Chip cleaning device and cleaning method
By adjusting the air pressure inside the cavity and using a liquid and gas jet mechanism, combined with a rotation mechanism, efficient cleaning of residues on the bottom of high-density interconnect packaged chips is achieved, solving the problem of low cleaning efficiency in existing technologies and improving chip reliability.
Patent Information
- Application Number
- CN202410939316.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2026-01-16
AI Technical Summary
Existing technologies struggle to effectively clean residues, especially flux residues, from the bottom of chips in high-density interconnect packaging structures, resulting in low cleaning efficiency and impacting chip reliability and the risk of failure during service.
The system employs a pneumatic control mechanism to regulate the air pressure within the cavity. Combined with liquid and gas jet mechanisms, a negative pressure environment is created to allow the cleaning fluid to fully penetrate the bottom of the chip. A rotating mechanism accelerates the flow and discharge of the cleaning fluid. Combined with high-pressure rinsing and spin-drying, the system achieves thorough cleaning of the chip's bottom and crevices.
It improves the cleaning efficiency of residues on the bottom of the chip, avoids or reduces the generation of bubbles, ensures cleaning effect, and is suitable for ultra-high density interconnect packaging structures.
Smart Images
Figure CN121339079A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip cleaning, and more particularly to a chip cleaning apparatus and cleaning method. Background Technology
[0002] With the rapid development of fields such as artificial intelligence and wireless networks, the demand for ultra-high integration of chips is increasing, and packaging structures are also developing rapidly, forming advanced packaging structures such as fan-out and through silicon via (TSV), which can integrate multiple single chips with different functions together.
[0003] Taking the TSV packaging structure as an example, the TSV structure interconnects with the interposer through a large number of microbumps on the bottom of the chip, forming a multifunctional unit structure. However, as the interconnection density requirement increases, the diameter and spacing of the ubumps on the bottom of the chip become smaller and smaller, making it difficult to clean residues (such as flux) on the bottom of the chip. Summary of the Invention
[0004] This application provides a chip cleaning apparatus and cleaning method, which can improve the cleaning efficiency of residues on the bottom of the chip.
[0005] This application provides a chip cleaning apparatus, which includes a cavity, a pressure control mechanism, a support stage, a rotation mechanism, a liquid jetting mechanism, and a gas jetting mechanism. The pressure control mechanism is connected to the cavity and is used to adjust the pressure within the cavity. The support stage is located in the cavity and is used to support the chip. The rotation mechanism is connected to the support stage and is used to rotate the support stage. The liquid jetting mechanism is used to spray cleaning fluid onto the chip surface. The gas jetting mechanism is used to jet gas onto the chip surface.
[0006] The chip cleaning apparatus provided in this application, by incorporating a pneumatic pressure control mechanism, allows for the adjustment of the air pressure within the cavity. During chip cleaning, the pneumatic pressure control mechanism first lowers the cavity pressure, and a liquid jetting mechanism sprays cleaning fluid onto the chip surface. Then, the pneumatic pressure control mechanism increases the cavity pressure, creating a negative pressure environment at the bottom of the chip (higher on the outside, lower on the inside). This forces the cleaning fluid into the low-pressure areas at the bottom of the chip and between chips, ensuring good filling of the cleaning fluid at the chip bottom. This effectively encapsulates the microbumps at the chip bottom and prevents or reduces air bubbles, facilitating the cleaning of residues. Furthermore, a rotating mechanism drives the chip on the support platform to rotate, and a gas jetting mechanism sprays air onto the chip surface. Through spin-drying and blowing, the cleaning fluid at the bottom of the chip is quickly expelled, enabling cleaning of all areas within the chip and the gaps between chips.
[0007] In some possible implementations, the gas jetting mechanism includes a heating device for heating the gas jetting mechanism, thereby accelerating the drying of the bottom of the chip while simultaneously accelerating the discharge of cleaning fluid from the bottom of the chip, thus improving cleaning efficiency.
[0008] In some possible implementations, the liquid jetting mechanism includes nozzles whose angle and position are adjustable. This allows for precise alignment cleaning by adjusting the nozzle's tilt angle and position as needed, thereby improving the cleaning efficiency of residues on the bottom of the chip.
[0009] In some possible implementations, the gas ejected by the gas ejection mechanism includes one or more of nitrogen, air, or argon.
[0010] In some possible implementations, the pressure regulating mechanism includes an air extraction device and an air intake device. The cavity is provided with an air intake port and an air extraction port. The air intake device communicates with the cavity through the air intake port, and the air extraction device communicates with the cavity through the air extraction port. In this way, the air extraction device can extract gas from the cavity through the air extraction port, thereby reducing the air pressure inside the cavity; the air intake device can fill the cavity with gas through the air intake port, thereby increasing the air pressure inside the cavity.
[0011] In some possible implementations, the liquid jetting mechanism is also used to spray cleaning fluid at pressures exceeding 100 psi onto the chip surface. This allows for high-pressure rinsing of the gaps between chips, and the high pressure promotes the flow of cleaning fluid between and under the chips, thereby improving the cleaning effect and facilitating the removal of residues from the chip bottom.
[0012] This application also provides a cleaning method, which may include: placing a chip on a support stage within a cavity; controlling the air pressure within the cavity to a first air pressure and spraying cleaning fluid onto the chip surface; controlling the air pressure within the cavity to a second air pressure, wherein the second air pressure is greater than the first air pressure; controlling the support stage to rotate the chip and spray air onto the chip surface.
[0013] The above cleaning method involves first reducing the air pressure inside the cavity to a first air pressure and spraying cleaning fluid onto the chip surface. Then, the air pressure inside the cavity is increased to a second air pressure, creating a negative pressure environment with a higher outer pressure and a lower inner pressure at the bottom of the chip. This forces the cleaning fluid into the low-pressure areas at the bottom of the chip and between chips, ensuring good filling of the cleaning fluid at the bottom of the chip. This effectively covers the microbumps at the bottom of the chip and avoids or reduces the formation of air bubbles, facilitating the cleaning of residues at the bottom of the chip. Afterward, the cleaning fluid at the bottom of the chip is quickly expelled through spin drying and blowing, thus achieving cleaning of all areas inside the chip and the gaps between chips.
[0014] In some possible implementations, the first atmospheric pressure is lower than the ambient atmospheric pressure, and the second atmospheric pressure is higher than the ambient atmospheric pressure.
[0015] In some possible implementation methods, the air pressure in the control chamber is the first air pressure, including: controlling the air pressure in the control chamber to be below 500 Torr, ensuring that there is a small air pressure in the chamber to better meet the requirements of negative pressure cleaning.
[0016] In some possible implementations, after the air pressure within the control chamber reaches a second pressure, the process further includes spraying a cleaning fluid with a pressure of 100 psi or higher onto the chip surface. This allows for high-pressure rinsing of the gaps between chips, and the high pressure promotes the flow of the cleaning fluid between and under the chips, thereby improving the cleaning effect and facilitating the removal of residues from the chip bottom.
[0017] In some possible implementations, the pressure difference between the second and first air pressures is above 200 Torr. This creates a significant pressure difference between the bottom and outer regions of the chip, allowing the cleaning solution to fully penetrate the bottom of the chip and improving cleaning efficiency.
[0018] In some possible implementations, the aforementioned control platform drives the chip to rotate, including controlling the platform to rotate the chip at a speed of 300 rpm or higher. This allows for the rapid removal of cleaning fluid from the bottom of the chip.
[0019] In some possible implementations, the above-mentioned jetting onto the chip surface includes: jetting one or more of nitrogen, air, or argon onto the chip surface.
[0020] In some possible implementations, the above-mentioned jetting of gas onto the chip surface includes: jetting heated gas onto the chip surface. This accelerates the removal of cleaning fluid from the bottom of the chip while simultaneously speeding up the drying of the chip bottom, thereby improving cleaning efficiency. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of chip cleaning provided in the prior art;
[0022] Figure 2 This is a schematic diagram of a chip cleaning apparatus provided in an embodiment of this application;
[0023] Figure 3 This is a schematic diagram of a chip cleaning apparatus provided in an embodiment of this application;
[0024] Figure 4 This is a flowchart of a chip cleaning method provided in an embodiment of this application;
[0025] Figure 5This is a schematic diagram of a chip during the cleaning process, provided as an embodiment of this application.
[0026] Figure 6 This is a schematic diagram of a chip during the cleaning process, provided as an embodiment of this application. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] The terms "first," "second," etc., used in the specification, embodiments, claims, and drawings of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or order. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can indicate three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item)" refers to one or more, and "more" refers to two or more. "Installation," "connection," "linking," etc., should be interpreted broadly, for example, it can be an electrical connection or a mechanical connection; it can be a fixed connection or a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium, or a connection within two elements. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, including a series of steps or units. Methods, systems, products, or equipment are not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or equipment. Terms such as “up,” “down,” “left,” and “right” are used only with respect to the orientation of components in the accompanying drawings. These directional terms are relative concepts used for relative description and clarification and may vary accordingly depending on the orientation of the components in the drawings.
[0029] In advanced packaging, such as 2.5D / 3D (dimensional) packaging, cleaning residues on the bottom of the die has become one of the most challenging problems.
[0030] Taking flux residue cleaning as an example, flux residue and underfill (UF) repel each other, easily causing cavitation during UF filling. This leaves the ubump at the bottom of the die without UF protection, leading to a higher risk of failure in subsequent processes, reliability, and service life. Therefore, solving the flux cleaning problem is urgent.
[0031] Currently, the most effective way to clean flux residue is to fill the bottom of the chip with the cleaning solution and ensure it flows freely. Existing cleaning devices only achieve this through high pressure and adjusted spray angles, as referenced... Figure 1 As shown, when the ubbuck spacing decreases further, the density increases, and the die gap increases to a certain extent, the benefits of simply increasing the flushing pressure are limited. Due to the presence of bubbles in the atmosphere, the flow resistance of the two-phase fluid increases significantly, and some bubbles may even become trapped in certain fixed areas (such as...). Figure 1 The increased die gap (in the p region) prevents the cleaning solvent from contacting the ubump surface, and the increased die gap also causes the pressure of the cleaning fluid to be dispersed, making it difficult to clean some areas.
[0032] Based on this, this application provides a novel chip cleaning device and cleaning method. By controlling the change in air pressure and using negative pressure, the cleaning fluid can fully enter the bottom of the die to encapsulate the ubump and avoid or reduce the generation of air bubbles at the bottom of the die. This can improve the cleaning efficiency (or cleaning capability) of the residue at the bottom of the chip and provide strong support for breakthroughs in ultra-high density interconnect packaging.
[0033] As illustrated, the cleaning process in this application embodiment may include:
[0034] First, a cleaning solution is sprayed onto the die surface at a low air pressure.
[0035] Then, increase the air pressure to allow the cleaning fluid to fully enter the bottom of the die and encapsulate the ubump, thus avoiding or reducing the generation of air bubbles at the bottom of the die.
[0036] Then, by rinsing, the flow and metabolism of the cleaning fluid at the bottom of the die are promoted, which facilitates the dissolution and removal of flux around the ubump.
[0037] Then, by rotating and blowing air, the water at the bottom of the die is metabolized and discharged.
[0038] The structure of the novel cleaning device provided in the embodiments of this application will be described in detail below.
[0039] Figure 2This is a schematic diagram of the structure of a novel cleaning device provided in an embodiment of this application, wherein (a) is a top view and (b) is a side view.
[0040] Figure 3 This is a schematic diagram of another novel cleaning device provided in an embodiment of this application, wherein (a) is a top view and (b) is a side view.
[0041] For illustrative purposes only, please refer to the following: Figure 2 , Figure 3 As shown in the figure, this application provides a novel cleaning device, which includes a cavity 1, a support platform 11, a rotating mechanism 12, a liquid jetting mechanism 13, a gas jetting mechanism 14, and a pressure control mechanism (not shown in the figure).
[0042] As illustrated, the cavity 1 can be a cavity structure that can be sealed and has good airtightness, thereby ensuring that the air pressure inside the cavity 1 is maintained at a set value to meet the cleaning requirements.
[0043] Continue to refer to Figure 2 , Figure 3 As shown, the aforementioned support platform 11 is located inside the cavity 1 and is used to support the chip D to be cleaned.
[0044] As illustrated, in some possible implementations, the support platform 11 may include an adsorption device, a fixing device, etc., to fix the chip to be cleaned and ensure the flatness of the support surface to prevent the chip from vibrating during rotation.
[0045] Continue to refer to Figure 2 , Figure 3 As shown, the rotating mechanism 12 is connected to the support platform 11 and is used to drive the support platform 11 to rotate.
[0046] As illustrated, in some possible implementations, the rotating mechanism 12 can be located at the bottom of the support platform 11. The rotating mechanism 12 can drive the support platform 11 to rotate, thereby driving the chip D to rotate. In this way, during the subsequent cleaning process, rotating the chip D can accelerate the discharge of cleaning fluid from the bottom of the chip.
[0047] This application does not impose any restrictions on the configuration of the aforementioned rotating mechanism 12; in practice, it can be selected and configured as needed.
[0048] As can be seen, in some possible implementations, the rotating mechanism 12 may include a rotating motor and related components or devices.
[0049] Continue to refer to Figure 2 , Figure 3As shown, the liquid spraying mechanism 13 is used to spray cleaning fluid onto the surface of chip D through a nozzle. The liquid spraying mechanism 13 can have a certain spraying pressure and can continuously and stably spray cleaning fluid.
[0050] In some possible implementations, the liquid jetting mechanism 13 can spray high-pressure cleaning fluid through nozzle n, for example, the pressure of the sprayed high-pressure cleaning fluid can reach over 100 psi. This allows for high-pressure rinsing of chip D, promoting the flow of cleaning fluid (water) between chips and on the chip bottom, improving the cleaning effect, and facilitating the removal of residues on the chip bottom. For details, please refer to the relevant descriptions in the subsequent cleaning methods.
[0051] As illustrated, in some possible implementations, the angle and position of the nozzle n in the liquid jetting mechanism 13 can be adjusted. For example, the angle between the nozzle n and the chip D can be adjusted to vary between 0 and 90°, the distance between the nozzle n and the chip in the vertical direction can be adjusted to vary between 0 and 500 mm, and the horizontal distance between the nozzle n and the rinsing position (such as the gap between two chips) can also be adjusted to vary between 0 and 500 mm. In this way, the tilt angle and position of the nozzle can be adjusted to achieve precise alignment as needed, thereby improving the cleaning efficiency of residues on the bottom of the chip.
[0052] Indicatively, in some possible implementations, the liquid jetting mechanism 13 may be equipped with a transmission mechanism, with the nozzle n connected to the transmission mechanism. During the cleaning process of the chip, the transmission mechanism can control the nozzle n to be precisely aligned, thereby improving the cleaning efficiency of residues on the bottom of the chip.
[0053] This application does not impose any restrictions on the configuration of the aforementioned transmission mechanism; in practice, it can be configured as needed.
[0054] For example, refer to Figure 2 As shown, in some possible implementations, the aforementioned transmission mechanism may include a slide rail 13a, a swing arm 13b, a power system, and a control system. The swing arm 13b is slidably connected to the slide rail 13a, and the nozzle n is slidably connected to the swing arm 13b. Both the swing arm 13b and the nozzle n are connected to the power system and the control system. Under the control of the control system, the power system can drive the swing arm 13b to slide left and right along the slide rail 13a, and the nozzle n to slide back and forth along the swing arm 13b. In this way, during the cleaning process, the alignment position of the nozzle n can be precisely controlled by the control system as needed.
[0055] For example, refer to Figure 3As shown, in some possible implementations, the aforementioned transmission mechanism may include a swing arm 13c, a power system, and a control system. One end of the swing arm 13c can be movably connected to the bracket, and the other end of the swing arm 13c is a free end. The nozzle n is movably connected to this free end, and this free end can rotate around the bracket. Both the swing arm 13c and the nozzle n are connected to the power system and the control system. Under the control of the control system, the swing arm 13c can be driven to rotate by the power system, and the nozzle n can be controlled to rotate. In this way, during the cleaning process, the alignment position of the nozzle n can be precisely controlled by the control system as needed.
[0056] Of course, the liquid injection mechanism 13 mentioned above may also include pipelines, electric pumps, etc., and can be set according to actual needs. This application does not impose any restrictions on this.
[0057] Continue to refer to Figure 2 , Figure 3 As shown, the gas injection mechanism 14 is used to inject gas onto the surface of chip D, thereby accelerating the discharge of cleaning fluid from the bottom of chip D.
[0058] Of course, the gas injection mechanism 14 may include a booster pump, pipeline, swing arm, nozzle, etc., and can be set as needed in practice. This application does not limit this.
[0059] Indicatively, in some possible implementations, the gas injection mechanism 14 may include a heating device that can heat the injected gas, thereby accelerating the drying of the bottom of the chip D while simultaneously accelerating the discharge of the cleaning fluid from the bottom of the chip D, thus improving cleaning efficiency.
[0060] This application does not restrict the type of gas injected by the gas injection mechanism 14; in practice, it can be set as needed.
[0061] For example, in some possible implementations, the gas injected by the gas injection mechanism 14 may be nitrogen.
[0062] For example, in some possible implementations, the gas injected by the gas injection mechanism 14 may be air.
[0063] For example, in some possible implementations, the gas injected by the gas injection mechanism 14 may be argon.
[0064] The above-mentioned air pressure control mechanism ( Figure 2 and Figure 3 (Not shown) is connected to cavity 1 and is used to adjust the air pressure inside cavity 1.
[0065] As illustrated, in some possible implementations, the aforementioned air pressure control mechanism may include an air extraction device and an air intake device, with an air extraction port a1 and an air intake port a2 provided on the cavity 1 (see reference). Figure 2 and Figure 3 (As shown). That is to say, the air extraction port a1 can be set on the side wall, top or bottom of the cavity 1, and the air inlet port a2 can also be set on the side wall, top or bottom of the cavity 1.
[0066] The air extraction device is connected to the air extraction port a1 through a pipeline. By controlling the air extraction device, the gas in the cavity 1 can be extracted, thereby reducing the air pressure in the cavity 1.
[0067] The air intake device is connected to the air intake port a2 through a pipeline. By controlling the air intake device, gas can be filled into the cavity 1, thereby increasing the air pressure in the cavity 1.
[0068] In other words, the amount of gas inside cavity 1 can be adjusted by using the air extraction device and the air intake device.
[0069] In this case, when cleaning the chip, the air extraction device can be controlled to extract the gas in the cavity 1, reducing the air pressure in the cavity 1, and spraying the cleaning liquid onto the chip surface under lower air pressure; then, the air intake device can be controlled to fill the cavity 1 with gas (such as nitrogen), increasing the air pressure in the cavity 1, thereby forming a negative pressure of "high outside and low inside", which forces the cleaning liquid into the bottom of the chip, allowing the cleaning liquid to fully enter the bottom of the chip and encapsulate the ubump, and avoid or reduce the generation of air bubbles at the bottom of the chip, thereby improving the efficiency of removing residues from the bottom of the chip.
[0070] This application does not restrict the configuration of the above-mentioned air extraction device and air intake device; in practice, the configuration can be selected and configured as needed.
[0071] As illustrated, in some possible implementations, the aforementioned evacuation device may include a vacuum pump and related components or devices.
[0072] As illustrated, in some possible implementations, the aforementioned air intake device may include a high-pressure air pump and related components or devices.
[0073] Additionally, the aforementioned chip cleaning apparatus may also include a drainage system, which may include a drain hole b (see reference). Figure 2 and Figure 3 As shown in the diagram, the system includes a drainage tank, a drainage pipe, etc., through which the cleaning solution after cleaning the chip can be discharged.
[0074] Of course, other mechanisms or devices can also be installed in this chip cleaning device. In practice, they can be set up as needed, and will not be elaborated here.
[0075] This application also provides a chip cleaning method, such as... Figure 4 As shown, the cleaning method may include:
[0076] Step 01: Place the chip on the support stage inside the cavity.
[0077] For illustrative purposes only, please refer to the following: Figure 2 or Figure 3 As shown, the chip D to be cleaned is placed on the support stage 11 inside the cavity 1 and fixed in place to ensure the flatness of the support stage and prevent vibration of the chip during subsequent rotation. Finally, the cavity 1 is sealed to ensure airtightness during the subsequent cleaning process.
[0078] Step 02: Control the air pressure inside cavity 1 to the first air pressure P1.
[0079] For illustrative purposes only, please refer to the following: Figure 2 or Figure 3 As shown, the air extraction device in the air pressure control mechanism can be controlled to extract the gas in the cavity 1 through the air extraction port a1, reducing the air pressure in the cavity 1 to below the ambient air pressure, that is, the first air pressure P1 is less than the ambient air pressure. Here, the ambient air pressure refers to the atmospheric pressure of the environment in which the equipment is located.
[0080] For example, in some possible implementations, the air pressure inside the cavity 1 can be controlled to be reduced to below 500 Torr, that is, the first air pressure P1 is less than or equal to 500 Torr, thereby ensuring that there is a small air pressure inside the cavity to better meet the requirements of negative pressure cleaning.
[0081] Step 03: Spray cleaning solution onto the chip surface.
[0082] For illustrative purposes only, please refer to the following: Figure 2 or Figure 3 As shown, the liquid spraying mechanism 13 sprays cleaning fluid onto the surface of chip D. The cleaning fluid can be water or other liquids. During the spraying process, the angle and size of the nozzle n in the liquid spraying mechanism 13 can be adjusted to control the direction and flow rate of the cleaning fluid, thereby ensuring cleaning efficiency.
[0083] In this case, combined Figure 5 As shown in (a), the cleaning solution (water) covers the surface and sides of chip D, while the areas between chips and at the bottom of the chip are low-pressure areas, where the cleaning solution (water) may not be able to penetrate completely.
[0084] Step 04: Control the air pressure inside cavity 1 to the second air pressure P2, which is greater than the first air pressure P1, that is, P2 > P1.
[0085] For illustrative purposes only, please refer to the following: Figure 2 or Figure 3As shown, the air intake device in the air pressure control mechanism can be controlled to inflate the cavity 1 through the air intake port a2, increasing the air pressure in the cavity 1 to above the ambient air pressure, so that the second air pressure P2 is greater than the first air pressure P1.
[0086] In this case, refer to Figure 5 As shown in (b), the increased external air pressure of chip D creates a pressure difference between the outside and inside, thus forcing the cleaning fluid (water) into the bottom of the chip and the low-pressure areas between the chips, achieving good filling of the ubumps. (Refer to...) Figure 5 As shown in (c).
[0087] This application does not impose any restrictions on the specific magnitude of the second air pressure P2, as long as the second air pressure P2 is higher than the first air pressure P1.
[0088] In some possible implementations, the pressure difference between the second pressure P2 and the first pressure P1 can be controlled to be above 200 Torr. This creates a larger pressure difference between the bottom and outer regions of the chip, allowing the cleaning fluid to fully penetrate the bottom of the chip and improving cleaning efficiency.
[0089] It is understandable that by increasing the air pressure inside the cavity from the first air pressure P1 to the second air pressure P2, a negative pressure environment with a high outer pressure and a low inner pressure can be formed at the bottom of the chip. This allows the cleaning fluid to enter the bottom of the chip and encapsulate the ubump, and avoids or reduces the generation of air bubbles at the bottom of the chip, which is more conducive to cleaning the residue at the bottom of the chip.
[0090] Step 05: Control the carrier platform to drive the chip to rotate and spray air onto the chip surface.
[0091] For illustrative purposes only, please refer to the following: Figure 2 or Figure 3 As shown, the rotating mechanism 12 can control the carrier platform 11 to rotate the chip D, and the gas injection mechanism 14 can be controlled to inject gas onto the surface of the chip D. Through spin drying and blowing, the cleaning fluid at the bottom of the chip is metabolically discharged. In practice, the flow rate and angle of the injected gas can be controlled as needed.
[0092] Indicatively, in some possible implementations, the gas injected by the gas injection mechanism 14 onto the surface of the chip D can be nitrogen, air, or argon, but is not limited to these.
[0093] As illustrated, in some possible implementations, the rotating mechanism 12 controls the carrier stage 11 to drive the chip D to rotate at a speed of over 300 rpm.
[0094] In some possible implementations, the gas injection mechanism 14 can be controlled to inject heated gas onto the surface of the chip D, thereby accelerating the drying of the bottom of the chip while simultaneously accelerating the discharge of the cleaning fluid from the bottom of the chip D, thus improving cleaning efficiency.
[0095] Furthermore, in some possible implementations, after step 04 above, a high-pressure cleaning solution, such as a cleaning solution with a pressure of 100 psi or higher, can be sprayed onto the chip surface. In this case, refer to... Figure 6 As shown, high-pressure rinsing can be performed on the gaps between chips D. High pressure can promote the flow of cleaning fluid (water) between chips and on the bottom of chips, thereby improving the cleaning effect and making it easier to remove residues from the bottom of chips.
[0096] Of course, after cleaning the chip, the cleaning solution can be drained through the drainage system. In practice, this can be set up as needed.
[0097] The cleaning method described in this application can be used to clean flux from packages with small ubump pitch and size, multiple chip combinations and small chip pitch, and can also clean various parts inside the chip and the gaps between chips.
[0098] The chip cleaning apparatus provided in this application is not limited to cleaning flux on the bottom of chips, but can also clean other residues. Of course, the cleaning apparatus provided in this application can also be used to clean other products besides chips, and this application makes no limitation thereto.
[0099] It should be understood that the sequence number of each of the above-mentioned production processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.
[0100] In addition, for other related contents in the above cleaning method, you can refer to the corresponding parts in the aforementioned cleaning device, which will not be repeated here; for other settings and structures in the aforementioned cleaning device, you can refer to the above cleaning method and related processes for adjustment, which will not be repeated here.
[0101] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A chip cleaning apparatus, characterized by, The chip cleaning device comprises: a cavity; a gas pressure control mechanism connected with the cavity, used for adjusting the gas pressure in the cavity; a supporting table located in the cavity, used for supporting a chip; a rotating mechanism connected with the supporting table, used for driving the supporting table to rotate; a liquid spraying mechanism, used for spraying cleaning liquid to the surface of the chip; a gas spraying mechanism, used for spraying gas to the surface of the chip.
2. The chip cleaning device according to claim 1, wherein the gas spraying mechanism comprises a heating device, used for heating the gas sprayed by the gas spraying mechanism.
3. The chip cleaning device according to claim 1 or 2, wherein the gas pressure adjusting mechanism comprises an air suction device and an air inlet device; the cavity is provided with an air inlet hole and an air outlet hole; the air inlet device can communicate with the cavity through the air inlet hole, and the air suction device can communicate with the cavity through the air outlet hole.
4. The chip cleaning device according to any one of claims 1-3, wherein the liquid spraying mechanism is also used for spraying cleaning liquid with a pressure of 100 psi or above to the surface of the chip.
5. The chip cleaning device according to any one of claims 1-4, wherein the liquid spraying mechanism comprises a nozzle, and the angle and position of the nozzle can be adjusted.
6. The chip cleaning device according to any one of claims 1-5, wherein the gas sprayed by the gas spraying mechanism comprises one or more of nitrogen, air or argon. The chip cleaning method comprises: placing a chip on a supporting table in a cavity; controlling the gas pressure in the cavity to be a first gas pressure, and spraying cleaning liquid to the surface of the chip; controlling the gas pressure in the cavity to be a second gas pressure; wherein the second gas pressure is greater than the first gas pressure; controlling the supporting table to drive the chip to rotate, and spraying gas to the surface of the chip.
7. A method of cleaning a chip, characterized by, 8. The chip cleaning method according to claim 7, wherein the first gas pressure is lower than the environmental gas pressure, and the second gas pressure is higher than the environmental gas pressure.
9. The chip cleaning method according to claim 7 or 8, wherein the step of controlling the gas pressure in the cavity to be a first gas pressure comprises: controlling the gas pressure in the cavity to be 500 Torr or below.
10. The chip cleaning method according to any one of claims 7-9, wherein after the step of controlling the gas pressure in the cavity to be a second gas pressure, the method further comprises: spraying cleaning liquid with a pressure of 100 psi or above to the surface of the chip.
11. The chip cleaning method according to any one of claims 7-10, wherein the gas pressure difference between the second gas pressure and the first gas pressure is 200 Torr or above.
12. The chip cleaning method according to any one of claims 7-11, wherein the step of controlling the supporting table to drive the chip to rotate comprises: controlling the rotating speed of the supporting table to drive the chip to be 300 rpm or above.
13. The chip cleaning method according to any one of claims 7-12, wherein the step of spraying gas to the surface of the chip comprises: spraying one or more of nitrogen, air, or argon gas onto the chip surface.
14. The chip cleaning method according to any one of claims 7-13, wherein, the spraying gas onto the chip surface includes: spraying heated gas onto the chip surface.