Manufacturing method of enameled copper wire

Abstract

The invention provides a method for manufacturing an enameled copper wire, which can inhibit generation of abnormal appearance parts. A method for manufacturing an enameled copper wire in which a copper wire drawing material is manufactured by continuously cold-drawing a copper wire using a wire drawing die, and an enameled coating is applied to the surface of the copper wire drawing material and sintered. The copper powder adhering to the surface of the copper wire and / or the copper wire drawing material is removed using a fabric wiping cloth using cut microfibers. Further, for example, a wire drawing lubricant is sprayed onto the surface of the copper wire. For example, the copper powder adhering to the surface of the copper wire drawing material is removed using a felt.

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing enameled copper wire. Background Technology

[0002] Enameled copper wire consists of a conductor and an enameled coating. The conductor is primarily composed of copper. The enameled coating covers the surface of the conductor. In the manufacturing process of enameled copper wire, an enameling coating is applied to the surface of the conductor to form a coating film. Then, through sintering, the enameled coating is formed.

[0003] As for enameled copper wire, there is a flat enameled copper wire described in Patent Document 1. The conductor of the flat enameled copper wire is a flat copper wire drawing material. The flat copper wire drawing material is a conductor with a flat cross-section. The flat copper wire drawing material is manufactured by continuously cold drawing flat copper wire using a flat wire drawing die.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 10-43704 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Copper powder is generated during the manufacturing of flat enameled copper wire. This copper powder is then pressed onto the flat copper wire. The pressed copper powder is then peeled off from the flat copper wire drawing material using drawing dies, coating dies, and winches. When the enameled coating is applied to the surface of the flat copper wire drawing material, foaming occurs, starting from the areas where copper powder has been peeled off or pressed onto the surface. These foamed areas become areas with appearance defects (hereinafter referred to as appearance defect sections).

[0009] In the technology described in Patent Document 1, copper powder adhering to the flat copper wire is removed by passing the flat copper wire between two rollers with a felt outermost layer. However, in the technology described in Patent Document 1, it is difficult to sufficiently remove the copper powder adhering to the flat copper wire and suppress the generation of appearance abnormalities.

[0010] In one aspect of this disclosure, a method for manufacturing enameled copper wire that can suppress the generation of appearance defects is preferably provided.

[0011] Methods for solving problems

[0012] One aspect of this disclosure is a method for manufacturing enameled copper wire, which involves continuously cold-drawing copper wire using a drawing die to produce a copper wire drawing material, coating the surface of the copper wire drawing material with an enameled coating, and then sintering it. During the manufacturing of the enameled copper wire, a fabric wiping cloth made of cut microfibers is used to remove copper powder adhering to the surface of at least one of the copper wire and the copper wire drawing material.

[0013] According to the method for manufacturing enameled copper wire, which is an aspect of this disclosure, it is possible to suppress the generation of appearance abnormalities in enameled copper wire. Attached Figure Description

[0014] Figure 1 This is an explanatory diagram showing the structure of a manufacturing apparatus for flat enameled copper wire.

[0015] Figure 2 It is a cross-sectional view showing the cross-sectional shape of a flat copper wire.

[0016] Figure 3 It is a cross-sectional view showing the cross-sectional shape of flat copper wire drawing material.

[0017] Figure 4 This is an explanatory diagram showing the processing performed around the periphery of a flat wire drawing machine.

[0018] Figure 5 This is an explanatory diagram showing the structure of the first copper powder removal section as viewed from the upstream direction.

[0019] Figure 6 This is an explanatory diagram showing the structure of the second copper powder removal section as viewed from the upstream direction.

[0020] Figure 7 This is an explanatory diagram showing the structure of the third copper powder removal section as viewed from the upstream direction.

[0021] In Figure 8, Figure 8A This involves attaching wool felt to manufacture flat enameled copper wires, replacing the upper, lower, right, and left fabric sections, and then taking electron microscope images of the copper powder adhering to the wool felt. Figure 8B After manufacturing a flat enameled copper wire using the method described in the first embodiment, electron microscope images of the copper powder attached to the surfaces of the upper fabric portion, lower fabric portion, right fabric portion, and left fabric portion are taken.

[0022] Explanation of reference numerals in the attached figures

[0023] 1… Manufacturing equipment, 3… Flywheel or winding tube, 5… Round wire drawing machine, 7… Flat rolling mill, 9… Annealing furnace, 11… Flat wire drawing machine, 13… Annealing furnace, 15… Coating machine, 17… Sintering furnace, 19… Winding machine, 22A, 22B… Short side, 23… Conductor, 23A… Flat copper wire, 23B… Flat copper wire drawing material, 24A, 24B… Edge, 25… Flat enameled copper wire, 26A, 26B …End face, 30…Flat wire drawing die, 31…First copper powder removal section, 33…Second copper powder removal section, 41…Upper substrate, 43…Lower substrate, 45…Upper fabric section, 47…Lower fabric section, 51…Right substrate, 53…Left substrate, 55…Right fabric section, 57…Left fabric section, 61…Spray nozzle, 63…Cover box, 71…Third copper powder removal section, 73…Dust collection box, 75…Slit. Detailed Implementation

[0024] The exemplary embodiments of this disclosure will be described with reference to the accompanying drawings.

[0025] <First Implementation Method>

[0026] 1. An overview of the manufacturing method for flat enameled copper wire

[0027] based on Figures 1-3 This section provides a general overview of the manufacturing method for flat enameled copper wire. Flat enameled copper wire corresponds to enameled copper wire. The manufacturing method for flat enameled copper wire uses... Figure 1 The apparatus 1 shown is for manufacturing flat enameled copper wire. The apparatus 1 for manufacturing flat enameled copper wire includes a flywheel or winding tube 3, a round wire drawing machine 5, a flat rolling mill 7, an annealing furnace 9, a flat wire drawing machine 11, an annealing furnace 13, a coating machine 15, a sintering furnace 17, and a winding machine 19.

[0028] A wire-shaped conductor 23 is wound on a flywheel or winding tube 3. The conductor 23 is led out from the flywheel or winding tube 3 and travels along a path that passes sequentially through a circular wire drawing machine 5, a flat rolling mill 7, an annealing furnace 9, a flat wire drawing machine 11, an annealing furnace 13, a coating machine 15, and a sintering furnace 17, and is wound onto a winding machine 19. In addition, the processed conductor 23, namely the flat copper wire drawing material 23B described later, passes through the area including the coating machine 15 and the sintering furnace 17 multiple times.

[0029] The conductor 23 is made of copper or a copper alloy. The cross-sectional shape of the conductor 23 is circular before the flat rolling process described later. It should be noted that the cross-section of the conductor 23 refers to the section orthogonal to the length direction of the conductor 23.

[0030] The circular wire drawing machine 5 draws the conductor 23, which has a circular cross-sectional shape, into wires. The flat rolling machine 7 flattens the traveling conductor 23. The flattened conductor 23 is designated as flat copper wire 23A. Figure 2 As shown, the cross-sectional shape of the flat copper wire 23A is formed by two parallel sides 24A and 24B and two arc-shaped end faces 26A and 26B. In the cross-section, sides 24A and 24B are straight lines. The lengths of sides 24A and 24B in the cross-section are greater than the lengths of end faces 26A and 26B. The flat copper wire 23A is annealed in the annealing furnace 9.

[0031] The flat wire drawing machine 11 performs flat wire drawing on the traveling flat copper wire 23A. Flat wire drawing is a process in which the flat copper wire 23A is continuously cold-drawn using the flat wire drawing die 30, which will be described later. The flat-drawn conductor 23 is used as the flat copper wire drawing material 23B. The configuration of the flat wire drawing machine 11 will be described later.

[0032] The cross-sectional shape of flat copper wire drawing material 23B is as follows: Figure 3 As shown, this is a rounded rectangle. The longer sides of the rounded rectangle are sides 24A and 24B. The shorter sides 22A and 22B of the rounded rectangle are derived from the end faces 26A and 26B in the flat copper wire 23A.

[0033] like Figure 1 As shown, in the flat wire drawing machine 11, the direction of travel of the conductor 23 is designated as the travel direction TR. The opposite direction of the travel direction TR is designated as the upstream direction US. The annealing furnace 13 anneals the flat copper wire drawing material 23B. The coating machine 15 forms a coating film of a specified thickness on the surface of the flat copper wire drawing material 23B by applying an enameled coating to the surface of the flat copper wire drawing material 23B.

[0034] The sintering furnace 17 heats and sinters the flat copper wire drawing material 23B, which is being coated with a paint coating of a specified thickness using the paint coating machine 15, to form a film. For example... Figure 1 As shown, the process of applying enameled coating using a coating machine 15 and forming a film using a sintering furnace 17 is repeated. The result is the production of flat enameled copper wire 25 with a specified film thickness. The flat enameled copper wire 25 is then wound onto a winding machine 19.

[0035] The method for forming the coating is as follows: An enameled coating is applied to the surface of the flat copper wire drawing material 23B. The enameled coating is, for example, a coating containing resin and solvent. Next, the solvent in the enameled coating applied to the surface of the flat copper wire drawing material 23B is evaporated, and the resin in the enameled coating is cured. After the solvent evaporates and the resin cures, a flat enameled copper wire 25 is formed.

[0036] 2. Treatment performed around the flat wire drawing machine 11

[0037] based on Figures 4-7 This describes the processing performed around the periphery of the flat wire drawing machine 11. For example... Figure 4 As shown, the flat enameled copper wire manufacturing apparatus 1 includes a first copper powder removal section 31 and a second copper powder removal section 33 between the annealing furnace 9 and the flat wire drawing machine 11. The first copper powder removal section 31 is located upstream in the direction US compared to the second copper powder removal section 33.

[0038] like Figure 5 As shown, the first copper powder removal unit 31 includes an upper substrate 41, a lower substrate 43, an upper feeding section 45, and a lower feeding section 47. The upper substrate 41 and the lower substrate 43 are both plate-shaped components with horizontal main surfaces. The upper substrate 41 and the lower substrate 43 are each made of a material with high rigidity, such as metal. The upper substrate 41 is located above the lower substrate 43.

[0039] The upper fabric portion 45 and the lower fabric portion 47 are both plate-shaped components with horizontal main surfaces. The upper fabric portion 45 is fixed to the lower surface of the upper substrate 41. The lower fabric portion 47 is fixed to the upper surface of the lower substrate 43. The upper fabric portion 45 and the lower fabric portion 47 are opposite each other in the vertical direction.

[0040] The upper fabric portion 45 has a core material made of felt and a covering material covering its periphery. Therefore, the surface of the upper fabric portion 45 is made of the covering material. The covering material is made of a fabric wiping cloth using cut microfibers. The lower fabric portion 47 also has the same structure as the upper fabric portion 45.

[0041] The traveling flat copper wire 23A passes between the upper fabric section 45 and the lower fabric section 47. At this time, edge 24A of the flat copper wire 23A contacts the upper fabric section 45. In addition, edge 24B of the flat copper wire 23A contacts the lower fabric section 47.

[0042] The surfaces of the upper fabric portion 45 and the lower fabric portion 47 are made of a fabric wiping cloth using cut microfibers, so that the edges 24A and 24B of the traveling flat copper wire 23A come into contact with the fabric wiping cloth using cut microfibers. The fabric wiping cloth using cut microfibers removes copper powder adhering to the edges 24A and 24B of the flat copper wire 23A.

[0043] For example, the first copper powder removal unit 31 can be moved intermittently in the right direction R or the left direction L. The right direction R is the right direction when viewed from the upstream direction US. The left direction L is the left direction when viewed from the upstream direction US. The right direction R and the left direction L are directions orthogonal to the length direction of the flat copper wire 23A. Orthogonal is a form of intersection.

[0044] Since the flat copper wire 23A does not move to the right (R) or left (L) direction in the first copper powder removal section 31, when the first copper powder removal section 31 is moved to the right (R) or left (L) direction, the first copper powder removal section 31 moves relative to the flat copper wire 23A to the right (R) or left (L) direction. Intermittent movement means, for example, alternately repeating the time periods during which the first copper powder removal section 31 does not move to the right (R) or left (L) direction and the time periods during which it moves to the right (R) or left (L) direction.

[0045] When the first copper powder removal section 31 is moved intermittently to the right (R) or left (L), portions of the surfaces of the upper and lower cloth sections 45 that have not yet come into contact with the flat copper wire 23A can come into contact with the flat copper wire 23A for the first time. As a result, the removal of copper powder adhering to the edges 24A and 24B of the flat copper wire 23A is more effective.

[0046] Furthermore, by intermittently moving the first copper powder removal section 31 to the right (R) or left (L), portions of the surfaces of the upper and lower cloth sections 45 that have already contacted the flat copper wire 23A can be prevented from subsequently contacting the flat copper wire 23A. As a result, damage to the flat copper wire 23A from copper powder captured by the upper and lower cloth sections 45 can be suppressed.

[0047] like Figure 6 As shown, the second copper powder removal unit 33 includes a right substrate 51, a left substrate 53, a right feeding section 55, and a left feeding section 57. The right substrate 51 and the left substrate 53 are plate-shaped components with vertical main surfaces that are parallel to the upstream direction US. The right substrate 51 and the left substrate 53 are each made of a highly rigid material such as metal. When viewed from the upstream direction US, the right substrate 51 is located further to the right (R) than the left substrate 53.

[0048] The right-side fabric portion 55 and the left-side fabric portion 57 are plate-shaped components with vertical main surfaces that are parallel to the upstream direction US. The right-side fabric portion 55 is fixed to the left-side L-shaped surface of the right-side substrate 51. The left-side fabric portion 57 is fixed to the right-side R-shaped surface of the left-side substrate 53. The right-side fabric portion 55 and the left-side fabric portion 57 are opposite each other in the right-side R and left-side L directions.

[0049] The right-side fabric section 55 and the left-side fabric section 57 have the same configuration as the upper-side fabric section 45 and the lower-side fabric section 47. The traveling flat copper wire 23A passes between the right-side fabric section 55 and the left-side fabric section 57. At this time, the end face 26B of the flat copper wire 23A contacts the right-side fabric section 55. Additionally, the end face 26A of the flat copper wire 23A contacts the left-side fabric section 57.

[0050] The surfaces of the right-side fabric portion 55 and the left-side fabric portion 57 are made of a fabric wiping cloth using cut microfibers, so the end faces 26A and 26B of the traveling flat copper wire 23A come into contact with the fabric wiping cloth using cut microfibers. The fabric wiping cloth using cut microfibers removes copper powder adhering to the end faces 26A and 26B of the flat copper wire 23A.

[0051] For example, the second copper powder removal section 33 can be moved intermittently in the vertical direction. The vertical direction is a direction orthogonal to the length direction of the flat copper wire 23A. Orthogonal is a form of intersection. Since the flat copper wire 23A does not move in the vertical direction within the second copper powder removal section 33, when the second copper powder removal section 33 is moved in the vertical direction, the second copper powder removal section 33 moves relative to the flat copper wire 23A in the vertical direction. Intermittent movement means, for example, alternating between time periods when the second copper powder removal section 33 does not move in the vertical direction and time periods when it moves in the vertical direction.

[0052] When the second copper powder removal unit 33 is moved intermittently in the vertical direction, portions of the surfaces of the right-side cloth section 55 and the left-side cloth section 57 that have not yet come into contact with the flat copper wire 23A can come into contact with the flat copper wire 23A for the first time. As a result, the removal efficiency of copper powder adhering to the end faces 26A and 26B of the flat copper wire 23A is improved.

[0053] Furthermore, by intermittently moving the second copper powder removal section 33 in the vertical direction, portions of the surfaces of the right-side cloth section 55 and the left-side cloth section 57 that have already come into contact with the flat copper wire 23A can be prevented from subsequently coming into contact with the flat copper wire 23A. As a result, damage to the flat copper wire 23A caused by copper powder captured by the right-side cloth section 55 and the left-side cloth section 57 can be suppressed.

[0054] like Figure 4 As shown, the flat wire drawing machine 11 includes a flat wire drawing die 30, a spray nozzle 61, and a cover box 63. The flat wire drawing die 30 is used to continuously perform cold drawing on flat copper wire 23A. The spray nozzle 61 sprays wire drawing lubricant onto the surface of the flat copper wire 23A at a position US upstream of the flat wire drawing die 30. The cover box 63 is a hollow, box-shaped component. The cover box 63 houses the flat wire drawing die 30 and the spray nozzle 61. The cover box 63 prevents the wire drawing lubricant sprayed from the spray nozzle 61 from spreading outwards.

[0055] like Figure 4 As shown, the flat enameled copper wire manufacturing apparatus 1 includes a third copper powder removal unit 71 and a dust collection box 73 between the flat wire drawing machine 11 and the annealing furnace 13. Figure 7As shown, the third copper powder removal section 71 is a plate-shaped component made of felt. The main surface of the third copper powder removal section 71 is orthogonal to the upstream direction US. A slit 75 is formed in the third copper powder removal section 71, extending from its end towards the vicinity of the center. The slit 75 penetrates the third copper powder removal section 71 in its thickness direction.

[0056] The traveling flat copper wire material 23B passes through the inner part of the slit 75. The traveling flat copper wire material 23B comes into contact with the portion of the third copper powder removal unit 71 facing the slit 75. Therefore, the third copper powder removal unit 71 removes the copper powder adhering to the surface of the flat copper wire material 23B.

[0057] The dust collection box 73 is located further along the travel direction TR than the third copper powder removal section 71. The traveling flat copper wire drawing material 23B passes through the dust collection box 73. Air inside the dust collection box 73 is drawn in. Therefore, the dust collection box 73 is able to remove copper powder adhering to the surface of the flat copper wire drawing material 23B.

[0058] The mechanism comprising the flat wire drawing machine 11, the third copper powder removal unit 71, and the dust collection box 73 is designated as the flat wire drawing mechanism. In this embodiment, an example of a single flat wire drawing mechanism is shown, but two such flat wire drawing mechanisms may also be arranged in series.

[0059] 3. The effect of the manufacturing method of flat enameled copper wire

[0060] (1A) In the manufacturing method of the flat enameled copper wire disclosed herein, copper powder adhering to the surface of the flat copper wire 23A is removed using an upper cloth portion 45 and a lower cloth portion 47, the surfaces of which are covered by a fabric wiping cloth made of cut microfibers. The fabric wiping cloth made of cut microfibers has a fine fiber diameter and dense fibers. Therefore, the fabric wiping cloth made of cut microfibers is highly effective at removing fine copper powder. As a result, it is possible to suppress the generation of appearance abnormalities in the manufactured flat enameled copper wire 25.

[0061] (1B) In the method for manufacturing flat enameled copper wire disclosed herein, a drawing lubricant is sprayed onto the surface of the flat copper wire 23A. Therefore, copper powder adhering to the surface of the flat copper wire 23A can be further removed. As a result, it is possible to further suppress the generation of appearance abnormalities in the manufactured flat enameled copper wire 25.

[0062] (1C) In the method for manufacturing flat enameled copper wire disclosed herein, a third copper powder removal section 71 made of felt is used to remove copper powder adhering to the surface of the flat copper wire drawing material 23B. Therefore, it is possible to further suppress the generation of appearance abnormalities in the manufactured flat enameled copper wire 25.

[0063] (1D) In ​​the manufacturing method of the flat enameled copper wire disclosed herein, the upper fabric portion 45 and the lower fabric portion 47, whose surfaces are covered by a fabric wiping cloth made of cut microfibers, can be moved intermittently in a direction intersecting the length direction of the flat copper wire 23A. Therefore, the effect of removing copper powder adhering to the surface of the flat copper wire 23A is higher. In addition, damage to the flat copper wire 23A by copper powder captured by the upper fabric portion 45 and the lower fabric portion 47 can be suppressed.

[0064] Furthermore, in the manufacturing method of the flat enameled copper wire disclosed herein, the right-side cloth portion 55 and the left-side cloth portion 57, whose surfaces are covered by a fabric wiping cloth made of cut microfibers, can be moved intermittently in a direction intersecting the length direction of the flat copper wire 23A. Therefore, the effect of removing copper powder adhering to the surface of the flat copper wire 23A is improved. In addition, damage to the flat copper wire 23A by copper powder captured by the right-side cloth portion 55 and the left-side cloth portion 57 can be suppressed.

[0065] <Example>

[0066] 1. Implementation of the manufacturing method for flat enameled copper wire

[0067] A flat enameled copper wire 25 was manufactured using the method described in the first embodiment. The fabric wiping cloth, which uses cut microfibers and constitutes the surfaces of the upper fabric portion 45, lower fabric portion 47, right fabric portion 55, and left fabric portion 57, is a TechnoWiper CRN500 manufactured by MIRAI KOSEN Co., Ltd. The TechnoWiper CRN500 is composed of polyester and nylon fibers. The fiber diameter of the TechnoWiper CRN500 is approximately 5 μm.

[0068] 2. Evaluation of copper powder removal

[0069] After manufacturing the flat enameled copper wire 25, copper powder (i.e., copper powder removed from the surface of the flat copper wire 23A) attached to the surfaces of the upper fabric portion 45, lower fabric portion 47, right fabric portion 55, and left fabric portion 57 is transferred to a carbon ribbon. The surface of the transferred carbon ribbon is photographed using an electron microscope. The photographs are shown below. Figure 8B .

[0070] As a comparative example, the upper fabric portion 45, lower fabric portion 47, right fabric portion 55, and left fabric portion 57 were replaced with wool felt, while flat enameled copper wire 25 was manufactured under the same conditions. After manufacturing the flat enameled copper wire 25, the copper powder adhering to the surface of the wool felt was transferred to a carbon ribbon. The surface of the transferred carbon ribbon was photographed using an electron microscope. The photographs are shown below. Figure 8A .

[0071] like Figure 8BAs shown, when using the upper feeding section 45, the lower feeding section 47, the right feeding section 55, and the left feeding section 57, a large amount of fine copper powder with a size of about 10 μm or larger can be removed from the surface of the flat copper wire 23A. Figure 8A As shown, when using felt, only large copper particles with a size of approximately 50 μm or larger can be removed from the surface of the flat copper wire 23A. Furthermore, only a small amount of copper powder can be removed.

[0072] <Other Implementation Methods>

[0073] The embodiments of this disclosure have been described above, but this disclosure is not limited to the above embodiments and can be implemented in various ways.

[0074] (1) In the method for manufacturing enameled copper wire disclosed herein, enameled copper wire other than flat enameled copper wire can be manufactured. The conductor through which copper powder is removed by the first copper powder removal section 31, the second copper powder removal section 33 and the third copper powder removal section 71 may not be a flat conductor, for example, it may be a round conductor.

[0075] (2) Alternatively, the first copper powder removal section 31 and the second copper powder removal section 33 may be positioned, for example, closer to the travel direction TR side than the flat wire drawing die 30. In this case, copper powder can be removed from the surface of the flat copper wire drawing material 23B using the first copper powder removal section 31 and the second copper powder removal section 33.

[0076] Alternatively, the first copper powder removal section 31 and the second copper powder removal section 33 can be positioned, for example, at the position in the first embodiment and at a position further along the travel direction TR than the flat wire drawing die 30. In this case, copper powder can be removed from the surface of the flat copper wire 23A and from the surface of the flat copper wire drawing material 23B.

[0077] (3) Multiple constituent elements may share the functions of one constituent element in each of the above embodiments, or one constituent element may perform the functions of multiple constituent elements. Additionally, a portion of the configuration in each of the above embodiments may be omitted. Furthermore, at least a portion of the configuration in each of the above embodiments may be added to, substituted for, or otherwise made relative to the configuration in other of the above embodiments.

[0078] (4) In addition to the above-mentioned method for manufacturing flat enameled copper wire, this disclosure can also be realized by various means such as a flat enameled copper wire manufacturing apparatus and flat enameled copper wire.

[0079] [The technical concepts disclosed in this specification]

[0080] [Project 1]

[0081] A method for manufacturing enameled copper wire involves continuously cold-drawing copper wire using a drawing die to produce copper wire drawing material, coating the surface of the copper wire drawing material with an enameled coating and sintering it; in the aforementioned manufacturing method, a fabric wiping cloth using cut microfibers is used to remove copper powder adhering to the surface of at least one of the aforementioned copper wire and the aforementioned copper wire drawing material.

[0082] [Project 2]

[0083] According to the manufacturing method of enameled copper wire described in Project 1, a wire drawing lubricant is sprayed onto the surface of the aforementioned copper wire.

[0084] [Project 3]

[0085] According to the manufacturing method of enameled copper wire described in Project 1 or 2, a felt is further used to remove copper powder adhering to the surface of the aforementioned copper wire drawing material.

[0086] [Project 4]

[0087] The method for manufacturing enameled copper wire according to any one of items 1 to 3, wherein the aforementioned fabric wiping cloth using cut microfibers is moved intermittently in a direction intersecting the length direction of the aforementioned copper wire and the aforementioned copper wire drawing material.

[0088] [Project 5]

[0089] The method for manufacturing enameled copper wire according to any one of items 1 to 4, wherein the aforementioned copper wire is a flat copper wire, the aforementioned drawing die is a flat drawing die, the aforementioned copper drawing material is a flat copper drawing material, and the aforementioned enameled copper wire is a flat enameled copper wire.

Claims

1. A method for manufacturing enameled copper wire, comprising producing copper wire drawing material by continuously cold drawing copper wire using a drawing die, coating the surface of the copper wire drawing material with an enameled coating and then sintering it. In the manufacturing method, a fabric wiping cloth using cut microfibers is used to remove copper powder adhering to the surface of at least one of the copper wire and the copper wire drawing material.

2. The method for manufacturing enameled copper wire according to claim 1, wherein, Spray drawing lubricant onto the surface of the copper wire.

3. The method for manufacturing enameled copper wire according to claim 1 or 2, wherein, Further use of felt to remove copper powder adhering to the surface of the copper wire drawing material.

4. The method for manufacturing enameled copper wire according to claim 1 or 2, wherein, The fabric wiping cloth using cut microfibers is moved intermittently in a direction that intersects the length direction of the copper wire and the copper wire material.

5. The method for manufacturing enameled copper wire according to claim 1 or 2, wherein, The copper wire is a flat copper wire, the wire drawing die is a flat wire drawing die, the copper wire drawing material is a flat copper wire drawing material, and the enameled copper wire is a flat enameled copper wire.

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