High-precision pulse heating device and method

Abstract

The invention discloses a high-precision pulse heating device and method, and relates to the technical field of pulse heating devices.The high-precision pulse heating device comprises a supporting assembly, a heating assembly is arranged at the top of the supporting assembly, an external assembly is installed on the surface of the lower end of the supporting assembly, and an adsorption assembly is arranged between the supporting assembly and the heating assembly; firstly, a core heating sheet of the pulse heating device adopts an aluminum nitride material and an internal unique heating circuit design, and the aluminum nitride material has the advantages of good heat-conducting property, small thermal expansion coefficient and the like; the unique heating circuit layout design ensures high temperature rising speed and uniform temperature distribution of the heating sheet surface; on the basis, the surface of the heating sheet is subjected to gridding refining test and calibration, so that the surface temperature uniformity datamation of the heating sheet is formed, the placement positions of to-be-heated objects with different sizes are accurately matched, and the local temperature uniformity index is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pulse heating device, in particular to a high-precision pulse heating device and method. BACKGROUND

[0002] At present, the eutectic packaging process of the chip is mostly using pulse heating device, but the existing pulse heating device is not suitable for high-precision heating scene, and the problems and shortcomings are as follows: 1. After pulse heating, the surface temperature distribution of the heating table is uneven, and the maximum surface temperature difference reaches 6% of the nominal temperature (i.e. the temperature is heated to 450℃, and the maximum surface temperature difference is 27℃), which seriously affects the heating quality; 2. The compressed gas is basically used to cool the heating sheet by blowing, and the compressed air repeatedly acts on the heating sheet during repeated heating process, which affects the service life of the heating sheet; 3. The gas exhaust way for cooling is unreasonable, and the heated gas is directly discharged at both sides of the heating table body without using special devices (such as air pipes) to actively control the discharge, which not only destroys the air atmosphere of the heating table and the surrounding environment, but also produces large exhaust noise; 4. There is no independent protection gas (commonly used nitrogen, helium, etc., and nitrogen is taken as a representative in this paper) supply and control gas path structure, which is easy to cause the oxidation damage of the chip in the chip high-temperature eutectic process scene needing nitrogen protection; there is no closed cover protection device, and there is no safety isolation for the high-temperature (up to 500℃) body of the heating device, which is easy to cause scalding injury to the operator. SUMMARY

[0003] In order to solve the defects of the prior art, the present application provides a high-precision pulse heating device and method.

[0004] In order to solve the above technical problems, the present application provides the following technical scheme: The present application provides a high-precision pulse heating device, which comprises: A support assembly is provided on the top of the support assembly, an external assembly is mounted on the surface of the lower end of the support assembly, an adsorption assembly is arranged at the middle position of the support assembly and the heating assembly, a heating sheet cooling assembly is arranged at the middle position of the opposite side of the support assembly and the heating assembly, a base cooling assembly is arranged at the periphery of the upper surface of the base, and a nitrogen protection assembly is arranged on the inner side of the base cooling assembly. The support assembly comprises a base, a connecting frame is fixedly installed on the upper surface of the base by screws, and a heating sheet support seat is fixedly installed on the middle position of the upper surface of the base by screws.

[0005] As a preferred technical scheme of the present application, the heating assembly comprises an aluminum nitride heating sheet, a thermocouple is embedded in the middle position of the right end face of the aluminum nitride heating sheet, and a fixed pressing block is fixedly connected to each of the four corners of the upper surface of the aluminum nitride heating sheet, the surface of each fixed pressing block is clamped with a fixed pressing plate, and the upper surfaces at both ends of the fixed pressing plate are threadedly connected to the upper end face of the connecting frame through screws.

[0006] As a preferred technical scheme of the present application, the external connecting assembly comprises an eutectic platform protective cover, the two side faces of the lower end of the eutectic platform protective cover are threadedly connected to the two end faces of the lower end of the base through screws, and the right side face of the eutectic platform protective cover is threadedly connected with a sealing plate through a screw.

[0007] As a preferred technical scheme of the present application, the adsorption assembly comprises a vacuum suction hole, the vacuum suction hole is arranged in the middle position of the upper surface of the aluminum nitride heating sheet, the middle position of the upper surface of the base and the heating sheet support seat is provided with a vacuum adsorption gas channel, the lower end of the vacuum adsorption gas channel penetrates the back face of the base, and the inner cavity of the lower end of the vacuum adsorption gas channel is connected with a suction connector one.

[0008] As a preferred technical scheme of the present application, the heating sheet cooling assembly comprises a heating sheet gas channel one, the heating sheet gas channel one is arranged in the outer ring groove in the middle position of the upper surface of the base, the lower end of the heating sheet gas channel one penetrates the front face of the base, a plurality of heating sheet air inlet holes are arranged in the outer groove of the top of the heating sheet support seat, and the inner cavity of the front end of the heating sheet gas channel one is connected with an air inlet component.

[0009] As a preferred technical scheme of the present application, a heating sheet gas channel two is arranged in the inner ring groove in the middle position of the upper surface of the base, the front end of the heating sheet gas channel two penetrates the front face of the base, a plurality of heating sheet heat dissipation holes are arranged in the inner groove bottom face of the top of the heating sheet support seat, and the inner cavity of the front end of the heating sheet gas channel two is connected with an air exhaust component.

[0010] As a preferred technical scheme of the present application, the base cooling assembly comprises a base cooling gas channel, the base cooling gas channel is arranged at the periphery of the upper surface of the base, the front end of the base cooling gas channel penetrates the front face of the left end of the base, the rear end of the base cooling gas channel penetrates the back face of the right end of the base, the inner cavity of the front end of the base cooling gas channel is connected with an air inlet connector, and the inner cavity of the rear end of the base cooling gas channel is connected with an air outlet connector.

[0011] As a preferred technical scheme of the present application, the nitrogen protection assembly comprises a nitrogen protection gas channel, the nitrogen protection gas channel is arranged on the upper surface of the base, the front end of the nitrogen protection gas channel penetrates the upper right corner of the front face of the base, the rear end of the nitrogen protection gas channel penetrates the upper left corner of the back face of the base, and the inner cavities of the front end and the rear end of the nitrogen protection gas channel are connected with one gas channel connector.

[0012] A heating method comprising the following steps: S1, turn on the vacuum adsorption assembly in the pulse heating device, and at the same time, place the target substrate on the upper surface of the aluminum nitride heating sheet and adsorb and fix it; then place the target chip, align and place it and press it to hold; S2, start the nitrogen protection assembly and the base cooling assembly at the same time, respectively used for establishing a nitrogen atmosphere environment and high temperature isolation; S3, the aluminum nitride heating sheet is powered on to rise in temperature; the whole temperature rising process is monitored through the embedded thermocouple; S4, stop rising in temperature and keep the set temperature for a certain period of time after the temperature reaches the set value; S5, start the heating sheet cooling assembly to quickly cool the aluminum nitride heating sheet, and the whole cooling process is monitored through the embedded thermocouple; S6, after the cooling is completed, the target chip is taken away, and the cooling gas circuit is closed. Thus, one working cycle is completed, and the next cycle is started.

[0013] The beneficial effects of the present application are: 1. The high-precision pulse heating device, firstly, the core heating sheet of the pulse heating device adopts aluminum nitride material and a unique heating line design inside, the aluminum nitride material has the advantages of good heat conduction performance, small thermal expansion coefficient and the like; the unique heating line layout design ensures that the heating sheet surface temperature distribution is uniform while ensuring that the temperature rising speed is fast; on this basis, the heating sheet surface is tested and calibrated in a grid refinement manner to form data of the heating sheet surface temperature uniformity, so as to accurately match the placement position of different sizes of objects to be heated, and further improve the local temperature uniformity index; the center area of the heating sheet surface can be customized and processed into through holes with different diameters and different numbers, the through holes are connected with the vacuum air circuit inside the pulse heating device, and play a role in adsorbing and fixing the product to be heated; the heating sheet can be customized and processed into counterbores with different numbers and diameters, which is convenient for temperature testing of the device by using a needle thermocouple.

[0014] 2. The high-precision pulse heating device, through the heating sheet support seat, the surface of the heating sheet support seat has a unique gas circuit cavity structure, which not only ensures that the heating sheet has enough support area, but also fully increases the contact area between the heat dissipation gas and the heating sheet, so as to achieve good heat dissipation effect.

[0015] 3. The high-precision pulse heating device, through the heating sheet cooling assembly, firstly, the cooling gas flow of the heating sheet is realized by using the air extraction mode, which can realize the effect of rapid cooling and reduce the expansion pressure applied to the heating sheet; then the cooling gas is discharged through an independent gas circuit, which will not damage the atmosphere (air composition and temperature) environment inside the pulse heating device and the atmosphere (air composition and temperature) environment of the core area of the equipment.

[0016] 4. The high-precision pulse heating device, by independent from the heating piece support seat, connecting frame, base, eutectic platform shield, sealing plate and other components of the nitrogen cavity type circuit structure, when starting the drive structure will be transmitted to the nitrogen protection gas path inside through two gas path joints, the nitrogen protection gas path transmits nitrogen to the surrounding of aluminum nitride heating piece, can ensure that the nitrogen fills the heating piece surface space of the eutectic heating device, avoid the product oxidation damage in the eutectic process.

[0017] 5. The high-precision pulse heating device, first with independent base cooling gas circuit and closed outer cover, control the base temperature not too high (≤60℃), then use the closed outer cover to carry out safety isolation to the device, to protect the operator from scalding.

[0018] 6. The high-precision pulse heating device, first adopts the separated structure design, simple structure and convenient replacement, low processing cost, then the heating piece as consumables, can be replaced conveniently, low operation and maintenance cost. DETAILED DESCRIPTION

[0019] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, together with the embodiments of the present application, to explain the present application, and do not constitute a limitation on the present application. In the drawings: Figure 1 is a structural schematic diagram of the present application; Figure 2 is a structural schematic diagram of the right side view of the present application; Figure 3 is a structural schematic diagram of the lower view of the present application; Figure 4 is a top view of the present application; Figure 5 is a structural schematic diagram of the rear side view of the present application; Figure 6 is a front sectional view of the present application; Figure 7 is a structural schematic diagram of the Figure 6 lower view of the present application; Figure 8 is a side sectional view of the present application; Figure 9 is a structural schematic diagram of the Figure 8 rear view of the present application; Figure 10 is a side sectional view of the heating piece cooling assembly of the present application; Figure 11 is an exploded view of the present application; Figure 12 is a structural schematic diagram of the Figure 11 lower view of the present application; Figure 13 This is the invention Figure 12 A structural diagram from a rear view; Figure 14 This is an exploded view of part of the structure of the present invention; Figure 15 This is a structural schematic diagram of the base of the present invention from multiple perspectives; Figure 16 This is a schematic diagram of the heating element support base of the present invention from multiple perspectives.

[0020] In the diagram: 1. Support assembly; 101. Base; 102. Connecting frame; 103. Heating element support seat; 2. Heating assembly; 201. Aluminum nitride heating element; 202. Thermocouple; 203. Fixing block; 204. Fixing plate; 3. External assembly; 301. Eutectic stage cover; 302. Sealing plate; 4. Adsorption assembly; 401. Vacuum suction hole; 402. Vacuum adsorption gas path; 403. Suction connector one; 5. Heating element cooling assembly; 501. Heating element gas path one; 502. Heating element air inlet; 503. Air inlet component; 504. Heating element gas path two; 505. Heating element heat dissipation hole; 506. Evacuation component; 6. Base cooling assembly; 601. Base cooling gas path; 602. Air inlet connector; 603. Exhaust connector; 7. Nitrogen protection assembly; 701. Nitrogen protection gas path; 702. Gas path connector. Detailed Implementation

[0021] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0022] Example: Figures 1-16 As shown, the present invention discloses a high-precision pulse heating device, comprising: a support assembly 1, a heating assembly 2 disposed on the top of the support assembly 1, an external assembly 3 mounted on the lower surface of the support assembly 1, an adsorption assembly 4 disposed at the middle position of the support assembly 1 and the heating assembly 2, a heating element cooling assembly 5 disposed at the middle position of the side of the support assembly 1 and the heating assembly 2, a base cooling assembly 6 disposed at the periphery of the upper surface of the base 101, and a nitrogen protection assembly 7 disposed on the inner side of the base cooling assembly 6; the support assembly 1 includes a base 101, a connecting frame 102 fixedly mounted on the upper surface of the base 101 by screws, and a heating element support seat 103 fixedly mounted on the middle position of the upper surface of the base 101 by screws.

[0023] The heating element support 103 has a unique gas circuit cavity structure on its surface, which ensures sufficient support area for the heating element and increases the contact area between the heat dissipation gas and the heating element to achieve good heat dissipation effect.

[0024] The heating assembly 2 comprises an aluminum nitride heating sheet 201, a thermocouple 202 is embedded in the middle position of the right end face of the aluminum nitride heating sheet 201, and a fixed pressing block 203 is fixedly connected to each of the four corners of the upper surface of the aluminum nitride heating sheet 201, the surface of each fixed pressing block 203 is clamped with a fixed pressing plate 204, and the upper surfaces of the two ends of the fixed pressing plate 204 are threadedly connected to the upper end face of the connecting frame 102 through screws.

[0025] The external assembly 3 comprises an eutectic table protective cover 301, the two side faces of the lower end of the eutectic table protective cover 301 are threadedly connected to the two end faces of the lower end of the base 101 through screws, and the right side face of the eutectic table protective cover 301 is threadedly connected with a sealing plate 302 through a screw.

[0026] The nitrogen cavity type loop structure is independently composed of the heating sheet support seat 103, the connecting frame 102, the base 101, the eutectic table protective cover 301, and the sealing plate 302, nitrogen gas is transmitted to the inside of the nitrogen protection gas path 701 through the two gas path joints 702 under the action of the driving structure, and the nitrogen protection gas path 701 transmits the nitrogen gas to the surrounding of the aluminum nitride heating sheet 201, so that the surface space of the heating sheet of the eutectic heating device can be filled with nitrogen gas, and oxidation damage of the product during the eutectic process can be avoided.

[0027] The adsorption assembly 4 comprises a vacuum suction hole 401, the vacuum suction hole 401 is arranged in the middle position of the upper surface of the aluminum nitride heating sheet 201, the middle positions of the upper surfaces of the base 101 and the heating sheet support seat 103 are provided with a vacuum adsorption gas path 402, the lower end of the vacuum adsorption gas path 402 penetrates the back surface of the base 101, and the inner cavity of the lower end of the vacuum adsorption gas path 402 is connected with a suction joint 403.

[0028] The heating sheet cooling assembly 5 comprises a heating sheet gas path 501, the heating sheet gas path 501 is arranged in the outer ring groove of the middle position of the upper surface of the base 101, the lower end of the heating sheet gas path 501 penetrates the front surface of the base 101, a plurality of heating sheet air inlet holes 502 are arranged in the outer groove of the top of the heating sheet support seat 103, and the inner cavity of the front end of the heating sheet gas path 501 is connected with an air inlet component 503; a heating sheet gas path 504 is arranged in the inner ring groove of the middle position of the upper surface of the base 101, the front end of the heating sheet gas path 504 penetrates the front surface of the base 101, a plurality of heating sheet heat dissipation holes 505 are arranged in the inner groove bottom surface of the top of the heating sheet support seat 103, and the inner cavity of the front end of the heating sheet gas path 504 is connected with an air exhaust component 506.

[0029] Wherein, by setting the heating sheet cooling assembly 5, start heating sheet cooling assembly 5, wherein the suction component 506 driven heating sheet heat dissipation hole 505 will aluminum nitride heating sheet 201 surface heat to extract, then the air inlet component 503 will cold gas through the heating sheet gas path 501 and heating sheet inlet hole 502 to the surface of the aluminum nitride heating sheet 201, at this time the air inlet component 503 and suction component 506 in cooperation with the use of the heat dissipation process for cold cycle, so that the aluminum nitride heating sheet 201 can be cooled quickly.

[0030] The base cooling assembly 6 comprises a base cooling gas path 601, the base cooling gas path 601 is opened on the upper surface of the base 101, and the front end of the base cooling gas path 601 penetrates the front surface of the left end of the base 101, the rear end of the base cooling gas path 601 penetrates the back surface of the right end of the base 101, the inner cavity of the front end of the base cooling gas path 601 is connected with an air inlet joint 602, and the inner cavity of the rear end of the base cooling gas path 601 is connected with an air outlet joint 603.

[0031] The nitrogen protection assembly 7 comprises a nitrogen protection gas path 701, the nitrogen protection gas path 701 is opened on the upper surface of the base 101, and the front end of the nitrogen protection gas path 701 penetrates the upper right corner of the front surface of the base 101, the rear end of the nitrogen protection gas path 701 penetrates the upper left corner of the back surface of the base 101, and the inner cavities of the front end and the rear end of the nitrogen protection gas path 701 are connected with a gas path joint 702.

[0032] Wherein, by setting the nitrogen protection assembly 7, starting the driving structure to transmit nitrogen to the inside of the nitrogen protection gas path 701 through the two gas path joints 702, respectively, the nitrogen protection gas path 701 transmits nitrogen to the surrounding of the aluminum nitride heating sheet 201, which can ensure that the nitrogen fills the heating sheet surface space of the eutectic heating device and avoid oxidation damage of the product during the eutectic process.

[0033] When working, first, the target substrate is placed on the upper surface of the aluminum nitride heating sheet 201, and then the vacuum suction air path 402 is driven by the suction device to perform suction, and the vacuum suction hole 401 is driven by the vacuum suction air path 402 to perform negative pressure suction, so that the substrate can be adsorbed and positioned, and then the target chip is placed, positioned and pressed, and the nitrogen protection assembly 7 and the base cooling assembly 6 are started, the gas path joint 702 in the nitrogen protection assembly 7 can transmit nitrogen to the inside of the nitrogen protection air path 701, and the nitrogen protection air path 701 can transmit nitrogen to the surface of the aluminum nitride heating sheet 201, and then the gas inlet joint 602 in the base cooling assembly 6 can transmit compressed air to the inside of the base cooling air path 601, so that the nitrogen protection assembly 7 and the base cooling assembly 6 are used to establish a nitrogen atmosphere environment and high-temperature isolation, respectively, and the aluminum nitride heating sheet 201 is powered and heated, the whole heating process is monitored by the embedded thermocouple 202, the heating is stopped when the temperature reaches the set value and the set temperature is maintained for a certain period of time, and the heating sheet cooling assembly 5 is started, wherein the heating sheet heat dissipation hole 505 is driven by the suction part 506 to remove the heat on the surface of the aluminum nitride heating sheet 201, and then the cold gas is transmitted to the surface of the aluminum nitride heating sheet 201 through the heating sheet air path one 501 and the heating sheet gas inlet hole 502 by the gas inlet part 503, so that the cooperation of the gas inlet part 503 and the suction part 506 promotes the cooling process to be a cold cycle, so that the aluminum nitride heating sheet 201 can be rapidly cooled, and the whole cooling process is monitored by the embedded thermocouple 202, and after the cooling is completed, the target chip is taken away, and the cooling air path is closed. Thus, one working cycle is completed, and the next cycle is started.

[0034] A heating method, comprising the following steps: S1, the vacuum adsorption assembly 4 in the pulse heating device is started, and the target substrate is placed on the upper surface of the aluminum nitride heating sheet 201 and adsorbed and fixed; and then the target chip is placed, positioned and pressed; S2, the nitrogen protection assembly 7 and the base cooling assembly 6 are started at the same time, and are used to establish a nitrogen atmosphere environment and high-temperature isolation, respectively; S3, the aluminum nitride heating sheet 201 is powered and heated; and the whole heating process is monitored by the embedded thermocouple 202; S4, the heating is stopped when the temperature reaches the set value and the set temperature is maintained for a certain period of time; S5, the heating sheet cooling assembly 5 is started, and the aluminum nitride heating sheet 201 is rapidly cooled, and the whole cooling process is monitored by the embedded thermocouple 202; S6, after the cooling is completed, the target chip is taken away, and the cooling air path is closed. Thus, one working cycle is completed, and the next cycle is started.

[0035] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent ones. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high-precision pulse heating device, characterized in that, include: A support component (1) is provided with a heating component (2) at its top. An external component (3) is installed on the surface of the lower end of the support component (1). An adsorption component (4) is provided in the middle of the support component (1) and the heating component (2). A heating element cooling component (5) is provided in the middle of the side opposite to the support component (1) and the heating component (2). A base cooling component (6) is provided on the outer periphery of the upper surface of the base (101). A nitrogen protection component (7) is provided on the inner side of the base cooling component (6). The support assembly (1) includes a base (101), a connecting frame (102) is fixedly installed on the upper surface of the base (101) by screws, and a heating element support seat (103) is fixedly installed at the middle position of the upper surface of the base (101) by screws.

2. The high-precision pulse heating device according to claim 1, characterized in that, The heating assembly (2) includes an aluminum nitride heating element (201), a thermocouple (202) is embedded in the middle of the right end face of the aluminum nitride heating element (201), and a fixing block (203) is fixedly connected to each of the four corners of the upper surface of the aluminum nitride heating element (201). Each fixing block (203) is fitted with a fixing plate (204), and the upper surfaces of both ends of the fixing plate (204) are threaded to the upper end face of the connecting frame (102) by screws.

3. The high-precision pulse heating device according to claim 2, characterized in that, The external component (3) includes a eutectic stage cover (301). The two sides of the lower end of the eutectic stage cover (301) are threaded to the two ends of the lower end of the base (101) by screws. The right side of the eutectic stage cover (301) is threaded to a sealing plate (302) by screws.

4. A high-precision pulse heating device according to claim 3, characterized in that, The adsorption component (4) includes a vacuum suction hole (401), which is located in the middle of the upper surface of the aluminum nitride heating element (201). Vacuum adsorption gas passages (402) are provided in the middle of the upper surface of the base (101) and the heating element support (103). The lower end of the vacuum adsorption gas passage (402) extends backward through the back of the base (101). The inner cavity of the lower end of the vacuum adsorption gas passage (402) is connected to a suction connector (403).

5. A high-precision pulse heating device according to claim 4, characterized in that, The heating element cooling assembly (5) includes a heating element air passage (501), which is located in the outer ring groove at the middle of the upper surface of the base (101). The lower end of the heating element air passage (501) extends forward through the front of the base (101). Multiple heating element air inlets (502) are provided in the outer groove at the top of the heating element support (103). An air inlet component (503) is connected to the inner cavity at the front end of the heating element air passage (501).

6. A high-precision pulse heating device according to claim 5, characterized in that, A second heating element air passage (504) is provided in the inner ring groove at the middle position of the upper surface of the base (101), and the front end of the second heating element air passage (504) penetrates through the front of the base (101). A plurality of heating element heat dissipation holes (505) are provided on the bottom surface of the inner groove at the top of the heating element support (103). An air extraction component (506) is connected to the inner cavity at the front end of the second heating element air passage (504).

7. A high-precision pulse heating device according to claim 6, characterized in that, The base cooling assembly (6) includes a base cooling air passage (601). The base cooling air passage (601) is located on the periphery of the upper surface of the base (101). The front end of the base cooling air passage (601) penetrates the front of the left end of the base (101), and the rear end of the base cooling air passage (601) penetrates the back of the right end of the base (101). An air inlet connector (602) is connected to the inner cavity of the front end of the base cooling air passage (601), and an exhaust connector (603) is connected to the inner cavity of the rear end of the base cooling air passage (601).

8. A high-precision pulse heating device according to claim 7, characterized in that, The nitrogen protection component (7) includes a nitrogen protection gas passage (701). The nitrogen protection gas passage (701) is located on the upper surface of the base (101). The front end of the nitrogen protection gas passage (701) passes through the upper right corner of the front of the base (101), and the rear end of the nitrogen protection gas passage (701) passes through the upper left corner of the back of the base (101). The inner cavities of the front end and the rear end of the nitrogen protection gas passage (701) are connected to a gas passage connector (702).

9. A heating method, applied to the high-precision pulse heating device according to any one of claims 1-8, characterized in that, Includes the following steps: S1. Turn on the vacuum adsorption component (4) in the pulse heating device, and at the same time place the target substrate on the upper surface of the aluminum nitride heating plate (201) for adsorption and fixation; then place the target chip, align it, and press it to hold it in place. S2. Simultaneously activate the nitrogen protection component (7) and the base cooling component (6) to establish a nitrogen atmosphere environment and high temperature isolation, respectively. S3, the aluminum nitride heating element (201) is energized and heated; the entire heating process is monitored by the embedded thermocouple (202); S4. After the temperature reaches the set value, the heating stops and the set temperature is maintained for a certain period of time. S5. Start the heating element cooling component (5) to quickly cool the aluminum nitride heating element (201) and monitor the entire cooling process through the embedded thermocouple (202); S6. After cooling is complete, remove the target chip and shut off the cooling airflow. This completes one work cycle, and the next cycle will begin.

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