Processor for testing electronic components

Abstract

The invention relates to a technique for reconfiguring an electronic component. According to the present invention, an image obtained by capturing an identification mark of an electronic component loaded on a test bench is analyzed to calculate a temporary region of the electronic component, and then a movement distance (including rotational movement or horizontal movement) for rearranging the electronic component is calculated. Therefore, the electronic component can be finely reconfigured, and the reliability of the electric connection between the electronic component and the test machine can be improved.

Description

Technical Field

[0001] The present invention relates to a processor that electrically connects electronic components to a testing machine to support the testing of electronic components. Background Technology

[0002] A processor for testing electronic components is a device that processes electronic components to enable them to be electrically connected to the testing machine.

[0003] The increasing integration of electronic components, such as semiconductor devices, is leading to a trend of narrower circuit linewidths. Therefore, the precision requirements for connecting electronic components to testing equipment are also becoming increasingly stringent.

[0004] For example, the prior art has 20 The error range should also allow for a good electrical connection between electronic components and the testing machine, but now it is actually required to be 10. or numbers below It is within the error range to date.

[0005] On the other hand, electronic components also include wafers (dies) that are separated from wafers into individual units.

[0006] Chips are packaged or stacked together to produce high-bandwidth memory (HBM) to complete the final product.

[0007] In order to perform subsequent operations on the chip, it is necessary to test the chip.

[0008] Electronic components in wafer form can be tested after the contact pads are electrically connected to the tester.

[0009] Because the gaps between the contact pads are tiny and very thin, chips are easily broken or fractured, making it difficult to develop effective tests for testing electronic components in HBM condition. To address this, the applicant previously filed Korean Patent Publication No. 10-2021-0088373 (hereinafter referred to as "Prior Art").

[0010] The prior art proposes a technique to reconfigure electronic components and align their positions before connecting them to a testing machine.

[0011] Existing technology utilizes a camera to scan electronic components on a test stand (which is referred to as a "chuck" in the prior art) to determine the current position (arbitrary position) of the electronic components, and reduces the error in the position of the electronic components by moving the electronic components to the correct position during position adjustment.

[0012] However, existing technologies have the following problems.

[0013] First, image processing and analysis take a lot of time when analyzing images of electronic components in the captured images to determine the current location.

[0014] Secondly, it is necessary to ensure that the distance between the camera and the electronic components corresponds to the distance at which the electronic components should be included in the image captured by the camera. Therefore, obtaining a clear image becomes correspondingly more difficult. Furthermore, the precision of image analysis is proportionally reduced, and the error range during reconfiguration becomes larger. These problems arise from controlling the position of the electronic components within a few... This causes confusion when the range is within a certain range.

[0015] If the electrical connection between the electronic components and the testing machine is not properly established, the electronic components may be damaged. Therefore, accurate position control of the electronic components is a priority issue that needs to be addressed.

[0016] [Existing Technical Documents] [Patent Documents] (Patent Document 1) Korean Patent Publication No. 10-2021-0088373 Summary of the Invention

[0017] Technical issues There is a need to reduce the time spent on image processing and analysis of electronic components captured by cameras and to achieve precise image processing and analysis of electronic components.

[0018] Technical solution The processing machine for testing electronic components of the present invention includes: a transport shuttle having a transport table capable of transporting electronic components while being loaded; a first robotic arm for loading electronic components onto the transport table located in a first area by operation of the transport shuttle; a second robotic arm for unloading electronic components from the transport table which has been moved from the first area to a second area by operation of the transport shuttle; a test table for loading electronic components unloaded from the transport table by the second robotic arm; a reconfiguration mechanism for reconfiguring electronic components loaded into a temporary area of ​​the test table by the second robotic arm into a correct position area; and a moving mechanism for moving the test table to reconfigure the electronic components into the correct position area using the reconfiguration mechanism; and a connection. The device electrically connects the electronic components mounted on the test bench, which are reconfigured by the reconfiguration mechanism, to the test machine so that the electronic components can be tested; the controller controls the transport shuttle, the first robotic arm, the second robotic arm, the reconfiguration mechanism, the moving mechanism, and the connector, wherein the reconfiguration mechanism includes: a reconfiguration pick-up device capable of holding the electronic components; and a reconfiguration camera, configured separately from the reconfiguration pick-up device. The controller analyzes the image obtained by the reconfiguration camera after capturing the identification mark of the electronic components mounted on the test bench, calculates the temporary area of ​​the electronic components, and then controls the moving mechanism and the reconfiguration pick-up device to move the electronic components from the temporary area to the correct position area.

[0019] The controller directs the reconfigured camera to sequentially capture images of the first and second identification marks located on the electronic component and analyzes the obtained images to calculate the temporary area of ​​the electronic component.

[0020] The reconfiguration pickup and the reconfiguration camera are configured to interact in such a way that at the time when the first electronic component held by the reconfiguration pickup is in the correct position area, the reconfiguration camera is able to capture a first identification mark of a second electronic component adjacent to the first electronic component.

[0021] The reconfigured camera is installed in such a way that, assuming that when the center of the electronic component is being filmed, at least a portion of the edge of the electronic component is out of view.

[0022] The identification mark is formed independently of the circuit pattern on the electronic component.

[0023] The relative position between the identification mark and the circuit pattern is defined.

[0024] The electronic component reconfiguration method of the processor for testing electronic components of the present invention includes the following steps: an image capture step, in which an identification mark of an electronic component on a test bench is captured using a reconfiguration camera; a first calculation step, in which a temporary region of the electronic component is calculated by analyzing the image obtained in the image capture step; a second calculation step, in which a distance is calculated for moving the electronic component from the temporary region calculated in the first calculation step to the correct position region; and a movement step, in which the electronic component on the temporary region is moved to the correct position region by means of the value calculated in the second calculation step, wherein the image capture step uses the reconfiguration camera to capture the identification mark of the electronic component on the test bench.

[0025] The shooting steps include the following steps: a first shooting step, shooting a first identification mark on an electronic component; and a second shooting step, using the reconfigured camera to shoot a second identification mark on the electronic component on the test bench, wherein the first calculation step analyzes the images obtained in the first shooting step and the second shooting step to calculate a temporary area of ​​the electronic component.

[0026] Beneficial effects According to the present invention, the position of electronic components can be controlled within a certain range by using identification marks whose relative positions to circuit patterns are clearly defined. This range allows for improved reliability of processors used for testing electronic components. Attached Figure Description

[0027] Figure 1 This is a conceptual plan view of a processor for testing electronic components according to the first embodiment of the present invention.

[0028] Figure 2 It is applicable to Figure 1 The diagram shows a schematic plan of the transport stage of the processor used for testing electronic components.

[0029] Figure 3 It is applicable to Figure 1 A schematic perspective view of the first robotic arm of the processing machine used for testing electronic components.

[0030] Figure 4 It is used for explanation Figure 3 The first robotic arm is shown in the reference diagram.

[0031] Figure 5 It is applicable to Figure 1 A schematic perspective view of a test bench for a processor used to test electronic components.

[0032] Figure 6 It is for combining to Figure 1 The diagram shows a schematic plan view of the test board of a processor used for testing electronic components.

[0033] Figure 7 It is used for explanation Figure 6 The diagram shows the electrical connections between the test board and the electronic components.

[0034] Figure 8 It is used for explanation Figure 5 A reference diagram of the temporary area on the test bench.

[0035] Figure 9 It is used for explanation Figure 5 The image shows a reference diagram of the correct position area generated on the test bench.

[0036] Figure 10 It is applicable to Figure 1 The diagram shows a schematic of the reconfiguration mechanism of a processor used for testing electronic components.

[0037] Figure 11 It is used for explanation Figure 10 A reference diagram of the electronic components capturing the area of ​​the reconfigured camera on the reconfiguration mechanism.

[0038] Figure 12 Examples of identification markers for various forms are shown.

[0039] Figure 13 and Figure 14 These are reference figures used to compare the prior art with the present invention.

[0040] Figure 15 It is used to explain the applicability Figure 1 The diagram shows a reference image of the moving mechanism of a processor used for testing electronic components.

[0041] Figures 16 to 18 It is used for explanation Figure 5 The reference diagram shows the set line segments generated on the test board.

[0042] Figure 19 and Figure 20 It is used for explanation Figure 4 The reference diagram shows the virtual line segments generated on the test bench.

[0043] Figure 21 It is used for explanation Figure 4 The diagram shows the reference area set on the test bench.

[0044] Figure 22 It is used for explanation Figure 1 The flowchart shown is a process for reconfiguring electronic components executed on a processor used for testing electronic components.

[0045] Figures 23 to 31 It is used for explanation Figure 21The flowchart shown is a reference diagram.

[0046] Figures 32 to 35 This is a reference diagram used to illustrate various examples of identifiers for electronic components.

[0047] Figures 36 to 38 This is a reference diagram used to illustrate other examples of how electronic components can be reconfigured. Detailed Implementation

[0048] Preferred embodiments of the invention will be described in conjunction with the accompanying drawings; however, for the sake of brevity, descriptions of well-known or repetitive structures will be omitted or shortened as much as possible.

[0049] <An overview of the processor used for testing electronic components> Figure 1 This is a conceptual plan view of the processor (TH, hereinafter referred to as "processor") for testing electronic components according to the present invention.

[0050] The processor TH for testing electronic components of the present invention can be divided into a moving area MP, an unloading area LU, a reconfiguration area RP and a connection area CP, including a transport shuttle 100, a first robot arm 210, a second robot arm 220, a test table 300, a vacuum device 400, a reconfiguration mechanism 500, a moving mechanism 600, a connector 700 and a controller 800.

[0051] In the moving area MF, electronic components can be moved between the unloading area LU and the reconfiguration area RP for exchange purposes. For this purpose, a transport shuttle 100 for carrying electronic components is installed on the moving area MP.

[0052] The transport shuttle 100 is equipped for transporting electronic components between the unloading area LU and the reconfiguration area RP.

[0053] The transport shuttle 100 has a movable transport platform 110.

[0054] The transport shuttle 100 may have one or more transport tables 110.

[0055] The transport table 110 can move in one direction. According to a preferred embodiment, the transport table 110 can reciprocate in the X-axis direction.

[0056] When there are multiple transport tables 100, multiple transport tables 110 can be arranged side by side in the Y-axis direction.

[0057] Moreover, multiple transport tables 110 need to move back and forth independently in the X-axis direction.

[0058] The transfer table 110 can move back and forth between the first area A1 on the unloading area LU side and the second area A2 on the reconfiguration area RP side.

[0059] Electronic components can be loaded onto the transport platform 110.

[0060] The transfer table 110 is not a pocket-shaped structure with a mounting slot for electronic components, but a vacuum structure that uses vacuum pressure to fix electronic components placed on a flat surface.

[0061] as Figure 2 The schematic plan view shown shows that the transfer stage 110 has a vacuum hole VH and a vacuum tank VG for vacuum adsorption of electronic components.

[0062] A vacuum port VH is paired with a vacuum tank VG.

[0063] The vacuum pressure entering through the vacuum port VH is evenly distributed through the vacuum tank VG and applied to the electronic components.

[0064] The electronic components can be fixed to the transport stage 110 by vacuum pressure, so they do not move during the process of being loaded onto the transport stage 110 and moving in the X-axis direction. Therefore, as long as the electronic components are precisely placed on the transport stage 110, the tolerance of electronic component position deviation, which has always been a problem, can be minimized.

[0065] Vacuum holes VH and vacuum tanks VG can be configured in a 2×8 row and column configuration, but the loading capacity of the transfer table 110 can be increased or decreased arbitrarily.

[0066] In the unloading area (LU), electronic components can be supplied to or retrieved from the processing unit (TH). That is, electronic components to be tested are supplied to the processing unit (TH) via the unloading area (LU), and tested electronic components are retrieved from the processing unit (TH) via the unloading area. Electronic components can be supplied to or retrieved from the processing unit (TH) by being carried by transporters such as Jedec Trays, Ring Frames, or other customer pallets.

[0067] Electronic components to be tested, located in unloading area LU, are loaded onto transport table 110 located in first area A1. Tested electronic components loaded onto transport table 110 in first area A1 are then unloaded from transport table 110. For this purpose, unloading area LU is equipped with a first robotic arm 210.

[0068] The first robotic arm 210 is equipped for loading or unloading electronic components onto or from the transport table 110.

[0069] In order to use the first robotic arm 210 for unloading operations, the transfer table 110 needs to be moved to the unloading area LU side and located in the first area A1.

[0070] The first robotic arm 210 loads the electronic components to be tested onto the transport table 110 located in the first area A1, or unloads the tested electronic components from the transport table 110 located in the first area A1.

[0071] The first robotic arm 210 has one or more pickers capable of gripping or releasing electronic components.

[0072] The pickup can hold electronic components using vacuum pressure.

[0073] The first robotic arm 210 can be equipped with multiple pickers to increase the workload in a single operation. For example, like... Figure 3 As shown in the schematic diagram, the first robotic arm 210 may have four pickers P1 arranged in a 2×2 row and column configuration. Of course, the number of pickers P1 provided in the first robotic arm 210 can be increased or decreased depending on the implementation.

[0074] Each pickup P1 can be independently raised and lowered to selectively grasp or release electronic components. Therefore, electronic components removed from the transport table 110 by the first robot 210 can be classified according to their test level.

[0075] The system includes a lift E1 that allows each of the pickups P1 of the first robotic arm 210 to move independently. The lift E1 enables the pickups P1 to selectively grasp or release electronic components. Therefore, the position of the electronic components moved to the transport table 110 by the first robotic arm 210 can be individually and precisely adjusted, allowing for individual placement on the transport table 110. Furthermore, the electronic components removed from the transport table 110 by the first robotic arm 210 can be classified according to their test level.

[0076] The first robotic arm 210 may also include a camera C1.

[0077] The first robotic arm 210 can analyze the image captured by the camera C1 before grasping the electronic component and accurately calculate the position of the electronic component before grasping it using the pick-up device P1. In this way, the pick-up device P1 can grasp the electronic component more precisely and place it in the correct position on the transport table 110 accordingly.

[0078] The pickup P1 can be implemented by holding electronic components of various heights.

[0079] For example, the lifting height of the pickup P1 can be determined based on the height of the electronic component preset by the administrator. In this case, if the specifications of the electronic component to be tested are changed, the administrator needs to re-enter the height of the electronic component, which is inconvenient.

[0080] For example, the lifting height of the pickup P1, used to hold or release the electronic component, can be determined by calculating the height of the electronic component from an image captured by the camera C1. In this case, the processor TH automatically recognizes the height of the electronic component and drives the pickup P1 to operate, thus improving ease of use.

[0081] The first robotic arm 210 may also include a rotary machine R1.

[0082] Rotary machine R1, such as Figure 4 As shown, the vertical line in the Z-axis direction is used as the rotation axis to rotate the electronic component ED in the θ-axis direction.

[0083] The rotating mechanism R1 allows each pickup P1 to rotate individually. This enables the first robotic arm 210 to move the electronic component ED not only along the X, Y, and Z axes, but also to rotate it along the θ axis. Specifically, the first robotic arm 210 can correct the deflection of the electronic component ED as captured by the camera C1 before placing it on the transport table 110. Then, the position of the electronic component ED, precisely positioned on the transport table 110 by the first robotic arm 210, is fixed by vacuum pressure. Therefore, the position of the electronic component ED along the X, Y, Z, and θ axes can be precisely adjusted during the movement of the electronic component ED by the first robotic arm 210.

[0084] However, the rotating tool for the electronic component ED can also be equipped separately without using the first robotic arm 210.

[0085] For example, if the first robot arm 210 holds the electronic component ED from the Jedek tray or ring and supplies it to the rotary tool, the rotary tool uses vacuum pressure to fix the electronic component ED and then rotates it to correct its deflection. The electronic component ED, whose deflection has been corrected by the rotary tool, can be re-held by the first robot arm 210 and moved to the transport table 110.

[0086] Figure 3 The first robotic arm 210 in the illustration is provided with four pickers P1. In the case of multiple pickers P1 as described above, the objects held by each picker P1 can be different.

[0087] For example, some pickups P1 hold electronic components ED in a live bug state (terminals facing down), while the remaining pickups P1 hold electronic components ED in a dead bug state (terminals facing up). In this case, all electronic components ED can be processed regardless of their loading state on the Jedek tray or ring rack and supplied to the processor TH, thus improving the usability of the processor TH.

[0088] In the reconfiguration area RP, the electronic components ED to be tested are removed from the transport table 110 and the removed electronic components ED are reconfigured.

[0089] According to this embodiment, two reconfiguration areas RP are symmetrically arranged on both sides, separated by a connection area CP. As mentioned above, having two reconfiguration areas RP increases the processing capacity of the processor TH and the test machine.

[0090] The reconfiguration zone RP is equipped with a second robotic arm 220.

[0091] The second robotic arm 220 unloads the electronic components ED to be tested from the transport table 110 or loads the tested electronic components ED onto the transport table 110.

[0092] In order for the second robotic arm 220 to perform the unloading operation, the transfer table 110 needs to be moved to the reconfiguration area RP side and located in the second area A2.

[0093] The second robotic arm 220 unloads the electronic components to be tested from the transport table 110 located in the second area A2 or loads the tested electronic components from the transport table 110 located in the second area A2.

[0094] Similarly, the second robotic arm 220 has one or more pickers capable of gripping or releasing the electronic component ED. Preferably, multiple pickers can be provided in the second robotic arm 220 to increase the work capacity in a single operation. For example, the second robotic arm 220 can have four pickers arranged in a 2×2 row and column configuration. Of course, the number of pickers provided in the second robotic arm 220 can be increased or decreased depending on the implementation. Moreover, the pickers of the second robotic arm 220 can also be independently raised and lowered to selectively grip or release the electronic component ED.

[0095] The second robotic arm 220 can be equipped with the same operating structure as the first robotic arm 210. However, the number of pickers P1 provided on the first robotic arm 210 and the number of pickers provided on the second robotic arm 220 can also be different. However, in order to reduce the production cost of the second robotic arm 220, individual lifting or rotating tools with pickers may not be used on the second robotic arm 220.

[0096] The second robotic arm 220 unloads the electronic component ED to be tested from the transport table 110 located in the second area A2 and loads it onto the test table 300, which is moved to the reconfiguration area RP.

[0097] Furthermore, the second robotic arm 220 loads the tested electronic components ED, which are mounted on the test bench 300, onto the transfer table 110 located in the second area A2.

[0098] The test stand 300 is equipped to hold the electronic components ED that are unloaded from the transport table 110 by the second robot arm 220.

[0099] as Figure 5 The schematic enlarged view shown shows that the upper surface of the test stage 300 is formed flat. Therefore, the electronic component ED is loaded onto the test stage 300 in a manner that places it on the flat upper surface of the test stage 300.

[0100] When viewing the test bench 300 from a flat surface, it can be seen as follows: Figure 5 The shape shown in (a) is a disk, but it can also be as follows: Figure 5 (b) shows the shape of a square plate.

[0101] According to the present invention, the test stage 300 can move in the X-axis and Y-axis directions or rotate around a vertical line V1 passing through the center of the test stage 300 in the Z-axis direction as a rotation axis.

[0102] Furthermore, the test stage 300 can be raised and lowered by the connector 700 described later.

[0103] Generally, during the movement of electronic components ED towards the test stage 300, impacts or inertia occur. Therefore, the position of the electronic components ED mounted on the test stage 300 may be disturbed due to impacts or inertia. To prevent this problem, a vacuum hole h is formed in the area where the electronic components ED are mounted on the test stage 300. Then, by applying vacuum pressure through the vacuum hole h, the electronic components ED can be fixed to the test stage 300. That is, when the electronic components ED are placed on the test stage 300 by the second robot arm 220, the electronic components ED are directly positioned in their designated locations due to the vacuum pressure. The vacuum adsorption structure of the test stage 300 can be compared with a reference... Figure 2 The vacuum adsorption structure in the transport stage 110 is the same.

[0104] According to a preferred embodiment, a camera C2 may be mounted at the center or one side of the test bench 300. The camera C2 is used to confirm the angular position (position along the θ-axis) of the test board TB, as described later, and for reference later. Figure 6 The description specifies at least one of the test area TZ of the test board TB and the test pin t of the test board TB. However, as long as the position of the corner of the test board TB can be confirmed, the mounting position of the camera C2 can be considered at any position.

[0105] The camera C2 can be divided into a high-magnification camera that confirms the position of each test pin t and a low-magnification camera that confirms the entire test area TZ within a certain area.

[0106] Vacuum unit 400 provides vacuum pressure to vacuum port h located on test stage 300 via vacuum circuit (not shown). Naturally, the vacuum pressure provided by vacuum unit 400 is transmitted to electronic component ED through vacuum port h. Therefore, the position of electronic component ED mounted on test stage 300 can be fixed by the vacuum pressure.

[0107] The vacuum port h can be selectively opened and closed according to the control of the vacuum circuit (not shown). Therefore, the electronic component ED can be fixedly mounted to the test stage 300 or detached from the test stage 300.

[0108] According to the present invention, the electronic components ED to be tested, loaded onto the test bench 300, are precisely reconfigured in the reconfiguration area RP. This will be described in detail later.

[0109] In the connection zone CP, the electronic components ED mounted on the test bench 300, which is moved to the connection zone CP, are electrically connected to the test machine.

[0110] The testing machine has a test board TB for electrical connection between the electronic component ED and the testing machine. Furthermore, the test board TB is integrated with the processor TH. More specifically, the test board TB is integrated with the connection area CP.

[0111] The electronic component ED mounted on the test bench 300 is electrically connected to the test board TB. Therefore, the electronic component ED can ultimately be electrically connected to the test machine through the test board TB.

[0112] The following is a brief description of the test board TB.

[0113] Figure 6 This is a bottom view showing the bottom surface of the test board TB.

[0114] exist Figure 6 In the example shown, although the test board TB is in the form of a disc, the test board TB can also be equipped in the form of a four-corner plate.

[0115] as Figure 6 The bottom view shows test areas TZ arranged on the test board TB, each corresponding to one electronic component ED. Each test area TZ corresponds one-to-one with an electronic component ED mounted on the test bench 300.

[0116] Each test area TZ is equipped with a test pin t that is electrically connected to one electronic component ED.

[0117] The test pins can be the same as the probe pins on the probe card or be other types or shapes of very fine contact pins.

[0118] Test pins t on a single test area TZ form a collection, which is electrically connected to the electronic component ED. Therefore, the test area TZ and the electronic component ED must be perfectly aligned. If the coordinates of the electronic component ED on the test stage 300 in the XY plane are not aligned with the coordinates of the test area TZ, the electrical connection between the electronic component ED and the test machine will be faulty.

[0119] Especially like Figure 7 As illustrated in the conceptual example, if the electronic component ED on the test bench 300 is located at an angular position deflected by a rotation angle θ1 relative to the test area TZ along the θ axis, the electrical connection between the electronic component ED and the test machine will be poor. Therefore, all test areas TZ on the test board TB and all electronic components ED on the test bench 300 must be perfectly aligned.

[0120] The reconfiguration mechanism 500 is equipped to ensure that the test area TZ and the electronic component ED are in perfect alignment.

[0121] According to this embodiment, the electronic component ED is moved from the transport table 110 to the test table 300 by the second robot 220. During this process, the position of the electronic component ED may be incorrect due to factors such as operational errors or impacts of the second robot 220. Therefore, the position or angular position of the electronic component ED loaded onto the test table 300 by the second robot 220 may vary. That is, the electronic component ED loaded on the test table 300 and the test area TZ of the test board TB may not be consistent.

[0122] Of course, if the tolerance range between the electronic component ED and the test area TZ is wide, there is no problem. But in reality, packaged semiconductor components are required to have a tolerance of 30. Precision within 5, while wafers or HBM are required to be 5. To address this issue, the present invention loads the electronic component ED into a temporary area when the second robot 220 moves the electronic component ED from the transport table 110 to the test table 300. Then, the electronic component ED is subsequently repositioned from the temporary area to the correct position area. According to a preferred embodiment, the planar shape and area of ​​the temporary area and the correct position area can be the same as the planar shape and area of ​​the electronic component ED.

[0123] The temporary area is not a preset position, but rather an arbitrary location where the electronic component ED is placed on the test table 300 by the second robot arm 220. That is, the temporary area is not set or fixed by the controller 800, but its location is arbitrarily determined by the second robot arm 220. For example, if the second robot arm 220 places the electronic component ED on the test table 300, the area where the electronic component ED is placed becomes the temporary area BZ. (Exaggerated presentation) Figure 8An example of a temporary region BZ on test bench 300 is shown.

[0124] The correct location area RZ refers to the position where the electronic component ED aligns with the test area TZ. (This is an exaggerated representation.) Figure 9 The relationship between the temporary region BZ and the correct position region RZ on the test bench 300 is shown.

[0125] Although the correct position area RZ can be preset, it can also be set to be consistent with the position and configuration of the test area TZ on the test board TB after the electronic component ED to be tested is loaded onto the test stage 300.

[0126] The reconfiguration mechanism 500 is equipped to reconfigure the position of the electronic component ED, which is loaded onto the test stage 300 by the second robot arm 220, from the temporary area BZ to the correct position area RZ.

[0127] According to this embodiment, the second robot arm 220 loads the electronic component ED to be tested, which is unloaded from the transport table 110, into a temporary area BZ. Then, the reconfiguration mechanism 500 operates to move the electronic component ED from the temporary area BZ to the correct position area RZ. Here, the temporary area BZ includes not only the position in the X and Y axis directions, but also the angular position in the θ axis direction, representing the deflection and rotation state of the electronic component ED.

[0128] For reference, considering only the theoretical design without factoring in machining errors, the spacing between the picks of the second robot 220 can be the same as the spacing between the electronic components placed on the transport table 110. In this case, it is not necessary to adjust the spacing between the electronic components ED that are moved by the second robot 220 from the transport table 110 to the test table 300 or from the test table 300 to the transport table 110. Therefore, production costs can be reduced accordingly. Similarly, the spacing between the picks of the second robot 220 is the spacing between the test areas TZ of the test board TB and can be the same as the spacing between the correct position areas RZ on the test table 300.

[0129] For reference only. Figure 9 The exaggerated map illustrates the difference in distance between the temporary region BZ and the correct location region RZ, but this difference can take many forms. The temporary region BZ and the correct location region RZ may also have only a slight angular difference, depending on the situation.

[0130] On the other hand, like Figure 10 The schematic diagram shown shows that the reconfiguration mechanism 500 includes a reconfiguration pickup 510 and a reconfiguration camera 520.

[0131] The reconfiguration mechanism 500 is fixed in position. For example, the reconfiguration mechanism 500 can be installed in a manner that fixes it to the frame that constitutes the processor TH skeleton.

[0132] The reconfigurable pickup 510 can hold or release the electronic component ED. The reconfigurable pickup 510 can hold the electronic component ED by vacuum pressure.

[0133] The pickup 510 is reconfigured and fixed in the horizontal direction, which serves as the X-axis and Y-axis.

[0134] The camera 520 and the pickup 510 are reconfigured separately.

[0135] The camera 520 and the pickup 510 are reconfigured separately.

[0136] The camera 520 was reconfigured for shooting electronic components (ED). In particular, as... Figure 11 As shown in the example, the camera 520 is reconfigured to capture the identification marks D1 and D2 of the electronic components ED.

[0137] Identification marks D1 and D2 are formed independently of the circuit pattern on the electronic component ED.

[0138] The identification marks D1 and D2 can be patterns, texts, and symbols formed in additional locations during the production stage of electronic components ED, independent of the circuit pattern.

[0139] The identification marks D1 and D2 can take various forms depending on the producer.

[0140] Figure 12 Various examples of identification markers D1 and D2 in different forms are shown.

[0141] The relative positions of the identification marks D1 and D2 and the circuit pattern are defined. Therefore, confirming the positions of the identification marks D1 and D2 allows us to specify the correct position of the circuit pattern.

[0142] The identification markers D1 and D2 can be one or more, and one or more of them can be selected for shooting.

[0143] In this embodiment, there are two identification marks D1 and D2. These two identification marks D1 and D2 can be distinguished as a first identification mark D1 and a second identification mark D2. Of course, there can be more than three identification marks D1 and D2, where two identification marks D1 and D2 on specific locations can be selected identification marks. For example, two identification marks D1 and D2 near diagonal corners can be selected identification marks.

[0144] The first identification mark D1 and the second identification mark D2 are separated from each other, preferably as far apart as possible.

[0145] The two identification markers D1 and D2 can also have different shapes.

[0146] The first identification mark D1 and the second identification mark D2 can be arranged diagonally as much as possible.

[0147] According to a preferred embodiment of the invention, the spacing between the reconfigured camera 520 and the electronic components ED is maintained closer than in the prior art. Therefore, as... Figure 13 As shown, assuming the reconfigured camera 520 takes the center O of the electronic component ED as the shooting center, the entire edge or at least a portion of the electronic component ED is out of view. That is, according to the present invention, the reconfigured camera 520 is installed in such a way that the entire electronic component ED cannot be completely placed within the image I captured by the reconfigured camera 520. Simultaneously, assuming the reconfigured camera 520 takes the center O of the electronic component ED as the shooting center, the two identification marks D1 and D2 are not entirely contained within one image. Therefore, the first identification mark D1 is captured first, followed by the second identification mark D2. That is, two shots are taken sequentially. Of course, the focal distance of the reconfigured camera 520 is set to the distance between the lens of the reconfigured camera 520 and the electronic component ED. Therefore, the first identification mark D1 and the second identification mark D2 of the electronic component ED can be more clearly distinguished in the image captured by the reconfigured camera 520.

[0148] Of course, it can also be achieved by including two identification markers D1 and D2 in one image and taking only one shot.

[0149] Figure 14 (a) shows an image I1 captured by a prior art camera. Figure 14 (b) and (c) show images I2 and I3 captured by the reconfigured camera 520 of the embodiment. Figure 14 (b) is an image I2 of the first identification mark D1 of the electronic component ED. Figure 14 (c) is an image I3 of the second identification mark D2 of the electronic component ED.

[0150] Figure 14If the pixels of images I1, I2, and I3 in (a), (b), and (c) are the same, then compared to image I1 in (a), images I2 and I3 in (b) and (c) can more clearly distinguish the identification marks D1 and D2 of the electronic component ED. According to this invention, the processing and analysis of images I2 and I3 is easier and the time required is reduced. Furthermore, according to this invention, the processing and analysis of images I2 and I3 can be performed with greater precision. Therefore, according to this invention, the current position (coordinates and angular position on the XY plane) of the electronic component ED on the temporary region BZ can be more precisely determined.

[0151] The positions of identification markers D1 and D2 can be accurately identified by comparing them with other specific locations on the test bench 300, or by comparing them with the coordinates of the test bench 300. Through such comparisons, the deflection or position of the electronic component ED in the XY plane can be confirmed.

[0152] According to a preferred embodiment, the reconfiguration pickup 510 and the reconfiguration camera 520 are bundled together into a single module. Therefore, the relative positions of the reconfiguration pickup 510 and the reconfiguration camera 520 are fixed.

[0153] Figure 10 The reconfiguration pickup 510 is fixed, but it can also be equipped in a liftable or rotatable manner depending on the implementation.

[0154] If the reconfigurable pickup 510 is equipped in a height-adjustable manner, the electronic components ED on the test stage 300 can be held or placed on the test stage 300 by lifting the reconfigurable pickup 510.

[0155] If the reconfiguration pickup 510 is equipped in a rotatable manner, the θ-axis direction of the electronic component ED can be corrected by rotating the reconfiguration pickup 510.

[0156] Furthermore, in order to prevent damage caused by excessive pressure applied to the electronic components ED during the gripping process, the reconfigured pickup 510 can be equipped in a manner that can be buffered by a buffer.

[0157] The moving mechanism 600 is used to move the test stand 300.

[0158] In this embodiment, the moving mechanism 600 enables the test stage 300 to rotate and move in the θ-axis direction.

[0159] Furthermore, the moving mechanism 600 in this embodiment can move the test platform 300 horizontally.

[0160] as Figure 15 The schematic enlarged view shown shows that the moving mechanism 600 includes a rotary mover 610 and a horizontal mover 620.

[0161] The rotary mover 610 can use the vertical line V2 passing through the center of the test stage 300 in the Z-axis direction as the rotation axis to rotate and move the test stage 300 in both directions. The reason for rotating and moving the test stage 300 is to reconfigure the electronic components ED on the temporary area BZ to the correct position area RZ after correcting the angular position of the components ED.

[0162] For example, the angular position of the temporary region BZ may not be consistent with the correct position region RZ. This means that the angular position of the electronic component ED on the temporary region BZ is inconsistent with the angular position of the correct position region RZ. Moreover, the angular position of the correct position region RZ is consistent with the angular position of the test area TZ on the test board TB. Therefore, if the angular position of the temporary region BZ is inconsistent with the angular position of the correct position region RZ and deflects, the angular position of the temporary region BZ will be inconsistent with the angular position of the test area TZ. In this case, without correcting the angular position of the electronic component ED on the temporary region BZ, it is not possible to achieve complete consistency between the position of the electronic component ED and the test area TZ. Therefore, when reconfiguring the electronic component ED on the temporary region BZ to the correct position region RZ, the angular position of the electronic component ED needs to be corrected. However, in this embodiment, the reconfiguration pickup 510 is fixed, so as an alternative, the test stage 300 is rotated to correct the angular position of the electronic component ED held by the reconfiguration pickup 510. Of course, if the pickup 510 is reconfigured to be rotatably equipped, the test stage 300 rotation is not required during the reconfiguration process.

[0163] The horizontal mover 620 moves the test platform 300 horizontally in the XY plane.

[0164] The horizontal mover 620 can be distinguished as an X-axis mover 621 and a Y-axis mover 622.

[0165] The X-axis mover 621 can move the test stage 300 horizontally in the X-axis direction.

[0166] The Y-axis mover 622 can move the test stage 300 horizontally in the Y-axis direction.

[0167] According to the present invention, the moving mechanism 600 has two functions.

[0168] The primary function of the moving mechanism 600 is to drive the test station 300 to move horizontally, selectively positioning it between the reconfiguration area RP and the connection area CP. Under this primary function, the horizontal movement of the test station 300 along the X-axis is performed as the main operation. This primary function of the moving mechanism 600 enables the test station 300 to move between the reconfiguration area RP and the connection area CP.

[0169] The second function of the moving mechanism 600 is to move the test stage 300 to reconfigure the electronic component ED using the reconfiguration mechanism 500. In this second function, the main operation performed is to move the test stage 300 horizontally in the X and Y axes and to rotate the test stage 300 using the vertical line V2 as a rotation axis. This second function of the moving mechanism 600 allows the electronic component ED on the temporary area BZ to be moved to the correct position area RZ.

[0170] Furthermore, the electronic component ED can also be placed on the test stage 300 by the second robot 220 using the moving mechanism 600. In this case, it is sufficient for the second robot to move the electronic component ED only in the Y-axis direction.

[0171] Connector 700 electrically connects the electronic component ED loaded on the test stand 300, which is moved to the connection area CP, to the test machine.

[0172] Connector 700 applies pressure to the test board TB above the test bench 300. Therefore, the electronic component ED mounted on the test bench 300 is electrically connected to the test board TB, ultimately connecting the electronic component ED to the test machine. Testing of the electronic component ED is performed with the connector 700 electrically connecting the electronic component ED to the test machine. At this time, the electronic component ED mounted on the test bench 300 should be in a state of reconfiguration from the temporary area BZ to the correct position area RZ through a reconfiguration operation performed in the reconfiguration area RP.

[0173] In this embodiment, the test stage 300 is located below the test board TB. Therefore, the connector 700 is provided to drive the test stage 300 to move up and down.

[0174] According to this embodiment, connector 700 also has two functions.

[0175] The primary function of connector 700 is to pressurize the test bench 300 upwards onto the test board TB, thereby electrically connecting the electronic component ED on the test bench 300 to the test board TB. Here, the electronic component ED is electrically connected to the test board TB through corresponding test areas TZ.

[0176] The second function of connector 700 is to raise the test stage 300 on the reconfiguration area RP, allowing the reconfiguration pickup 310 to hold or release the electronic component ED. Furthermore, the second function of connector 700 is to lower the test stage 300 to prevent interference between the test stage 300 and the electronic component ED held by the reconfiguration pickup 510 when the moving mechanism 600 moves the test stage 300. In other words, the second function of connector 700 is to raise and lower the test stage 300 during the reconfiguration of the electronic component ED. Of course, when the reconfiguration pickup 510 is height-adjustable, it is not necessary for connector 700 to drive the test stage 300 to rise or fall during the reconfiguration process.

[0177] If a lifting tool is provided to drive the reconfiguration pickup 510 to rise and fall, the lifting and falling of the test stage 300 caused by the connector 700 can be omitted during the reconfiguration of the electronic component ED.

[0178] As previously described, according to this embodiment, during the reconfiguration of the electronic component ED, the positions of the reconfiguration pickup 510 and the reconfiguration camera 520 are fixed. Alternatively, the test stage 300 may move horizontally, rotate, or move vertically. Examples will be provided below for further explanation.

[0179] If the reconfiguration pickup 510 needs to hold the electronic component ED on the temporary area BZ for reconfiguration of the electronic component ED, the reconfiguration pickup 510 is fixed and the connector 700 drives the test stage 300 to rise. This puts the reconfiguration pickup 510 in a position where it can hold the electronic component ED loaded onto the test stage 300. Next, while the reconfiguration pickup 510 holds the electronic component ED, the connector 700 lowers the test stage 300. Then, the moving mechanism 600 operates, causing the test stage 300 to rotate and move horizontally, thereby aligning the correct position area RZ where the electronic component ED needs to be loaded with the electronic component ED held by the reconfiguration pickup 510. Finally, the connector 700 drives the test stage 300 to rise again, putting the test stage 300 in a position where it can support the electronic component ED.

[0180] With the electronic component ED supported by the test stage 300, if the electronic component ED is fixed to the test stage 300 by the vacuum pressure provided through the vacuum port h, the pickup 510 is reconfigured to release the grip on the electronic component ED.

[0181] If the pickup 510 is reconfigured to release the grip on the electronic component ED, the connector 700 will allow the test stage 300 to descend.

[0182] As in this embodiment, production costs can be reduced by moving the test stage 300 instead of reconfiguring the pickup 510 during the process of moving the electronic component ED from the temporary area BZ to the correct location area RZ.

[0183] According to a preferred embodiment of the processor TH of the present invention, rotational and horizontal movement of the test stage 300 is required to ensure that the test stage 300 and the test board TB are perfectly aligned. Therefore, if the movement structure of the test stage 300 is further applied to the reconfiguration of electronic components ED, production costs can be reduced.

[0184] The controller 800 controls elements necessary for the proper operation of the processor TH, such as the transport shuttle 100, the first robot 210, the second robot 220, the vacuum unit 400, the reconfiguration mechanism 500, the moving mechanism 600, and the connector 700.

[0185] The controller 800 controls the electronic component ED as follows: if the camera C1 captures an image of the electronic component ED loaded on the Jedek tray or ring frame, the camera analyzes the image by confirming the position of the identification marks D1 and D2 to calculate the degree of deflection of the electronic component ED. If the picker P1 of the first robot arm 210 holds the electronic component ED, the rotary machine R1 is rotated to correct the deflection of the electronic component ED.

[0186] The controller 800 analyzes images obtained by the reconfiguration camera 520 sequentially capturing images of the electronic component ED loaded onto the test stage 300 by the second robotic arm 220 with the first identification mark D1 and the second identification mark D2, and calculates the temporary region BZ of the electronic component ED on the test stage 300. This allows the controller to determine the relative positional relationship between the temporary region BZ and the correct position region RZ, and thus to determine the direction and distance of horizontal movement of the test stage 300 and rotational movement of the reconfiguration pickup 510 required to move the electronic component ED to the correct position region RZ.

[0187] The controller 800 can also calculate the height of the electronic component ED based on the image captured by the camera C1 or the reconfigured camera 520, and determine the lifting height of the pickup P1 or the test platform 300. However, if the height of the electronic component ED is input by the administrator via an additional input tool, the controller 800 determines the lifting height of the pickup P1 and the reconfigured pickup 510 based on the height of the electronic component ED set by the input.

[0188] Next, the operation of the processor TH as described above will be explained.

[0189] First, in the unloading area LU, the first robot arm 210 loads the electronic component ED to be tested onto the transfer table 110 located in the first area A1. During this process, the position of the electronic component in the X-axis, Y-axis, and θ-axis directions can be adjusted.

[0190] Once all electronic components ED are loaded onto the transport table 110, the transport shuttle 100 operates, and the transport table 110 moves to the second area A2. Then, the second robot arm 220 unloads the electronic components ED from the transport table 110 and moves them to the test table 300 on the reconfiguration area RP. At this time, the location of the electronic components ED loaded onto the test table 300 by the second robot arm 220 is a temporary area BZ. Here, the number of electronic components ED that can be loaded onto the test table 300 may exceed the number that can be loaded onto the transport table 110. In this case, the transport table 110 travels back and forth between the first area A1 and the second area A2 more than twice to transport the electronic components ED to be tested. If the loading capacity of the transport table 110 is 16 units and the loading capacity of the test table 300 is 256 units, the transport table 110 needs to travel back and forth 16 times to fill the test table 300.

[0191] If all the electronic components ED to be tested are loaded onto the test bench 300, the controller 800 will activate the reconfiguration mechanism 500, the moving mechanism 600, and the connector 700 to reconfigure the electronic components ED from the temporary area BZ to the correct position area RZ.

[0192] Once the electronic components ED are reconfigured on the test bench 300, the moving mechanism 600 operates to move the test bench 300 to the connection area CP. Then, the connector 700 operates, causing the test bench 300 to rise towards the test board TB side, allowing the electronic components ED and the test machine to make electrical connections.

[0193] Once the testing of the electronic component ED is complete, the connector 700 operates, causing the test stage 300 to descend. The moving mechanism 600 then moves the test stage 300 to the reconfiguration area RP. The second robot 220 then moves the tested electronic component ED to the transport tray 110 located in the second area A2. The transport tray 110, now filled with the tested electronic component ED, moves towards the first area A1. Finally, the first robot 210 unloads the tested electronic component ED from the transport tray 110.

[0194] According to the present invention, two reconfiguration zones RP are configured, each equipped with two second robotic arms 220, two test stands 300, two reconfiguration mechanisms 500, two moving mechanisms 600, and two connectors 700. This is to reduce the downtime of the testing machine and thus improve its uptime.

[0195] For example, suppose that testing of electronic components (EDs) is performed with the test bench 300 on one side perfectly aligned with the test board TB. Then, on the other side of the test bench 300, operations such as removing the tested EDs, replacing them with the EDs to be tested, and reconfiguring the EDs can be performed. This improves the uptime of the processor TH and significantly reduces the downtime of the test machine.

[0196] <Explanation of the correct location area> The test board TB is attached to the processor TH using a rotational connection. Therefore, the angular position of the test board TB may vary slightly depending on the installation precision.

[0197] For example, as presented in an exaggerated way Figure 15 The example shown illustrates how the test board TB can be integrated into the processor TH with the column direction D of the test area TZ deflected by a certain angle α relative to the X-axis direction.

[0198] Therefore, the angular position of the test board TB needs to be accurately determined in relation to the X-axis or Y-axis directions. For this purpose, as mentioned earlier, it may be necessary to install a camera C on the test bench 300 and use this camera C to photograph the test board TB to accurately confirm the arrangement, angular position, and position of the test pins t of the test area TZ. However, if the test board TB can be integrated with the processor TH in a manner that maintains the set angular position, the confirmation of the angular position of the camera C or the test board TB is not required.

[0199] exist Figure 16 In the example shown, the test area TZ can be arranged with a certain angle α deflected relative to the X-axis. Therefore, as... Figure 17 As shown, the controller 800 generates a set line segment SL containing any two reference points L1 and L2 on the image captured by the camera C2. According to a preferred example, the set line segment SL is generated parallel to the column of the test area TZ.

[0200] There are multiple options for the two reference points L1 and L2.

[0201] The two reference points L1 and L2 can be the centers of two test zones TZ that belong to the same column and are separated from each other.

[0202] as Figure 18 As illustrated, the two reference points L1 and L2 can be two additional markers placed at mutually separated locations.

[0203] On the other hand, the electronic component ED needs to be reconfigured on the test bench 300 in a column direction parallel to the set line segment SL. For this purpose, a virtual line segment needs to be generated on the test bench 300. Then, the controller 800 needs to calculate and determine the positional relationship between the virtual line segment and the set line segment SL. According to a preferred example, to simplify the calculation by the controller 800, the virtual line segment can be generated in a manner that is consistent with, or at least parallel to or perpendicular to, the set line segment SL when the test bench 300 and the test board TB are in completely aligned positions. However, most preferably, the virtual line segment and the set line segment SL are generated simultaneously at the point when the test board TB and the test bench 300 are in completely aligned positions.

[0204] If a virtual line segment is generated, the correct position area RZ that is consistent with the test area TZ can be calculated and determined based on the relationship between the set line segment SL and the virtual line segment.

[0205] Based on the first example, a virtual line segment can be generated immediately after the specified line segment SL is generated. Of course, the correct position area RZ is determined as the virtual line segment is generated.

[0206] According to the second example, virtual line segments can be generated when the electronic component ED is loaded into the temporary region BZ. This second example will be explained in more detail below.

[0207] First, the second robotic arm 220 loads the electronic component ED onto the test stage 300. The electronic component ED is then placed in a temporary area BZ. As previously described, the temporary area BZ on the test stage 300 is a variable position that can only be determined after the electronic component ED to be tested has been placed. The planar shape of the temporary area BZ is the same as that of the electronic component ED.

[0208] If the test platform 300 is filled with electronic components ED, the controller 800 identifies two recognition locations to form virtual line segments. This identification process can be performed by the controller 800 using the reconfiguration camera 520 of the movement mechanism 600 and the reconfiguration mechanism 500. That is, the two recognition locations can be identified using images obtained by moving the test platform 300 with the movement mechanism 600 and capturing images with the reconfiguration camera 520.

[0209] There are many ways to choose between two identification locations.

[0210] For example, the two identification locations could be the centers O of two distinct electronic components ED belonging to the same column within the temporary area BZ. In this case, to minimize the error between the virtual line segment and the set line segment SL, the centers O of the two most distant electronic components ED belonging to the same column can be selected as the two identification locations. For example, as... Figure 19The center points O1 and O2 of the two most distantly separated electronic components ED in a certain column of the electronic component ED in the temporary region BZ are selected as two identification points L3 and L4. If the columns of electronic components ED have different lengths, in order to minimize errors, the two identification points L3 and L4 can be the center O of the two most distantly separated electronic components ED in the longest column.

[0211] as Figure 19 The example shown confirms that if two identification locations, L3 and L4, are confirmed, it appears as if the image is exaggerated. Figure 20 The controller 800 generates a virtual line segment GL containing two identification locations L3 and L4. Then, it calculates the relationship (consistent or parallel) between the set line segment SL and the virtual line segment GL, as if... Figure 21 The correct location area RZ is determined. At this time, the correct location area RZ, marked with a thick line, is set to be separated from the temporary area BZ, marked with a thin line, by a width of approximately one column (the spacing between adjacent electronic components).

[0212] If the rotation position of the test stage 300 is adjusted, the arrangement and position of the correct position area RZ generated on the test stage 300 can be consistent with the test area TZ on the test board TB.

[0213] The electronic components ED on the temporary area BZ move to the correct position area RZ in a preset order. Of course, this process utilizes the reconfiguration mechanism 500.

[0214] <Explanation of reconfiguration methods> The electronic components ED on the temporary area BZ of the test bench 300 are precisely reconfigured to the correct position area RZ, enabling them to communicate with the test area TZ of the test board TB. The error range remains consistent within the specified range. To this end, controller 800 appropriately controls reconfiguration mechanism 500, moving mechanism 600, and connector 700, and follows the specified procedures. Figure 22 The flowchart shown reconfigures the electronic component ED. The following section combines... Figure 22 The flowchart shown illustrates the reconfiguration method of electronic components (ED) performed on test bench 300.

[0215] 1. Location Confirmation <s11> If the second robotic arm 200 fills the temporary area BZ of the test bench 300 with electronic components ED, the controller 800 confirms the two pre-set identification locations L3 and L4. Here, pre-setting means that the objects (the center point of the electronic components or additional markings, etc.) for the two identification locations L3 and L4 to be confirmed have been set.

[0216] To confirm the two identification locations L3 and L4, the controller 800 operates the moving mechanism 600 to move the test platform 300 while continuously capturing images of the test platform 300 with the reconfigured camera 520. The controller 800 then analyzes the captured images to confirm the two identification locations L3 and L4.

[0217] as Figure 19 As illustrated, the two identification locations L3 and L4 can be the center points of the two electronic components EDs (hereinafter referred to as "reference components") that are furthest apart in the longest column of the electronic components EDs loaded on the temporary area BZ of the test bench 300.

[0218] 2. Generate virtual line segments <s12> Controller 800 Figure 20 The example shown generates a virtual line segment GL that connects the two identification locations L3 and L4.

[0219] On the other hand, in this embodiment, if a virtual line segment GL is generated, the test platform 300 is rotated so that when the positions of the test platform 300 and the test board TB are completely aligned, the angular position of the virtual line segment GL on the XY plane is aligned with the angular position of the set line segment SL. For example, as exaggeratedly presented... Figure 23 Similarly, if the angular positions of the virtual line segment GL and the set line segment SL are not consistent in the XY plane, the controller 800 uses the rotary mover 610 to rotate the test platform 300 as if... Figure 24 Similarly, on the XY plane, make the angular position of the virtual line segment GL consistent with that of the set line segment SL. Then, in the case of... Figure 23 In this state, proceed with steps S13 and below. However, if the controller 800 can perform high-performance calculations, steps S13 and below can be performed even if the virtual line segment GL and the set line segment SL are not consistent.

[0220] 3. Set the correct location area <s13> Controller 800 is like Figure 21 As illustrated, the correct position region RZ for the electronic component ED to be reconfigured is set based on the virtual line segment GL. Here, information about the correct position region RZ may include the position of each region of the correct position region RZ on the X-axis, the position on the Y-axis, the angular position in the θ-axis direction, and the coordinates of the center of the correct position region RZ.

[0221] 4. The first shot for the first identification mark. <s14> In order to reconfigure electronic components ED according to a set sequence, the controller 800 first uses the reconfiguration camera 520 to capture the first identification mark D1 of the first electronic component ED1 to be reconfigured. This allows for the acquisition of a sequence similar to... Figure 25 Image I2 of (a).

[0222] 5. The second shot for the second identification mark. <s15> After the first shot is captured via step S14, the controller 800 reconfigures the camera 520 to capture the second identification mark D2 of the first electronic component ED1. This allows for the acquisition of a result similar to... Figure 25 Image I3 is the same as (b). In order to sequentially photograph the first identification mark D1 and the second identification mark D2 of the first electronic component ED1, the controller 800 controls the moving mechanism 600 to move the test stage 300.

[0223] 6. First Calculation <s16> The controller 800 analyzes the images I2 and I3 obtained from the first capture in step S14 and the second capture in step S15 to calculate the temporary region BZ of the first electronic component ED1. Information about the calculated temporary region BZ may include the position of the first electronic component ED1 on the X-axis, the position on the Y-axis, the angular position in the θ-axis direction, and the coordinates of the center of the first electronic component ED1.

[0224] For reference, in order to confirm the two identification locations L3 and L4 in step S11, the same method can be used for steps S14 to S16.

[0225] 7. Second Calculation <s17> Upon completion of step S16, the controller 800 calculates the distance required to move the first electronic component ED1 from the temporary region BZ to the correct position region RZ. This distance includes the horizontal movement distance along the X-axis, the horizontal movement distance along the Y-axis, and the rotational movement distance based on the angular position difference along the θ-axis.

[0226] 8. Mobile electronic components <s18> Once the second calculation in step S17 is completed, the controller 800 activates the reconfiguration mechanism 500, the moving mechanism 600, and the connector 700 to move the first electronic component ED1 from the temporary region BZ to the correct position region RZ. This movement of the first electronic component ED1 can be as follows: Figure 26 Similarly, break it down into more specific steps.

[0227] 8-1. Holding electronic components <s18a> The controller 800 calculates the center O coordinates of the first electronic component ED1 using the positions of the first identification mark D1 and the second identification mark D2. However, this calculation can be performed in advance in step S16. Furthermore, the controller 800, like... Figure 27 As illustrated, the moving mechanism 600 is operated to drive the test stage 300 to move so that the center of the reconfigured pickup 510 is aligned with the center O of the first electronic component ED1 on a vertical line.

[0228] With the center of the pickup 510 reconfigured to be aligned with the center O of the first electronic component ED1, as... Figure 28 As illustrated, the controller 800 operates the connector 700, causing the test stage 300 to rise to a height where the reconfigurable pickup 510 can hold the first electronic component ED1. In this state, the controller 800 controls the reconfigurable pickup 510 to hold the first electronic component ED1. Therefore, the reconfigurable pickup 510 holds the first electronic component ED1 by vacuum pressure. Afterward, the controller 800 lowers the test stage 300.

[0229] 8-2. Correction Angle Position <s18b> The correct position region RZ is generated based on the virtual line segment GL. However, as exaggeratedly presented... Figure 29 Similar to (a), the angular position of the first electronic component ED1 held by the reconfigured pickup 510 and the angular position of the virtual line segment GL may be inconsistent, resulting in a difference of angle β. In this case, the controller 800 operates the rotary mover 610, causing the test stage 300 to rotate and move as if... Figure 29 In the same way as (b), the angular position of the first electronic element ED1 held by the reconfigured pickup 510 is made consistent with the angular position of the virtual line segment GL.

[0230] Of course, it can also be achieved by directly comparing the angular position of the first electronic element ED1 with the angular position of the correct position region RZ.

[0231] 8-3. Inspection angle position <s18c> The controller 800 measures the center point of the reference component by reconfiguring the camera 520 to confirm the reference component, and checks whether the angular position of the first electronic component ED1 matches the angular position of the virtual line segment SL. For this purpose, the controller 800 moves the test stage 300 using the moving mechanism 600.

[0232] However, step S18c is merely a check and can therefore be omitted arbitrarily.

[0233] 8-4. Reconfiguration <s18d> When the inspection is completed, the controller 800 operates the moving mechanism 600 and the connector 700 to reposition the first electronic component EDl held by the repositioning pickup 510 to the correct position area RZ.

[0234] According to a preferred example of the present application, the repositioning operation for the second electronic component is performed in the following manner, i.e., the step S18d is performed for the first electronic component EDl.

[0235] For example, as shown in Figure 30 , the controller 800 operates the repositioning camera 520 to perform the first shooting of the first identification mark Dl of the second electronic component ED2 to be repositioned while repositioning the first electronic component EDl held by the repositioning pickup 510 to the correct position area RZ. For this purpose, one example is implemented in the following manner, i.e., the second electronic component ED2 is arranged adjacent to the first electronic component EDl in the diagonal direction of the first electronic component EDl. Therefore, the repositioning pickup 510 and the repositioning camera 520 need to be arranged as described below, i.e., at the time point when the repositioning pickup 510 repositions the first electronic component EDl of high priority, the repositioning camera 520 can shoot the first identification mark Dl of the second electronic component ED2 of low priority to be repositioned after the first electronic component EDl of high priority.

[0236] That is, at the time point when the repositioning of the first electronic component EDl of the step S18d is completed, the first shooting of the step S14 for the repositioning of the second electronic component ED2 is also completed. Thereafter, the steps S15 to S18 for the repositioning of the second electronic component ED2 are performed. Of course, as shown in Figure 31 , at the time point when the second electronic component ED2 is repositioned to the correct position area RZ, the repositioning camera 520 shoots the first identification mark Dl of the third electronic component ED3. Then, the repositioning operation for all the electronic components ED is performed in this manner.

[0237] Further, when the repositioning of the electronic components ED is completed as described above, the controller 800 controls the moving mechanism 600 to move the test table 300 to the lower side of the test board TB, and thereafter performs the steps required for the test.

[0238] However, according to the example described above, the positions of the test table 300 and the test board TB are completely coincident with each other, and this can be achieved in a state where the angle position of the virtual line GL coincides with that of the set line SL. Therefore, at least before the electronic components ED are electrically connected to the test board TB, the controller 800 needs to rotate the test table 300 to make the angle position of the virtual line GL coincide with that of the set line SL.

[0239] On the other hand, the test zone TZ, the temporary zone BZ, and the correct position zone RZ can be generated as a point (one point coordinate) instead of a subject having an area, depending on the circumstances. In this case, the point can be the center of the test zone TZ, the temporary zone BZ (or the electronic component), or the correct position zone RZ. Even in this case, the steps S16 to S18 can be properly performed with respect to the relationship between the coordinates of the first identification mark Dl on the electronic component ED, the coordinates of the second identification mark D2 on the electronic component ED, and the angle position of the virtual line segment GL.

[0240] <Additional Matters> 1. Regarding the identification marks Dl, D2 The foregoing embodiment utilizes the positions of the identification marks Dl, D2 for confirming the position of the electronic component ED. However, other identifiers can be used in various forms as exemplified below in addition to the identification marks Dl, D2.

[0241] (1) Use of corners As exemplified in Figure 32 , the corners D3, D4 of the electronic component ED can be used as identifiers. The positions of the corners D3, D4 are confirmed by photographing the corners D3, D4 with the second camera C2, and thus the position of the electronic component ED can be finally confirmed.

[0242] (2) Use of identification patterns As exemplified in Figure 33 , the identification patterns D5, D6 of the electronic component ED can be used as identifiers. The positions of the identification patterns D5, D6 are confirmed by photographing the identification patterns D5, D6 with the second camera C2, and thus the position of the electronic component ED can be finally confirmed.

[0243] (3) Use of identification pads As exemplified in Figure 34 , the identification pads D7, D8 of the electronic component ED can be used as identifiers. The positions of the identification pads D7, D8 are confirmed by photographing the identification pads D7, D8 with the second camera C2, and thus the position of the electronic component ED can be finally confirmed.

[0244] (4) Use of identification terminals As exemplified in Figure 35 , the identification terminals Tl, T2 of the electronic component ED can be used as identifiers. The positions of the identification terminals Tl, T2 are confirmed by photographing the identification terminals Tl, T2 with the second camera C2, and thus the position of the electronic component ED can be finally confirmed. In this case, the identification terminals Tl, T2 can be a collection of a plurality of terminals.

[0245] 2. Other examples of reconfiguration methods As mentioned earlier, in order to fill a test bench 300 with electronic components ED, the transport table 110 needs to transport the electronic components ED repeatedly more than ten times.

[0246] Therefore, if all electronic components (EDs) are filled into the test bench 300 and then reconfigured, it may increase the overall processing time.

[0247] Therefore, if the electronic components ED are reconfigured according to the 16 electronic components ED that the transport table 110 can carry at one time, the time can be shortened accordingly.

[0248] For example, this can be achieved by reconfiguring 16 electronic components ED on the test bench 300 during the process of moving the electronic components from the transport stage 110 to the first area S1 after the second area S2 has been emptied.

[0249] Furthermore, instead of photographing and reconfiguring each electronic component (ED) individually before moving on to the next, one can photograph multiple electronic components at once and then reconfigure each photographed component. The following section will combine... Figure 36 The following diagram illustrates an example of its preferred features.

[0250] as Figure 36 Similarly, 16 electronic components (EDs) were mounted on the test bench 300.

[0251] Controller 800 first controls the reconfiguration of camera 520 and movement mechanism 600 so as to... Figure 37 Similarly, the first identification mark D1 of each electronic component ED is photographed sequentially in the same direction.

[0252] After the first identification marker D1 is captured, the controller 800 controls the reconfiguration of the camera 520 and the movement mechanism 600 so that, as Figure 38 Similarly, photograph the second identification mark D2 of the electronic component ED in the same direction as the arrow. In order to further shorten the time, the photographing order of the second identification mark D2 can be reversed compared to the photographing order of the first identification mark D1.

[0253] However, depending on the implementation, it can also be implemented as follows: after taking pictures of the first identification mark D1 for the eight electronic components ED in the first column, take pictures of the second identification mark D2 for the eight electronic components ED in the first column, and then take pictures of the eight electronic components ED in the second column in the same way.

[0254] The controller 800 also targets parallel processing. Figure 38 The calculation of the position of the electronic component ED after the second identification mark D2 is captured during the shooting process.

[0255] Figure 38 Once the shooting is complete, the controller 800 activates the reconfiguration pickup 510 and the movement mechanism 600 to reconfigure the electronic components ED, which have completed position calculations, to the correct position area RZ.

[0256] Afterwards, the 16 new electronic components (EDs) transported from transport platform 110 were reconfigured.

[0257] The foregoing embodiments are merely preferred examples of the present invention, and many other applications are possible. Therefore, the present invention should not be construed as limited to the content described above. The scope of the present invention should be interpreted as the scope of the patent application and its equivalents.

Claims

1. A handler for testing electronic components, comprising: a transport shuttle having a transport table that moves in a state of loading electronic components to thereby be able to transport the electronic components; a first robot that loads electronic components to a transport table located in a first area by operation of the transport shuttle; a second robot that unloads electronic components from a transport table moved from the first area to a second area by operation of the transport shuttle; a test table that loads electronic components unloaded from the transport table by the second robot; a reconfiguration mechanism that reconfigures electronic components loaded to a temporary area of the test table by the second robot to a correct position area; a movement mechanism that moves the test table for reconfiguring electronic components to the correct position area by the reconfiguration mechanism; a connector that electrically connects electronic components loaded on the test table reconfigured by the reconfiguration mechanism to a tester to thereby allow the electronic components to be tested; a controller that controls the transport shuttle, the first robot, the second robot, the reconfiguration mechanism, the movement mechanism, and the connector, wherein the reconfiguration mechanism includes: a reconfiguration picker that is able to hold electronic components; and a reconfiguration camera that is disposed apart from the reconfiguration picker, the controller calculates a temporary area of electronic components after analyzing an image obtained by the reconfiguration camera capturing an identification mark of electronic components loaded on the test table, and controls the movement mechanism and the reconfiguration picker to move electronic components from the temporary area to the correct position area.

2. The handler for testing electronic components according to claim 1, wherein the controller controls the reconfiguration camera to sequentially capture a first identification mark and a second identification mark of electronic components and analyzes the obtained images to calculate a temporary area of electronic components.

3. The handler for testing electronic components according to claim 2, wherein the reconfiguration picker and the reconfiguration camera are disposed in such a manner that, at a point in time when a first electronic component held by the reconfiguration picker is located in the correct position area, the reconfiguration camera is able to capture a first identification mark of a second electronic component adjacent to the first electronic component.

4. The handler for testing electronic components according to claim 1, wherein the reconfiguration camera is installed in such a manner that, assuming that a center of an electronic component is captured, at least a portion of an edge of the electronic component is out of a field of view.

5. The handler for testing electronic components according to claim 1, wherein the identification mark is formed independently of a circuit pattern on the electronic component.

6. The handler for testing electronic components according to claim 5, wherein a relative position between the identification mark and the circuit pattern is defined.

7. An electronic component reconfiguration method for a handler for testing electronic components, comprising the steps of: a capturing step of capturing an identification mark of an electronic component on a test table by a reconfiguration camera; a first calculation step of analyzing images obtained in the photographing step to calculate a temporary area of the electronic component; a second calculation step of calculating a distance for moving the electronic component from the temporary area calculated in the first calculation step to a correct position area; and a moving step of moving the electronic component on the temporary area to the correct position area by the value calculated in the second calculation step, wherein the photographing step photographs identification marks of the electronic component on the test table using the reconfiguration camera.

8. The electronic component reconfiguration method of the handler for testing electronic components according to claim 7, wherein the photographing step includes steps of: a first photographing step of photographing first identification marks on the electronic component; and a second photographing step of photographing second identification marks of the electronic component on the test table using the reconfiguration camera, wherein the first calculation step analyzes images obtained in the first photographing step and the second photographing step to calculate a temporary area of the electronic component. ​

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