Slice preparation device and slice preparation method

Abstract

The invention provides a slice preparation device and a slice preparation method. The slice preparation device comprises a modeling module, a first grinding control module, an image acquisition module and a second grinding control module, the modeling module is used for acquiring modeling information and grinding parameters, the image acquisition module is used for acquiring a section image of a sliced sample, the first grinding control module is used for grinding the sliced sample to a fine grinding stop line according to the grinding feed amount, and the second grinding control module is used for grinding the sliced sample to the fine grinding stop line. The actual grinding efficiency is determined according to the section image acquired by the image acquisition module and the time from grinding to the fine grinding stop line, the sliced sample is ground according to the actual grinding efficiency and the formula TN = B * XN / eta, TN is the Nth grinding time, B is a coefficient, the value range of B is 0-0.9, XN is the Nth residual grinding distance, eta is the grinding efficiency, and the value range of TN is 0-0.9. And an iterative grinding mode is adopted to reach a grinding specified position, so that the accuracy of intelligent grinding is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of microelectronics, and in particular to a slice preparation apparatus and a slice preparation method. Background Technology

[0002] Driven by the global wave of digitalization and intelligentization, modern electronic information technology is iterating and innovating at an unprecedented pace. As the core physical carrier of electronic systems, circuit boards play a crucial role in consumer electronics, communication equipment, automotive electronics, aerospace, and other fields due to their superior electrical interconnection performance and mechanical support functions. By optimizing the electrical connections and signal transmission paths of integrated circuits, circuit boards effectively improve the stability, reliability, and integration of electronic systems, becoming a fundamental component for the functionality of modern electronic devices. With the accelerated implementation of emerging technologies such as 5G communication, artificial intelligence, and the Internet of Things, the trend of intelligentization and miniaturization of electronic devices is becoming increasingly significant, leading to a continuous exponential growth in demand for circuit boards. Driven by both industrial upgrading and technological innovation, the market size of high-density interconnect, rigid-flex boards, and packaging substrates is constantly expanding, indicating that the circuit board industry is about to usher in a broader development prospect and a period of strategic opportunity.

[0003] With the continuous breakthroughs in electronic information technology, circuit boards are rapidly evolving towards high-density integration, high signal transmission rates, and multifunctional composites. Their complex layered structures and precise circuit layouts pose unprecedented challenges to quality control. Against this backdrop, ensuring the quality and reliability of circuit boards has become a critical aspect of electronic product manufacturing. Metallographic sectioning, as an analytical method that can visually reveal the microstructure of circuit boards, has been widely applied in the industry. Through a series of processes including slicing, grinding, polishing, and micro-etching, it clearly displays the internal structure of the circuit board, playing an indispensable role in quality inspection, process optimization, and failure analysis. By creating and analyzing metallographic sections of circuit boards, we can gain a deeper understanding of their microstructure and quality status, promptly identify potential problems and defects, and take corresponding measures for improvement and optimization.

[0004] In the process of manufacturing transformation and upgrading towards high-end and precision manufacturing, product quality control standards are continuously improving. With increasingly stringent user requirements for product quality, enterprises need to implement more comprehensive and meticulous quality monitoring during the production process and finished product shipment stage. Against this backdrop, metallographic sectioning and grinding, as a key quality inspection method, is experiencing a significant increase in its workload. Traditional manual operation methods are struggling to meet the current high-intensity, high-precision inspection demands, and the demand for human resources is continuously rising. Therefore, to effectively improve inspection efficiency and ensure product quality stability, there is an urgent need for an automated and intelligent sectioning device.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a slide preparation device and a slide preparation method to solve the problem of low slide detection efficiency caused by manual operation in the prior art.

[0007] To achieve the above and other related objectives, the present invention provides a slice preparation apparatus, comprising:

[0008] A modeling module is used to acquire modeling information and grinding parameters; wherein, the modeling information includes three-dimensional data of the sample to be sliced ​​held by the gripper, and the grinding parameters include grinding a specified position; the specified grinding position is used to indicate the location of the target cut surface of the sample to be sliced ​​in the three-dimensional data;

[0009] The first grinding control module, connected to the modeling module, is used to determine the fine grinding stop line according to the specified grinding position, and to grind the sliced ​​sample to the fine grinding stop line according to the grinding feed amount;

[0010] An image acquisition module, connected to the modeling module, is used to acquire an image of a first current cut surface of a sliced ​​sample ground to the fine grinding stop line, and to determine a first remaining grinding distance between the first current cut surface and the target cut surface based on the image of the first current cut surface; and to acquire an image of a second current cut surface of a sliced ​​sample ground to the fine grinding stop line, and to determine a second remaining grinding distance between the second current cut surface and the target cut surface based on the image of the second current cut surface;

[0011] The second grinding control module is connected to the image acquisition module and the modeling module, respectively. It is used to determine the fine grinding stop line according to the designated grinding position, grind the sample to be sliced ​​to the fine grinding stop line according to the grinding feed amount, determine the first grinding time for the sample to be sliced ​​from the fine grinding stop line to the fine grinding stop line, determine the grinding efficiency of the second grinding control module according to the first remaining grinding distance, the second remaining grinding distance, and the first grinding time, determine the second grinding time according to the second remaining grinding distance, the grinding efficiency, and the following formula, and grind the sample to be sliced ​​to the designated grinding position according to the second grinding time.

[0012] T2 = A * X2 / η;

[0013] Where T2 is the second grinding time, A is a coefficient, the value of A ranges from 0 to 1, X2 is the second remaining grinding distance, and η is the grinding efficiency;

[0014] When A is less than 1, the image acquisition module further includes: acquiring multiple images of the Nth current cut surface of the sliced ​​sample after grinding by the second grinding control module, and determining the Nth remaining grinding distance between the Nth current cut surface and the target cut surface based on the image of the Nth current cut surface;

[0015] The second grinding control module also includes:

[0016] The Nth grinding time is determined according to the following formula;

[0017] TN = B * XN / η, (N>2);

[0018] Where TN is the Nth grinding time, B is a coefficient ranging from 0 to 0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency;

[0019] The sliced ​​sample is ground to the designated grinding position according to the Nth grinding time;

[0020] The grinding mesh number of the second grinding control module is greater than that of the grinding mesh number of the first grinding control module for slicing.

[0021] In one embodiment, the first grinding control module includes:

[0022] The coarse grinding unit, connected to the modeling module, is used to coarsely grind the sample to be sliced, determine the coarse grinding stop line according to the specified grinding position, and grind the sample to be sliced ​​to the coarse grinding stop line according to the grinding feed rate.

[0023] The intermediate grinding unit, connected to the modeling module, is used to perform intermediate grinding on the sample to be sliced ​​after coarse grinding, determine the intermediate grinding stop line according to the specified grinding position, and grind the sample to be sliced ​​to the intermediate grinding stop line according to the grinding feed rate.

[0024] The fine grinding unit, connected to the modeling module, is used to fine grind the sliced ​​sample after medium grinding, determine the fine grinding stop line according to the specified grinding position, and grind the sliced ​​sample to the fine grinding stop line according to the grinding feed rate.

[0025] The grit size used in the coarse grinding unit, the medium grinding unit, and the fine grinding unit increases sequentially.

[0026] In one embodiment, the slice preparation apparatus further includes:

[0027] The polishing module is used to polish the sliced ​​sample that has been ground to the specified grinding position.

[0028] In one embodiment, the grinding parameters further include micro-etching parameters; the slice preparation apparatus further includes:

[0029] The micro-etching module, connected to the modeling module, is used to perform micro-etching on the sliced ​​sample that has been ground to the specified grinding position according to the micro-etching parameters.

[0030] Secondly, this application also provides a method for preparing a slice, comprising:

[0031] Acquire modeling information and grinding parameters; wherein, the modeling information includes three-dimensional data of the sample to be sliced ​​held by the gripper, and the grinding parameters include grinding a specified position; the specified grinding position is used to indicate the location of the target cut surface of the sample to be sliced ​​in the three-dimensional data;

[0032] The fine grinding stop line is determined according to the specified grinding position, and the sliced ​​sample is ground to the fine grinding stop line according to the grinding feed rate;

[0033] Acquire an image of the first current cut surface of the sliced ​​sample that has been ground to the fine grinding stop line, and determine the first remaining grinding distance between the first current cut surface and the target cut surface based on the image of the first current cut surface;

[0034] The fine grinding stop line is determined according to the specified grinding position, the sample to be sliced ​​is ground to the fine grinding stop line according to the grinding feed rate, and the first grinding time of the sample to be sliced ​​from the fine grinding stop line to the fine grinding stop line is determined.

[0035] Acquire an image of the second current cut surface of the sliced ​​sample that has been ground to the fine grinding stop line, and determine the second remaining grinding distance between the second current cut surface and the target cut surface based on the image of the second current cut surface;

[0036] The grinding efficiency of the second grinding control module is determined based on the first remaining grinding distance, the second remaining grinding distance, and the first grinding time.

[0037] The second grinding time is determined based on the second remaining grinding distance, the grinding efficiency, and the following formula. The sliced ​​sample is then ground to the designated grinding position according to the second grinding time.

[0038] T2 = A * X2 / η;

[0039] Where T2 is the second grinding time, A is a coefficient, the value of A ranges from 0 to 1, X2 is the second remaining grinding distance, and η is the grinding efficiency;

[0040] In the case where A is less than 1, the image of the Nth current cut surface of the polished sample is acquired multiple times, and the Nth remaining polishing distance between the Nth current cut surface and the target cut surface is determined based on the image of the Nth current cut surface.

[0041] The Nth grinding time is determined according to the following formula, and the sample to be sliced ​​is ground to the designated grinding position according to the Nth grinding time;

[0042] TN = B * XN / η, (N>2);

[0043] Where TN is the Nth grinding time, B is a coefficient ranging from 0 to 0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency.

[0044] As described above, the slice preparation apparatus and slice preparation method of the present invention have the following beneficial effects:

[0045] The slicing preparation apparatus of the present invention includes: a modeling module, a first grinding control module, an image acquisition module, and a second grinding control module; wherein, the modeling module is used to acquire modeling information and grinding parameters; wherein, the modeling information includes three-dimensional data of the sample to be sliced ​​held by a gripper, and the grinding parameters include a designated grinding position; the designated grinding position is used to indicate the location of the target cut surface of the sample to be sliced ​​in the three-dimensional data; the first grinding control module is connected to the modeling module and is used to determine a fine grinding stop line according to the designated grinding position, and to grind the sample to be sliced ​​to the fine grinding stop line according to the grinding feed amount; the image acquisition module is connected to the modeling module and is used to acquire an image of a first current cut surface of the sample to be sliced ​​to the fine grinding stop line, determine a first remaining grinding distance between the first current cut surface and the target cut surface according to the image of the first current cut surface, and acquire an image of a second current cut surface of the sample to be sliced ​​to the fine grinding stop line, and determine a second remaining grinding distance between the second current cut surface and the target cut surface according to the image of the second current cut surface; the second grinding control module is connected to the image acquisition module and the modeling module respectively, and is used to determine a fine grinding stop line according to the designated grinding position, and to grind the sample to the fine grinding stop line according to the grinding feed amount. The process involves determining the first grinding time from the fine grinding stop line to the fine grinding stop line of the sample to be sliced, and determining the grinding efficiency of the second grinding control module based on the first remaining grinding distance, the second remaining grinding distance, and the first grinding time. The second grinding time is determined based on the second remaining grinding distance, the grinding efficiency, and the following formula: T2 = A * X2 / η; where T2 is the second grinding time, A is a coefficient ranging from 0 to 1, X2 is the second remaining grinding distance, and η is the grinding efficiency; where A is less than... In case 1, the image acquisition module further includes: acquiring multiple images of the Nth current cut surface of the sample after grinding by the second grinding control module, and determining the Nth remaining grinding distance between the Nth current cut surface and the target cut surface based on the image of the Nth current cut surface; the second grinding control module further includes: determining the Nth grinding time according to the following formula: TN=B*XN / η, (N>2); where TN is the Nth grinding time, B is a coefficient, the value of B is in the range of 0~0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency; grinding the sample to the designated grinding position according to the Nth grinding time.This application acquires the 3D data of the sample to be sliced ​​and the designated grinding position through a modeling module. A first grinding control module performs preliminary grinding based on the designated grinding position and feed rate, grinding the sample to the fine grinding stop line. Because the first grinding control module has a smaller grit size, grinding is faster, improving the efficiency of the preliminary grinding. Then, an image acquisition module determines the first and second remaining grinding distances of the sample. A second grinding control module determines the second grinding time based on the first and second remaining grinding distances and the first grinding time, and grinds the sample to the designated grinding position according to the second grinding time. The second grinding control module does not grind based on the feed rate of the grinding machine, but rather on the actual grinding position determined by the image acquisition module and the grinding efficiency of the grinding machine in the second grinding control module. Based on the actual grinding efficiency, the sample is ground according to the formula TN = B * XN / η, using an iterative grinding method to reach the designated grinding position. This greatly improves the accuracy of intelligent grinding, avoids over-grinding, achieves automated slicing, and improves the inspection efficiency of circuit boards.

[0046] The slicing preparation method of the present invention improves the initial grinding efficiency by acquiring modeling information and grinding parameters. The modeling information includes three-dimensional data of the sample to be sliced ​​held by a gripper, and the grinding parameters include a designated grinding position. The designated grinding position indicates the location of the target section of the sample in the three-dimensional data. A fine grinding stop line is determined based on the designated grinding position, and the sample is ground to the fine grinding stop line based on the grinding feed rate. An image of the first current section of the sample ground to the fine grinding stop line is acquired. A first remaining grinding distance between the first current section and the target section is determined based on the image of the first current section. A fine grinding stop line is determined based on the designated grinding position. The sample is ground to the fine grinding stop line based on the grinding feed rate, and a first grinding time is determined for the sample to grind from the fine grinding stop line to the fine grinding stop line. An image of the second current section of the sample ground to the fine grinding stop line is acquired. A second remaining grinding distance between the second current section and the target section is determined based on the image of the second current section. The first remaining grinding distance and the second remaining grinding distance are then used to determine the final grinding time. The grinding efficiency of the second grinding control module is determined by the distance and the first grinding time. The second grinding time is determined based on the second remaining grinding distance, the grinding efficiency, and the following formula. The sample to be sliced ​​is ground to the designated grinding position according to the second grinding time: T2=A*X2 / η; where T2 is the second grinding time, A is a coefficient with a value range of 0~1, X2 is the second remaining grinding distance, and η is the grinding efficiency. When A is less than 1, the image of the Nth current cut surface of the sample after grinding is acquired multiple times. The Nth remaining grinding distance between the Nth current cut surface and the target cut surface is determined based on the image of the Nth current cut surface. The Nth grinding time is determined according to the following formula, and the sample to be sliced ​​is ground to the designated grinding position according to the Nth grinding time: TN=B*XN / η, (N>2); where TN is the Nth grinding time, B is a coefficient with a value range of 0~0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency. The iterative grinding method is used to reach the designated grinding position, which greatly improves the accuracy of intelligent grinding and avoids over-grinding. Attached Figure Description

[0047] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the embodiments of this application and to illustrate the implementation of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application.

[0048] Figure 1 The diagram shown is a structural schematic of the slice preparation apparatus of the present invention.

[0049] Figure 2 The diagram shown is a flowchart of the slice preparation method of the present invention.

[0050] Component designation explanation

[0051] 100 slice preparation device

[0052] 101 Modeling Module

[0053] 103 First Grinding Control Module

[0054] 105 Image Acquisition Module

[0055] 107 Second Grinding Control Module

[0056] Steps S202~S214 Detailed Implementation

[0057] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0058] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0059] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0060] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0061] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.

[0062] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0063] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0064] In some embodiments, please refer to Figure 1 This application provides a slice preparation device 100, including: a modeling module 101, a first grinding control module 103, an image acquisition module 105, and a second grinding control module 107.

[0065] The modeling module 101 is used to acquire modeling information and grinding parameters; wherein, the modeling information includes three-dimensional data of the sample to be sliced ​​held by the gripper, and the grinding parameters include grinding a specified position; the grinding specified position is used to indicate the location of the target cut surface of the sample to be sliced ​​in the three-dimensional data.

[0066] As an example, the gripper can hold the sealed sample, with the surface to be ground facing down. The modeling module can then be used to create a model, thereby simultaneously recording the relative position of the sample and the gripper, improving the accuracy of feed rate and angle control during subsequent grinding.

[0067] The 3D data is used to display a three-dimensional image of the sample being sliced, held by the gripper. As an example, grinding a specified location may include an image of the target cut surface in the sample being sliced.

[0068] The first grinding control module 103 is connected to the modeling module 101 and is used to determine the fine grinding stop line according to the specified grinding position, and to grind the sliced ​​sample to the fine grinding stop line according to the grinding feed amount.

[0069] The fine grinding stop line is used to determine the final grinding position of the first grinding control module. The grinding feed rate is the feed rate of the grinder in both the first and second grinding control modules. As an example, the fine grinding stop line may include an image of the finely ground section of the sample being sliced. The straight-line distance between the fine grinding stop line and the designated grinding position is 0.2 mm to 0.3 mm, for example: 0.2 mm, 0.24 mm, 0.25 mm, 0.28 mm, 0.3 mm, etc.

[0070] The image acquisition module 105, connected to the modeling module 101, is used to acquire an image of the first current cut surface of the sample being sliced ​​after grinding to the fine grinding stop line, and to determine the first remaining grinding distance between the first current cut surface and the target cut surface based on the image of the first current cut surface; and to acquire an image of the second current cut surface of the sample being sliced ​​after grinding to the fine grinding stop line, and to determine the second remaining grinding distance between the second current cut surface and the target cut surface based on the image of the second current cut surface.

[0071] As an example, the fine grinding stop line may include an image of the finely ground section in the sliced ​​sample. The straight-line distance between the fine grinding stop line and the designated grinding location is 0.1 mm to 0.2 mm, for example: 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, etc.

[0072] The second grinding control module 107 is connected to the image acquisition module 105 and the modeling module 101 respectively. It is used to determine the fine grinding stop line according to the designated grinding position, grind the sliced ​​sample to the fine grinding stop line according to the grinding feed amount, determine the first grinding time of the sliced ​​sample from the fine grinding stop line to the fine grinding stop line, and determine the grinding efficiency of the second grinding control module according to the first remaining grinding distance, the second remaining grinding distance, and the first grinding time. It also determines the second grinding time according to the second remaining grinding distance and the grinding efficiency, and grinds the sliced ​​sample to the designated grinding position according to the second grinding time.

[0073] The grinding mesh number of the second grinding control module 107 is greater than that of the first grinding control module for slicing.

[0074] Specifically, since the grinding efficiency of the grinder in the second grinding control module 107 is fixed, the difference between the first remaining grinding distance and the second remaining grinding distance is determined, the grinding efficiency is determined according to the ratio of the difference to the second grinding time, and the second grinding time is determined according to the following formula;

[0075] T2 = A * X2 / η;

[0076] Where T2 is the second grinding time, A is a coefficient with a value range of 0 to 1, X2 is the second remaining grinding distance, and η is the grinding efficiency.

[0077] As an example, when the value of A is 1, the sample to be sliced ​​is ground according to the second grinding time, thereby obtaining the sample to be sliced ​​at the specified grinding position, and then the cut surface at the specified grinding position is detected.

[0078] As an example, when the value of A is less than 1, since A is less than 1, when grinding the sample according to the second grinding time, the cut surface of the ground sample will still be some distance from the designated grinding position. A smaller fine feed rate can be used to gradually grind and observe until the designated grinding position is reached, improving the grinding accuracy and avoiding the possibility of not grinding to the designated position due to machine errors directly based on the second grinding time. The fine feed rate can range from 20 micrometers to 100 micrometers, such as 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, and 100 micrometers.

[0079] As an example, when the value of A is less than 1, the image acquisition module further includes: acquiring multiple images of the Nth current cut surface of the sliced ​​sample after grinding by the second grinding control module, and determining the Nth remaining grinding distance between the Nth current cut surface and the target cut surface based on the image of the Nth current cut surface; the second grinding control module further includes: determining the Nth grinding time according to the following formula;

[0080] TN = B * XN / η, (N>2);

[0081] Where TN is the Nth grinding time, B is a coefficient ranging from 0 to 0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency;

[0082] The sliced ​​sample will be ground to the designated grinding position according to the Nth grinding time.

[0083] As an example, when the value of A is less than 1, after grinding according to the second grinding time, the image of the third current slice of the sample to be sliced ​​is obtained. The third remaining grinding distance between the third current slice and the target slice is determined according to the image of the third current slice. The third grinding time is determined according to the third grinding distance and the formula (T3=B*X3 / η). The sample to be sliced ​​is ground according to the third grinding time. Then the image of the fourth current slice of the sample to be sliced ​​after grinding according to the third grinding time is obtained. The steps of obtaining the Nth grinding time and grinding the sample to be sliced ​​according to the Nth grinding time are repeated until the specified grinding position is reached, which greatly improves the accuracy of grinding.

[0084] In the above embodiments, a modeling module acquires the three-dimensional data of the sample to be sliced ​​and the designated grinding position. A first grinding control module performs preliminary grinding according to the designated grinding position and feed rate, grinding the sample to be sliced ​​to the fine grinding stop line. Since the first grinding control module has a small grinding grit, the grinding is fast, improving the grinding efficiency of the preliminary grinding. Then, the first and second remaining grinding distances of the sample to be sliced ​​are determined by the image acquisition module. The second grinding control module determines the second grinding time based on the first and second remaining grinding distances and the first grinding time, and grinds the sample to the designated grinding position according to the second grinding time. The second grinding control module does not grind according to the feed rate of the grinding machine, but rather according to the actual grinding position determined by the image acquisition module and the grinding efficiency of the grinding machine in the second grinding control module. The sample to be sliced ​​is ground according to the formula TN = B * XN / η based on the actual grinding efficiency, and the iterative grinding method is used to reach the designated grinding position, which greatly improves the accuracy of intelligent grinding, avoids over-grinding, realizes automated slicing, and improves the detection efficiency of circuit boards.

[0085] In some embodiments, the modeling module may include a 3D X-ray modeling machine, which includes a rotating camera and 3D reconstruction software. The rotating camera can rotate around the gripper holding the sliced ​​sample. By allowing X-rays to pass through the gripper and the sliced ​​sample, some of the X-rays are absorbed. After the X-rays are absorbed, the intensity of the X-rays passing through the gripper and the sliced ​​sample changes. Multiple two-dimensional images at different angles are formed based on the intensity of the X-rays. Then, the 3D reconstruction software forms 3D data of the gripper holding the sliced ​​sample based on the multiple two-dimensional images at different angles.

[0086] In some embodiments, the first grinding control module includes: a coarse grinding unit, a medium grinding unit, and a fine grinding unit; wherein the grinding grit used in the coarse grinding unit, the medium grinding unit, and the fine grinding unit increases sequentially.

[0087] The coarse grinding unit, connected to the modeling module, is used to coarsely grind the sample to be sliced, determine the coarse grinding stop line according to the specified grinding position, and grind the sample to the coarse grinding stop line according to the grinding feed rate.

[0088] As an example, the coarse grinding stop line may include an image of the coarsely ground section in the sliced ​​sample. The straight-line distance between the coarse grinding stop line and the designated grinding location is 0.8 mm to 1.2 mm, for example: 0.8 mm, 0.9 mm, 1 mm, 1.2 mm, etc.

[0089] As an example, the grit of the coarse grinding unit may include 100-140 grit, such as 100 grit, 110 grit, 120 grit, 130 grit, 140 grit, etc.

[0090] The intermediate grinding unit, connected to the modeling module, is used to perform intermediate grinding on the sample after coarse grinding. It determines the intermediate grinding stop line according to the specified grinding position and grinds the sample to the intermediate grinding stop line according to the grinding feed rate.

[0091] As an example, the intermediate grinding stop line may include an image of the intermediate grinding section in the sliced ​​sample. The straight-line distance between the intermediate grinding stop line and the designated grinding location is 0.3 mm to 0.5 mm, for example: 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0092] As an example, the grinding grit of the medium grinding unit may include 380-420 grit, such as 380 grit, 390 grit, 400 grit, 410 grit, 420 grit, etc.

[0093] The fine grinding unit, connected to the modeling module, is used to fine grind the sliced ​​sample after medium grinding. It determines the fine grinding stop line according to the specified grinding position and grinds the sliced ​​sample to the fine grinding stop line according to the grinding feed rate.

[0094] As an example, the grinding grit of the fine grinding unit may include 1300-1700 grit, such as 1300 grit, 1400 grit, 1500 grit, 1600 grit, 1700 grit, etc.

[0095] As an example, the slicing preparation apparatus may also include a cleaning module for removing moisture from the cut surface using a high-pressure air gun after grinding.

[0096] In some embodiments, the first grinding control module can also set parameters such as the lifespan of the sandpaper and the flow rate of the cooling water in the grinder, thereby further improving the accuracy of grinding.

[0097] In some embodiments, the image acquisition module may include a microscope for acquiring images of the cross-section.

[0098] As an example, high-speed, high-resolution acquisition of cross-sectional images can be achieved by setting the magnification of the microscope, the intensity of the light source, the depth of focus, etc.

[0099] In some embodiments, determining the first remaining grinding distance between the first current cut surface and the target cut surface based on the image of the first current cut surface includes: determining the contour line of a certain structure in the image of the first current cut surface using an edge detection algorithm based on the mapping relationship between the two-dimensional image and the three-dimensional data, projecting it onto the surface of the sliced ​​sample in the three-dimensional data, determining the current position in the three-dimensional data using an iterative nearest point algorithm, and determining the first remaining grinding distance based on the distance between the current position and the target cut surface.

[0100] In some embodiments, determining the second remaining grinding distance between the second current cut surface and the target cut surface based on the image of the second current cut surface includes: determining the contour line of a certain structure in the image of the second current cut surface using an edge detection algorithm based on the mapping relationship between the two-dimensional image and the three-dimensional data, projecting it onto the surface of the sliced ​​sample in the three-dimensional data, determining the current position in the three-dimensional data using an iterative nearest point algorithm, and determining the second remaining grinding distance based on the distance between the current position and the target cut surface.

[0101] In some embodiments, the slice preparation apparatus further includes a polishing module for polishing the sample to be sliced ​​after grinding to a specified position.

[0102] As an example, the polishing time can range from 15 to 25 seconds, such as 15 seconds, 17 seconds, 20 seconds, 23 seconds, 25 seconds, etc.

[0103] In some embodiments, the grinding parameters further include micro-etching parameters; the slice preparation apparatus further includes: a micro-etching module, connected to the modeling module, used to perform micro-etching treatment on the sliced ​​sample ground to a specified grinding position according to the micro-etching parameters.

[0104] As an example, micro-etching parameters may include micro-etching time, which can range from 1 second to 5 seconds, such as 1 second, 2 seconds, 3 seconds, 4 seconds, 5 seconds, etc. The micro-etched sample can also be cleaned by using a high-pressure air gun to remove moisture from the cut surface.

[0105] In some embodiments, the image acquisition module further includes: acquiring an image of the target section surface ground to a specified grinding location; the slice preparation device further includes: a measurement module connected to the image acquisition module, used to output detection data based on the image of the target section surface; the detection data includes the dimensions of each structure in the target section surface.

[0106] In some embodiments, please refer to Figure 2 This application also provides a method for preparing slices, including steps S202-S214.

[0107] Step S202: Obtain modeling information and grinding parameters; wherein, the modeling information includes three-dimensional data of the sample to be sliced ​​held by the gripper, and the grinding parameters include grinding a specified position; the grinding specified position is used to indicate the location of the target cut surface of the sample to be sliced ​​in the three-dimensional data.

[0108] Step S204: Determine the fine grinding stop line according to the designated grinding position, and grind the sliced ​​sample to the fine grinding stop line according to the grinding feed rate.

[0109] Step S206: Obtain an image of the first current cut surface of the sliced ​​sample that has been ground to the fine grinding stop line, and determine the first remaining grinding distance between the first current cut surface and the target cut surface based on the image of the first current cut surface.

[0110] Step S208: Determine the fine grinding stop line according to the designated grinding position, grind the sliced ​​sample to the fine grinding stop line according to the grinding feed rate, and determine the first grinding time from the fine grinding stop line to the fine grinding stop line.

[0111] Step S210: Obtain an image of the second current cut surface of the sliced ​​sample that has been ground to the fine grinding stop line, and determine the second remaining grinding distance between the second current cut surface and the target cut surface based on the image of the second current cut surface.

[0112] Step S212: Determine the grinding efficiency of the second grinding control module based on the first remaining grinding distance, the second remaining grinding distance, and the first grinding time.

[0113] Step S214: Determine the second grinding time based on the second remaining grinding distance, grinding efficiency, and the following formula. Grind the sliced ​​sample to the designated grinding position according to the second grinding time: T2=A*X2 / η; where T2 is the second grinding time, A is a coefficient with a value range of 0~1, X2 is the second remaining grinding distance, and η is the grinding efficiency.

[0114] When A is less than 1, the image of the Nth current cut surface of the sample after grinding is acquired multiple times, and the Nth remaining grinding distance between the Nth current cut surface and the target cut surface is determined based on the image of the Nth current cut surface; the Nth grinding time is determined according to the following formula, and the sample to be ground is ground to the designated grinding position according to the Nth grinding time;

[0115] TN = B * XN / η, (N>2);

[0116] Where TN is the Nth grinding time, B is a coefficient ranging from 0 to 0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency.

[0117] In summary, this invention acquires the three-dimensional data of the sample to be sliced ​​and the designated grinding position through a modeling module. A first grinding control module performs preliminary grinding based on the designated grinding position and feed rate, grinding the sample to the fine grinding stop line. Because the first grinding control module has a smaller grit size, grinding is faster, improving the efficiency of the preliminary grinding. Then, the image acquisition module determines the first and second remaining grinding distances of the sample. The second grinding control module determines the second grinding time based on the first and second remaining grinding distances and the first grinding time, and grinds the sample to the designated grinding position according to the second grinding time. The second grinding control module does not grind based on the feed rate of the grinding machine, but rather on the actual grinding position determined by the image acquisition module and the grinding efficiency of the grinding machine in the second grinding control module, greatly improving grinding accuracy, avoiding over-grinding, achieving automated slicing, and improving the inspection efficiency of circuit boards.

[0118] This invention significantly reduces reliance on human labor, while also significantly improving operational stability and safety by eliminating fatigue errors and safety hazards associated with manual operation.

[0119] This invention also enables intelligent switching and grinding operations of the sliced ​​sample between different tracks of the grinder, optimizing the contact path and force distribution between the slice and the sandpaper, resulting in more uniform sandpaper wear and improved sandpaper utilization. Simultaneously, this invention achieves precise metering and on-demand spraying of the grinding fluid, effectively saving grinding fluid usage compared to traditional manual spraying, thus reducing production costs and resource consumption.

[0120] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0121] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A slice preparation apparatus, characterized by, The application comprises: a modeling module, configured to acquire modeling information and grinding parameters; the modeling information comprises three-dimensional data of a sample held by a grabber, and the grinding parameters comprise a grinding designated position; the grinding designated position is used to indicate a position of a target section of the sample in the three-dimensional data; a first grinding control module, connected with the modeling module, configured to determine a fine grinding stop line according to the grinding designated position, and grind the sample to the fine grinding stop line according to a grinding feed amount; an image acquisition module, connected with the modeling module, configured to acquire an image of a first current section of the sample ground to the fine grinding stop line, determine a first remaining grinding distance between the first current section and the target section according to the image of the first current section, and acquire an image of a second current section of the sample ground to a fine grinding stop line, and determine a second remaining grinding distance between the second current section and the target section according to the image of the second current section; a second grinding control module, connected with the image acquisition module and the modeling module respectively, configured to determine the fine grinding stop line according to the grinding designated position, grind the sample to the fine grinding stop line according to the grinding feed amount, determine a first grinding time of the sample from the fine grinding stop line to the fine grinding stop line, determine a grinding efficiency of the second grinding control module according to the first remaining grinding distance, the second remaining grinding distance and the first grinding time, determine a second grinding time according to the second remaining grinding distance, the grinding efficiency and the following formula, and grind the sample to the grinding designated position according to the second grinding time; T2=A*X2 / η; wherein T2 is the second grinding time, A is a coefficient, the value range of A is 0-1, X2 is the second remaining grinding distance, and η is the grinding efficiency; wherein when the value of A is less than 1, the image acquisition module further comprises: acquiring an image of an Nth current section of the sample ground by the second grinding control module for multiple times, and determining an Nth remaining grinding distance between the Nth current section and the target section according to the image of the Nth current section; the second grinding control module further comprises: determining the Nth grinding time according to the following formula; TN=B*XN / η, (N>2); wherein TN is the Nth grinding time, B is a coefficient, the value range of B is 0-0.9, XN is the Nth remaining grinding distance, and η is the grinding efficiency; grinding the sample to the grinding designated position according to the Nth grinding time; wherein the polishing mesh number of the second grinding control module is greater than the polishing mesh number of the first grinding control module.

2. The slice preparation device of claim 1, wherein The first grinding control module comprises: a coarse grinding unit, connected with the modeling module, configured to coarsely grind the sample, determine a coarse grinding stop line according to the grinding designated position, and grind the sample to the coarse grinding stop line according to a grinding feed amount; A middle grinding unit, connected with the modeling module, is configured to perform middle grinding on the coarsely ground sample, determine a middle grinding stop line according to the grinding designated position, and grind the sample to the middle grinding stop line according to a grinding feed amount; A fine grinding unit, connected with the modeling module, is configured to perform fine grinding on the middle-ground sample, determine a fine grinding stop line according to the grinding designated position, and grind the sample to the fine grinding stop line according to a grinding feed amount; The grinding grits used in the coarse grinding unit, the middle grinding unit and the fine grinding unit are sequentially increased.

3. The slice preparation device of claim 1, wherein, The section preparation device further comprises: A polishing module configured to perform polishing on the sample ground to the grinding designated position.

4. The slice preparation device of claim 1, wherein, The grinding parameters further comprise etching parameters. The section preparation device further comprises: An etching module, connected with the modeling module, configured to perform etching on the sample ground to the grinding designated position according to the etching parameters.

5. A method of slice preparation, characterized by, The method comprises: Obtaining modeling information and grinding parameters; wherein the modeling information comprises three-dimensional data of the sample held by the gripper, and the grinding parameters comprise a grinding designated position; the grinding designated position is used to indicate a position of a target section of the sample in the three-dimensional data; Determine a fine grinding stop line according to the grinding designated position, and grind the sample to the fine grinding stop line according to a grinding feed amount; Obtain an image of a first current section of the sample ground to the fine grinding stop line, determine a first remaining grinding distance between the first current section and the target section according to the image of the first current section; Determine a fine grinding stop line according to the grinding designated position, grind the sample to the fine grinding stop line according to the grinding feed amount, and determine a first grinding time for grinding the sample from the fine grinding stop line to the fine grinding stop line; Obtain an image of a second current section of the sample ground to the fine grinding stop line, determine a second remaining grinding distance between the second current section and the target section according to the image of the second current section; Determine a grinding efficiency of a second grinding control module according to the first remaining grinding distance, the second remaining grinding distance and the first grinding time; Determine the second grinding time according to the second remaining grinding distance, the grinding efficiency and the following formula, and grind the sample to the grinding designated position according to the second grinding time: T2=A*X2 / η; wherein T2 is the second grinding time, A is a coefficient, the value range of A is 0-1, X2 is the second remaining grinding distance, and η is the grinding efficiency; wherein when A is less than 1, the image of an Nth current section of the sample after grinding is obtained multiple times, and an Nth remaining grinding distance between the Nth current section and the target section is determined according to the image of the Nth current section; Determine an Nth grinding time according to the following formula, and grind the sample to the grinding designated position according to the Nth grinding time: TN=B*XN / η, (N>2); Wherein, TN is the N grinding time, B is a coefficient, the value range of B is 0-0.9, XN is the N remaining grinding distance, and η is the grinding efficiency.

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