Sensor mounting device and method for mounting sensor mounting device to power semiconductor device

Abstract

A sensor mounting device and a method for mounting a sensor mounting device to a power semiconductor device. The sensor mounting device (10) comprises: a device body (11) having a first side surface (111) and an opposite second side surface (112), where the positioning structure (12) is located at the first side surface (111); and at least a sensor locator (14). The at least one sensor element (15) is accommodated within the at least one sensor retainer (14). The sensor mounting device (10) further comprises at least one first mounting structure (18) adapted to mount the sensor mounting device (10) to a corresponding at least one second mounting structure (35) of the semiconductor power device (30).

Description

Technical Field

[0001] This disclosure relates to a sensor mounting device, a power semiconductor device, and a method for mounting the sensor mounting device onto the power semiconductor device. Background Technology

[0002] Monitoring power semiconductor modules for health monitoring, predictive maintenance, or improved responsiveness in the event of failure is becoming increasingly important. Therefore, various physical parameters, such as chip temperature, input and output current, or applied voltage, can be monitored temporarily or periodically during device operation. In particular, monitoring of output current is an important feature not only for improving the operation and control of power modules in applications but also for improving control over short-circuit failure modes. This monitoring is typically achieved using a current sensor located near the power module's output or AC terminals, or near the output bus in the application. Power modules with integrated current sensors, especially Hall effect sensors, are another option. Summary of the Invention

[0003] The goal is to attach sensor elements to power semiconductor devices in a simple way, while still enabling accurate measurements of the sensor elements.

[0004] This objective is achieved through the features of the independent claim. Advantageous embodiments are indicated in the dependent claims.

[0005] For example, as claimed in the independent claims, the embodiments of this disclosure address, in whole or in part, the above-mentioned disadvantages in the art. Further embodiments of the power semiconductor device, sensor mounting device, and method for mounting the sensor mounting device to the power semiconductor device are the subject of the remaining claims.

[0006] A sensor mounting device is provided, comprising a device body having a first side surface and an opposing second side surface, wherein at least one positioning structure is located on the first side surface. The sensor mounting device further includes at least one sensor location. At least one sensor element is housed within the at least one sensor location. The sensor mounting device further includes at least one first mounting structure adapted to mount the sensor mounting device to a corresponding at least one second mounting structure of a semiconductor power device.

[0007] Sensor mounting devices provide a simple structure with sensor elements that can be easily retrofitted into existing power semiconductor devices. This makes it easier to use sensor elements in power semiconductor devices. Consequently, the setup and assembly of power semiconductor devices (such as power modules) are simpler and cheaper.

[0008] Another advantage is greater flexibility in designing power semiconductor devices (e.g., power modules). The customer decides where to mount the sensor element to the power module. Simple assembly is possible using the first mounting structure. The first mounting structure can be permanently or only temporarily attached to the second mounting structure. Correspondingly, the sensor mounting device is permanently or only temporarily attached to the power semiconductor device. There is no need to build a product with an integrated sensor element on the power semiconductor device and a second product without a sensor element on the power semiconductor device. Using a mountable sensor mounting device eliminates the need for parallel manufacturing of two product types. This further reduces production costs.

[0009] Furthermore, it is possible to use more than one sensor element to operate multiple power semiconductor devices that share a common sensor mounting device.

[0010] The positioning structure is a recess and / or groove, but it can also be a notch, cut, or various deepenings, or a combination of these deepenings. Alternatively, it is a hole, such as a through hole or a through-hole. The positioning structure is, for example, C-shaped, but can have any suitable geometry, such as circular, elliptical, triangular, square, rectangular, or other polygonal shapes. The shape depends on the shape of the sensor element or part of the sensor element to be positioned.

[0011] The sensor mounting device further includes at least one first alignment structure. The first alignment structure facilitates the alignment of the sensor mounting device with a corresponding or mating structure of the power semiconductor device.

[0012] The first alignment structure can be located, for example, inside or next to the positioning structure. Therefore, the existing structure of the power semiconductor device can be used as an additional alignment structure to achieve improved mounting. Since the sensor element in the positioning structure is located in a defined position (due to the first alignment structure), more accurate measurements using the sensor element are possible.

[0013] The first alignment structure includes, for example, a slot that can be partially or completely penetrated by a current-carrying structure (e.g., a terminal), which serves as an additional alignment structure for the power semiconductor device. Alternatively, the first alignment structure is a bedstop such that at least a portion of the power semiconductor device is adjacent to the first alignment structure or alignment device. Thus, the sensor element is properly aligned relative to the current-carrying structure (e.g., the terminal). The terminal (e.g., the output terminal of the power module) that partially or completely penetrates the slot at least supports the alignment and fixation of the sensor mounting device. Because the sensor element is located near the slot and therefore near the terminal, more accurate measurement of, for example, the output current from the output terminal is possible.

[0014] Different designs are possible for the positioning structure, as long as the magnetic core and / or sensor element are assembled inside the positioning structure. At least one positioning structure is, for example, C-shaped, particularly a C-shaped recess, but can have any suitable geometry, such as circular, elliptical, triangular, square, rectangular, or other polygonal shapes. Depending on the requirements of the magnetic core shape, the positioning structure (e.g., the recess) can have any suitable shape. The magnetic core includes a gap, and after the magnetic core is installed, at least one sensor positioning element is located within this gap. Arranging at least one sensor positioning element within the gap makes it possible to have the most compact possible setup. The magnetic core surrounds, for example, at least one first alignment structure. In this defined case, proper alignment between the terminals and the magnetic core is facilitated.

[0015] Caps are available to protect the magnetic core and positioning structure from dust, debris, and other contaminants, ensuring the longest possible operating time without maintenance. The caps can be the same shape as the magnetic core to completely cover it.

[0016] The body of the sensor mounting device can be made of any electrically insulating material. Electrically insulating materials are particularly thermoplastic or thermosetting resins filled with particles or fibers made of inorganic materials. These materials are robust and easy to process. Additionally, the entire sensor mounting device can be made of electrically insulating materials, such as thermoplastic or thermosetting resins filled with particles or fibers. Furthermore, the device body includes transfer-molded parts and / or injection-molded parts, or is manufactured using transfer molding and / or injection molding processes. Other suitable molding processes are also feasible for manufacturing the device body. These are simple methods for manufacturing the device body and can also be used for the rest of the sensor mounting device.

[0017] At least one sensor element is, for example, a sensor for detecting electrical and / or electromagnetic and / or magnetic parameters, such as current, voltage, electric field, magnetic field, and / or electromagnetic field. This list is not exhaustive, and a sensor element can refer to any sensor element suitable for the electrical and / or electromagnetic properties of the measuring device.

[0018] At least one sensor element is exemplarily a Hall sensor and / or a Rogowski coil and / or a fiber optic sensor. Not only Hall sensors can be used for current monitoring in power semiconductor modules, but other types of current sensors (e.g., Rogowski coils or fiber optic devices) are also suitable. If a Hall sensor is used, for example, the sensor consists of a magnetic core that surrounds the terminals or different components of the power semiconductor device (e.g., the output bus in the application). The magnetic core has a gap at which the sensor element (e.g., the Hall sensor itself) is located. The sensor element measures the magnetic field generated by the output current. Combinations of the three sensor types are possible to provide more accurate measurements across different devices.

[0019] The sensor mounting device includes at least one third mounting structure adapted to mount the sensor mounting device to a corresponding at least fourth mounting structure of at least one other device. For example, a cooling device and / or a modular printed circuit board. Securing the sensor mounting device to multiple structures provides a more stable overall structure, thereby offering improved mechanical support.

[0020] The first, second, third, and fourth mounting structures include clamps and / or shoulders and / or screws and / or threads and / or adhesive. The mounting structure can be a fully usable fixing structure (e.g., a clamp) for mounting and securing the sensor mounting device and assembling it to a corresponding mounting structure of the power semiconductor device. Alternatively, the fixing structure of the sensor mounting device can be different parts that are fixedly or temporarily usable on the sensor mounting device and / or in the power semiconductor device.

[0021] The first mounting structure is, for example, a clamp, which is fixed to a corresponding second mounting structure, which serves as a shoulder. Alternatively, the first and second mounting structures are fastened in opposite ways. Thus, the first mounting structure is the shoulder, and the second mounting structure is the clamp. The same applies to the third and fourth mounting structures. Not only do the first and second mounting structures correspond to each other, but the third and fourth mounting structures also correspond to each other. Alternative mounting structures and their counterparts are, for example, screws and threads and / or glue and other adhesives.

[0022] Additional sensor mounting devices are mounted to the peripheral region of a power semiconductor device, with at least a portion of the power terminals (especially output or AC terminals) located in this peripheral region. On one hand, the sensor mounting devices can be fixedly connected, for example, by gluing, permanent clamping, or screw fixing. On the other hand, fixing by clamping or screw fixing facilitates temporary placement of the sensor mounting devices.

[0023] A power semiconductor device is also provided. The power semiconductor device includes: a housing body having a third side surface; at least one terminal, wherein the at least one terminal is located on the third side surface. The power semiconductor device further includes at least one second mounting structure, wherein the at least one second mounting structure is configured to be mounted to a corresponding at least one first mounting structure of a sensor mounting device. The power semiconductor device can be any device that needs to monitor current. Typical power devices are IGBTs, HEMTs, MOSFETs, thyristors, and diodes, which may be based on silicon, silicon carbide, or gallium nitride. Additionally, the power semiconductor device can be combined with other sensors, controllers, and / or passive devices. Such devices can be arranged on a substrate structure or a control board.

[0024] At least one terminal of a power semiconductor device can be used as an additional alignment structure to improve the alignment between the power semiconductor device and the sensor mounting device and thus facilitate proper alignment between the current-carrying structure (e.g., the terminal) and the sensor element.

[0025] The implementation of additional sensor mounting devices strikes a balance between customer requests and the interests of power semiconductor device manufacturers in maintaining product complexity and keeping the number of product variations low (which is related to manufacturing costs). These additional sensor mounting devices can be easily attached to the power semiconductor device. Therefore, there exists a unified single product without sensor elements (e.g., Hall sensors), which can optionally be equipped with sensor elements upon customer request.

[0026] A method for mounting a sensor mounting device to a power semiconductor device is also provided. The method includes the steps of: providing a sensor mounting device; providing a power semiconductor device; and mounting the sensor mounting device to the power semiconductor device, wherein at least one first mounting structure of the sensor mounting device is fixed to at least one corresponding second mounting structure of the power semiconductor device.

[0027] This method provides a simple mounting of a sensor onto a power semiconductor device to measure the current of the power semiconductor device using at least one sensor element. The operation of the power semiconductor device is monitored, and depending on the monitored values, the power semiconductor device can be adjusted and controlled to improve performance or detect failure modes.

[0028] The method further includes aligning a sensor mounting device to a power semiconductor device, wherein at least one sensor positioning element is located adjacent to a current-carrying structure of the power semiconductor device. The alignment of the sensor mounting device to the power semiconductor device also results in the alignment of at least one sensor element to a current-carrying structure (e.g., a terminal), thereby enabling more accurate measurement of electrical, magnetic, and electromagnetic properties (e.g., output current). The current-carrying structure is used, for example, as at least one additional alignment structure and fitted into the first alignment structure, for example, the current-carrying structure partially or completely penetrates at least one first alignment structure. Alternatively, the additional alignment structure is adjacent to at least one first alignment structure or alignment device. In this way, the current-carrying structure supports the alignment between the sensor mounting device and the power semiconductor device.

[0029] The sensor mounting device can also be mounted to at least one other structure, such as a cooling device and / or a printed circuit board, wherein at least one third mounting structure of the sensor mounting device is fixed to at least one corresponding fourth mounting structure of at least one other structure. The cooling device can be a cooler or various heat sinks that cool the power semiconductor device during operation to prevent overheating and maintain stable performance.

[0030] This disclosure includes several aspects of a power semiconductor device, a sensor mounting device, and a method for mounting the sensor mounting device to the power semiconductor device based on embodiments and examples thereof. Each feature described with respect to one of these aspects is also disclosed herein with respect to another aspect, even if the corresponding feature is not explicitly mentioned in the context of a particular aspect. For example, the method described in this disclosure relates to a method for mounting a sensor mounting device to a power semiconductor device. Therefore, the features and advantages described in conjunction with the power semiconductor device or the sensor mounting device can be used in this method, and vice versa.

[0031] While this disclosure can be made in various modifications and alternatives, its details are shown by way of example in the accompanying drawings and will be described in detail. However, it should be understood that this disclosure is not intended to be limited to the specific embodiments and examples described. Rather, it is intended to cover all modifications, equivalents, and alternatives that fall within the scope of this disclosure as defined by the appended claims. Attached Figure Description

[0032] The accompanying drawings are included to provide further understanding. In the drawings, elements with the same structure and / or function may be referenced by the same reference numerals. It will be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0033] Figure 1 This is a perspective view of a power semiconductor device. Figure 2This is a perspective view of the sensor mounting device. Figure 3 This is a perspective view of the sensor mounting devices and power semiconductor devices. Figure 4 This is a schematic diagram of the steps of a method for mounting a sensor mounting device onto a power semiconductor device. Detailed Implementation

[0034] Figure 1 A perspective view of a power semiconductor device 30 is shown. The power semiconductor device 30 includes at least one terminal 33 located at a third side surface 34 of the power semiconductor device 30. Furthermore, the power semiconductor device 30 includes at least one second mounting structure 35, wherein the at least one second mounting structure 35 is configured to be fixed to a sensor mounting device 10. Figure 1 At least one first mounting structure 18 (not shown in the image) corresponding to the first mounting structure 18 Figure 1 (Not shown in the image). The second mounting structure 35 is... Figure 1 The shoulder of the mounting structure can be, for example, a clamp. Alternatively, the second mounting structure 35 can be a screw, thread, and / or glue or other adhesive.

[0035] Figure 2 A perspective view of a sensor mounting device 10 is shown. The sensor mounting device 10 has a device body 11 having a first side surface 111 and an opposing second side surface 112. The device body 11 can be made of any electrically insulating material. In particular, thermoplastic or thermosetting resin materials filled with particles or fibers of inorganic material can be used. The device body 11 can be manufactured by transfer molding, injection molding, or other suitable molding processes.

[0036] The positioning structure 12 is located on the first side surface 111 of the device body 11 and is adapted to accommodate the magnetic core 13 and at least one sensor positioning element 14. In this embodiment, the positioning structure 12 is a recess, but it can also be a notch, cut, groove, or different deepening. Here, the recess is C-shaped, but it can have any suitable geometry depending on the shape of the magnetic core, such as circular, elliptical, triangular, square, rectangular, or other polygonal shapes. Here, the magnetic core 13 is correspondingly C-shaped and has a gap 16. After the magnetic core 13 is installed, the sensor positioning element 14 is arranged inside the gap 16. The magnetic core 13 is covered by a corresponding C-shaped cap 20 to prevent dust, debris, and other contaminants from contaminating the magnetic core 13 or the positioning structure 12. The magnetic core 13 and the cap 20 can have any suitable mating geometry, such as circular, elliptical, triangular, square, rectangular, or other polygonal shapes.

[0037] At least one sensor element 15 is housed inside the sensor positioning member 14. Figure 2(The area is indicated as a dotted line square). The device body 11 of the sensor mounting device 10 provides a positioning structure 12, such as a recess, for the arrangement of at least one sensor element 15 and a magnetic core 13. For example, the sensor element 15 may be a current sensor. The current sensor may be any sensor of the type of Hall sensor and / or Rogowski coil and / or fiber optic sensor. Depending on the type of semiconductor device or application, the device body 11 may incorporate one or more current sensors, particularly three current sensors in the case of a six-pack module. In such exemplary cases, each sensor element 15 corresponds to one magnetic core 13. Alternatively, one or more sensor elements 15 themselves, as well as the magnetic core 13, may be an integral part of the sensor mounting device 10.

[0038] The first alignment structure 50 is also inside the positioning structure 12, and this first alignment structure is adapted to align the sensor mounting device 10 with the power semiconductor device 30.

[0039] Furthermore, the sensor mounting device 10 includes at least one first mounting structure 18, which is adapted to mount the sensor mounting device 10 to a corresponding second mounting structure 35 of the power semiconductor device 30. Figure 2 (Not shown in the image). In Figure 2 In this configuration, the first mounting structure 18 is implemented for use with the corresponding second mounting structure 35. Figure 2 (Not shown) A clamping fixture is used for clamping connection. In addition, the sensor mounting device 10 includes at least one third mounting structure 19, which is adapted to mount the sensor mounting device 10 to a corresponding mounting structure of an auxiliary device, such as a cooler, a printed circuit board (e.g., a control board or assembly board).

[0040] Figure 3 A perspective view of the sensor mounting device 10 and the power semiconductor device 30 is shown. The sensor mounting device 10 and... Figure 2 The sensor mounting device shown is the same, and the power semiconductor 30 is the same as... Figure 1 The power semiconductors shown in the partial cross-sectional view are the same. Therefore, detailed descriptions are omitted.

[0041] The first alignment structure 50, serving as the slot 17, may be partially or completely penetrated by at least one other alignment structure, for example, by at least one terminal 33 of the power semiconductor device 30. It is also possible to use different current-carrying structures 90 as additional alignment structures, along with corresponding first alignment structures 50.

[0042] The first alignment structure 50 can have any geometry, as long as it is suitable for connection with the corresponding features of the power semiconductor device 30 or at least with a portion of the power semiconductor device 30 (e.g., at least one terminal 33 protruding from the third side surface 34). This facilitates connection between the terminal 33 and the magnetic core 13 and thus with the sensor element 15 (in Figure 3 Proper alignment between the dots, lines, and squares (as indicated in the text).

[0043] like Figure 3 As shown, the first mounting structure 18 is a clamp that is fixed to a corresponding second mounting structure 35, which serves as a shoulder. Alternatively, the first mounting structure 18 and the second mounting structure 35 are fastened in opposite ways. Thus, the first mounting structure 18 is the shoulder, and the second mounting structure 35 is the clamp.

[0044] like Figure 3 As shown, the sensor mounting device 10 can be attached to only one power semiconductor device 30. Alternatively, the sensor mounting device 10 can also be implemented as a common device for multiple power semiconductor devices 30 (e.g., several equivalent power modules arranged in a row on a common base plate). Here, the sensor mounting device 10 can not only be fixed to the power module, but also to a corresponding fourth mounting structure 41 of at least one other device (e.g., a cooler, heat sink, or printed circuit board (e.g., a control board)) via at least one third mounting structure 19. Figure 3 (Not shown in the image), which will provide improved mechanical support. The third mounting structure 19 and the fourth mounting structure 41 ( Figure 3 (Not shown) is interchangeable with the first mounting structure 18 and the second mounting structure 35. Alternative mounting structures and their counterparts are screws and threads and / or glue and other adhesives.

[0045] If desired, additional functionalities or design options can be added to the sensor mounting device 10, such as alignment and / or mechanical support features for positioning pin terminals or press-fit terminals and / or pin or bed rails on the printed circuit board. For this purpose, the sensor mounting device 10 includes additional alignment structures to align the sensor mounting device 10 and the power semiconductor device 30, for example, with the printed circuit board. To secure the sensor mounting device 10 to the printed circuit board, at least one third mounting structure 19 of the sensor mounting device 10 can be used. Additionally, alignment pins may be present, which can penetrate through holes in the printed circuit board.

[0046] Figure 4 The steps of a method for mounting a sensor mounting device 10 to a power semiconductor device 30 are shown. In a first step S1, the sensor mounting device 10 is provided. In a second step S2, the power semiconductor device 30 is provided.

[0047] In a further step S3, the sensor mounting device 10 is aligned with the power semiconductor device 30, wherein at least one current-carrying structure 90 (e.g., terminal 33) is used as an additional alignment structure and partially or completely penetrates the first alignment structure 50. Thus, the sensor element 15 is properly aligned relative to the terminal 33, which serves as an additional alignment structure. The terminal 33, which partially or completely penetrates the slot 17 (e.g., the output terminal of the power module), at least supports the alignment and fixation of the sensor mounting device 10.

[0048] In step S4, the sensor mounting device 10 is mounted to the power semiconductor device 30, wherein at least a first mounting structure 18 of the sensor mounting device 10 is fixed to at least one corresponding second mounting structure 35 of the power semiconductor device 30.

[0049] In optional step S5, the sensor mounting device 10 is mounted to at least one other device, wherein at least one third mounting structure 19 of the sensor mounting device 10 is secured to a corresponding at least one fourth mounting structure 41 of the at least one other device. The sensor mounting device 10 may, for example, be mounted to a cooling device and / or a printed circuit board. For this purpose, the third mounting structure 19 can be used to mount, for example, two different devices to the sensor mounting device 10. In this case, the cooling device includes at least one fourth mounting structure 41, and the printed circuit board includes at least one fifth mounting structure. The fifth mounting structure also includes at least one of a clamp, shoulder, screw, thread, glue, or another adhesive.

[0050] The embodiments shown in the accompanying drawings, as stated, represent exemplary embodiments of the power semiconductor device 30 and the sensor mounting device 10. Therefore, they do not constitute a complete list of all embodiments of improved arrangements of the power semiconductor device 30 or the sensor mounting device 10. The actual arrangement of the power semiconductor device 30 or the sensor mounting device 10 may differ from the exemplary embodiments described above.

[0051] Figure Labels 10 Sensor mounting devices 11 Device Body 111 First side surface 112 Second side surface 12 Positioning Structure 13 magnetic cores 14 Sensor positioning components 15 Sensor Components 16. Gap in the magnetic core 17 slots 18 First Installation Structure 19 Third Installation Structure 20 hats 30 Power Semiconductor Devices 33 terminals 34 Third side surface 35 Second installation structure 41 Fourth Installation Structure 50 First Alignment Structure 90 Current-carrying structure

Claims

1. A sensor mounting device (10), comprising: - Device body (11), having a first side surface (111) and an opposing second side surface (112), wherein, - At least one positioning structure (12) is located at the first side surface (111), - At least one sensor positioning element (14), wherein, - At least one sensor element (15) is housed inside the at least one sensor positioning element (14). - At least one first mounting structure (18) adapted to mount the sensor mounting device (10) to at least one corresponding second mounting structure (35) of the semiconductor power device (30).

2. The sensor mounting device (10) according to claim 1, wherein, The positioning structure (12) is a recess and / or groove.

3. The sensor mounting device (10) according to claim 1 or 2, comprising at least one first alignment structure (50).

4. The sensor mounting device (10) according to claim 3, wherein, The at least one first alignment structure (50) is housed inside or next to the at least one positioning structure (12).

5. The sensor mounting device (10) according to claim 3 or 4, wherein, The at least one first alignment structure (50) includes a slot (17).

6. The sensor mounting device (10) according to any one of the preceding claims, wherein, The magnetic core (13) is housed inside the at least one positioning structure (12).

7. The sensor mounting device (10) according to claim 6, wherein, The magnetic core (13) surrounds the at least one first alignment structure (50).

8. The sensor mounting device (10) according to any one of the preceding claims, wherein, The magnetic core (13) includes a gap (16), and the at least one sensor positioning element (14) is located in the gap (16).

9. The sensor mounting device (10) according to any one of the preceding claims, wherein, The device body (11) includes an electrically insulating material, which includes transfer molding components and / or injection molding components.

10. The sensor mounting device (10) according to any one of the preceding claims, wherein, The at least one sensor element (15) is a sensor for detecting electrical and / or electromagnetic and / or magnetic parameters.

11. The sensor mounting device (10) according to any one of the preceding claims, wherein, The at least one sensor element (15) is a sensor for detecting current.

12. The sensor mounting device (10) according to any one of the preceding claims, wherein, The at least one sensor element (15) is a Hall sensor and / or a Rogowski coil and / or an optical fiber sensor.

13. The sensor mounting device (10) according to any one of the preceding claims, comprising at least one third mounting structure (19) adapted to mount the sensor mounting device (10) to at least one corresponding fourth mounting structure (41) of at least one other device.

14. The sensor mounting device (10) according to any one of the preceding claims, wherein, The at least one first, second, third, and fourth mounting structure (18, 35, 19, 41) includes at least one of a clamp, shoulder, screw, thread, glue, or another adhesive.

15. A power semiconductor device (30), comprising: - Third side surface (34). - At least one terminal (33), wherein the at least one terminal (33) is located on the third side surface (34). - At least one second mounting structure (35) adapted to mount the power semiconductor device (30) to at least one corresponding first mounting structure (18) of the sensor mounting device (10) according to any one of the preceding claims.

16. A method for mounting a sensor mounting device (10) according to claims 1 to 14 to a power semiconductor device (30), the method comprising the steps of: - Provide the sensor mounting device (10). - Provide the power semiconductor device (30). - The sensor mounting device (10) is mounted to the power semiconductor device (30), wherein at least a first mounting structure (18) of the sensor mounting device (10) is fixed to at least one corresponding second mounting structure (32) of the power semiconductor device (30).

17. The method of claim 16, further comprising the steps of: The sensor mounting device (10) is aligned with the power semiconductor device (30), wherein at least one sensor positioning element (14) is located next to the current-carrying structure (90) of the power semiconductor device (30).

18. The method according to claim 16 or 17, wherein, The alignment of the sensor mounting device (10) to the power semiconductor device (30) is supported by the current-carrying structure (90) assembled to the at least one first alignment structure (50).

19. The method according to any one of claims 16 to 18, comprising the following steps: The sensor mounting device (10) is mounted to at least one other structure, wherein the at least one third mounting structure (19) of the sensor mounting device (10) is fixed to the corresponding at least one fourth mounting structure (41) of the at least one other device.

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