An inverter circuit and a functional module integrated with a heat sink

Abstract

An inverter circuit module for power distribution circuit device technology field is applied to a generator set and includes an operating parameter acquisition circuit configured to acquire rotating speed, output voltage and output current parameters of the generator set; a control circuit connected with the operating parameter acquisition circuit and configured to generate a control signal based on the operating parameters and output the control signal for adjusting oil intake of the generator set; a power conversion device electrically connected with the control circuit and an output end of the generator set, the power conversion device including a radiator, a commutator module and an inverter module fixed on the same mounting surface of the radiator through a welding layer; an input end of the commutator module is connected with the output end of the generator set, an output end of the commutator module is connected with an input end of the inverter module, and an output end of the inverter module is used for power supply for a load; the circuit structure and the heat dissipation structure of the inverter circuit are improved, the low cost is maintained, and the problem of difficult heat dissipation is solved.

Description

Technical Field

[0001] This invention relates to the field of power supply and distribution circuit devices, specifically to an inverter circuit and an integrated heat sink functional module. Background Technology

[0002] The inverter functional module is the core component of the inverter, mainly realizing the functions of inversion and rectification. Its composition and design directly determine the performance and reliability of the whole machine. Since its main heat source comes from the inversion and rectification process, specifically the semiconductor power switching devices (such as MOSFETs or IGBTs) in the module generate heat during the DC-AC conversion process. Especially when switching frequently, if the heat cannot be dissipated in time, it will lead to temperature accumulation, accelerate device aging, and even cause failure. Therefore, heat dissipation design is crucial. At the same time, the ease of installation must also be considered, which requires improving its integration and miniaturization.

[0003] There are two main design approaches for existing inverter functional modules. One approach is to use low-level components for circuit design and connection. The advantage of this approach is that the components are far apart, so heat is less likely to accumulate, and maintenance only requires the replacement of specific components, resulting in lower costs. The other approach is to use integrated functional modules, which have more concentrated heat. Although they have high integration and heat dissipation only requires cooling the concentrated heat source, they require dedicated drivers and are more expensive, making them unsuitable for low-cost generator sets.

[0004] Meanwhile, for this module, the current mainstream heat dissipation methods have the following limitations:

[0005] One method uses an aluminum substrate as a carrier board, on which power devices are first integrated, and then assembled with an aluminum housing with heat dissipation fins using thermal grease. This method is complex, and components are prone to damage during device mounting and substrate fixing. Furthermore, precise alignment with the main circuit board is required during installation, resulting in high overall assembly difficulty and cost.

[0006] Secondly, to improve integration, multiple functional modules often share the same heat sink. Since the modules have different electrical potentials, insulating ceramic sheets need to be installed between the modules and the heat sink. Although the ceramic sheets have both insulating and thermal conductivity functions, their bonding process requires high precision. The adhesive is prone to aging and peeling under long-term vibration or thermal cycling, leading to a decrease in thermal conductivity and affecting the reliability of heat dissipation.

[0007] Third, some solutions employ adaptive heat dissipation control systems or high-performance chips to improve heat dissipation efficiency, but this significantly increases costs and makes it difficult to promote in conventional or low-cost generator set applications. Summary of the Invention

[0008] I. Technical problems to be solved

[0009] This invention addresses the shortcomings of existing technologies by proposing an inverter circuit that improves the circuit structure and heat dissipation structure of the inverter circuit. Compared with adaptive heat dissipation control systems or solutions using high-performance chips, it solves the problem of heat dissipation difficulties while maintaining low cost.

[0010] II. Specific Technical Solutions

[0011] An inverter circuit module, applied to a generator set, includes: an operating parameter acquisition circuit configured to acquire the generator set's speed, output voltage, and output current parameters; a control circuit connected to the operating parameter acquisition circuit, configured to generate a control signal based on the operating parameters and output a control signal for adjusting the generator set's fuel intake; and a power conversion device electrically connected to the control circuit and the generator set's output terminal, the power conversion device including a radiator, and a rectifier submodule and an inverter submodule fixed to the same mounting surface of the radiator via a welding layer; the input terminal of the rectifier submodule is connected to the generator set's output terminal, its output terminal is connected to the input terminal of the inverter submodule, and the output terminal of the inverter submodule is used to supply power to a load.

[0012] Implementation principle and working principle:

[0013] In this solution, on the one hand, the generator speed, voltage, and current are collected and then fed back and controlled by the control circuit to form a closed-loop control system for the generator set. On the other hand, the control signal not only drives the inverter but also directly controls the oil supply to the generator, deeply coupling the power conversion with the control of the primary power source. Finally, the two core heat-generating sub-modules, namely the rectifier and inverter, are directly fixed on the same plane of the same heat sink through a welding layer, creating the shortest heat conduction path. Specifically, while traditional inverters treat the generator as a stable power source, this solution actively stabilizes the power source by adjusting the oil supply, fundamentally solving the systemic problem of poor output power quality caused by generator speed fluctuations. This "electric-mechanical" linkage control concept transcends the conventional thinking of those skilled in the art who usually only focus on the circuit itself. Welding the two modules to the same heat sink, this structural innovation achieves breakthroughs in performance, cost, and process simplification. The integrated design reduces thermal resistance and improves heat dissipation efficiency. The aluminum substrate / ceramic sheet is eliminated, and a plastic shell can be used, reducing process and material costs. Subsequently, only the rectifier and inverter sub-modules need to be plugged in and fixed by wave soldering, making assembly more convenient.

[0014] Preferably, the rectifier submodule is a module in which three silicon controlled rectifiers (SCRs) and three diodes are connected and packaged into one unit according to a three-phase semi-controlled rectifier bridge circuit; the inverter submodule is a module in which four IGBTs and four diodes are connected and packaged into one unit according to a full-bridge inverter circuit. The beneficial effect of this preferred embodiment is that multiple power devices are connected and packaged at the wafer level according to a predetermined circuit, such as a three-phase semi-controlled rectifier bridge and a full-bridge inverter, to form two highly integrated modules. This greatly reduces the size, reduces the parasitic parameters of the internal wiring of the module, and improves consistency and reliability. Multiple power devices that were originally discrete and required separate installation and heat dissipation are pre-integrated into two fully functional subsystem modules, breaking through the conventional idea of ​​heat dissipation integration of discrete devices, and instead pre-packaged into modules before integration.

[0015] Preferably, at least one electrolytic capacitor C3 is connected in parallel at the output terminal of the rectifier submodule for filtering. The beneficial effect of this preferred option is that by utilizing the energy storage characteristics of the electrolytic capacitor, the voltage ripple on the DC bus after rectification is smoothed, providing a stable and clean DC power supply for the subsequent inverter and ensuring the quality of the output AC power.

[0016] Preferably, the control circuit includes a controller and at least one IGBT drive circuit connected thereto. The IGBT drive circuit includes an optocoupler PC, whose input terminal is connected to the controller via a current-limiting resistor R47; a push-pull amplifier circuit composed of an NPN transistor Q1 and a PNP transistor Q2, whose input terminal is connected to the output terminal of the optocoupler PC, and whose output terminal is connected to the gate of the corresponding IGBT in the inverter submodule via a gate resistor Rg; a bypass branch is connected in parallel across the gate resistor Rg, which is formed by a diode D22 and a resistor R80 connected in series, wherein the anode of the diode D22 is connected to the output terminal of the push-pull amplifier circuit, and the cathode of the diode D22 is connected to the gate of the IGBT; the beneficial effect of this preferred embodiment is: using "optical isolation + The push-pull amplification architecture achieves isolation between high-voltage and low-voltage circuits and provides sufficient gate drive current, making driving simple, reliable, and less expensive than dedicated driver chips. A branch consisting of a diode and a resistor is connected in parallel with the gate resistor to form asymmetrical switching speed control. This achieves "fast turn-on to reduce turn-on losses and soft turn-off to suppress voltage spikes," optimizing the IGBT's switching trajectory and improving efficiency and reliability. The extremely simple branch of diode D22 and resistor R80 cleverly resolves the contradiction between switching losses and turn-off overvoltage, controlling the increased energy consumption and heat generation risks associated with using discrete components to control IGBTs.

[0017] Preferably, a power supply circuit is also included, comprising a power management chip U6, a switching transistor U5, and a multi-output winding transformer T; the output terminal of the power management chip U6 is connected to the control electrode of the switching transistor U5, and the series path of the switching transistor U5 is connected in the primary winding T1E circuit of the multi-output winding transformer; at least one secondary winding T1B of the multi-output winding transformer, after rectification and filtering, provides drive power to the IGBT drive circuit; at least another secondary winding T1A, after rectification and filtering, provides operating power to the controller; at least one secondary winding T1D of the multi-output winding transformer T, after rectification and filtering, provides power to the controller. The power supply is provided by the U6 power management chip. The advantages of this preferred design are: by using a single switching transistor in conjunction with a multi-winding transformer, a flyback switching power supply is designed to provide stable voltages with multiple isolation channels for units at different potentials within the system, such as the drive circuit, control chip, and the power chip itself. This achieves integrated power supply for the entire control system, resulting in a compact structure, low cost, and system safety through electrical isolation. It can simultaneously meet the power supply requirements of the drive circuit (which may require higher voltage), the control chip (which requires lower voltage), and its own Vcc. This highly integrated and low-cost multi-isolated power supply design is not a universal solution, and its close integration with the entire inverter sub-module reflects a high degree of system integration.

[0018] A functional module for an integrated heat sink in an inverter includes a heat sink comprising a mounting plate and heat dissipation fins disposed on one side of the mounting plate; a rectifier submodule, which is a submodule in which three thyristors and three diodes are connected and packaged together according to a three-phase half-controlled rectifier bridge circuit; an inverter submodule, which is a submodule in which four IGBTs and four diodes are connected and packaged together according to a full-bridge inverter circuit; and a solder layer that fixes the back sides of the rectifier submodule and the inverter submodule to the same plane of the mounting plate; wherein the electrical pins of the rectifier submodule and the inverter submodule extend outward perpendicularly to the mounting plate for insertion into a printed circuit board.

[0019] In this solution, the circuit module formed by the rectifier and inverter sub-modules is integrated into a common high heat dissipation efficiency heat sink by the soldering layer assembled during packaging. The electrical pins are designed to be vertically plugged in. Since the heat sink can directly conduct heat to the heat sink, only air cooling or liquid cooling is needed to quickly separate the large amount of heat from the components, achieving extremely high power density, excellent heat dissipation performance, and extremely simple external connection method.

[0020] The innovative aspects of this solution also include the following: 1) Directly soldering two modules with different functions but close thermal relationship to the heat sink, skipping the traditional and expensive intermediate thermal interface such as "aluminum substrate" or "ceramic sheet"; 2) Using the heat sink as both a structural support and a mounting substrate; 3) The "vertical extension of pins" design directly serves the automated process of "plug-in wave soldering".

[0021] More importantly, traditionally, packaged integrated circuit modules are considered to have significantly better heat dissipation performance than discrete components. While discrete components are cheaper, they suffer from significant heat loss and heat buildup, making them prone to failure due to overheating and resulting in shorter lifespans. This solution, however, optimizes the circuit and concentrates the main heat sources on a heat sink, reducing circuit heating and improving the heat transfer coefficient between the main heat sources and the heat sink. This overcomes the problem of uncontrollable heat dissipation that often arises with low-cost component integration, ensuring both performance and heat dissipation while maintaining cost-effectiveness.

[0022] Preferably, the welding layer is a thermally conductive solder layer, which covers the contact surfaces of the rectifier submodule and inverter submodule with the mounting plate; the welding layer includes welding pieces; the welding pieces are located on the side closest to the mounting plate and on each side adjacent to that side; the bottom of the mounting hole is provided with corrugated protrusions or several strip grooves; a support step is provided around the sidewall of the mounting hole, and several limiting holes are provided around the support step, with spring bolts installed in the limiting holes to fix the inverter submodule and rectifier submodule; the beneficial effect of this preferred embodiment is that: through the welding pieces, corrugated protrusions / strip grooves, support steps and spring bolts The mechanical structure, including bolts, enhances welding strength, thermal contact area, and vibration resistance; it ensures long-term reliable and stable mechanical and thermal connections between the module and the heat sink, resisting thermal fatigue and vibration impact; in summary, the welded plates expand the connection area, the corrugated protrusions / slots achieve mechanical interlocking to prevent shear force damage, and the spring bolts provide continuous clamping force to compensate for thermal expansion and contraction and avoid cracking; this multi-layered safety design of "welding-embedding-locking-pressing" completely solves the industry problem of easy aging and loosening of traditional adhesives (such as silicone grease) or single screw fixation, and has made significant progress in improving the product's lifespan and reliability in harsh environments.

[0023] The beneficial effects of this invention are as follows:

[0024] 1. By deeply coupling the "electromechanical" components and structurally integrating thermally, the system's efficiency and stability are fundamentally improved, breaking through the traditional approach of discrete optimization. This invention integrates inverter control and generator oil supply regulation into a closed-loop system, smoothing power fluctuations at the source. It also features a unique structure that directly integrates the two major heat sources, rectification and inversion, onto the same heat dissipation plane through a welding layer. This breaks the technological prejudice that "low cost inevitably leads to low performance" and achieves synergistic optimization: it not only improves power quality from the root but also creates the shortest heat dissipation path, achieving a balance between low thermal resistance, high withstand voltage, and low cost (eliminating the need for aluminum substrates / ceramic sheets and using a plastic casing). This cross-domain collaboration and structural integration solves the long-standing industry problem of balancing "performance and cost."

[0025] 2. By employing a highly integrated and topology-optimized circuit scheme, the system's complexity and cost are reduced while unexpectedly improving efficiency and reliability. This invention pre-packages functional modules at the wafer level, significantly reducing size and parasitic parameters. Furthermore, it utilizes an optimized discrete drive scheme (such as an IGBT drive circuit with D22-R80 branches) to achieve precise control of the switching trajectory, effectively reducing switching losses and voltage spikes. This discrete scheme is far less expensive than dedicated driver chips, yet it resolves the contradiction between high performance and low cost through simple and ingenious topology changes, producing unexpected technical effects. Simultaneously, a dedicated multi-output isolated power supply integrates the system's power supply, further demonstrating a high degree of system integration innovation.

[0026] 3. A simple and highly reliable assembly system is built with "welding integration" as the core, which subverts the complex and fragile installation process of traditional functional modules. The invention uses "thermal conductive welding layer" as the core to permanently fix the functional module and heat sink into a whole. The subsequent motherboard assembly can be completed with only simple "plug-in-wave soldering", which greatly reduces the process steps.

[0027] 4. To address the vibration challenges in generator sets, an innovative composite vibration-resistant structure of "welding-embedding-locking-pressing" was introduced. Through the synergistic effect of welded plates, mechanical interlocking grooves, and spring bolts, unexpectedly, vibration and thermal fatigue resistance far surpasses that of traditional screw and silicone grease methods while ensuring optimal heat conduction. This minimalist, robust, and efficient assembly system represents a revolutionary breakthrough in traditional processes. Attached Figure Description

[0028] Figure 1 This is a logic diagram of an inverter circuit module in this embodiment.

[0029] Figure 2 This is a connection diagram of the rectifier submodule in this embodiment.

[0030] Figure 3 This is a connection diagram of the inverter submodule in this embodiment.

[0031] Figure 4 for Figure 3 The circuit diagram of the drive circuit of the inverter submodule.

[0032] Figure 5 This is a circuit diagram of the power supply circuit in this embodiment.

[0033] Figure 6 This is a circuit diagram of the output terminal of the secondary winding T1B in this embodiment.

[0034] Figure 7 This is a circuit diagram of the output terminal of the secondary winding T1A in this embodiment.

[0035] Figure 8 This is a circuit diagram for acquiring voltage and current parameters at the load end in this embodiment.

[0036] Figure 9 This is a circuit diagram for acquiring the output voltage of the rectifier submodule in this embodiment.

[0037] Figure 10 This is a structural diagram of the functional module of the integrated heat sink used in the inverter in this embodiment.

[0038] Figure 11 This is a schematic diagram of the circuit connection within the inverter submodule in this embodiment.

[0039] Figure 12 This is a schematic diagram of the circuit connection within the rectifier submodule in this embodiment.

[0040] Explanation of reference numerals in the attached figures:

[0041] Welding layer 41, welding plate 411, heat sink 42, mounting plate 421, mounting hole 4210, strip groove 4211, support step 4212, heat sink fin 422, inverter submodule 43, rectifier submodule 44. Detailed Implementation

[0042] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0043] like Figure 1-12 As shown:

[0044] An inverter circuit module, applied to a generator set, includes: an operating parameter acquisition circuit configured to acquire the generator set's speed, output voltage, and output current parameters; a control circuit connected to the operating parameter acquisition circuit, configured to generate a control signal based on the operating parameters and output a control signal for adjusting the generator set's fuel intake; and a power conversion device electrically connected to the control circuit and the generator set's output terminal. The power conversion device includes a radiator, and a rectifier submodule 44 and an inverter submodule 43 fixed to the same mounting surface of the radiator via a welding layer. The input terminal of the rectifier submodule 44 is connected to the generator set's output terminal, and its output terminal is connected to the input terminal of the inverter submodule 43. The output terminal of the inverter submodule 43 is used to supply power to the load.

[0045] In specific implementation, such as Figure 2 , Figure 3 , Figure 11 and Figure 12 ,in Figure 11 and Figure 12 The diagrams further illustrate specific connections and pin arrangements of the internal power devices in the inverter submodule 43 and rectifier submodule 44. Specifically, the inverter submodule 43 is a module in which four IGBTs and four diodes are connected and packaged together according to a full-bridge inverter circuit. The rectifier submodule 44 is a module in which three thyristors and three diodes are connected and packaged together according to a three-phase semi-controlled rectifier bridge circuit. The internal circuit topology of the rectifier submodule 44 after packaging is shown in the dashed box. The three pins on its left side are connected to... Figure 2 The three-phase output of the generator set is connected, and the right side outputs DC. Its high-level end is the POWER pin, and its low-level end is the PGND pin. Figure 11 The dashed box represents the circuit topology of the inverter submodule 43 after packaging. The input POWER terminal and PGND terminal on the left are connected to... Figure 12 Corresponding to the terminals on the right side of the output terminals, the right-side output terminals VS-A and VS-B are connected to... Figure 3 or Figure 8 In transformer L1;

[0046] At the wafer level, multiple power devices are connected and packaged according to a predetermined circuit, such as a three-phase half-controlled rectifier bridge and a full-bridge inverter, to form two highly integrated modules. The modules can be packaged using materials such as silicone, resin, or thermoplastic materials. This greatly reduces the size, reduces the parasitic parameters of the internal wiring of the modules, and improves consistency and reliability. Multiple power devices that were originally discrete and required separate installation and heat dissipation are pre-integrated into two fully functional subsystem modules, breaking through the conventional idea of ​​heat dissipation integration of discrete devices. Instead, they are pre-packaged into modules and then integrated.

[0047] In practical implementation, the operating parameter acquisition circuit is as follows: Figure 2 , Figure 8 and Figure 9 As shown, the positive terminal of operational amplifier U3C is connected to the V- terminal of rectifier submodule 44 through resistor R45, the resistance of which is 10Ω to 510Ω. Its negative terminal is connected to the V+ terminal of rectifier submodule 44 through resistor R52 of the same value. The peripheral circuit of U3C is common knowledge and does not need to be described in detail. Operational amplifiers U3A and U3D are used to collect the load terminal voltage and current parameters, respectively. The control circuit performs negative feedback adjustment based on the collected parameters, which directly acts on the throttle inlet valve of the generator set to maintain stable operation by controlling the oil supply. It also adjusts the inverter submodule 43 and rectifier submodule 44.

[0048] Adjustments to inverter submodule 43, such as Figure 3 and Figure 4 The controller generates control signals through a built-in operating algorithm (such as SPWM), which are then transmitted via... Figure 4 The amplified drive circuit shown directly acts on the gates (G1, etc.) of each IGBT in the inverter submodule 43, controlling their turn-on and turn-off, thereby realizing DC-to-AC inversion and output voltage / frequency regulation; as for the regulation of the rectifier submodule 44, since it is a three-phase half-controlled rectifier bridge, its output DC voltage can be controlled by adjusting the firing angle of the thyristor, and the firing signal of its firing angle is also generated by the controller;

[0049] The inverter submodule 43 and rectifier submodule 44 are soldered onto the same heat sink 42. This structural innovation achieves breakthroughs in performance, cost, and process simplification. The integrated design reduces thermal resistance and improves heat dissipation efficiency. The aluminum substrate / ceramic sheet is eliminated, and a plastic shell can be used, reducing process and material costs. Subsequently, only the rectifier and inverter submodules 43 need to be plugged in and fixed by wave soldering, making assembly more convenient. In actual encapsulation, resin can be used for encapsulation, with the solder layer directly bonded to the resin during solidification.

[0050] In implementation, at least one electrolytic capacitor C3 is connected in parallel to the two pins V+ and V- at the output of the rectifier submodule 44 for filtering. The energy storage characteristics of the electrolytic capacitor C3 are used to smooth the voltage ripple on the DC bus after rectification, providing a stable and clean DC power supply for the subsequent inverter and ensuring the quality of the output AC power. An additional 0.1μF small capacitor can be connected in parallel to remove noise when powering the IC later.

[0051] In implementation, the control circuit includes a controller and four IGBT drive circuits connected to it. The controller is specifically a microcontroller, specifically an ARM4 microcontroller, and the four IGBT drive circuits are composed of the same model and components. In this embodiment, only one IGBT drive circuit is described. The IGBT drive circuit includes an optocoupler PC4, whose input terminal is connected to the controller through a current-limiting resistor R47, which has a value of 10Ω to 100Ω; and a push-pull amplifier circuit composed of an upper NPN transistor Q1 and a lower PNP transistor Q2, whose input terminal is connected to the output terminal of the optocoupler PC4, and whose output terminal is connected to a gate resistor Rg, which has a value of 1Ω to 20Ω. Figure 4 R74 is connected to the gate (G1) of the corresponding IGBT in the inverter submodule 43; a bypass branch is connected in parallel across the gate resistor Rg, which is formed by diode D22 and resistor R80 in series, with resistor R80 ranging from 1Ω to 20Ω; the anode of diode D22 is connected to the output of the push-pull amplifier circuit, and the cathode of diode D22 is connected to the gate of the IGBT, using "optical isolation + The push-pull amplification architecture achieves isolation between high and low voltage currents and provides sufficient gate drive current, making driving simple, reliable, and less expensive than dedicated driver chips. A branch consisting of diode D22 and resistor R80 connected in parallel with the gate resistor forms an asymmetric switching speed control, achieving "fast turn-on to reduce turn-on losses and soft turn-off to suppress voltage spikes," optimizing the IGBT's switching trajectory and improving efficiency and reliability. The extremely simple branch of diode D22 and resistor R80 cleverly solves the contradiction between switching losses and turn-off overvoltage, controlling the increased energy consumption and heat generation risks associated with using discrete components to control the IGBT. At the same time, this branch, in cooperation with the adjacent capacitor, can form a bootstrap circuit, which can increase the input voltage G1, facilitating the activation of the IGBT inside.

[0052] In addition, the controller also controls the rectifier submodule 44 through the rectifier control circuit. Specifically, the controller's three pulse control terminals drive the G1 pulse of the rectifier submodule 44 through the rectifier control circuit. SCR G2 SCR and G3 SCR Three terminals are used for control to improve the current quality of the rectifier submodule 44. The rectifier control circuit is a conventional thyristor control circuit, which is common knowledge to those skilled in the art and will not be described in detail here.

[0053] In a specific implementation, a power supply circuit is also included to power each component. This power supply circuit includes a power management chip U6, a switching transistor U5, and a multi-output winding transformer T. The transformer T is specifically an 8-10 pin transformer, and U6 uses a UC2843 series chip. The output terminal of the power management chip U6 is connected to the control terminal (G terminal) of the switching transistor U5. In a specific implementation, the switching transistor is preferably a MOSFET. The series path of the switching transistor U5 is connected in the primary winding T1E circuit of the multi-output winding transformer. At least one secondary winding T1B of the multi-output winding transformer T is rectified and filtered to provide drive power to the IGBT drive circuit. At least another secondary winding T1A is rectified and filtered to provide operating power to the controller. At least one secondary winding T1D of the multi-output winding transformer T is rectified and filtered to power the power management chip U6.

[0054] The specific connection method is as follows: the IGBT drive power supply is powered through the output terminal of the rectifier submodule 44; the output terminal of the power management chip U6 is connected to the gate (G) of the MOSFET U5; the drain (D) of the MOSFET U5 is connected to the negative terminal of the input terminal T1E of the multi-output transformer T; the positive terminal of the input terminal T1E is connected to the positive output terminal V+; the source (S) of the switching transistor U5 is grounded through resistor R1 or connected to the negative output terminal V-; the positive terminal of the secondary winding T1B is connected to the positive terminal of diode D40, and the negative terminal of diode D40 is connected to the gate (G) of the multi-output transformer T. The input terminal of the power management chip U2 is connected, and the output terminal of the power management chip U2 is connected to the positive terminal of diode D26 through resistor R70; the negative terminal of the stimulation winding T1B is grounded, and the second and third branches of diode D40 are grounded through polarized capacitor C34 and non-polarized capacitor C99, respectively, where the parameter range of C34 is 100μF to 330μF, and C99 is 0.1μF to 10μF; the second and third branches of the output terminal of the power management chip U2 are connected through polarized capacitor C16 and non-polarized capacitor C16, respectively. 26 is grounded, where the parameter range of C16 is the same as that of C34, and C25 is the same as that of C99; the positive terminal of output T1A is connected to the positive terminal of diode D4, the negative terminal of diode D4 is connected to the input terminal of power management chip U4, and the output terminal of power management chip U4 is connected to the controller of the control circuit unit; the negative terminal of secondary winding T1A is grounded, and the second and third branches of diode D4 are grounded through polarized capacitor C34 and non-polarized capacitor C50, respectively; the second and third branches of the output terminal of power management chip U4 are... Do not ground through the polarized capacitor C21 and the non-polarized capacitor C42. The parameter range of C21 is the same as that of C34, and that of C42 is the same as that of C99. The positive terminal of the output terminal T1D is connected to the positive terminal of the diode D11. The negative terminal of the diode D11 is connected to the power supply terminal of the power management chip U6. The negative terminal of the output terminal T1D is grounded. The second and third branches of the negative terminal of the diode D11 are grounded through the polarized capacitor C59 and the non-polarized capacitor C62, respectively. The parameter range of C59 is the same as that of C34, and that of C62 is the same as that of C99.

[0055] A flyback switching power supply is designed using a single switching transistor and a multi-winding transformer to provide stable, isolated voltages for units at different potentials within the system, such as the drive circuit, control chip, and the power supply chip itself. This achieves integrated power supply for the entire control system, resulting in a compact structure, low cost, and guaranteed system safety through electrical isolation. It can simultaneously meet the power supply requirements of the drive circuit (which may require higher voltage), the control chip (which requires lower voltage), and its own Vcc. This highly integrated, low-cost multi-isolated power supply design is not a universal solution, and its close integration with the entire inverter module demonstrates a high degree of system integration.

[0056] In actual production operation, because the aforementioned components are low-cost discrete components, their heat generation and heat loss are relatively high. One source of heat is the rectifier submodule 44 and the inverter submodule 43, while other heat losses and heat generation have been reduced through circuit design. Therefore, a functional module for an integrated heat sink for the inverter is needed, such as... Figure 10 , Figure 11 and Figure 12 It includes a heat sink 42, which includes a mounting plate 421 and heat dissipation fins 422 integrally formed on one side of the mounting plate; a rectifier submodule 44, specifically adopting a submodule in which three thyristors and three diodes are connected and packaged into a three-phase half-controlled rectifier bridge circuit; an inverter submodule 43, which is a submodule in which four IGBTs and four diodes are connected and packaged into a full-bridge inverter circuit. The connection of the three-phase half-controlled rectifier bridge circuit and the connection of the full-bridge inverter circuit are common knowledge and will not be described in detail here; a solder layer 41, which is fixedly connected to the back of the rectifier submodule 44 and the inverter submodule 43 during packaging and is located on the same plane as the mounting plate; wherein, the electrical pins of the rectifier submodule 44 and the inverter submodule 43 extend downward perpendicularly to the mounting plate for insertion into the printed circuit board.

[0057] In this solution, the circuit module formed by the rectifier and inverter submodule 43 is integrated into a common high heat dissipation efficiency heat sink by the soldering layer assembled during packaging. The electrical pins are designed to be vertically plugged in. Since the heat sink can be directly transferred to the heat sink by direct soldering, the heat sink only needs to be air-cooled or liquid-cooled to quickly separate the large amount of heat from the components, thus achieving extremely high power density, excellent heat dissipation performance and extremely simple external connection method.

[0058] The innovative aspects of this solution also include the following: 1) Directly soldering two modules with different functions but close thermal relationship to the heat sink, skipping the traditional and expensive intermediate thermal interface such as "aluminum substrate" or "ceramic sheet"; 2) Using the heat sink as both a structural support and a mounting substrate; 3) The "vertical extension of pins" design directly serves the automated process of "plug-in wave soldering".

[0059] More importantly, traditionally, packaged integrated circuit modules are considered to have significantly better heat dissipation performance than discrete components. While discrete components are cheaper, they suffer from significant heat loss and heat buildup, making them prone to failure due to overheating and resulting in shorter lifespans. This solution, however, optimizes the circuit and concentrates the main heat sources on a heat sink, reducing circuit heating and improving the heat transfer coefficient between the main heat sources and the heat sink. This overcomes the problem of uncontrollable heat dissipation that often arises with low-cost component integration, ensuring both performance and heat dissipation while maintaining cost-effectiveness.

[0060] In specific implementation, the welding layer is a thermally conductive solder layer, which covers the contact surfaces of the rectifier submodule 44 and the inverter submodule 43 with the mounting plate; the welding layer includes welding pieces 411, the main material of which can be copper; the welding pieces 411 are located on the side close to the mounting plate 421 and on each side adjacent to that side, the heat sink is a finned heat sink, and the side where the bottom of the mounting plate 421 is located can be nickel plated to increase the difficulty and stability of the welding connection; the bottom of the mounting hole 4210 is provided with corrugated protrusions or several strip grooves 4211; a support step 4212 is provided around the side wall of the mounting hole, and several limiting holes are opened at the four apex corners of the support step, and spring bolts are set in the limiting holes to fix the inverter submodule 43 and the rectifier submodule 44; The mechanical structure, including the welding plate 411, corrugated protrusions / slots 4211, support steps 4212, and spring bolts, enhances the connection strength, thermal contact area, and vibration resistance. This ensures a long-term, reliable, and stable mechanical and thermal connection between the module and the heat sink 42, resisting thermal fatigue and vibration impact. In summary, the welding plate 411 expands the connection area, the corrugated protrusions / slots achieve mechanical interlocking to prevent shear force damage, and the spring bolts provide continuous clamping force to compensate for thermal expansion and contraction and prevent cracking. This multi-layered safety design of "welding-embedding-locking-pressing" completely solves the industry problem of easy aging and loosening of traditional adhesives (such as silicone grease) or single screw fixation, and significantly improves the product's lifespan and reliability in harsh environments.

[0061] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims.

Claims

1. An inverter circuit module, applied to a generator set, characterized in that, include: The operating parameter acquisition circuit is configured to acquire the speed, output voltage, and output current parameters of the generator set. A control circuit, connected to the operating parameter acquisition circuit, is configured to generate a control signal based on the operating parameters and output a control signal for adjusting the oil intake of the generator set. The control circuit includes a controller and at least one IGBT drive circuit connected thereto. A power conversion device is electrically connected to the control circuit and the generator set output terminal; wherein the power conversion device includes: a heat sink (42) having a mounting plate (421); a rectifier submodule (44) and an inverter submodule (43), which are integrated power modules pre-packaged according to their respective circuit topologies; and a thermally conductive solder layer (41) that directly fixes the back sides of the rectifier submodule (44) and the inverter submodule (43) to the same plane of the mounting plate (421). The heat sink (42), thermally conductive solder layer (41), rectifier submodule (44), and inverter submodule (43) together form an integrated structural unit; the electrical pins of the rectifier submodule (44) and inverter submodule (43) extend outward perpendicularly to the mounting plate (421) and are used to insert the integrated structural unit into the printed circuit board; the mounting plate (421) is provided with mounting holes (4210) corresponding to the rectifier submodule (44) and inverter submodule (43). The bottom of the mounting hole (4210) is provided with corrugated protrusions or several strip grooves (4211); the input end of the rectifier submodule (44) is connected to the output end of the generator set, and its output end is connected to the input end of the inverter submodule (43). The output end of the inverter submodule (43) is used to supply power to the load; it also includes a power supply circuit, which includes a power management chip U6, a switching transistor U5, and a multi-output winding transformer T; the output end of the power management chip U6 is connected to the control electrode of the switching transistor U5, and the series path of the switching transistor U5 is connected in the primary winding T1E circuit of the multi-output winding transformer; at least one secondary winding T1B of the multi-output winding transformer T is rectified and filtered to provide driving power to the IGBT drive circuit; at least another secondary winding T1A is rectified and filtered to provide operating voltage to the controller; at least one secondary winding T1D of the multi-output winding transformer T is rectified and filtered to supply power to the power management chip U6.

2. The inverter circuit module according to claim 1, characterized in that: The rectifier submodule (44) is a module in which three thyristors and three diodes are connected and packaged into one unit according to a three-phase semi-controlled rectifier bridge circuit; the inverter submodule (43) is a module in which four IGBTs and four diodes are connected and packaged into one unit according to a full-bridge inverter circuit.

3. The inverter circuit module according to claim 2, characterized in that: At least one electrolytic capacitor C3 is connected in parallel at the output of the rectifier submodule (44) for filtering.

4. The inverter circuit module according to claim 2, characterized in that: The IGBT drive circuit includes an optocoupler PC, whose input terminal is connected to the controller through a current-limiting resistor R47; and a push-pull amplifier circuit composed of an NPN transistor Q1 and a PNP transistor Q2, whose input terminal is connected to the output terminal of the optocoupler PC, and whose output terminal is connected to the gate of the corresponding IGBT in the inverter submodule through a gate resistor Rg.

5. The inverter circuit module according to claim 4, characterized in that, A bypass branch is connected in parallel across the gate resistor Rg. This bypass branch is formed by diode D22 and resistor R80 connected in series. The anode of diode D22 is connected to the output terminal of the push-pull amplifier circuit, and the cathode of diode D22 is connected to the gate of the IGBT.

6. A functional module for an integrated heat sink in an inverter, characterized in that, include: The heat sink (42) includes a mounting plate (421) and heat dissipation fins (422) disposed on one side of the mounting plate (421); a rectifier submodule (44) is a submodule in which three thyristors and three diodes are connected and packaged into one unit according to a three-phase half-controlled rectifier bridge circuit; an inverter submodule (43) is a submodule in which four IGBTs and four diodes are connected and packaged into one unit according to a full-bridge inverter circuit; a solder layer (41) fixes the back sides of the rectifier submodule (44) and the inverter submodule (43) to the same plane of the mounting plate (421); wherein, the rectifier submodule (44) and the inverter submodule (43) are The electrical pins of the rectifier submodule (44) and inverter submodule (43) extend outward perpendicularly to the mounting plate (421) for insertion into the printed circuit board; the solder layer (41) is a thermally conductive solder layer that covers the contact surfaces of the rectifier submodule (44) and inverter submodule (43) with the mounting plate (421), and the solder layer (41) includes solder tabs (411); the solder tabs (411) are located on the side close to the mounting plate (421) and on each side adjacent to that side; the mounting plate (421) is provided with mounting holes (4210) corresponding to the rectifier submodule (44) and inverter submodule (43); the bottom of the mounting holes (4210) is provided with corrugated protrusions or several strip grooves (4211).

7. The functional module of the integrated heat sink according to claim 6, characterized in that: A support step (4212) is provided around the side wall of the mounting hole (4210). A number of limiting holes are provided around the support step (4212), and spring bolts are provided in the limiting holes to fix the inverter submodule (43) and the rectifier submodule (44).

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