PCB including current line surrounding boss hole

Abstract

Disclosed is a PCB having a boss hole formed in a hole shape for fixing a PCB substrate, in which an electrical pattern is provided along an inner side portion of the boss hole. Thus, a conventional PCB can be utilized without any change even in increasingly restricted physical and spatial environments, and an allowable current can be ensured as the energy density increases.

Description

Technical Field

[0001] This application claims the benefit of priority to Korean Patent Application No. 2023-0160458, filed on November 20, 2023, the disclosure of which is incorporated herein by reference in its entirety.

[0002] This disclosure relates to a PCB including current lines surrounding a boss hole. More specifically, this disclosure relates to a PCB including a vertical metal plate for securing the PCB to a device with current lines surrounding the boss hole. Background Technology

[0003] In the case of lithium-ion rechargeable batteries, for safety purposes, the temperature, voltage, and other parameters of the individual battery cells are measured and monitored. A PCB manufactured for this purpose is called a Battery Management Unit (BMU), and the electrode leads of the individual battery cells are electrically connected to the PCB.

[0004] IT products such as smartphones and laptops are becoming smaller and lighter, and the battery modules or battery packs used in them are becoming increasingly dense, while also having higher capacity. Due to the limited space available for components, the battery unit (BMU) is also becoming very dense. However, for highly mobile IT products, the BMU must essentially have boss holes for mounting.

[0005] Figure 1 This is a schematic diagram showing a portion of the upper surface of a standard BMU 100, and Figure 2 This is a perspective view showing a portion of the BMU configuration in a conventional battery pack. Figure 1 and Figure 2 The x, y, and z coordinates shown are the same. (Refer to...) Figure 2 The BMU 100 is located at the center of the battery cell 200 with electrode leads 210, and the BMU 100 is connected to an external current line 140. The BMU 100 has a boss hole 120 for fixing to the battery pack. (See reference...) Figure 1 The left side of BMU 100 has multiple welding parts 110. The welding parts 110 are welded to... Figure 2 External current line 140. The electrode leads of the battery cell, sensors, external output terminals, etc., are soldered to the solder joint 110. Figure 1 At the center, a boss hole 120 is provided for fixing the BMU 100. The solder joints 110 are connected to current lines 130 for electrical connection to various components in the BMU. Figure 1 In the text, everything except the current line 130 required for description is omitted.

[0006] Because the boss hole 120 is located in the horizontal plane (xy plane) of the BMU, there is insufficient space to horizontally install the current lines. Since the boss hole 120 is only for mounting the BMU 100, the current lines must be installed in the remaining area. As the width of the current line 130 decreases, the maximum permissible current also decreases. As the energy density of the battery module or battery pack increases, the maximum permissible current must also increase, but as the BMUs become increasingly dense and smaller, the space available for the current lines becomes even smaller.

[0007] BMUs are also based on multi-layer PCBs, but they still exhibit the problem of reduced allowable current. Due to heat generation, it's also impossible to place high-capacity current lines on the inner layers of the PCB. However, with increasing energy density, additional solutions are necessary to ensure the allowable current.

[0008] Patent document 1 relates to a technique for ensuring an electrical connection (i.e., electrical conduction) between a conductor pattern formed on a printed circuit board and a housing, and for ensuring that the housing is grounded (i.e., connected to ground (GND)) by means of mounting screws used to secure the printed circuit board and the housing.

[0009] Patent Document 2 provides a printed circuit board with a thinned frame ground portion, wherein the frame ground portion 11 for forming conductor patterns 13a and 13b is disposed around four mounting holes 12 for fixing, and a plurality of through holes 14 are disposed around the mounting holes 12 for fixing the frame ground portion 11. In the component mounting process, a paste solder 15 is applied to the through holes 14 during a paste solder printing process. In the reflow process, the paste solder 15 is melted and partially introduced into the through holes 14 to attach to the through holes 14 and the conductor patterns 13a and 13b around them, thereby forming a solder film.

[0010] In Patent Document 3, a screw hole 16 is formed in the circuit board 10 for the screw 50 to extend through, preventing the screw hole from being filled with solder during the soldering process without special treatment. No copper foil is formed on the inner wall of the screw hole 16. A first conductive portion 20 is formed around the screw hole 16 on the first main surface 12 of the circuit board 10. When the circuit board 10 is fixed to the housing, the head 52 of the screw 50 contacts and is electrically connected to the first conductive portion 20. The ground layer 28 of the circuit board 10 and the first conductive portion 20 are connected to each other in a through hole 18. A second conductive portion is also provided on the second main surface of the circuit board 10, and the second conductive portion is electrically connected in the through hole 18. When the screw 50 is threaded into the screw hole 62 of the mounting post 60 of the electronic device housing, the screw 50 and the second conductive portion 22 are electrically connected to the housing, thereby electrically connecting the ground layer 28 to the housing.

[0011] In Patent Documents 1 to 3, as a configuration for grounding a PCB, conductive material is added to the inner surface of the grounding hole or to the upper and lower parts around it. This is for the electrical connection between the PCB and the housing, but it cannot be considered a suitable solution to the problem related to the fixed current lines described in this disclosure.

[0012] Patent document 4 discloses a technique for simply fixing a circular hole and a metal tube inserted therein electrically and physically in the form of rivets, which cannot be considered a solution to the problem according to this disclosure.

[0013] Therefore, no technology has yet been proposed that can utilize conventional PCBs without any modifications, even in increasingly constrained physical and spatial environments, while ensuring permissible current as energy density increases. In particular, the challenge of using BMUs in IT products such as smartphones and laptops, which are becoming smaller and lighter while simultaneously increasing energy density, must be addressed.

[0014] (Existing technical documents) (Patent Document 1) Japanese Patent Application Publication No. 2014-090018 (Patent Document 2) Japanese Patent Application Publication No. 2009-212124 (Patent Document 3) Japanese Patent Application Publication No. 1996-236878 (Patent Document 4) Korean Patent Publication No. 2179678 Summary of the Invention

[0015] Technical issues One object of this disclosure is to provide a technique that can utilize conventional PCBs without any modifications, even in increasingly constrained physical and spatial environments, and ensure permissible current as energy density increases. In particular, another object of this disclosure is to provide a technique that can ensure permissible current in BMUs used in IT products such as smartphones and laptops, which are becoming smaller and lighter while increasing energy density.

[0016] Technical solution To achieve the above objectives, this disclosure provides a PCB having a boss hole formed in the shape of a hole for fixing a PCB substrate, wherein an electrical pattern is provided along the inner side surface of the boss hole. The shape of the boss hole may be cylindrical; however, this disclosure is not limited thereto. Depending on the need, the shape of the boss hole may be polygonal.

[0017] Electrical patterns can be made of metal. Electrical patterns can be made of conductive materials. Even conductive pastes can be used, but copper, commonly used in PCBs, is preferred.

[0018] The electrical pattern can be a thin strip of copper metal used for circuit patterns on a PCB. The strip is disposed along the inner side surface of a boss hole. The width of the strip can be less than the depth of the boss hole. That is, the circuit pattern of a conventional PCB is horizontally disposed on the PCB substrate. In this case, the circuit pattern can be stacked in multiple layers. On the other hand, the electrical pattern according to this disclosure is characterized in that the electrical pattern is vertically disposed.

[0019] Furthermore, the electrical pattern can have multiple layers. When the electrical pattern provided along the inner side surface of the boss hole is configured to have multiple layers, the necessary electrical pattern can be additionally provided through the boss hole.

[0020] Connectors can be added to the top surface of the PCB, and these connectors are electrically connected to the electrical pattern. Because the electrical pattern is vertically positioned, unlike conventional circuit patterns on the PCB, connectors are needed to link the electrical pattern to the conventional circuit pattern. Two connectors can be located at the beginning and end of the electrical pattern, respectively. Alternatively, the connectors can be horizontally positioned and electrically connected to the electrical pattern.

[0021] A vertical gap extending further from the boss hole can be provided. The vertical gap is a vertically cut gap, and the electrical pattern can extend into the vertical gap. Two vertical gaps can be arranged symmetrically with respect to the boss hole, and the connecting part can be electrically connected to the electrical pattern extending into the vertical gap. At the same time, the electrical pattern can be physically fixed through the vertical gap.

[0022] Two electrical patterns can be arranged on the left and right sides of the inner side of the boss hole. The exposed outer part of the electrical pattern can be coated with an insulating material.

[0023] Electrical patterns can be attached to the inner side of the boss hole.

[0024] An annular protective portion can be added to the outside of the electrical pattern. The protective portion can be an insulator and can electrically isolate the electrical pattern from bolts, etc., that are fixed through the boss hole.

[0025] PCBs can be used as battery management units (BMUs) in battery modules.

[0026] In addition, this disclosure provides a battery module including a PCB.

[0027] This disclosure can provide any possible combination of the above solutions.

[0028] Beneficial effects This disclosure provides a PCB having boss holes formed in the shape of holes for fixing a PCB substrate, wherein electrical patterns are disposed along the inner side surfaces of the boss holes. Therefore, a technology can be provided that allows the use of conventional PCBs without any modifications, even in increasingly constrained physical and spatial environments, and ensures permissible current even with increased energy density. Additionally, a technology can be provided that ensures permissible current in BMUs used in IT products such as smartphones and laptops, which are becoming smaller and lighter while increasing energy density.

[0029] Conventional boss holes are non-conductive, but the electrical patterns of this disclosure are added to the boss holes. Unlike conventional circuit patterns, the electrical patterns of this disclosure are vertically arranged, thus providing additional necessary electrical patterns. The electrical patterns can have multiple layers. When the electrical patterns arranged along the inner side surface of the boss hole are configured to have multiple layers, additional necessary electrical patterns can be provided through the boss hole.

[0030] The electrical pattern can have multiple layers, or two electrical patterns can be respectively arranged on the left and right sides along the inner side of the boss hole. In this case, multiple layers or left and right patterns can be used as separate transmission schemes. Attached Figure Description

[0031] Figure 1 This is a schematic diagram showing a portion of the upper surface of a conventional BMU.

[0032] Figure 2 This is a perspective view showing a portion of the BMU configuration in a conventional battery pack.

[0033] Figure 3 This is a perspective view of the boss hole according to the first embodiment of the present disclosure.

[0034] Figure 4 This is a perspective view of the boss hole according to the second embodiment of the present disclosure. Detailed Implementation

[0035] Preferred embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the preferred embodiments of the present disclosure. However, in describing the working principles of the preferred embodiments of the present disclosure in detail, specific details of known functions and configurations incorporated herein will be omitted where such detailed descriptions might obscure the subject matter of the disclosure.

[0036] Furthermore, the same reference numerals will be used throughout all the accompanying drawings to refer to parts that perform similar functions or work. Throughout the specification, where a part is referred to as being connected to another part, that part can be directly connected to that other part, or indirectly connected to that other part via yet another part. Additionally, unless otherwise stated, including a particular element does not mean excluding other elements, but rather means that such elements may be further included.

[0037] In the following description, a PCB according to the present disclosure will be illustrated with reference to the accompanying drawings. The PCB according to the present disclosure differs from a conventional PCB only in the boss holes and the electrical patterns disposed thereon. Figure 3 This is a perspective view of the boss hole according to the first embodiment of the present disclosure. Figure 3 Only the configuration of the boss hole and the electrical pattern set there is shown; other PCB configurations are omitted. Figure 3 a) is an enlarged view of the boss hole. Figure 3 b) is a diagram showing the electrical pattern and connections, and Figure 3 c) is a diagram showing another modification of the electrical pattern.

[0038] Reference Figure 3 The PCB has a boss hole 520 for fixing a PCB (particularly a BMU 500) and an electrical pattern 550 disposed along the inner side surface of the boss hole 520. The boss hole 520 is cylindrical in shape. The electrical pattern 550 is made of copper metal used in the PCB. The electrical pattern 550 is made of a strip of copper metal. The strip is disposed along the inner side surface of the boss hole. The width W of the strip can be equal to or less than the depth D of the boss hole 520. While the circuit patterns of a conventional PCB are horizontally disposed on the PCB substrate, the electrical pattern 550 according to this disclosure is characterized in that the electrical pattern is vertically disposed.

[0039] A connecting portion 560 can be added to the upper surface of the BMU 500 and electrically connected to the electrical pattern 550. Since the electrical pattern 550 is vertically arranged, unlike a conventional circuit pattern located at the BMU, the connecting portion 560 is required to connect the electrical pattern to a conventional circuit pattern. Two connecting portions 560 are respectively provided at the beginning and end of the electrical pattern 550. The connecting portions 560 are horizontally arranged and electrically connected to the electrical pattern 550.

[0040] The connecting part 560 can be connected to the circuit pattern provided at a conventional BMU without forming a separate form; however, since the electrical pattern 550 according to this disclosure is vertically arranged, therefore... Figure 3 The diagram shows a separate connection part 560, which can be connected to the circuit pattern of a conventional BMU.

[0041] A vertical gap portion 525 is provided as a vertical cut-out gap extending further from the boss hole 520, and an electrical pattern 550 extends into the vertical gap portion 525. The two vertical gap portions 525 are symmetrically arranged with respect to the boss hole 520, and a connecting portion 560 is electrically connected to the electrical pattern 550 extending into the vertical gap portion 525. The electrical pattern 550 is fixedly fitted into the vertical gap portion 525. Figure 3 c) shows a modification of a connecting part 560. Figure 3 The connecting portion 560A shown in c) is directly fixed to the upper surface of the BMU 300 without the vertical gap portion 525. If the vertical gap portion 525 is not required, the connecting portion 560A can be provided at both ends of the electrical pattern 550.

[0042] Although Figure 3 Only one electrical pattern 550 is provided, but the electrical pattern can have multiple layers. When the electrical pattern provided along the inner side of the boss hole 520 is configured to have multiple layers, the necessary electrical patterns can be additionally provided through the boss hole. In this case, the electrical patterns are also inserted into the vertical gap as multiple layers. However, if the electrical patterns provided in multiple layers operate as independent circuits, multiple connection portions 560 must also be provided. Although in Figure 3 In a), only one connecting portion 560 is provided at each of the starting and ending portions, but multiple connecting portions may also be provided. In this case, the vertical gap portion extends further, and multiple connecting portions 560 may be arranged adjacent to each other despite an electrical short circuit.

[0043] Figure 4 This is a perspective view of the boss hole according to a second embodiment of the present disclosure. The second embodiment is identical to the first embodiment except that two electrical patterns are respectively arranged along the inner side surface of the boss hole on the left and right sides; therefore, descriptions of the same configuration will be omitted.

[0044] Reference Figure 4 Two electrical patterns 550 are respectively disposed on the left and right sides along the inner side portion of the boss hole 520. Therefore, the number of connecting portions 560 increases from two to four. The two electrical patterns 550 can form one electrical connection, or they can be used as two separate electrical connections by adding an insulator between the two electrical patterns 550.

[0045] Additionally, the exposed outer portion of the electrical pattern can be coated with an insulating material, or the electrical pattern can be attached to the inner side portion of the boss hole. Furthermore, an annular protective portion can be added to the exterior of the electrical pattern. This protective portion can be an insulator and can electrically separate the electrical pattern from bolts or other fasteners secured through the boss hole.

[0046] In addition, this disclosure provides a battery module including a PCB.

[0047] Although the specific details of this disclosure have been described in detail, those skilled in the art will understand that the detailed description only discloses preferred embodiments of the disclosure and therefore does not limit the scope of the disclosure. Consequently, those skilled in the art will understand that various changes and modifications can be made without departing from the category and technical concept of this disclosure, and it will be apparent that such changes and modifications fall within the scope of the appended claims.

[0048] (Explanation of reference numerals in the attached image) 100, 500: BMU 110: Welding Department 120, 520: Boss hole 525: Vertical gap section 130: Current line 140: External current line 200: Battery cell 210: Electrode lead 550: Electrical pattern 560, 560A: Connecting part D: Depth of the boss hole W: Width of the electrical pattern

Claims

1. A PCB having boss holes formed in the shape of holes for fixing a PCB substrate, in, An electrical pattern is provided along the inner side surface of the boss hole.

2. The PCB according to claim 1, wherein, The electrical pattern is made of metal.

3. The PCB according to claim 1, wherein, The electrical pattern has multiple layers.

4. The PCB according to claim 1, wherein, A connection portion is added to the upper surface of the PCB, and the connection portion is electrically connected to the electrical pattern.

5. The PCB according to claim 1, wherein, A vertical gap portion extending further from the boss hole is provided, the vertical gap portion being a vertically cut gap, and... The electrical pattern extends into the vertical gap.

6. The PCB according to claim 1, wherein, The electrical patterns are arranged in two positions along the inner side surface of the boss hole.

7. The PCB according to claim 1, wherein, The exposed portions of the electrical pattern are coated with an insulating material.

8. The PCB according to claim 1, wherein, The electrical pattern is attached to the inner side portion of the boss hole.

9. The PCB according to claim 1, wherein, The electrical pattern is surrounded by a ring-shaped protective section.

10. The PCB according to claim 1, wherein, The PCB is used as a battery management unit, or BMU, in the battery module.

11. A battery module comprising the PCB according to any one of claims 1 to 10.

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