Electronic component transfer cutting machine

Abstract

The invention discloses an electronic element transferring and cutting machine which comprises a transferring mechanism for driving materials to move, a rotating mechanism for driving the materials to rotate to adjust the direction, a bearing table for bearing the materials, a cutting mechanism for cutting and separating the materials by moving in a cutting gap, and a material transferring mechanism for driving the bearing table to translate and lift to transfer the materials. And the turnover mechanism drives the bearing table to turn over to complete unloading. The transferring mechanism pushes the materials to the bearing table through a push plate, a rotating disc of the rotating mechanism drives the materials to rotate, and the rotating disc, the workbench and the bearing table are all provided with adsorption structures to ensure that the materials are stable. A cutter of the cutting mechanism moves back and forth under the action of a translation driving part, the material moving mechanism achieves moving and lifting of the bearing table through a transverse movement driving part and a lifting driving part, and the overturning mechanism enables the bearing table to overturn through an overturning shaft and an overturning driving part. The device achieves the effects of efficiently completing the procedures of transferring, cutting, transferring, unloading and the like of the electronic elements and improving the working efficiency and quality.

Description

Technical Field

[0001] This application relates to the field of electronic component transfer and splitting, and in particular to an electronic component transfer and splitting machine. Background Technology

[0002] With the continuous development of the electronic components industry, the requirements for production efficiency, quality, and cost control are increasing. Electronic component materials in a production line generally consist of multiple electronic components and a bottom adhesive tape (such as...). Figure 1 As shown in the figure, multiple electronic components are glued to the bottom tape in an array. They need to be cut by a cutting device to form independent columns of electronic components. Sufficient spacing is reserved between adjacent columns of electronic components to allow for cutting by the cutter.

[0003] To address the problem of cutting electronic component materials, the current technology typically employs a method whereby the material to be cut is first transported to the cutting equipment via a transfer device, then placed on the cutting equipment's worktable, and finally cut using the cutting blades. This approach separates the transfer and cutting operations into two relatively independent stages on the production line. The transfer device focuses on conveying the material, moving it from one location to the vicinity of the cutting equipment; while the cutting equipment is responsible for cutting the material into individual rows of electronic components. This clear division of labor can achieve electronic component production to a certain extent, but it also has some shortcomings.

[0004] However, this existing technology has significant drawbacks. Because the transfer and separation processes are handled by different equipment, materials often require secondary loading, unloading, and positioning. Secondary loading and unloading increases material turnaround time on the production line, reducing production efficiency; repeated positioning easily introduces positioning errors, affecting product quality. Furthermore, the combined use of different equipment results in a large footprint, increasing the company's production space costs. Simultaneously, the increased number of devices also raises equipment costs and integration complexity, failing to meet the high-efficiency, precise, and low-cost production requirements of electronic component production lines. Summary of the Invention

[0005] In order to improve the production efficiency and quality of electronic components, as well as reduce the equipment footprint and equipment cost, this application provides an electronic component transfer and splitting machine.

[0006] The electronic component transfer and splitting machine provided in this application adopts the following technical solution: An electronic component transfer and splitting machine, comprising: Transfer mechanism, used to drive the movement of materials; A rotating mechanism is installed in the transfer mechanism and drives the material on the transfer mechanism to rotate by rotation in order to adjust the direction of the material; A support platform is arranged side by side with the discharge end of the transfer mechanism and is used to support the material transferred out from the transfer mechanism; A dividing mechanism is installed at the discharge end of the transfer mechanism. A cutting gap is formed between the support platform and the transfer mechanism. The dividing mechanism moves in the cutting gap to cut and separate the material on the support platform from the material on the transfer mechanism. The material transfer mechanism is used to drive the support platform to move horizontally and vertically in order to transfer the segmented material to the next process; The tilting mechanism is used to drive the carrier platform to tilt so as to complete the unloading action of the segmented material.

[0007] By adopting the above technical solution, the functions of transfer, rotation, segmentation, material handling, and flipping are integrated into one unit, realizing continuous automated processing of electronic component materials. This design avoids secondary loading and unloading and repeated positioning of materials between different devices, significantly shortening the production cycle time, thereby improving overall production efficiency and reducing equipment footprint and overall costs. The rotation mechanism can flexibly adjust the material direction to ensure accurate segmentation; the segmentation mechanism directly cuts in the cutting gap formed between the transfer mechanism and the support platform, with direct action and precise positioning; the material handling and flipping mechanisms realize smooth material transfer and automated unloading, meeting the needs of efficient and precise production.

[0008] Preferably, the transfer mechanism includes a frame, a worktable mounted on the frame, a push plate horizontally slidably connected to the worktable, and a sliding drive component mounted on the worktable. The sliding drive component is used to drive the push plate to move forward and backward toward the support platform, thereby pushing the material on the worktable onto the support platform.

[0009] By adopting the above technical solution, the transfer mechanism uses a sliding drive to push the push plate in a horizontal reciprocating motion. The structure is simple and reliable, enabling automated material transfer from the worktable to the carrier platform. This linear propulsion method reduces material swaying and misalignment during the transfer process, ensuring the positional accuracy of the material when entering the cutting station, laying the foundation for subsequent precise cutting, while also reducing the complexity of the mechanism and maintenance costs.

[0010] Preferably, the rotating mechanism includes a rotating disk rotatably connected to the worktable and a rotating drive for driving the rotating disk to rotate. The worktable has a mounting hole in the middle for mounting the rotating disk. The rotation axis of the rotating disk is perpendicular to the working surface of the worktable. When the material is positioned on the rotating disk, the rotating drive drives the rotating disk to rotate to adjust the orientation of the front end of the material. When the travel path of the push plate passes through the working surface of the rotating disk, it pushes the material on the rotating disk toward the support platform.

[0011] By adopting the above technical solution, the rotating mechanism precisely controls the rotation of the turntable through a rotating drive component, allowing the material to be adjusted to the optimal orientation before cutting. The turntable is integrated with mounting holes in the center of the worktable, resulting in a compact structure and space-saving design.

[0012] Preferably, the rotating disk includes an upper disk body and a lower disk body that are assembled and fixed together. A first negative pressure chamber is provided between the upper disk body and the lower disk body. The upper disk body is provided with a plurality of first adsorption holes that communicate with the first negative pressure chamber. The lower disk body is provided with a first air extraction hole that communicates with the first negative pressure chamber. By extracting air at the first air extraction hole, a negative pressure is formed at the first adsorption hole to firmly adsorb the material so that the rotating disk can drive the material to rotate.

[0013] By adopting the above technical solution, the rotating disk uses an upper and lower disk body combination to form a first negative pressure chamber, and generates negative pressure adsorption force through the first adsorption hole and the first air extraction hole. This design can firmly adsorb materials and prevent them from sliding or deviating when adjusting the rotation direction, ensuring the reliability of the direction adjustment. At the same time, the split structure also facilitates the processing and maintenance of the negative pressure channel, improving the practicality and service life of the mechanism.

[0014] Preferably, the workbench surface is provided with a plurality of second adsorption holes, which are distributed at the discharge end of the workbench. The discharge end of the workbench is provided with a second negative pressure chamber communicating with the plurality of second adsorption holes, and the second negative pressure chamber is connected to a second air extraction hole. The support platform is provided with a third negative pressure chamber, and the surface of the support platform is provided with a third adsorption hole communicating with the third negative pressure chamber. The third negative pressure chamber is connected to a third air extraction hole. When the material on the workbench extends out of the support platform surface, air is extracted at the second and third air extraction holes to create a negative pressure at the second and third adsorption holes, so as to firmly adsorb the material so that the cutting mechanism can cut the material.

[0015] By adopting the above technical solution, negative pressure adsorption structures are set at the discharge end of the worktable and on the surface of the support platform, respectively. This allows the material to be firmly adsorbed and fixed from below when it is pushed onto the support platform and prepared for cutting. This multi-point adsorption method effectively suppresses vibration or displacement of the material during cutting, ensuring the stability of the cutting operation, thereby improving the quality of the cut surface and reducing defects such as chipping and burrs. This is crucial for the processing of precision electronic components.

[0016] Preferably, the dividing mechanism includes a cutter and a translation drive. The cutter slides close to the discharge end of the worktable, and the cutting edge of the cutter protrudes from the surface of the worktable. The translation drive is used to drive the cutter to move back and forth along the extension direction of the cutting gap.

[0017] By adopting the above technical solution, the dividing mechanism drives the cutter to move along the cutting slit through a translational drive component, achieving linear cutting. The cutter slides close to the output end of the worktable with its blade protruding, ensuring the continuity of the cutting action and the effectiveness of the cutting depth. This direct mechanical cutting method is highly efficient, and combined with the precise control of the translational drive component, it can achieve clean and crisp dividing, adapting to high-efficiency production lines.

[0018] Preferably, the material transfer mechanism includes a slide mounted on the frame, a movable seat slidably connected to the slide, a transverse drive for driving the movable seat to move horizontally, a lifting frame slidably connected to the movable seat vertically, and a lifting drive for driving the lifting frame to move up and down, wherein the support platform is connected to the lower end of the lifting frame.

[0019] By adopting the above technical solution, the material transfer mechanism, through the coordinated action of the lateral drive and the lifting drive, drives the carrier platform to move precisely horizontally and vertically. This allows the segmented material units to be smoothly and accurately transferred to the receiving position of the next process, achieving seamless connection between processes and further improving the automation level of the production line and the overall logistics efficiency.

[0020] Preferably, the flipping mechanism includes a flipping shaft rotatably connected to the lifting frame and a flipping drive for driving the flipping shaft to rotate. The length direction of the flipping shaft is consistent with the sliding direction of the cutter, and the flipping shaft is fixedly connected to the bottom of the support platform.

[0021] By adopting the above technical solution, the flipping mechanism drives the flipping shaft to rotate the carrier platform through the flipping drive component. This design is suitable for the unloading of segmented materials, such as dumping the materials into a specific collection device or changing their posture for subsequent operations, thereby completing the final step of the entire processing flow and realizing the automation and diversification of unloading.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. It integrates the functions of transfer, rotation, division, material handling and flipping into one unit, avoiding secondary loading and unloading of materials and repeated positioning, shortening the production cycle, improving production efficiency, and reducing equipment footprint and overall cost; 2. The rotating mechanism can adjust the material direction to ensure accurate segmentation. The segmentation mechanism cuts within the cutting gap with precise positioning. 3. The material transfer and flipping mechanism enables smooth material transfer and automated unloading, meeting the needs of efficient and precise production. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the material structure in an electronic component transfer and division machine according to an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the overall structure of an electronic component transfer and splitting machine according to an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the internal structure of the rotating mechanism in an electronic component transfer and splitting machine according to an embodiment of this application.

[0026] Figure 4 This is a schematic diagram showing the positional relationship between the transfer mechanism and the division mechanism in an electronic component transfer and division machine according to an embodiment of this application.

[0027] Figure 5 This is a schematic diagram showing the positional relationship between the material transfer mechanism and the support platform in an electronic component transfer and division machine according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached drawings: 1. Transfer mechanism; 11. Frame; 12. Sliding drive component; 13. Push plate; 14. Worktable; 141. Second suction hole; 142. Second air extraction hole; 2. Rotation mechanism; 21. Rotary disk; 211. Upper disk body; 2111. First suction hole; 212. Lower disk body; 2121. First air extraction hole; 213. First negative pressure chamber; 3. Dividing mechanism; 31. Cutter; 32. Translation drive component; 4. Support platform; 5. Material transfer mechanism; 51. Slide; 52. Moving seat; 53. Lifting drive component; 54. Lateral drive component; 55. Lifting frame; 6. Tilting mechanism; 61. Tilting drive component; 62. Tilting shaft; 7. Cutting gap. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0030] This application discloses an electronic component transfer and splitting machine, referring to... Figure 1 and Figure 2The system includes a transfer mechanism 1, a rotating mechanism 2, a support platform 4, a dividing mechanism 3, a material transfer mechanism 5, and a tilting mechanism 6. The transfer mechanism 1 drives the material to move. The rotating mechanism 2, located within the transfer mechanism 1, rotates the material on the transfer mechanism 1 to adjust its direction. The support platform 4 is positioned parallel to the discharge end of the transfer mechanism 1 and carries the material removed from the transfer mechanism 1. The dividing mechanism 3 is located at the discharge end of the transfer mechanism 1, forming a cutting gap 7 between the support platform 4 and the transfer mechanism 1. The dividing mechanism 3 moves within the cutting gap 7 to cut and separate the material on the support platform 4 from the material on the transfer mechanism 1. The material transfer mechanism 5 drives the support platform 4 to move horizontally and vertically, transferring the divided material to the next process. The flipping mechanism 6 is used to drive the carrier platform 4 to flip so as to complete the unloading action of the divided material. This integrates the functions of transfer, rotation, division, material transfer and flipping into one, realizing the continuous automated processing of electronic component materials, avoiding secondary loading and unloading and repeated positioning of materials, improving production efficiency, and reducing equipment footprint and overall cost.

[0031] Specifically, the transfer mechanism 1 includes a frame 11, a worktable 14, a pusher plate 13, and a sliding drive component 12. The frame 11 serves as the supporting foundation for the entire transfer mechanism 1. The worktable 14 is mounted on the frame 11, providing a horizontal working plane for material placement and movement. Its surface should have a certain degree of flatness and smoothness to reduce friction during material movement. The pusher plate 13 is horizontally slidably connected to the worktable 14. It can be made of materials such as steel or plastic. The pushing part of the pusher plate 13 is perpendicular to the worktable 14, providing a large contact area for the material and enabling smooth material movement. The connecting part of the pusher plate 13 adopts a sliding frame structure parallel to the worktable 14 and is slidably connected to the slide rail at the bottom of the worktable 14. In this embodiment, the sliding drive component 12 is installed on both sides of the worktable 14. Common sliding drive components 12 include cylinders, electric push rods, and transmission chain structures. Taking the transmission chain structure as an example, the connecting part of the push plate 13 is fixedly connected to the chain of the sliding drive component 12. The chain is driven to rotate by a dual-output shaft stepper motor in conjunction with a sprocket. The rotation of the chain drives the push plate 13 to move, accurately pushing the material to the dividing mechanism 3. The sliding drive component 12 drives the push plate 13 to move forward and backward towards the bearing platform 4, pushing the material on the worktable 14 onto the bearing platform 4 and then retracting it. This linear propulsion method is simple and reliable, reducing the shaking and misalignment of the material during the transfer process, and ensuring the positional accuracy of the material when entering the dividing station.

[0032] Reference Figure 2 and Figure 3Specifically, the rotating mechanism 2 includes a rotating disk 21 and a rotating drive component. The rotating disk 21 is rotatably connected to the worktable 14. The worktable 14 has a mounting hole in its center for mounting the rotating disk 21, and the axis of rotation of the rotating disk 21 is perpendicular to the working surface of the worktable 14. The rotating disk 21 includes an upper disk body 211 and a lower disk body 212, which are assembled and fixed together. The upper disk body 211 and the lower disk body 212 can be fixedly connected by bolts or clips. A first negative pressure chamber 213 is provided at the joint between the upper disk body 211 and the lower disk body 212. The upper disk body 211 has several first suction holes 2111 evenly distributed, communicating with the first negative pressure chamber 213. The lower disk body 212 has a first exhaust hole 2121 communicating with the first negative pressure chamber 213. The first exhaust hole 2121 is connected to an independent exhaust device, which can be a fan. When air is drawn from the first suction port 2121, a negative pressure is formed at the first adsorption port 2111, thereby firmly adsorbing the material. A rotary drive is used to rotate the rotating disk 21. Common rotary drives include motors. The motor's output shaft is connected to the central shaft of the rotating disk 21 via a coupling. When the motor starts, it drives the rotating disk 21 to rotate, adjusting the orientation of the material's front end. When the pusher plate 13 passes the working surface of the rotating disk 21, it pushes the material, whose orientation has been adjusted, onto the support platform 4. The rotating disk 21 is designed with upper and lower disk bodies 212 combined to form the first negative pressure chamber 213, which firmly adsorbs the material and prevents it from sliding or shifting during rotational orientation adjustment. The split structure also facilitates the processing and maintenance of the negative pressure channel.

[0033] Reference Figure 4 and Figure 5 Specifically, the workbench 14 has several second adsorption holes 141 on its surface, distributed at the discharge end of the workbench 14. Inside the discharge end of the workbench 14, a second negative pressure chamber is provided, communicating with the second adsorption holes 141. This second negative pressure chamber is connected to a second suction port 142. The second suction port 142 is also controlled by an independent suction device. The support platform 4 has a third negative pressure chamber inside, and its surface has third adsorption holes communicating with this third negative pressure chamber. This third negative pressure chamber is also connected to a third suction port, which is also controlled by an independent suction device. When material extends from the surface of the support platform 4 on the workbench 14, suction is applied through the second and third suction ports 142 and 142, creating negative pressure at these locations and firmly adsorbing and fixing the material from below. This multi-point adsorption method effectively suppresses vibration or displacement of the material during cutting, ensuring the stability of the cutter 31 operation, improving the quality of the cut surface, and reducing defects such as chipping and burrs. It should be noted that when performing material transfer and cutting operations, the support platform 4 and the worktable 14 are on the same plane.

[0034] Specifically, the dividing mechanism 3 includes a cutter 31 and a translation drive 32. The cutter 31 is typically made of high-speed steel or cemented carbide, which has high hardness and wear resistance. The cutter 31 slides close to the discharge end of the worktable 14, and the cutting edge of the cutter 31 protrudes from the surface of the worktable 14, thus ensuring the continuity of the cutting action and the effectiveness of the cutting depth. The translation drive 32 is used to drive the cutter 31 to move back and forth along the extension direction of the cutting gap 7. Common translation drive 32s include linear motors, lead screw and nut mechanisms, or transmission chain structures. Taking the transmission chain structure as an example, the handle of the cutter 31 is fixedly connected to the chain of the translation drive 32. The chain is driven to rotate by a stepper motor in conjunction with a sprocket. The rotation of the chain drives the cutter 31 to move, and the cutter 31 moves in the cutting gap 7 to complete the smooth cutting of the material. Alternatively, if a lead screw and nut mechanism is used, the lead screw is mounted on the frame 11 via bearings, and the nut is connected to the cutter 31. The motor drives the lead screw to rotate, and the nut moves linearly along the lead screw, thereby moving the cutter 31. This direct mechanical cutting method is highly efficient, and with the precise control of the translation drive 32, it can achieve clean and crisp cutting.

[0035] Specifically, the material transfer mechanism 5 includes a slide 51, a movable seat 52, a transverse drive 54, a lifting frame 55, and a lifting drive 53. The slide 51 is located at the frame 11, providing a guide rail for the horizontal movement of the movable seat 52. The movable seat 52 is horizontally slidably connected to the slide 51, and its sliding is achieved through the cooperation of a slider and the guide rail on the slide 51. The transverse drive 54 is used to drive the movable seat 52 to move horizontally, and can also be a cylinder, electric push rod, etc. The lifting frame 55 is vertically slidably connected to the movable seat 52, and its vertical sliding is achieved through the cooperation of a guide column and a guide sleeve. The lifting drive 53 is used to drive the lifting frame 55 to rise and fall, and commonly includes an electric lifting screw or a hydraulic cylinder. The support platform 4 is connected to the lower end of the lifting frame 55. When the material moves onto the support platform, the end of the material abuts against the front position of the lifting frame 55. Using the lifting frame 55 as a limiting plate helps improve the cutting accuracy of the equipment's segmentation action. When the transverse drive 54 and the lifting drive 53 work together, they can drive the carrier platform 4 to move precisely horizontally and vertically, so as to smoothly and accurately transfer the divided material to the receiving position of the next process.

[0036] Specifically, the tilting mechanism 6 includes a tilting shaft 62 and a tilting drive component 61. The tilting shaft 62 is rotatably connected to the lifting frame 55, and its length direction is consistent with the sliding direction of the cutter 31. The tilting shaft 62 is fixedly connected to the bottom of the support platform 4. The tilting drive component 61 is used to drive the tilting shaft 62 to rotate. A common tilting drive component 61 is a combination of a motor and a reducer. The tilting drive component is installed at the lower end of the lifting frame. When the motor starts, it drives the tilting shaft 62 to rotate after being reduced in speed by the reducer, thereby tilting the support platform 4 and completing the unloading action of the segmented material.

[0037] The implementation principle of this embodiment is as follows: This electronic component transfer and dividing machine integrates multiple functions into one unit. The transfer mechanism 1 pushes the material from the workbench 14 to the support platform 4, the rotation mechanism 2 adjusts the material direction, the dividing mechanism 3 cuts the material in the cutting slit 7, the material transfer mechanism 5 transfers the divided material, and the flipping mechanism 6 completes the unloading. This integrated design avoids secondary loading and unloading and repeated positioning of materials between different devices, significantly shortening the production cycle, improving production efficiency, and reducing the equipment's footprint and overall cost. The rotation mechanism 2 ensures accurate dividing orientation, the dividing mechanism 3 provides precise positioning, and the material transfer and flipping mechanisms 6 achieve smooth material transfer and automated unloading, meeting the high-efficiency, precise, and low-cost production requirements of electronic component production lines.

[0038] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An electronic component transfer and dividing machine characterized by comprising: The utility model relates to a kind of material moving device, including: Transfer mechanism (1) for driving material to move; Rotary mechanism (2) is arranged in transfer mechanism (1), and material on transfer mechanism is rotated by rotary mechanism (2) and is rotated in rotation mode, to adjust the direction of material; Supporting table (4) is arranged side by side with the discharge end of the transfer mechanism (1), and is used to support the material removed from the transfer mechanism (1); Segmentation mechanism (3) is arranged at the discharge end of the transfer mechanism (1), and the supporting table (4) and the transfer mechanism (1) form cutting gap (7) between them, and the segmentation mechanism (3) moves in cutting gap (7) to cut and separate the material on the supporting table (4) and the material on the transfer mechanism (1); Material transfer mechanism (5) is used to drive the supporting table (4) to translate and lift, to transfer the segmented material to the next process; Turnover mechanism (6) is used to drive the supporting table (4) to overturn, so as to complete the unloading action of the segmented material.

2. The electronic component transfer and dividing machine according to claim 1, characterized by: The transfer mechanism (1) includes a rack (11), a workbench (14) arranged on the rack (11), a push plate (13) horizontally and slidingly connected to the workbench (14), and a sliding drive (12) arranged at the workbench (14), the sliding drive (12) is used to drive the push plate (13) to advance and retreat towards the supporting table (4), and the material on the workbench (14) is pushed to the supporting table (4) by the push plate (13).

3. The electronic component transfer and dividing machine according to claim 2, characterized by: The rotary mechanism (2) includes a rotary disc (21) rotatably connected to the workbench (14) and a rotary drive for driving the rotary disc (21) to rotate, the workbench (14) is provided with a mounting hole for mounting the rotary disc (21) in the middle, the rotary axis of the rotary disc (21) is perpendicular to the working surface of the workbench (14), when the material is positioned on the rotary disc (21), the rotary drive drives the rotary disc (21) to rotate to adjust the front end of the material to face, when the advancing path of the push plate (13) passes through the working surface of the rotary disc (21) to push the material on the rotary disc (21) to the supporting table (4).

4. The electronic component transfer and dividing machine according to claim 3, characterized by: The rotary disc (21) includes an upper disc body (211) and a lower disc body (212) assembled and fixed up and down, a first negative pressure cavity (213) is arranged between the upper disc body (211) and the lower disc body (212), the upper disc body (211) is provided with a plurality of first suction holes (2111) in communication with the first negative pressure cavity (213), the lower disc body (212) is provided with a first air extraction hole (2121) in communication with the first negative pressure cavity (213), air is extracted at the first air extraction hole (2121) to form negative pressure at the first suction hole (2111) to adsorb the material firmly, so that the rotary disc (21) rotates with the material.

5. The electronic component transfer and dividing machine according to claim 2, characterized by: The workbench (14) is provided with a plurality of second suction holes (141), the second suction holes (141) are distributed at the discharging end of the workbench (14), the discharging end of the workbench (14) is internally provided with a second negative pressure cavity communicated with the second suction holes (141), and the second negative pressure cavity is communicated with a second air suction hole (142); the bearing table (4) is internally provided with a third negative pressure cavity, the bearing table (4) is provided with a third suction hole communicated with the third negative pressure cavity, and the third negative pressure cavity is communicated with a third air suction hole; when the material on the workbench (14) extends out of the surface of the bearing table (4), air is sucked at the second air suction hole (142) and the third air suction hole, so that negative pressure is formed at the second suction hole (141) and the third suction hole, the material is firmly adsorbed, and the cutting mechanism (3) cuts the material.

6. The electronic component transfer and dividing machine according to claim 2, characterized by: The cutting mechanism (3) comprises a cutter (31) and a translation driving element (32), the cutter (31) slides close to the discharging end of the workbench (14), and the blade of the cutter (31) protrudes from the surface of the workbench (14), and the translation driving element (32) is used for driving the cutter (31) to move back and forth along the extension direction of the cutting gap (7).

7. The electronic component transfer and dividing machine according to claim 6, wherein: The material moving mechanism (5) comprises a sliding frame (51) arranged at the rack (11), a moving seat (52) horizontally and slidingly connected to the sliding frame (51), a horizontal movement driving element (54) used for driving the moving seat (52) to move horizontally, a lifting frame (55) vertically and slidingly connected to the moving seat (52), and a lifting driving element (53) used for driving the lifting frame (55) to lift and lower, and the bearing table (4) is connected to the lower end of the lifting frame.

8. The electronic component transfer and dividing machine according to claim 7, characterized by: The turnover mechanism (6) comprises a turnover shaft (62) rotationally connected to the lifting frame (55) and a turnover driving element (61) used for driving the turnover shaft (62) to rotate, the length direction of the turnover shaft (62) is consistent with the sliding direction of the cutter (31), and the turnover shaft (62) is fixedly connected with the bottom of the bearing table (4).

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