Multilayer circuit board solder mask developing machine

Abstract

The invention discloses a multilayer circuit board solder resist developing machine, and relates to the technical field of circuit board processing, the multilayer circuit board solder resist developing machine comprises a machine body, the inner side of a positioning frame is provided with a movable support member, and the inner side of a placing groove is provided with a liquid changing member. According to the developing device, a liquid changing part is arranged, a third electromagnetic valve is closed, a first electromagnetic valve and a second electromagnetic valve are opened, at the moment, a first telescopic air cylinder is started to enable a pressing plate to move downwards, and due to the fact that a flow guide hole is shielded by the third electromagnetic valve, the pressing plate can extrude developing liquid in a containing groove when moving downwards; when the pressing plate moves upwards, the developing liquid in the liquid storage tank can enter the placing groove through the first electromagnetic valve, the first one-way valve and the liquid inlet pipe under the action of negative pressure, so that rapid replacement of the developing liquid can be realized; the labor intensity of workers is reduced, and meanwhile, the overall operation efficiency of the developing machine is also improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, and particularly relates to a multi-layer circuit board solder mask developing machine. BACKGROUND

[0002] Circuit board processing belongs to the field of integrated circuit manufacturing, in which a developing machine is used. The developing machine automatically removes unexposed photoresist on a circuit board (PCB) through four core processes of "conveying, developing, washing and drying", and finally presents a preset circuit pattern. The specific operation process and key links are as follows: After exposure, the photoresist on the board surface forms an "exposure solidification area" and an "unexposed and unsolidified area". The core of the developing machine is to selectively dissolve the unsolidified photoresist by using the chemical action of developing solution, and then to remove the residual liquid by washing with water, and finally to dry the board surface to prepare for subsequent etching processes. After the circuit board enters the developing cavity, it will go through three steps of "spraying, soaking and secondary spraying": 1. Pre-spraying: a plurality of high-pressure spraying pipes (nozzle spacing 5-10 mm, pressure 0.15-0.3 MPa) uniformly spray developing solution (commonly alkaline liquid such as sodium carbonate solution, concentration 1-3%, temperature controlled at 25-35 DEG C) to the board surface, and initially dissolve the surface unsolidified photoresist; 2. Soaking: the circuit board enters the developing solution tank (liquid level height is higher than the board surface), and the soaking time is 10-30 seconds, so that the developing solution fully penetrates and dissolves the deep unsolidified glue. A stirring device (such as a stirring paddle or a bubble generator) is arranged in the tank to ensure uniform concentration of the liquid. 3. Secondary spraying: the high-pressure spraying pipe rinses the board surface again to completely wash away the dissolved photoresist residue. The developing solution is recycled after removing the residue through a filtering system (such as a filter core) to reduce the cost of consumables. In the integrated circuit manufacturing scene, the solder mask developing machine also has the capabilities of "parameter self-adaptation" and "quality traceability": the device can automatically adjust the developing solution concentration, spraying pressure and other parameters according to different types of solder mask of integrated circuit circuit board and board thickness. At the same time, through the integrated visual detection system, the solder mask pattern edge precision is captured in real time, and the data is uploaded to the MES system of integrated circuit manufacturing to realize the whole process quality traceability, and provide qualified circuit board substrate for subsequent chip mounting, packaging test and other processes.

[0003] When immersing circuit boards, some developer may remain on their surface. This causes the amount of developer in the tank to decrease as multiple circuit boards are immersed, requiring replenishment. Replenishing the developer is not only complicated but also affects the overall processing efficiency of the equipment. Furthermore, when immersing circuit boards in the tank, some areas are clamped and supported, preventing the circuit boards from fully contacting the developer, thus affecting the developing effect. Summary of the Invention

[0004] The purpose of this invention is to provide a multilayer circuit board solder resist developing machine to solve the problems of inconvenience in quickly replenishing the developing solution and the inability of the circuit board to come into full contact with the developing solution.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multilayer circuit board solder resist developing machine, comprising a machine body, two sets of board conveyors mounted on the top of the machine body, the two sets of board conveyors being symmetrically arranged along the vertical central axis of the machine body, a liquid collection tank located below the board conveyors being provided on one side of the machine body, a placement trough being installed on one side of the liquid collection tank, a sprayer being provided on the top of the board conveyors, a U-shaped connecting frame being installed on one side of the board conveyors, a first telescopic cylinder being connected to the outer side of the U-shaped connecting frame, a positioning frame being connected to the movable end of the first telescopic cylinder, a movable support being provided on the inner side of the positioning frame, and a liquid changing component being provided on the inner side of the placement trough; The movable support includes a positioning frame installed on one side of the positioning frame, a support frame installed on one side of the positioning frame, a first roller conveyor installed on the side of the support frame away from the positioning frame, and a second roller conveyor installed on the inner side of the support frame.

[0006] As a further embodiment of the present invention: the movable support further includes a second telescopic cylinder installed on the top of the positioning frame. The extended end of the second telescopic cylinder is connected to a push plate. One end of the push plate is provided with a telescopic spring connected to the second telescopic cylinder. A spur rack is connected to one side of the push plate. A spur gear is rotatably connected to the inner side of the positioning frame. A reciprocating screw is fixedly connected to the bottom end of the spur gear. A rectangular rod located on one side of the reciprocating screw is fixedly connected to the inner side of the positioning frame. A slider is movably sleeved on the outer side of the reciprocating screw. The second roller conveyor is installed at the end of the slider away from the reciprocating screw.

[0007] As a further embodiment of the present invention: one end of the slider is provided with a crescent pin that matches the outer side of the reciprocating lead screw, and the inner side of the slider is provided with a through hole that matches the rectangular rod.

[0008] As a further embodiment of the present invention, the rollers at one end of the first roller conveyor and the second roller conveyor are arranged alternately.

[0009] As a further scheme of the present application: the second telescopic cylinder is in the fully retracted state, and the slider is located at the center of the rectangular rod.

[0010] As a further scheme of the present application: the liquid changing member further comprises a pressing plate installed at the bottom of the positioning frame and located between the second roller conveyor and the placing groove, the top of the pressing plate is provided with a flow guide hole penetrating to the bottom of the pressing plate, the top of the pressing plate is installed with a third electromagnetic valve above the flow guide hole, and the outer side of the pressing plate is provided with a sealing strip.

[0011] As a further scheme of the present application: the liquid changing member further comprises a pressing plate installed at the bottom of the positioning frame and located between the second roller conveyor and the placing groove, the top of the pressing plate is provided with a flow guide hole penetrating to the bottom of the pressing plate, the top of the pressing plate is installed with a third electromagnetic valve above the flow guide hole, and the outer side of the pressing plate is provided with a sealing strip.

[0012] As a further scheme of the present application: the liquid changing member further comprises a pressing plate installed at the bottom of the positioning frame and located between the second roller conveyor and the placing groove, the top of the pressing plate is provided with a flow guide hole penetrating to the bottom of the pressing plate, the top of the pressing plate is installed with a third electromagnetic valve above the flow guide hole, and the outer side of the pressing plate is provided with a sealing strip.

[0013] As a further scheme of the present application: the liquid changing member further comprises a pressing plate installed at the bottom of the positioning frame and located between the second roller conveyor and the placing groove, the top of the pressing plate is provided with a flow guide hole penetrating to the bottom of the pressing plate, the top of the pressing plate is installed with a third electromagnetic valve above the flow guide hole, and the outer side of the pressing plate is provided with a sealing strip.

[0014] As a further scheme of the present application: the liquid changing member further comprises a pressing plate installed at the bottom of the positioning frame and located between the second roller conveyor and the placing groove, the top of the pressing plate is provided with a flow guide hole penetrating to the bottom of the pressing plate, the top of the pressing plate is installed with a third electromagnetic valve above the flow guide hole, and the outer side of the pressing plate is provided with a sealing strip.

[0015] Compared with the prior art, the present application has the following beneficial effects: 1. By setting the liquid changing member, closing the third electromagnetic valve and opening the first electromagnetic valve and the second electromagnetic valve, the top of the flow guide hole is shielded, at this time the first telescopic cylinder is started to make the pressing plate move downward, and since the flow guide hole is shielded by the third electromagnetic valve, the pressing plate will squeeze the developer in the placing groove when moving downward, at this time the developer in the placing groove will be discharged through the drain pipe, the second one-way valve and the second electromagnetic valve, and when the pressing plate moves upward, the developer in the liquid storage tank can enter the placing groove through the first electromagnetic valve, the first one-way valve and the liquid inlet pipe under the action of negative pressure, so that the developer can be quickly replaced, the labor intensity of the staff is reduced, and the overall operation efficiency of the developing machine is improved. 2、When the circuit board moves to the top of the rotating rollers of the first rotating roller conveyor and the second rotating roller conveyor, the first telescopic cylinder is started, and the positioning frame is lowered by the contraction of the first telescopic cylinder. At this time, the positioning frame is lowered synchronously with the positioning frame, and the first rotating roller conveyor is lowered synchronously with the second rotating roller conveyor through the support frame, so that the circuit board falls to the inside of the placing groove, and the development of the circuit board is realized by the developing solution in the placing groove. Then the second telescopic cylinder is started, and the straight rack is moved by the extension of the second telescopic cylinder, so that the straight rack drives the straight gear to rotate. At this time, the reciprocating screw rod rotates with the straight gear, so that the slider drives the second rotating roller conveyor to move up and down. When the second rotating roller conveyor moves up, the rotating rollers on the second rotating roller conveyor are dislocated with the rotating rollers on the first rotating roller conveyor. At this time, the circuit board is supported by the rotating rollers on the second rotating roller conveyor, so that the circuit board is separated from the first rotating roller conveyor. When the second rotating roller conveyor moves to the bottom of the first rotating roller conveyor, the rotating rollers on the first rotating roller conveyor support the circuit board, and the rotating rollers on the second rotating roller conveyor are separated from the circuit board. In this way, the support position of the circuit board is different, so that the circuit board cannot be in contact with the developing solution due to the shielding of part of the position, and the soaking effect of the circuit board in the developing solution is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the structure schematic diagram of the whole application; Figure 2 It is the structure schematic diagram of the bottom of the placing groove of the application; Figure 3 It is the connection schematic diagram of the first rotating roller conveyor and the second rotating roller conveyor of the application; Figure 4 It is the connection schematic diagram of the second rotating roller conveyor and the positioning frame of the application; Figure 5 It is the Figure 4 It is the enlarged view of A in the application; Figure 6 It is the connection schematic diagram of the slider and the reciprocating screw rod of the application; Figure 7 It is the connection schematic diagram of the placing groove and the pressing plate of the application; Figure 8 It is the connection schematic diagram of the second telescopic cylinder and the reciprocating screw rod of the application.

[0017] In the figure: 1, the body; 2, the collecting tank; 3, the placing groove; 4, the plate conveying machine; 5, the spraying machine; 6, the U-shaped connecting frame; 7, the liquid inlet pipe; 8, the first one-way valve; 9, the first electromagnetic valve; 10, the liquid outlet pipe; 11, the second one-way valve; 12, the second electromagnetic valve; 13, the support frame; 14, the first rotating roller conveying machine; 15, the second rotating roller conveying machine; 16, the positioning frame; 17, the rectangular rod; 18, the sliding block; 19, the first telescopic cylinder; 20, the positioning frame; 21, the pressing plate; 22, the second telescopic cylinder; 23, the push plate; 24, the straight rack; 25, the straight gear; 26, the third electromagnetic valve; 27, the reciprocating screw rod; 28, the sealing strip; 29, the telescopic spring; 30, the flow guide hole. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0019] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The embodiments of the present application will be described below according to the overall structure of the present application.

[0020] Please refer to Figures 1-8The embodiment of the application discloses a multi-layer circuit board solder resist developing machine, which comprises a machine body 1, two groups of board conveyors 4 are arranged on the top of the machine body 1, the two groups of board conveyors 4 are symmetrically arranged along the vertical central axis of the machine body 1, a liquid collecting groove 2 is arranged on one side of the machine body 1 and located below the board conveyor 4, a placing groove 3 is arranged on one side of the liquid collecting groove 2, a spraying machine 5 is arranged on the top of the board conveyor 4, a U-shaped connecting frame 6 is arranged on one side of the board conveyor 4, a first telescopic cylinder 19 is connected to the outer side of the U-shaped connecting frame 6, a positioning frame 20 is connected to the movable end of the first telescopic cylinder 19, a movable support is arranged on the inner side of the positioning frame 20, and a liquid changing device is arranged on the inner side of the placing groove 3. The movable support comprises a positioning frame 16 arranged on one side of the positioning frame 20, a support frame 13 is arranged on one side of the positioning frame 16, a first rotary roller conveyor 14 is arranged on the side, away from the positioning frame 16, of the support frame 13, and a second rotary roller conveyor 15 is arranged on the inner side of the support frame 13.

[0021] In the embodiment, the multi-layer circuit board is first placed on the top of the board conveyor 4, then the circuit board is moved below the spraying machine 5 through the operation of the board conveyor 4, at this time, the developing liquid is sprayed on the circuit board above the board conveyor 4 through the operation of the spraying machine 5, so that the circuit board is sprayed once, then the circuit board is moved to the top of the first rotary roller conveyor 14 and the second rotary roller conveyor 15 through the operation of the board conveyor 4, the first telescopic cylinder 19 is started, the circuit board is immersed in the placing groove 3 through the contraction of the first telescopic cylinder 19, so that the developing liquid wraps the circuit board, then the movable support is started, the first rotary roller conveyor 14 and the second rotary roller conveyor 15 alternately support the circuit board through the operation of the movable support, so that the area of the circuit board surface that is shielded is reduced, so that the circuit board is fully contacted with the developing liquid, then the circuit board is moved out of the placing groove 3 through the extension of the first telescopic cylinder 19, then the circuit board is moved to another board conveyor 4 through the operation of the first rotary roller conveyor 14 and the second rotary roller conveyor 15, then the soaked circuit board is sprayed again through the operation of the spraying machine 5, and when the developing liquid in the placing groove 3 is replaced, the developing liquid is replaced through the combined operation of the liquid changing device and the first telescopic cylinder 19.

[0022] Please pay attention to Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8The movable support also includes a second telescopic cylinder 22 installed on the top of the positioning frame 16. The extended end of the second telescopic cylinder 22 is connected to a push plate 23. One end of the push plate 23 is provided with a telescopic spring 29 connected to the second telescopic cylinder 22. A spur rack 24 is connected to one side of the push plate 23. A spur gear 25 is rotatably connected to the inner side of the positioning frame 20. A reciprocating screw 27 is fixedly connected to the bottom end of the spur gear 25. A rectangular rod 17 located on one side of the reciprocating screw 27 is fixedly connected to the inner side of the positioning frame 16. A slider 18 is movably sleeved on the outer side of the reciprocating screw 27. A second roller conveyor 15 is installed at the end of the slider 18 away from the reciprocating screw 27.

[0023] In this embodiment, when the circuit board moves above the rollers of the first roller conveyor 14 and the second roller conveyor 15, the first telescopic cylinder 19 is activated. The retraction of the first telescopic cylinder 19 causes the positioning frame 20 to move downwards. At this time, the positioning frame 16 moves downwards synchronously with the positioning frame 20. During this process, the first roller conveyor 14 moves downwards synchronously with the second roller conveyor 15 via the support frame 13, thereby causing the circuit board to fall into the inner side of the placement tank 3. Simultaneously, the developing solution in the placement tank 3 develops the circuit board. Then, the second telescopic cylinder 22 is activated. The extension of the second telescopic cylinder 22 causes the push plate 23 to move the rack 24, thereby causing the rack 24 to rotate the spur gear 25. At this time, the reciprocating screw 27 moves along with the spur gear 25. The slider 18 rotates, causing the second roller conveyor 15 to move up and down. When the second roller conveyor 15 moves upward, the rollers on the second roller conveyor 15 will be misaligned with the rollers on the first roller conveyor 14. At this time, the circuit board will be supported by the rollers on the second roller conveyor 15, thus separating the circuit board from the first roller conveyor 14. When the second roller conveyor 15 moves below the first roller conveyor 14, the rollers on the first roller conveyor 14 will support the circuit board. At this time, the rollers on the second roller conveyor 15 will separate from the circuit board. This allows the circuit board to be supported at different positions, thus preventing parts of the circuit board from being blocked and unable to contact the developer, further improving the immersion effect of the circuit board in the developer.

[0024] One end of the slider 18 is provided with a crescent pin that matches the outer side of the reciprocating screw 27, and the inner side of the slider 18 is provided with a through hole that matches the rectangular rod 17. The rollers at one end of the first roller conveyor 14 and the second roller conveyor 15 are staggered. When the second telescopic cylinder 22 is in the fully retracted state, the slider 18 is located at the center of the rectangular rod 17.

[0025] Please refer to this carefully. Figure 2 , Figure 3 , Figure 7 , Figure 8The liquid replacement device includes an inlet pipe 7 installed at the bottom of the placement tank 3, a drain pipe 10 located on one side of the inlet pipe 7 at the bottom of the placement tank 3, a first check valve 8 installed at one end of the inlet pipe 7, a first solenoid valve 9 connected to one end of the first check valve 8, the first solenoid valve 9 connected to the developer storage tank through a connecting pipe, a second check valve 11 installed at one end of the drain pipe 10, and a second solenoid valve 12 installed at one end of the second check valve 11. The fluid changing component also includes a pressure plate 21 installed at the bottom of the positioning frame 16 and located between the second roller conveyor 15 and the placement trough 3. A guide hole 30 extending through to the bottom of the pressure plate 21 is provided at the top of the pressure plate 21. A third solenoid valve 26 is installed at the top of the pressure plate 21 above the guide hole 30. A sealing strip 28 is provided on the outside of the pressure plate 21.

[0026] The first one-way valve 8 has its drain end connected to the inlet pipe 7, the second one-way valve 11 has its drain end connected to the second solenoid valve 12, the top of the pressure plate 21 has a concave structure, and the guide hole 30 is located at the center of the pressure plate 21. The length and width of the pressure plate 21 are equal to the length and width of the inner wall of the placement groove 3.

[0027] In this embodiment, when the positioning frame 16 moves downward, it will drive the pressure plate 21 to move downward synchronously. At this time, the pressure plate 21 will be inserted into the inner wall of the placement tank 3. The sealing strip 28 is in full contact with the inner wall of the placement tank 3. The developer inside the placement tank 3 is squeezed by the pressure plate 21 and discharged through the guide hole 30 to the top of the pressure plate 21. At this time, one end of the inlet pipe 7 and the outlet pipe 10 are blocked by the first solenoid valve 9 and the second solenoid valve 12, respectively. When the pressure plate 21 moves upward, the developer at the top of the pressure plate 21 will flow through the guide hole 30 to the bottom of the pressure plate 21. As multiple circuit boards are soaked, the amount of developer in the placement tank 3 decreases, and the concentration of developer in the placement tank 3 decreases. At this time, the third solenoid valve 26 is closed and the third solenoid valve 26 is opened. The first solenoid valve 9 and the second solenoid valve 12 are used to block the top of the guide hole 30. At this time, the first telescopic cylinder 19 is activated to move the pressure plate 21 downward. Since the guide hole 30 is blocked by the third solenoid valve 26, the pressure plate 21 will squeeze the developer in the placement tank 3 when it moves downward. The developer in the placement tank 3 will then be discharged through the drain pipe 10, the second one-way valve 11, and the second solenoid valve 12. When the pressure plate 21 moves upward, the negative pressure allows the developer in the storage tank to enter the placement tank 3 through the first solenoid valve 9, the first one-way valve 8, and the inlet pipe 7. This enables rapid replacement of the developer, reduces the labor intensity of the workers, and improves the overall operating efficiency of the developing machine.

[0028] The working principle of this invention is as follows: First, the multilayer circuit board is placed on top of the board conveyor 4. The operation of the board conveyor 4 moves the circuit board to below the sprayer 5. At this time, the operation of the sprayer 5 causes the developing solution to spray onto the circuit board above the board conveyor 4, thus achieving one spraying of the circuit board. As the board conveyor 4 operates, the circuit board moves to the top of the first roller conveyor 14 and the second roller conveyor 15. When the circuit board moves above the rollers of the first roller conveyor 14 and the second roller conveyor 15, the first telescopic cylinder 19 is activated. The retraction of the first telescopic cylinder 19 causes the positioning frame 20 to move downwards. At this time, the positioning frame 16 moves downwards synchronously with the positioning frame 20. During this process... The first roller conveyor 14 moves down synchronously with the second roller conveyor 15 via the support frame 13. When the positioning frame 16 moves down, it drives the pressure plate 21 to move down synchronously. At this time, the pressure plate 21 inserts into the inner wall of the placement tank 3. The sealing strip 28 is in full contact with the inner wall of the placement tank 3. The developing solution inside the placement tank 3 is squeezed by the pressure plate 21 and flows through the guide hole 30 to the top of the pressure plate 21. At this time, one end of the inlet pipe 7 and the outlet pipe 10 are blocked by the first solenoid valve 9 and the second solenoid valve 12, respectively. The circuit board falls into the inner side of the placement tank 3. At the same time, the developing solution in the placement tank 3 develops the circuit board. Then, the second telescopic cylinder 22 is activated. The extension of the second telescopic cylinder 22 pushes the positioning plate 2. 3. The spur rack 24 is moved, causing it to rotate the spur gear 25. The reciprocating screw 27 rotates with the spur gear 25, causing the slider 18 to move the second roller conveyor 15 up and down. When the second roller conveyor 15 moves upward, the rollers on it will misalign with the rollers on the first roller conveyor 14. The circuit board will then be supported by the rollers on the second roller conveyor 15, thus separating it from the first roller conveyor 14. When the second roller conveyor 15 moves below the first roller conveyor 14, the rollers on the first roller conveyor 14 will support the circuit board, and the rollers on the second roller conveyor 15 will then... The circuit boards are separated, allowing for different support positions. This prevents parts of the circuit board from being blocked and thus preventing them from contacting the developer, further improving the immersion effect of the circuit board in the developer. When the pressure plate 21 moves upward, the developer at the top of the pressure plate 21 flows through the guide hole 30 to the bottom of the pressure plate 21. As multiple circuit boards are immersed, the amount of developer in the placement tank 3 decreases, resulting in a lower concentration of developer in the placement tank 3. At this time, the third solenoid valve 26 is closed and the first solenoid valve 9 and the second solenoid valve 12 are opened, thus blocking the top of the guide hole 30. Then, the first telescopic cylinder 19 is activated, causing the pressure plate 21 to move downward. Because the guide hole 30 is blocked by the third solenoid valve 26,When the pressure plate 21 moves downward, it squeezes the developer solution inside the placement tank 3, causing it to drain through the drain pipe 10, the second one-way valve 11, and the second solenoid valve 12. Conversely, when the pressure plate 21 moves upward, the negative pressure allows the developer solution in the storage tank to enter the placement tank 3 through the first solenoid valve 9, the first one-way valve 8, and the inlet pipe 7. This enables rapid replacement of the developer solution, reducing the workload of operators and improving the overall operating efficiency of the developing machine.

[0029] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A multilayer circuit board solder resist developing machine, comprising a machine body (1), characterized in that, Two sets of plate conveyors (4) are installed on the top of the machine body (1). The two sets of plate conveyors (4) are symmetrically arranged along the vertical central axis of the machine body (1). A liquid collection tank (2) located below the plate conveyor (4) is provided on one side of the machine body (1). A placement tank (3) is installed on one side of the liquid collection tank (2). A sprayer (5) is provided on the top of the plate conveyor (4). A U-shaped connecting frame (6) is installed on one side of the plate conveyor (4). A first telescopic cylinder (19) is connected to the outside of the U-shaped connecting frame (6). A positioning frame (20) is connected to the movable end of the first telescopic cylinder (19). A movable support is provided on the inner side of the positioning frame (20). A liquid changing component is provided on the inner side of the placement tank (3). The movable support includes a positioning frame (16) installed on one side of the positioning frame (20), a support frame (13) installed on one side of the positioning frame (16), a first roller conveyor (14) installed on the side of the support frame (13) away from the positioning frame (16), and a second roller conveyor (15) provided on the inner side of the support frame (13).

2. The multilayer circuit board solder resist developing machine according to claim 1, characterized in that, The movable support also includes a second telescopic cylinder (22) installed on the top of the positioning frame (16). The extension end of the second telescopic cylinder (22) is connected to a push plate (23). One end of the push plate (23) is provided with a telescopic spring (29) connected to the second telescopic cylinder (22). A spur rack (24) is connected to one side of the push plate (23). A spur gear (25) is rotatably connected to the inner side of the positioning frame (20). A reciprocating screw (27) is fixedly connected to the bottom end of the spur gear (25). A rectangular rod (17) located on one side of the reciprocating screw (27) is fixedly connected to the inner side of the positioning frame (16). A slider (18) is movably sleeved on the outer side of the reciprocating screw (27). The second roller conveyor (15) is installed at the end of the slider (18) away from the reciprocating screw (27).

3. The multilayer circuit board solder resist developing machine according to claim 2, characterized in that, One end of the slider (18) is provided with a crescent pin that matches the outer side of the reciprocating lead screw (27), and the inner side of the slider (18) is provided with a through hole that matches the rectangular rod (17).

4. A multilayer circuit board solder resist developing machine according to claim 2, characterized in that, The rollers at one end of the first roller conveyor (14) and the second roller conveyor (15) are staggered.

5. A multilayer circuit board solder resist developing machine according to claim 2, characterized in that, When the second telescopic cylinder (22) is in the fully retracted state, the slider (18) is located at the center of the rectangular rod (17).

6. A multilayer circuit board solder resist developing machine according to claim 2, characterized in that, The liquid replacement device includes an inlet pipe (7) installed at the bottom of the placement tank (3). The bottom of the placement tank (3) is provided with a drain pipe (10) located on one side of the inlet pipe (7). A first check valve (8) is installed at one end of the inlet pipe (7). A first solenoid valve (9) is connected to one end of the first check valve (8). The first solenoid valve (9) is connected to the developer storage tank through a connecting pipe. A second check valve (11) is installed at one end of the drain pipe (10). A second solenoid valve (12) is installed at one end of the second check valve (11).

7. A multilayer circuit board solder resist developing machine according to claim 6, characterized in that, The fluid changing component also includes a pressure plate (21) installed at the bottom of the positioning frame (16) and located between the second roller conveyor (15) and the placement trough (3). The top of the pressure plate (21) is provided with a guide hole (30) that extends through to the bottom of the pressure plate (21). The top of the pressure plate (21) is provided with a third solenoid valve (26) located above the guide hole (30). A sealing strip (28) is provided on the outside of the pressure plate (21).

8. A multilayer circuit board solder resist developing machine according to claim 7, characterized in that, The drain end of the first check valve (8) is connected to the inlet pipe (7), and the drain end of the second check valve (11) is connected to the second solenoid valve (12).

9. A multilayer circuit board solder resist developing machine according to claim 7, characterized in that, The top of the pressure plate (21) is concave, and the guide hole (30) is located at the center of the pressure plate (21).

10. A multilayer circuit board solder resist developing machine according to claim 7, characterized in that, The length and width of the pressure plate (21) are equal to the length and width of the inner wall of the placement groove (3).

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