Silicon wafer diamond wire test platform and test method

Abstract

The invention belongs to the technical field of diamond wire production, and particularly relates to diamond wire testing. The invention provides a silicon wafer diamond wire test platform which comprises a base, a side plate and a supporting table, the side plate and the supporting table are arranged on the base, and the supporting table and the side plate are oppositely arranged to clamp a silicon rod; the left stand column and the right stand column are fixed to the base and symmetrically distributed along the center line of the supporting table; the driving assembly comprises an electric cylinder, the electric cylinder is fixed to the left stand column, and a first sliding block is arranged at the output end of the electric cylinder; the pair of fixed pulleys are arranged on the side plates; the tension maintaining piece is arranged on the right stand column in a sliding mode; the fixed end of the diamond wire is connected with the right stand column, and the movable end of the diamond wire is connected with the first sliding block and abuts against the silicon rod after winding around the tension maintaining piece and the fixed pulley. By arranging the electric cylinder, the diamond wire of a single wire is made to move repeatedly, cutting is achieved, by arranging the movable pulley, the gravity of the movable pulley is utilized in the cutting process, a complex active tensioning mechanism is omitted, the tension in the testing process is made to be continuous and constant, and the accuracy and repeatability of testing data are remarkably improved.

Description

Technical Field

[0001] This invention belongs to the field of diamond wire production technology, specifically relating to diamond wire testing, and more particularly to a silicon wafer diamond wire testing platform. Background Technology

[0002] In the field of photovoltaic and semiconductor material processing, diamond wire is widely used due to its high-efficiency cutting performance. Key indicators of diamond wire, such as fatigue resistance and wear resistance, directly determine cutting quality and cost. Therefore, accurate and efficient performance testing is crucial before it is put into practical use.

[0003] Currently, standard diamond wire testing platforms in the industry typically employ a simulated cutting method using a closed-loop ring of diamond wire. In this platform, a diamond wire, with its ends connected, is mounted on multiple guide wheels and driven by a main drive wheel to perform high-speed unidirectional cyclic motion, simulating continuous wear during actual cutting. Fatigue fracture of diamond wire is a gradual process, requiring long-term continuous testing to obtain effective performance data.

[0004] Due to the lengthy testing cycle, it is impossible to quickly assess the quality of diamond wire or rapidly verify process parameters. During prolonged testing, the diamond wire undergoes irreversible plastic elongation due to continuous wear and stretching, leading to gradual relaxation. This relaxation directly causes a decrease in tension, which is a key variable affecting the wear mode and fatigue life of diamond wire. To ensure consistent testing conditions, operators must frequently stop the machine and manually adjust the tension wheel to restore the initial tension. This manual intervention not only disrupts the continuity of the test but also introduces human error, significantly reducing the accuracy and repeatability of the test results and failing to truly reflect the long-term performance of the diamond wire under stable tension.

[0005] Therefore, how to prevent diamond wire from loosening under long-term testing is a technical problem that urgently needs to be solved in this field.

[0006] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0007] This disclosure provides at least one silicon wafer diamond wire testing platform to address the technical problem of diamond wire relaxation under long-term testing.

[0008] In a first aspect, embodiments of this disclosure provide a silicon wafer diamond wire testing platform, comprising: a base and a side plate and a support platform disposed thereon, the support platform and the side plate being disposed opposite each other to clamp a silicon rod; a left column and a right column fixed to the base and symmetrically distributed along the center line of the support platform; a driving assembly comprising: an electric cylinder fixed to the left column, the output end of the electric cylinder being provided with a first slider; a pair of fixed pulleys disposed on the side plate; a tension maintaining member slidably disposed on the right column; and a diamond wire, the fixed end of which is connected to the right column, the movable end of which is connected to the first slider, and after passing through the tension maintaining member and the fixed pulleys, abutting against the silicon rod; wherein, the electric cylinder drives the first slider and the diamond wire to reciprocate to grind the silicon rod; simultaneously, the tension maintaining member reciprocates along the right column in response to the tension of the diamond wire to maintain tension.

[0009] In one optional embodiment, a vertical second slide rail is provided on the right column; the tension maintaining member includes a second slider that slides with the second slide rail, and a movable pulley is provided on the second slider; wherein, the diamond wire is wound on the movable pulley, and the weight of the second slider and the movable pulley provides tension to the diamond wire.

[0010] In one alternative embodiment, the tension maintaining member includes a plurality of movable pulleys and a second slider, wherein each movable pulley has a different weight and / or each second slider has a different mass.

[0011] In one alternative embodiment, a first slide rail is provided on the left column, and the first slider is adapted to move along the first slide rail.

[0012] In one optional implementation, both the first slide rail and the second slide rail are double-rail structures.

[0013] In one optional embodiment, the side plate is provided with a plurality of strip-shaped mounting holes, and the fixed pulley is connected to the strip-shaped mounting holes.

[0014] In one optional embodiment, a pair of clamping blocks are provided on the support platform, and the clamping blocks abut against the side of the silicon rod; both the clamping blocks and the support platform are provided with a plurality of through holes to discharge silicon rod debris.

[0015] Secondly, this disclosure also provides a testing method using the silicon wafer diamond wire testing platform described above, comprising the following steps: S1: Sample clamping: Fixing the silicon rod on the support platform and adjusting its position to contact the test section of the diamond wire; S2: Setting parameters: Setting the reciprocating frequency, stroke, and total test time or number of cycles of the electric cylinder; S3: Starting the test: Starting the electric cylinder to drive the diamond wire to perform a high-speed reciprocating sawing motion, simulating the cutting and grinding of the silicon rod; S4: Dynamic tensioning: During the test, the movable pulley of the tension maintaining component automatically slides under the action of gravity, compensating for the elongation of the diamond wire in real time and maintaining constant tension; S5: Result evaluation: After the test, the performance of the diamond wire is evaluated by measuring the wear state of the diamond wire, the amount of silicon rod cut, or the total number of cycles until the diamond wire breaks.

[0016] In one alternative implementation, in step S2, different cutting conditions are simulated by adjusting the reciprocating frequency and stroke of the electric cylinder.

[0017] In one optional implementation, in step S5, the wear morphology of the diamond wire surface after testing is observed and recorded using a high-precision microscope or profilometer.

[0018] The beneficial effects of this invention are that it provides a silicon wafer diamond wire testing platform, which uses an electric cylinder to repeatedly move a single diamond wire to achieve cutting. By using a movable pulley, the diamond wire utilizes its own gravity during the cutting process to achieve dynamic, passive, constant force control of the diamond wire tension. This eliminates the need for a complex active tensioning mechanism, resulting in a simple overall structure and low cost. It ensures continuous and constant tension during testing, avoiding tension attenuation caused by diamond wire elongation. No manual intervention is required, significantly improving the accuracy and repeatability of test data.

[0019] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0020] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 An unfolded perspective view of the silicon wafer diamond wire testing platform provided in an embodiment of this disclosure; Figure 2 This is a schematic diagram of the movement of the diamond wire when the movable pulley moves in the F1 direction, as provided in an embodiment of this disclosure. Figure 3 This is a schematic diagram showing the movement of the diamond wire when the movable pulley moves in the F2 direction, as provided in an embodiment of this disclosure.

[0023] In the picture: 1. Base; 2. Side plate; 3. Right column; 31. Second slide rail; 4. Left column; 5. Drive assembly; 51. Electric cylinder; 52. Fixed pulley; 53. First slider; 54. First slide rail; 55. Tension maintaining component; 551. Moving pulley; 552. Second slider; 7. Support platform; 8. Silicon rod; 6. Diamond wire; 61. Fixed end; 62. Moving end. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0026] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0027] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0028] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0029] Research has revealed the following drawbacks of existing technologies: Standard diamond wire testing platforms in the industry typically employ a simulated cutting method using a closed-loop ring of diamond wire. In this platform, a diamond wire, with its ends connected, is mounted on multiple guide wheels and driven by a main drive wheel to perform high-speed unidirectional cyclic motion, simulating continuous wear during actual cutting. Fatigue fracture of the diamond wire is a gradual process, requiring prolonged continuous testing to obtain effective performance data.

[0030] Due to the lengthy testing cycle, it is impossible to quickly assess the quality of diamond wire or rapidly verify process parameters. During prolonged testing, the diamond wire undergoes irreversible plastic elongation due to continuous wear and stretching, leading to gradual relaxation. This relaxation directly causes a decrease in tension, which is a key variable affecting the wear mode and fatigue life of diamond wire. To ensure consistent testing conditions, operators must frequently stop the machine and manually adjust the tension wheel to restore the initial tension. This manual intervention not only disrupts the continuity of the test but also introduces human error, significantly reducing the accuracy and repeatability of the test results and failing to truly reflect the long-term performance of the diamond wire under stable tension.

[0031] Therefore, how to prevent diamond wire from loosening under long-term testing is a technical problem that urgently needs to be solved in this field.

[0032] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0034] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0035] like Figures 1 to 3 As shown, some embodiments provide a silicon wafer diamond wire testing platform, including: a base 1 and a side plate 2 and a support 7 disposed thereon, the support 7 and the side plate 2 being arranged opposite to each other to clamp silicon rods 8; the base 1 serves as the basic support structure of the entire testing platform, and has sufficient rigidity and stability, which can effectively reduce the vibration caused by high-frequency reciprocating motion during the testing process, and provide a stable foundation for the test.

[0036] The side plate 2 and the support platform 7 are arranged opposite to each other to form a clamping space for the silicon rod 8. This relative arrangement ensures that the silicon rod 8 maintains a stable position during the test and prevents test errors caused by displacement.

[0037] A pair of clamping blocks are provided on the support platform 7, which abut against the side of the silicon rod 8. Both the clamping blocks and the support platform 7 are provided with several through holes. This design not only enhances the stability of clamping, but also allows the silicon rod 8 debris generated during the cutting process to be discharged in time, preventing the accumulation of debris from affecting the test accuracy.

[0038] The left column 4 and right column 3 are fixed to the base 1 and symmetrically distributed along the center line of the support platform 7. The symmetrical distribution of the left column 4 and right column 3 along the center line of the support platform 7 ensures the balanced transmission of force during the test and avoids uneven wear caused by asymmetrical distribution. The symmetrical structural design makes the diamond wire 6 uniformly stressed during reciprocating motion, improving the reliability and repeatability of the test results. The left column 4 is equipped with a first slide rail 54, and the right column 3 is equipped with a vertical second slide rail 31. The double-track structure design further enhances the stability of the system and ensures the accuracy of the diamond wire 6's movement trajectory. Specifically, the left column 4 is equipped with a first slide rail 54, and the first slider 53 is adapted to move along the first slide rail 54. Both the first slide rail 54 and the second slide rail 31 are double-track structures.

[0039] The drive assembly 5 includes: an electric cylinder 51 fixed to the left column 4, with a first slider 53 at the output end of the electric cylinder 51; a pair of fixed pulleys 52 disposed on the side plate 2; a tension maintaining member 55 slidably disposed on the right column 3; and a diamond wire 6, with its fixed end 61 connected to the right column 3 and its movable end 62 connected to the first slider 53, and passing through the tension maintaining member 55 and the fixed pulleys 52 before abutting against the silicon rod 8; wherein the electric cylinder 51 drives the first slider 53 and the diamond wire 6 to reciprocate to grind the silicon rod 8; and the tension maintaining member 55 reciprocates along the right column 3 in response to the tension of the diamond wire 6 to maintain tension.

[0040] The drive assembly 5 is the core power component of the test platform. The electric cylinder 51 is fixed on the left column 4, and the output end of the electric cylinder 51 is equipped with a first slider 53. As a precision transmission device, the electric cylinder 51 can provide stable reciprocating motion. The first slider 53 connected to its output end moves along the first slide rail 54, ensuring high precision and repeatability of the motion.

[0041] A pair of fixed pulleys 52 are mounted on the side plate 2. The side plate 2 has several strip-shaped mounting holes, and the fixed pulleys 52 are connected to the strip-shaped mounting holes. This design allows the position of the fixed pulleys 52 to be adjusted according to the test requirements to accommodate test samples of different sizes. Specifically, the side plate 2 has several strip-shaped mounting holes, and the fixed pulleys 52 are connected to the strip-shaped mounting holes.

[0042] The tension holding component 55 is a key innovation of this test platform. It is slidably mounted on the right column 3 and includes a second slider 552 that slides in cooperation with the second slide rail 31. A movable pulley 551 is provided on the second slider 552.

[0043] The diamond wire 6 is wound on the movable pulley 551, and the second slider 552 and the weight of the movable pulley 551 provide a continuous and stable tension for the diamond wire 6. This automatic tensioning mechanism based on the principle of gravity can compensate for the plastic elongation of the diamond wire 6 caused by stretching during the test in real time, maintain constant tension, and avoid data distortion caused by tension decay in traditional tests.

[0044] The tension maintaining component 55 includes several movable pulleys 551 and second sliders 552. Each movable pulley 551 has a different weight and / or each second slider 552 has a different mass. This modular design allows users to configure different mass combinations according to test needs, achieving precise control of tension and meeting the testing requirements of diamond wires of different specifications. Specifically, a vertical second slide rail 31 is provided on the right column 3. The tension maintaining component 55 includes a second slider 552 that slides in cooperation with the second slide rail 31, and a movable pulley 551 is provided on the second slider 552. The diamond wire 6 is wound around the movable pulley 551, and the weight of the second slider 552 and the movable pulley 551 provides tension to the diamond wire 6.

[0045] Specifically, the tension maintaining member 55 includes a plurality of movable pulleys 551 and second sliders 552, each movable pulley 551 having a different weight and / or each second slider 552 having a different mass.

[0046] A pair of clamping blocks are provided on the support platform 7, and the clamping blocks abut against the side of the silicon rod 8; both the clamping blocks and the support platform 7 are provided with several through holes to discharge the silicon rod 8 debris.

[0047] The fixed end 61 of the diamond wire 6 is connected to the right column 3, and the moving end 62 is connected to the first slider 53. After passing through the tension maintaining member 55 and the fixed pulley 52, it abuts against the silicon rod 8. This unique path design enables the diamond wire 6 to form a multi-point contact sawing motion mode during the test, which more realistically simulates the actual cutting conditions. The electric cylinder 51 drives the first slider 53 and the diamond wire 6 to reciprocate to grind the silicon rod 8. At the same time, the tension maintaining member 55 responds to the tension change of the diamond wire 6 and reciprocates along the right column 3 to maintain the tension, thus achieving dynamic balance in the test process.

[0048] Some embodiments provide a testing method using the silicon wafer diamond wire testing platform as described above, including the following steps: S1: Sample clamping: Fix the silicon rod 8 on the support 7 and adjust its position to contact the test section of the diamond wire 6; S2: Parameter setting: Set the reciprocating frequency, stroke, and total test time or number of cycles of the electric cylinder 51; S3: Start the test: Start the electric cylinder 51 to drive the diamond wire 6 to perform a high-speed reciprocating sawing motion, simulating the cutting and grinding of the silicon rod 8; S4: Dynamic tensioning: During the test, the movable pulley 551 of the tension maintaining member 55 automatically slides under the action of gravity, compensating for the elongation of the diamond wire 6 in real time and maintaining constant tension; S5: Result evaluation: After the test, evaluate the performance of the diamond wire 6 by measuring the wear state of the diamond wire 6, the cutting amount of the silicon rod 8, or the total number of cycles until the diamond wire 6 breaks.

[0049] It should be further explained that in step S2, different cutting conditions are simulated by adjusting the reciprocating frequency and stroke of the electric cylinder 51; in step S5, the wear morphology of the diamond wire 6 after testing is observed and recorded by a high-precision microscope or profilometer.

[0050] Overall workflow: Step S1: Sample clamping process; The silicon rod 8 is fixed on the support 7, and the clamping block ensures that the silicon rod 8 is firmly clamped. Its position is adjusted so that it contacts the test section of the diamond wire 6. The key to this step is to ensure that the contact position between the silicon rod 8 and the diamond wire 6 is accurate, so as to provide reliable contact conditions for subsequent tests. The through-hole design on the support 7 and the clamping block can discharge cutting debris in time and prevent debris accumulation from affecting the test accuracy. Step S2: Parameter setting process; Set the reciprocating frequency, stroke, and total test time or number of cycles of the electric cylinder 51; by precisely controlling these parameters, different cutting conditions can be simulated, such as high-speed cutting, fine cutting, and other different scenarios; the flexibility of parameter settings enables the test platform to adapt to various testing needs, improving the applicability of the equipment and the pertinence of the test. Step S3: Test execution process; The electric cylinder 51 is activated to drive the diamond wire 6 to perform a high-speed reciprocating sawing motion, simulating the cutting and grinding of the silicon rod 8. During this process, the diamond wire 6 continuously grinds the silicon rod 8 in a high-speed reciprocating motion, realistically reproducing the wear mechanism in the actual cutting process. The thermal effect and mechanical stress generated by the high-speed reciprocating motion are highly consistent with the actual situation, ensuring the authenticity of the test results. Step S4: Dynamic tensioning process; During the test, the movable pulley 551 of the tension maintaining component 55 slides automatically under the action of gravity, compensating for the elongation of the diamond wire 6 in real time and maintaining constant tension. This automatic compensation mechanism ensures the stability of tension throughout the test, eliminates test errors caused by material relaxation, and guarantees the reliability and accuracy of the data. Step S5: Result Evaluation Process; After the test, the surface wear morphology of the diamond wire 6 was observed and recorded using a high-precision microscope or profilometer to evaluate the performance of the diamond wire 6. The scientific evaluation method provides reliable data support for the quality control and process optimization of diamond wire.

[0051] In summary, this invention achieves automatic and stable tension control during testing by incorporating a gravity-adaptive tension maintaining element 55, resulting in a continuous and uninterrupted testing environment. This improves the accuracy and repeatability of test data and reduces errors introduced by human intervention. Furthermore, the symmetrical structural design and precise drive control system ensure high consistency of test conditions, leading to reliable performance evaluation results and improved testing efficiency. Finally, the modular design of the movable pulley 551 and mass block allows for flexible adjustment of test parameters, meeting the testing requirements of diamond wires of different specifications and enhancing the applicability of the equipment.

[0052] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0053] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0054] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon wafer diamond wire testing platform, characterized in that, include: The base (1) and the side plate (2) and the support platform (7) are arranged opposite to each other to clamp the silicon rod (8); The left column (4) and right column (3) are fixed on the base (1) and symmetrically distributed along the center line of the support (7); The driver component (5) includes: An electric cylinder (51) is fixed on the left column (4), and the output end of the electric cylinder (51) is provided with a first slider (53). A pair of fixed pulleys (52) are mounted on the side plate (2); Tension maintaining element (55) is slidably mounted on the right column (3); In addition, the diamond wire (6), its fixed end (61) is connected to the right column (3), its movable end (62) is connected to the first slider (53), and after passing through the tension maintaining member (55) and the fixed pulley (52), it abuts against the silicon rod (8); The electric cylinder (51) drives the first slider (53) and the diamond wire (6) to reciprocate to grind the silicon rod (8); at the same time, the tension maintaining member (55) responds to the tension of the diamond wire (6) and reciprocates along the right column (3) to maintain the tension.

2. The silicon wafer diamond wire testing platform as described in claim 1, characterized in that, A vertical second slide rail (31) is provided on the right column (3); The tension maintaining member (55) includes: A second slider (552) is slidably engaged with the second slide rail (31), and a movable pulley (551) is provided on the second slider (552); The diamond wire (6) is wound around the movable pulley (551), and the weight of the second slider (552) and the movable pulley (551) provides tension to the diamond wire (6).

3. The silicon wafer diamond wire testing platform as described in claim 2, characterized in that, The tension maintaining member (55) includes a plurality of movable pulleys (551) and second sliders (552), each movable pulley (551) having a different weight and / or each second slider (552) having a different mass.

4. The silicon wafer diamond wire testing platform as described in claim 2, characterized in that, The left column (4) is provided with a first slide rail (54), and the first slider (53) is adapted to move along the first slide rail (54).

5. The silicon wafer diamond wire testing platform as described in claim 4, characterized in that, Both the first slide rail (54) and the second slide rail (31) are double-rail structures.

6. The silicon wafer diamond wire testing platform as described in claim 1, characterized in that, The side plate (2) is provided with several strip-shaped mounting holes, and the fixed pulley (52) is connected to the strip-shaped mounting holes.

7. The silicon wafer diamond wire testing platform as described in claim 1, characterized in that, A pair of clamping blocks are provided on the support platform (7), and the clamping blocks abut against the side of the silicon rod (8); Both the clamping block and the support platform (7) are provided with several through holes to discharge silicon rod (8) debris.

8. A testing method using the silicon wafer diamond wire testing platform as described in any one of claims 1 to 7, characterized in that, Includes the following steps: S1: Sample clamping: Fix the silicon rod (8) on the support (7) and adjust its position so that it contacts the test section of the diamond wire (6); S2. Setting parameters: Set the reciprocating frequency, stroke, and total test time or number of cycles of the electric cylinder (51); S3. Start-up test: Start the electric cylinder (51) to drive the diamond wire (6) to perform a high-speed reciprocating sawing motion to simulate the cutting and grinding of the silicon rod (8); S4. Dynamic tension: During the test, the movable pulley (551) of the tension maintaining component (55) slides automatically under the action of gravity, which compensates for the elongation of the diamond wire (6) in real time and maintains constant tension. S5. Result evaluation: After the test, the performance of the diamond wire (6) is evaluated by measuring the wear state of the diamond wire (6), the cutting amount of the silicon rod (8), or the total number of cycles until the diamond wire (6) breaks.

9. The test method as described in claim 8, characterized in that, In step S2, different cutting conditions are simulated by adjusting the reciprocating frequency and stroke of the electric cylinder (51).

10. The test method as described in claim 8, characterized in that, In step S5, the wear morphology of the diamond wire (6) surface after testing is observed and recorded using a high-precision microscope or profilometer.

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