Electronic device comprising at least one thermoelectric module and corresponding electronic system

Abstract

The invention relates to an electronic device comprising a support member (2) and at least one component (3) with which at least one thermoelectric module (7) is associated, the module being shaped as a block comprising two main heat exchange faces, the module being at least partially integrated into the support member, the first of the two main faces is in direct contact with at least one of the faces of the component, or is in contact with at least one of the faces of the component via at least one link (10) made of at least a thermally conductive material. The invention also relates to a corresponding electronic system.

Description

Technical Field

[0001] The present invention relates to an electronic device including at least one thermoelectric module.

[0002] The present invention also relates to a system including such a device. Background Technology

[0003] Climate change is a major concern for many legislative and regulatory bodies around the world. Indeed, countries have already implemented, are implementing, or will implement a wide variety of carbon emission control measures. Specifically, an ambitious standard applies both to new aircraft and to existing aircraft that require technological solutions to comply with current regulations. For several years, civil aviation has been contributing to addressing climate change.

[0004] Technological research has significantly improved the environmental performance of aircraft. Applicants must consider the influencing factors at each stage of design and development to obtain more energy-efficient and environmentally friendly aviation components and products whose integration and use in civil aviation have moderate environmental consequences, thereby improving the energy efficiency of aircraft.

[0005] Therefore, the applicant has been working to reduce its negative impact on the climate and minimize greenhouse gas emissions by using benign methods and manufacturing processes, thereby reducing the environmental footprint of its activities.

[0006] This ongoing research and development involves next-generation aircraft engines, particularly reducing aircraft weight through the materials used and lighter onboard equipment, developing electrical technologies to ensure propulsion, and aviation biofuels, which are crucial in addition to technological advancements.

[0007] However, aircraft, electronic devices, and systems often generate heat, which typically requires them to be associated with large, energy-intensive cooling systems, such as fans or air conditioners. Summary of the Invention

[0008] The purpose of this invention is to propose a more environmentally friendly electronic device.

[0009] The object of this invention is to provide an electronic system including such a device.

[0010] Therefore, an electronic device is provided that includes at least one support member and at least one component.

[0011] According to the invention, the device includes at least one module associated with the component, shaped as a block comprising two main heat exchange faces, the module being at least partially integrated into a support member such that the first of its two main faces is in direct contact with at least one of the faces of the component, or in contact via at least one connector made of at least a thermally conductive material, wherein the component includes a first face associated with a thermoelectric module and a second face associated with a second thermoelectric module or a second support member, such that the components formed by the component, the thermoelectric module, and the second thermoelectric module or the second support member are stacked.

[0012] Therefore, by integrating the thermoelectric module into the support structure itself, it is easier to ensure heat exchange with the component.

[0013] Considering that the heat exchange between the components and the thermoelectric module is localized, they are more efficient and faster.

[0014] Therefore, this invention is more environmentally friendly.

[0015] Furthermore, premature aging of related components (if no module exists, for example, due to its heating) is limited. Over time, this improves the performance of electronic devices.

[0016] Therefore, this invention is the result of technical research aimed at significantly improving aircraft performance, and in this sense, it helps to reduce the environmental impact of aircraft.

[0017] For the purposes of this application, it must be noted that the "thermoelectric module" is a module used to realize the Peltier effect: when the module is energized, it generates a temperature difference, making one of its main surfaces hot and the other cold. Conversely, such a module can also realize the Seebeck effect: when a temperature gradient is applied to the module, it generates an electric current. Therefore, the thermoelectric module includes one or more thermoelectric materials capable of realizing both of the above effects.

[0018] For the purposes of this application, the term "direct contact" between component A and component B is understood to mean that component A touches component B without the intermediate macropart C. Of course, when component A and component B are in direct contact, a possible layer of attachment material (e.g., a sintered material layer, particularly silver or copper sintered, or a crosslinked material layer, such as a thermally conductive adhesive, or a brazing material layer) may be present between component A and component B to attach the components together. This layer is clearly dissimilar to the intermediate macropart C.

[0019] The term "component A associated with component B" is understood to mean that component A is in direct or indirect contact with component B. When component A is a thermoelectric module and is "associated" with component B, it can therefore be understood that component A is in direct or indirect contact with component B to allow for heat exchange between the two components.

[0020] Alternatively, the module may be entirely housed within the supporting structure.

[0021] Optionally, the device includes a thermal regulation device associated with the module.

[0022] Optionally, the thermal regulation device is at least partially arranged inside the support member.

[0023] Optionally, the module is in direct contact with at least one component of the thermal regulation device.

[0024] Optionally, the heat regulation device includes a discharge element made of a thermally conductive material.

[0025] Optionally, the thermal conditioning device includes a thermal reference interface, to which the module is in direct contact or via a connector made of a thermally conductive material.

[0026] Optionally, the component is a first component, and the device is configured to allow temperature regulation of a group including the first component and at least one second component.

[0027] Optionally, the module is a first module (7) associated with the first component, and the device includes a second module (17) associated with the second component.

[0028] Optionally, the support member is a first support member (2), and at least one component is supported by a second support member (22) of the electronic device.

[0029] Optionally, the device includes a third support member that carries the second module.

[0030] Optionally, the first module, the first component, the second component, and the second module are stacked to form a stack.

[0031] Optionally, the first module implements the Peltier effect, while the second module implements the Seebeck effect.

[0032] Optionally, the module is a first module, and the device includes a second module associated with another face of the component, the first module, the component, and the second module being stacked to form a stack.

[0033] Alternatively, the device is a power module.

[0034] The present invention also relates to an electronic system including the above-described devices, wherein the electronic system is an aircraft electronic system.

[0035] Other features and advantages of the invention will become apparent when reading the following description of specific, non-limiting embodiments of the invention. Attached Figure Description

[0036] Please refer to the attached diagram, in which:

[0037] [ Figure 1 ] Figure 1 This is a cross-sectional view of an electronic device according to a first embodiment of the present invention;

[0038] [ Figure 2 ] Figure 2 This includes a cross-sectional view of an electronic device according to a second embodiment of the present invention, and a cross-sectional view relating to a magnified close-up of a portion of the device;

[0039] [ Figure 3 ] Figure 3 This is a cross-sectional view of an electronic device according to a third embodiment of the present invention;

[0040] [ Figure 4 ] Figure 4 This is a cross-sectional view of an electronic device according to a fourth embodiment of the present invention;

[0041] [ Figure 5 ] Figure 5 This is a cross-sectional view of an electronic device according to a fifth embodiment of the present invention;

[0042] [ Figure 6 ] Figure 6 This is a cross-sectional view of an electronic device according to a sixth embodiment of the present invention;

[0043] [ Figure 7 ] Figure 7 Includes a cross-sectional view of an electronic device according to a seventh embodiment of the present invention, and a cross-sectional view relating to a magnified close-up of a portion of the device;

[0044] [ Figure 8 ] Figure 8 This is a cross-sectional view of an electronic device according to the eighth embodiment of the present invention;

[0045] [ Figure 9 ] Figure 9 This is a cross-sectional view of an electronic device according to the ninth embodiment of the present invention. Detailed Implementation

[0046] Figure 1 An electronic device 1 according to a first embodiment is shown, the device including a support member 2. In this example, the support member 2 carries at least one component 3 on its upper surface 4. In this example, the component 3 has two main faces, a first face 5 facing outwards from the support member 2, and a second face 6 facing towards the support member 2. The component 3 is connected to the support member at its second face 6.

[0047] According to the present invention, component 3 is associated with thermoelectric module 7.

[0048] As described above, the thermoelectric module 7 can achieve the Peltier effect: when the thermoelectric module 7 is powered, it generates a temperature difference, thus creating hot and cold zones. By reversing the direction of the current flowing through the thermoelectric module 7, the effect of these zones is reversed, with the hot zone becoming the cold zone, and vice versa. To ensure optimal heat transfer to the outside, the thermoelectric module 7 is preferably configured to minimize heat loss at both the external interface / hot zone and the external interface / cold zone. Specifically, the thermoelectric module 7 is configured to minimize thermal resistance at both the external interface / hot zone and the external interface / cold zone. Optionally, component 3 is attached to the support member 2 via module 7. Typically, the second surface 6 of component 3 is attached to module 7, for example, by sintering (e.g., silver or copper-based sintering), crosslinking (e.g., thermally conductive adhesive), or brazing.

[0049] Module 7 is directly attached to support member 2 by sintering (e.g., silver or copper-based sintering), crosslinking (e.g., thermally conductive adhesive), or brazing. Preferably, the material to which component 3 is attached to support member 2 and / or the material to which module 7 is attached to support member 2 is electrically and / or thermally conductive.

[0050] In a manner known to all, support member 2 is shaped to conduct electric current. This is how component 3 can be powered. Therefore, different options are known.

[0051] Therefore, component 3 can be powered by support member 2 and / or module 7. This power supply to component 3 via support member 2 and / or module 7 is applicable to all other embodiments of this application.

[0052] For example, support member 2 is a printed circuit board: therefore, it includes an electrically insulating substrate having one or more tracks and / or one or more paths made of conductive material, allowing current to be conducted through support member 2 to component 3 and / or module 7.

[0053] In the first option, the support member 2 is shaped to supply power to component 3 on one hand (without any intervention from module 7) and to module 7 on the other. Therefore, the power supply of component 3 and module 7 by the support member 2 is independent.

[0054] According to the second option, the support member 2 is configured to power module 7, rather than directly power component 3. Module 7 then transfers current to component 3. For this purpose, the materials used to attach module 7 to support member 1 and to component 3 to module 7 are made of conductive materials, allowing component 3 to be powered by both support member 2 and module 7 (due to its thermoelectric properties, module 7 enables it to function as an electrical conductor between support member 2 and component 3; for example, via one or more conductive segments passing through it, module 7 can thus passively enable it to power component 3). Furthermore, the materials used to attach module 7 to support member 1 and to component 3 to module 7 are made of conductive materials and are also thermally conductive.

[0055] Using this material allows for limiting the resistance at the interface between the hot and cold zones of module 7 and the outside, thereby optimizing heat exchange with the outside. The goal for this is to make the material's resistance less than or equal to 1 milliohm.

[0056] In the third option, the support member 2 is configured to supply power to component 3 but not to module 7. Component 3 then transfers current to module 7. For this purpose, the materials used to attach module 7 to the support member 1 and to attach component 3 to module 7 are made of conductive materials. Furthermore, the materials used to attach module 7 to the support member 1 and to attach component 3 to module 7 are made of conductive materials and are also thermally conductive.

[0057] Module 7 is shaped as a block and includes two main faces 8 and 9 for heat exchange with the outside. Module 7 is shaped such that the two faces 8 and 9 extend parallel to each other.

[0058] Due to its thermoelectric properties, when module 7 is powered on, a temperature difference will occur between its two main faces. Therefore, the module has a so-called "cold" face and a so-called "hot" face. According to the direction of current flow in module 7, the hot face (correspondingly, the cold face) is the first of the two main faces of the module (correspondingly, the second of the two main faces of the module).

[0059] Therefore, it is understandable that in order to benefit from the thermoelectric properties of module 7, module 7 must be powered in a specific direction of current flow depending on which face of module 7 needs to be "hot" and which face needs to be "cold" (the fact that it is used as an electrical conductor for component 3 is irrelevant to this dedicated power supply).

[0060] therefore, Figure 1 The electrical components that can actively power module 7 are schematically shown.

[0061] For other accompanying drawings, this electrical component is not necessarily shown to make the drawings easier to read. However, it should be understood that it does exist in the various embodiments described in this application and can be implemented for all embodiments. Module 7, supplied by support member 2 (directly or via additional elements, such as via component 3), is applicable to all other embodiments of this application, and therefore these explanations will not be repeated below.

[0062] In this example, module 7, which is associated with component 3, is therefore used to cool component 3.

[0063] Therefore, the surface 8 of module 7 that contacts the second surface 6 of component 3 is a cold surface. Optionally, this surface 8 is in direct contact with the second surface 6 of component 3.

[0064] Therefore, in this example, the current arrives via the support member 2, first reaching the face 6 of module 7. Then, the current flows through module 7 and out through the face 8 of module 7, powering component 3 before being discharged by the support member 2, thus forming a circuit.

[0065] Powering a thermoelectric module to heat one face while cooling the other is well known in the prior art and will not be described in more detail in this example.

[0066] To ensure that heat is dissipated outside the support member, the electronic device 1 includes a thermal conditioning device that contacts the heated face of the module (face 9 in this example).

[0067] Depending on the intended application, the thermal regulation device is or includes a bus (and such as a busbar) and / or a heat pipe and / or a cover and / or a shroud made of a thermally conductive material (and such as metal or graphene) and / or a heat dissipation element and / or any other type of radiator and / or heater.

[0068] In this example, the thermal regulation device includes a heat dissipation element 10. Optionally, the face 9 is in direct contact with the heat dissipation element 10. Typically, the face 9 is attached to the heat dissipation element 10 by sintering (e.g., silver or copper-based sintering), crosslinking (e.g., thermally conductive adhesive), or brazing.

[0069] The heat dissipation component 10 is made of a thermally conductive material, such as metals, such as copper, silver, aluminum, gold, palladium, nickel, etc.

[0070] In this example, the heat dissipation element 10 is shaped such that its thickness is much smaller than its other two dimensions. For example, the heat dissipation element 10 can be rod-shaped, plate-shaped, etc.

[0071] The heat dissipation member 10 extends, for example, inside the support member 2, so that it opens to the outside of the support member 2 at only one end. The heat dissipation member 10 extends linearly inside the support member 2, for example.

[0072] Preferably, the heat dissipation element 10 is sized to protrude on either side of the main face of the relevant module 7 (in this example, the main face 9) according to at least one dimension.

[0073] In one option, module 7 is only partially arranged within support member 2. For this purpose, support member 2 includes a housing 11 that is open at one end on the upper main surface 4 of support member 2. In this example, housing 11 has an opposite end open on heat dissipation member 10.

[0074] In this configuration, module 7 is arranged within housing 11 such that its top surface, i.e., surface 8, protrudes from the top main surface 4 of support member 2. On the other hand, its bottom surface, i.e., surface 9, is entirely disposed within support member 2. Typically, 30% to 95%, for example 50% to 90%, of module 7 is disposed within support member 2.

[0075] In the first embodiment described as such, component 3 is in direct contact with module 7, and module 7 itself is in direct contact with heat dissipation component 10 (through the attachment material layer as described above).

[0076] Therefore, at component 3, along the height of electronic device 1, there exists a series of the following layers (excluding the attachment material layer): component 3 / module 7 / heat dissipation component 10 / support member 2. According to a first variant of the first embodiment, component 3 may be arranged on the lower portion 12 of support member 2, rather than on its upper portion 4 (e.g., from...). Figure 3 (It can be seen that...)

[0077] If module 7 is attached to support member 1, it will preferably be attached via a material that is at least thermally conductive (and may also be conductive depending on how module 7 is powered).

[0078] According to a second variation of the first embodiment (optionally combined with the first variation described above), although in this example module 7 is associated with component 3 to cool the component, module 7 can also be associated with component 3 to heat the component. In this case, it is sufficient to modify the direction of current flow in the power supply of module 7 so that the surface 9 of the module is a cold surface and the surface 8 of the module is a hot surface.

[0079] Figure 2 An electronic device 1 according to a second embodiment is shown. The electronic device 1 includes a support member 2. The support member 2 is a printed circuit board, in this example, on which at least one component 3 is supported. In this case, the component 3 has two main faces, namely a first face 5 facing away from the support member 2 and a second face 6 facing the support member. The component 3 is connected to the support member 2 at its second face 6.

[0080] Component 3 is associated with thermoelectric module 7.

[0081] Optionally, component 3 is directly attached to support member 2. Typically, the second face 6 is directly attached to support member, for example, by sintering (e.g., by sintering based on silver, copper, etc.), by crosslinking (e.g., by thermally conductive adhesive), or by brazing.

[0082] Module 7 is shaped as a block and includes two main faces for heat exchange with the outside. Module 7 is shaped such that the two faces extend parallel to each other. As previously described, module 7 is electrically powered (e.g., via support member 2, and optionally via member 3), resulting in a temperature difference between its two main faces. Therefore, module 7 has a so-called "cold" face and a so-called "hot" face, with the hot face (correspondingly, the cold face) being the first of the two main faces of the module (correspondingly, the second of the two main faces of the module) depending on the direction of current flow in the module.

[0083] In this example, module 7 is associated with component 3 for cooling. Therefore, in this case, the face 8 that contacts the second face 6 of component 3 is the cold face.

[0084] Optionally, face 8 contacts the second face 6 of component 3 via at least one thermally conductive connector 13. Preferably, connector 13 is also conductive: thus, component 3 can be powered and thermally regulated via the same connector 13.

[0085] This simplifies electronic device 1.

[0086] Alternatively, at least two connectors 13 can connect component 3 to module 7, one being thermally conductive and the other electrically conductive.

[0087] For example, connector 13 is a track and / or path. For example, connector 13 is made of metal, such as copper, silver, aluminum, gold, palladium, nickel, etc.

[0088] Therefore, the connector 13 is in direct contact with the component 3 (in this case, the second main face 6 of the component 3) on the one hand, and with the module 7 (in this case, the face 8 of the module 7) on the other hand.

[0089] Preferably, face 8 contacts the second face 6 of component 3 via a number of connectors 13, in which case these connectors 13 thereby form a path "forest".

[0090] For example, the various connectors 13 are identical to each other.

[0091] For example, the different connectors 13 extend completely parallel to each other.

[0092] Various connectors 13 extend, for example, perpendicular to the second main face 6 of component 3 and the face 8 of module 7, while extending between these two faces 6 and 8.

[0093] To ensure that heat is dissipated outside the support member 2, the electronic device 1 includes a thermal adjustment device that comes into contact with the thermal surface of the module 7.

[0094] Depending on the intended application, the thermal conditioning device is or includes a bus (and, for example, a busbar) and / or a heat pipe and / or a cover and / or a shroud made of thermally conductive material and / or any other type of radiator and / or heater.

[0095] In this example, the thermal regulation device includes a heat dissipation element 10. Optionally, the face 9 is in direct contact with the heat dissipation element 10.

[0096] The heat dissipation component 10 is made of a thermally conductive material, such as metals, such as copper, silver, aluminum, gold, palladium, nickel, etc.

[0097] In this example, the heat dissipation element 10 is shaped such that its thickness is much smaller than its other two dimensions. For example, the heat dissipation element 10 can be rod-shaped, plate-shaped, etc.

[0098] The heat dissipation member 10 extends, for example, inside the support member 2, so that it opens to the outside of the support member 2 at only one end. The heat dissipation member 10 extends linearly inside the support member 2, for example.

[0099] Preferably, the heat dissipation element 10 is sized to protrude on either side of the main face of the relevant module 7 (in this example, the main face 9) according to at least one dimension.

[0100] In one option, module 7 is fully housed within support member 2. For this purpose, support member 2 includes a housing 11 that is not open at the upper main section 4 and lower main section 12 of the support member. In this example, one end of housing 11 is open to heat dissipation member 10, and the opposite end is open to second strip 15.

[0101] In the second embodiment described as such, component 3 is in direct contact with connector 13, connector 13 itself is in direct contact with module 7, and module 7 itself is in direct contact with heat dissipation component 10.

[0102] Therefore, at component 3, along the height of electronic device 1, there exists a series of the following layers (except for the attachment material layer): component 3 / connector 13 / module 7 / heat dissipation component 10 / support member 2.

[0103] According to a first variation of the second embodiment, component 3 may be arranged on the lower part 12 of the support member 2, rather than on its upper part 4.

[0104] According to a second variation of the second embodiment (optionally combined with the first variation described above), although in this case module 7 is associated with component 3 as a cooling component 3, module 7 can also be associated with component 3 for heating. In this case, it is sufficient to modify the direction of current flow in the power supply of module 7 so that the surface 9 of the module is a cold surface and the surface 8 of the module is a hot surface.

[0105] Naturally, the same support member can include several modules / component pairs. Therefore, Figure 3 A third embodiment is shown, wherein the first module pair 7a / component 3a according to the first embodiment and the second module pair 7b / component 3b according to the second embodiment are arranged on the same support member 2. Figure 3 In this case, one pair is associated with the upper part 4 of module 3 and the other pair is associated with its lower part 12, but of course, these two pairs can also be associated with the same part (upper part 4 or lower part 12) of the support member 2.

[0106] Furthermore, the same component can be associated with several modules, such that the component is in contact with at least two thermoelectric modules (directly and / or via connectors made of at least thermally conductive material). Therefore, Figure 4 A fourth embodiment is shown, in which the same component 3 is associated with the first module 7 and the second module 17. For example, the first module 7 / component 3 pair is the same as that described in the first embodiment (this is, of course, an option, and the first module 7 / component 3 pair could be, for example, that described in the second embodiment).

[0107] In this example, the second module 17 is the same as the first module 7.

[0108] Therefore, the second module 17 has two main faces, namely face 18 and face 19.

[0109] Optionally, the face 18 of the second module 17 is the face that contacts the first face 5 of the component 3.

[0110] For example, face 18 is in direct contact with the first face 5 of component 3.

[0111] Optionally, the second module 17 is configured such that face 18 is a cold face and face 19 is a hot face.

[0112] As described above, the first module 7 and the second module 17 are powered so that they can each be used to cool the component 3. Therefore, the circulation direction through each module must be defined accordingly. The first module 7 can be powered by inserting conductive tracks and / or paths into the support member 2 and / or into the component 3 and / or through the second module 17. The second module 17 can be powered by inserting conductive tracks and / or paths into the support member 2 and / or into the component 3 and / or through the first module 7.

[0113] Therefore, component 3 is sandwiched between the two modules 7 and 17.

[0114] In this configuration, the second module 17 is located entirely outside the support member 2. Therefore, the second module 17 dissipates heat through contact with the environment outside the support member 2 (e.g., through convection and / or radiation).

[0115] In the fourth embodiment described thus, component 3 is in direct contact with its two associated modules 7, 17.

[0116] Therefore, along the height of the electronic device 1, there are the following continuous layers (except for the attachment material layer): second module 17 / component 3 / first module 7 / heat dissipation component 10 / support member 2.

[0117] According to a first variation of the fourth embodiment, component 3 may be arranged on the lower part 12 of the support member 2, rather than on its upper part 4.

[0118] According to a second variation of the fourth embodiment (optionally combined with the first variation described above), although in this example modules 7 and 17 are associated with component 3 to cool component 3, modules 7 and 17 can also be associated with component 3 to heat it. In this example, it is sufficient to modify the direction of current flow in the power supply of module 7 and the direction of current flow in the power supply of module 17 so that surfaces 9 and 19 are cold surfaces, while surfaces 8 and 18 are hot surfaces.

[0119] According to a third variation of the fourth embodiment (optionally combined with the first variation described above), although in this example, both modules 7 and 17 are associated with component 3 to cool component 3, one of modules 7 and 17 can be associated with component 3 to cool it, while the other of modules 7 and 17 can be associated with component 3 to heat it. In this example, it is sufficient to modify the direction of current flow in the power supply of module 7 and / or the direction of current flow in the power supply of module 17 so that faces 9 and 18 are cold (or hot) faces, while faces 8 and 19 are hot (or cold) faces.

[0120] Therefore, module 7 or module 17 can be operated alternately according to the desired purpose.

[0121] Therefore, in all cases, it can be understood that component 3 includes a first face associated with the first thermoelectric module 7 and a second face associated with the second thermoelectric module 17, such that the assembly formed by the thermoelectric module 7, component 3, and the second thermoelectric module 17 forms a stack. In this example, the assembly formed by the support member 2, thermoelectric module 7, component 3, and the second thermoelectric module 17 forms a stack.

[0122] The term "stacked" is understood to refer to various elements arranged (preferably continuously) on top of each other in a given direction. Preferably, the direction is orthogonal to a plane parallel to at least one of the lower or upper portions of the support member 2. Preferably, the direction is vertical when the support member 2 is laid flat.

[0123] Figure 5 The fifth embodiment is shown, which is the same as the fourth embodiment, except that the second module 17 does not directly exchange heat with the external environment, but exchanges heat with the solid thermal regulation device 21, which may or may not be part of the electronic device.

[0124] Depending on the intended application, the thermal regulation device is or includes, for example, a bus (and, for example, a busbar) and / or a heat pipe and / or a cover and / or a shroud made of a thermally conductive material (and, for example, metal or graphene) and / or a heat dissipation element and / or any other type of radiator and / or heater.

[0125] For example, at least some of the thermal conditioning devices 21 are in direct contact with the face 19 of the second module 17 opposite to the face 18 attached to the component 3.

[0126] The width and / or length of the heat-adjusting device that directly contacts the face 19 of the second module 17 may be smaller than the width and / or length of the face. Alternatively, the width and / or length of the heat-adjusting device that directly contacts the face 19 of the second module 17 may be similar to the width and / or length of the face. Another variation is that the width and / or length of the heat-adjusting device that directly contacts the face 19 of the second module 17 may be greater than the width and / or length of the face.

[0127] Therefore, in all cases, it can be understood that component 3 includes a first face associated with the first thermoelectric module 7 and a second face associated with the second thermoelectric module 17, such that the components formed by the thermoelectric module 7, component 3, and the second thermoelectric module 17 form a stack. In this example, the components formed by the support member 2, thermoelectric module 7, component 3, and the second thermoelectric module 17 form a stack.

[0128] In this example, the components formed by the support member 2, the thermoelectric module 7, the component 3, the second thermoelectric module 17, and the thermal regulation device are stacked together.

[0129] The term "stacked" is understood to refer to various elements arranged (preferably continuously) on top of each other in a given direction. Preferably, the direction is orthogonal to a plane parallel to at least one of the lower or upper portions of the support member 2. Preferably, the direction is vertical when the support member 2 is laid flat.

[0130] Figure 6 A sixth embodiment is shown, which is the same as the fourth embodiment, except that component 3 is not arranged on one of the faces of the support member 2, but is arranged entirely inside the support element 2. Then, the second module 17 is arranged only partially inside the support member 2, and is no longer arranged entirely outside the support element 2.

[0131] In this example, the second module 17 is arranged such that its face (opposite to the face that contacts component 3) protrudes from the upper main face 4 of the support member 2. On the other hand, its face that contacts component 3 is completely disposed within the support member 2. Typically, 30% to 95%, for example 50% to 90%, of the second module 17 is disposed within the support member 2.

[0132] According to a first variant of the sixth embodiment, the second module 17 dissipates heat not by contact with the environment outside the support member 2 (e.g., by convection and / or radiation), but via the thermal regulation device proposed in the fifth embodiment.

[0133] According to a second variation of the sixth embodiment, the second module 17 can also be arranged entirely inside the support member 2, just like the first module 7. The second module 17 is then associated with a heat regulation device, at least partially arranged inside the support member 2, as with the first module 7.

[0134] Therefore, in all cases, it can be understood that component 3 includes a first face associated with the first thermoelectric module 7 and a second face associated with the second thermoelectric module 17, such that the components formed by the thermoelectric module 7, component 3 and the second thermoelectric module 17 are stacked.

[0135] The term "stacked" is understood to refer to various elements arranged (preferably continuously) on top of each other in a given direction. Preferably, the direction is orthogonal to a plane parallel to at least one of the lower or upper portions of the support member 2. Preferably, the direction is vertical when the support member 2 is laid flat.

[0136] Figure 7 A seventh embodiment is shown, which is the same as the sixth embodiment, except that the first module 7 does not directly contact the thermal regulation device, but rather contacts it through at least one thermally conductive connector 20.

[0137] For example, connector 20 can be the same as connector 13 described in the second embodiment.

[0138] Preferably, module 7 is in direct contact with the thermal conditioning device via a plurality of connectors 20, more preferably via a plurality of connectors 20 that are the same as those in the second embodiment 13.

[0139] The thermal regulation device associated with the first module 7 is arranged entirely inside the support member 2, or only partially in the support element 2, or entirely outside the support member 2.

[0140] Depending on the intended application, the thermal regulation device is or includes, for example, a bus (and, for example, a busbar) and / or a heat pipe and / or a cover and / or a shroud made of a thermally conductive material (and, for example, a metal or graphene) and / or a heat dissipation element and / or any other type of radiator and / or heater.

[0141] Therefore, in all cases, it can be understood that component 3 includes a first face associated with the first thermoelectric module 7 and a second face associated with the second thermoelectric module 17, such that the components formed by component 3, thermoelectric module 7 and the second thermoelectric module 17 are stacked.

[0142] The term "stacked" is understood to refer to various elements arranged (preferably continuously) on top of each other in a given direction. Preferably, the direction is orthogonal to a plane parallel to at least one of the lower or upper portions of the support member 2. Preferably, the direction is vertical when the support member 2 is laid flat.

[0143] Figure 8 An eighth embodiment is shown that is the same as the first embodiment, except that component 3 is different from module 7 and is not supported by the same support member 2.

[0144] Therefore, the electronic device 1 includes a support member 2 for the carrier module 7 and an additional support member 22 for the carrier component 3. The support member 22 may be the same as or different from the support member 2. Therefore, the support member 22 may be a printed circuit board.

[0145] Support members 2 and 22 are connected to each other at least through a connector between module 7 and component 3.

[0146] In the eighth embodiment described thus, component 3 is in direct contact with both the support member 22 and the module 7. As for module 7, logically it is in direct contact with both component 3 and the support member 2.

[0147] Therefore, along the height of the electronic device 1, there are the following continuous layers (except for the attachment material layer): second support member 22 / component 3 / module 7 / first support member 2.

[0148] Module 7 can also cool or heat component 3 according to the direction of the current from its power supply.

[0149] Therefore, component 3 is "clamped" between support member 22 and module 7.

[0150] Furthermore, in this example, it can be understood that thermal regulation is accomplished by a support member that does not bear the load of component 3, in this example, the support member is support member 2.

[0151] For this purpose, the electronic device includes a thermal regulation device 21 connected to module 7.

[0152] Depending on the intended application, the thermal regulation device is or includes, for example, a bus (and, for example, a busbar) and / or a heat pipe and / or a cover and / or a shroud made of a thermally conductive material (and, for example, a metal or graphene) and / or a heat dissipation element and / or any other type of radiator and / or heater.

[0153] Therefore, in all cases, it can be understood that component 3 includes a first face associated with the first thermoelectric module 7 and a second face associated with the second support member 22, such that the components formed by the second support member 22, component 3, thermoelectric module 7 and the first support member 2 are stacked.

[0154] The term "stacked" is understood to mean that various elements are arranged on top of each other in a given direction (preferably continuously). Preferably, the direction is orthogonal to a plane parallel to at least one of the lower or upper portions of support member 2 and / or support member 22. Preferably, the direction is vertical when support member 2 is laid flat and / or when support member 22 is laid flat.

[0155] Figure 9 A ninth embodiment is shown that is the same as the eighth embodiment, except that the electronic device 1 has more components: therefore, the electronic device 1 includes two parts 3a, 3b (instead of one), two modules 7, 17 (instead of one), and three support members 2, 22, 32 (instead of two).

[0156] Subsequently, electronic device 1 is, for example, an electronic power module (used as a rectifier, inverter, dimming unit, chopper, etc.). For example, support members 2 and 32 can be printed circuit boards. Support member 22 is, for example, composed of one or more metal layers stacked on top of each other. For example, component 3 is a power electronic component.

[0157] More precisely, the support member 22 carries the first component 3a on its first main surface and the second component 3b on its second main surface. The two components 3a and 3b may be offset from each other, or conversely, one may extend over the other for stacking (and be separated by the support member 22). The first component 3a is in direct contact with the support member 22 on one hand and with the module 7 on the other. As for the module 7, it logically has direct contact with the first component 3a on one hand and with the support member 22 on the other.

[0158] The second component 3b is in direct contact with the support member 22 on one hand and with the module 17 on the other. As for the module 17, logically it is in direct contact with the second component 3b on one hand and with the support member 32 on the other.

[0159] Therefore, at this component, along the height of the electronic device 1, there exists a series of the following layers (excluding the attachment material layer): first support member 2 / first module 7 / first component 3a / second support member 22 / second component 3b / second module 17 / third support member 32.

[0160] The first module 7 can cool or heat the first component 3a just as well, depending on the direction of the current of the power source under discussion, and / or the second module 17 can cool or heat the second component 3b just as easily, depending on the direction of the current of the power source.

[0161] Therefore, component 3a is "clamped" between support member 22 and module 7, while component 3b is "clamped" between support member 22 and module 17.

[0162] Furthermore, in this example, it can be understood that thermal regulation is accomplished by support members that do not bear loads, in this example, support members 2 and support members 32.

[0163] For this purpose, the electronic device includes a thermal regulation device 23, which is connected to module 7 on one hand and component 17 on the other.

[0164] Depending on the intended application, the thermal regulation device is or includes, for example, a bus (and, for example, a busbar) and / or a heat pipe and / or a cover and / or a shroud made of a thermally conductive material (and, for example, a metal or graphene) and / or a heat dissipation element and / or any other type of radiator and / or heater.

[0165] Therefore, in all cases, it can be understood that component 3a includes a first face associated with the first thermoelectric module 7 and a second face associated with the second support member 22, such that the components formed by the first support member 2, the thermoelectric module 7, component 3a and the second support member 22 are stacked.

[0166] Therefore, in all cases, it can be understood that component 3b includes a first face associated with the second thermoelectric module 17 and a second face associated with the second support member 22, such that the components formed by the second support member 22, component 3b, thermoelectric module 17 and third support member 32 are stacked.

[0167] The components formed by the first support member 2, the thermoelectric module 7, the component 3a, the second support member 22, the component 3b, the thermoelectric module 17 and the third support member 32 are stacked together.

[0168] The term "stacked" is understood to mean that various elements are arranged on top of each other in a given direction (preferably continuously). Preferably, the direction is orthogonal to a plane parallel to at least one of the lower or upper portions of support member 2 and / or support member 32. Preferably, the direction is vertical when support member 2 is laid flat and / or when support member 32 is laid flat.

[0169] When an electronic device includes at least one module associated with at least one component of the device, the thermal regulation device can be configured to allow monitoring and / or regulating the temperature of that component. Therefore, it can be understood that this is possible regardless of the construction of the electronic device (various figures illustrate possible non-limiting constructions where the electronic device includes at least one component and at least one module).

[0170] According to the first option, the thermal regulation device may include at least one sensor capable of estimating the temperature of the component and at least one computing device (of the type of controller or computer) communicating with the sensor. Based on the information transmitted by the sensor, the computing device may adjust the intensity and / or direction of the current supply to the power supply of a module associated with the component. Alternatively or supplementarily, the sensor may measure the temperature difference between two faces of the module to adjust the intensity and / or direction of the current supply to the module, causing the component to be maintained at a set temperature.

[0171] According to the second option, the face of the module opposite to the face connected to the component is in contact with a thermal reference interface of a thermal conditioning device (directly or via an element such as the thermal conditioning device and an intermediate element such as a heat dissipation element). The thermal reference interface is at a given reference temperature, which is applied to the opposite face. The temperature difference between the opposite face of the module and the face in contact with the component generates a current. By measuring this current, it is possible to estimate the difference between the two faces of the module. This allows actions to be taken at the module (e.g., by modifying the intensity and / or direction of the current of the power supply in question) to modify the temperature difference between its two faces as needed.

[0172] The thermal reference interface can be brazed, sintered (copper, silver), bonded (based on thermally conductive adhesives), layered (graphite, graphene, aluminum alloy, silicon alloy), silicon-based mat, etc.

[0173] Modules / components are naturally applicable to other constructions. Specifically, when an electronic device includes at least two modules, each associated with at least one component of the device, the thermal regulation device can be configured to allow monitoring and / or regulating the temperature difference between the two components. It should be understood that this is possible regardless of the construction of the electronic device. Figure 3 and Figure 9 Possible, non-limiting configurations are shown, in which the electronic device includes at least two components and at least two modules.

[0174] According to the first option, the thermal regulation device may include at least one sensor capable of estimating the temperature of a first component, as well as the temperature of a second component and at least one computing device (of the type of controller or computer) communicating with the sensor. Based on the information transmitted by the sensor, the computing device may adjust the intensity and / or direction of the current supplying power to the module associated with the first component and / or the module associated with the second component to maintain the two components at a setpoint temperature difference (possibly equal to zero). Alternatively or supplementarily, the sensor may measure the temperature difference between two faces of the module associated with the first component and / or the module associated with the second component to adjust the intensity and / or direction of the current supplying power to the module associated with the first component and / or the module associated with the second component to maintain the two components at a setpoint temperature difference (possibly equal to zero).

[0175] According to the second option, a thermal reference interface (directly or via an element such as the thermal regulator and an intermediate element such as a heat dissipation element) is in contact with the face of the associated component (in this example, the first module) and the thermally regulating device. The thermal reference interface can be brazed, sintered (copper, silver), bonded (based on thermally conductive adhesives), layered (graphite, graphene, aluminum alloy, silicon alloy), silicon-based mat, etc.

[0176] A thermal reference interface is at a given reference temperature, which is applied to the opposing faces. The temperature difference between the opposing face of the first module and the face in contact with the component generates an electric current. By measuring this current, the difference between the two faces of the first module can be estimated, and thus the temperature of the first component can be estimated. In this case, by comparing this data with data related to the temperature of the second component, the temperature difference between the two components can be estimated. Therefore, it is possible to:

[0177] - Take action at the first module (by modifying, for example, the strength and / or direction of the current in the power supply under discussion), and / or

[0178] - Take action at the second module (by modifying, for example, the strength and / or direction of the current in the power supply discussed).

[0179] This ensures that the temperature difference between the first component and the second component is maintained at a given setpoint temperature difference (the setpoint temperature difference can be equal to zero).

[0180] Of course, it should be understood that the interpretation provided for a pair of modules or a group of two modules / a pair of components or a group of two components also applies to other constructions, such as a pair of modules or a group of at least two modules / a pair of components or a group of at least two components.

[0181] Of course, the present invention is not limited to the described embodiments, but covers any variations included within the scope of the invention as defined by the claims.

[0182] Specifically, regardless of the embodiment, the thermally conductive connection may differ from what is indicated. For example, the connection does not necessarily need to be conductive. If one or more additional conductive connections are required to power one or more components of an electronic device, one or more electrical insulation barriers (barriers such as those based on SiO2, AlN, etc.) may optionally be provided between the thermally conductive connection(s) and the conductive connection(s) in the electronic device.

[0183] Regardless of the implementation, the same module can be associated with several components, such that the module is in contact with at least two components (directly or through at least a thermally conductive connector).

[0184] Regardless of the embodiment, although in this example the support member is a printed circuit board or a board consisting of one or more metal layers, the support member can more generally be a substrate.

[0185] Regardless of the embodiment, when at least two elements (one or more modules, one or more parts, one or more support members, etc.) are referred to as “stacked”, it means that they can be in direct contact with each other or separated by another element (one or more modules, one or more parts, one or more support members, etc.).

[0186] Regardless of the embodiment, when at least one element (one or more modules, one or more parts, one or more support members, etc.) is referred to as being "clipped" between two other elements (one or more modules, one or more parts, one or more support members, etc.), it means that the three elements in question can be in direct contact with each other, or (for at least two of the elements) be separated by another element (one or more modules, one or more parts, one or more support members, etc.).

[0187] Regardless of the embodiment, the attachment between component A (one or more modules, components, support elements, etc.) and component B (one or more modules, components, support elements, etc.) can be ensured by sintering, crosslinking, brazing, etc.

[0188] Conductive tracks and / or paths and / or any other means enabling electrical and / or thermal connection of element A (one or more modules, components, support elements, etc.) and element B (one or more modules, components, support elements, etc.) can themselves be associated with a dedicated thermal conditioning device. Depending on the intended application, the thermal conditioning device is or includes, for example, buses (and busbars) and / or heat pipes and / or covers and / or heat dissipation elements made of thermally conductive materials (and / or metals or graphene) and / or any other type of radiator and / or heater.

[0189] Regardless of the implementation method:

[0190] - The width and / or length and / or thickness of this module may be smaller than the width and / or length and / or thickness of the associated component.

[0191] - The width and / or length of this module can be substantially similar to the width and / or length of the associated component.

[0192] - For example, the main face of a module that is in direct contact with the face of a component (either directly or via at least a thermally conductive connector) has dimensions similar to those of the component, but the thickness of the module is less than that of the component.

[0193] - For example, the main face of the module that is in contact with the face of the component (directly or through at least a thermally conductive connector) has a smaller size than the size of the component, and the thickness of the module is also smaller than the thickness of the component.

[0194] Regardless of the embodiment, the component can be arranged entirely outside the support member, only partially inside the support element, or entirely inside the support element.

[0195] Regardless of the embodiment, the module can be arranged entirely outside the support member, only partially inside the support element, or entirely inside the support element.

[0196] Regardless of the embodiment, at least one of the thermal regulation elements can be arranged entirely outside the support member, only partially inside the support member, or entirely inside the support member.

[0197] Regardless of the embodiment, if the device includes several modules, the second module may be arranged entirely outside the support member, only partially inside the support member, or entirely inside the support member.

[0198] Different embodiments can be combined with each other. For example, although the third embodiment proposes associating a first module / component pair according to the first embodiment and a second module / component pair according to the second embodiment with the same support member, the same support member can be associated with any first module / component pair and any second module / component pair described (the first pair and the second pair can also be identical to each other). Furthermore, the seventh embodiment (in which the module contacts the thermal regulating device via at least a thermally conductive connection) can be combined with various other embodiments such that, for any of the embodiments discussed, the module can directly contact the thermal regulating device or contact the thermal regulating device via at least a thermally conductive connection.

[0199] Regardless of the embodiment, the thermal adjustment devices can be arranged entirely outside the support member, only partially inside the support member, or entirely inside the support member. When the thermal adjustment devices are arranged outside the support member, they can be attached to one of the faces of the support member, or indirectly attached to one of the faces of the support member via an associated module.

[0200] Regardless of the implementation, the electronic device may be a power module, power supply module, etc., and / or may be integrated into an electronic system, such as a motor, actuator, smart actuator, smart motor, etc. The electronic system may also be optionally integrated into an aircraft, such as an electric aircraft.

[0201] Regardless of the implementation, the component can be of any type, such as a chip, surface mount device (SMD), package (CMS package or non-CMS package), quad flat no lead (QFN) or dual flat no lead (DFN) package, pad grid array (LGA), sensor (such as a gyroscope), memory, computing device, amplification component, etc.

[0202] Regardless of the implementation, the module can be a semiconductor module, i.e., including a pn junction or any other module that enables the desired thermoelectric effect to be generated.

[0203] Regardless of the embodiment, although in this example the module always regulates the temperature of associated components by supplying power, the module can also be energized to generate current under the influence of a thermal gradient, which will be applied to the module via the components (e.g., so that the current generated by the module can be reused to power another component and / or another module, or to regulate the thermal gradient, or to regulate the thermal gradient of another module, etc.). In this case, the associated thermal regulation device may supplement the role of the electrical conductor and / or additional conductive devices may be used.

[0204] Regardless of the implementation, one or more elements may be inserted between each thermoelectric module / component pair discussed.

[0205] Regardless of the implementation, electronic devices can be shaped to allow temperature regulation of components and / or modules.

[0206] Specifically, it should be understood that components can be heated or cooled depending on the direction of the module's power supply current, and the degree of heating or cooling can be increased or decreased by increasing or decreasing the current intensity. Alternatively, it is also possible to affect the temperature of the surface of the module connected to the component requiring thermal regulation, without affecting the current.

[0207] Regardless of the embodiment, the electronic device can be shaped to allow temperature regulation of a group of at least two components and / or a group of at least two modules and / or a group of at least one component and one module.

[0208] Specifically, it should be understood that, depending on the direction of the current from the power supply of at least one of the modules associated with the group, at least one of the elements in the group can be heated or cooled, and by increasing or decreasing the intensity of the current, the element can be heated or cooled to a greater or lesser extent, such that the temperature difference between the various elements within the group is maintained at the same set point (possibly equal to zero). Alternatively, the temperature of the face of the module opposite the face connected to the element requiring thermal regulation can be affected, rather than the current of at least one module associated with the group.

[0209] Regardless of the envisioned embodiment, the power supply for element A (module, component, etc.) can be provided by one of a conductive track, a path (by definition, a path is conductive), another element B (module, component, etc.), and a thermal regulation device for the electronic device (if said device is also conductive). For example, regardless of the envisioned embodiment, at least one metal emitter can be used to power element A and simultaneously to thermally regulate said element A.

[0210] Regardless of the envisioned implementation, the power supply of component A (module, component, etc.) also enables the simultaneous power supply of component B (module, component, etc.).

[0211] Regardless of the envisioned implementation, the thermal adjustment device for element A (module, component, etc.) also enables the simultaneous adjustment of element B (module, component, etc.).

Claims

1. An electronic device, comprising at least one support member (2) and at least one component (3), characterized in that, The device includes at least one thermoelectric module (7) associated with the component and shaped as a block comprising two main heat exchange faces. The module is at least partially integrated into the support member such that the first of the two main faces of the module is in direct contact with at least one of the faces of the component, or via at least one connector (13) made of at least a thermally conductive material. The component includes a first face associated with the thermoelectric module and a second face associated with a second thermoelectric module or a second support member (22), such that the components formed by the component, the thermoelectric module, and the second thermoelectric module or the second support member are stacked.

2. The device according to claim 1, characterized in that, The module (7) is fully integrated into the support member (2).

3. The device according to claim 1 or 2, characterized in that, Includes a thermal regulation device associated with the module (2).

4. The device according to claim 3, characterized in that, The thermal regulation device is arranged at least partially inside the support member (2).

5. The device according to claim 3 or 4, characterized in that, The module is in direct contact with at least one component of the thermal regulation device.

6. The device according to any one of claims 3 to 5, characterized in that, The thermal regulation device includes a discharge component (10) made of a thermally conductive material.

7. The device according to any one of claims 3 to 6, characterized in that, The thermal regulation device includes a thermal reference interface, and the module (7) is in direct contact with the thermal reference interface or in contact via a connector made of thermally conductive material.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The component is a first component (3a), and the device is configured to allow temperature regulation of a group including the first component and at least one second component (3b).

9. The electronic device according to claim 8, characterized in that, The module is a first module (7) associated with the first component, and the device includes a second module (17) associated with the second component.

10. The electronic device according to claim 8 or claim 9, characterized in that, The support member is a first support member (2), and at least one of the components is supported by a second support member (22) of the electronic device.

11. The electronic device according to claims 9 and 10, characterized in that, Includes a third support member (32) that carries the second module.

12. The electronic device according to any one of claims 9 to 11, characterized in that, The first module (7) realizes the Peltier effect, while the second module (17) realizes the Seebeck effect.

13. The device according to any one of the preceding claims, characterized in that, The device is a power module.

14. An electronic system comprising the device according to any one of claims 1 to 13, wherein the electronic system is an aircraft electronic system.

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