Chip plastic package process, plastic package device and semiconductor plastic package piece

Abstract

The invention relates to the technical field of chip processing, in particular to a chip plastic package process, a plastic package device and a semiconductor plastic package piece. According to the technical scheme, the machine table comprises a machine table body, a first hydraulic rod is fixedly connected to the interior of the machine table body, a supporting table is fixedly connected to the output end of the first hydraulic rod, and a mold plate is installed at the top end of the supporting table. And then residual impurities on the surface of the mold plate are blown away through the air blowing structure, by arranging the rotating structure, the direction of blown-out high-pressure air flow can be changed, so that a groove in the surface of the mold plate can be better covered, by arranging the wiping assembly, the surface of the mold plate can be wiped, stubborn dirt can be wiped away, and the cleaning efficiency is improved. And impurities blown off to the surface of the mold plate are wiped away, and the problem that residues and impurities in the mold are difficult to cover areas during cleaning is solved.

Description

TECHNICAL FIELD

[0001] The application relates to the chip processing technical field, in particular to a chip plastic packaging process, a plastic packaging device and a semiconductor plastic packaging piece. BACKGROUND

[0002] The chip belongs to a kind of semiconductor, and the semiconductor is a kind of material with conductivity between conductor and insulator, which can be accurately controlled by doping, temperature, light and other conditions.The unique characteristics make it the core foundation of electronic device manufacturing, and when the semiconductor is processed, the plastic packaging equipment is needed to cover the surface of the bare chip to protect the chip.

[0003] After the chip is plastic packaging, there may be plastic residues and other impurities in the groove inside the mold, so the surface of the mold needs to be cleaned, and the existing cleaning method is generally to use the high-pressure gas pipe held by the operator to spray into the mold to blow up the residues and impurities in the mold, but the operation of the operator's hand-held mode can not cover some areas in the mold groove, which will cause residues and impurities to remain in the uncovered area, therefore, the application provides a chip plastic packaging process, a plastic packaging device and a semiconductor plastic packaging piece. SUMMARY

[0004] The purpose of the application is to solve the problem of residues and impurities in the mold being difficult to cover during cleaning in the background art, and to provide a chip plastic packaging process, a plastic packaging device and a semiconductor plastic packaging piece.

[0005] In the first aspect, the application provides a chip plastic packaging device, which comprises a machine table body, a first hydraulic rod is fixedly connected inside the machine table body, an output end of the first hydraulic rod is fixedly connected with a supporting table, a mold plate is installed at the top end of the supporting table, a mounting table is fixedly connected to the top end of the inner wall of the machine table body, and a mold plate is also installed at the bottom of the mounting table, a display screen is fixedly connected to one side of the machine table body, and the device further comprises a blowing assembly for blowing and cleaning the surfaces of the two groups of mold plates, the blowing assembly comprises a blowing structure, an adjusting structure and a rotating structure. The blowing structure is used to clean the surface of the mold plate by using high-pressure airflow, and the blowing structure comprises a horizontal plate, and a straight pipe is fixedly connected to the bottom of the horizontal plate. The adjusting structure is used to adjust the height of the horizontal plate, so that the horizontal plate can be attached to one side of the mold plate that needs to be cleaned. The rotating structure is used to adjust the direction of the blowing high-pressure airflow, so as to expand the cleaning range. The device further comprises a wiping assembly for wiping the dirt on the surface of the mold plate.

[0006] Optionally, the blowing structure further comprises an output pipe, the output pipe is fixedly connected to the inner wall of the horizontal plate, the straight pipes are fixedly connected to the bottom of the output pipe, the straight pipes are provided in multiple groups and are distributed in parallel on the bottom of the output pipe, the other side of the bottom of the output pipe is fixedly connected with a transmission pipe, the transmission pipe is fixedly connected to the bottom of the horizontal plate, the bottom of the transmission pipe is rotatably connected with an inclined pipe, the inclined pipe is also provided in multiple groups and is distributed in parallel on the bottom of the horizontal plate, the inclined pipe is arranged on one side of the straight pipe, one side of the transmission pipe is fixedly connected with an air inlet pipe, one end of the air inlet pipe extends out of the horizontal plate.

[0007] Optionally, the adjusting structure comprises a mounting plate, the mounting plate is fixedly connected to one side of the machine table body, one side of the mounting plate is fixedly connected with a second hydraulic rod, the output end of the second hydraulic rod is fixedly connected with a side plate, the bottom of one side of the side plate is fixedly connected with a first motor, the output end of the first motor is fixedly connected with a bidirectional screw rod, the outer wall of the bidirectional screw rod is threadedly connected with a nut, one side of the nut is fixedly connected with a connecting block, the connecting block is fixedly connected to the bottom of the horizontal plate, the other side of the nut is fixedly connected with a sliding block, one side of the side plate away from the second hydraulic rod is fixedly connected with a sliding frame, the sliding block is slidingly connected to the inner wall of the sliding frame.

[0008] Optionally, the rotating structure comprises a second motor, the second motor is fixedly connected to one side of the horizontal plate, the output end of the second motor is fixedly connected with a first gear, the outer wall of the first gear is engaged with a toothed belt, the outer wall of the inclined pipe is fixedly connected with a second gear, the number of the second gears is consistent with the number of the inclined pipes, the inner wall of the toothed belt is engaged with the outer walls of multiple second gears, the bottom of the horizontal plate is fixedly connected with a side frame, the toothed belt is arranged in the inner wall of the side frame.

[0009] Optionally, the erasing assembly comprises a first bottom frame, the first bottom frame is fixedly connected to the bottom of the horizontal plate, the inner wall of the first bottom frame is fixedly connected with a first spring, the bottom of the first spring is fixedly connected with a mounting block, the bottom of the mounting block is fixedly connected with a non-woven fabric layer, the bottom of the non-woven fabric layer is attached to the top end of the mold plate, the first spring, the mounting block and the non-woven fabric layer are all provided in multiple groups and are distributed in parallel on the bottom of the horizontal plate, multiple non-woven fabric layers are arranged between the inclined pipes and the straight pipes.

[0010] Optionally, the erasing assembly further comprises a storage frame, the storage frame is mounted in the inner wall of the horizontal plate, the bottom of the storage frame is provided with a circular groove, the inner wall of the circular groove is inserted with a plug, the inner wall of the plug is provided with a communication groove, the communication groove penetrates through the bottom of the plug, one side of the mounting block is fixedly connected with a push plate, the top end of the push plate is fixedly connected with a receiving frame, the top end of the receiving frame is provided with a square groove, the receiving frame is arranged at the bottom of the plug, two groups of transmission pipes are mounted at the bottom of the receiving frame, the transmission pipes are slidingly connected to the inner wall of the first bottom frame, the bottom of the transmission pipe is arranged at the top end of the non-woven fabric layer.

[0011] Optionally, the top end of the horizontal plate is fixedly connected with a feeding pipe, the feeding pipe is funnel-shaped, the bottom of the feeding pipe is fixedly connected with the top end of the storage frame, the inside of the feeding pipe is provided with a sealing block, and the bottom of the sealing block is fixedly connected with a rubber pad.

[0012] Optionally, one side of the bottom of the horizontal plate is fixedly connected with a second bottom frame, the inner wall of the second bottom frame is fixedly connected with a second spring, the bottom of the second spring is fixedly connected with a push block, the bottom of the push block extends out of the inner wall of the second bottom frame, the bottom of the push block is fixedly connected with a water absorption pad, and the water absorption pad is attached to the surface of the mold plate.

[0013] In a second aspect, the application provides a chip plastic packaging process applied to the chip plastic packaging device in the first aspect, which comprises the following steps: S1, cleaning the lead frame to keep it clean, then screening the bare chips, screening out the chips without damage and scratches, and fixing the chips at the specified position of the lead frame through a die bonder; S2, accurately placing the lead frame with completed chip pasting and bonding into a mold cavity, fixing through a positioning pin, ensuring that the chip, pin and cavity position match, and avoiding deviation to cause subsequent plastic packaging defects; S3, driving the mold to close with the fixed mold, applying mold closing pressure to ensure that the mold is sealed to prevent plastic packaging material from overflowing, preheating the softened plastic packaging material, and injecting the plastic packaging material into the mold cavity under high pressure to gradually fill the entire cavity; S4, after the plastic packaging material fills the cavity, maintaining the temperature and pressure in the mold to make the plastic packaging material cross-link under high temperature, change from viscous flow state to solid state, and form a hard packaging body, and the chip can be taken out after solidification, and the excess flash of the chip is cleaned.

[0014] In a third aspect, the application provides a semiconductor plastic packaging piece prepared by the chip plastic packaging process in the second aspect.

[0015] Compared with the prior art, the application has at least one of the following beneficial technical effects: By arranging the adjusting assembly, the height of the two groups of horizontal plates can be adjusted, the two groups of horizontal plates are adjusted to be close to the two groups of mold plates, then the blowing structure is used to blow off the impurities remaining on the surface of the mold plate, by arranging the rotating structure, the direction of the blown high-pressure airflow can be changed, so that the groove on the surface of the mold plate is more easily covered, by arranging the wiping assembly, the surface of the mold plate can be wiped, which is beneficial to wiping the stubborn dirt and wiping the impurities blown onto the surface of the mold plate, and the problem that the residues and impurities in the mold are difficult to cover during cleaning is solved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of a chip plastic packaging process, a plastic packaging device and a semiconductor plastic package. Figure 2 It is a schematic diagram of the overall sectional structure of a chip plastic packaging process, a plastic packaging device and a semiconductor plastic package. Figure 3 It is a schematic diagram of the position of the cross plate and the mold plate. Figure 4 It is a schematic diagram of the sectional structure of the side plate. Figure 5 It is a schematic diagram of the sectional structure of the side plate. Figure 4 It is a schematic diagram of the structure of A of Figure 6 It is a schematic diagram of the structure of B of Figure 4 Figure 7 It is a schematic diagram of the rotating structure. Figure 8 It is a schematic diagram of the sectional structure of the cross plate. Figure 9 It is a schematic diagram of the structure of C of Figure 8 Figure 10 It is a schematic diagram of the structure of the transmission pipe and the air inlet pipe.

[0017] The figure mark: 1, machine body; 2, first hydraulic rod; 3, supporting table; 4, mold plate; 5, mounting table; 6, display screen; 7, mounting plate; 8, second hydraulic rod; 9, side plate; 10, first motor; 11, bidirectional screw rod; 12, nut; 13, connecting block; 14, sliding block; 15, sliding frame; 16, cross plate; 17, output pipe; 18, inclined pipe; 19, transmission pipe; 20, straight pipe; 21, air inlet pipe; 22, second motor; 23, first gear; 24, toothed belt; 25, second gear; 26, side frame; 27, first bottom frame; 28, first spring; 29, mounting block; 30, non-woven fabric layer; 31, storage frame; 32, blocking block; 33, communication groove; 34, receiving frame; 35, transmission pipe; 36, push plate; 37, second bottom frame; 38, second spring; 39, push block; 40, water absorption pad; 41, adding pipe; 42, closing block. DETAILED DESCRIPTION

[0018] The technical solutions of the present application are further described below in combination with the drawings and specific embodiments.

[0019] As Figure 1 - Figure 10 ​​The chip plastic sealing device provided by the present application comprises a machine body 1, a first hydraulic rod 2 fixedly connected inside the machine body 1, a support table 3 fixedly connected to the output end of the first hydraulic rod 2, a mold plate 4 installed at the top end of the support table 3, an installation table 5 fixedly connected to the top end of the inner wall of the machine body 1, another mold plate 4 also installed at the bottom of the installation table 5, a display screen 6 fixedly connected to one side of the machine body 1, and a blowing assembly for blowing and cleaning the surfaces of the two sets of mold plates 4, wherein the blowing assembly comprises a blowing structure, an adjusting structure and a rotating structure. The blowing structure is used for cleaning the surface of the mold plate 4 by using high-pressure airflow. The blowing structure comprises a horizontal plate 16, a straight pipe 20 fixedly connected to the bottom of the horizontal plate 16, and an output pipe 17 fixedly connected to the inner wall of the horizontal plate 16. The straight pipe 20 is fixedly connected to the bottom of the output pipe 17. A plurality of straight pipes 20 are arranged in parallel at the bottom of the output pipe 17. A transmission pipe 19 is fixedly connected to the other side of the bottom of the output pipe 17. The transmission pipe 19 is fixedly connected to the bottom of the horizontal plate 16. An inclined pipe 18 is rotatably connected to the bottom of the transmission pipe 19. A plurality of inclined pipes 18 are arranged in parallel at the bottom of the horizontal plate 16. The inclined pipes 18 are arranged on one side of the straight pipes 20. An air inlet pipe 21 is fixedly connected to one side of the transmission pipe 19. One end of the air inlet pipe 21 extends out of the horizontal plate 16.

[0020] In order to solve the problem that the residues and impurities in the mold are difficult to cover the area during cleaning, when the chip needs to be processed, the chip group can be placed between the two groups of mold plates 4, and the sealing plastic is added to the specified position of the mold plate 4. The first hydraulic rod 2 is used to push the support table 3 and the lower group of mold plates 4 to move upwards, so that the chip group on the lower group of mold plates 4 moves upwards until the chip group is moved between the two groups of mold plates 4. The sealing plastic can be heated to flow to the specified position, so that the surface of the chip is sealed and processed. After the chip processing is completed, the groove of the mold plate 4 needs to be cleaned. The mold is cooled, and when the two groups of horizontal plates 16 need to be moved to the vicinity of the two groups of mold plates 4, the second hydraulic rod 8 is started. The side plate 9 and the horizontal plate 16 are pushed into the machine body 1 by the second hydraulic rod 8 until the horizontal plate 16 moves between the two groups of mold plates 4. Then the first motor 10 is started, and the bidirectional screw 11 is driven to rotate by the first motor 10. When the bidirectional screw 11 rotates, the two groups of nuts 12 arranged on the outer wall will move. When the nut 12 moves, the sliding block 14 on one side will slide in the sliding frame 15, so as to limit the movement of the nut 12 and make the nut 12 move in a straight line. When the nut 12 moves, the two groups of connecting blocks 13 and the horizontal plate 16 will move in opposite directions, so that the two groups of horizontal plates 16 gradually approach the two groups of mold plates 4, which is convenient for cleaning the mold plate 4 in time. When the surface of the mold plate 4 needs to be cleaned, the high-pressure fan outside is started to make the high-pressure airflow enter the air inlet pipe 21, and then pass through the air inlet pipe 21 to the transmission pipe 19 and the straight pipe 20. By arranging the straight pipe 20, the airflow in the transmission pipe 19 can be blown vertically downward, so that the area targeted by the straight pipe 20 can be cleaned. By arranging the inclined pipe 18, the airflow in the transmission pipe 19 can be blown obliquely, so that the surface of the mold plate 4 can be cleaned at different angles. At the same time, the straight pipe 20 and the inclined pipe 18 are arranged in parallel, which is more conducive to cleaning the surface of the mold plate 4. When the surface of the mold plate 4 is cleaned, the second motor 22 is started to drive the first gear 23 on the output end to rotate. When the first gear 23 rotates, the toothed belt 24 meshing with the outer wall will also rotate. When the gear belt rotates, the second gears 25 meshing with it will also rotate. When the second gears 25 rotate, the inclined pipe 18 will also rotate, so that the direction of the inclined pipe 18 can be changed constantly, which can expand the cleaning range of the mold plate 4 and improve the coverage of the area on the mold plate 4. It is conducive to cleaning the surface of the mold plate 4 more cleanly.

[0021] It should be noted that, as Figure 6 , Figure 8 and Figure 9Further comprising a wiping assembly for wiping the surface dirt of the mold plate 4, the wiping assembly comprises a first bottom frame 27 fixedly connected to the bottom of the horizontal plate 16, the inner wall of the first bottom frame 27 is fixedly connected with a first spring 28, the bottom of the first spring 28 is fixedly connected with a mounting block 29, the bottom of the mounting block 29 is fixedly connected with a non-woven fabric layer 30, the bottom of the non-woven fabric layer 30 is attached to the top end of the mold plate 4, the first spring 28, the mounting block 29 and the non-woven fabric layer 30 are all provided with multiple groups and are distributed in parallel on the bottom of the horizontal plate 16, and multiple groups of the non-woven fabric layer 30 are arranged between the inclined pipe 18 and the straight pipe 20.

[0022] When the horizontal plate 16 moves above the mold plate 4, the non-woven fabric layer 30 installed on the horizontal plate 16 contacts the top of the mold plate 4 and provides a downward pushing force to the mounting block 29 and the non-woven fabric layer 30 through the first spring 28, so that the non-woven fabric layer 30 remains attached to the top of the mold plate 4. When cleaning the surface of the mold plate 4, the second hydraulic rod 8 needs to push the horizontal plate 16 to clean other positions on the mold plate 4. When the horizontal plate 16 moves, the mounting block 29 and the non-woven fabric layer 30 below move together. Since the non-woven fabric layer 30 is attached to the top of the mold plate 4 and has a downward pushing force, it is more beneficial to attach to the groove on the mold plate 4 when moving, so that the impurities in the groove are wiped off by the non-woven fabric layer 30, and the surface of the mold plate 4 can be gradually cleaned as the horizontal plate 16 moves. The non-woven fabric layer 30 is arranged between the inclined pipe 18 and the straight pipe 20, which is more beneficial to cooperate with the cleaning of the inclined pipe 18 and the straight pipe 20.

[0023] Further, as Figure 8 and Figure 9The erasing assembly further comprises a storage frame 31 installed on the inner wall of the horizontal plate 16, a circular groove is opened on the bottom of the storage frame 31, a plug 32 is inserted on the inner wall of the circular groove, a communication groove 33 is opened on the inner wall of the plug 32, the communication groove 33 penetrates through the bottom of the plug 32, one side of the mounting block 29 is fixedly connected with a push plate 36, the top end of the push plate 36 is fixedly connected with a receiving frame 34, a square groove is opened on the top end of the receiving frame 34, the receiving frame 34 is arranged on the bottom of the plug 32, two groups of transmission pipes 35 are installed on the bottom of the receiving frame 34, the transmission pipes 35 are slidingly connected on the inner wall of the first bottom frame 27, the bottom of the transmission pipe 19 is arranged on the top end of the non-woven fabric layer 30, the top end of the horizontal plate 16 is fixedly connected with a joining pipe 41, the shape of the joining pipe 41 is funnel-shaped, the bottom of the joining pipe 41 is fixedly connected on the top end of the storage frame 31, a closing block 42 is installed in the joining pipe 41, a rubber pad is fixedly connected on the bottom of the closing block 42, one side of the bottom of the horizontal plate 16 is fixedly connected with a second bottom frame 37, a second spring 38 is fixedly connected on the inner wall of the second bottom frame 37, a push block 39 is fixedly connected on the bottom of the second spring 38, the bottom of the push block 39 protrudes from the inner wall of the second bottom frame 37, a water absorption pad 40 is fixedly connected on the bottom of the push block 39, and the water absorption pad 40 is attached to the surface of the mold plate 4.

[0024] When cleaning of the mold plate 4 surface is required, by adjusting the structure, a set of horizontal plates 16 below can be moved slightly onto the mold plate 4. This causes the non-woven fabric layer 30 and the mounting block 29 on the lower set of horizontal plates 16 to contact the lower set of mold plates 4. Under the pressure of the horizontal plates 16 and the mold plate 4, the non-woven fabric layer 30 and the mounting block 29 move slightly upwards. As the mounting block 29 moves, it pushes the first spring 28 upwards, causing the push plate 36 on one side to move upwards as well. When the push plate 36 moves, it causes the receiving frame 34 to move upwards. When the receiving frame 34 moves upward, it pushes the blocking block 32 upward. When the connecting groove 33 of the blocking block 32 moves to the inner wall of the storage frame 31, the cleaning agent in the storage frame 31 flows into the connecting groove 33 and then flows downward into the receiving frame 34. The cleaning agent in the receiving frame 34 flows downward through the two sets of transfer pipes 35 to the two sets of non-woven fabric layers 30, so that the non-woven fabric layers 30 are soaked with cleaning agent, which helps to soften the residue in the mold plate 4. After being soaked with cleaning agent, the horizontal plate 16 can be reset by adjusting the structure. At this time, the first spring 28 This will push the mounting block 29 and the non-woven fabric layer 30 downwards, simultaneously causing the push plate 36 and the receiving frame 34 to move downwards as well. The blocking block 32 will also move downwards due to gravity and the liquid pressure within the storage frame 31, thus preventing further leakage of the cleaning agent. When the horizontal plate 16 moves, it can simultaneously move the second bottom frame 37, the second spring 38, and the absorbent pad 40. Since the absorbent pad 40 is located behind the non-woven fabric layer 30, it can absorb any residual cleaning agent on the surface of the mold plate 4 as it moves against the mold plate 4 surface. The push force of the second spring 38 can cause the absorbent pad 40 to enter the groove on the mold plate 4, which is more conducive to cleaning the cleaning agent in the mold plate 4. By setting a funnel-shaped inlet tube 41 on the horizontal plate 16, the cleaning agent can be poured into the storage box 31 through the funnel-shaped inlet tube 41. After the addition is completed, the top of the inlet tube 41 can be sealed by the sealing block 42. The rubber pad at the bottom of the sealing block 42 can improve the sealing effect of the inlet tube 41. After the inlet tube 41 is sealed, impurities can be effectively prevented from entering the inlet tube 41.

[0025] A chip molding process, comprising the following steps: S1. Clean the lead frame to keep it clean. Then, screen the bare chips to select those without damage or scratches. Then, use a die bonder to fix the chips in the designated positions on the lead frame. S2. Accurately place the lead frame with the chip pasted and bonded into the mold cavity and fix it with the positioning pin to ensure that the chip and pin are matched with the cavity position and avoid misalignment that may cause subsequent molding defects. S3. The equipment drives the moving mold and the fixed mold to close, applies mold closing pressure, ensures mold sealing, prevents plastic sealant from overflowing, preheats and softens the plastic sealant, and injects it into the mold cavity through the flow channel under high pressure, so that it gradually fills the entire cavity; S4. After the molding compound fills the cavity, maintain the temperature and pressure inside the mold to allow the molding compound to undergo a cross-linking reaction at high temperature, changing from a viscous flow state to a solid state, forming a hard package. After curing, the chip can be removed, and any excess flash on the chip can be cleaned.

[0026] A semiconductor molding compound is manufactured by the aforementioned chip molding process.

[0027] To address the issue of difficult-to-cover areas of residue and impurities within the mold during cleaning, when chip processing is required, the chip assembly can be placed between two sets of mold plates 4. Encapsulating plastic is added to a designated position on the mold plate 4. The first hydraulic rod 2 pushes the support platform 3 and the lower set of mold plates 4 upwards, causing the chip assembly on the lower set of mold plates 4 to move upwards until it is positioned between the two sets of mold plates 4. The encapsulating plastic is then heated, causing the molten plastic to flow to the designated position, thereby encapsulating the chip surface. After chip processing is complete, the grooves in the mold plates 4 need to be cleaned. The molds are first cooled before further processing. To move the two sets of horizontal plates 16 to the vicinity of the two sets of mold plates 4, the second hydraulic rod 8 can be activated. The second hydraulic rod 8 pushes the side plate 9 and horizontal plate 16 into the machine body 1 until the horizontal plate 16 is positioned between the two sets of mold plates 4. Then, the first motor 10 can be activated, driving the bidirectional screw 11 to rotate. When the bidirectional screw 11 rotates, it moves the two sets of nuts 12 on the outer wall. As the nuts 12 move, they cause the slider 14 on one side to slide within the slide frame 15, thus limiting the movement of the nuts 12 and ensuring they move in a straight line. Simultaneously, the movement of the nuts 12 also drives the two sets of connecting blocks 13. The horizontal plates 16 move in the opposite direction to the two sets of mold plates 4, allowing them to gradually approach each other, facilitating timely cleaning of the mold plates 4. When cleaning of the surface of the mold plates 4 is required, an externally installed high-pressure fan can be activated to allow high-pressure airflow into the inlet pipe 21, which then transmits the airflow to the transmission pipe 19 and the straight pipe 20. By installing the straight pipe 20, the airflow in the transmission pipe 19 can be blown vertically downwards, allowing the area aligned with the straight pipe 20 to be cleaned. By installing the inclined pipe 18, the airflow in the transmission pipe 19 can be blown out obliquely, allowing the surface of the mold plates 4 to be cleaned at different angles. Simultaneously, the straight pipe 20 and the inclined pipe 18... The inclined tubes 18 are arranged in parallel, which is more conducive to cleaning the surface of the mold plate 4. When cleaning the surface of the mold plate 4, the second motor 22 can be started. The second motor 22 drives the first gear 23 at the output end to rotate. When the first gear 23 rotates, it will drive the toothed belt 24 meshing with the outer wall to rotate together. When the gear belt rotates, it will drive the multiple sets of second gears 25 meshing with it to rotate. When the second gears 25 rotate, they will drive the inclined tubes 18 to rotate together. Thus, the orientation of the inclined tubes 18 can be continuously changed, which can expand the cleaning range of the mold plate 4 and increase the area covered on the mold plate 4, which is conducive to cleaning the surface of the mold plate 4 more thoroughly. When the horizontal plate 16 moves above the mold plate 4, the non-woven fabric layer 30 mounted on the horizontal plate 16 will contact the upper part of the mold plate 4. The first spring 28 provides a downward thrust to the mounting block 29 and the non-woven fabric layer 30, keeping the non-woven fabric layer 30 in contact with the upper part of the mold plate 4. When cleaning the surface of the mold plate 4, the second hydraulic rod 8 needs to push the horizontal plate 16 to clean other areas of the mold plate 4. As the horizontal plate 16 moves, it will also move the mounting block 29 and the non-woven fabric layer 30 below. Because the non-woven fabric layer 30 is in contact with the upper part of the mold plate 4 and has a downward thrust, it is more conducive to adhering to the grooves on the mold plate 4 during movement, causing impurities in the grooves to be wiped away by the non-woven fabric layer 30. As the horizontal plate 16 moves, the surface of the mold plate 4 can be gradually cleaned. The non-woven fabric layer 30 is positioned between the inclined tube 18 and the straight tube 20, which is more conducive to the cleaning of the inclined tube 18 and the straight tube 20. When it is necessary to clean the surface of the mold plate 4, by adjusting the structure, the lower set of horizontal plates 16 can be moved slightly onto the mold plate 4. After the non-woven fabric layer 30 and the mounting block 29 on the lower set of horizontal plates 16 come into contact with the lower set of mold plates 4, they are squeezed by the horizontal plates 16 and the mold plate 4, causing the non-woven fabric layer 30 and the mounting block 29 to move slightly upward. When the mounting block 29 moves, it pushes the first spring 28 to move upward, and drives the push plate 36 on one side to move upward as well. When the push plate 36 moves, it drives the receiving frame 34 upward. When the receiving frame 34 moves upward, it pushes the blocking block 32 upward. When the connecting groove 33 of the blocking block 32 moves to the inner wall of the storage frame 31, the cleaning agent in the storage frame 31 flows into the connecting groove 33 and then flows downward into the receiving frame 34. The cleaning agent in the receiving frame 34 flows downward through the two sets of transfer pipes 35 to the two sets of non-woven fabric layers 30, so that the non-woven fabric layers 30 are soaked in cleaning agent, which helps to soften the residue in the mold plate 4. After being soaked in cleaning agent, the horizontal plate 16 can be reset by adjusting the structure. At this time, the first spring 28 will push the mounting block 29 and the non-woven fabric layer 30 downward, and at the same time drive the push plate 36 and the receiving frame 34 downward together. The blocking block 32 will also move downward with gravity and the liquid in the storage frame 31. The body pressure moves downwards, preventing the cleaning agent from continuing to flow out. When the horizontal plate 16 moves, it can simultaneously drive the second bottom frame 37, the second spring 38, and the absorbent pad 40 to move together. Since the absorbent pad 40 is located behind the non-woven fabric layer 30, it can absorb the residual cleaning agent on the surface of the mold plate 4 when it moves against the surface of the mold plate 4. The pushing force of the second spring 38 can push the absorbent pad 40 into the groove on the mold plate 4, which is more conducive to wiping the cleaning agent in the mold plate 4 cleanly. By setting a funnel-shaped inlet tube 41 on the horizontal plate 16, the cleaning agent can be easily poured into the storage frame 31 through the funnel-shaped inlet tube 41. After the addition is completed, the top of the inlet tube 41 can be sealed by the sealing block 42.The rubber gasket at the bottom of the sealing block 42 improves the sealing effect on the inlet pipe 41, effectively preventing impurities from entering the inlet pipe 41 after it is sealed.

[0028] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A chip encapsulation device, comprising a machine body (1), wherein a first hydraulic rod (2) is fixedly connected inside the machine body (1), a support platform (3) is fixedly connected to the output end of the first hydraulic rod (2), a mold plate (4) is installed on the top of the support platform (3), a mounting platform (5) is fixedly connected to the top of the inner wall of the machine body (1), a mold plate (4) is also installed on the bottom of the mounting platform (5), and a display screen (6) is fixedly connected to one side of the machine body (1), characterized in that: It also includes a blowing assembly for blowing and cleaning the surface of the two sets of mold plates (4), the blowing assembly includes blowing structure, adjustment structure and rotating structure; The blowing structure is used for cleaning the surface of the mold plate (4) by using high pressure airflow, and the blowing structure includes a horizontal plate (16), and the bottom of the horizontal plate (16) is fixedly connected with a straight pipe (20); The adjustment structure is used for adjusting the height of the horizontal plate (16), so that the horizontal plate (16) is attached to the side of the mold plate (4) which needs to be cleaned; The rotating structure is used for adjusting the direction of blowing high pressure airflow, so as to expand the cleaning range; It also includes a wiping assembly for wiping the dirt on the surface of the mold plate (4).

2. The chip plastic sealing device according to claim 1, wherein, The blowing structure further includes an output pipe (17) fixedly connected to the inner wall of the horizontal plate (16), the straight pipe (20) is fixedly connected to the bottom of the output pipe (17), the straight pipe (20) is provided with multiple groups and is parallelly distributed at the bottom of the output pipe (17), the other side of the bottom of the output pipe (17) is fixedly connected with a transmission pipe (19), the transmission pipe (19) is fixedly connected to the bottom of the horizontal plate (16), the bottom of the transmission pipe (19) is rotatably connected with an inclined pipe (18), the inclined pipe (18) is also provided with multiple groups and is parallelly distributed at the bottom of the horizontal plate (16), the inclined pipe (18) is arranged on one side of the straight pipe (20), one side of the transmission pipe (19) is fixedly connected with an air inlet pipe (21), one end of the air inlet pipe (21) extends out of the horizontal plate (16).

3. The chip plastic sealing device according to claim 2, wherein, The adjustment structure includes a mounting plate (7) fixedly connected to one side of the machine table body (1), a second hydraulic rod (8) fixedly connected to one side of the mounting plate (7), an output end of the second hydraulic rod (8) fixedly connected with a side plate (9), a first motor (10) fixedly connected to the bottom of one side of the side plate (9), an output end of the first motor (10) fixedly connected with a bidirectional screw rod (11), an outer wall of the bidirectional screw rod (11) threadedly connected with a nut (12), one side of the nut (12) fixedly connected with a connecting block (13), the connecting block (13) fixedly connected to the bottom of the horizontal plate (16), the other side of the nut (12) fixedly connected with a sliding block (14), one side of the side plate (9) away from the second hydraulic rod (8) fixedly connected with a sliding frame (15), the sliding block (14) slidingly connected to the inner wall of the sliding frame (15).

4. The chip plastic sealing device according to claim 3, characterized in that, The rotating structure includes a second motor (22) fixedly connected to one side of the horizontal plate (16), an output end of the second motor (22) fixedly connected with a first gear (23), an outer wall of the first gear (23) engaged with a toothed belt (24), an outer wall of the inclined pipe (18) fixedly connected with a second gear (25), the number of the second gear (25) consistent with the number of the inclined pipe (18), an inner wall of the toothed belt (24) engaged with the outer wall of multiple second gears (25), the bottom of the horizontal plate (16) fixedly connected with a side frame (26), the toothed belt (24) arranged in the inner wall of the side frame (26).

5. The chip plastic sealing device according to claim 4, wherein, The erasing assembly comprises a first bottom frame (27) fixed at the bottom of the horizontal plate (16), the inner wall of the first bottom frame (27) is fixed with a first spring (28), the bottom of the first spring (28) is fixed with a mounting block (29), the bottom of the mounting block (29) is fixed with a non-woven fabric layer (30), the bottom of the non-woven fabric layer (30) is attached to the top end of the mold plate (4), the first spring (28), the mounting block (29) and the non-woven fabric layer (30) are all provided with multiple groups and are distributed in parallel at the bottom of the horizontal plate (16), and multiple groups of the non-woven fabric layer (30) are arranged between the inclined pipe (18) and the straight pipe (20).

6. The chip plastic sealing device according to claim 5, wherein The erasing assembly further comprises a storage frame (31) installed on the inner wall of the horizontal plate (16), the bottom of the storage frame (31) is provided with a circular groove, the inner wall of the circular groove is inserted with a plug block (32), the inner wall of the plug block (32) is provided with a communication groove (33) penetrating through the bottom of the plug block (32), one side of the mounting block (29) is fixed with a push plate (36), the top end of the push plate (36) is fixed with a receiving frame (34), the top end of the receiving frame (34) is provided with a square groove, the receiving frame (34) is arranged at the bottom of the plug block (32), and the bottom of the receiving frame (34) is provided with two groups of transmission pipes (35) which are slidingly connected to the inner wall of the first bottom frame (27), and the bottom of the transmission pipe (19) is arranged at the top end of the non-woven fabric layer (30).

7. The chip plastic sealing device according to claim 6, wherein The top end of the horizontal plate (16) is fixed with a feeding pipe (41), the feeding pipe (41) is funnel-shaped, the bottom of the feeding pipe (41) is fixed at the top end of the storage frame (31), the inside of the feeding pipe (41) is provided with a sealing block (42), and the bottom of the sealing block (42) is fixed with a rubber pad.

8. The chip plastic sealing device according to claim 7, wherein, The bottom of the horizontal plate (16) is fixed with a second bottom frame (37) on one side, the inner wall of the second bottom frame (37) is fixed with a second spring (38), the bottom of the second spring (38) is fixed with a push block (39), the bottom of the push block (39) protrudes out of the inner wall of the second bottom frame (37), the bottom of the push block (39) is fixed with a water absorption pad (40), and the water absorption pad (40) is attached to the surface of the mold plate (4).

9. A chip plastic sealing process applied to the chip plastic sealing device of claim 8, characterized in that, The process comprises the following steps: S1, clean the lead frame to keep it clean, then screen the bare chips, screen out the chips without damage and scratches, and fix the chips on the specified position of the lead frame through the die bonder; S2, accurately put the lead frame with completed chip pasting and bonding into the mold cavity, fix it through the positioning pin, ensure that the chip, pin and cavity position match, and avoid deviation to cause subsequent plastic packaging defects; S3, drive the movable die and the fixed die to close, apply the mold closing pressure, ensure the mold sealing, prevent the plastic packaging material from overflowing, preheat the softened plastic packaging material, and inject it into the mold cavity through the runner under the high pressure pushing, so that it gradually fills the entire cavity; S4, after the plastic sealing material fills the cavity, the temperature and the pressure in the mold are kept, so that the plastic sealing material has cross-linking reaction at high temperature, changes from viscous flow state to solid state, and forms a hard package body. After the solidification is completed, the chip can be taken out, and the flash of the chip is cleaned.

10. A semiconductor plastic package, characterized by comprising: The semiconductor plastic sealing piece is prepared by the chip plastic sealing process as claimed in claim 9.

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