Ultraviolet-heat dual-curing adhesive with low thermal expansion coefficient, long storage period and high reworkability and application of ultraviolet-heat dual-curing adhesive
By adding amino-containing acrylate block copolymers and fillers to adhesives, the bonding stability and rework performance under high temperature changes are improved, solving the problems of easy cracking and poor stability of existing adhesives.
CN121343523APending Publication Date: 2026-01-16SHANGHAI YUNTONG ELECTRONIC TECH CO LTD +1
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Patent Information
- Application Number
- CN202511587124.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-03
- Publication Date
- 2026-01-16
AI Technical Summary
Technical Problem
Existing adhesives are prone to cracking under high temperature changes, leading to debonding at the bonding interface and drift in device performance. Furthermore, the addition of silica can affect stability and reworkability.
Method used
This UV-thermal dual-curing adhesive uses a low coefficient of thermal expansion. By adding amino-containing acrylate block copolymers and fillers, the coefficient of thermal expansion is synergistically reduced and the stability and reworkability are improved. The adhesive can be cured by both UV light and heat.
Benefits of technology
It effectively reduces the coefficient of thermal expansion, extends the shelf life, improves the stability and reworkability of adhesives, and reduces production costs.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to an ultraviolet-heat dual-curing adhesive with low thermal expansion coefficient, long storage period and high reworkability and application thereof, and belongs to the technical field of adhesives. The adhesive comprises the following components in parts by weight: 5-30 parts of epoxy resin, 5-30 parts of a reactive diluent, 1-10 parts of an acrylate block copolymer with amino groups, 50-80 parts of a filler, 0.5-3 parts of a cationic photoinitiator, 0.5-3 parts of a cationic thermal initiator, 0.05-3 parts of a photosensitizer and 0.1-3 parts of a thixotropic agent, the amino group content of the copolymer is 0.5-6.0 mmol / g, and the weight-average molecular weight of the copolymer is 50,000-150,000 g / mol. By adding the copolymer, the stability of the adhesive can be improved, and the storage period can be prolonged; and during repair heating, the adhesive can be softened and stripped on the premise of not damaging the precise base material, so that the repair performance of the adhesive is remarkably improved, and the production cost is reduced.
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