Method and apparatus for manufacturing electronic component

Abstract

The invention provides a manufacturing method and a manufacturing device of an electronic component, which can seek for miniaturization. This electronic component is provided with a base part having a first end surface and a second end surface facing each other in the longitudinal direction, and external electrodes provided on the first end surface and the second end surface, respectively. The method for manufacturing an electronic component comprises the steps of: impregnating the base part from the first end surface side into a first conductive paste layer, which is a precursor for the external electrodes; moving the base part relative to the first conductive paste layer in the in-plane direction of the first end surface in a state in which the base part is immersed in the first conductive paste layer from the first end surface side; pulling up the base part from the first conductive paste layer during or after the movement of the base part relative to the first conductive paste layer in the in-plane direction of the first end surface; after the base part is pulled up from the first conductive paste layer, the base part is immersed in a second conductive paste layer, which is a precursor of the external electrode, from the first end surface side.

Description

Technical Field

[0001] This invention relates to a method and apparatus for manufacturing electronic components. Background Technology

[0002] Previously known electronic components included: a generally rectangular cuboid-shaped base portion formed by alternating layers of dielectric and internal electrode layers; and external electrodes disposed on a pair of end faces along the length of the base portion. A multilayer ceramic capacitor is disclosed as one such electronic component in Japanese Patent Application Publication No. 2017-73435 (Patent Document 1).

[0003] The external electrodes not only cover the end face of the substrate but also extend from that end face to the four outer peripheral faces of the substrate. The multilayer ceramic capacitor is mounted on the substrate, for example, using solder that bonds to the external electrodes.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-73435 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] In recent years, miniaturization has become an important issue in electronic components such as multilayer ceramic capacitors. From the perspective of miniaturizing electronic components, efforts are being made to minimize the thickness of the external electrodes.

[0009] Therefore, this disclosure is made to solve the above-mentioned problems and aims to provide a method and apparatus for manufacturing electronic components that can be miniaturized.

[0010] Solution for solving the problem

[0011] The method for manufacturing an electronic component based on the present disclosure is as follows: the electronic component comprises: a substrate having a first end face and a second end face opposite to each other in the longitudinal direction; and external electrodes respectively disposed on the first end face and the second end face. The above-described method for manufacturing an electronic component based on the present disclosure includes the following steps: impregnating the substrate portion from the side where the first end face is located toward the first conductive paste layer, which serves as a precursor for the external electrode; while the substrate portion is impregnated in the first conductive paste layer from the side where the first end face is located, moving the substrate portion relative to the first conductive paste layer in the in-plane direction of the first end face; during or after the period during which the substrate portion is moved relative to the first conductive paste layer in the in-plane direction of the first end face, lifting the substrate portion from the first conductive paste layer; and after the substrate portion is lifted from the first conductive paste layer, impregnating the substrate portion from the side where the first end face is located toward the second conductive paste layer, which serves as a precursor for the external electrode.

[0012] According to the above-described method for manufacturing electronic components based on the present disclosure, the thickness of the second conductive paste layer may be greater than the thickness of the first conductive paste layer.

[0013] According to the above-described method for manufacturing an electronic component based on the present disclosure, in the step of moving the substrate portion relative to the first conductive paste layer in the in-plane direction of the first end face, the substrate portion may move relative to the first conductive paste layer in a first direction orthogonal to the length direction.

[0014] According to the above-described method for manufacturing an electronic component based on the present disclosure, in the step of moving the substrate portion relative to the first conductive paste layer in the in-plane direction of the first end face, the substrate portion may also move relative to the first conductive paste layer in a second direction orthogonal to the length direction and the first direction, respectively.

[0015] The manufacturing apparatus for the electronic component based on this disclosure is an apparatus for manufacturing the following electronic component: The electronic component includes: a substrate having a first end face and a second end face opposite to each other in the longitudinal direction; and external electrodes respectively disposed on the first end face and the second end face. The manufacturing apparatus for the electronic component based on this disclosure includes a holding portion, a paste layer holding mechanism, a vertical drive mechanism, a horizontal drive mechanism, and a control unit. The holding portion holds the substrate with the first end face facing downward in the vertical direction. The first conductive paste layer and the second conductive paste layer are both precursors of the external electrodes. The paste layer holding mechanism holds the first conductive paste layer and the second conductive paste layer. The vertical drive mechanism moves the holding portion in the vertical direction. The horizontal drive mechanism moves the holding portion in the horizontal direction. The control unit controls the operation of the vertical drive mechanism and the horizontal drive mechanism. The control unit moves the holding part using the vertical drive mechanism, thereby impregnating the substrate part from the side where the first end face is located toward the first conductive paste layer. While the substrate part is impregnated in the first conductive paste layer from the side where the first end face is located, the holding part is moved in a horizontal direction using the horizontal drive mechanism. During or after the first end face moves in the horizontal direction, the holding part is moved in a way that lifts the substrate part from the first conductive paste layer using the vertical drive mechanism. After the substrate part is lifted from the first conductive paste layer, the holding part is moved using the vertical drive mechanism, thereby impregnating the substrate part from the side where the first end face is located toward the second conductive paste layer.

[0016] According to the above-described manufacturing apparatus for electronic components based on the present disclosure, the thickness of the second conductive paste layer may be greater than the thickness of the first conductive paste layer.

[0017] According to the above-described manufacturing apparatus for an electronic component based on the present disclosure, the paste layer holding mechanism may also have a flat plate portion. In this case, the first conductive paste layer is disposed on the flat plate portion, and after the substrate portion is lifted from the first conductive paste layer, the second conductive paste layer replaces the first conductive paste layer and is disposed on the flat plate portion.

[0018] According to the above-described manufacturing apparatus for electronic components based on the present disclosure, the paste layer holding mechanism may also have a first plate portion and a second plate portion independent of the first plate portion. In this case, the first conductive paste layer may be disposed on the first plate portion, and the second conductive paste layer may be disposed on the second plate portion.

[0019] The effects of the invention

[0020] According to this disclosure, it is possible to provide a method and apparatus for manufacturing electronic components that can be miniaturized. Attached Figure Description

[0021] Figure 1 This is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the embodiment.

[0022] Figure 2 yes Figure 1 A schematic cross-sectional view of a multilayer ceramic capacitor is shown.

[0023] Figure 3 yes Figure 1 A schematic cross-sectional view of a multilayer ceramic capacitor is shown.

[0024] Figure 4 This is a flowchart illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment.

[0025] Figure 5 yes Figure 4 A detailed flowchart of step S8 in the manufacturing process shown.

[0026] Figure 6 It is used for explanation Figure 5 A schematic cross-sectional view of step S811 in the manufacturing process shown.

[0027] Figure 7 It is used for explanation Figure 5 A schematic cross-sectional view of step S811 in the manufacturing process shown.

[0028] Figure 8 It is used for explanation Figure 5 A schematic cross-sectional view of step S812 in the manufacturing process shown.

[0029] Figure 9 It is used for explanation Figure 5 A schematic cross-sectional view of step S813 in the manufacturing process shown.

[0030] Figure 10 It is used for explanation Figure 5 A schematic top view showing the direction of movement of the base portion in step S813 of the manufacturing process.

[0031] Figure 11 It is used for explanation Figure 5 A schematic cross-sectional view of step S814 in the manufacturing process shown.

[0032] Figure 12 It is used for explanation Figure 5 A schematic cross-sectional view of step S815 in the manufacturing process shown.

[0033] Figure 13 It is used for explanation Figure 5 A schematic cross-sectional view of step S816 in the manufacturing process shown.

[0034] Figure 14 It is used for explanation Figure 5 A schematic cross-sectional view of step S816 in the manufacturing process shown.

[0035] Figure 15 It is used for explanation Figure 5 A schematic cross-sectional view of step S817 in the manufacturing process shown.

[0036] Figure 16 It is used for explanation Figure 5 A schematic cross-sectional view of step S82 in the manufacturing process shown.

[0037] Figure 17 It is used for explanation Figure 5 A schematic cross-sectional view of step S82 in the manufacturing process shown.

[0038] Figure 18 It is used for explanation Figure 5 A schematic cross-sectional view of step S82 in the manufacturing process shown.

[0039] Figure 19 It is used for explanation Figure 4 A schematic cross-sectional view of step S9 in the manufacturing process shown.

[0040] Figure 20 It is used for explanation Figure 4 A schematic cross-sectional view of step S9 in the manufacturing process shown.

[0041] Figure 21 This is a schematic top view of a multilayer ceramic capacitor used to illustrate the location for measuring the thickness of the external electrodes in a verification test.

[0042] Figure 22 It is a table that shows the test conditions and test results in the verification test.

[0043] Figure 23 It is a table that shows the test conditions and test results in the verification test.

[0044] Figure 24 This is a schematic top view illustrating the direction of movement of the substrate portion in the manufacturing method of the multilayer ceramic capacitor of the first modified example.

[0045] Figure 25 This is a schematic top view illustrating the direction of movement of the substrate portion in the manufacturing method of the multilayer ceramic capacitor of the second modified example.

[0046] Figure 26This is a schematic top view illustrating the direction of movement of the substrate portion in the manufacturing method of the multilayer ceramic capacitor of the third modified example.

[0047] Figure 27 This is a schematic bottom view showing the structure of the holding part used in the manufacturing method of the multilayer ceramic capacitor in the fourth variation.

[0048] Figure 28 yes Figure 27 A schematic cross-sectional view of the retaining part shown.

[0049] Figure 29 This is a schematic cross-sectional view showing the structure of the first plate portion and the second plate portion used in the manufacturing method of the multilayer ceramic capacitor in the fourth variation.

[0050] Explanation of reference numerals in the attached figures

[0051] 10. Paste application mechanism; 10a. Receiving space; 11. Scraper; 12. Blade; 20, 20A. Holding part; 21. Base layer; 22. Adhesive layer; 23. Actuator; 24. Base layer; 24a. Through hole; 25. Adhesive part; 30. Recycling blade; 51. First conductive paste layer; 52. Bottom; 53. Second conductive paste layer; 54. Bottom; 60. Flat plate part; 61. First flat plate part; 62. Second flat plate part; 90. Control unit; 91. CPU; 92. Memory; 100. Multilayer ceramic capacitor; 110. Substrate part; 111. First main surface; 112. Second main surface; 113. First Side surface; 114, second side surface; 115, first end face; 116, second end face; 117a, first outer layer; 117b, second outer layer; 118, internal electrode layer; 118a, first internal electrode layer; 118b, second internal electrode layer; 119, dielectric layer; 120, first external electrode; 121, first external electrode on end face side; 122, first external electrode on side surface side; 130, second external electrode; 131, second external electrode on end face side; 132, second external electrode on side surface side; 160, base electrode layer; 161, first layer; 162, second layer; 170, plating; C, inner layer; G, gap. Detailed Implementation

[0052] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures. The embodiments shown below illustrate a method for manufacturing a multilayer ceramic capacitor as a method for manufacturing an electronic component. Furthermore, the method for manufacturing an electronic component of this embodiment shown below can also be applied to methods for manufacturing multilayer ceramic inductors or multilayer ceramic thermistors, etc.

[0053] In the embodiments shown below, the same reference numerals are used to label the same or common parts in the figures, and their descriptions are not repeated. Furthermore, in the figures, L represents the length direction of the base portion, W represents the width direction of the base portion, and T represents the stacking direction of the base portion. The base portion will then be discussed in detail.

[0054] (Implementation Method)

[0055] <A. Structure of Multilayer Ceramic Capacitors>

[0056] Figure 1 This is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the embodiment. Figure 2 yes Figure 1 A schematic cross-sectional view of the multilayer ceramic capacitor shown along line II-II. Figure 3 yes Figure 1 The diagram shows a schematic cross-sectional view of a multilayer ceramic capacitor along line III-III. First, refer to... Figures 1-3 The structure of the multilayer ceramic capacitor 100 manufactured according to the manufacturing method of the multilayer ceramic capacitor of this embodiment will be described.

[0057] like Figures 1-3 As shown, the multilayer ceramic capacitor 100 of this embodiment includes a substrate 110 and external electrodes.

[0058] The base portion 110 has a generally cuboid shape. The base portion 110 has a first main surface 111 and a second main surface 112 that are opposite each other in the stacking direction T, a first side surface 113 and a second side surface 114 that are opposite each other in the width direction W that is orthogonal to the stacking direction T, and a first end surface 115 and a second end surface 116 that are opposite each other in the length direction L that is orthogonal to the stacking direction T and the width direction W.

[0059] The base portion 110, for example, has a length dimension of 0.2 mm or more and 3.2 mm or less, a width dimension of 0.1 mm or more and 2.5 mm or less, and a thickness dimension of 0.1 mm or more and 2.5 mm or less. Furthermore, tolerances can be incorporated into the above dimensions.

[0060] The external electrode consists of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is disposed on the first end face 115. The second external electrode 130 is disposed on the second end face 116.

[0061] The first external electrode 120 includes an end face side first external electrode 121 and a side face side first external electrode 122.

[0062] The first external electrode 121 on the end face side is a portion disposed entirely on the first end face 115. The first external electrode 122 on the side face side is a portion extending from the first end face 115 toward the first main face 111, the second main face 112, the first side face 113, and the second side face 114, respectively. More specifically, the first external electrode 122 on the side face side covers the portion of the first main face 111 located on the side of the first end face 115, the portion of the second main face 112 located on the side of the first end face 115, the portion of the first side face 113 located on the side of the first end face 115, and the portion of the second side face 114 located on the side of the first end face 115.

[0063] The second external electrode 130 includes an end face side second external electrode 131 and a side face side second external electrode 132.

[0064] The second external electrode 131 on the end face side is a portion disposed entirely on the second end face 116. The second external electrode 132 on the side face side is a portion extending from the second end face 116 toward the first main face 111, the second main face 112, the first side face 113, and the second side face 114, respectively. More specifically, the second external electrode 132 on the side face side covers the portion of the first main face 111 located on the side of the second end face 116, the portion of the second main face 112 located on the side of the second end face 116, the portion of the first side face 113 located on the side of the second end face 116, and the portion of the second side face 114 located on the side of the second end face 116.

[0065] The first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0066] The substrate electrode layer 160 includes at least one of a sintered layer, a resin layer, and a thin film layer. In this embodiment, the substrate electrode layer 160 is composed of a sintered layer.

[0067] The sintered layer contains both glass and metallic components. The metallic component is composed of one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing that metal; for example, an alloy of Ag and Pd can be used. The glass component contains at least one of Si and Zn.

[0068] The sintered layer can consist of a single layer or multiple layers stacked together. The sintered layer can also be formed by sintering after the conductive paste is applied to the substrate 110, or it can be formed by sintering simultaneously with the internal electrode layer 118.

[0069] The plating layer 170 is disposed on the substrate electrode layer 160. As the material for forming the plating layer 170, one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing that metal, can be used. As an example, an alloy of Ag and Pd can be used as the material for forming the plating layer 170.

[0070] Here, according to the manufacturing method of the multilayer ceramic capacitor of this embodiment, the multilayer ceramic capacitor 100 can be constructed in such a way that the thickness of the first external electrode 120 and the thickness of the second external electrode 130 are considerably small, which will be discussed in detail later.

[0071] like Figure 2 and Figure 3 As shown, the substrate 110 includes: a first outer layer 117a, which is composed of a dielectric layer and includes a first main surface 111; a second outer layer 117b, which is composed of a dielectric layer and includes a second main surface 112; and a plurality of internal electrode layers 118, which are alternately stacked with the dielectric layer between the first outer layer 117a and the second outer layer 117b.

[0072] In this embodiment, the dielectric layer constituting the first outer layer 117a and the dielectric layer constituting the second outer layer 117b are substantially the same ceramic material system. "Substantially the same ceramic material system" means that the proportions of the ceramic materials used as raw materials are substantially the same, and the range of deviations in ceramic composition caused by deviations in the proportions and processing steps is included within the substantially the same ceramic material system.

[0073] Multiple internal electrode layers 118 are composed of a first internal electrode layer 118a and a second internal electrode layer 118b. Inside the substrate portion 110, the first internal electrode layer 118a and the second internal electrode layer 118b are alternately stacked along the stacking direction T. The multiple first internal electrode layers 118a and the multiple second internal electrode layers 118b are arranged parallel to the length direction L and the width direction W, respectively. A dielectric layer 119 is disposed between adjacent first internal electrode layers 118a and second internal electrode layers 118b along the stacking direction T. That is, adjacent first internal electrode layers 118a and second internal electrode layers 118b in the stacking direction T are opposite each other in such a way that the dielectric layer 119 is sandwiched in between.

[0074] The first internal electrode layer 118a extends to the first end face 115. The first end face 115 is covered by the first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b extends to the second end face 116. The second end face 116 is covered by the second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0075] In addition, Figure 2and Figure 3 The example shown has seven sheets of each of the first internal electrode layer 118a and the second internal electrode layer 118b, but the number of sheets of each of the first internal electrode layer 118a and the second internal electrode layer 118b is not particularly limited to seven sheets.

[0076] The first internal electrode layer 118a and the second internal electrode layer 118b each contain one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing that metal. An example of such an alloy is an alloy of Ag and Pd. In this embodiment, the first internal electrode layer 118a and the second internal electrode layer 118b each contain Ni as the main component. Alternatively, the first internal electrode layer 118a and the second internal electrode layer 118b may also each contain dielectric particles of the same compositional system as the ceramic contained in the dielectric layer 119. Furthermore, the first internal electrode layer 118a and the second internal electrode layer 118b may each contain Sn at the interface between themselves and the dielectric layer 119.

[0077] Multiple dielectric layers 119 are composed of an outer dielectric layer and an inner dielectric layer. The outer dielectric layer is located between the first main surface 111 and the inner electrode layer 118 located on the side closest to the first main surface 111 in the stacking direction T, and between the second main surface 112 and the inner electrode layer 118 located on the side closest to the second main surface 112 in the stacking direction T. The inner dielectric layer is located between adjacent inner electrode layers 118 along the stacking direction T.

[0078] The multiple dielectric layers 119 can be made of dielectric ceramics containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3 as ceramic materials. Alternatively, materials formed by adding by-components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds to these main components can also be used.

[0079] The substrate 110 includes an inner layer C. The inner layer C is stacked in the stacking direction T by portions of the first inner electrode layer 118a opposite to the second inner electrode layer 118b adjacent in the stacking direction T, and portions of the second inner electrode layer 118b opposite to the first inner electrode layer 118a adjacent in the stacking direction T, thereby having electrostatic capacitance.

[0080] <B. Manufacturing method of multilayer ceramic capacitors>

[0081] Figure 4 This is a flowchart illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment. Figure 5 yes Figure 4 A detailed flowchart of step S8 in the manufacturing process shown. Figures 6-9 and Figures 11-18It is used for explanation Figure 5 A schematic cross-sectional view of each step in the manufacturing process shown. Figure 10 It is used for explanation Figure 5 A schematic top view showing the direction of movement of the base portion in step S813 of the manufacturing process. Figure 19 and Figure 20 It is used for explanation Figure 4 A schematic cross-sectional view of step S9 in the manufacturing process shown. Hereinafter, refer to... Figures 4 to 20 The manufacturing method of the multilayer ceramic capacitor 100 according to this embodiment will be described. Furthermore, in Figure 8 , Figure 9 , Figure 11 ,as well as Figures 13-20 The detailed internal structure of the base 110 is omitted from the illustration.

[0082] First, such as Figure 4 As shown, a dielectric ceramic slurry is prepared (step S1). Specifically, dielectric ceramic powder, additive powder, binder resin, and solvent are dispersed and mixed. Thus, a dielectric ceramic slurry is prepared.

[0083] The dielectric ceramic powder is, for example, perovskite-structured dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The added powder is, for example, composed of at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea-formaldehyde resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or water-based polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These can be used as monomers or in mixtures of two or more. The dielectric ceramic slurry can also be either solvent-based or water-based. When the dielectric ceramic slurry is designed as a water-based coating, it is prepared by mixing a water-soluble binder and dispersant with a water-soluble dielectric raw material.

[0084] Next, a dielectric ceramic sheet is formed (step S2). Specifically, a dielectric ceramic slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or micro-gravure coater, and then dried. This forms the dielectric ceramic sheet. From the viewpoint of miniaturization and high capacitance of multilayer ceramic capacitors, the thickness of the dielectric ceramic sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0085] Next, a master sheet is formed (step S3). Specifically, a conductive paste is applied to the dielectric ceramic sheet in a predetermined pattern. This forms a master sheet with a predetermined internal electrode pattern on the dielectric ceramic sheet. The conductive paste contains Ni powder, solvent, dispersant, and binder, and is adjusted to a certain viscosity. PVA or PVB is used as the binder. The application method for the conductive paste can be screen printing, inkjet printing, or gravure printing. From the viewpoint of miniaturization and high capacitance of multilayer ceramic capacitors, the thickness of the internal electrode pattern is preferably 0.3 μm or more and 0.8 μm or less. In addition to the master sheet with the internal electrode pattern, a dielectric ceramic sheet that has not undergone step S3 is also prepared as the master sheet.

[0086] Next, multiple master sheets are stacked (step S4). Specifically, a predetermined number of master sheets without internal electrode patterns, consisting only of dielectric ceramic sheets, are stacked with a thickness of, for example, 10 μm or more and 30 μm or less. A predetermined number of master sheets with internal electrode patterns are then stacked on top of these master sheets. The number of master sheets with internal electrode patterns stacked is, for example, 1 or more and 1000 or less. A predetermined number of master sheets without internal electrode patterns, consisting only of dielectric ceramic sheets, are then stacked on top of these master sheets with a thickness of, for example, 10 μm or more and 30 μm or less. This constitutes a master sheet group.

[0087] Next, a dielectric block is formed by pressing the mother sheet assembly together (step S5). Specifically, the mother sheet assembly is pressed together in the lamination direction using isostatic pressing or rigid pressing. This forms the dielectric block. At this time, the dielectric ceramic sheets are pressed together at a predetermined temperature to ensure they are tightly bonded. Furthermore, a dielectric ceramic sheet of a certain thickness is placed on the outermost layer in the lamination direction and pressed. This protects the dielectric sheet with the internal electrode pattern formed on it.

[0088] Next, the dielectric block is divided to form a chip (step S6). Specifically, the dielectric block is divided into a matrix shape by pressure cutting, dicing, or laser cutting, and then monolithically processed into multiple chips. Alternatively, the dielectric block can be divided while it is being heated and softened.

[0089] Next, the chip is fired (step S7). Specifically, the substrate 110 is formed by firing the dielectric and conductive materials contained in the chip by heating the chip. The firing temperature is set to, for example, 900°C or higher and 1300°C or lower. In addition, the firing temperature can be appropriately set corresponding to the dielectric and conductive materials.

[0090] Next, the external electrode is formed (step S8). For example... Figure 5As shown, process S8 includes processes S81 to S83 as described below.

[0091] First, the first external electrode 120 is formed (step S81). Step S81 also includes steps S811 to S819, which are described below.

[0092] First, such as Figures 5-7 As shown, a first conductive paste layer 51, serving as a precursor for an external electrode, is formed in the paste layer holding mechanism (step S811). Specifically, the paste layer holding mechanism is configured to hold the paste layer and has a flat plate portion 60. The first conductive paste layer 51 is applied to the flat plate portion 60 using the paste application mechanism 10. The first conductive paste layer 51 and the second conductive paste layer 53, discussed later, are formed in layers from a conductive paste composed of conductive particles, a binder, a solvent, and a dispersant. The flat plate portion 60 is formed from, for example, a metallic material. The surface of the flat plate portion 60 extends in the horizontal direction.

[0093] The paste application mechanism 10 has a scraper 11 and a blade 12 located facing each other. The scraper 11 and the blade 12 have a generally plate-like shape.

[0094] The end of the scraper 11 located on the flat plate portion 60 side abuts against the flat plate portion 60. The end of the blade 12 located on the flat plate portion 60 side is positioned slightly separated from the flat plate portion 60. Thus, a gap G is provided between the aforementioned end of the blade 12 and the flat plate portion 60. The space between the scraper 11 and the blade 12 constitutes a receiving space 10a for storing the conductive paste.

[0095] With the conductive paste forming the first conductive paste layer 51 stored in the receiving space 10a, the paste application mechanism 10 moves relative to the plate portion 60 along the in-plane direction of the plate portion 60. Thus, by applying the conductive paste extruded from the gap G onto the plate portion 60, the first conductive paste layer 51 is formed on the plate portion 60.

[0096] Alternatively, the plate portion 60 can be moved instead of the paste application mechanism 10, or both the paste application mechanism 10 and the plate portion 60 can be moved. The thickness H1 of the first conductive paste layer 51 can be appropriately changed by changing the vertical dimension of the gap G.

[0097] The paste application mechanism 10 is also used to scrape off the first conductive paste layer 51 from the flat plate portion 60, which will be discussed in detail later.

[0098] Next, as Figure 5 and Figure 8 As shown, the substrate portion 110 is impregnated into the first conductive paste layer 51 (step S812).

[0099] In detail, firstly, a plurality of substrate portions 110 are held by a holding portion 20 such that their respective first end faces 115 face the first conductive paste layer 51. The holding portion 20 is used to hold the substrate portion 110 with one of its pair of end faces facing downward in the vertical direction. Furthermore, as discussed later... Figures 9-11 and Figures 13-15 In the figure, only one of the multiple base portions 110 is shown.

[0100] The retaining portion 20 includes a base layer 21 and an adhesive layer 22 disposed on the main surface of the base layer 21. The base layer 21 is formed of, for example, a metal material. The adhesive layer 22 is formed of, for example, silicone rubber. In this embodiment, by attaching the second end face 116 of the substrate portion 110 to the adhesive layer 22, the substrate portion 110 is retained by the retaining portion 20 with the first end face 115 facing downward in the vertical direction.

[0101] An actuator 23 is mounted on the holding part 20. The actuator 23 can move the holding part 20 in any direction based on a signal from the control unit 90. More specifically, the actuator 23 drives the holding part 20 to move in three orthogonal axes: the length direction L, the width direction W, and the stacking direction T. In this embodiment, the actuator 23 is equivalent to both a vertical drive mechanism that moves the holding part 20 in the vertical direction and a horizontal drive mechanism that moves the holding part 20 in the horizontal direction. The actuator 23 is composed of, for example, a servo motor, a stepper motor, or a Robo Cylinder, but the type of actuator 23 is not particularly limited to these.

[0102] The control unit 90 is used to control the operation of the actuator 23. The control unit 90 has a CPU (Central Processing Unit) 91, a memory 92, and input / output devices (not shown) for inputting and outputting various signals as its main components.

[0103] CPU 91 is used to execute programs. Memory 92 includes ROM (Read Only Memory) and RAM (Random Access Memory). ROM stores data non-volatilely. RAM volatilely stores data generated by CPU 91 executing programs.

[0104] The various components of the control unit 90 are interconnected via a data bus. Processing in the CPU 91 is implemented using various hardware components and software executed by the CPU 91. This software is pre-stored in ROM / RAM. Power is supplied to the control unit 90 using an internal power supply (not shown) or an external power supply (not shown). For connection to an external power supply, an AC adapter (not shown) is used, for example.

[0105] The control unit 90 drives the actuator 23 to impregnate the substrate 110 from the first end face 115 toward the first conductive paste layer 51 such that the first end face 115 of the substrate 110 substantially reaches the bottom 52 of the first conductive paste layer 51 (see discussion below). Figure 9 ).

[0106] The phrase "the first end face 115 approximately reaches the bottom 52" ​​not only means that the first end face 115 abuts against the surface of the flat plate portion 60, but also that the first end face 115 is positioned slightly separated from the surface of the flat plate portion 60. This is because it is also conceivable that, due to dimensional tolerances in the length direction L of the base portion 110, the first end face 115 of a portion of the multiple base portions 110 abuts against the surface of the flat plate portion 60, while the first end face 115 of the remaining multiple base portions 110 does not abut against the surface of the flat plate portion 60.

[0107] Next, as Figure 5 , Figure 9 as well as Figure 10 As shown, the substrate portion 110 moves relative to the first conductive paste layer 51 in the in-plane direction of the first end face 115 (step S813).

[0108] In detail, with the substrate portion 110 immersed in the first conductive paste layer 51 from the first end face 115 side, the actuator 23 is driven by the control unit 90 to move the substrate portion 110 relative to the first conductive paste layer 51 in the WT plane direction of the first end face 115.

[0109] like Figure 10 As shown, the substrate 110 rotates within the WT plane in a manner that traces a rectangular (square in this embodiment) trajectory by alternately moving in the W and T directions. By moving the substrate 110 in this way, the first conductive paste layer 51 can be evenly wetted and ascended toward the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114. In this embodiment, one of the W and T directions corresponds to the first direction, and the other corresponds to the second direction.

[0110] By impregnating the substrate portion 110 with the first conductive paste layer 51 in this way, a portion of the first conductive paste layer 51 is applied to the first end face 115.

[0111] Next, as Figure 5 and Figure 11 As shown, the substrate portion 110 is lifted from the first conductive paste layer 51 (process S814).

[0112] Specifically, the actuator 23 is driven by the control unit 90, thereby moving the substrate portion 110 in a manner that lifts the substrate portion 110 from the first conductive paste layer 51 during a period in which the substrate portion 110 moves relative to the first conductive paste layer 51 in the direction within the WT plane of the first end face 115. In this embodiment, the substrate portion 110 is lifted obliquely upward from the first conductive paste layer 51.

[0113] A first layer 161, serving as a precursor to the base electrode layer 160 of the first external electrode 120, is applied to the first end face 115 of the substrate portion 110, which has been lifted from the first conductive paste layer 51. A majority of the first layer 161 constitutes the portion corresponding to the end face-side first external electrode 121, and a remaining portion of the first layer 161 constitutes the portion corresponding to the side face-side first external electrode 122.

[0114] Next, as Figure 5 As shown, a second conductive paste layer 53, serving as a precursor for an external electrode, is formed on the plate portion 60 (step S815).

[0115] In detail, firstly, such as Figure 12 As shown, the remaining portion of the first conductive paste layer 51 on the plate portion 60 is scraped off by the scraper 11 of the paste application mechanism 10. The first conductive paste layer 51 thus scraped off is removed from the plate portion 60 and is recycled in a manner that allows it to be stored again in the receiving space 10a of the paste application mechanism 10.

[0116] Next, the conductive paste used to form the first conductive paste layer 51 is stored in the receiving space 10a to form the second conductive paste layer 53. In this state, the paste application mechanism 10 moves relative to the flat plate portion 60 in the in-plane direction of the flat plate portion 60. Thus, by applying the paste extruded from the gap G onto the flat plate portion 60, the second conductive paste layer 53 is formed on the flat plate portion 60.

[0117] Here, the dimension H2 of the thickness of the second conductive paste layer 53 is used (refer to the discussion below). Figure 13 The dimension H1 of the first conductive paste layer 51 described above is greater than the thickness of the first conductive paste layer 51 (refer to the dimension H1). Figure 7 The dimension of the clearance G in the height direction is changed in a large way. For example, the dimension H1 is set to be more than 30% and less than 50% of the dimension H2.

[0118] Next, as Figure 5 , Figure 13 as well as Figure 14 As shown, the substrate portion 110 is impregnated into the second conductive paste layer 53 (step S816).

[0119] In detail, after the substrate portion is lifted from the first conductive paste layer 51, the actuator 23 is driven by the control unit 90, so that the substrate portion 110 is impregnated from the first end face 115 toward the second conductive paste layer 53 in such a way that the first end face 115 of the substrate portion 110 substantially reaches the bottom 54 of the second conductive paste layer 53.

[0120] By impregnating the substrate 110 with the second conductive paste layer 53 in this way, a portion of the second conductive paste layer 53 is applied to the first end face 115.

[0121] Furthermore, while the substrate portion 110 is immersed in the second conductive paste layer 53, the substrate portion 110 can be moved relative to the second conductive paste layer 53 in the in-plane direction of the first end face 115, similar to the process S813 described above.

[0122] Next, as Figure 5 and Figure 15 As shown, the substrate portion 110 is lifted from the second conductive paste layer 53 (process S817).

[0123] Specifically, the actuator 23 is driven by the control unit 90, thereby moving the substrate portion 110 in a manner that lifts it from the second conductive paste layer 53. In this embodiment, the substrate portion 110 is lifted from the second conductive paste layer 53 upward in the vertical direction.

[0124] Thus, the second layer 162, which serves as the precursor of the base electrode layer 160 of the first external electrode 120, is applied to the first end face 115, the first main face 111, the second main face 112, the first side face 113, and the second side face 114 of the substrate portion 110, which has been lifted from the second conductive paste layer 53. The second layer 162 thus applied covers the first layer 161.

[0125] Here, the second layer 162 is applied to the substrate portion 110 such that most of it constitutes the portion corresponding to the side-side first external electrode 122. Thus, the base electrode layer 160 of the end-face side first external electrode 121 is mainly composed of the first layer 161, and the base electrode layer 160 of the side-side first external electrode 122 is mainly composed of the second layer 162.

[0126] Furthermore, as a method to make the second layer 162 biased towards the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114 relative to the first end face 115 side, for example, a method to optimize the viscosity of the second conductive paste layer 53 can be cited.

[0127] By applying the second layer 162 to the first end face 115 as described above, even if the thickness of the first layer 161 is insufficient compared to the required thickness of the base electrode layer 160 of the first external electrode 120, the thickness of the second layer 162 can still be made up to the required amount of thickness.

[0128] Alternatively, after process S817, the substrate can be repeatedly impregnated with the conductive paste.

[0129] Next, as Figure 5 As shown, the first layer 161 and the second layer 162 are sintered (step S818). Specifically, by heating the first layer 161 and the second layer 162, which have been applied to the first end face 115 and its surrounding area, using, for example, a drying oven, a sintered layer constituting the base electrode layer 160 is formed. The sintering temperature is set, for example, to between 700°C and 900°C. Furthermore, the sintering temperature can be appropriately varied depending on the dielectric material and the conductive material.

[0130] Next, as Figure 5 As shown, a plating layer 170 is formed on the surface of the sintered layer (step S819). As a result, a first external electrode 120 is formed on the first end face 115.

[0131] Next, as Figure 5 and Figures 16-18 As shown, the base portion 110 is flipped over (step S82). Specifically, firstly, a retaining portion 20 is prepared, having a structure substantially the same as that of the retaining portion 20 used to retain the base portion 110 and being separately constructed from the retaining portion 20. Furthermore, for ease of explanation, the retaining portion 20 used to retain the base portion 110 is referred to as the first retaining portion, and the retaining portion 20 separately constructed from the first retaining portion is referred to as the second retaining portion.

[0132] Next, as Figure 16 As shown, the second holding portion is positioned relative to the first holding portion with the adhesive layer 22 of the second holding portion facing the first external electrode 120. Then, the first holding portion is moved relative to the second holding portion so that the first holding portion and the second holding portion approach each other. As a result, the first external electrode 120 abuts against the adhesive layer 22 of the second holding portion.

[0133] Next, as Figure 17 As shown, the first retaining part, the second retaining part, and the base part 110 are flipped together in an upside-down manner.

[0134] Next, as Figure 18As shown, the first holding portion is moved relative to the second holding portion in such a way that the first holding portion and the second holding portion are moved away from each other. Here, the adhesive force of the adhesive layer 22 of the second holding portion is stronger than that of the adhesive layer 22 of the first holding portion. As a result, the base portion 110 to which the first external electrode 120 is attached to the adhesive layer 22 of the second holding portion is peeled off from the adhesive layer 22 of the first holding portion.

[0135] As a result, the base portion 110 is held by the second retaining portion with the second end face 116 facing downward in the vertical direction.

[0136] Next, as Figure 5 As shown, a second external electrode 130 is formed on the second end face 116 (step S83). Step S83 also includes steps corresponding to steps S811 to S819 described above, but since the content of these steps is basically the same as that of steps S811 to S819, their description is omitted.

[0137] Next, as Figure 4 , Figure 19 as well as Figure 20 As shown, the multilayer ceramic capacitor 100 is recycled (step S9). Specifically, first, a recycling blade 30 is prepared. Next, with the tip of the recycling blade 30 abutting the surface of the adhesive layer 22 of the second holding portion, the recycling blade 30 is moved relative to the second holding portion. Thus, by inserting the recycling blade 30 into the gap between the adhesive layer 22 and the first external electrode 120, the multilayer ceramic capacitor 100 is detached from the second holding portion. Therefore, the multilayer ceramic capacitor 100 can be recycled.

[0138] By going through the processes described above, a multilayer ceramic capacitor 100 can be manufactured according to the manufacturing method of the multilayer ceramic capacitor of this embodiment.

[0139] <C. Summary>

[0140] In the manufacturing method of the multilayer ceramic capacitor of this embodiment, as described above, when the external electrode is provided to the substrate 110, the substrate 110 is immersed in the first conductive paste layer 51 from the first end face 115 side so that the first end face 115 of the substrate 110 substantially reaches the bottom 52 of the first conductive paste layer 51. In this state, the substrate 110 is moved relative to the first conductive paste layer 51 in the WT plane direction of the first end face 115. Furthermore, during its movement, the substrate 110 is lifted from the first conductive paste layer 51, and then the substrate 110 is immersed in the second conductive paste layer 53 from the first end face 115 side so that the first end face 115 substantially reaches the bottom 54 of the second conductive paste layer 53.

[0141] By providing the external electrode in this way on the substrate 110, the thickness of the first external electrode 121 covering the end face side of the first end face 115 of the substrate 110 can be reduced. This is because, by moving the substrate 110 relative to the first conductive paste layer 51 in the WT plane direction of the first end face 115 in a state where the first end face 115 has approximately reached the bottom 52 of the first conductive paste layer 51, as described above, excessive application of the first conductive paste layer 51 to the first end face 115 can be effectively suppressed.

[0142] That is, the reason is that even if a portion of the first conductive paste layer 51 is excessively applied to the first end face 115 within the first conductive paste layer 51, by moving the substrate portion 110 relative to the first conductive paste layer 51 as described above, the excessive amount of the first conductive paste layer 51 rubs against the plate portion 60, thereby causing the excessive amount of the first conductive paste layer 51 to peel off from the first end face 115.

[0143] As a result, the thickness of the first external electrode 121 on the end face side of the first end face 115 covering the substrate portion 110 can be reduced. Furthermore, the same effect is achieved in the second external electrode 131 on the end face side of the second end face 116 covering the substrate portion 110.

[0144] Therefore, with the above configuration, it is possible to establish a manufacturing method and manufacturing apparatus for miniaturized electronic components.

[0145] Furthermore, by moving the substrate portion 110 relative to the first conductive paste layer 51 in the WT direction of the first end face 115 in a state where the first end face 115 has approximately reached the bottom 52 of the first conductive paste layer 51, as described above, the generation of so-called bubbling, which causes air bubbles to be drawn into the gap between the first end face 115 and the first external electrode 121 on the end face side, can be effectively suppressed. This is because air bubbles that are unexpectedly drawn into the gap are squeezed out of the gap toward the outside of the gap due to the relative movement of the substrate portion 110 relative to the first conductive paste layer 51.

[0146] Furthermore, the effectiveness of the manufacturing method of the multilayer ceramic capacitor described above was confirmed by the verification tests discussed later.

[0147] In the above embodiment, the example described is that the retaining portion 20 is configured to be movable by mounting the actuator 23 on the retaining portion 20. However, it is also possible to configure the plate portion 60 to be movable in any direction by mounting the actuator 23 on the plate portion 60. In this case, the substrate portion 110 can also be moved relative to the first conductive paste layer 51 and the second conductive paste layer 53.

[0148] Furthermore, in the above-described embodiment, in process S814, the case in which the substrate portion 110 is lifted from the first conductive paste layer 51 during the period when the substrate portion 110 moves relative to the first conductive paste layer 51 in the direction in the WT plane of the first end face 115 is illustrated. However, it is also possible that the substrate portion 110 is lifted from the first conductive paste layer 51 after the substrate portion 110 has moved relative to the first conductive paste layer 51 in the direction in the WT plane of the first end face 115.

[0149] <D. Verification Experiment>

[0150] In this verification test, the effect of the manufacturing method of the multilayer ceramic capacitor of this embodiment was verified by comparing the thickness of the external electrodes of the multilayer ceramic capacitor (hereinafter also referred to as the multilayer ceramic capacitor of the embodiment) manufactured based on the manufacturing method of the multilayer ceramic capacitor of this embodiment with the thickness of the external electrodes of the multilayer ceramic capacitor (hereinafter also referred to as the multilayer ceramic capacitor of the comparative example) manufactured based on the manufacturing method of the multilayer ceramic capacitor of the comparative example.

[0151] Figure 21 This is a schematic top view of a multilayer ceramic capacitor used to illustrate the location for measuring the thickness of the external electrodes in a verification test. Figure 22 and Figure 23 It is a table that shows the test conditions and test results in the verification test.

[0152] In comparing the manufacturing method of the multilayer ceramic capacitor in the comparative example with the manufacturing method of the multilayer ceramic capacitor in this embodiment, only the above-mentioned steps S811 to S814 (see reference) are excluded. Figure 5 This is the only difference; the rest are the same. That is, in the manufacturing method of the comparative example of the multilayer ceramic capacitor, the substrate portion 110 is impregnated with the conductive paste layer only once.

[0153] In this verification experiment, multilayer ceramic capacitors of Examples 1-19 and 21-39, with different test conditions, were prepared. Figure 22 As shown, in Examples 1 to 19, the moving length d of the base portion in the WT plane direction in process S813 (refer to...) Figure 10 They are all different. For example... Figure 23 As shown, in Examples 21 to 39, the dimension H1, which is the thickness of the first conductive paste layer 51 in step S812 (refer to...), is... Figure 8 The dimension H2 relative to the thickness of the second conductive paste layer 53 in process S816 (refer to) Figure 13The layer thickness ratio r of the ratio (i.e., H1 / H2) is different for each layer.

[0154] The substrate of the multilayer ceramic capacitors in the embodiments and comparative examples has dimensions of 3.2 mm in length, 2.5 mm in width, and 2.5 mm in thickness. The number of samples of the multilayer ceramic capacitors in Examples 1-19, 21-39, and the multilayer ceramic capacitors in the comparative examples is 5 each.

[0155] In this verification test, the thickness of the external electrodes and the presence or absence of blistering in the multilayer ceramic capacitors of the examples and comparative examples were confirmed. As for the thickness of the external electrodes, such as... Figure 21 As shown, the thickness dimension t1 (also called central thickness dimension t1) of the central portion of the first external electrode 121 in the width direction W of the end face side is measured, and the thickness dimension t2 (also called outer thickness dimension t2) of the first external electrode 121 in the width direction W corresponding to the end of the inner layer portion C is measured, and their difference Δt (i.e., t1-t2) is calculated. Furthermore, the central thickness dimension t1 is the average value measured from 5 samples. The same applies to the outer thickness dimension t2.

[0156] Here, in Figure 22 and Figure 23 In this context, "thickness evaluation" refers to the thickness evaluation obtained by comparing the difference Δt between the embodiment and the comparative example. If the difference Δt between the embodiment and the comparative example is greater than or equal to the difference Δt, the thickness evaluation is described as "poor". If the difference Δt between the embodiment and the comparative example is less than the difference Δt, the thickness evaluation is described as "good". Furthermore, if the difference Δt between the embodiment and the comparative example is less than or equal to 20 μm, the thickness evaluation is described as "excellent".

[0157] Furthermore, if foaming occurs, the foaming evaluation will be described as "poor". If no foaming occurs, the foaming evaluation will be described as "good".

[0158] Furthermore, when the travel length d is 10 mm or more, the productivity evaluation is described as "poor". When the travel length d is less than 10 mm, the productivity evaluation is described as "good". The reason for this is that when the travel length d is sufficiently large, the area of ​​the plate portion, the first conductive paste layer, and the second conductive paste layer required to manufacture a single multilayer ceramic capacitor increases, and as a result, the manufacturing capacity of the multilayer ceramic capacitor manufacturing apparatus decreases.

[0159] Furthermore, if the thickness evaluation is "poor," the overall evaluation will be described as "poor." If the thickness evaluation is "good" or "excellent," and at least one of the foaming evaluation and productivity evaluation is "poor," the overall evaluation will be described as "acceptable." If the thickness evaluation, foaming evaluation, and productivity evaluation are all "good," the overall evaluation will be described as "good." If the thickness evaluation is "excellent," and both the foaming evaluation and productivity evaluation are "good," the overall evaluation will be described as "excellent."

[0160] like Figure 22 and Figure 23 As shown, in the multilayer ceramic capacitors of embodiments other than Example 21, the overall evaluation is any one of "acceptable", "good", and "excellent". Therefore, it is confirmed that by manufacturing a multilayer ceramic capacitor based on the manufacturing method of the multilayer ceramic capacitor of this embodiment, it is possible to achieve thinner walls for the external electrodes, and further, it is possible to achieve miniaturization of the multilayer ceramic capacitor.

[0161] Furthermore, when the moving length d is set to 5 mm or more and the layer thickness ratio r is set to 40%, as in Examples 7-19, it was confirmed that the thickness evaluation is "excellent," the thickness of the first external electrode 121 and the second external electrode 131 on the end face side is generally thinned, and these thicknesses are made quite uniform in the width direction W and the stacking direction T. The same applies when the moving length d is set to 15 mm or more and the layer thickness ratio r is set to 30% or more and 50% or less, as in Examples 27-31.

[0162] Furthermore, when the moving length d is set to 5 mm or more and 9 mm or less, and the layer thickness ratio r is set to 40%, as in Examples 7-11, it was confirmed that the thickness of the first external electrode 121 and the second external electrode 131 on the end face side is generally thinned, and these thicknesses are made quite uniform in the width direction W and the stacking direction T. Moreover, it was confirmed that a method for manufacturing a multilayer ceramic capacitor that suppresses blistering and has excellent productivity was developed.

[0163] (Examples 1 through 3)

[0164] Figures 24-26 These are schematic top views illustrating the direction of movement of the substrate portion in the manufacturing method of the multilayer ceramic capacitors in the first to third modifications. Hereinafter, refer to... Figures 24-26 The manufacturing method of the multilayer ceramic capacitor based on the first to third modifications of the above-described embodiments will be described.

[0165] like Figures 24-26As shown, the manufacturing methods of the multilayer ceramic capacitors in the first to third modifications differ from those in the multilayer ceramic capacitor manufacturing methods of the embodiments described above in that the moving direction of the substrate portion 110 in step S813 is different.

[0166] In detail, such as Figure 24 As shown, in the first modified example, the base portion 110 reciprocates along the W direction and then reciprocates in the T direction. Furthermore, the order of the reciprocating movement in the W direction and the reciprocating movement in the T direction can also be reversed.

[0167] like Figure 25 As shown, in the second modified example, after the base portion 110 reciprocates in a first inclined direction that is inclined relative to both the W and T directions, it reciprocates in a second inclined direction that is inclined relative to both the W and T directions and intersects the first inclined direction. Furthermore, the first and second inclined directions are preferably orthogonal to each other.

[0168] like Figure 26 As shown, in the third variation, the base portion 110 rotates in a manner that traces a roughly circular track within the WT plane.

[0169] With such a configuration, the effects described in the above embodiments can also be obtained, and it is possible to provide a method and apparatus for manufacturing electronic components that can be miniaturized.

[0170] (4th variation)

[0171] Figure 27 This is a schematic bottom view showing the structure of the holding part used in the manufacturing method of the multilayer ceramic capacitor in the fourth variation. Figure 28 yes Figure 27 A schematic cross-sectional view of the retaining part along line XXVIII-XXVIII. Figure 29 This is a schematic cross-sectional view showing the structure of the first plate portion and the second plate portion used in the manufacturing method of the multilayer ceramic capacitor in the fourth variation. Hereinafter, refer to... Figures 27-29 The manufacturing method of the multilayer ceramic capacitor based on the fourth variation of the above-described embodiments will be described.

[0172] like Figures 27-29 As shown, the manufacturing method of the fourth modified ceramic capacitor differs from that of the above-described embodiment in that the structure of the holding part is different, and the paste layer holding mechanism has a first plate part 61 and a second plate part 62 instead of the plate part 60.

[0173] like Figure 27 and Figure 28As shown, the retaining portion 20A includes: a base layer 24, with a plurality of through holes 24a arranged in a grid pattern on the base layer 24; and generally cylindrical adhesive portions 25, which are respectively inserted into the plurality of through holes 24a. A plurality of base portions 110 can be respectively inserted into a plurality of adhesive portions 25. The base layer 24 is formed of, for example, a metallic material. The adhesive portions 25 are formed of, for example, silicone rubber.

[0174] The adhesive portion 25 is configured to be slightly larger than the through hole 24a. Therefore, the adhesive portion 25 is fixed to the through hole 24a by being inserted into it in a slightly compressed state in the in-plane direction of a section orthogonal to its axial direction. Alternatively, the size of the adhesive portion 25 may be set to be approximately the same as the size of the through hole 24a, and the adhesive portion 25 may be fixed to the through hole 24a by the adhesive force of its surface.

[0175] The inner size of the adhesive portion 25 is slightly smaller than the outer size of the base portion 110 in the WT plane. Therefore, the base portion 110 inserted into the adhesive portion 25 is fixed to the through hole 24a by means of the adhesive portion 25 due to the compressive force of the adhesive portion 25.

[0176] Here, multiple base portions 110 are fixed to the through holes 24a with the same protruding length from each through hole 24a. This allows for the absorption of dimensional tolerances in the length direction of the base portions 110. Therefore, in the aforementioned process S812 or S816, more first end faces 115 of the base portions 110 can abut against the bottom 52 of the first conductive paste layer 51 or the bottom 54 of the second conductive paste layer 53.

[0177] When disassembling the multilayer ceramic capacitor 100 held by the holding part 20A, a recycling pin or the like can be used instead of the aforementioned recycling blade 30. In this case, the multilayer ceramic capacitor 100 can be recycled by using the recycling pin or the like to push the multilayer ceramic capacitor 100 out of the through hole 24a.

[0178] like Figure 29 As shown, in this modified example, a first conductive paste layer 51 is disposed on the first plate portion 61, and a second conductive paste layer 53 is disposed on a second plate portion 62, which is independent of the first plate portion 61. Therefore, after the substrate portion 110 is lifted from the first conductive paste layer 51, there is no need to scrape off the remaining portion of the first conductive paste layer 51 remaining on the first plate portion 61. As a result, multilayer ceramic capacitors can be manufactured efficiently.

[0179] With such a configuration, the effects described in the above embodiments can also be obtained, and it is possible to provide a method and apparatus for manufacturing electronic components that can be miniaturized.

[0180] (Other methods, etc.)

[0181] In the embodiments and variations thereof described above, multilayer ceramic capacitors were exemplified as electronic components, and their manufacturing methods and apparatus were explained. However, the manufacturing methods and apparatus for electronic components shown in these embodiments and variations can also be applied to manufacturing methods and apparatus for, for example, multilayer ceramic inductors or multilayer ceramic thermistors, which are electronic components. However, in the case of multilayer ceramic inductors, the internal electrodes are composed of coil-shaped conductors.

[0182] Furthermore, various changes can be made to the shape, structure, size, quantity, material, etc. of each part shown in the above-described embodiments and variations of the present invention, as long as they do not depart from the spirit of the present invention.

[0183] Furthermore, the characteristic configurations shown in the above-described embodiments and variations of the present invention can naturally be combined with each other without departing from the spirit of the present invention.

[0184] Therefore, the above-disclosed embodiments and their variations are illustrative in all respects and are not restrictive. The scope of protection of this invention is defined by the claims, and also includes all modifications within the meaning and scope equivalent to the claims.

Claims

1. A method of manufacturing an electronic component, the electronic component including: a base portion having a first end surface and a second end surface that are opposite in a length direction; and external electrodes provided on the first end surface and the second end surface, respectively, wherein the method of manufacturing the electronic component includes the following steps: impregnating the base portion with a first conductive paste layer that is a precursor of the external electrodes from a side on which the first end surface is located; relatively moving the base portion with respect to the first conductive paste layer in a surface-in-plane direction of the first end surface in a state in which the base portion is impregnated with the first conductive paste layer from the side on which the first end surface is located; pulling the base portion from the first conductive paste layer during or after the base portion is relatively moved with respect to the first conductive paste layer in the surface-in-plane direction of the first end surface; and impregnating the base portion with a second conductive paste layer that is a precursor of the external electrodes from the side on which the first end surface is located after the base portion is pulled from the first conductive paste layer.

2. The method of manufacturing the electronic component according to claim 1, wherein a size of a thickness of the second conductive paste layer is larger than a size of a thickness of the first conductive paste layer.

3. The method of manufacturing the electronic component according to claim 1 or 2, wherein in the step of relatively moving the base portion with respect to the first conductive paste layer in the surface-in-plane direction of the first end surface, the base portion is relatively moved with respect to the first conductive paste layer in a first direction that is orthogonal to the length direction.

4. The method of manufacturing the electronic component according to claim 3, wherein in the step of relatively moving the base portion with respect to the first conductive paste layer in the surface-in-plane direction of the first end surface, the base portion is also relatively moved with respect to the first conductive paste layer in a second direction that is orthogonal to the length direction and the first direction, respectively.

5. An apparatus of manufacturing an electronic component, the electronic component including: a base portion having a first end surface and a second end surface that are opposite in a length direction; and external electrodes provided on the first end surface and the second end surface, respectively, wherein the apparatus of manufacturing the electronic component includes: a holding portion that holds the base portion so that the first end surface faces a lower side in a vertical direction; a paste layer holding mechanism that holds a first conductive paste layer that is a precursor of the external electrodes and a second conductive paste layer that is a precursor of the external electrodes; a vertical driving mechanism that moves the holding portion in the vertical direction; a horizontal driving mechanism that moves the holding portion in a horizontal direction; and a control portion that controls operations of the vertical driving mechanism and the horizontal driving mechanism, the control portion impregnating the base portion with the first conductive paste layer from a side on which the first end surface is located by moving the holding portion with the vertical driving mechanism. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The control section moves the holding section so that the first end surface moves in the horizontal direction by using the horizontal drive mechanism while the base section is impregnated in the first conductive paste layer from the side of the first end surface, The control section moves the holding section so that the base section is pulled up from the first conductive paste layer by using the vertical drive mechanism during or after the first end surface moves in the horizontal direction, The control section impregnates the base section in the second conductive paste layer from the side of the first end surface by moving the holding section by using the vertical drive mechanism after the base section is pulled up from the first conductive paste layer.

6. The electronic component manufacturing apparatus according to claim 5, wherein The thickness of the second conductive paste layer is larger than the thickness of the first conductive paste layer.

7. The electronic component manufacturing apparatus according to claim 5 or 6, wherein The paste layer holding mechanism has a flat plate section, The first conductive paste layer is provided on the flat plate section, The second conductive paste layer is provided on the flat plate section in place of the first conductive paste layer after the base section is pulled up from the first conductive paste layer.

8. The electronic component manufacturing apparatus according to claim 5 or 6, wherein The paste layer holding mechanism has a first flat plate section and a second flat plate section which is independent of the first flat plate section, The first conductive paste layer is provided on the first flat plate section, The second conductive paste layer is provided on the second flat plate section.

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