Liquid cooling device, system and control method

Abstract

The invention provides a liquid cooling device and system and a control method, and can be applied to the technical field of heat dissipation. The liquid cooling device (100) comprises: a cold plate (101) comprising a plate body (103) and a microchannel array (104) formed in the plate body (103), the middle area of the plate body (103) being provided with a first liquid inlet and a first liquid outlet; the liquid cooling pipeline (102) is connected with the first liquid inlet and the first liquid outlet and is used for conveying cooling liquid to the first liquid inlet; the micro-channel array (104) is configured to guide the cooling liquid flowing in from the first liquid inlet to the areas on the two sides of the plate body (103) and then return to the first liquid outlet to flow out; the micro-channel array (104) is further configured to have a preset depth-to-width ratio to form a first flow resistance to the cooling liquid so as to reduce the flow velocity of the cooling liquid in the micro-channel array (104).

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a liquid cooling device, system and control method. BACKGROUND

[0002] With the development of artificial intelligence and high-performance computing, the power density of central processing units (CPUs) and graphics processing units (GPUs) of electronic devices has increased dramatically, and liquid cooling technology has become the mainstream solution to replace air cooling. However, when using the same cooling liquid distribution unit (CDU) to supply liquid to different types of cold plates (such as GPU cold plates with high flow demand and CPU cold plates with low flow demand) in the case, there are serious challenges. The flow demand of the two is significantly different, and the existing system is difficult to efficiently match, resulting in uneven flow distribution. If the total flow is forcibly increased to meet the high flow demand of the GPU, excessive pressure drop, vibration and leakage risk will occur when flowing through the traditional low-flow resistance CPU cold plate, not only increasing the pumping power consumption, reducing the system electric energy use efficiency, but also increasing the system cost and failure rate. SUMMARY

[0003] In view of the above problems, the present application provides a liquid cooling device, system and control method for improving heat dissipation efficiency.

[0004] The first aspect of the present application provides a liquid cooling device, comprising: a cold plate comprising a plate body and a microchannel array formed in the plate body, a first liquid inlet and a first liquid outlet are arranged in the middle region of the plate body; the microchannel array is configured to guide the cooling liquid flowing from the first liquid inlet to the two side regions of the plate body and then return to the first liquid outlet; the microchannel array is also configured to have a preset aspect ratio to form a first flow resistance to the cooling liquid, so as to reduce the flow rate of the cooling liquid in the microchannel array; a liquid cooling pipeline connected to the first liquid inlet and the first liquid outlet for conveying cooling liquid to the first liquid inlet.

[0005] The second aspect of the present application provides a liquid cooling system, comprising a first liquid cooling device applied to a first heat generating element, a second liquid cooling device applied to a second heat generating element and a cooling liquid distribution unit, the liquid cooling pipelines of the first liquid cooling device and the second liquid cooling device are connected in parallel to the cooling liquid distribution unit; the first liquid cooling device is the liquid cooling device of any one of the first aspect, having a first flow resistance; the second liquid cooling device has a second flow resistance, the second flow resistance is different from the first flow resistance, the first flow resistance and the second flow resistance are used to control the ratio of the first cooling liquid flow rate flowing through the first liquid cooling device and the second cooling liquid flow rate flowing through the second liquid cooling device, and match the heat dissipation requirements of the first liquid cooling device and the second liquid cooling device.

[0006] The third aspect of the present application provides a control method applied to the liquid cooling system of the first aspect, the method comprising: calculating a temperature change rate of the first heat generating element based on the temperature of the first liquid cooling device; in response to the temperature change rate of the first heat generating element being greater than a second threshold value, generating a first control instruction, the first control instruction being used to control the cooling liquid distribution unit to increase the first cooling liquid flow rate.

[0007] The liquid cooling device and the liquid cooling system provided by the embodiments of the present application can assign appropriate cooling liquid flow rates to different cold plates by presetting different flow resistances for the cold plates of different heat generating elements, without the need to additionally set active control valves, thereby solving the problem of the need to separately match flow rates for different heat generating elements. By designing reasonable microchannel structures and presetting flow resistances, the flow rate of the cooling liquid in the microchannels can also be effectively reduced, thereby avoiding problems such as excessive pressure drop, turbulent vibration and potential leakage risk caused by excessively high flow rates, and improving the safety and stability of the cooling device.

[0008] The control method provided by the embodiments of the present application enables the liquid cooling system to not only passively distribute flow rates, but also actively respond to conditions such as sudden temperature rise and abnormal flow rate, thereby preventing overheating by adjusting the CDU or the power of the heat generating element, achieving dynamic thermal management, and improving the ability of the system to respond to sudden computing loads. BRIEF DESCRIPTION OF DRAWINGS

[0009] The above content and other purposes, features and advantages of the present application will be more clearly understood through the following description of the embodiments of the present application with reference to the accompanying drawings, in which:

[0010] Figure 1 The structure of the liquid cooling device according to the embodiments of the present application is schematically shown;

[0011] Figure 2 The internal structure of the cold plate according to the embodiments of the present application is schematically shown;

[0012] Figure 3 The overall structure of the cold plate according to the embodiments of the present application is schematically shown;

[0013] Figure 4 The liquid cooling pipeline connector according to the embodiments of the present application is schematically shown;

[0014] Figure 5 The composition of the liquid cooling system according to the embodiments of the present application is schematically shown;

[0015] Figure 6 The flowchart of the control method according to an embodiment of the present application is schematically shown;

[0016] Figure 7 The flowchart of the control method according to another embodiment of the present application is schematically shown.

[0017] BRIEF DESCRIPTION OF DRAWINGS

[0018] 100 - liquid cooling device; 101 - cold plate; 102 - liquid cooling pipeline; 103 - plate body; 104 - micro-channel array; 105 - first flow channel; 106 - second flow channel; 107 - first connecting channel; 108 - second connecting channel; 109 - third connecting channel; 110 - fourth connecting channel; 111 - fin; 112 - liquid cooling pipeline connecting piece; 113 - cooling liquid distribution unit; 114 - coupler; 115 - first quick plug connector; 116 - second quick plug connector; 117 - first pipeline adapter; 118 - second pipeline adapter; 119 - liquid leakage detection line; 120 - upper cover; 121 - cold plate bracket; 122 - through hole; 123 - first liquid inlet connector; 124 - first liquid outlet connector; 200 - liquid cooling system; 201 - first liquid cooling device; 202 - second liquid cooling device. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0020] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, which is determined by the ordinary skilled person considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled person in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0021] The embodiment of the present application provides a liquid cooling device 100, which can be applied to the field of high-power-density electronic equipment with extremely high heat dissipation requirements, and the core application scenarios are servers and data centers, especially integrated with multiple high-power consumption computing nodes, such as CPUs, GPUs, application-specific integrated circuits, artificial intelligence chips and the like.

[0022] With the continuous improvement of chip power density, for example, the heat flux density of some high-performance GPUs has exceeded 200W / cm², and the traditional air cooling and even part of the liquid cooling scheme has approached the heat dissipation limit. The cold plate liquid cooling technology adopted by the liquid cooling device 100 has a heat transfer efficiency far exceeding air cooling, which can effectively cope with such challenges.

[0023] In the parallel liquid cooling circuit, the pressure difference between the inlet and outlet of each branch is equal, and the flow Q and the flow resistance coefficient R follow the physical relationship: ΔP=R·Q2. This means that by accurately designing and fixing the flow resistance coefficient R of each cold plate, each branch will automatically obtain a specific flow Q matching its heat dissipation demand under the same system pressure difference ΔP.

[0024] The liquid cooling device 100 provided by the embodiments of the present application can allocate appropriate cooling liquid flow to the cold plate through a reasonable micro-channel structure and a preset flow resistance, without the need for additional active control valves, thereby solving the problem of the need for separate flow matching for different heat generating elements. Through the reasonable micro-channel structure and the preset flow resistance, the flow rate of the cooling liquid in the micro-channel can also be effectively reduced, thereby avoiding problems such as excessive pressure drop, turbulent vibration, and potential leakage risk caused by excessively high flow rate, and improving the safety and stability of the cooling device.

[0025] In an application scenario containing elements of different power consumption levels, such as a high-power GPU and a relatively low-power CPU, the liquid cooling device 100 can preset different flow resistances for the cold plates of different heat generating elements, for example, a smaller flow resistance for the GPU cold plate to obtain a larger flow rate, and a larger flow resistance for the CPU cold plate to allocate a smaller but sufficient flow rate. In this way, the differential cooling resource allocation is automatically and passively achieved in a unified cooling circuit.

[0026] The liquid cooling device 100 provided by the embodiments of the present application will be described in detail below.

[0027] Figure 1 The structure of the liquid cooling device 100 according to the embodiments of the present application is schematically shown.

[0028] As shown in Figure 1 , the liquid cooling device 100 includes a cold plate 101 and a liquid cooling pipeline 102.

[0029] Figure 2 The internal structure of the cold plate 101 according to the embodiments of the present application is schematically shown.

[0030] As shown in Figure 2 , the cold plate 101 includes a plate body 103 and a micro-channel array 104 formed in the plate body 103, and the middle region of the plate body 103 is provided with a first liquid inlet and a first liquid outlet. The liquid cooling pipeline 102 connects the first liquid inlet and the first liquid outlet, and is used to deliver cooling liquid to the first liquid inlet. The micro-channel array 104 is configured to guide the cooling liquid flowing from the first liquid inlet to the two side regions of the plate body 103 and then return to the first liquid outlet. The micro-channel array 104 is also configured to have a preset aspect ratio to form a first flow resistance to the cooling liquid, so as to reduce the flow rate of the cooling liquid in the micro-channel array 104.

[0031] like Figure 2 As shown, the plate 103 is a rectangular metal plate with a flat bottom that contacts the heating element. Inside the plate 103, a microchannel array 104 is formed through etching. By designing the orientation of the microchannel array 104, the coolant is divided into two paths: one on the left side and one on the right side of the plate 103. Each side has a U-shaped, two-way flow path. Taking the left side as an example, the coolant enters the left microchannel, flows towards the edge of the plate 103, then turns back through a channel located at the edge, and finally flows back to the center of the plate 103, where it converges and flows out from the first outlet. The coolant flows along this "entering in the middle, splitting on both sides, and turning back in a U-shape" path, fully covering the entire heating area of ​​the chip and ensuring efficient heat exchange.

[0032] In embodiments of this application, the microchannels in the microchannel array 104 are designed with a reasonable preset aspect ratio. This deep and narrow channel shape significantly increases fluid friction, thereby creating the desired initial flow resistance.

[0033] In fluid mechanics, the flow rate of coolant in a pipe can be represented by the following model:

[0034] ΔP = Q × R

[0035] Where ΔP represents the pressure difference provided by the CDU that delivers cooling value, Q represents the flow rate of the coolant, and R represents the flow resistance that hinders the flow of the coolant.

[0036] With a fixed pressure differential ΔP, the higher the flow resistance R, the lower the flow rate Q. In parallel liquid cooling systems, such as when the CPU's and GPU's cold plates are connected in parallel to the same CDU, the CDU provides approximately the same total pressure differential for all parallel branches, and the flow rate is automatically distributed according to the flow resistance of each branch. Cold plates with high flow resistance will automatically receive a smaller flow rate, while cold plates with low flow resistance will receive a larger flow rate.

[0037] When the coolant flow rate increases to a certain level, its flow state will change from laminar to turbulent due to the increase in Reynolds number. Turbulence will cause periodic pulsations in fluid pressure, and this pulsation effect will be transmitted to the piping system and pump body, potentially inducing mechanical vibration. This vibration will pose a challenge to the sealing reliability of pipeline connections and the long-term operational stability of the pump.

[0038] The present application can set different first flow resistances for the cold plates of different heat generating elements by designing appropriate microchannel aspect ratios, so as to define reasonable flow rates for the microchannels. According to the formula flow rate = flow rate / flow cross-sectional area, the flow rate can be limited by the first flow resistance, and at the same time, the narrow channel also means a small flow cross-sectional area, thereby limiting the flow rate in the microchannel. By setting a reasonable aspect ratio, the flow rate in the microchannel can be controlled at a reasonable level. By limiting the flow rate to a range tending to be laminar or weak turbulent flow through high flow resistance, the noise and mechanical stability of the liquid cooling device 100 can be significantly improved, and the problems of vibration and potential leakage risk can be fundamentally solved. In addition, by limiting the first flow resistance to limit the flow rate in the microchannel, it can avoid providing excessive cooling liquid for the heat generating elements, and reduce the energy consumption of pumping these invalid flow rates. At the same time, by limiting the first flow resistance, it can prevent the problem of cooling efficiency decline caused by the inability of the cooling liquid to be distributed according to the actual needs of each heat generating element.

[0039] In some embodiments of the present application, the preset aspect ratio is greater than or equal to 3.1:1. For example, in a liquid cooling cold plate for a high-power CPU, the width of the microchannel can be 0.2±0.1mm, the depth of the flow channel is 3±0.2mm, the aspect ratio is 15:1, and the thickness of the fin 111 of the microchannel is 0.2mm. This design forms a high flow resistance to the cooling liquid, effectively limiting its flow rate, and ensuring that a lower flow rate matching the CPU heat dissipation requirement is obtained in the parallel system.

[0040] As shown in Figure 2 The microchannel array includes flow channel groups symmetrically arranged on the first side and the second side of the plate body 103, and the flow channel groups on the first side and the second side each include a first flow channel 105 and a second flow channel 106, both of which are composed of a plurality of microchannels. The flow channel layout on the first side and the second side is completely mirror-symmetric, ensuring the uniformity of the cooling liquid flow rate and heat exchange. The cooling liquid needs to flow through the first flow channel 105 and the second flow channel 106 on each side, prolonging the flow path and time in the plate body 103, thereby fully utilizing the heat exchange area.

[0041] The microchannel array 104 further includes a first connecting channel 107 and a second connecting channel 108.

[0042] The first connecting channel 107 is disposed between the first flow channels 105 on the first and second sides, connected to the first inlet, and connected to the inlets of both the first and second flow channels 105. The first connecting channel 107 acts as a distributor, evenly distributing the coolant from the first inlet to the first flow channels 105 on both sides. When coolant is injected from the first inlet, it first enters the first connecting channel 107. Its relatively wide cross-section causes the flow velocity to decrease instantaneously, converting dynamic pressure into static pressure, thus achieving initial pressure equalization. Subsequently, driven by the balanced pressure, the coolant is synchronously and evenly distributed to the first flow channels 105 on both sides, effectively avoiding the problem of excessive flow on one side and insufficient flow on the other side due to uneven distribution.

[0043] The second connecting channel 108 is structurally symmetrical to the first connecting channel 107, and is located between the second flow channels 106 on the first and second sides. It connects to the first outlet and to the outlets of both the first and second flow channels 106. The second connecting channel 108 acts as a collector, gathering the coolant flowing back from the second flow channels 106 on both sides to the first outlet. Similarly, the second connecting channel 108, through its flow-collecting cavity structure, smoothly collects the liquid flow and guides it to the outlet, avoiding localized eddies and additional flow resistance caused by sudden contraction or turning of the flow path, thus ensuring the stability of the outflow process.

[0044] The outlet of the first flow channel 105 on the first side is connected to the inlet of the second flow channel 106 on the first side via the third connecting channel 109; the outlet of the first flow channel 105 on the second side is connected to the inlet of the second flow channel 106 on the second side via the fourth connecting channel 110. The third connecting channel 109 and the fourth connecting channel 110 serve as turning channels, completing a 180° flow direction change from the first flow channel 105 to the second flow channel 106 within each side. Specifically, after the coolant flows through the first flow channel 105 and reaches the edge of the plate, it enters the third connecting channel 109 or the fourth connecting channel 110. This channel acts as a turning chamber, guiding the coolant to smoothly and evenly return and enter the second flow channel 106. This design creates a highly efficient "U-shaped" two-way flow path for the coolant on one side, which not only significantly extends the residence time and flow path of the coolant in the effective heat exchange area, making heat exchange more thorough, but also effectively balances the pressure distribution inside the plate through the symmetrical flow field design, suppressing the risk of structural vibration or deformation caused by uneven pressure, and improving the reliability and quietness of the cold plate.

[0045] Both the first flow channel 105 and the second flow channel 106 include multiple parallel microchannels. (Reference) Figure 2On the first side of the plate 103, the first flow channel 105 is composed of multiple parallel microchannels extending in the same direction; the second flow channel 106 is composed of multiple parallel microchannels extending in the same direction. The first and second microchannels extend in opposite directions and correspond one-to-one, meaning the inlet of one first microchannel corresponds to the inlet of another second microchannel. This symmetrical flow channel layout ensures a balanced distribution of coolant pressure within the plate 103, reducing structural deformation or vibration that may result from uneven pressure. Compared to a complex serpentine single-channel design, this parallel multi-channel design effectively reduces overall flow resistance and helps lower the system's pumping power consumption.

[0046] refer to Figure 2 The third connecting channel 109 and the fourth connecting channel 110 are located at the end regions on both sides of the plate 103. Positioning the third connecting channel 109 and the fourth connecting channel 110 at the ends of the plate 103 allows the coolant to complete a 180° turn from the first flow channel 105 to the second flow channel 106 on each side. This layout forms a compact and smooth U-shaped flow path, significantly extending the effective flow path and heat exchange time of the coolant within the limited area of ​​the plate 103, thus improving heat dissipation efficiency. This design allows the coolant to flow through the edge regions of the plate 103, thereby covering the entire surface of the plate 103, including the outermost region, helping to eliminate potential local hot spots at the chip edges and ensuring the uniformity of the chip package surface temperature. Fixing the turning channels to the end regions avoids opening large transverse flow channels in the middle of the plate 103, helping to maintain the mechanical strength and structural integrity of the core pressure-bearing and heat-transfer areas of the plate 103. At the same time, this layout pattern facilitates one-time molding through precision machining methods such as etching and milling, and has good process feasibility.

[0047] In the embodiments of this application, the widths of the third connecting channel 109 and the fourth connecting channel 110 are greater than the widths of the microchannels in the microchannel array 104. The increased width of the third connecting channel 109 and the fourth connecting channel 110, serving as turning and collecting cavities connecting the first flow channel 105 and the second flow channel 106, significantly increases the flow cross-sectional area. This effectively reduces the local resistance loss caused by the rapid contraction or expansion of the channels when the flow channel turns, thereby optimizing the overall pressure drop of the entire flow channel system and helping to reduce the system's pumping power requirements. As miniature distribution or collecting cavities, the third connecting channel 109 and the fourth connecting channel 110 allow the coolant to achieve sufficient mixing and pressure rebalancing after flowing out from the multiple parallel microchannels of the first flow channel 105, before smoothly and uniformly entering each parallel microchannel of the second flow channel 106. This helps ensure consistent flow distribution within all microchannels of the second flow channel 106, thereby improving heat dissipation uniformity and avoiding localized overheating caused by uneven flow distribution. Sufficiently wide connection channels also prevent coolant from creating eddies or dead zones in the turning areas. Smooth flow helps to remove any air bubbles or tiny impurities that may accumulate in this area, reducing the risk of decreased heat dissipation performance due to air blockage or clogging, and improving the long-term reliability of the 101 cold plate.

[0048] In the embodiments of this application, after the coolant enters the first connecting channel 107 from the first inlet, it is evenly and simultaneously distributed to the first microchannel on the first side and the second microchannel on the second side. After flowing through their respective channels, the coolant is turned back through the third connecting channel 109 and the fourth connecting channel 110, and then enters and flows in parallel through the third and fourth microchannels of the second flow channel 106, finally converging in the second connecting channel 108 and flowing out from the first outlet. This parallel flow channel design allows the coolant to flow from the center to both sides, covering the entire board area. This symmetrical design ensures that heat can be carried away simultaneously and evenly from the center and edges of the chip, effectively avoiding the problem of excessively high local hot spots that may be caused by the traditional "one-end in, one-end out" design, thereby improving the operational stability and performance of the heat-generating element. The two-way flow channel design allows the coolant to stay in the board 103 for a longer time and flows over a larger heat exchange area. After the coolant is heated as it flows through the first flow channel 105, it can continue to absorb heat as it flows back through the second flow channel 106, thus maximizing the heat exchange process.

[0049] refer to Figure 2The microchannels of the microchannel array are formed based on parallel fins 111, with the fins 111 having an angle of 90°±2°. These fins 111 are formed directly on the plate substrate through precision machining, such as serration, etching, or milling, and the gaps between adjacent fins 111 constitute the microchannels. The fins 111, perpendicular to the bottom surface, provide the smoothest and most regular flow path for the coolant, helping to reduce unnecessary turbulence and resistance, allowing the coolant to be distributed more evenly to each microchannel, thereby improving the overall heat exchange efficiency. The burst pressure requirement of the fins 111 is not less than 1.5MPa. When subjected to the internal pressure of the coolant, the right-angle fin structure can evenly transfer stress to the plate substrate, avoiding flow resistance disturbances caused by irregular flow path design, thereby enhancing the structural integrity and long-term pressure resistance reliability of the microchannel array 104.

[0050] Figure 3 A schematic diagram of the overall structure of the cold plate 101 according to an embodiment of this application is shown.

[0051] like Figure 3 As shown, the cold plate 101 also includes a top cover 120 and a cold plate bracket 121. The top cover 120 is fixedly covered on the top surface of the plate body 103, and together with the plate body 103, it encloses the sealed cavity of the microchannel array 104. The top cover 120 is a key component constituting the closed flow channel, and its inner side, together with the microchannel area on the plate body 103, defines the flow space of the coolant. The cold plate bracket 121 is located at the bottom of the plate body 103. This bracket is mainly used to support the entire cold plate structure and provide a mechanical interface with the target heat-generating element. It is usually designed with mounting holes to facilitate the reliable fixing of the cold plate 101 to the server motherboard or heat dissipation module, while ensuring that the bottom of the cold plate 101 maintains appropriate contact pressure with the chip surface to achieve efficient heat conduction. This structural design achieves reliable sealing and pressure bearing of the flow channel through the combination of the top cover 120 and the plate body 103, ensuring the safe operation of the cooling circuit. At the same time, the independent cold plate bracket 121 achieves the separation of mechanical support and installation positioning functions. This modular design not only improves the structural strength and reliability of the product, but also facilitates assembly and maintenance, which is the key to realizing the engineering application of liquid cooling devices 100.

[0052] In the embodiments of this application, the upper cover 120 is provided with through holes 122 that precisely correspond to the positions of the first liquid inlet and the first liquid outlet. The through holes 122 are provided with threads that match the first liquid outlet connector 124 or the first liquid inlet connector 123 of the liquid cooling pipeline 102. Specifically, the first liquid outlet connector 124 of the liquid cooling pipeline 102 delivers coolant from the CDU and is screwed into and connected to the upper cover through hole 122 corresponding to the first liquid inlet; correspondingly, the first liquid inlet connector 123 collects coolant flowing out from the cold plate 101 and is screwed into and connected to the upper cover through hole 122 corresponding to the first liquid outlet. The threaded connection provides a reliable interface with high mechanical strength and good vibration resistance, ensuring that the coolant will not leak under high pressure. The first liquid outlet connector 124 is located above the microchannel array 104, so that the coolant has a natural height difference when entering the microchannel array 104, which can discharge the air in the microchannel from top to bottom, and allow it to be smoothly discharged from the liquid outlet located at a relatively low position along with the liquid flow. It can also optimize the flow distribution, so that the coolant is more evenly distributed on the cross-section of the entire microchannel array 104, and improve the heat dissipation uniformity.

[0053] It should be noted that the first liquid outlet connector 124 and the first liquid inlet connector 123 are not located at the end of the liquid cooling pipeline 102, but rather in the middle section of the liquid cooling pipeline 102. Based on this design, the liquid cooling pipeline 102 is an independent component, with both ends capable of connecting to the CDU or other cold plates, while the cold plate 101 is connected to the pipeline system through its middle section interface. Placing the connectors in the middle section of the pipeline makes the cold plate 101 itself an independent, quickly replaceable module. When maintenance or replacement of a particular cold plate 101 is required, only that unit can be operated on without disassembling the entire liquid cooling circuit, greatly improving the system's maintainability.

[0054] In the embodiments of this application, reference is made to Figure 2 The central axes of the first liquid outlet connector 124 and the first liquid inlet connector 123 are parallel to each other, and the interfaces connecting to the liquid cooling pipeline 102 face opposite directions. For example, the interface of the first liquid outlet connector 124 is connected to the axial left side of the liquid cooling pipeline 102, while the interface of the first liquid inlet connector 123 is connected to the axial right side of the pipeline. This design with opposite interface orientations allows the liquid outlet and inlet pipelines to be led out from different sides of the connection point, which can more naturally conform to the spatial constraints within the mechanical structure where the liquid cooling device 100 is located, making the pipeline route smoother, reducing unnecessary sharp bends and twists, thereby reducing local flow resistance and potential stress concentration. The symmetrical layout of the first liquid outlet connector 124 and the first liquid inlet connector 123, which are parallel and have opposite interface orientations, helps to balance the torque at the joint, making the entire connection structure more evenly stressed and more stable when subjected to vibration or accidental tension.

[0055] In some embodiments, reference Figure 1Multiple cold plates 101 are connected in series on the liquid cooling pipeline. For example, in one embodiment, after the coolant flows out of the CDU, it flows sequentially through the first cold plate, the second cold plate, and so on, up to the Nth cold plate, connected in series on the same liquid cooling pipeline 102, and finally returns to the CDU. The outlet of the previous cold plate is connected to the inlet of the next cold plate via the liquid cooling pipeline 102, and so on, forming a series loop. This series configuration significantly reduces the number of main pipelines and connectors required. Compared to laying a separate pair of inlet and outlet pipelines for each cold plate, the series method simplifies the system layout, reduces material costs and installation complexity, and is particularly suitable for scenarios requiring the cooling of multiple similar heat-generating elements.

[0056] It should be noted that in a series piping system, the flow rate through each cold plate is the same. However, because the coolant absorbs heat as it flows through each cold plate, its temperature increases progressively, resulting in a higher coolant inlet temperature at the downstream cold plate compared to the upstream cold plate. Therefore, this configuration requires that the heat dissipation demand of the downstream heat-generating components be lower than or equal to that of the upstream components; otherwise, there may be a risk of insufficient heat dissipation.

[0057] In some embodiments, the number of cold plates connected in series can be determined according to the system's heat dissipation requirements and temperature rise control, for example, 2, 4, or 8. Preferably, the total number of cold plates connected in series should ensure that the total temperature rise of the coolant from the first cold plate to the last cold plate does not exceed 15°C, so as to ensure that the end cold plate still has effective heat dissipation capacity.

[0058] In the embodiments of this application, reference is made to Figure 1 In the liquid cooling pipeline 102, two cold plates are configured in series. This configuration is typically used in scenarios requiring the cooling of a pair of high-power, similar chips with high requirements for flow consistency. For example, in a dual-socket server, the power consumption and heat dissipation requirements of the two CPUs are extremely similar. By using a series configuration, it can be naturally ensured that they receive completely equal cooling flow, achieving uniform heat dissipation.

[0059] In this embodiment, the coolant is water. For example, deionized water or a special water-based coolant containing additives such as corrosion inhibitors and fungicides can be used. Water is one of the most common liquids in nature with the highest specific heat capacity, meaning that a unit mass of water can carry a large amount of heat, and its thermal conductivity is superior to most organic liquids, ensuring excellent basic heat dissipation efficiency. Water as a coolant is extremely low in cost, widely available, and non-toxic, significantly reducing the operating costs and maintenance requirements of liquid cooling systems.

[0060] Figure 4 A schematic diagram of the connector of the liquid cooling pipeline 102 according to an embodiment of this application is shown.

[0061] like Figure 4As shown, the liquid cooling device 100 provided in this application also includes a liquid cooling pipe connector 112, which is connected to a coolant distribution unit 113 (i.e., CDU) for providing coolant circulation. The liquid cooling pipe connector 112 includes a connector 114, a first quick-connect fitting 115, a second quick-connect fitting 116, a first pipe adapter 117, and a second pipe adapter 118.

[0062] In this embodiment, the connector 114 has a first end and a second end opposite to each other, and internally machined with flow channels for connecting quick-connect fittings and pipe adapters. A first quick-connect fitting 115 and a second quick-connect fitting 116 are arranged side-by-side at the first end of the connector 114. The first quick-connect fitting 115 is used to quickly connect to the inlet pipe of the coolant distribution unit 113, and the second quick-connect fitting 116 is used to quickly connect to the outlet pipe of the coolant distribution unit 113. This quick-connect design facilitates rapid connection and disconnection of the pipes during maintenance or replacement. A first pipe adapter 117 and a second pipe adapter 118 are disposed at the second end of the connector 114. One end of the first pipe adapter 117 is connected to the first quick-connect fitting 115 through the internal flow channels of the connector 114, and its other end is connected to the inlet of the liquid cooling pipe 102; one end of the second pipe adapter 118 is connected to the second quick-connect fitting 116 through the internal flow channels of the connector 114, and its other end is connected to the outlet of the liquid cooling pipe 102.

[0063] The liquid cooling pipeline connector 112 connects to the CDU pipeline via a quick-connect fitting, greatly simplifying the on-site installation and maintenance process. Connection can be completed without special tools, achieving true plug-and-play functionality and facilitating the rapid deployment and maintenance of the liquid cooling unit 100. The inlet and outlet interfaces are highly integrated into a single connector 114, resulting in a compact structure that effectively saves valuable space within the heating element and makes the pipeline layout neater and more organized. This connector can be designed and manufactured as a standard module, facilitating interface standardization and compatibility across different server models or generations of products, reducing design and supply chain costs.

[0064] In this embodiment, the ratio of the inner diameters of the first quick-connect fitting 115 to the first pipe adapter 117 is configured as a first ratio; the ratio of the inner diameters of the second quick-connect fitting 116 to the second pipe adapter 118 is configured as a second ratio. Both the first and second ratios are configured within a predetermined range. This configuration of inner diameter ratios generates a controllable, additional local flow resistance within the liquid cooling pipe connector 112, thereby enhancing the first flow resistance (i.e., total flow resistance) of the entire liquid cooling device 100 to a preset range. This design provides a reliable means to precisely fine-tune the total flow resistance of the cold plate during the manufacturing stage. By changing the size ratio of the internal channels of the connector, for example, by using a pipe adapter that is thinner than the quick-connect fitting, a final system flow resistance value is set for each cold plate module. This ensures a high degree of consistency in flow resistance performance among mass-produced cold plate products, meeting the requirements of parallel systems for precise flow distribution. By controlling the inner diameter ratio and configuring the high flow resistance of the cold plates, it is ensured that each cold plate can obtain a cooling flow rate that is precisely matched with its heat dissipation requirements in a complex parallel liquid cooling system.

[0065] refer to Figure 1 In some embodiments of this application, the liquid cooling device further includes a leakage detection line 119. The leakage detection line 119 is wound around the outer edge of the liquid cooling pipeline 102 and extends along its length to detect leakage of coolant. When leakage is detected, a leakage alarm signal is generated.

[0066] The leak detection cable 119 is typically a specially designed sensing cable, operating on one or a combination of two common mechanisms: impedance change and capacitance change. The impedance change-based mechanism consists of two parallel conductive cores separated by an insulating material whose properties change upon contact with water. In a dry state, this cable has extremely high insulation resistance. When a leak occurs and the coolant wets the cable, its insulation resistance drops significantly. The detection circuit detects this impedance change and triggers an alarm. The capacitance change-based mechanism forms a capacitor. When coolant with a dielectric constant much greater than air comes into contact with the cable, it causes a detectable change in capacitance, thus triggering an alarm.

[0067] By tightly wrapping the detection line around the outer edge of the pipeline, real-time and uninterrupted monitoring of the entire length of the liquid cooling pipeline 102 can generate an alarm signal at the first moment of leakage, even if it is a tiny leak, thus gaining valuable time for early intervention and preventing the fault from escalating.

[0068] In the embodiments of this application, the leak detection line 119 can adopt a distributed detection method. By measuring the position of the signal change point, the specific location of the leak along the liquid cooling pipeline 102 can be accurately located, which greatly simplifies the troubleshooting and maintenance work and shortens the system downtime.

[0069] In some embodiments of this application, the liquid cooling device further includes a water collection tank and a detector. The water collection tank is located below the liquid cooling device 100, particularly directly below the high-risk area containing the cold plate and joints, and is used to collect coolant leakage. The detector is located inside the water collection tank and is used to detect the amount of leakage in the water collection tank, and to generate a safety alarm signal if the amount of leakage exceeds a first threshold.

[0070] The detector is a liquid level sensor or liquid presence sensor, for example, it determines whether there is leakage and the amount of accumulated leakage in the collection tank by monitoring the liquid level. When the detected leakage exceeds a preset first threshold, such as when the liquid level reaches 5 mm, the detector will trigger and generate a safety alarm signal.

[0071] The water collection tank and detector, as a supplement to the leak detection line 119, together with the aforementioned leak detection line 119, constitute a dual protection system of "active cable monitoring" and "passive container collection and monitoring." In some embodiments, a safety alarm signal can be triggered by limiting the impedance change of the leak detection line 119 to greater than 5%, or the water level in the collection tank to greater than 3 ml. This redundant design greatly improves the overall reliability of the liquid cooling unit 100, ensuring that there are backup measures to prevent catastrophic consequences if any single protective measure fails. By setting thresholds, the severity of the leak can be differentiated. For example, triggering the leak detection line 119 can be considered a "precautionary warning," indicating a possible minor leak; while triggering the water collection tank detector means an "emergency alarm," indicating that the leakage has reached a level requiring immediate shutdown. This graded alarm mechanism helps maintenance personnel take more precise response measures. In addition, the water collection tank can also prevent leaks from overflowing and prevent coolant from damaging heat-generating elements or other valuable components.

[0072] The liquid cooling device 100 provided in this application embodiment exhibits significant comprehensive advantages in the field of heat dissipation for high-power-density electronic devices through innovative preset flow resistance design and system integration. It successfully solves the heat dissipation problem of components with different heat dissipation requirements (including CPUs and GPUs) connected to the same coolant distribution unit 113 via an intelligent flow distribution mechanism. Based on the principle of equal pressure difference in parallel liquid cooling circuits, ΔP=R·Q², the device presets differentiated flow resistance coefficients for cold plates with different heat dissipation requirements, thereby automatically allocating greater flow to high-power components under a unified system pressure difference, without relying on complex active control valves. This valveless design not only simplifies the system architecture, reduces costs and potential failure points, but also achieves precise "on-demand cooling."

[0073] The liquid cooling device 100 provided in this application embodiment optimizes the aspect ratio of the microchannels to set appropriate flow resistance, effectively limiting the coolant flow rate and avoiding turbulent vibration, thereby improving system stability. The liquid cooling device 100 integrates multiple safety protections, including a leak detection line 119 wound around the pipes for real-time leak monitoring and location, which, together with a water collection tank and detector located below the device, forms a double safety net, significantly enhancing security. The liquid cooling device 100, through its modular design, supports rapid deployment and maintenance of the cold plate, liquid cooling pipes, and liquid cooling pipe connectors 112, facilitating hot-swapping in servers.

[0074] Another aspect of this application provides a liquid cooling system, the liquid cooling system including Figure 1 The liquid cooling device 100 shown.

[0075] Figure 5 A schematic diagram of the composition of a liquid cooling system 200 according to an embodiment of this application is shown.

[0076] like Figure 5 As shown in the illustration, a liquid cooling system 200 provided in this application includes a first liquid cooling device 201 applied to a first heating element, a second liquid cooling device 202 applied to a second heating element, and a coolant distribution unit 113. The liquid cooling pipes 102 of the first liquid cooling device 201 and the second liquid cooling device 202 are connected in parallel to the coolant distribution unit 113. The first liquid cooling device 201 is the liquid cooling device 100 provided in this application and has a preset first flow resistance. The second liquid cooling device 202 has a second flow resistance, which is different from the first flow resistance. The first and second flow resistances are used to control the ratio of the first coolant flow rate through the first liquid cooling device 201 to the second coolant flow rate through the second liquid cooling device 202, matching the heat dissipation requirements of the first liquid cooling device 201 and the second liquid cooling device 202.

[0077] Since the two liquid cooling units are connected in parallel to the same coolant distribution unit 113, they share a common driving pressure differential. According to the principles of fluid mechanics, in a parallel circuit, the flow rate through each branch is inversely proportional to its flow resistance, and the pressure difference between the inlet and outlet of each branch is equal. The formula is expressed as follows:

[0078] Q_total = Q_GPU + Q_CPU

[0079] ΔP = R_GPU*Q_GPU² = R_CPU*Q_CPU²

[0080] Wherein, Q_total represents the total flow rate output by the coolant distribution unit 113, Q_GPU represents the total flow rate allocated to the GPU cold plate group, Q_CPU represents the total flow rate allocated to the CPU cold plate, ΔP represents the branch voltage drop of the coolant distribution unit 113, R_CPU represents the first flow obstruction of the first liquid cooling device 201 of the CPU, and R_GPU represents the second flow obstruction of the second liquid cooling device 202 of the GPU.

[0081] Therefore, the difference between the first and second flow resistances passively controls the ratio between the first coolant flow rate through the first liquid cooling device 201 and the second coolant flow rate through the second liquid cooling device 202, thereby achieving a precise match between the coolant flow rate and the heat dissipation requirements of each heat-generating component. This solution replaces additional electronic control components (such as proportional valves, flow sensors, and control algorithms) with the flow resistance of the hardware itself to control the coolant flow rate, greatly simplifying the system architecture, reducing costs and potential failure points, while improving the inherent reliability and consistency of flow distribution.

[0082] In some embodiments of this application, the first heat-generating element is a central processing unit (CPU), and the second heat-generating element is a graphics processing unit (GPU), with the first flow resistance greater than the second flow resistance. In current high-performance computing systems, GPUs typically undertake massively parallel computing tasks, resulting in extremely high power density and requiring a large cooling flow rate to prevent core overheating, such as 5-10 L / min. CPUs, on the other hand, have relatively lower power density, and excessively high flow rates can cause vibration problems due to turbulence; therefore, they require relatively smaller flow rates. By setting the first flow resistance of the CPU cold plate to be greater than the second flow resistance of the GPU cold plate, when the total flow provided by the CPU CPU flows through this parallel system, most of the coolant flow will be automatically allocated to the GPU cold plate due to its smaller second flow resistance; while the CPU cold plate, with its larger first flow resistance, will automatically receive a relatively smaller but stable flow rate that matches its needs. This design ensures that the GPU receives sufficient cooling while avoiding excessive pressure drop, harmful vibration, and potential leakage risks that may occur when a high total flow rate is forced through the CPU cold plate, thereby improving heat dissipation capacity while ensuring the long-term operational reliability of the system.

[0083] In the embodiments of this application, the ratio of the first flow resistance to the second flow resistance can be controlled by designing the inner diameter of the inlet or outlet of the liquid cooling pipes of the first liquid cooling device 201 and the second liquid cooling device 202, thereby controlling the ratio of the first coolant flow rate of the first liquid cooling device 201 to the second coolant flow rate of the second liquid cooling device 202, so as to match the heat dissipation requirements of the first liquid cooling device 201 and the second liquid cooling device 202.

[0084] Taking the CPU as the first heat-generating element and the GPU as the second heat-generating element as an example, the inner diameter of the inlet of the first liquid cooling device 201 is 4.5 mm, and the inner diameter of the inlet of the second liquid cooling device 202 is 6.5 mm. This relatively enhances the first flow resistance of the first liquid cooling device 201, thereby controlling the flow rate of the first coolant cooling the CPU and the flow rate of the second coolant cooling the GPU. Preferably, the flow resistance ratio of the first flow resistance to the second flow resistance is 2.5 to 3.5, which can achieve a flow distribution that matches the power consumption difference between the CPU and the GPU.

[0085] The liquid cooling device 100 and liquid cooling system 200 of this application can be applied to electronic devices with heat-generating components such as chips, such as servers, switches, and storage devices.

[0086] Another aspect of this application provides a control method, applied to, for example... Figure 5 The liquid cooling system 200 shown.

[0087] Figure 6 A flowchart illustrating a control method according to an embodiment of this application is shown schematically.

[0088] like Figure 6 As shown in the figure, this application provides a control method, which includes steps S610 to S620.

[0089] In operation S610, the temperature change rate of the first heating element is calculated based on the temperature of the first liquid cooling device 201.

[0090] In this embodiment, a temperature sensor is installed on the first liquid cooling device 201, for example, on the upper surface of the CPU cold plate, to acquire its temperature value in real time or periodically. Based on continuous temperature sampling data, the CPU's temperature change rate is obtained by calculating the amount of temperature change per unit time. This change rate reflects the dynamic change rate of the chip's thermal load.

[0091] In operation S620, in response to the temperature change rate being greater than the second threshold, a first control command is generated, which is used to control the coolant distribution unit to increase the first coolant flow rate.

[0092] In this embodiment, the temperature change rate of the first heating element is compared with a preset second threshold. This second threshold is used to determine if there is a rapid increase in heat load that could lead to overheating. Once the temperature change rate exceeds the second threshold, it indicates that the first heating element is facing a rapid temperature rise and requires immediate enhanced cooling. At this time, the method generates a first control command. The first control command is sent to the CDU or the processor controlling the CDU to control the CDU to increase pumping power or adjust valve opening to increase the flow rate of the first coolant through the first liquid cooling device 201, thereby enhancing the heat dissipation efficiency of the first liquid cooling device 201 and effectively preventing the first heating element from throttling or being damaged due to overheating.

[0093] Traditional feedback control based on current temperature values ​​is inherently lagging. By the time the system detects that the temperature exceeds a threshold and takes action, the heating element is often already overheated, making intervention too late. The control method provided in this application, however, calculates the rate of temperature change in real time, enabling it to keenly detect rapid temperature increases and intervene early, before the absolute temperature reaches a dangerous level but before the temperature rises rapidly. This rate-of-change-based proactive control allows the system to move beyond fixed flow allocation and dynamically adjust flow based on real-time heat dissipation needs. This ensures basic energy efficiency while handling sudden high-load conditions, achieving more refined thermal management.

[0094] If increasing the first coolant flow rate does not achieve the desired cooling effect, the control method provided in this application embodiment further includes S630.

[0095] In operation S630, in response to the temperature of the first liquid cooling device 201 being higher than a third threshold, a second control signal is generated, which is used to indicate a reduction in the power of the first heating element.

[0096] In this embodiment, the temperature of the first liquid cooling device 201 is continuously monitored and compared with a third threshold. This third threshold is a safe upper limit temperature, typically set slightly below the maximum junction temperature the first heating element can withstand or the system's set throttling temperature. If the temperature is detected to be higher than this third threshold, it indicates that simply increasing the first coolant flow rate is insufficient to effectively control the temperature of the first heating element, and the first heating element faces a direct risk of overheating. At this point, the method immediately generates a second control signal. This second control signal is used to instruct a reduction in the operating power of the first heating element. This signal can be sent to the processor or operating system that controls the operation of the first heating element, forcibly reducing the power consumption and heat generation of the first heating element by throttling or directly limiting the power consumption wall.

[0097] When step S620 fails to contain the temperature rise of the first heat-generating element, step S630 eliminates the risk of overheating by directly intervening in the heat source itself, ensuring that the chip temperature is forcibly controlled within a safe range and preventing permanent hardware damage.

[0098] This method avoids the traditional practice of maintaining excessively high cooling flow rates for extended periods to cope with potential peak heat loads, instead employing an on-demand, dynamic flow allocation strategy. This effectively reduces the system's pumping energy consumption and improves overall energy efficiency. Simultaneously, by analyzing pressure differential anomalies, such as identifying specific cold plate blockages, it provides clear guidance for preventative system maintenance, such as triggering targeted flushing procedures, thereby extending equipment lifespan, reducing unexpected downtime, and achieving a leap from extensive cooling to refined thermal management.

[0099] Based on the above methods, another embodiment of this application provides a method for controlling the water pressure difference regarding the first coolant flow rate.

[0100] Figure 7 A flowchart illustrating a control method according to another embodiment of this application is shown schematically.

[0101] like Figure 7 As shown, another embodiment of this application provides a control method including operations S710~S730.

[0102] In operation S710, the water pressure difference between the inlet and outlet pipes of the coolant distribution unit is detected.

[0103] In this embodiment, a first pressure sensor is installed on the inlet pipe of the CDU, and a second pressure sensor is installed on the outlet pipe to achieve real-time monitoring of the pressure at both ends of the pipes and calculate the water pressure difference ΔP between them. This pressure difference is a key indicator reflecting the change in fluid resistance of the entire liquid cooling circuit, and its value change is directly related to the total flow resistance status of the CDU, liquid cooling pipe 102, and all cold plates. By continuously monitoring ΔP, the system can dynamically sense the overall flow health of the liquid cooling system 200, providing an important basis for early identification of problems such as blockage, aging, or abnormal coolant properties.

[0104] In operation S720, the first coolant flow rate is detected in response to a water pressure difference greater than a fourth threshold.

[0105] In this embodiment, the real-time calculated water pressure difference ΔP is compared with a preset fourth threshold. The fourth threshold is set based on the reference pressure difference corresponding to the rated flow rate under clean, unobstructed operating conditions, with a certain safety margin. When ΔP continuously exceeds this threshold, it indicates that the total flow resistance of the liquid cooling circuit has significantly increased. Possible reasons for ΔP continuously exceeding the fourth threshold include local blockage of the cold plate microchannels, increased pipeline deposits, abnormally high coolant viscosity, or the presence of unremoved gas in the system. To accurately assess the severity of flow restriction, a dedicated test of the first coolant flow rate is performed, using a high-precision flow meter to obtain the current actual flow rate data, thereby providing reliable input for subsequent diagnosis and control.

[0106] In operation S730, in response to the first coolant flow rate being lower than the fifth threshold, a second control command is generated, which instructs the coolant distribution unit to increase the first coolant flow rate.

[0107] In this embodiment, the detected first coolant flow rate is compared with a preset fifth threshold, which represents the minimum safe flow rate required by the first liquid cooling device 201. If the flow rate is lower than the fifth threshold, it is determined that the current cooling capacity is insufficient to ensure the safe operation of the component, and there is a risk of overheating. At this time, a second control command is generated. This second control command is used to instruct the coolant distribution unit to increase the pumping power or take other measures to increase the total system flow rate, thereby ensuring that the first coolant flow rate returns to a safe level.

[0108] For example, in high-flow-resistance CPU cold plates, the microchannels are extremely small and highly sensitive to blockage. Even a slight blockage can lead to a sharp drop in flow rate and CPU overheating. A decrease in pressure detection is highly likely caused by cold plate blockage. Methods such as frequently switching the CDU to add fresh fluid are used to flush the cold plate microchannels and restore the water pressure differential.

[0109] The control method provided in this application achieves a breakthrough in the thermal management of the liquid cooling system, moving from passive lag to proactive prevention, through a multi-parameter collaborative and hierarchical response mechanism. Its core lies in introducing the rate of temperature change as a predictive control parameter, which can increase cooling flow in advance during the early stages when the chip temperature has not yet exceeded the limit but is rising too rapidly, effectively avoiding the risk of overheating. Simultaneously, it constructs multiple safety defenses, automatically triggering chip frequency reduction for fundamental protection when flow regulation is ineffective, and diagnosing abnormal states such as pipe blockage through real-time monitoring of the linkage between system pressure difference and flow. This method improves heat dissipation reliability while achieving dynamic flow allocation on demand, reducing system energy consumption, and providing intelligent basis for preventative maintenance, forming a rapid-response, safe, and efficient thermal management solution.

[0110] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation that may be implemented according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0111] Those skilled in the art will understand that the features described in the various embodiments of this application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this application. In particular, the features described in the various embodiments of this application can be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.

[0112] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Without departing from the scope of this application, those skilled in the art can make various substitutions and modifications, all of which should fall within the scope of this application.

Claims

1. A liquid cooling device, characterized by, Comprising: a cold plate (101) comprising a plate body (103) and a microchannel array (104) formed in the plate body (103), a middle region of the plate body (103) being provided with a first liquid inlet and a first liquid outlet; a liquid cooling pipeline (102) connected to the first liquid inlet and the first liquid outlet for conveying cooling liquid to the first liquid inlet; the microchannel array (104) is configured to guide the cooling liquid flowing from the first liquid inlet to the two side regions of the plate body (103) and then return to the first liquid outlet; the microchannel array (104) is also configured to have a preset aspect ratio to form a first flow resistance to the cooling liquid, so as to reduce the flow rate of the cooling liquid in the microchannel array (104).

2. The liquid cooling device according to claim 1, wherein: the microchannel array (104) comprises flow channel groups symmetrically arranged on the first side and the second side of the plate body (103), and each of the flow channel groups on the first side and the second side comprises a first flow channel (105) and a second flow channel (106), each of the first flow channel (105) and the second flow channel (106) is composed of a plurality of microchannels, and the microchannel array (104) further comprises: a first connecting channel (107) arranged between the first flow channels (105) on the first side and the second side, connected to the first liquid inlet, and connected to the inlet of the first flow channels (105) on the first side and the second side; a second connecting channel (108) arranged between the second flow channels (106) on the first side and the second side, connected to the first liquid outlet, and connected to the outlet of the second flow channels (106) on the first side and the second side; the outlet of the first flow channel (105) on the first side is connected to the inlet of the second flow channel (106) on the first side through a third connecting channel (109); the outlet of the first flow channel (105) on the second side is connected to the inlet of the second flow channel (106) on the second side through a fourth connecting channel (110).

3. The liquid cooling device according to claim 2, wherein: each of the first flow channel (105) and the second flow channel (106) comprises a plurality of parallel microchannels.

4. The liquid cooling device according to claim 2, wherein: the third connecting channel (109) and the fourth connecting channel (110) are respectively located at the end regions of the two sides of the plate body (103); the width of the third connecting channel (109) and the fourth connecting channel (110) is greater than the width of the microchannels in the microchannel array (104).

5. The liquid cooling device according to claim 1, wherein: the aspect ratio of the microchannels in the microchannel array (104) is greater than or equal to 3.1:

1.

6. The liquid cooling device according to claim 1, wherein: the microchannels of the microchannel array (104) are formed based on parallel fins (111), and the angle of the fins (111) is 90°±2°.

7. The liquid cooling device of claim 1, wherein, Further comprising: A liquid cooling pipeline connector (112) is connected to a cooling liquid distribution unit (113) for circulating cooling liquid, and comprises: a coupler (114) having opposite first and second ends; first and second quick plug connectors (115, 116) arranged side by side at the first end of the coupler (114), the first quick plug connector (115) being connected to an inlet pipeline of the cooling liquid distribution unit (113), and the second quick plug connector (116) being connected to an outlet pipeline of the cooling liquid distribution unit (113); first and second pipeline adapters (117, 118) arranged at the second end of the coupler (114), one end of the first pipeline adapter (117) being in communication with the first quick plug connector (115) through an internal flow channel of the coupler (114), and the other end being connected to an inlet of the liquid cooling pipeline (102), and one end of the second pipeline adapter (118) being in communication with the second quick plug connector (116) through the internal flow channel of the coupler (114), and the other end being connected to an outlet of the liquid cooling pipeline (102).

8. The liquid cooling device according to claim 7, wherein: a ratio of the inner diameter of the first quick plug connector (115) to the first pipeline adapter (117) is configured as a first ratio; a ratio of the inner diameter of the second quick plug connector (116) to the second pipeline adapter (118) is configured as a second ratio; the first ratio and the second ratio are both configured within a predetermined ratio range to enhance the first flow resistance to a preset range.

9. The liquid cooling device of claim 1, wherein, Further comprising: a liquid leakage detection line (119) wound around an outer edge of the liquid cooling pipeline (102) for detecting a liquid leakage phenomenon of the cooling liquid, and generating a liquid leakage alarm signal in the case of detecting the liquid leakage phenomenon.

10. The liquid cooling device of claim 9, wherein, Further comprising: a water collecting tank arranged below the liquid cooling device for collecting the liquid leakage of the cooling liquid; a detector arranged in the water collecting tank for detecting the amount of liquid leakage in the water collecting tank, and generating a safety alarm signal in the case that the amount of liquid leakage is greater than a first threshold value.

11. The liquid cooling device according to claim 1, wherein: the cold plate (101) further comprises: an upper cover (120) fixedly covering a top surface of the plate body (103) to form a sealed cavity of the micro-channel array (104) together with the plate body (103); a cold plate bracket (121) arranged at a bottom of the plate body (103).

12. The liquid cooling device according to claim 11, wherein: the upper cover (120) is provided with through holes (122) corresponding to the first inlet and the first outlet, and the through holes (122) are provided with threads matched with the first outlet connector (124) or the first inlet connector (123) of the liquid cooling pipeline (102). The first liquid outlet connector (124) is connected to the through hole (122) corresponding to the first liquid inlet, the first liquid inlet connector (123) is connected to the through hole (122) corresponding to the first liquid outlet, and the center axes of the first liquid outlet connector (124) and the first liquid inlet connector (123) are parallel to each other and the interfaces of the liquid cooling pipeline (102) are oppositely directed.

13. The liquid cooling device according to claim 12, characterized in that, The center axes of the first liquid outlet connector (124) and the first liquid inlet connector (123) are parallel to each other and the interfaces of the liquid cooling pipeline (102) are oppositely directed.

14. The liquid cooling device of claim 1, wherein, A plurality of the cold plates (101) are connected in series on the liquid cooling pipeline (102).

15. The liquid cooling device of claim 1, wherein, The cooling liquid is water.

16. A liquid cooling system comprising a first liquid cooling device (201) applied to a first heat generating element, a second liquid cooling device (202) applied to a second heat generating element, and a cooling liquid distribution unit (113), characterized in that, The liquid cooling pipelines (102) of the first liquid cooling device (201) and the second liquid cooling device (202) are connected in parallel to the cooling liquid distribution unit (113); The first liquid cooling device (201) is the liquid cooling device (100) according to any one of claims 1-15, the second liquid cooling device (202) has a second flow resistance, the second flow resistance is different from the first flow resistance, the first flow resistance and the second flow resistance are used to control the ratio of the first cooling liquid flow rate flowing through the first liquid cooling device (201) and the second cooling liquid flow rate flowing through the second liquid cooling device (202), and match the heat dissipation requirements of the first liquid cooling device (201) and the second liquid cooling device (202).

17. The liquid cooling system of claim 16, wherein, The first heat generating element is a central processing unit, and the second heat generating element is a graphics processing unit, and the first flow resistance is greater than the second flow resistance.

18. A control method applied to the liquid cooling system according to any one of claims 16-17, characterized in that, The method comprises: Based on the temperature of the first liquid cooling device (201), the temperature change rate of the first heat generating element is calculated; In response to the temperature change rate of the first heat generating element being greater than a second threshold value, a first control instruction is generated, the first control instruction being used to control the cooling liquid distribution unit (113) to increase the first cooling liquid flow rate.

19. The control method according to claim 18, characterized by, The method further comprises: In response to the temperature of the first heat generating element being higher than a third threshold value, a second control signal is generated, the second control signal being used to instruct to reduce the power of the first heat generating element.

20. The control method according to claim 18, wherein The method further comprises: Detecting the water pressure difference between the liquid inlet pipeline and the liquid outlet pipeline of the cooling liquid distribution unit (113); In response to the water pressure difference being greater than a fourth threshold value, the first cooling liquid flow rate is detected; In response to the first cooling liquid flow rate being lower than a fifth threshold value, a second control instruction is generated, the second control instruction being used to instruct the cooling liquid distribution unit (113) to increase the first cooling liquid flow rate.

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