A transistor lead sleeve assembling machine

Abstract

The application relates to the field of transistor component assembly technology and discloses a transistor pin sleeve assembling machine which comprises an assembling table and a pipe feeding device and further comprises an assembling module, the top of the assembling table is fixedly provided with a pipe feeding frame, the pipe feeding device is arranged at the top of the pipe feeding frame, and the top of the assembling table is fixedly provided with an assembling frame; the assembling module comprises an assembling plate, a spacing plate, spacing holes, a connecting plate, a clamping plate, clamping springs, an elastic expansion plate, a detection plate, detection springs and limiting grooves; the clamping plate is pulled to move to the right side to be separated from the transistor, so that the transistor is in a suspended state; after the transistor is separated from the clamping plate, the transistor falls under the action of gravity, the collective falling is realized by means of gravity, the transistor does not need to depend on additional driving components, the problems of asynchronous discharging or discharging blockage are avoided, and the assembling efficiency of the transistor pin sleeve is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of transistor component assembly, and particularly relates to a transistor pin sleeve assembling machine. BACKGROUND

[0002] The transistor pin sleeve assembling machine is used for accurately sleeving the pre-cut insulating sleeve on the metal pin of the transistor, and ensuring the fixation of the sleeve through subsequent processing, so as to realize the production demand of pin insulation protection and anti-oxidation, and generally sleeve the standard transistor pin with the same size.

[0003] A patent with the patent number CN222806472U relates to a transistor pin sleeve assembling machine. The machine includes a machine table, a material moving device, a limiting device, and a sleeve assembling device. The material moving device, the limiting device, and the sleeve assembling device are all installed on the machine table. The material moving device is used to synchronously drive the transistors on the loading station and the sleeve station in the first direction. The limiting device is used to position the transistors on the sleeve station. The limiting device and the material moving device alternately operate to cooperate. The sleeve assembling device is used to sleeve the sleeve to the pins of the transistors on the sleeve station. The transistor pin sleeve assembling machine of the patent can alternately cooperate the limiting device and the material moving device during the assembly of the transistor, so that the material moving process is faster, the assembly efficiency is higher, and the production efficiency is improved.

[0004] In the above patent, the limiting device and the material moving device can alternately cooperate to make the material moving process faster and the assembly efficiency higher, thereby improving the production efficiency. However, when discharging the transistors sleeved with the sleeve, the grabbing mechanism grabs the transistors one by one, which is difficult to complete the discharging of multiple transistors at a time and thus reduces the assembly efficiency. In addition, the volume of the transistor is usually small, and it is difficult to intuitively distinguish whether the transistor is clamped by the clamping plate. Therefore, a transistor pin sleeve assembling machine needs to be designed to solve the above problems. SUMMARY

[0005] The present application relates to the technical field of transistor component assembly, and particularly relates to a transistor pin sleeve assembling machine.

[0006] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0007] The application discloses a transistor pin sleeve assembling machine which comprises an assembling table, a pipe feeding device and an assembling module, a pipe rack is fixedly arranged on the top of the assembling table, the pipe feeding device is arranged on the top of the pipe rack, and an assembling rack is fixedly arranged on the top of the assembling table; the assembling module comprises an assembling plate, a spacing plate, spacing holes, a connecting plate, a clamping plate, clamping springs, an elastic expansion plate, a detection plate, detection springs and limiting grooves; the assembling plate is slidably arranged on the top of the assembling rack; the spacing plate is fixedly arranged on the top of the assembling plate; the spacing holes are formed in the top of the assembling plate; the connecting plate is fixedly arranged on the top of the assembling plate; the clamping plate is slidably arranged on the top of the assembling plate; the clamping springs are arranged between the connecting plate and the clamping plate and can support the clamping plate; the elastic expansion plate is fixedly arranged on the top of the clamping plate; the detection plate slidably penetrates through the left and right walls of the connecting plate; the detection springs are arranged between the connecting plate and the detection plate and can support the detection plate; and the limiting grooves are formed in the top of the assembling plate; the clamping plate is pulled to move to the right side and is separated from the transistor, so that the transistor is in a suspended state; after the transistor is separated from the clamping plate, the transistor falls under the action of gravity.

[0008] As a preferred technical scheme of the application, the elastic expansion plate is in contact with the inner wall of the limiting groove, the detection plate is in contact with the free end of the elastic expansion plate, the detection plate can move transversely synchronously with the elastic expansion plate through the contact between the detection plate and the free end of the elastic expansion plate, and the clamping plate is used for clamping the transistor.

[0009] As a preferred technical scheme of the application, the top of the assembling plate is provided with detection grooves, the detection plate is in contact with the inner wall of the detection grooves, the detection grooves are used for detecting whether the transistor is inclined and clamped, and the elastic expansion plate is used for limiting the clamping plate; the operator can observe whether the transistor is inclined and clamped by the clamping plate through the adhesion between the left side of the inner wall of the detection groove and the detection plate.

[0010] As a preferred technical scheme of the application, the transistor pin sleeve assembling machine further comprises a flattening module and a blanking module, the flattening module is used for preventing height deviation of the transistor pin, and the blanking module is used for preventing accumulation of the transistor pin; the flattening module comprises a sliding groove, a rotating rod, a gear, a rack, a hollow rod, a hollow plate and a pressing spring; the hollow rod rotates and presses the side of the top of the transistor; the transistor moves downward under the pressing of the hollow rod; the sliding groove is formed in the top of the assembling plate; the rotating rod is rotatably arranged on the top of the assembling plate; the gear is fixedly arranged on the circumferential surface of the rotating rod; the rack is fixedly arranged on the left side of the assembling plate; the hollow rod is slidably arranged on the circumferential surface of the rotating rod; the hollow plate is fixedly arranged on the circumferential surface of the rotating rod; and the pressing spring is arranged between the hollow rod and the hollow plate and can support the hollow rod.

[0011] As a preferred technical scheme of the present application, the gear is engaged with the rack, the bottom of the rack is provided as a curved surface, and the side of the hollow rod away from the rotating rod is provided as a curved surface; the hollow rod is extruded upward to extrude the pressing spring, thereby avoiding deformation of the transistor caused by excessive extrusion of the hollow rod.

[0012] As a preferred technical scheme of the present application, the discharging module comprises a discharging groove, an ejection frame, a discharging plate, an annular piece and an ejection groove; the ejection frame ejects to push the transistors accumulated on the top of the discharging plate; the accumulated transistors are ejected by the ejection frame and discharged along the inclined surface of the discharging plate; the discharging groove is opened on the top of the assembling table; the ejection frame is fixedly installed on the inner wall bottom of the discharging groove; the discharging plate is slidingly installed on the inner wall of the discharging groove; the annular piece is arranged between the discharging groove and the discharging plate; and the ejection groove is opened on the top of the discharging plate.

[0013] As a preferred technical scheme of the present application, the discharging module further comprises an elastic expansion block and a speed limiting hole; the elastic expansion block is fixedly installed on the top of the ejection frame; the speed limiting hole is opened on the fixed end of the elastic expansion block; and the free end of the elastic expansion block is fixedly connected with the discharging plate; the upward oblique movement of the free end of the elastic expansion block can suck the gas outside the elastic expansion block into the inside of the elastic expansion block through the speed limiting hole.

[0014] As a preferred technical scheme of the present application, the ejection frame is in contact with the inner wall of the ejection groove; a sealing ring is arranged between the free end of the elastic expansion block and the fixed end of the elastic expansion block; the sealing ring can improve the sealing between the free end of the elastic expansion block and the fixed end of the elastic expansion block; the annular piece is elastic; and the slow movement of the free end of the elastic expansion block can make the discharging plate slowly move upward to reset.

[0015] The present application has the following beneficial effects:

[0016] 1. In the present application, the operator can observe whether the transistor is tilted and clamped by the clamping plate by detecting the fit between the detection plate and the left side of the inner wall of the detection groove, thereby quickly identifying the problem of transistor tilting or not being clamped, and timely adjusting before the sleeve process is started, so as to avoid the mispositioning of the sleeve and the pin caused by the abnormal posture of the transistor, reduce defects such as sleeve deviation or missing sleeve, and realize the collective falling of the transistor under the action of gravity after the transistor is separated from the contact with the clamping plate, thereby avoiding the problems of asynchronous discharging or discharging jamming, and improving the assembly efficiency of the transistor pin sleeve.

[0017] 2. In the present application, the height difference between the transistors is prevented by moving the transistors downward, so that the pins of transistors with different heights are at the same horizontal reference, thereby ensuring the accurate alignment of the sleeve and the pin, and avoiding the inconsistent sleeve depth caused by the height difference.

[0018] 3. The invention, by pressing the spring to deform and store force under the extrusion of the hollow rod, thereby avoiding the deformation of the transistor caused by excessive extrusion of the hollow rod, and the storage characteristics of the pressed spring under the extrusion deformation, can convert the rigid impact force of the hollow rod into elastic force, thereby avoiding the bending of the transistor caused by out-of-control pressure;

[0019] 4. The invention, by ejecting the ejection frame and pushing the transistors accumulated on the top of the discharging plate, the accumulated transistors are pushed along the slope of the discharging plate by the ejection of the ejection frame, directly pushing the accumulated transistors along the slope of the discharging plate, which can quickly resolve the material accumulation on the top of the discharging plate, avoid equipment downtime for cleaning due to blockage, and prevent extrusion and friction between the accumulated transistors, and avoid damage to the sleeve;

[0020] 5. The invention, by slowly moving the free end of the elastic expansion block to slowly move the discharging plate upward for resetting, the slow resetting keeps the transistor always in stable contact with the slope or inner wall of the discharging plate, and the sudden change in support force caused by the sudden movement of the plate body is avoided, thereby preventing accidental bouncing along the slope and ensuring assembly quality. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The overall structure diagram of the invention is shown in the figure;

[0022] Figure 2 The half-section structure diagram of the assembly table of the invention is shown in the figure;

[0023] Figure 3 The position structure diagram of the assembly frame and the assembly plate of the invention is shown in the figure;

[0024] Figure 4 The position structure diagram of the rack and pinion of the invention is shown in the figure;

[0025] Figure 5 The position structure diagram of the assembly plate and the rack of the invention is shown in the figure;

[0026] Figure 6 The half-section structure diagram of the discharging plate of the invention is shown in the figure;

[0027] Figure 7 The Figure 6 The enlarged schematic diagram of the structure of part A of the invention is shown in the figure.

[0028] In the figure: 1, assembly table; 2, pipe rack; 3, assembly rack; 4, assembly plate; 5, spacing plate; 6, spacing hole; 7, adapter plate; 8, clamping plate; 9, clamping spring; 10, elastic expansion plate; 11, detection plate; 12, detection spring; 13, limiting groove; 141, sliding groove; 142, rotating rod; 143, gear; 144, rack; 145, hollow rod; 146, hollow plate; 147, pressing spring; 151, blanking groove; 152, ejection rack; 153, blanking plate; 154, annular piece; 155, ejection groove; 156, elastic expansion block; 157, speed limiting hole. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0030] Reference Figures 1-6 An embodiment of the present application is: a transistor pin sleeve assembly machine, comprising an assembly table 1 and a pipe feeding device, further comprising an assembly module, the assembly table 1 is fixedly installed at the top thereof with a pipe rack 2, the pipe feeding device is arranged at the top of the pipe rack 2, and the assembly table 1 is fixedly installed at the top thereof with an assembly rack 3; the assembly module comprises an assembly plate 4, a spacing plate 5, a spacing hole 6, an adapter plate 7, a clamping plate 8, a clamping spring 9, an elastic expansion plate 10, a detection plate 11, a detection spring 12 and a limiting groove 13, the assembly plate 4 is slidingly installed at the top of the assembly rack 3, the spacing plate 5 is fixedly installed at the top of the assembly plate 4, the spacing hole 6 is formed in the top of the assembly plate 4, the adapter plate 7 is fixedly installed at the top of the assembly plate 4, the clamping plate 8 is slidingly installed at the top of the assembly plate 4, the clamping spring 9 is arranged between the adapter plate 7 and the clamping plate 8, the clamping plate 8 can be supported by the clamping spring 9, the elastic expansion plate 10 is fixedly installed at the top of the clamping plate 8, the detection plate 11 slidingly penetrates through the left and right walls of the adapter plate 7, the detection spring 12 is arranged between the adapter plate 7 and the detection plate 11, the detection plate 11 can be supported by the detection spring 12, and the limiting groove 13 is formed in the top of the assembly plate 4. The gravity is used to realize the collective falling without relying on additional driving components, and the problems of asynchronous blanking or blanking jamming are avoided, thereby improving the assembly efficiency of the transistor pin sleeve.

[0031] The elastic expansion plate 10 is in contact with the inner wall of the limiting groove 13, the detection plate 11 is in contact with the free end of the elastic expansion plate 10, the detection plate 11 can move transversely synchronously with the elastic expansion plate 10 through the contact between the detection plate 11 and the free end of the elastic expansion plate 10, and the clamping plate 8 is used for clamping the transistor.

[0032] The detection groove is arranged on the top of the assembly plate 4, the detection plate 11 is in contact with the inner wall of the detection groove, and the detection groove is used for detecting whether the transistor is tilted and clamped. The elastic expansion plate 10 is used for limiting the clamping plate 8. The operator can observe whether the transistor is tilted and clamped by the clamping plate 8 by the fit degree of the detection plate 11 and the left side of the inner wall of the detection groove. The fit degree is used for quickly identifying the problems of the tilted transistor or the unclamped transistor. The problems can be adjusted in time before the sleeve pipe process is started, so that the sleeve pipe and the pin are prevented from being mispositioned due to the abnormal posture of the transistor, and defects such as sleeve deviation or missing sleeve are reduced.

[0033] When working: the clamping plate 8 is pulled to move to the right side, the clamping plate 8 moves to the right side to extrude the clamping spring 9, the clamping spring 9 is deformed and stores power under the extrusion of the clamping plate 8, meanwhile, the clamping plate 8 moves to the right side to separate from the spacer plate 5, and the clamping plate 8 moves to the right side to push the detection plate 11 to move to the right side, the detection plate 11 moves to the right side to extrude the clamping spring 9, and the clamping spring 9 is deformed and stores power under the extrusion of the detection plate 11. After the clamping plate 8 separates from the spacer plate 5,

[0034] A plurality of transistors are placed in the spacing hole 6, and the clamping plate 8 is loosened to reset the clamping plate 8 to move to the left side under the elastic force of the clamping spring 9. The clamping plate 8 moves to the left side to contact the plurality of transistors and clamp the transistors. If the transistors are correctly placed and not tilted, the clamping plate 8 moves to the left side to separate from the detection plate 11. After the detection plate 11 separates from the clamping plate 8, the detection plate 11 moves to the left side to reset under the elastic force of the detection spring 12. The detection plate 11 moves to the left side to reset and is attached to the left side of the inner wall of the detection groove. The operator can observe whether the transistor is tilted and clamped by the clamping plate 8 by the fit degree of the detection plate 11 and the left side of the inner wall of the detection groove. After the transistors are stably placed in the spacing hole 6, the front side of the assembly table 1 is provided with an electric push rod, and the output end of the electric push rod is fixedly connected to the front side of the assembly plate 4. The electric push rod is started to move to the rear side to drive the assembly plate 4 to intermittently move to the rear side.

[0035] The assembly plate 4 intermittently moves to the rear side to drive the transistors to move to the rear side. The sleeve pipe equipment cooperates with the intermittently moving assembly plate 4 to sleeve the transistor pins. After the sleeve pipe is completed, the clamping plate 8 is pulled to move to the right side to separate from the transistors. At this time, the transistors are in a suspended state. After the transistors separate from the clamping plate 8, the transistors fall collectively under the action of their own gravity.

[0036] Reference Figures 1-7On the basis of the above-mentioned embodiment, in another embodiment of the present application, a flattening module and a discharging module are further included, the flattening module is used for preventing the height deviation of the transistor pin, and the discharging module is used for preventing the accumulation of the transistor pin. The flattening module includes a chute 141, a rotating rod 142, a gear 143, a rack 144, a hollow rod 145, a hollow plate 146, and a pressing spring 147. The chute 141 is arranged on the top of the assembling plate 4. The rotating rod 142 is rotatably arranged on the top of the assembling plate 4. The gear 143 is fixedly arranged on the circumferential surface of the rotating rod 142. The rack 144 is fixedly arranged on the left side of the assembling plate 4. The hollow rod 145 is slidably arranged on the circumferential surface of the rotating rod 142. The hollow plate 146 is fixedly arranged on the circumferential surface of the rotating rod 142. The pressing spring 147 is arranged between the hollow rod 145 and the hollow plate 146. The hollow rod 145 is supported by the pressing spring 147. The transistor pins of different heights are moved to the same horizontal reference by moving downward, so that the sleeve and the pin are accurately aligned, and the inconsistent depth caused by the height difference is avoided.

[0037] The gear 143 is engaged with the rack 144. The bottom of the rack 144 is arranged as an arc surface. The side of the hollow rod 145 away from the rotating rod 142 is arranged as an arc surface. The hollow rod 145 is moved upward to extrude the pressing spring 147, so that the transistor is not deformed due to excessive extrusion of the hollow rod 145. When the pressing spring 147 is extruded and deformed, the resilient force of the hollow rod 145 is converted into elastic force by the force storage characteristic of the extruded and deformed pressing spring 147, so that the transistor is not bent due to uncontrolled pressure.

[0038] The discharging module includes a discharging groove 151, an ejection frame 152, a discharging plate 153, an annular piece 154, and an ejection groove 155. The discharging groove 151 is arranged on the top of the assembling table 1. The ejection frame 152 is fixedly arranged on the inner wall bottom of the discharging groove 151. The discharging plate 153 is slidably arranged on the inner wall of the discharging groove 151. The annular piece 154 is arranged between the discharging groove 151 and the discharging plate 153. The ejection groove 155 is arranged on the top of the discharging plate 153. The accumulated material on the top of the discharging plate 153 is quickly resolved by directly pushing the retained transistor along the inclined surface to discharge, so that the equipment is not stopped for cleaning due to blockage.

[0039] The discharging module further includes an elastic expansion block 156 and a speed limiting hole 157. The elastic expansion block 156 is fixedly arranged on the top of the ejection frame 152. The speed limiting hole 157 is arranged on the fixed end of the elastic expansion block 156. The free end of the elastic expansion block 156 is fixedly connected with the discharging plate 153. The obliquely upward movement of the free end of the elastic expansion block 156 will suck the gas outside the elastic expansion block 156 into the inside of the elastic expansion block 156 through the speed limiting hole 157, so that the extrusion and friction between the accumulated transistors are prevented, and the sleeve is not damaged.

[0040] The ejection frame 152 is in contact with the inner wall of the ejection groove 155, a sealing ring is arranged between the free end of the elastic expansion block 156 and the fixed end of the elastic expansion block 156, the sealing property between the free end of the elastic expansion block 156 and the fixed end of the elastic expansion block 156 is improved through the sealing ring, the annular sheet 154 has elasticity, the slow movement of the free end of the elastic expansion block 156 causes the downward movement of the blanking plate 153 to reset, the slow reset causes the transistor to always stably adhere to the inclined surface or the inner wall of the blanking plate 153, and sudden support force mutation caused by the sudden movement of the plate body is avoided, thereby preventing accidental bouncing of the transistor along the inclined surface and ensuring the assembly quality.

[0041] When working, the assembly plate 4 moves to the rear side, which drives the rack 144 to move to the rear side, the rack 144 moves to the rear side, which extrudes the gear 143, the gear 143 is extruded by the rack 144 to rotate, the gear 143 rotates to drive the rotating rod 142 to rotate, the rotating rod 142 rotates to drive the hollow rod 145 to rotate, the hollow rod 145 rotates to press the top side of the transistor, the side of the transistor is pressed downward by the hollow rod 145, the downward movement of the transistor prevents the poor sleeve effect caused by the different heights, and the hollow rod 145 is moved upward by the reaction force of the extruded transistor;

[0042] The hollow rod 145 moves upward to extrude the compression spring 147, the compression spring 147 is deformed and stores energy by the extrusion of the hollow rod 145, so that the transistor is prevented from being deformed due to excessive extrusion of the hollow rod 145, when the gear 143 continues to rotate to drive the rotating rod 142 to continue to rotate, the rotating rod 142 continues to rotate to drive the hollow rod 145 to continue to rotate, the hollow rod 145 continues to rotate to be separated from the contact with the top side of the transistor, after the hollow rod 145 is separated from the contact with the top side of the transistor, the hollow rod 145 moves downward to reset under the elastic force of the compression spring 147.

[0043] The rack 144 moves to the rear side to make the arc surface of the rack 144 contact and extrude the blanking plate 153, the blanking plate 153 is extruded downward by the rack 144, the downward movement of the blanking plate 153 extrudes the annular sheet 154, the annular sheet 154 is deformed and stores energy by the extrusion of the blanking plate 153, and the downward movement of the blanking plate 153 causes the ejection frame 152 to eject the surface of the blanking plate 153, the ejection frame 152 ejects to push the transistor accumulated on the top of the blanking plate 153;

[0044] The ejection of the retained transistor along the slope of the ejection plate 153 is achieved by the ejection of the ejection frame 152, and when the rack 144 continues to move to the rear side, the ejection plate 153 is out of contact with the rack 144, and after the ejection plate 153 is out of contact with the rack 144, the ejection plate 153 is moved upward by the elastic force of the annular sheet 154, and when the ejection plate 153 is moved upward, the free end of the elastic expansion block 156 is pulled, and the free end of the elastic expansion block 156 is moved obliquely upward under the pulling of the ejection plate 153, and the oblique upward movement of the free end of the elastic expansion block 156 will suck the gas outside the elastic expansion block 156 into the inside of the elastic expansion block 156 through the speed-limiting hole 157;

[0045] The slow entry of the gas outside the elastic expansion block 156 into the inside of the elastic expansion block 156 through the speed-limiting hole 157 makes the free end of the elastic expansion block 156 move slowly, and the slow movement of the free end of the elastic expansion block 156 makes the ejection plate 153 move slowly upward to reset.

[0046] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, and any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A transistor pin-in-can assembly machine comprising an assembly station (1) and a tube feeding device, characterized in that, It also includes assembly module, leveling module and blanking module, the assembly table (1) top fixedly installed for pipe rack (2), the pipe feeding equipment is arranged in the top of pipe rack (2), the assembly table (1) top fixedly installed with assembly frame (3); The assembly module includes assembly plate (4), spacing plate (5), spacing hole (6), adapter plate (7), clamping plate (8), clamping spring (9), elastic expansion plate (10), detection plate (11), detection spring (12) and limit groove (13), the assembly plate (4) is slidably installed on the top of assembly frame (3), the spacing plate (5) is fixedly installed on the top of assembly plate (4), the spacing hole (6) is opened on the top of assembly plate (4), the adapter plate (7) is fixedly installed on the top of assembly plate (4), the clamping plate (8) is slidably installed on the top of assembly plate (4), the clamping spring (9) is arranged between the adapter plate (7) and the clamping plate (8), the elastic expansion plate (10) is fixedly installed on the top of clamping plate (8), the detection plate (11) is slidably penetrated through the left and right walls of adapter plate (7), the detection spring (12) is arranged between the adapter plate (7) and the detection plate (11), and the limit groove (13) is opened on the top of assembly plate (4). The leveling module is used for preventing the height deviation of the transistor pin, and the blanking module is used for preventing the accumulation of the transistor pin.

2. The transistor lead sleeve assembly machine of claim 1, wherein, The elastic expansion plate (10) is in contact with the inner wall of the limit groove (13), the detection plate (11) is in contact with the free end of the elastic expansion plate (10), and the clamping plate (8) is used for clamping the transistor.

3. The transistor lead sleeve assembly machine of claim 2, wherein, The detection groove is opened on the top of the assembly plate (4), the detection plate (11) is in contact with the inner wall of the detection groove, the detection groove is used for detecting whether the transistor is inclined and clamped, and the elastic expansion plate (10) is used for limiting the clamping plate (8).

4. The transistor lead sleeve assembly machine of claim 3, wherein, The leveling module includes sliding groove (141), rotating rod (142), gear (143), rack (144), hollow rod (145), hollow plate (146) and pressing spring (147), the sliding groove (141) is opened on the top of assembly plate (4), the rotating rod (142) is rotatably installed on the top of assembly plate (4), the gear (143) is fixedly installed on the circumferential surface of rotating rod (142), the rack (144) is fixedly installed on the left side of assembly plate (4), the hollow rod (145) is slidably installed on the circumferential surface of rotating rod (142), the hollow plate (146) is fixedly installed on the circumferential surface of rotating rod (142), and the pressing spring (147) is arranged between the hollow rod (145) and the hollow plate (146).

5. The transistor lead sleeve assembly machine of claim 4, wherein, The gear (143) is engaged with the rack (144), the bottom of the rack (144) is provided as an arc surface, and the side, away from the rotating rod (142), of the hollow rod (145) is provided as an arc surface.

6. A transistor lead bushing assembly machine according to claim 5, wherein, The blanking module comprises a blanking groove (151), an ejection frame (152), a blanking plate (153), an annular sheet (154) and an ejection groove (155), the blanking groove (151) is arranged on the top of the assembling table (1), the ejection frame (152) is fixedly installed on the inner wall bottom of the blanking groove (151), the blanking plate (153) is slidingly installed on the inner wall of the blanking groove (151), the annular sheet (154) is arranged between the blanking groove (151) and the blanking plate (153), and the ejection groove (155) is arranged on the top of the blanking plate (153).

7. A transistor lead bushing assembly machine according to claim 6, wherein, The blanking module further comprises an elastic expansion block (156) and a speed limiting hole (157), the elastic expansion block (156) is fixedly installed on the top of the ejection frame (152), the speed limiting hole (157) is arranged on the fixed end of the elastic expansion block (156), and the free end of the elastic expansion block (156) is fixedly connected with the blanking plate (153).

8. The transistor lead sleeve assembly machine of claim 7, wherein, The ejection frame (152) is in contact with the inner wall of the ejection groove (155), a sealing ring is arranged between the free end of the elastic expansion block (156) and the fixed end of the elastic expansion block (156), and the annular sheet (154) is elastic.

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