seventh dimension of the mounting hole 1411 and smaller than the eighth dimension of the first step on the inner wall of the counterweight housing 141. The second guide rod 143 is an upwardly contracting second step, with its ninth dimension of the second step smaller than its eighth dimension, and its tenth dimension of the first step larger than its eighth dimension and smaller than the eleventh dimension of the second step at the bottom of the counterweight housing 141.

[0042] Furthermore, in Figure 3 In the illustrated embodiment, the mounting hole 1411 of the aforementioned counterweight housing 141 is provided with an internal thread. The lower end of the ejector pin 13 is provided with a matching external thread.

[0043] In addition, in some embodiments, the heating plate cover 12 is provided with locking bolts for locking the heating plate cover 12 onto the heating plate body 11.

[0044] Furthermore, in some embodiments, the heating plate body 11 is provided with three first through holes. The heating plate cover 12 is correspondingly provided with multiple second through holes. The heating plate correspondingly includes three ejector pins 13 with mushroom heads 15, and three counterweight assemblies 14.

[0045] In addition, please refer to Figure 5 and Figure 6 . Figure 5 A schematic diagram showing the position of the ejector pin in the initial state of a heating plate provided according to some embodiments of the present invention is shown. Figure 6A schematic diagram of the position of the process state top pin of the heating disc provided by some embodiments of the present application is shown.

[0046] In Figure 5 and Figure 6 In the embodiment shown, the first aspect of the present application provides the above-mentioned heating disc with a boss structure 121 under the heating disc cover 12 extending into the heating disc body 11, which is used to avoid the first through hole on the heating disc body 11 and the second through hole on the heating disc cover 12 being misaligned due to different thermal expansion amounts of the heating disc body 11 and the heating disc cover 12 at high temperatures, causing the top pin 13 to be stuck and unable to move up and down freely.

[0047] In some non-limiting embodiments, the above-mentioned heating disc provided by the second aspect of the present application includes a memory and a controller. Here, the memory includes but is not limited to the computer readable storage medium provided by the third aspect mentioned above, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored on the memory to implement the top pin mounting and dismounting method provided by the first aspect of the present application.

[0048] The working principle of the above-mentioned heating disc will be described below in combination with some embodiments of the top pin mounting and dismounting method. Those skilled in the art can understand that these embodiments of the top pin mounting and dismounting method are only some non-limiting embodiments provided by the present application, which are intended to clearly demonstrate the main concept of the present application and provide some specific schemes for facilitating the public to implement, rather than limiting the overall function or overall working mode of the heating disc. Similarly, the heating disc is also only a non-limiting embodiment provided by the present application, which does not limit the execution subject and execution order of each step in these top pin mounting and dismounting methods.

[0049] Please refer to Figure 7 and Figure 8 . Figure 7 A flowchart of the top pin mounting and dismounting method provided by some embodiments of the present application is shown. Figure 8 A schematic diagram of the principle of the top pin mounting and dismounting method provided by some embodiments of the present application is shown.

[0050] As Figure 7 and Figure 8 shown, in the preventive maintenance stage (PM) of the semiconductor processing process, during the process of dismounting the plurality of top pins 13 and the plurality of weight assemblies 14, the controller can first raise the heating disc to a third position preset in the semiconductor thin film deposition device, and unscrew the three locking bolts on the heating disc cover 12.

[0051] Afterwards, the controller can detach the heating plate cover 12 upward from the heating plate body 11 of the heating plate as provided in the first aspect of the present application. Here, the heating plate cover 12 is provided with a plurality of pins 13 and a plurality of weight assemblies 14.

[0052] Further afterwards, the controller can detach the pins 13 upward and the weight assemblies 14 downward from the heating plate cover 12 via the detachable portion between the pins 13 and the weight assemblies 14.

[0053] Similarly, in the process of installing the plurality of pins 13 and the plurality of weight assemblies 14, the controller can first pass each pin 13 through the corresponding second through hole.

[0054] Afterwards, the controller can install the weight assemblies 14 to the lower side of the second through hole via the second detachable portion between the pins 13 and the weight assemblies 14.

[0055] Further afterwards, the controller can align each weight assembly 14 to its corresponding first through hole and cover the heating plate cover 12 to the heating plate body 11.

[0056] Further afterwards, the controller can tighten the three locking bolts on the heating plate cover 12 and lower the heating plate to a fourth preset position in the semiconductor thin film deposition device to continue the process stage.

[0057] Alternatively, in other embodiments, in the preventive maintenance stage of the semiconductor processing process, in the process of detaching the plurality of pins 13 and the plurality of weight assemblies 14, the controller can first raise the heating plate to a third preset position in the semiconductor thin film deposition device and unscrew the three locking bolts on the heating plate cover 12.

[0058] Afterwards, the controller can first detach the heating plate cover 12 upward from the heating plate body 11. Here, the heating plate cover 12 is provided with a plurality of pins 13 and a plurality of weight assemblies 14.

[0059] Afterwards, the controller can detach the pins 13 upward and the weight assemblies 14 downward from the heating plate cover 12 via the detachable portion between the mushroom heads 15 and the pins 13.

[0060] Similarly, in the process of installing the plurality of pins 13 and the plurality of weight assemblies 14, the controller can first pass each pin 13 through the corresponding second through hole.

[0061] Afterwards, the technician can install the weight assemblies 14 to the lower side of the second through hole via the second detachable portion between the pins 13 and the weight assemblies 14.

[0062] Afterwards, the technician can align each hammer assembly 14 to its corresponding first through hole, and cover the heating disc cover body 12 to the heating disc body 11.

[0063] Afterwards, the controller can tighten the three locking bolts on the heating disc cover body 12, and lower the heating disc to a fourth preset position in the semiconductor thin film deposition device to continue the process stage.

[0064] In summary, the above heating disc, the ejector pin disassembly and assembly method, and the storage medium can set an independently detachable heating disc cover body, and disassemble the ejector pin and the hammer assembly linked to the bottom of the ejector pin from the heating disc cover body, so as to replace the ejector pin and the hammer assembly without disassembling the heating disc, thereby improving the efficiency of the semiconductor processing process.

[0065] Although the above methods are illustrated and described as a series of acts for simplicity, it should be understood and appreciated that the methods are not limited by the order of acts, as some acts can occur in different orders and / or concurrently with other acts from that shown and described herein or in other acts not shown and described herein that are understood by one skilled in the art.

[0066] The steps of a method or algorithm described in connection with the embodiments disclosed herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module can reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium can be integral to the processor. The processor and the storage medium can reside in an ASIC. The ASIC can reside in a user terminal. In the alternative, the processor and the storage medium can reside as discrete components in a user terminal.

[0067] In one or more exemplary embodiments, the functions described can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions can be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media can be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0068] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating tray, characterized by The heating plate comprises: a heating plate body, which is provided with a plurality of first through holes, a first size of the first through holes being greater than a second size of a weight assembly; a heating plate cover, which covers the heating plate body and is provided with a plurality of second through holes corresponding to the plurality of first through holes, wherein a third size of the second through holes is greater than a fourth size of a top pin and smaller than the second size of the weight assembly and a fifth size of a mushroom head; a plurality of top pins, the top of each top pin being connected to the mushroom head provided on the heating plate body, and the bottom of each top pin penetrating the corresponding second through hole downward to connect the top of the corresponding weight assembly; and a plurality of weight assemblies, the bottom of each weight assembly penetrating the corresponding first through hole downward to drive the corresponding top pin to rise and fall in the corresponding second through hole.

2. The heating tray of claim 1, wherein, A detachable part is provided between the mushroom head and the top pin, and / or between the top pin and the weight assembly, to mount the mushroom head and the weight assembly on both sides of the second through hole respectively and connect them via the top pin penetrating the second through hole.

3. The heating tray of claim 1, wherein, The weight assembly comprises: a weight shell, which is provided with a mounting hole at the top; a first guide rod, which is provided in the weight shell and has a top connected to the lower end of the top pin penetrating the mounting hole; a second guide rod, which is provided in the weight shell and has a top connected to the bottom of the first guide rod via a spring and a bottom connected to the bottom of the weight shell; and the spring, which is provided between the first guide rod and the second guide rod, is used to make the first distance between the top of the top pin of the heating plate in the initial state and the heating plate cover smaller than the second distance between the top of the weight assembly of the heating plate in the process state and the heating plate cover, to prevent the upper surface of the weight assembly from colliding with the lower surface of the heating plate cover when the top pin is lifted.

4. The heating tray of claim 3, wherein, The bottom of the weight shell is a first stepped shape expanding downward, the sixth size of the first guide rod is greater than the seventh size of the mounting hole and smaller than the eighth size of the first step of the inner wall of the weight shell, and the second guide rod is a second stepped shape contracting upward, the ninth size of the second step of the second guide rod is smaller than the eighth size, and the tenth size of the first step of the second guide rod is greater than the eighth size and smaller than the eleventh size of the second step of the bottom of the weight shell.

5. The heating tray of claim 3, wherein, The inner side of the mounting hole of the weight shell is provided with internal threads, and the lower end of the top pin is provided with matching external threads.

6. The heating tray of claim 1, wherein, The heating plate cover is provided with locking bolts for locking the heating plate cover on the heating plate body.

7. The heating tray of claim 1, wherein, The heating plate body is provided with three first through holes, the heating plate cover is correspondingly provided with a plurality of second through holes, and the heating plate correspondingly comprises three top pins with mushroom heads and three weight assemblies.

8. A method of disassembling a needle, comprising: The heating plate comprises the following steps: removing the heating plate cover upward from the heating plate body of the heating plate according to any one of claims 1-7, wherein the heating plate cover is provided with a plurality of top pins and a plurality of weight assemblies; and ​ removing the plunger upwardly and the weight assembly downwardly from the heating disc cover body via detachable parts located between the mushroom head and the plunger, and / or between the plunger and the weight assembly.

9. The ejection pin removal method of claim 8, wherein, Further comprising the steps of: inserting each of the plungers through a corresponding second through hole; mounting the mushroom head to an upper side of the second through hole via a first detachable part located between the mushroom head and the plunger, and / or mounting the weight assembly to a lower side of the second through hole via a second detachable part located between the plunger and the weight assembly; and aligning each of the weight assemblies to its corresponding first through hole and covering the heating disc cover body onto the heating disc body.

10. A computer readable storage medium having stored thereon computer instructions, wherein, The computer instructions, when executed by the processor, implement the plunger dismounting method as claimed in any one of claims 7-9.

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