Transistor pin sleeve assembling machine

Abstract

The invention relates to the technical field of transistor component assembling, and discloses a transistor pin sleeve assembling machine which comprises an assembling table and pipe feeding equipment and further comprises an assembling module, a pipe feeding frame is fixedly installed at the top of the assembling table, the pipe feeding equipment is arranged at the top of the pipe feeding frame, and an assembling frame is fixedly installed at the top of the assembling table; the assembling module comprises an assembling plate, a spacing plate, a spacing hole, a connecting plate, a clamping plate, a clamping spring, an elastic telescopic plate, a detection plate, a detection spring and a limiting groove, the clamping plate is pulled to move rightwards to break away from contact with the transistor, the transistor is in a suspended state at the moment, and after the transistor breaks away from contact with the clamping plate, the elastic telescopic plate is connected with the detection plate. According to the technical scheme, the transistors fall together under the action of the gravity of the transistors, collective falling is achieved by means of the gravity without depending on additional driving parts, the problem of asynchronous discharging or discharging blockage is solved, and then the assembling efficiency of the transistor pin sleeves is improved.

Description

Technical Field

[0001] This invention relates to the field of transistor component assembly technology, and more particularly to a transistor lead sleeve assembly machine. Background Technology

[0002] Transistor pin sleeve assembly machines are used to precisely fit pre-cut insulating sleeves onto the metal pins of transistors, and subsequent processing ensures that the sleeves are reliably fixed, thereby meeting the production requirements of pin insulation protection and anti-oxidation. They are typically used to sleeve standard transistor pins of the same size.

[0003] Patent CN222806472U relates to a transistor lead sleeve assembly machine. It includes a machine base, a material transfer device, a limiting device, and a lead sleeve fitting device. The material transfer device, limiting device, and lead sleeve fitting device are all mounted on the machine base. The material transfer device synchronously moves the transistors on the loading station and the sleeve station in a first direction. The limiting device positions the transistors on the sleeve station. The limiting device and the material transfer device operate alternately and cooperate. The lead sleeve fitting device is used to fit the lead sleeve onto the lead of the transistor located at the sleeve station. In the transistor lead sleeve assembly machine of this patent, the limiting device and the material transfer device can cooperate alternately during the transistor assembly process, making the material transfer process faster, the assembly efficiency higher, and thus improving production efficiency.

[0004] In the aforementioned patent, the limiting device and the material transfer device can work together alternately to make the material transfer process faster and the assembly efficiency higher, thereby improving production efficiency. However, when unloading transistors after the lead sleeve, the gripping mechanism grips the transistors one by one, making it difficult to unload multiple transistors at once, thus reducing assembly efficiency. Furthermore, transistors are usually small in size, making it difficult to visually distinguish whether the transistors are fully clamped by the clamping plate. Therefore, it is necessary to design a transistor lead sleeve assembly machine to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a transistor lead sleeve assembly machine.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A transistor lead sleeve assembly machine includes an assembly table and a tube feeding device, and further includes an assembly module. A tube feeding rack is fixedly mounted on the top of the assembly table, and the tube feeding device is disposed on top of the tube feeding rack. An assembly frame is fixedly mounted on the top of the assembly table. The assembly module includes an assembly plate, a spacer plate, a spacer hole, a connecting plate, a clamping plate, a clamping spring, an elastic telescopic plate, a detection plate, a detection spring, and a limiting groove. The assembly plate is slidably mounted on the top of the assembly frame, the spacer plate is fixedly mounted on the top of the assembly plate, the spacer hole is formed on the top of the assembly plate, the connecting plate is fixedly mounted on the top of the assembly plate, and the clamping plate... The clamping plate is slidably mounted on the top of the assembly plate. The clamping spring is located between the connecting plate and the clamping plate, and can support the clamping plate through the clamping spring. The elastic telescopic plate is fixedly mounted on the top of the clamping plate. The detection plate slides through the left and right walls of the connecting plate. The detection spring is located between the connecting plate and the detection plate, and can support the detection plate through the detection spring. The limiting groove is opened on the top of the assembly plate. Pulling the clamping plate to the right to move it away from the transistor will cause the transistor to be suspended in the air. After the transistor is separated from the clamping plate, the transistor will fall together under its own gravity.

[0007] As a preferred embodiment of the present invention, the elastic telescopic plate contacts the inner wall of the limiting groove, and the detection plate abuts against the free end of the elastic telescopic plate. The detection plate can move laterally synchronously with the elastic telescopic plate by abutting against the free end of the elastic telescopic plate. The clamping plate is used to clamp the transistor.

[0008] As a preferred embodiment of the present invention, the top of the assembly plate is provided with a detection groove, the detection plate is in contact with the inner wall of the detection groove, the detection groove is used to detect whether the transistor is tilted or misaligned, and the elastic telescopic plate is used to limit the clamping plate. The operator can observe whether the transistor is tilted and clamped by the clamping plate by the fit between the detection plate and the left side of the inner wall of the detection groove.

[0009] As a preferred embodiment of the present invention, it further includes a leveling module and a blanking module. The leveling module is used to prevent height deviation of transistor pins, and the blanking module is used to prevent transistor pins from piling up. The leveling module includes a slide groove, a rotating rod, a gear, a rack, a hollow rod, a hollow plate, and a pressing spring. The hollow rod rotates and presses against the top side of the transistor, causing the transistor side to move downward under the pressure of the hollow rod. The slide groove is opened on the top of the assembly plate. The rotating rod is rotatably mounted on the top of the assembly plate. The gear is fixedly mounted on the circumferential surface of the rotating rod. The rack is fixedly mounted on the left side of the assembly plate. The hollow rod is slidably mounted on the circumferential surface of the rotating rod. The hollow plate is fixedly mounted on the circumferential surface of the rotating rod. The pressing spring is disposed between the hollow rod and the hollow plate, and the pressing spring can support the hollow rod.

[0010] As a preferred embodiment of the present invention, the gear meshes with the rack, the bottom of the rack is set as an arc surface, and the side of the hollow rod away from the rotating rod is set as an arc surface. The hollow rod moves upward to compress the compression spring, thereby avoiding excessive compression of the hollow rod that could cause transistor deformation.

[0011] As a preferred embodiment of the present invention, the feeding module includes a feeding trough, an ejector, a feeding plate, an annular plate, and an ejection groove. The ejector pushes out and pushes the transistors stacked on top of the feeding plate. The transistors that are stuck are fed out along the inclined surface of the feeding plate by the ejector action of the ejector. The feeding trough is opened on the top of the assembly table. The ejector is fixedly installed at the bottom of the inner wall of the feeding trough. The feeding plate is slidably installed on the inner wall of the feeding trough. The annular plate is disposed between the feeding trough and the feeding plate. The ejection groove is opened on the top of the feeding plate.

[0012] As a preferred embodiment of the present invention, the feeding module further includes an elastic telescopic block and a speed limiting hole. The elastic telescopic block is fixedly installed on the top of the ejector frame, the speed limiting hole is opened at the fixed end of the elastic telescopic block, and the free end of the elastic telescopic block is fixedly connected to the feeding plate. When the free end of the elastic telescopic block moves obliquely upward, it will draw the gas outside the elastic telescopic block into the interior of the elastic telescopic block through the speed limiting hole.

[0013] As a preferred embodiment of the present invention, the ejector frame contacts the inner wall of the ejector groove, and a sealing ring is provided between the free end of the elastic telescopic block and the fixed end of the elastic telescopic block. The sealing ring can improve the sealing between the free end of the elastic telescopic block and the fixed end of the elastic telescopic block. The annular plate is elastic, and the slow movement of the free end of the elastic telescopic block causes the feed plate to slowly move upward and reset.

[0014] The present invention has the following beneficial effects: 1. In this invention, the operator can observe whether the transistor is tilted and clamped by the clamping plate by measuring the fit between the detection plate and the left side of the inner wall of the detection groove. The fit can quickly identify whether the transistor is tilted or not clamped, and can be adjusted in time before the sleeve process starts. This avoids misalignment between the sleeve and the pin due to abnormal transistor posture, and reduces defects such as misalignment or missing sleeves. After the transistor is released from contact with the clamping plate, the transistor falls collectively under its own gravity. The collective falling by gravity does not require additional driving components and avoids the problems of asynchronous feeding or feeding jamming, thereby improving the assembly efficiency of transistor pin sleeves. 2. This invention prevents differences in sleeve effect caused by different heights by moving the transistor downwards. By moving it downwards, the transistor pins of different heights are brought to the same horizontal reference, thereby ensuring precise alignment between the sleeve and the pins and avoiding inconsistent insertion depth caused by height differences. 3. This invention uses the compression spring to deform and store force when compressed by the hollow rod, thereby avoiding excessive compression of the hollow rod that could cause transistor deformation. The force storage characteristic of the compression spring when it is compressed and deformed can convert the rigid impact force of the hollow rod into elastic force, thereby preventing the transistor from bending due to uncontrolled pressure. 4. This invention pushes the transistors piled on top of the feed plate by ejecting them with an ejector. The stuck transistors are pushed out along the slope of the feed plate by the ejector. Directly pushing the stuck transistors out along the slope can quickly resolve the material accumulation on the top of the feed plate, avoid equipment shutdown for cleaning due to blockage, and prevent squeezing and friction between the piled transistors, thus avoiding damage to the sleeve. 5. This invention uses the free end of the elastic telescopic block to slowly move the unloading plate upwards and reset it. The slow reset ensures that the transistor always remains stably attached to the inclined surface or inner wall of the unloading plate, preventing sudden changes in the support force caused by sudden movement of the plate, thereby preventing it from accidentally bouncing off the inclined surface and ensuring assembly quality. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure proposed in this invention; Figure 2 This is a schematic diagram of a half-section of the assembly platform structure proposed in this invention; Figure 3 This is a schematic diagram of the positional structure of the assembly frame and assembly plate proposed in this invention; Figure 4 This is a schematic diagram of the rack and gear position structure proposed in this invention; Figure 5 This is a schematic diagram of the assembly plate and rack position structure proposed in this invention; Figure 6 This is a schematic diagram of a half-section of the blanking plate structure proposed in this invention; Figure 7 The present invention proposes Figure 6 Enlarged schematic diagram of part A in the middle.

[0016] In the diagram: 1. Assembly table; 2. Pipe rack; 3. Assembly frame; 4. Assembly plate; 5. Spare plate; 6. Spare hole; 7. Connecting plate; 8. Clamping plate; 9. Clamping spring; 10. Elastic telescopic plate; 11. Detection plate; 12. Detection spring; 13. Limiting groove; 141. Slide groove; 142. Rotating rod; 143. Gear; 144. Rack; 145. Hollow rod; 146. Hollow plate; 147. Compression spring; 151. Discharge groove; 152. Ejector frame; 153. Discharge plate; 154. Annular piece; 155. Ejector groove; 156. Elastic telescopic block; 157. Speed ​​limiting hole. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] Reference Figure 1-6 One embodiment of the present invention is: a transistor lead sleeve assembly machine, including an assembly platform 1 and a tube feeding device, and further including an assembly module. A tube feeding rack 2 is fixedly installed on the top of the assembly platform 1, and the tube feeding device is disposed on the top of the tube feeding rack 2. An assembly frame 3 is fixedly installed on the top of the assembly platform 1. The assembly module includes an assembly plate 4, a spacer plate 5, a spacer hole 6, a connecting plate 7, a clamping plate 8, a clamping spring 9, an elastic telescopic plate 10, a detection plate 11, a detection spring 12, and a limiting groove 13. The assembly plate 4 is slidably installed on the top of the assembly frame 3, the spacer plate 5 is fixedly installed on the top of the assembly plate 4, the spacer hole 6 is opened on the top of the assembly plate 4, and the connecting plate 7 is fixedly installed on the assembly module. At the top of the assembly plate 4, the clamping plate 8 is slidably installed on the top of the assembly plate 4, and the clamping spring 9 is set between the connecting plate 7 and the clamping plate 8. The clamping spring 9 can support the clamping plate 8. The elastic telescopic plate 10 is fixedly installed on the top of the clamping plate 8. The detection plate 11 slides through the left and right walls of the connecting plate 7. The detection spring 12 is set between the connecting plate 7 and the detection plate 11. The detection spring 12 can support the detection plate 11. The limiting groove 13 is opened at the top of the assembly plate 4. It can achieve collective falling by gravity without relying on additional driving components, and avoid the problems of asynchronous feeding or feeding jamming, thereby improving the assembly efficiency of transistor pin sleeves.

[0019] The elastic telescopic plate 10 contacts the inner wall of the limiting groove 13, and the detection plate 11 abuts against the free end of the elastic telescopic plate 10. The detection plate 11 can move laterally synchronously with the elastic telescopic plate 10 through the abutment between the detection plate 11 and the free end of the elastic telescopic plate 10. The clamping plate 8 is used to clamp the transistor.

[0020] The top of the assembly board 4 has a detection groove. The detection plate 11 contacts the inner wall of the detection groove. The detection groove is used to detect whether the transistor is tilted or misaligned. The elastic telescopic plate 10 is used to limit the clamping plate 8. The operator can observe whether the transistor is tilted and clamped by the clamping plate 8 by the fit between the detection plate 11 and the left side of the inner wall of the detection groove. The fit can quickly identify the problem of transistor tilt or misalignment. It can be adjusted in time before the sleeve process starts, thereby avoiding the misalignment of the sleeve and pin due to abnormal transistor posture and reducing defects such as misalignment or missing sleeve.

[0021] During operation: Pulling the clamping plate 8 to the right causes the clamping plate 8 to compress the clamping spring 9. The clamping spring 9 deforms and stores force under the compression of the clamping plate 8. At the same time, the clamping plate 8 moves to the right and disengages from the spacer plate 5. The movement of the clamping plate 8 to the right also pushes the detection plate 11 to the right. The movement of the detection plate 11 to the right compresses the clamping spring 9. The clamping spring 9 deforms and stores force under the compression of the detection plate 11. After the clamping plate 8 disengages from the spacer plate 5; Several transistors are placed inside the spacer hole 6, and the clamping plate 8 is released so that the clamping plate 8 moves to the left and resets under the elastic force of the clamping spring 9. The clamping plate 8 moves to the left and resets to contact the transistors and clamps them. If the transistors are correctly placed and not tilted, the clamping plate 8 will move to the left and reset to disengage from the detection plate 11. After the detection plate 11 disengages from the clamping plate 8, the detection plate 11 moves to the left and resets under the elastic force of the detection spring 12. The detection plate 11 moves to the left and resets to fit against the left side of the inner wall of the detection slot. The operator can observe whether the transistors are tilted and clamped by the clamping plate 8 by the degree of fit between the detection plate 11 and the left side of the inner wall of the detection slot. After the transistors are placed and stabilized inside the spacer hole 6, an electric push rod is provided on the front side of the assembly table 1 and the output end of the electric push rod is fixedly connected to the front side of the assembly plate 4. The electric push rod is started and moves to the rear side, causing the assembly plate 4 to move to the rear side intermittently. Assembling plate 4 moves backward intermittently, causing the transistor to move backward as well. At the same time, the tube feeding equipment works in conjunction with the intermittently moving assembly plate 4 to sleeve the transistor pins. After the sleeve is finished, the clamping plate 8 is pulled to the right to disengage from the transistor. At this time, the transistor is in a suspended state. After the transistor is disengaged from the clamping plate 8, the transistors fall together under their own gravity.

[0022] Reference Figure 1-7 Based on the above embodiments, another embodiment of the present invention further includes a leveling module and a feeding module. The leveling module is used to prevent height deviation of transistor pins, and the feeding module is used to prevent transistor pins from piling up. The leveling module includes a slide groove 141, a rotating rod 142, a gear 143, a rack 144, a hollow rod 145, a hollow plate 146, and a pressing spring 147. The slide groove 141 is opened on the top of the assembly plate 4. The rotating rod 142 is rotatably mounted on the top of the assembly plate 4. The gear 143 is fixedly mounted on the circumferential surface of the rotating rod 142. The rack 144 is fixedly mounted on the left side of the assembly plate 4. The hollow rod 145 is slidably mounted on the circumferential surface of the rotating rod 142. The hollow plate 146 is fixedly mounted on the circumferential surface of the rotating rod 142. The pressing spring 147 is disposed between the hollow rod 145 and the hollow plate 146. The pressing spring 147 can support the hollow rod 145. By moving downward, transistor pins of different heights are brought to the same horizontal reference, thereby ensuring that the sleeve and the pin are accurately aligned and avoiding inconsistent insertion depth due to height difference.

[0023] Gear 143 meshes with rack 144. The bottom of rack 144 is set as an arc surface. The side of hollow rod 145 away from rotating rod 142 is set as an arc surface. Hollow rod 145 moves upward to compress compression spring 147, thereby avoiding excessive compression of hollow rod 145 that could cause transistor deformation. The force storage characteristic of compression spring 147 when it is compressed and deformed can convert the rigid impact force of hollow rod 145 into elastic force, thereby preventing transistor bending due to uncontrolled pressure.

[0024] The feeding module includes a feeding trough 151, an ejector 152, a feeding plate 153, an annular plate 154, and an ejection slot 155. The feeding trough 151 is located on the top of the assembly table 1. The ejector 152 is fixedly installed on the bottom of the inner wall of the feeding trough 151. The feeding plate 153 is slidably installed on the inner wall of the feeding trough 151. The annular plate 154 is located between the feeding trough 151 and the feeding plate 153. The ejection slot 155 is located on the top of the feeding plate 153. It directly pushes the retained transistor along the inclined surface to feed material, which can quickly resolve the material accumulation on the top of the feeding plate 153 and avoid equipment shutdown for cleaning due to blockage.

[0025] The unloading module also includes an elastic telescopic block 156 and a speed limiting hole 157. The elastic telescopic block 156 is fixedly installed on the top of the ejector frame 152. The speed limiting hole 157 is opened at the fixed end of the elastic telescopic block 156. The free end of the elastic telescopic block 156 is fixedly connected to the unloading plate 153. When the free end of the elastic telescopic block 156 moves obliquely upward, it will draw the gas outside the elastic telescopic block 156 into the interior of the elastic telescopic block 156 through the speed limiting hole 157, preventing the squeezing and friction between the stacked transistors and avoiding damage to the sleeve.

[0026] The ejector 152 contacts the inner wall of the ejector groove 155. A sealing ring is provided between the free end of the elastic telescopic block 156 and the fixed end of the elastic telescopic block 156. The sealing ring can improve the sealing between the free end of the elastic telescopic block 156 and the fixed end of the elastic telescopic block 156. The annular piece 154 is elastic. The slow movement of the free end of the elastic telescopic block 156 causes the unloading plate 153 to move upward slowly and reset. The slow reset ensures that the transistor always maintains a stable fit with the inclined surface or inner wall of the unloading plate 153, and will not cause a sudden change in the support force due to the sudden movement of the plate, thereby preventing it from accidentally bouncing off the inclined surface and ensuring the assembly quality.

[0027] During operation, the assembly board 4 moves backward, which in turn moves the rack 144 backward. The rack 144 moves backward and squeezes the gear 143. The gear 143 rotates due to the squeezing of the rack 144. The rotation of the gear 143 drives the rotating rod 142 to rotate, which in turn drives the hollow rod 145 to rotate. The rotation of the hollow rod 145 presses against the top side of the transistor. The side of the transistor moves downward due to the pressure of the hollow rod 145. The downward movement of the transistor prevents the difference in sleeve effect caused by different heights. At the same time, the hollow rod 145 moves upward due to the reaction force of squeezing the transistor. The hollow rod 145 moves upward to compress the compression spring 147. The compression spring 147 deforms and stores force under the compression of the hollow rod 145, thereby preventing the transistor from deforming due to excessive compression of the hollow rod 145. As the gear 143 continues to rotate, it drives the rotating rod 142 to continue rotating. The rotating rod 142 continues to rotate, driving the hollow rod 145 to continue rotating. As the hollow rod 145 continues to rotate, it will disengage from the top side of the transistor. After the hollow rod 145 disengages from the top side of the transistor, it moves downward to reset under the elastic force of the compression spring 147.

[0028] The rack 144 moves backward, causing its arc surface to contact the feed plate 153 and press it. The feed plate 153 moves downward under the pressure of the rack 144. The downward movement of the feed plate 153 presses the annular plate 154. The annular plate 154 deforms and stores force under the pressure of the feed plate 153. At the same time, the downward movement of the feed plate 153 causes the ejector 152 to be ejected from the surface of the feed plate 153. The ejector 152 then pushes the transistors piled on top of the feed plate 153. The stranded transistor is ejected by the ejector 152 and fed along the inclined surface of the feed plate 153. As the rack 144 continues to move backward, it will disengage from the feed plate 153. After the feed plate 153 disengages from the rack 144, the feed plate 153 moves upward and resets under the elastic force of the annular plate 154. When the feed plate 153 moves upward, it will pull the free end of the elastic telescopic block 156. The free end of the elastic telescopic block 156 moves obliquely upward due to the pull of the feed plate 153. The oblique upward movement of the free end of the elastic telescopic block 156 will draw the gas outside the elastic telescopic block 156 into the elastic telescopic block 156 through the speed limiting hole 157. The gas outside the elastic telescopic block 156 slowly enters the interior of the elastic telescopic block 156 through the speed limiting hole 157, causing the free end of the elastic telescopic block 156 to move slowly. The slow movement of the free end of the elastic telescopic block 156 causes the feed plate 153 to move upward slowly and reset.

[0029] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A transistor pin-in-can assembly machine comprising an assembly station (1) and a tube feeding device, characterized in that, It also includes assembly module, leveling module and blanking module, the assembly table (1) top fixedly installed for pipe rack (2), the pipe feeding equipment is arranged in the top of pipe rack (2), the assembly table (1) top fixedly installed with assembly frame (3); The assembly module includes assembly plate (4), spacing plate (5), spacing hole (6), adapter plate (7), clamping plate (8), clamping spring (9), elastic expansion plate (10), detection plate (11), detection spring (12) and limit groove (13), the assembly plate (4) is slidably installed on the top of assembly frame (3), the spacing plate (5) is fixedly installed on the top of assembly plate (4), the spacing hole (6) is opened on the top of assembly plate (4), the adapter plate (7) is fixedly installed on the top of assembly plate (4), the clamping plate (8) is slidably installed on the top of assembly plate (4), the clamping spring (9) is arranged between the adapter plate (7) and the clamping plate (8), the elastic expansion plate (10) is fixedly installed on the top of clamping plate (8), the detection plate (11) is slidably penetrated through the left and right walls of adapter plate (7), the detection spring (12) is arranged between the adapter plate (7) and the detection plate (11), and the limit groove (13) is opened on the top of assembly plate (4). The leveling module is used for preventing the height deviation of the transistor pin, and the blanking module is used for preventing the accumulation of the transistor pin.

2. The transistor lead sleeve assembly machine of claim 1, wherein, The elastic expansion plate (10) is in contact with the inner wall of the limit groove (13), the detection plate (11) is in contact with the free end of the elastic expansion plate (10), and the clamping plate (8) is used for clamping the transistor.

3. The transistor lead sleeve assembly machine of claim 2, wherein, The detection groove is opened on the top of the assembly plate (4), the detection plate (11) is in contact with the inner wall of the detection groove, the detection groove is used for detecting whether the transistor is inclined and clamped, and the elastic expansion plate (10) is used for limiting the clamping plate (8).

4. The transistor lead sleeve assembly machine of claim 3, wherein, The leveling module includes sliding groove (141), rotating rod (142), gear (143), rack (144), hollow rod (145), hollow plate (146) and pressing spring (147), the sliding groove (141) is opened on the top of assembly plate (4), the rotating rod (142) is rotatably installed on the top of assembly plate (4), the gear (143) is fixedly installed on the circumferential surface of rotating rod (142), the rack (144) is fixedly installed on the left side of assembly plate (4), the hollow rod (145) is slidably installed on the circumferential surface of rotating rod (142), the hollow plate (146) is fixedly installed on the circumferential surface of rotating rod (142), and the pressing spring (147) is arranged between the hollow rod (145) and the hollow plate (146).

5. The transistor lead sleeve assembly machine of claim 4, wherein, The gear (143) is engaged with the rack (144), the bottom of the rack (144) is provided as an arc surface, and the side, away from the rotating rod (142), of the hollow rod (145) is provided as an arc surface.

6. A transistor lead bushing assembly machine according to claim 5, wherein, The blanking module comprises a blanking groove (151), an ejection frame (152), a blanking plate (153), an annular sheet (154) and an ejection groove (155), the blanking groove (151) is arranged on the top of the assembling table (1), the ejection frame (152) is fixedly installed on the inner wall bottom of the blanking groove (151), the blanking plate (153) is slidingly installed on the inner wall of the blanking groove (151), the annular sheet (154) is arranged between the blanking groove (151) and the blanking plate (153), and the ejection groove (155) is arranged on the top of the blanking plate (153).

7. A transistor lead bushing assembly machine according to claim 6, wherein, The blanking module further comprises an elastic expansion block (156) and a speed limiting hole (157), the elastic expansion block (156) is fixedly installed on the top of the ejection frame (152), the speed limiting hole (157) is arranged on the fixed end of the elastic expansion block (156), and the free end of the elastic expansion block (156) is fixedly connected with the blanking plate (153).

8. The transistor lead sleeve assembly machine of claim 7, wherein, The ejection frame (152) is in contact with the inner wall of the ejection groove (155), a sealing ring is arranged between the free end of the elastic expansion block (156) and the fixed end of the elastic expansion block (156), and the annular sheet (154) is elastic.

Images