Optical chip, on-chip laser multi-pulse modulation method and system

Abstract

This invention discloses an optical chip, an on-chip laser multi-pulse modulation method, and a system. The optical chip includes a main beam splitter, a main beam combiner, a first optical path, and a second optical path. The main beam splitter includes a beam splitter input, a first beam splitter output, and a second beam splitter output. The main beam combiner includes a first beam combiner input, a second beam combiner input, and a beam combiner output. The first beam splitter output of the main beam splitter is connected to the first beam combiner input of the main beam combiner via the first optical path. The second beam splitter output is connected to the second beam combiner input of the main beam combiner via the second optical path. The first optical path includes a connecting waveguide, and the second optical path includes a preset number of adjustment units. This invention, through the optical chip and the on-chip laser multi-pulse modulation method, enables the modulation of laser multi-pulses to be applied to various occasions, and through a flexible control mechanism, precise control of pulse spacing and energy can be achieved.

Description

Technical Field

[0001] This invention relates to the field of optical chip technology, and in particular to an optical chip, an on-chip laser multi-pulse modulation method and system. Background Technology

[0002] Pulsed lasers generate laser light through stimulated emission and utilize techniques such as Q-switching, mode-locking, or gain switching to convert continuous laser light into short-pulse, high-peak-power pulses. These pulses have wide applications in precision micromachining (such as semiconductor etching and polishing) and medical surgery. However, high-peak-power single pulses often cause thermal damage to materials (such as melting and cracking). Although reducing the pulse repetition frequency can decrease the range of thermal damage during material processing, processing efficiency also decreases. This raises a trade-off between processing efficiency and accuracy, making it difficult to meet the demands of practical applications. Multi-pulse laser technology, on the other hand, first converts a single high-energy pulse into multiple sub-pulse sequences using optical means. While maintaining the total energy, it reduces the peak power of the single pulse, effectively suppressing thermal damage and solving the thermal damage problem in (high-energy) single-pulse applications.

[0003] However, currently, free-space multi-pulse modulation systems typically rely on highly customized designs, resulting in customized system designs that lack standardization and modularity. This limits their versatility and scalability. Furthermore, current pulse modulation schemes are limited to a single modulation dimension, making it difficult to meet the precision requirements for fine-grained control of core parameters such as pulse spacing and energy.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] The main objective of this invention is to provide an optical chip, an on-chip laser multipulse modulation method and system, which aims to solve the problems in the prior art where free space multipulse modulation systems usually rely on highly customized designs and lack standardization and modularity, thus limiting their versatility and scalability, and where the current pulse modulation schemes are limited to a single modulation dimension, making it difficult to meet the requirements for fine control of core parameters such as pulse spacing and energy.

[0006] To achieve the above objectives, the present invention provides an optical chip comprising: a main beam splitter, a main beam combiner, a first optical path, and a second optical path. The main beam splitter includes a beam splitter input, a first beam splitter output, and a second beam splitter output. The main beam combiner includes a first beam combiner input, a second beam combiner input, and a beam combiner output. The first beam splitter output of the main beam splitter is connected to the first beam combiner input of the main beam combiner via the first optical path. The second beam splitter output is connected to the second beam combiner input of the main beam combiner via the second optical path. The first optical path includes a connecting waveguide, and the second optical path includes a predetermined number of adjustment units.

[0007] Pulsed laser light is coupled into the optical chip and split by the main beam splitter to obtain a first sub-pulse and a second sub-pulse. The first sub-pulse passes through a connecting waveguide and the main beam combiner and is output through the output end of the beam combiner. The second sub-pulse passes through the connecting waveguide, a preset number of adjustment units and the main beam combiner in sequence, and outputs a set number of sub-pulse sequences in sequence according to the pulse energy requirements and pulse interval conditions.

[0008] The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line. These units are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirements of each sub-pulse, thereby performing phase modulation and pulse interval control on the pulsed laser.

[0009] Optionally, in each adjustment unit, the input port of the first-stage beam splitter is connected to the previous adjustment unit, the output port of the first-stage beam splitter is connected to two connecting waveguides respectively, and one of the connecting waveguides is connected to a phase shifter. The other ends of the two connecting waveguides are connected to the input port of the second-stage beam splitter, and the output port of the second-stage beam splitter is connected to one connecting waveguide and one optical waveguide delay line respectively. In the last adjustment unit, the corresponding secondary beam splitter is replaced by a secondary beam combiner. The output port of the secondary beam combiner is connected to only one connecting waveguide and is connected to the main beam combiner.

[0010] Optionally, the preset quantity is set according to the input pulsed laser and user requirements, wherein the user requirements include phase modulation requirements and pulse interval control requirements.

[0011] Furthermore, to achieve the above objectives, the present invention also provides an on-chip laser multi-pulse modulation method, implemented based on the aforementioned optical chip, wherein the on-chip laser multi-pulse modulation method specifically includes:

[0012] The pulsed laser output from the pulsed laser is input into the optical chip via optical coupling;

[0013] The pulsed laser is split by the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and the first sub-pulse is output.

[0014] The second sub-pulse is fed into a preset number of adjustment units after passing through a connecting waveguide, and the sub-pulse sequence generated by the preset number of adjustment units with a set number of sub-pulses is output sequentially.

[0015] Optionally, the step of inputting the second sub-pulse through a connecting waveguide to a preset number of adjustment units for adjustment specifically includes:

[0016] The second sub-pulse is input into a preset number of adjustment units after passing through one connecting waveguide;

[0017] Obtain the pulse interval, pulse number, and pulse energy of the sub-pulse sequence from the user, and set the usage of each phase shifter and optical waveguide delay line in a preset number of adjustment units based on the pulse interval, pulse number, and pulse energy;

[0018] Based on the usage of each phase shifter and optical waveguide delay line in the preset number of adjustment units, the second sub-pulse is adjusted using the preset number of adjustment units.

[0019] Optionally, the step of sequentially outputting the sub-pulse sequence generated by a preset number of the adjustment units, having a set number of sub-pulse sequences, specifically includes:

[0020] Obtain a set quantity and determine whether the set quantity is 1;

[0021] When the set quantity is 1, the target second sub-pulse generated by the preset number of the adjustment units will be output;

[0022] When the set quantity is not 1, the preset number of sub-pulse sequences generated by the adjustment unit with the preset number of sub-pulse sequences are output sequentially.

[0023] Optionally, when the set quantity is 1, outputting a preset number of target second sub-pulses generated by the adjustment unit specifically includes:

[0024] When the set quantity is 1, after passing through a preset number of adjustment units, the target second sub-pulse is input to the main beam combiner, wherein the preset number of adjustment units do not adjust the second sub-pulse;

[0025] The pulsed laser output from the beam combiner is coupled into the optical fiber to complete the output.

[0026] Optionally, when the set quantity is not 1, the step of sequentially outputting the sub-pulse sequences with a set quantity generated by the preset number of adjustment units specifically includes:

[0027] When the set quantity is not 1, the set number of sub-pulse sequences generated by the preset number of adjustment units are sequentially input into the main combiner;

[0028] The output of the combiner, which outputs a set number of sub-pulse sequences, is coupled into the optical fiber to complete the output.

[0029] Furthermore, to achieve the above objectives, the present invention also provides an on-chip laser multi-pulse modulation system, wherein the on-chip laser multi-pulse modulation system comprises:

[0030] The input module is used to input the pulsed laser output from the pulsed laser into the optical chip via optical coupling.

[0031] The beam splitting module is used to split the pulsed laser based on the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and output the first sub-pulse.

[0032] The adjustment output module is used to input the second sub-pulse through a connecting waveguide to a preset number of adjustment units for adjustment, and to output the sub-pulse sequence with a set number generated by the preset number of adjustment units in sequence.

[0033] In this invention, the optical chip includes: a main beam splitter, a main beam combiner, a first optical path, and a second optical path. The main beam splitter includes a beam splitter input, a first beam splitter output, and a second beam splitter output. The main beam combiner includes a first beam combiner input, a second beam combiner input, and a beam combiner output. The first beam splitter output of the main beam splitter is connected to the first beam combiner input of the main beam combiner via the first optical path. The second beam splitter output is connected to the second beam combiner input of the main beam combiner via the second optical path. The first optical path includes a connecting waveguide, and the second optical path includes a predetermined number of adjustment units. Pulsed laser light is coupled through... The light is fed into the optical chip and split by the main beam splitter to obtain a first sub-pulse and a second sub-pulse. The first sub-pulse passes through a connecting waveguide and the main beam combiner, and is output through the output terminal of the beam combiner. The second sub-pulse passes through the connecting waveguide, a preset number of adjustment units, and the main beam combiner in sequence, and outputs a set number of sub-pulse sequences according to the pulse energy requirements and pulse interval conditions. The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line, which are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirements of each sub-pulse, so as to perform phase modulation and pulse interval control of the pulsed laser. In this invention, pulsed laser light output from a pulsed laser is input into the optical chip via optical coupling. The pulsed laser light is split by the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and the first sub-pulse is output. The second sub-pulse is then fed through a connecting waveguide and input to a preset number of adjustment units for adjustment. The outputs of these preset number of adjustment units are then fed to a main beam combiner for beam combining, resulting in a set number of sub-pulse outputs. This invention employs a multi-stage series-parallel design integrating on-chip optical waveguide delay lines and optical switches, along with a thermal / electric phase shifter that adds individual branch waveguides at intervals, to obtain the corresponding optical chip. By applying voltage through the thermal / electric phase shifter, the refractive index of the waveguide is adjusted, thereby changing the propagation phase of the optical signal. Simultaneously, the pulse interval is achieved using an optical waveguide delay line, ultimately enabling precise control of the sub-pulse interval, pulse number, and pulse energy. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of the optical chip of the present invention, which has a multi-level adjustment unit;

[0035] Figure 2 This is a schematic diagram of the structure of the optical chip of the present invention having a single-stage adjustment unit;

[0036] Figure 3 This is a schematic diagram of the PCB-based interconnection scheme of the present invention;

[0037] Figure 4This is a flowchart of an embodiment of the on-chip laser multi-pulse modulation method of the present invention;

[0038] Figure 5 This is a schematic diagram of the 1064nm laser processing scheme of the present invention;

[0039] Figure 6 This is a schematic diagram of the 1550nm laser cosmetic treatment solution for pigmentation according to the present invention;

[0040] Figure 7 This is a schematic diagram of the on-chip laser multipulse modulation system implemented in this invention. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0042] Pulsed lasers generate laser light through stimulated emission and utilize techniques such as Q-switching, mode-locking, or gain switching to convert continuous laser light into short-pulse, high-peak-power pulses, finding wide applications in precision micromachining (e.g., semiconductor etching and polishing) and medical surgery. However, high-peak-power single pulses often cause thermal damage to materials (e.g., melting, cracking). While reducing the pulse repetition frequency can decrease the extent of thermal damage during material processing, processing efficiency also decreases, raising a trade-off between processing efficiency and precision, which struggles to meet the demands of practical applications. To address these issues, multi-pulse laser technology has gradually attracted industry attention. Multi-pulse laser technology first converts a single high-energy pulse into multiple sub-pulse sequences using optical means, reducing the peak power of the single pulse while maintaining the total energy, thus effectively suppressing thermal damage. Second, by adjusting parameters such as the pulse interval and pulse energy between sub-pulses, it is possible to balance thermal diffusion and material response, achieving high-precision, low-damage processing (e.g., drilling brittle materials). This method not only significantly improves processing efficiency but also ensures processing quality, providing an efficient and reliable solution for precision machining. Current multipulse laser technology mainly relies on free-space optical path systems. Its core components include mirrors, beam splitters, lenses, polarization elements, polarization-maintaining collimators, and acousto-optic modulators (AOMs). These devices can decompose a single pulse into multiple sub-pulse sequences and control the energy, spacing, and phase of the sub-pulses by controlling the propagation path and characteristics of the laser in free space.

[0043] However, despite the significant advantages of multi-pulse technology in controlling pulse sequences, existing free-space laser modulation systems have several limitations. These limitations can be summarized as follows: First, the system complexity and construction cost are high. Free-space multi-pulse modulation systems typically rely on highly customized designs, requiring various precision optical components (such as lenses, mirrors, beam splitters, etc.) and related electrical control devices, such as FPGA (Field Programmable Gate Array) control circuits and multi-stage amplifiers. This significantly increases system complexity, leading to bulky equipment, high space occupancy, and consequently, higher manufacturing and construction costs. Second, the system operation and maintenance costs are high. Free-space modulation systems have numerous discrete components, high power consumption, and complex maintenance. Optical components, especially optical modulators and multi-stage optical amplifiers, significantly increase system energy consumption, making it difficult to meet the needs of low-power applications. Furthermore, the typically customized system design, lacking standardization and modularity, limits its versatility and scalability, and increases the difficulty of system debugging and maintenance, further driving up costs. Third, the system's environmental adaptability and stability are insufficient. The physical characteristics of free-space optical paths make them susceptible to environmental vibrations, temperature changes, and humidity fluctuations, resulting in poor system stability and difficulty in long-term stable operation under complex environments. Fourthly, the system's pulse control methods and flexibility are insufficient. Traditional pulse control schemes are limited to a single control dimension, making it difficult to meet the precision requirements for fine-grained control of core parameters such as pulse spacing and energy. Fifthly, the system's limitations contradict future needs; the physical constraints of free-space optical paths make miniaturization and integration difficult, failing to meet the future development trend of high-precision, miniaturized devices.

[0044] To address one or more of the above-mentioned problems, the present invention provides an optical chip comprising: a main beam splitter, a main beam combiner, a first optical path, and a second optical path. The main beam splitter includes a beam splitter input, a first beam splitter output, and a second beam splitter output. The main beam combiner includes a first beam combiner input, a second beam combiner input, and a beam combiner output. The first beam splitter output of the main beam splitter is connected to the first beam combiner input of the main beam combiner via the first optical path. The second beam splitter output is connected to the second beam combiner input of the main beam combiner via the second optical path. The first optical path includes a connecting waveguide, and the second optical path includes a preset number of modulation... The unit consists of a pulsed laser beam coupled into the optical chip and split by a main beam splitter to obtain a first sub-pulse and a second sub-pulse. The first sub-pulse passes through a connecting waveguide and a main beam combiner, and is output through the output of the beam combiner. The second sub-pulse passes through the connecting waveguide, a preset number of adjustment units, and the main beam combiner in sequence, and outputs a set number of sub-pulse sequences according to the pulse energy requirements and pulse interval conditions. The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line, which are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirements of each sub-pulse, so as to perform phase modulation and pulse interval control of the pulsed laser.

[0045] The optical chip of the present invention, which can be controlled at multiple levels, such as Figure 1 As shown, the optical chip includes: a main beam splitter 202-1 and a main beam combiner 202-4. The input port of the main beam splitter is connected to an input terminal 201, and the output port of the main beam combiner is connected to an output terminal 201-(3N+4).

[0046] The pulsed laser is coupled into the optical chip through the input terminal 201 and split by the main beam splitter 202-1 to obtain the first sub-pulse and the second sub-pulse. The first sub-pulse passes through a connecting waveguide 201-1, and is then modulated by 202-4 before being output through the output terminal 201-(3N+4). The second sub-pulse passes through the connecting waveguide 201-2, a preset number of adjustment units, and the main beam combiner 202-4 in sequence. According to the pulse energy requirements and pulse interval conditions, a set number of sub-pulse sequences are output in sequence.

[0047] The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line. These units are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirements of each sub-pulse, thereby performing phase modulation and pulse interval control on the pulsed laser.

[0048] Specifically, in Figure 1The image shows an optical chip with a multi-level adjustment unit, including: an input terminal 201, an output terminal 201-(3N+4); and 2(N-1) 2 The secondary beam splitter specifically includes 203-1, 203-2, 203-3...203-(2N-1) and 202-3, where N represents the number of adjustment units; 1 2 main beam splitters 202-1; 1 Secondary beam splitter 202-2; 1 2nd secondary combiner 202-3; 1 The system consists of two main beam combiners (202-4); (3N+5) connecting waveguides (201, 201-1, 201-2, 201-3, 201-4...201-(3N+4)); N optical waveguide delay lines (204-1, 204-2, ..., 204-N); and N phase shifters (205-1, 205-2, ..., 205-N). 202-2, 201-3, 201-4, 205-1, 203-1, 201-5, and 204-1 form the first adjustment unit, and so on. The phase shifters are also referred to as the thermal / electrical structure, while the remaining structures are optical structures.

[0049] For optical chips, a pulsed laser with a specific repetition frequency and pulse width (selectable according to actual needs) output from a pulsed laser is first coupled into the optical chip using fiber-to-chip coupling (side coupling or grating coupling). The pulsed laser first passes through a 1×2 multi-mode interferometer (MMI), i.e., the main beam splitter, during which the optical pulse is split into two, only changing the pulse amplitude (the amplitude change can be set according to the pre-design requirements; ideally, the pulse shape remains unchanged). Subsequently, one pulse is directly output to the terminal, which is the first sub-pulse. The other pulse enters the connected 1×2 MMI, i.e., the secondary beam splitter, and is split into two again (the pulse amplitude change can also be determined according to the pre-design), finally generating two outputs. At this point, one of the pulses can be phase-controlled by a thermal / electric phase shifter. By changing the phase and utilizing the principle of optical switching, the output path of subsequent pulses can be flexibly selected: that is, only one pulse can be output as needed (this pulse can choose either a delayed line path or a non-delayed line path to achieve precise time interval control between pulses), or two pulses can be output simultaneously, passing through the delayed line path and the non-delayed line path respectively. Subsequently, these two pulses will enter the next stage 1×2 MMI or 2×2 MMI sequentially or simultaneously (depending on how the phase shifter is used) for further coupling and output.

[0050] Furthermore, for Figure 1In the optical chip under these conditions, a pulsed laser with the fundamental mode is input into the optical fiber 200-1. Through optical coupling, it is coupled into the optical chip via a tapered waveguide region (or via grating-based vertical coupling). Then, it passes through 202-1 and generates two outputs at the output end (the amplitudes of both pulses are reduced, and their sum approximates the original single pulse). One output is first coupled through 201-(3N+4) to the output end, forming the first sub-pulse. The other output is fed from 201-2 to 202-2, and the output wave is further split into two (the amplitudes of both pulses are reduced, and their sum approximates the original single pulse). These two pulses then enter the two waveguide arms 201-3 and 201-4 of the Mach-Zehnder Interferometer (MZI), respectively. 201-4 can be phase-modulated by 205-1. At this point, it is possible to choose whether to perform phase modulation on the pulse, thereby selecting the output mode in 203-1, and thus enabling the selection of subsequent optical transmission paths 204-1 and 201-5, achieving the corresponding time delay function. Subsequently, this part of the pulse passes through 203-2 or sequentially, and 201-7 can be phase modulated again by 205-2. At this point, it is possible to choose whether to perform phase modulation on the pulse, thereby selecting the output mode in 203-3, and thus enabling the selection of subsequent optical transmission paths 204-2 and 201-8, again selecting the corresponding time delay function. The corresponding parts thereafter are similar, and finally after being modulated by 202-4, it is transmitted through waveguide 201-(3N+4), and then coupled into optical fiber 200-2 for transmission (during the optical path transmission process, the number, intensity, and spacing of the pulses change, and the specific changes can be determined by designing similar devices such as 201-3, 202-1, 202-2, 202-3, 204, and 205-1).

[0051] Furthermore, each of the adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line.

[0052] In each adjustment unit, the input port of the first-stage beamsplitter is connected to the previous adjustment unit, and the output port of the first-stage beamsplitter is connected to two connecting waveguides, one of which is connected to a phase shifter. The other ends of the two connecting waveguides are connected to the input port of the second-stage beamsplitter, and the output port of the second-stage beamsplitter is connected to one connecting waveguide and one optical waveguide delay line. For the last adjustment unit, the secondary beamsplitter is replaced by a secondary beam combiner. In this case, the output port is only connected to one connecting waveguide, which in turn connects to the main beam combiner. This design achieves an optical switching function that switches the output port by adjusting the phase shifter.

[0053] Correspondingly, in each adjustment unit, after the corresponding laser input is sent to the secondary beam splitter, the output light wave is split into two paths (the amplitude of both light pulses is reduced, and the sum of the two is approximately the original single path), and they enter the two waveguide arms of the MZI respectively, that is, the two connecting waveguides connected to the first secondary beam splitter. One of the connecting waveguides can be connected to a phase shifter, which can be used for phase modulation. At this time, it is possible to choose whether to modulate the signal, and then select the output mode after the next secondary beam splitter, that is, to choose whether to perform time delay, so as to realize the corresponding pulse interval control function.

[0054] In this invention, the MZI (N=1 or 2) that implements optical switching function through N×2 and 2×2 MMIs achieves optical field distribution through mode interference. Without external phase modulation, this structure can achieve specific power distribution; however, with the introduction of external phase modulation, the output intensity of each port can be flexibly adjusted, thereby achieving the effect of optical switching.

[0055] Furthermore, the preset quantity is set according to the input pulsed laser and user requirements, wherein the user requirements include phase modulation requirements and pulse interval control requirements.

[0056] The total number of beam splitters and connecting waveguides is related to the total number of phase shifters and optical waveguide delay lines. When the number of phase shifters and optical waveguide delay lines is N, there are 2N-1 2×2 beam splitters (1×2 beam splitters and 1×2 beam combiners are fixed at 2 each), and 3N+5 connecting waveguides.

[0057] Specifically, in this invention, the specific preset quantity can be set according to the actual situation, that is, the number of adjustment units required is set according to the pulse interval, pulse number and pulse energy of the sub-pulse sequence.

[0058] Furthermore, when the adjustment unit is a single stage, the following can be obtained: Figure 2The schematic diagram of the optical chip structure shown includes an input terminal 101, an output terminal 101-7; three beam splitters 102-1, 102-2, and 103; two beam combiners 102-3 and 102-4; eight connecting waveguides 101, 101-1, 101-2, 101-3, 101-4, 101-5, 101-6, and 101-7; one optical waveguide delay line 104; and one phase shifter 105. In this optical chip configuration, the input fiber 100-1 carries a pulsed laser with a fundamental mode. This laser is coupled into the chip via a tapered waveguide region through optical coupling (or via grating-based vertical coupling). After passing through 102-1, it generates two outputs (both pulse amplitudes are reduced, and their sum approximates the original single pulse). The outputs first pass through a connecting waveguide 101-1, then are modulated by 102-4, resulting in one output pulse, the first sub-pulse. The other pulse is input from 101-2 to 102-2, and the output is further split into two (both pulse amplitudes are reduced, and their sum approximates the original single pulse), entering the two waveguide arms 101-3 and 101-4 of the MZI. 101-4 can be phase-modulated by 105. At this point, signal modulation can be selected, allowing for selection of the output mode in 103, and thus enabling the selection of the transmission path for the light at 104 or 101-5, achieving the corresponding time delay function. Subsequently, this part of the signal is output through waveguide 101-6 via 102-3 or sequentially, modulated by 102-4, and then transmitted through waveguide 101-7. It is then coupled into optical fiber 100-2 for transmission. (During the optical transmission process, the number, amplitude, and spacing of the pulses are all changed. The specific changes can be determined by designing similar devices such as 101-3, 102-1, 102-2, 102-3, 102-4, 103, 104, and 105.)

[0059] Furthermore, the optical chip based on the present invention has a corresponding control system, including an optical chip, an electrical chip connected to the optical chip, and a programmable voltage control system connected to the electrical chip; the programmable voltage control system, through the electrical chip, regulates the operating state of the optical switch on the optical chip in real time. Meanwhile, as... Figure 3 As shown, the optical chip and the electrical chip are directly integrated on the printed circuit board (PCB) using a 2D interconnection method (wire bonding technology), together forming a compact and high-performance optoelectronic integrated system.

[0060] Therefore, based on the highly integrated nature of on-chip optical devices, this invention achieves multi-dimensional flexible control over the number and spacing of output laser sub-pulses by rationally arranging multiple sets of optical waveguide delay line structures of different lengths and combining them with the dynamic gating function of reconfigurable optical switches. Simultaneously, the high integration and modular design of the chip make this solution applicable not only to silicon photonics platforms but also to material processing platforms such as lithium niobate on insulator (LNOI), silicon nitride (SiN), indium phosphide (InP), and gallium arsenide (GaAs). This compatibility not only broadens its application scope but also provides more possibilities for the development of multifunctional, high-performance integrated optical devices and novel heterogeneous integrated architectures for optical chips. In practical applications, the system supports preset delay levels, allowing selection as needed, simplifying operation and improving practicality and flexibility. This solution integrates complex discrete optical components from traditional laser modulation systems onto a single chip. This means converting multiple optical components (such as electro-optic modulators, couplers, and optical fibers) that previously required separate placement, connection, and adjustment into chip-level optical waveguide devices, integrated onto a tiny silicon or other material chip. These optical components are typically discrete in traditional systems, requiring independent optical paths, external equipment, and precise alignment. However, through optical integrated chip technology, these functional devices can be designed and manufactured on a single chip using on-chip optical waveguide systems, significantly improving the integration of multi-pulse modulation systems and reducing system complexity. Specifically, optical waveguide functional devices (optical switches, phase shifters, beam splitters, optical waveguide delay lines, etc.), optical waveguides, and other optical coupling devices can be integrated on the chip. These devices are connected internally via tiny optical waveguides, and optical signal processing, modulation, and transmission are all completed within the chip, eliminating reliance on external lenses, mirrors, or other large components. The advantages of this integration technology are that it not only reduces the system's size and weight but also improves the stability of optical performance and system efficiency, while significantly reducing manufacturing costs and power consumption. This gives it the characteristics of high precision, low power consumption, miniaturization, modularity and portability.

[0061] Furthermore, such as Figure 4 As shown, based on the optical chip, the present invention also provides an on-chip laser multi-pulse modulation method, wherein the on-chip laser multi-pulse modulation method includes:

[0062] Step S41: Input the pulsed laser output from the pulsed laser into the optical chip via optical coupling;

[0063] Step S42: Based on the main beam splitter in the optical chip, the pulsed laser is split to obtain a first sub-pulse and a second sub-pulse, and the first sub-pulse is output.

[0064] Step S43: The second sub-pulse is fed into a preset number of adjustment units after passing through a connecting waveguide for adjustment, and the sub-pulse sequence generated by the preset number of adjustment units with a set number of sub-pulses is output sequentially.

[0065] Specifically, in this invention, an on-chip laser multi-pulse modulation method can be implemented based on an optical chip. This on-chip laser multi-pulse modulation method employs a combination of optical switches and optical waveguide delay lines, achieving high integration through multi-stage series-parallel connections. This scheme optimizes the optical path structure step by step, utilizing optical switches to achieve the superposition and switching of optical pulses through optical waveguide delay line paths with different delay times. Combined with the flexible configuration function of the splitting ratio of different optical switches, it achieves precise control of sub-pulse decomposition, pulse intensity modulation, and sub-pulse interval. Furthermore, the switching characteristics of the optical switches can be controlled by an electrical chip with a voltage programmable control system, thereby precisely controlling the energy, quantity, and time interval parameters of the output pulsed laser to meet the needs of complex application scenarios.

[0066] Furthermore, the step of inputting the second sub-pulse through a connecting waveguide and then into a preset number of adjustment units for adjustment specifically includes:

[0067] The second sub-pulse is input into a preset number of adjustment units after passing through one connecting waveguide;

[0068] Obtain the pulse interval, pulse number, and pulse energy of the sub-pulse sequence from the user, and set the usage of each phase shifter and optical waveguide delay line in a preset number of adjustment units based on the pulse interval, pulse number, and pulse energy;

[0069] Based on the usage of each phase shifter and optical waveguide delay line in the preset number of adjustment units, the second sub-pulse is adjusted using the preset number of adjustment units.

[0070] In this invention, a corresponding adjustment unit is used to control the pulsed laser. By adjusting a preset number of adjustment units, the pulsed laser can be precisely controlled.

[0071] Furthermore, the step of sequentially outputting the sub-pulse sequence generated by the preset number of adjustment units, having a set number of sub-pulse sequences, specifically includes:

[0072] Obtain a set quantity and determine whether the set quantity is 1;

[0073] When the set quantity is 1, the target second sub-pulse generated by the preset number of the adjustment units will be output;

[0074] When the set quantity is not 1, the preset number of sub-pulse sequences generated by the adjustment unit with the preset number of sub-pulse sequences are output sequentially.

[0075] Furthermore, when the set quantity is 1, outputting a preset number of target second sub-pulses generated by the adjustment unit specifically includes:

[0076] When the set quantity is 1, after passing through a preset number of adjustment units, the target second sub-pulse is input to the main beam combiner, wherein the preset number of adjustment units do not adjust the second sub-pulse;

[0077] The pulsed laser output from the beam combiner is coupled into the optical fiber to complete the output.

[0078] When the set quantity is not 1, the preset number of sub-pulse sequences generated by the adjustment units, each having a preset number of sub-pulse sequences, are output sequentially, specifically including:

[0079] When the set quantity is not 1, the set number of sub-pulse sequences generated by the preset number of adjustment units are sequentially input into the main combiner;

[0080] The output of the combiner, which outputs a set number of sub-pulse sequences, is coupled into the optical fiber to complete the output.

[0081] Therefore, the core innovation of the on-chip laser multi-pulse modulation method proposed in this invention lies in the use of a multi-stage series-parallel design that integrates on-chip optical waveguide delay lines and optical switches, as well as a thermal / electric phase shifter that adds individual branch waveguides at intervals. By applying voltage through the thermal / electric phase shifter, the refractive index of the waveguide is adjusted, thereby controlling the propagation phase of the optical signal and ultimately achieving precise switching of the optical pulse path.

[0082] Furthermore, by employing different material processes for optical chips, design solutions tailored to different operating wavelengths and application scenarios can be achieved. For example, this invention uses silicon nitride technology to modulate pulsed lasers with a wavelength of 1064nm, such as... Figure 5 As shown, the on-chip laser multi-pulse modulation method can be used for precision machining tasks in industrial processing fields such as laser cutting, drilling, and marking; while the silicon-based platform process can achieve laser modulation at a wavelength of 1550nm, which can be applied to fields such as medical and communications. Figure 6 As shown, it can be used in skin repair, scar treatment, and cosmetic fields.

[0083] In summary, the optical chip of the present invention includes: a main beam splitter, a main beam combiner, a first optical path, and a second optical path. The main beam splitter includes a beam splitter input, a first beam splitter output, and a second beam splitter output. The main beam combiner includes a first beam combiner input, a second beam combiner input, and a beam combiner output. The first beam splitter output of the main beam splitter is connected to the first beam combiner input of the main beam combiner via the first optical path. The second beam splitter output is connected to the second beam combiner input of the main beam combiner via the second optical path. The first optical path includes a connecting waveguide, and the second optical path includes a predetermined number of adjustment units. A pulsed laser path is also included. The laser beam is overcoupled into the optical chip and split by the main beam splitter to obtain a first sub-pulse and a second sub-pulse. The first sub-pulse passes through a connecting waveguide and the main beam combiner, and is output through the output terminal of the beam combiner. The second sub-pulse passes through the connecting waveguide, a preset number of adjustment units, and the main beam combiner in sequence, and outputs a set number of sub-pulse sequences according to the pulse energy requirement and pulse interval condition. The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line, which are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirement condition of each sub-pulse, so as to perform phase modulation and pulse interval control of the pulsed laser.

[0084] In this invention, pulsed laser light output from a pulsed laser is input into the optical chip via optical coupling. The pulsed laser light is split by the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and the first sub-pulse is output. The second sub-pulse is then fed through a connecting waveguide and input to a preset number of adjustment units for adjustment. The outputs of these preset number of adjustment units are then fed to a main beam combiner for beam combining, resulting in a set number of sub-pulse outputs. This invention employs a multi-stage series-parallel design integrating on-chip optical waveguide delay lines and optical switches, along with a thermal / electric phase shifter that adds individual branch waveguides at intervals, to obtain the corresponding optical chip. By applying voltage through the thermal / electric phase shifter, the refractive index of the waveguide is adjusted, thereby changing the propagation phase of the optical signal. Simultaneously, the pulse interval is achieved using an optical waveguide delay line, ultimately enabling precise control of the sub-pulse interval, pulse number, and pulse energy.

[0085] Furthermore, such as Figure 7 As shown, based on the above-described on-chip laser multi-pulse modulation method, the present invention also provides an on-chip laser multi-pulse modulation system, wherein the on-chip laser multi-pulse modulation system includes:

[0086] Input module 71 is used to input the pulsed laser output from the pulsed laser into the optical chip via optical coupling.

[0087] The beam splitting module 72 is used to split the pulsed laser based on the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and output the first sub-pulse.

[0088] The adjustment output module 73 is used to input the second sub-pulse through a connecting waveguide to a preset number of adjustment units for adjustment, and to output the sub-pulse sequence with a set number generated by the preset number of adjustment units in sequence.

[0089] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal that includes that element.

[0090] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An optical chip, characterized in that, The optical chip includes: a main beam splitter, a main beam combiner, a first optical path, and a second optical path. The main beam splitter includes a beam splitter input, a first beam splitter output, and a second beam splitter output. The main beam combiner includes a first beam combiner input, a second beam combiner input, and a beam combiner output. The first beam splitter output of the main beam splitter is connected to the first beam combiner input of the main beam combiner via the first optical path. The second beam splitter output is connected to the second beam combiner input of the main beam combiner via the second optical path. The first optical path includes a connecting waveguide, and the second optical path includes a preset number of adjustment units. Pulsed laser light is coupled into the optical chip and split by the main beam splitter to obtain a first sub-pulse and a second sub-pulse. The first sub-pulse passes through a connecting waveguide and the main beam combiner and is output through the output end of the beam combiner. The second sub-pulse passes through the connecting waveguide, a preset number of adjustment units and the main beam combiner in sequence, and outputs a set number of sub-pulse sequences in sequence according to the pulse energy requirements and pulse interval conditions. The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line. These units are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirements of each sub-pulse, thereby performing phase modulation and pulse interval control on the pulsed laser. In each adjustment unit, the input port of the first-stage beam splitter is connected to the previous adjustment unit, and the output port of the first-stage beam splitter is connected to two connecting waveguides respectively, with one phase shifter connected to one of the connecting waveguides. The other ends of the two connecting waveguides are connected to the input port of the second-stage beam splitter, and the output port of the second-stage beam splitter is connected to one connecting waveguide and one optical waveguide delay line respectively. In the last adjustment unit, the corresponding secondary beam splitter is replaced by a secondary beam combiner, and the output port of the secondary beam combiner is connected to only one connecting waveguide and then connected to the main beam combiner.

2. The optical chip according to claim 1, characterized in that, The preset quantity is set according to the input pulsed laser and user requirements, wherein the user requirements include phase modulation requirements and pulse interval control requirements.

3. An on-chip laser multi-pulse modulation method, characterized in that, The on-chip laser multi-pulse modulation method is implemented based on the optical chip described in any one of claims 1-2, and the on-chip laser multi-pulse modulation method specifically includes: The pulsed laser output from the pulsed laser is input into the optical chip via optical coupling; The pulsed laser is split by the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and the first sub-pulse is output. The second sub-pulse is fed into a preset number of adjustment units after passing through a connecting waveguide, and the sub-pulse sequence generated by the preset number of adjustment units with a set number of sub-pulses is output sequentially.

4. The on-chip laser multi-pulse modulation method according to claim 3, characterized in that, The step of inputting the second sub-pulse into a preset number of adjustment units after passing it through a connecting waveguide for adjustment specifically includes: The second sub-pulse is input into a preset number of adjustment units after passing through one connecting waveguide; Obtain the pulse interval, pulse number, and pulse energy of the sub-pulse sequence from the user, and set the usage of each phase shifter and optical waveguide delay line in a preset number of adjustment units based on the pulse interval, pulse number, and pulse energy; Based on the usage of each phase shifter and optical waveguide delay line in the preset number of adjustment units, the second sub-pulse is adjusted using the preset number of adjustment units.

5. The on-chip laser multi-pulse modulation method according to claim 3, characterized in that, The step of sequentially outputting a sequence of sub-pulses generated by a preset number of the adjustment units specifically includes: Obtain a set quantity and determine whether the set quantity is 1; When the set quantity is 1, the target second sub-pulse generated by the preset number of the adjustment units will be output; When the set quantity is not 1, the preset number of sub-pulse sequences generated by the adjustment unit with the preset number of sub-pulse sequences are output sequentially.

6. The on-chip laser multi-pulse modulation method according to claim 5, characterized in that, When the set quantity is 1, the target second sub-pulse generated by the preset quantity of the adjustment unit is output, specifically including: When the set quantity is 1, after passing through a preset number of adjustment units, the target second sub-pulse is input to the main beam combiner, wherein the preset number of adjustment units do not adjust the second sub-pulse; The pulsed laser output from the beam combiner is coupled into the optical fiber to complete the output.

7. The on-chip laser multi-pulse modulation method according to claim 5, characterized in that, When the set quantity is not 1, the preset quantity of sub-pulse sequences generated by the adjustment units, each having a preset quantity, are output sequentially, specifically including: When the set quantity is not 1, the set number of sub-pulse sequences generated by the preset number of adjustment units are sequentially input into the main combiner; The output of the combiner, which outputs a set number of sub-pulse sequences, is coupled into the optical fiber to complete the output.

8. An on-chip laser multi-pulse modulation system, characterized in that, The on-chip laser multi-pulse modulation system includes: The input module is used to input the pulsed laser output from the pulsed laser into the optical chip via optical coupling. The beam splitting module is used to split the pulsed laser based on the main beam splitter in the optical chip to obtain a first sub-pulse and a second sub-pulse, and output the first sub-pulse. The adjustment output module is used to input the second sub-pulse through one connecting waveguide to a preset number of adjustment units for adjustment, and to output the sub-pulse sequence with a set number generated by the preset number of adjustment units in sequence; The preset number of adjustment units includes a secondary beam splitter, a connecting waveguide, a phase shifter, and an optical waveguide delay line. These units are used to activate the phase shifter and optical waveguide delay line in the corresponding adjustment unit according to the sub-pulse interval and the energy requirements of each sub-pulse, thereby performing phase modulation and pulse interval control on the pulsed laser. In each adjustment unit, the input port of the first-stage beam splitter is connected to the previous adjustment unit, and the output port of the first-stage beam splitter is connected to two connecting waveguides respectively, with one phase shifter connected to one of the connecting waveguides. The other ends of the two connecting waveguides are connected to the input port of the second-stage beam splitter, and the output port of the second-stage beam splitter is connected to one connecting waveguide and one optical waveguide delay line respectively. In the last adjustment unit, the corresponding secondary beam splitter is replaced by a secondary beam combiner, and the output port of the secondary beam combiner is connected to only one connecting waveguide and then connected to the main beam combiner.

Images