A steady-state junction-shell thermal resistance measurement method based on isostatic shell temperature control

CN121347592BActive Publication Date: 2026-05-26ZHEJIANG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ZHEJIANG UNIV
Filing Date
2025-12-19
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing methods for testing the thermal resistance of the crust have problems such as large measurement errors, cumbersome testing procedures, high equipment and time costs, poor stability of the cooling system, and difficulty in achieving uniform temperature distribution, resulting in a lack of repeatability and consistency in the measurement results.

Method used

A steady-state junction-shell thermal resistance measurement method with constant case temperature control is adopted. By adjusting the heat sink parameters under different module heating powers, the case temperature of the module under test is kept constant. The thermoelectric cooler is used to achieve temperature uniformity and cooling system stability. The steady-state junction-shell thermal resistance is extracted by combining the slope of the junction temperature-power curve, avoiding the error introduced by direct case temperature measurement.

Benefits of technology

It improves measurement accuracy and repeatability, simplifies operation procedures, reduces costs, is applicable to different packaging structures and cooling methods, has wide adaptability, and provides reliable and efficient measurement results.

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Abstract

This invention discloses a steady-state junction-shell thermal resistance measurement method based on isostatic shell temperature control, comprising the following steps: mounting the module under test (TBT) on a heat sink; setting a temperature sensor to detect the surface temperature of the TBT's shell to determine whether the shell temperature has reached a set value and remained stable; driving the TBT to generate heat and adjusting the heat sink to dissipate heat, so that the TBT reaches a thermal steady state; recording multiple data points of the TBT's junction temperature and heat generation power under multiple thermal steady-state conditions; and determining the slope of the junction temperature-heat generation power curve obtained by linear fitting as the TBT's junction-shell thermal resistance. This invention innovatively uses a thermoelectric cooler as the heat dissipation system during the testing process, fully utilizing its characteristics of fast response, good temperature uniformity, and high control precision to achieve high uniformity of the module shell surface temperature and improve the stability of the cooling system, thereby significantly enhancing the repeatability and robustness of the junction-shell thermal resistance test.
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