Active fastening type 5G communication mainboard

Abstract

The invention relates to the field of 5G communication mainboards, and particularly discloses an active fastening type 5G communication mainboard, comprising: a substrate; the mainboard main body assembly is electrically connected with the substrate; the driving fastening assembly is connected with the main board main body assembly; the driving fastening assembly comprises a stepped pressing assembly, a driving fastening assembly and a driving fastening assembly, wherein the stepped pressing assembly is connected with the mainboard main body assembly; the temperature gradient detection assembly is connected with the mainboard main body assembly; the control module is electrically connected with the stepped pressing assembly; through temperature gradient grading judgment and corresponding power adjustment, a thermal expansion gap is accurately compensated, and too tight damage or loosening failure is avoided; and in combination with phase change buffering and closed-loop correction, the operation stability of the mainboard in temperature fluctuation and vibration environments is improved, faults such as poor contact are reduced, the service life is prolonged, and then the mainboard adapts to 5G multi-scene complex working conditions.

Description

Technical Field

[0001] This invention relates to the field of 5G communication motherboards, specifically an active fastening type 5G communication motherboard. Background Technology

[0002] 5G communication technology, with its high data transmission rate, low latency, and wide connectivity, has been widely applied in base station equipment, industrial control terminals, and intelligent connected vehicles. Its core carrier, the 5G communication motherboard, needs to operate stably for extended periods in complex environments. Currently, most 5G communication motherboards are secured using passive structures, such as screws, clips, or spring clips, to connect the motherboard to the device housing or heat dissipation module, ensuring positional stability during use.

[0003] However, existing passive fastening solutions have significant limitations. On the one hand, the 5G communication motherboard generates a large amount of heat during multi-band signal processing and high-speed data computation, leading to thermal expansion differences between the motherboard substrate and the fastening components. Over time, this can cause fastening gaps, resulting in poor contact between the motherboard and surrounding components, affecting signal transmission stability. On the other hand, in vibrating environments such as outdoor base stations and vehicle-mounted equipment, passive fastening structures lack dynamic adjustment capabilities. Prolonged vibration can easily cause screw loosening and clip fatigue failure, increasing maintenance costs and potentially leading to motherboard malfunctions, affecting the continuous operation of the 5G communication system. Therefore, there is an urgent need to develop a more suitable active fastening 5G communication motherboard to address these technical problems. Summary of the Invention

[0004] The purpose of this invention is to provide an actively fastened 5G communication motherboard to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: An active fastening 5G communication motherboard includes: substrate; A motherboard main body assembly, which is electrically connected to the substrate; An active fastening assembly, which is connected to the main motherboard assembly; The active fastening assembly includes: A stepped clamping assembly, which is connected to the main board assembly, is used to provide graded adjustable power to drive the adjustment of the clamping force. A temperature gradient detection component, which is connected to the main body of the motherboard, is used to collect temperature gradient change data on the surface of the motherboard. The control module, electrically connected to the stepped clamping assembly, is used to determine the gap level between the main board assembly and the active fastening assembly based on the gradient data from the temperature gradient detection assembly, and to control the stepped clamping assembly to adjust the power transmission force according to the corresponding level, thereby achieving graded compensation of the fastening force. Compared with the prior art, the beneficial effects of the present invention are: by judging the temperature gradient and adjusting the corresponding power, the thermal expansion gap is accurately compensated, avoiding damage from excessive tightness or failure from loosening; combined with phase change buffering and closed-loop correction, the operating stability of the motherboard under temperature fluctuation and vibration environment is improved, the failure of poor contact and other faults is reduced, the service life is extended, and thus it is adapted to the complex working conditions of 5G multi-scenario. Attached Figure Description

[0006] Figure 1 This is a bottom perspective view of an active fastening 5G communication motherboard according to an embodiment of the present invention.

[0007] Figure 2 This is a top view of an active fastening 5G communication motherboard according to an embodiment of the present invention.

[0008] Figure 3 This is a schematic diagram of the stepped clamping assembly in an active fastening 5G communication motherboard according to an embodiment of the present invention.

[0009] Figure 4 This is a structural block diagram of the control module in an active fastening 5G communication motherboard according to an embodiment of the present invention.

[0010] In the diagram: 1-Baseboard, 2-Main board body assembly, 3-Active fastening assembly, 4-Stepped pressing assembly, 5-Temperature gradient detection assembly, 6-Control module, 201-Main board body, 202-Heating zone, 203-Edge zone, 204-Slot, 401-Curved frame, 402-Pressure plate, 403-Stepped drive component, 404-Phase change material, 501-Central monitoring component, 502-Non-core monitoring component, 503-Built-in monitoring component, 601-Gradient analysis unit, 602-Gap level judgment unit, 603-Graded drive control unit. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0012] An active-fastening 5G communication motherboard, in one embodiment of the present invention, such as... Figure 1 andFigure 2 As shown, it includes: a substrate 1; a main board assembly 2, which is electrically connected to the substrate 1; and an active fastening assembly 3, which is connected to the main board assembly 2. The active fastening assembly 3 includes: a stepped pressing assembly 4, which is connected to the main board assembly 2 and is used to provide graded adjustable power to drive the adjustment of the fastening force; a temperature gradient detection assembly 5, which is connected to the main board assembly 2 and is used to collect temperature gradient change data on the surface of the main board; and a control module 6, which is electrically connected to the stepped pressing assembly 4 and is used to determine the gap level between the main board assembly 2 and the active fastening assembly 3 based on the gradient data of the temperature gradient detection assembly 5, and control the stepped pressing assembly 4 to adjust the power transmission force according to the corresponding level to achieve graded compensation of the fastening force.

[0013] In one embodiment of the present invention: like Figure 1 and Figure 2 As shown, the motherboard main body assembly 2 includes: a motherboard main body 201, which is electrically connected to the substrate 1; a heat-generating area 202, which is located at the center of the top side of the motherboard main body 201; an edge area 203, which is located at the outer edge of the motherboard main body 201; and a groove 204, which is located inside the heat-generating area 202. The main board 201 is connected to the external structure via the substrate 1. The main board 201 is provided with a heating area 202 and an edge area 203. When the main board 201 is running, the temperature of the heating area 202 is higher and the temperature of the edge area 203 is lower, resulting in a temperature difference between the heating area 202 and the edge area 203. The distributed temperature gradient detection components 5 periodically detect the real-time temperature of the heating area 202 and the edge area 203, calculate the temperature gradient, and transmit it to the control module 6. The control module 6 analyzes and processes the data, combines the built-in gradient threshold and the phase change state of the phase change material 404 to determine the current thermal expansion gap level, and then outputs the corresponding level of power command to the stepped pressing component 4, transmitting the graded power command to the active fastening assembly. Component 3, the active fastening component 3, while adjusting the fastening force to compensate for the gap, transmits the actual fastening pressure data back to the control module 6 to form a closed-loop correction. During this period, the phase change material 404 absorbs the heat in the contact area of ​​the motherboard body 201 through the latent heat of phase change, buffers the thermal expansion difference of different materials, and dynamically adheres to the pressure block and the surface of the motherboard body 201. The heat absorbed by the phase change material 404 is conducted to the stepped pressing component 4, and then diffused by the stepped pressing component 4 to the external device housing (not shown in the figure) to complete the auxiliary heat dissipation. Finally, a full-process functional synergy is formed, including temperature gradient detection, gap level determination, graded dynamic compensation pressure closed-loop correction, phase change temperature control buffer and auxiliary heat dissipation, so as to realize the stable fastening and operation of the motherboard under temperature fluctuations.

[0014] In one embodiment of the present invention: like Figures 1 to 3 As shown, the stepped pressing assembly 4 includes a curved frame 401, one end of which is fixedly connected to the inside edge of the substrate 1; a stepped drive member 403, which is connected to the end of the curved frame 401 away from the inside edge of the substrate 1; the stepped drive member 403 is a graded electric telescopic frame; a pressure plate 402, which is connected to the ends of several stepped drive members 403 away from the curved frame 401; and a phase change material 404, which is connected to the bottom side of the pressure plate 402, and the phase change material 404 is arranged in a shape corresponding to the groove 204. The stepped drive component 403, in conjunction with the control module 6, outputs corresponding power commands to the stepped pressing assembly 4. Based on these power commands, the stepped drive component 403 moves the pressure plate 402 downwards a corresponding distance. The phase change material 404 at the bottom of the pressure plate 402 absorbs heat from the contact area of ​​the main board through its latent heat of phase change, buffers the thermal expansion differences between different materials, and dynamically adheres to the surface of the pressing block and the main board body 201. The heat absorbed by the phase change material 404 is then conducted to the pressure plate 402. The phase change material 404 can be an organic or inorganic phase change material; organic phase change materials are selected from paraffin wax and polyethylene glycol compounds, while inorganic phase change materials are selected from hydrated salts and molten salt compounds. Furthermore, the latent heat of phase change of the phase change material 404 is not less than 100 kJ / kg to ensure efficient heat absorption.

[0015] In one embodiment of the present invention: like Figure 1 and Figure 2 As shown, the temperature gradient detection component 5 includes: several central monitoring elements 501, which are arranged near the heating zone 202; the central monitoring elements 501 are distributed temperature sensors; several non-core monitoring elements 502, which are arranged near the edge zone; the non-core monitoring elements 502 are distributed temperature sensors; and an internal monitoring element 503, which is disposed inside the phase change material 404 and used to collect the real-time temperature of the phase change material 404 and transmit it to the control module 6; the internal monitoring element 503 is a distributed temperature sensor. After the central monitoring component 501, the non-core monitoring component 502, and the built-in monitoring component 503 synchronously monitor the temperature, they are sent to the control module 6. The control module 6 calculates the temperature difference between different areas collected by the temperature gradient detection component. The control module 6 has at least three built-in gradient thresholds, corresponding to the micro-gap, medium-gap, and large-gap levels, respectively. The stepped pressure-setting component 4 outputs a corresponding power control signal according to the gap level, controlling the power transmission force to be adjusted proportionally in stages (e.g., micro-gap corresponds to 10%-30% of rated power, medium-gap corresponds to 40%-60% of rated power, and large-gap corresponds to 70%-100% of rated power).

[0016] In one embodiment of the present invention: like Figure 4 As shown, the control module 6 includes: a gradient analysis unit 601, used to calculate the temperature difference between different regions collected by the temperature gradient detection component; a gap level judgment unit 602, used to judge the corresponding gap threshold level based on the temperature difference between different regions; and a graded drive control unit 603, used to output the corresponding power control signal based on the corresponding gap threshold level. The gap level judgment unit 602 and the graded drive control module 603 realize precise graded control of the fastening gap: the gradient analysis unit 601 first calculates the temperature difference of different areas of the motherboard. This provides basic data for gap determination; the gap level determination unit 602 has at least 3 levels of gradient thresholds built in. <5℃ corresponds to micro gap, 5℃≤ <10℃ corresponds to the middle gap, ≥10℃ corresponds to a large gap, thus defining the gap level; the graded drive control unit 603 outputs the corresponding power control signal according to the determined gap level, and the power transmission force of the stepped pressing component 4 is adjusted proportionally in stages, thereby achieving a precise match between the fastening force and the gap compensation requirements, and improving the dynamic adaptability and energy efficiency of active fastening.

[0017] In one embodiment of the present invention: the gap level determination unit is also associated with the phase change state of the phase change material 404: when the temperature gradient reaches a preset range (5℃≤ When the phase change material 404 enters the phase change stage (<10℃), the gap level judgment unit 602 upgrades the gap judgment by one level to compensate for the additional gap caused by the change in the material expansion characteristics during the phase change process.

[0018] In one embodiment of the present invention: the stepped pressing assembly 4 further includes a force feedback unit, which has a built-in pressure sensor for real-time detection of the actual fastening force of the pressure plate 402 on the main body 201 and feeding the real-time data back to the control module 6; the graded drive control unit 603 of the control module 6 performs closed-loop correction based on the force feedback data and the target fastening force corresponding to the temperature gradient to ensure that the power transmission force matches the gap compensation requirements.

[0019] The working principle of this invention is as follows: The main board body 201 is connected to the external structure through the substrate 1. The main board body 201 is provided with a heating area 202 and an edge area 203. When the main board body 201 is running, the temperature of the heating area 202 is higher and the temperature of the edge area 203 is lower, resulting in a temperature difference between the heating area 202 and the edge area 203. The distributed temperature gradient detection components 5 periodically detect the real-time temperature of the heating area 202 and the edge area 203, calculate the temperature gradient, and transmit it to the control module 6. The control module 6 analyzes and processes the data, combines the built-in gradient threshold and the phase change state of the phase change material 404 to determine the current thermal expansion gap level, and then outputs the corresponding level of power command to the stepped pressing component 4, transmitting the graded power command to... The active fastening component 3 adjusts the fastening force to compensate for the gap while transmitting the actual fastening pressure data back to the control module 6 to form a closed-loop correction. During this process, the phase change material 404 absorbs heat from the contact area of ​​the motherboard body 201 through the latent heat of phase change, buffers the thermal expansion differences of different materials, and dynamically adheres to the pressure block and the surface of the motherboard body 201. The heat absorbed by the phase change material 404 is conducted to the stepped pressing component 4, and then diffused to the external device housing (not shown in the figure) to complete auxiliary heat dissipation. Finally, a full-process functional synergy is formed, including temperature gradient detection, gap level determination, graded dynamic compensation pressure closed-loop correction, phase change temperature control buffering, and auxiliary heat dissipation, to achieve stable fastening and operation of the motherboard under temperature fluctuations. The stepped drive component 403, in conjunction with the control module 6, outputs corresponding power commands to the stepped pressing assembly 4. Based on these power commands, the stepped drive component 403 moves the pressure plate 402 downwards a corresponding distance. The phase change material 404 at the bottom of the pressure plate 402 absorbs heat from the contact area of ​​the main board through its latent heat of phase change, buffers the thermal expansion differences between different materials, and dynamically adheres to the surface of the pressing block and the main board body 201. The heat absorbed by the phase change material 404 is then conducted to the pressure plate 402. The phase change material 404 can be an organic or inorganic phase change material; organic phase change materials are selected from paraffin wax and polyethylene glycol compounds, while inorganic phase change materials are selected from hydrated salts and molten salt compounds. Furthermore, the latent heat of phase change of the phase change material 404 is not less than 100 kJ / kg to ensure efficient heat absorption.

[0020] When the central monitoring component 501, non-core monitoring component 502, and built-in monitoring component 503 simultaneously monitor the temperature, the data is sent to the control module 6. The control module 6 calculates the temperature difference between different areas collected by the temperature gradient detection component. The control module 6 has at least three built-in gradient thresholds, corresponding to micro-gap, medium-gap, and large-gap levels, respectively. The stepped pressing component 4 outputs a corresponding power control signal according to the gap level, controlling the power transmission force to be adjusted proportionally in stages (e.g., micro-gap corresponds to 10%-30% of rated power, medium-gap corresponds to 40%-60% of rated power, and large-gap corresponds to 70%-100% of rated power). The gap level judgment unit 602 and the graded drive control module 603 achieve precise graded control of the fastening gap: the gradient analysis unit 601 first calculates the temperature difference between different areas of the motherboard collected. This provides basic data for gap determination; the gap level determination unit 602 has at least 3 levels of gradient thresholds built in. <5℃ corresponds to micro gap, 5℃≤ <10℃ corresponds to the middle gap, ≥10℃ corresponds to a large gap, thus defining the gap level; the graded drive control unit 603 outputs the corresponding power control signal according to the determined gap level, and the power transmission force of the stepped pressing component 4 is adjusted proportionally in stages, thereby achieving a precise match between the fastening force and the gap compensation requirements, and improving the dynamic adaptability and energy efficiency of active fastening.

[0021] In summary, by judging temperature gradient and adjusting the corresponding power, the thermal expansion gap is accurately compensated to avoid damage from excessive tightness or failure from loosening. Combined with phase change buffering and closed-loop correction, the motherboard's operational stability under temperature fluctuations and vibration environments is improved, reducing faults such as poor contact and extending service life, thus adapting to the complex working conditions of 5G in multiple scenarios.

[0022] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An active fastening 5G communication motherboard, characterized in that, include: substrate; A motherboard main body assembly, which is electrically connected to the substrate; An active fastening assembly, which is connected to the main motherboard assembly; The active fastening assembly includes: A stepped clamping assembly, which is connected to the main board assembly, is used to provide graded adjustable power to drive the adjustment of the clamping force. A temperature gradient detection component, which is connected to the main body of the motherboard, is used to collect temperature gradient change data on the surface of the motherboard. The control module is electrically connected to the stepped clamping assembly. It is used to determine the gap level between the main board body assembly and the active fastening assembly based on the gradient data of the temperature gradient detection assembly, and to control the stepped clamping assembly to adjust the power transmission force according to the corresponding level, so as to realize the graded compensation of the fastening force.

2. The active fastening 5G communication motherboard according to claim 1, characterized in that, The main components of the motherboard include: The motherboard body is electrically connected to the substrate; A heat-generating area is located at the center of the top side of the motherboard body; An edge region, wherein the edge region is located at the outer edge of the motherboard body; The tank is located inside the heating zone.

3. The active fastening 5G communication motherboard according to claim 1, characterized in that, The stepped pressing assembly includes: A curved frame, one end of which is inserted and fixedly connected to the inside edge of the substrate; A stepped drive component, wherein the stepped drive component is connected to one end of the curved frame that is away from the interior of the substrate edge; A pressure plate, wherein the pressure plate is connected to one end of a plurality of stepped drive components away from the curved frame; A phase change material is connected to the bottom side of the pressure plate, and the phase change material is configured in a shape corresponding to the tank.

4. The active fastening 5G communication motherboard according to claim 3, characterized in that, The temperature gradient detection component includes: Several central monitoring units are placed near the heat-generating area; Several non-core monitoring components are placed near the edge area; An internal monitoring device is installed inside the phase change material to collect the real-time temperature of the phase change material and transmit it to the control module.

5. The active fastening 5G communication motherboard according to claim 4, characterized in that, As shown in the figure, the control module includes: The gradient analysis unit is used to calculate the temperature difference between different areas collected by the temperature gradient detection component. The gap level determination unit is used to determine the corresponding gap threshold level based on the temperature difference between different areas; The graded drive control unit is used to output corresponding power control signals based on the corresponding gap threshold level.

6. The active fastening 5G communication motherboard according to claim 5, characterized in that, The gap level judgment unit is also associated with the phase change state of the phase change material: when the temperature gradient is reached and the phase change material enters the phase change stage, the gap level judgment unit upgrades the gap judgment by one level to compensate for the additional gap caused by the change in the material expansion characteristics during the phase change process.

7. The active fastening 5G communication motherboard according to claim 3, characterized in that, The stepped pressing assembly also includes a force feedback unit, which has a built-in pressure sensor to detect the actual clamping force of the pressing plate on the main body in real time and feed the real-time data back to the control module. The graded drive control unit of the control module performs closed-loop correction based on the force feedback data and the target clamping force corresponding to the temperature gradient to ensure that the power transmission force matches the gap compensation requirements.

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