Carrying table device capable of overcoming warped wafer

Abstract

The invention relates to a carrier device capable of overcoming warped wafers. The carrier device comprises a carrier unit, a feeding arm unit and warped wafer products. The carrying table unit sequentially comprises a carrying table main cavity lower body and a carrying table main cavity upper body from bottom to top, a jacking mechanism drives a jacking carrying table above to move up and down, a plurality of jacking carrying table suction cups are installed at the top of the jacking carrying table, and a product adsorption carrying table suction cup is arranged at the position, on the outer side of the jacking carrying table, of the top of the carrying table main cavity upper body. The feeding arm unit comprises a feeding mechanical arm, and the top of the feeding mechanical arm is provided with a plurality of mechanical arm suction cups used for adsorbing warped wafer products. Through cooperation of the jacking mechanism and the partition adsorption mechanism, a staged adsorption strategy is adopted, the center area of the wafer is adsorbed through the jacking carrying table suction cup, then overall adsorption is completed through the product adsorption carrying table suction cup, and the problem that the large-warping wafer is difficult to adsorb is effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a wafer warping overcoming platform device. BACKGROUND

[0002] The wafer adsorption platform in the current market is mainly composed of a vacuum porous ceramic platform (hereinafter referred to as a ceramic platform) and a Bernoulli chuck. First, the product is placed on the surface of the ceramic platform, and then the vacuum of the ceramic platform and the Bernoulli chuck is turned on in sequence, so that the product is attached to the surface of the platform. The above-mentioned method has the following problems:

[0003] 1. The ceramic platform is expensive and can only be used for flat or slightly warped wafers. If the warping amount is too large, the vacuum will leak, the Bernoulli chuck will fail, and the product cannot be attached to the surface.

[0004] 2. The Bernoulli chuck commonly seen in the market is supported by three points, and the body is too large, so the ceramic platform has a large hollow area. When producing thin wafers, the warping amount increases due to the large hollow area of the Bernoulli chuck and the small number of support points, which is counterproductive. It cannot adapt to wafers of different thicknesses and cannot be self-corrected.

[0005] In view of the above-mentioned defects, the present application actively researches and innovates to create a wafer warping overcoming platform device, which has more industrial value. SUMMARY

[0006] To solve the above-mentioned technical problems, the purpose of the present application is to provide a wafer warping overcoming platform device.

[0007] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0008] A wafer warping overcoming platform device, comprising a platform unit, a feeding arm unit and a warped wafer product.

[0009] The platform unit comprises a platform main cavity lower body and a platform main cavity upper body from bottom to top, a top lifting platform is installed at the top middle concave cavity of the platform main cavity upper body, a top lifting mechanism is installed at the bottom middle concave cavity of the platform main cavity lower body, the top lifting mechanism drives the top lifting platform above to move up and down, a plurality of top lifting platform chucks are installed at the top of the top lifting platform, and a product adsorption platform chuck is arranged at the top of the platform main cavity upper body outside the top lifting platform.

[0010] The feeding arm unit comprises a feeding mechanical arm, and a plurality of mechanical arm chucks for adsorbing warped wafer products are installed at the top of the feeding mechanical arm.

[0011] As a further improvement of the present application, a warped wafer product support edge is installed outside the platform main cavity upper body.

[0012] As a further improvement of the present invention, upper limit photoelectric components and lower limit photoelectric components are respectively installed on both sides of the lifting mechanism.

[0013] As a further improvement of the present invention, the upper limit photoelectric component includes an upper limit photoelectric sensor plate installed at the bottom of the lifting platform and an upper limit photoelectric sensor installed on the lower body of the main cavity of the platform on one side of the upper limit photoelectric sensor plate; the lower limit photoelectric component includes a lower limit photoelectric sensor plate installed at the bottom of the lifting platform and a lower limit photoelectric sensor installed on the lower body of the main cavity of the platform on one side of the lower limit photoelectric sensor plate, and the upper limit photoelectric sensor plate is located above the lower limit photoelectric sensor plate.

[0014] As a further improvement of the present invention, at least two lifting guide rods are installed at the bottom of the lifting platform, and the bottom of the lifting guide rods are mounted on the lower body of the main cavity of the platform through guide bearings.

[0015] As a further improvement of the present invention, the lifting platform suction cup is provided with an air inlet at the bottom of the lifting platform.

[0016] As a further improvement of the present invention, an annular product adsorption platform gas collection chamber is provided below the product adsorption platform suction cup. The product adsorption platform gas collection chamber is located between the lower body of the main cavity of the platform and the upper body of the main cavity of the platform. Several product adsorption platform air inlets are provided at the bottom of the lower body of the main cavity of the platform and are connected to the upper product adsorption platform gas collection chamber.

[0017] As a further improvement of the present invention, the lifting mechanism is a lead screw step lifting shaft.

[0018] By means of the above-described solution, the present invention has at least the following advantages:

[0019] This invention utilizes a combination of a lifting mechanism and a partitioned adsorption mechanism, employing a staged adsorption strategy. First, the central region of the wafer is adsorbed using the lifting stage suction cup, and then the entire wafer is adsorbed using the product adsorption stage suction cup, effectively overcoming the problem of difficult adsorption of wafers with large warpage.

[0020] This invention is compatible with products of various thicknesses, allows for flexible switching of suction cups, saves labor costs, and improves machine uptime.

[0021] This invention eliminates the large hollow area of ​​the platform, resulting in smoother product adhesion and improved production quality.

[0022] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the following are preferred embodiments of the present invention described in detail with reference to the accompanying drawings. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a stage device for overcoming wafer warping according to the present invention;

[0025] Figure 2 yes Figure 1 A schematic diagram of the structure after removing the loading arm unit and the warped wafer product;

[0026] Figure 3 yes Figure 2 Top view;

[0027] Figure 4 yes Figure 2 A bottom view;

[0028] Figure 5 yes Figure 2 Internal structure diagram;

[0029] Figure 6 yes Figure 1 A schematic diagram of the structure of the loading arm unit.

[0030] The meanings of the labels in the figures are as follows.

[0031] Stage unit 1, loading arm unit 2, warped wafer product 3;

[0032] The following components are included: lower body of the main cavity of the stage 101, upper body of the main cavity of the stage 102, support edge for warped wafer products 103, lifting stage 104, lifting stage suction cup 105, lifting mechanism 106, upper limit photoelectric component 107, lower limit photoelectric component 108, lifting guide rod 109, air inlet of lifting stage suction cup 110, air inlet of product adsorption stage 111, air collection cavity of product adsorption stage 112, and suction cup of product adsorption stage 113.

[0033] 201 robotic arm for loading materials, 202 robotic arm suction cup. Detailed Implementation

[0034] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0035] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] First embodiment of the present invention:

[0037] like Figures 1-6 As shown, a stage device for overcoming wafer warpage in this embodiment includes a stage unit 1, a loading arm unit 2, and a warped wafer product 3.

[0038] The stage unit 1 includes, from bottom to top, a lower stage cavity 101 and an upper stage cavity 102. A warped wafer product support edge 103 is installed on the outside of the upper stage cavity 102.

[0039] A lifting platform 104 is installed in the recessed cavity at the top center of the upper body 102 of the main cavity of the platform. A lifting mechanism 106 (the lifting mechanism 106 is a lead screw stepping lifting shaft) is installed in the recessed cavity at the bottom center of the lower body 101 of the main cavity of the platform. The lifting mechanism 106 drives the upper lifting platform 104 to move up and down. Several lifting platform suction cups 105 are installed on the top of the lifting platform 104. A product adsorption platform suction cup 113 is provided on the top of the upper body 102 of the main cavity of the platform outside the lifting platform 104.

[0040] The lifting platform suction cup 105 is located at the bottom of the lifting platform 104 and has a lifting platform suction cup air inlet 110.

[0041] Below the suction cup 113 of the product adsorption platform, there is an annular product adsorption platform air collection chamber 112. The product adsorption platform air collection chamber 112 is located between the lower body 101 and the upper body 102 of the main cavity of the platform. Several product adsorption platform air inlets 111 are opened at the bottom of the lower body 101 of the main cavity of the platform and are connected to the upper product adsorption platform air collection chamber 112.

[0042] The loading arm unit 2 includes a loading robotic arm 201, and a number of robotic arm suction cups 202 for adsorbing warped wafer products 3 are installed on the top of the loading robotic arm 201.

[0043] An upper limit photoelectric component 107 and a lower limit photoelectric component 108 are respectively installed on both sides of the lifting mechanism 106. Specifically:

[0044] The upper limit photoelectric component 107 includes an upper limit photoelectric sensor plate installed at the bottom of the lifting platform 104 and an upper limit photoelectric sensor installed on the lower body 101 of the main cavity of the platform on one side of the upper limit photoelectric sensor plate.

[0045] The lower limit photoelectric component 108 includes a lower limit photoelectric sensor plate installed at the bottom of the lifting platform 104 and a lower limit photoelectric sensor installed on the lower body 101 of the main cavity of the platform on one side of the lower limit photoelectric sensor plate.

[0046] Furthermore, the upper limit photoelectric sensor is located above the lower limit photoelectric sensor.

[0047] At least two lifting guide rods 109 are installed at the bottom of the lifting platform 104. The bottom of the lifting guide rods 109 is mounted on the lower body 101 of the main cavity of the platform through guide bearings.

[0048] In this embodiment, the lifting mechanism 106 is raised to the receiving position, the loading robot arm 201 places the warped wafer product 3 onto the lifting stage suction cup 105, the robot arm suction cup 202 disconnects the vacuum, the loading robot arm 201 is pulled away from the wafer stage, the lifting stage suction cup 105 opens the vacuum, the warped wafer product 3 adheres to the lifting stage 104, the lifting mechanism 106 is lowered to the whole product adsorption stage position, the product adsorption stage suction cup 113 opens the vacuum, and the adsorption of the warped wafer product 3 is completed.

[0049] The second embodiment of the present invention:

[0050] like Figures 1-6 As shown, the stage device for overcoming wafer warpage in this embodiment mainly consists of a stage unit 1, a loading arm unit 2, and a warped wafer product 3.

[0051] The stage unit 1 is the core part of the device, and from bottom to top, it includes the lower stage main cavity 101 and the upper stage main cavity 102. The lower stage main cavity 101 and the upper stage main cavity 102 are made of AL7075 aluminum alloy, which replaces the traditional porous ceramic, significantly reducing manufacturing costs while ensuring sufficient structural strength and stability.

[0052] A lifting stage 104 is installed in the recessed cavity at the top center of the upper body 102 of the main stage cavity, and a lifting mechanism 106 is installed in the recessed cavity at the bottom center of the lower body 101 of the main stage cavity. The lifting mechanism 106 is a lead screw stepping lifting shaft that drives the upper lifting stage 104 to move up and down. Several lifting stage chucks 105 are installed on the top of the lifting stage 104. These chucks adopt a replaceable design, and different models of chucks can be selected according to the wafers with different degrees of warpage, thereby enhancing the adaptability of the device.

[0053] A product adsorption stage suction cup 113 is provided on the top of the upper body 102 of the main cavity outside the lifting stage 104. Below the product adsorption stage suction cup 113, an annular product adsorption stage gas collection chamber 112 is formed, located between the lower body 101 and the upper body 102 of the main cavity. Several product adsorption stage air inlets 111 are formed at the bottom of the lower body 101 and communicate with the upper product adsorption stage gas collection chamber 112. This annular gas collection chamber design makes the adsorption force distribution more uniform and improves the flatness of the wafer adsorption.

[0054] A warped wafer support edge 103 is installed on the outside of the main cavity upper body 102 of the stage. The support edge is made of flexible material and can adapt to wafer edges with different degrees of warping, ensuring the stable placement of the wafer on the stage.

[0055] The positioning detection system includes an upper limit photoelectric component 107 and a lower limit photoelectric component 108, respectively disposed on both sides of the lifting mechanism 106. The upper limit photoelectric component 107 includes an upper limit photoelectric sensor mounted on the bottom of the lifting stage 104 and an upper limit photoelectric sensor mounted on the lower body 101 of the stage's main cavity to one side of the upper limit photoelectric sensor. The lower limit photoelectric component 108 includes a lower limit photoelectric sensor mounted on the bottom of the lifting stage 104 and a lower limit photoelectric sensor mounted on the lower body 101 of the stage's main cavity to one side of the lower limit photoelectric sensor, with the upper limit photoelectric sensor located above the lower limit photoelectric sensor. This design ensures that the lifting stage 104 moves within a safe range, preventing damage to the wafer or equipment due to overtravel.

[0056] The guiding and stabilizing system includes at least two lifting guide rods 109, which are installed at the bottom of the lifting platform 104. The bottom of the lifting guide rods 109 is mounted on the lower body 101 of the main cavity of the platform via guide bearings to ensure the stability and straightness of the lifting movement and prevent deviation or shaking during the lifting process.

[0057] The loading arm unit 2 includes a loading robotic arm 201, on the top of which are several robotic arm suction cups 202 for adsorbing warped wafer products 3, so as to realize the automated transfer of wafers.

[0058] The working process of this embodiment is as follows:

[0059] First, the lifting mechanism 106 drives the lifting platform 104 to rise to the receiving position. The upper limit photoelectric component 107 stops rising after detecting that the lifting platform 104 has reached the correct position. The loading robotic arm 201 carries the warped wafer product 3 to the top of the platform and places the wafer product on the lifting platform suction cup 105 through the robotic arm suction cup 202.

[0060] Next, the vacuum is disengaged by the robotic arm suction cup 202, and the loading robotic arm 201 moves out of the stage area. The lifting stage suction cup 105 opens the vacuum through the lifting stage suction cup air inlet 110, and the warped wafer product 3 initially adheres to the surface of the lifting stage 104 under the action of suction, at which point the warping at the center of the wafer is initially corrected.

[0061] Then, the lifting mechanism 106 drives the lifting platform 104 to descend to the product adsorption position, carrying the wafer product. The lower limit photoelectric component 108 stops descending after detecting that the lifting platform 104 has reached the correct position. The product adsorption platform suction cup 113 opens a vacuum through the product adsorption platform air inlet 111 and the product adsorption platform gas collection chamber 112 to complete the overall adsorption of the wafer.

[0062] Throughout the operation, the lifting guide rod 109 ensures the smoothness of the lifting movement, while the upper limit photoelectric component 107 and the lower limit photoelectric component 108 monitor the lifting position in real time to prevent overtravel damage to the wafer or equipment. The warped wafer product support edge 103 provides flexible support for the wafer edge, ensuring that the wafer fits flatly against the stage surface.

[0063] This embodiment employs a staged adsorption strategy, first adsorbing the central region of the wafer using a lifting stage suction cup, and then completing the overall adsorption using a product adsorption stage suction cup, effectively overcoming the adsorption challenge of wafers with large warpage. The design of the annular product adsorption stage's gas collection cavity ensures a more uniform distribution of adsorption force, and combined with flexible support edges and a precise positioning system, it guarantees the flatness and stability of wafer adsorption.

[0064] Compared to traditional ceramic stages and Bernoulli chucks, this embodiment offers better adaptability, lower cost, and higher reliability, making it particularly suitable for handling high-warpage wafers in semiconductor manufacturing processes.

[0065] This invention utilizes a combination of a lifting mechanism and a zoned adsorption mechanism, employing a staged adsorption strategy. First, the lifting stage suction cups adsorb the central area of ​​the wafer, then the product adsorption stage suction cups complete the overall adsorption, effectively overcoming the difficulty in adsorbing wafers with large warpage. It is compatible with products of various thicknesses, allows for flexible switching of suction cups, saves labor costs, and improves machine uptime. Eliminating large cutout areas on the stage results in flatter product adsorption, improving production quality.

[0066] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0067] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0068] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A stage device for overcoming wafer warpage, comprising a stage unit (1), a loading arm unit (2), and a warped wafer product (3); Its features are: The platform unit (1) includes, from bottom to top, a lower platform main cavity (101) and an upper platform main cavity (102). A lifting platform (104) is installed in the recessed cavity at the top center of the upper platform main cavity (102). A lifting mechanism (106) is installed in the recessed cavity at the bottom center of the lower platform main cavity (101). The lifting mechanism (106) drives the upper lifting platform (104) to move up and down. Several lifting platform suction cups (105) are installed on the top of the lifting platform (104). A product adsorption platform suction cup (113) is provided on the top of the upper platform main cavity (102) outside the lifting platform (104). The loading arm unit (2) includes a loading robotic arm (201), and a plurality of robotic arm suction cups (202) for adsorbing warped wafer products (3) are installed on the top of the loading robotic arm (201).

2. The stage device for overcoming wafer warpage as described in claim 1, characterized in that, A warped wafer product support edge (103) is installed on the outside of the main cavity upper body (102) of the stage.

3. The stage device for overcoming wafer warpage as described in claim 1, characterized in that, An upper limit photoelectric component (107) and a lower limit photoelectric component (108) are respectively installed on both sides of the lifting mechanism (106).

4. The stage device for overcoming wafer warpage as described in claim 3, characterized in that, The upper limit photoelectric component (107) includes an upper limit photoelectric sensor plate installed at the bottom of the lifting platform (104) and an upper limit photoelectric sensor installed on the lower body (101) of the main cavity of the platform on one side of the upper limit photoelectric sensor plate; the lower limit photoelectric component (108) includes a lower limit photoelectric sensor plate installed at the bottom of the lifting platform (104) and a lower limit photoelectric sensor installed on the lower body (101) of the main cavity of the platform on one side of the lower limit photoelectric sensor plate, and the upper limit photoelectric sensor plate is located above the lower limit photoelectric sensor plate.

5. The stage device for overcoming wafer warpage as described in claim 1, characterized in that, At least two lifting guide rods (109) are installed at the bottom of the lifting platform (104), and the bottom of the lifting guide rods (109) is mounted on the lower body (101) of the main cavity of the platform through guide bearings.

6. The stage device for overcoming wafer warpage as described in claim 1, characterized in that, The lifting platform suction cup (105) is located at the bottom of the lifting platform (104) and has a lifting platform suction cup air inlet (110).

7. The stage device for overcoming wafer warpage as described in claim 1, characterized in that, An annular product adsorption platform gas collection chamber (112) is provided below the product adsorption platform suction cup (113). The product adsorption platform gas collection chamber (112) is located between the lower body (101) of the main cavity of the platform and the upper body (102) of the main cavity of the platform. Several product adsorption platform air inlets (111) are provided at the bottom of the lower body (101) of the main cavity of the platform and are connected to the upper product adsorption platform gas collection chamber (112).

8. The stage device for overcoming wafer warpage as described in claim 1, characterized in that, The lifting mechanism (106) is a lead screw step lifting shaft.

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