Efficient circulating heat dissipation device for integrated circuit and use method

Abstract

The invention discloses an efficient circulating heat dissipation device for an integrated circuit and a using method, and relates to the technical field of integrated circuit heat dissipation, the efficient circulating heat dissipation device comprises a liquid cooling plate, a walking cleaning mechanism and a heat dissipation mechanism, the liquid cooling plate is fixedly provided with a cooling liquid inlet and a cooling liquid outlet, and the walking cleaning mechanism is arranged on the liquid cooling plate. The liquid cooling plate moves in the length direction of the liquid cooling plate; the air cooling assembly is installed on the walking mechanism and used for conducting air cooling heat dissipation on the liquid cooling plate. According to the heat dissipation structure, the air cooling assembly and the liquid cooling plate are arranged in a matched mode, the synchronous heat dissipation effect of air cooling and liquid cooling of the integrated circuit can be achieved at the same time, meanwhile, real-time cooling treatment of cooling liquid can be achieved, the cooling effect of the cooling liquid is stably and continuously guaranteed, and the heat dissipation structure can move in real time and is convenient to use. And the heat dissipation comprehensiveness and effectiveness of the integrated circuit and the cooling liquid can be ensured.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit heat dissipation technology, and more specifically to a high-efficiency circulating heat dissipation device and its usage method for integrated circuits. Background Technology

[0002] An integrated circuit is a miniature electronic device or component that integrates a number of commonly used electronic components, such as transistors, resistors, capacitors, and the interconnections between these components, onto one or more small semiconductor wafers or dielectric substrates using specific semiconductor processes. These wafers are then packaged in a housing to form a miniature structure with specific circuit functions. As the scale of component integration increases, integrated circuits are increasingly developing into large-scale, very large-scale, and ultra-large-scale integrated circuit clusters. The heat power generated per unit volume is also gradually increasing. In order to ensure the continuous and stable operation of integrated circuits, heat dissipation devices are required.

[0003] In the invention patent application CN112638124A, published on April 9, 2021, entitled "Integrated Circuit Heat Dissipation Device in the Technical Field of Circuit Board Testing Device," the device includes a workbench with a support base mounted on it. The support base houses a heat dissipation mechanism, a circulating power pump, and a pressing mechanism. A water tank is located behind the support base and mounted on the workbench. The heat dissipation mechanism includes a heat dissipation base fixedly mounted on the support base. The heat dissipation base has multiple buffer rigid columns and a lower heat dissipation plate. A heat dissipation circulation plate is fixedly connected to the upper surface of the lower heat dissipation plate, a heat dissipation heat conduction plate is fixedly connected to the upper surface of the circulation plate, and a heat dissipation silicone plate is fixedly connected to the upper surface of the heat dissipation heat conduction plate. This device, by designing the heat dissipation mechanism and setting the size of the heat conduction holes in the silicone plate slightly smaller than those in the heat dissipation columns, and by utilizing the elasticity of the silicone plate, achieves a tighter contact between the two components after installation, thus improving the device's heat dissipation efficiency.

[0004] In the prior art, including the aforementioned patents, heat dissipation devices generally use air cooling or water cooling, but they cannot combine the advantages of both air cooling and water cooling, resulting in suboptimal heat dissipation. At the same time, the temperature of the coolant will rise during long-term heat dissipation, affecting the final heat dissipation effect and resulting in poor practical application performance. Summary of the Invention

[0005] The purpose of this invention is to provide a high-efficiency circulating heat dissipation device and method for use in integrated circuits, so as to overcome the above-mentioned shortcomings in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A high-efficiency circulating heat dissipation device for integrated circuits includes a liquid cooling plate, on which a coolant inlet and a coolant outlet are fixedly installed respectively, and a walking cleaning mechanism is also included: the mechanism is disposed on the liquid cooling plate and moves along the length of the liquid cooling plate.

[0008] Air-cooled assembly: It is installed on the walking mechanism and is used to provide air cooling for the liquid cooling plate.

[0009] Preferably, the walking cleaning mechanism includes a drive component and a cleaning component.

[0010] Preferably, the drive assembly includes a mounting bracket fixedly connected to the liquid cooling plate, a lead screw rotatably connected to the two mounting brackets, the lead screw being driven by a motor, and a moving block being threaded onto the external part of the lead screw.

[0011] Preferably, the walking cleaning mechanism includes mounting shells fixedly connected to both sides of the moving block, a cleaning roller rotatably connected to the mounting shell, and the cleaning roller rollingly connected to the upper surface of the liquid cooling plate.

[0012] Preferably, each of the mounting shells is equipped with two cleaning components, each of the cleaning components squeezing the liquid cooling plate to clean the surface of the liquid cooling plate.

[0013] Preferably, the cleaning assembly includes a slide plate slidably connected to the mounting housing, a cleaning shovel fixedly connected to the slide plate, and the slide plate and the mounting housing being fixedly connected by multiple springs.

[0014] Preferably, the air-cooled assembly includes an inclined fan blade rotatably connected to a movable block and a transmission component mounted on a liquid cooling plate, the transmission component being used to drive the inclined fan blade to rotate.

[0015] Preferably, the transmission component includes a rack fixedly connected to two mounting brackets, and a driven gear plate is coaxially fixedly connected to the inclined fan blade, the driven gear plate meshing with the rack.

[0016] In the above technical solution, the present invention provides a high-efficiency circulating heat dissipation device for integrated circuits. By being equipped with air-cooling components and liquid-cooling plates, it can not only achieve simultaneous air-cooling and liquid-cooling heat dissipation for integrated circuits, but also achieve real-time cooling of the coolant, thereby ensuring the cooling effect of the coolant stably and continuously. Moreover, the heat dissipation structure can move in real time, which can ensure the comprehensiveness and effectiveness of heat dissipation for integrated circuits and coolant.

[0017] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure.

[0018] This application provides an overview of various implementations or examples of the technology described in this disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0020] Figure 1 This is a three-dimensional structural diagram of a high-efficiency circulating heat dissipation device for integrated circuits.

[0021] Figure 2 This is a three-dimensional structural diagram of a high-efficiency circulating heat dissipation device for integrated circuits from another angle.

[0022] Figure 3 This is an exploded three-dimensional schematic diagram of an efficient circulating heat dissipation device for integrated circuits.

[0023] Figure 4 This is an exploded three-dimensional structural diagram of an air-cooled component in a high-efficiency circulating heat dissipation device for integrated circuits.

[0024] Figure 5 This is an exploded three-dimensional structural diagram of a walking cleaning mechanism in a high-efficiency circulating heat dissipation device for integrated circuits.

[0025] Figure 6 This is a three-dimensional structural diagram of a cleaning and scraping assembly in a high-efficiency circulating heat dissipation device for integrated circuits.

[0026] Figure 7 A high-efficiency circulating heat dissipation device for integrated circuits Figure 2 A magnified structural diagram of point A in the middle.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Liquid cooling plate; 2. Mounting bracket; 3. Rack; 4. Lead screw; 5. Air-cooled assembly; 51. Mounting shaft; 52. Inclined fan blade; 53. Driven gear plate; 6. Motor; 7. Walking cleaning mechanism; 71. Mounting housing; 72. Slide rail; 73. Side plate; 74. Cleaning assembly; 741. Side groove; 742. Spring; 743. Slide plate; 744. Cleaning shovel; 75. Cleaning roller; 76. Mounting rod; 8. Moving block; 9. Guide rail; 10. Coolant inlet; 11. Coolant outlet; 12. Bottom groove. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0030] Reference Figure 1-7 As shown, the present invention provides a high-efficiency circulating heat dissipation device for integrated circuits, including a liquid cooling plate 1, on which a coolant inlet 10 and a coolant outlet 11 are fixedly installed respectively, and also includes a walking cleaning mechanism 7: which is disposed on the liquid cooling plate 1 and moves in the length direction of the liquid cooling plate 1.

[0031] Air-cooled component 5: It is installed on the walking mechanism and is used to provide air-cooled heat dissipation for the liquid cooling plate 1.

[0032] The walking cleaning mechanism 7 includes a drive component and a cleaning component 74.

[0033] The drive assembly includes a mounting bracket 2 fixedly connected to the liquid cooling plate 1, two mounting brackets 2 having lead screws 4 rotatably connected to them, the lead screws 4 being driven by a motor 6, and a moving block 8 being threaded onto the external of the lead screws 4.

[0034] The walking cleaning mechanism 7 includes mounting shells 71 that are fixedly connected to both sides of the moving block 8. A cleaning roller 75 is rotatably connected to each mounting shell 71, and the cleaning roller 75 is in rolling connection with the upper surface of the liquid cooling plate 1.

[0035] Two cleaning components 74 are installed on each mounting shell 71. Each cleaning component 74 squeezes the liquid cooling plate 1, thereby cleaning the surface of the liquid cooling plate 1.

[0036] The cleaning assembly 74 includes a slide plate 743 slidably connected to the mounting housing 71, a cleaning shovel 744 fixedly connected to the slide plate 743, and the slide plate 743 and the mounting housing 71 are fixedly connected by a plurality of springs 742.

[0037] Reference Figure 1 , 3As shown in Figure 6, a coolant inlet and a coolant outlet 11 are respectively connected through one side wall of the liquid cooling plate 1. A coolant holding cavity is provided inside the liquid cooling plate 1. The liquid cooling plate 1 can be made of a metal material with good thermal conductivity, such as aluminum alloy. A mounting bracket 2 is fixedly connected to each of the two opposite side walls of the liquid cooling plate 1. A lead screw 4 is rotatably connected between the two mounting brackets 2. The lead screw 4 is coaxially fixedly connected to the output shaft of the motor 6. The motor 6 is fixedly mounted on one of the mounting brackets 2. A guide rail 9 is fixedly connected to the top of the liquid cooling plate 1. A moving block 8 is threaded onto the outside of the lead screw 4. A bottom groove 12 adapted to the guide rail 9 is opened on the moving block 8, thereby allowing... The movable block 8 moves in the transverse direction of the liquid cooling plate 1. A mounting shell 71 is fixedly connected to the opposite ends of the movable block 8. A cleaning roller 75 is rotatably connected to each mounting shell 71. A slide rail 72 is fixedly connected at the position of the side plate 73 of the mounting shell 71. A cleaning shovel 744 is provided on both sides of the side wall. A sliding plate 743 is connected to the upper end of the cleaning shovel. A side groove 741 that matches the corresponding return position is opened on the opposite sides of the sliding plate 743. Multiple springs 742 are fixedly connected to each sliding plate 743. The other end of the spring 742 is fixedly connected to the mounting groove. Each mounting shell 71 is mounted on the movable block 8 through a mounting rod 76.

[0038] This invention features two walking cleaning mechanisms 7. As the moving block 8 moves, the walking cleaning mechanisms 7 on both sides move synchronously. During the movement of the walking cleaning mechanisms 7, the cleaning rollers 75 roll on the liquid cooling plate 1, effectively cleaning the outer surface of the liquid cooling plate 1 and removing dirt from the rollers. This effectively prevents dirt from continuously adhering to the surface of the liquid cooling plate 1, thus affecting the heat dissipation effect of the coolant inside the liquid cooling plate 1. Simultaneously, as the cleaning rollers 75 move, they also drive the cleaning assembly 74 to move. Because the cleaning shovel 744 continuously contacts and presses against the upper surface of the liquid cooling plate 1 under the action of multiple connecting springs 742, it can remove stubborn stains remaining on the surface of the liquid cooling plate 1 during its movement. This stabilizes and improves the cleaning effect of the walking cleaning mechanisms 7, further enhancing the application effect of the device.

[0039] Reference Figure 1 , 3 As shown in Figure 4, in another embodiment of the present invention, the air-cooled assembly 5 includes an inclined fan blade 52 rotatably connected to the movable block 8 and a transmission component mounted on the liquid cooling plate 1. The transmission component is used to drive the inclined fan blade 52 to rotate.

[0040] The transmission component includes a rack 3 fixedly connected to two mounting brackets 2, and a driven gear 53 coaxially fixedly connected to the inclined fan blade 52, the driven gear 53 meshing with the rack 3.

[0041] Specifically, a rack 3 is fixedly connected between the two mounting brackets 2, and an inclined fan blade 52 is rotatably connected to the moving block 8. A mounting shaft 51 is fixedly connected to the inclined fan blade 52. The mounting shaft 51 is coaxially fixedly connected to the driven gear plate 53, and the driven gear plate 53 meshes with the rack 3.

[0042] When the integrated circuit is working, the heat it emits can be effectively absorbed by the liquid cooling plate 1. At the same time, the motor 6 can be turned on, and the motor 6 drives the lead screw 4 to rotate. The lead screw 4 can drive the moving block 8 to move back and forth, which can synchronously drive the air cooling component 5 to move back and forth. During this process, the driven gear disk 53 can mesh with the rack 3 and rotate, which can synchronously drive the inclined fan blade 52 to rotate. When the inclined fan blade 52 rotates, it can generate a certain amount of air force. Part of the air force will directly act on the heat dissipation of the integrated circuit, and the other part of the air force will be conducted downward to the liquid cooling plate 1 to effectively cool the coolant in the liquid cooling plate 1. It can not only achieve the simultaneous heat dissipation effect of air cooling and liquid cooling of the integrated circuit, but also achieve real-time cooling of the coolant, thereby ensuring the cooling effect of the coolant stably and continuously. Moreover, the heat dissipation structure can move in real time, which can ensure the comprehensiveness and effectiveness of heat dissipation for the integrated circuit and the coolant.

[0043] During use, when the integrated circuit is working, the heat it emits can be effectively absorbed by the liquid cooling plate 1. Simultaneously, the motor 6 can be turned on, driving the lead screw 4 to rotate. The lead screw 4 drives the moving block 8 to reciprocate, synchronously driving the air-cooling assembly 5 to reciprocate. During this process, the driven gear 53 can mesh with the rack 3 and rotate, synchronously driving the inclined fan blade 52 to rotate. When the inclined fan blade 52 rotates, it generates a certain amount of airflow. Part of this airflow directly acts on the heat dissipation of the integrated circuit, while the other part is conducted downwards to the liquid cooling plate 1, effectively cooling the coolant inside the liquid cooling plate 1. Simultaneously, under the action of the lead screw 4, the moving block 8 moves, synchronously driving the walking cleaning mechanisms 7 on both sides to move synchronously. During the movement of the walking cleaning mechanisms 7, the cleaning rollers... The cleaning roller 75 can move and roll on the liquid cooling plate 1. The cleaning roller 75 can effectively clean the outer surface of the liquid cooling plate 1, removing dirt and debris. This effectively prevents dirt and debris from continuously adhering to the surface of the liquid cooling plate 1, thus affecting the heat dissipation effect of the coolant inside the liquid cooling plate 1. At the same time, when the cleaning roller 75 moves, it can also effectively ensure the stability of the moving block 8, improving the actual application effect of the overall device. It can also drive the cleaning component 74 to move synchronously. Since the cleaning shovel 744 can continuously and tightly contact and squeeze the upper surface of the liquid cooling plate 1 under the action of multiple connecting springs 742, it can remove stubborn stains remaining on the surface of the liquid cooling plate 1 during the movement of the cleaning shovel 744, thereby stabilizing and improving the cleaning effect of the walking cleaning mechanism 7, and further improving the application effect of the device.

[0044] A method of using a high-efficiency circulating heat dissipation device for integrated circuits includes the following steps:

[0045] S1. The liquid cooling plate 1 is attached to the outside of the integrated circuit that needs to dissipate heat. When the integrated circuit is working, the heat emitted by it can be effectively absorbed by the liquid cooling plate 1.

[0046] S2. Start motor 6. Motor 6 drives lead screw 4 to rotate. Lead screw 4 can drive moving block 8 to move back and forth, which can synchronously drive air-cooling component 5 to move back and forth. During this process, driven gear disk 53 can mesh with rack 3 and rotate, which can synchronously drive inclined fan blade 52 to rotate. When inclined fan blade 52 rotates, it can generate a certain wind force. Part of the wind force will directly act on the heat dissipation of integrated circuit, and the other part of the wind force will be conducted downward to liquid cooling plate 1 to effectively cool the coolant in liquid cooling plate 1.

[0047] S3. While the moving block 8 moves, the walking cleaning mechanism 7 on both sides can move synchronously. During the movement of the walking cleaning mechanism 7, the cleaning roller 75 can move and roll on the liquid cooling plate 1. The cleaning roller 75 can effectively clean the outer surface of the liquid cooling plate 1 and remove dirt from the cleaning roller 75.

[0048] S4. During the movement of the walking cleaning mechanism 7, the cleaning shovel assembly 74 can be moved synchronously, so that the cleaning shovel 744 can continuously and tightly contact and squeeze the upper surface of the liquid cooling plate 1 under the action of multiple connecting springs 742, which can remove stubborn stains remaining on the surface of the liquid cooling plate 1.

[0049] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A high-efficiency circulating heat dissipation device for integrated circuits, comprising a liquid cooling plate (1), wherein a coolant inlet (10) and a coolant outlet (11) are fixedly installed on the liquid cooling plate (1), characterized in that, It also includes a walking cleaning mechanism (7): which is mounted on the liquid cooling plate (1) and moves along the length of the liquid cooling plate (1); Air-cooled component (5): It is installed on the walking mechanism and is used to cool the liquid cooling plate (1) by air.

2. The high-efficiency circulating heat dissipation device for integrated circuits according to claim 1, characterized in that, The walking cleaning mechanism (7) includes a drive component and a cleaning component (74).

3. The high-efficiency circulating heat dissipation device for integrated circuits according to claim 2, characterized in that, The drive assembly includes a mounting bracket (2) fixedly connected to the liquid cooling plate (1), and a lead screw (4) rotatably connected to the two mounting brackets (2). The lead screw (4) is driven by a motor (6), and a moving block (8) is threadedly connected to the external thread of the lead screw (4).

4. The high-efficiency circulating heat dissipation device for integrated circuits according to claim 3, characterized in that, The walking cleaning mechanism (7) includes mounting shells (71) fixedly connected to both sides of the moving block (8), and a cleaning roller (75) is rotatably connected to each mounting shell (71). The cleaning roller (75) is rolledly connected to the upper surface of the liquid cooling plate (1).

5. A high-efficiency circulating heat dissipation device for integrated circuits according to claim 4, characterized in that, Each of the mounting housings (71) is equipped with two cleaning components (74), each of the cleaning components (74) presses the liquid cooling plate (1) to clean the surface of the liquid cooling plate (1).

6. The high-efficiency circulating heat dissipation device for integrated circuits according to claim 5, characterized in that, The cleaning assembly (74) includes a sliding plate (743) slidably connected to the mounting housing (71), a cleaning shovel (744) fixedly connected to the sliding plate (743), and the sliding plate (743) and the mounting housing (71) are fixedly connected by a plurality of springs (742).

7. The high-efficiency circulating heat dissipation device for integrated circuits according to claim 3, characterized in that, The air-cooled assembly (5) includes an inclined fan blade (52) rotatably connected to a movable block (8) and a transmission component mounted on a liquid cooling plate (1), the transmission component being used to drive the inclined fan blade (52) to rotate.

8. The high-efficiency circulating heat dissipation device for integrated circuits according to claim 7, characterized in that, The transmission component includes a rack (3) fixedly connected to two mounting brackets (2), and a driven gear plate (53) is coaxially fixedly connected to the inclined fan blade (52), the driven gear plate (53) meshing with the rack (3).

9. A method of using a high-efficiency circulating heat dissipation device for integrated circuits, characterized in that, The method includes the following steps: S1. The liquid cooling plate (1) is attached to the outside of the integrated circuit that needs to dissipate heat. When the integrated circuit is working, the heat emitted by it can be effectively absorbed by the liquid cooling plate (1). S2. Start the motor (6). The motor (6) drives the lead screw (4) to rotate. The lead screw (4) can drive the moving block (8) to move back and forth, and can synchronously drive the air-cooling component (5) to move back and forth. During this process, the driven gear plate (53) can mesh with the rack (3) and rotate, and can synchronously drive the inclined fan blade (52) to rotate. When the inclined fan blade (52) rotates, it can generate a certain wind force. Part of the wind force will directly act on the heat dissipation of the integrated circuit, and the other part of the wind force will be transmitted downward to the liquid cooling plate (1) to effectively cool the coolant in the liquid cooling plate (1). S3. While the moving block (8) moves, the walking cleaning mechanism (7) on both sides can move synchronously. During the movement of the walking cleaning mechanism (7), the cleaning roller (75) can move and roll on the liquid cooling plate (1). The cleaning roller (75) can effectively clean the outer surface of the liquid cooling plate (1) and remove dirt from the cleaning roller (75). S4. During the movement of the walking cleaning mechanism (7), the cleaning shovel assembly (74) can be moved synchronously, so that the cleaning shovel (744) can continuously and tightly contact and squeeze the upper surface of the liquid cooling plate (1) under the action of multiple connecting springs (742), which can remove stubborn stains remaining on the surface of the liquid cooling plate (1).

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