Device and method for evaluating transmission performance of ceramic tube shell of low-cost and high-efficiency transceiving assembly

Abstract

The invention belongs to the technical field of microwave radio frequency, and particularly relates to a low-cost and high-efficiency transmitting-receiving assembly ceramic tube shell transmission performance evaluation device and method. The system comprises a ceramic tube shell test module, the ceramic tube shell test module comprises a TR assembly ceramic tube shell and a ceramic dielectric-based microstrip chip circuit fixed in the TR assembly ceramic tube shell, and the characteristic impedance of the ceramic dielectric-based microstrip chip circuit is matched with the standard working impedance of the TR assembly ceramic tube shell; the TR assembly ceramic tube shell is provided with an input terminal and an output terminal, and the input terminal and the output terminal are respectively connected with the ceramic dielectric-based microstrip chip circuit through gold wires. The system further comprises a signal source and a vector network analyzer. A first VNA port of the vector network analyzer is connected with the input terminal through an input port transmission line. An output terminal is connected with a second VNA port of the vector network analyzer through an output port transmission line. A test signal generated by the signal source is output through a first VNA port of the vector network analyzer. The invention provides a low-cost and high-efficiency transmitting-receiving assembly ceramic tube transmission performance evaluation device and method.

Description

Technical Field

[0001] This invention belongs to the field of microwave radio frequency technology, and specifically relates to a low-cost, high-efficiency transceiver component ceramic tube shell transmission performance evaluation device and method. Background Technology

[0002] With the rapid development of modern wireless communication, radar systems and electronic countermeasures technologies, the performance requirements of high-frequency, high-power TR (Transmit / Receive) components are becoming increasingly stringent. Among them, the ceramic housing, as a key packaging structure of TR components, not only plays a role in protecting the internal chip and providing stable mechanical support, but also directly affects the RF performance of the entire component, such as key indicators like the standing wave characteristics of signal transmission, insertion loss and power capacity.

[0003] In traditional testing methods, evaluating the RF performance of ceramic packages typically requires assembling the actual chip inside the package and then indirectly inferring the package's RF characteristics by measuring the overall module's performance. However, this method has several drawbacks: First, the use of high-cost microwave chips, including compound semiconductor devices such as GaAs and GaN, for each test results in high testing costs, especially during large-scale production or multiple iterations of verification in the R&D phase, significantly increasing the economic burden. Second, performance fluctuations, manufacturing deviations, and even potential defects in the active chip itself can introduce additional testing errors. For example, chip gain unevenness and matching network differences can all be coupled into the test results, making it difficult to accurately isolate and evaluate the package's own RF characteristics. In addition, traditional methods are significantly lacking in testing flexibility, unable to conduct independent and efficient specialized verification of specific RF parameters of the package (such as high-frequency resonant modes and multi-port coupling effects), leading to extended R&D cycles and a lack of accurate data support for design optimization. Currently, with the rapid development of 5G communication, millimeter-wave radar and terahertz technology, the operating frequency of ceramic tubes is constantly extending to higher frequency bands (such as Ka band, W band and even higher). Even slight differences in their radio frequency performance can have a significant impact on the overall system performance. Therefore, the industry urgently needs a low-cost, high-precision and highly repeatable radio frequency performance testing method for ceramic tubes without relying on active chips.

[0004] While some existing technologies have attempted to use passive test structures, such as coaxial connectors or waveguide fixtures for tube and shell testing, these methods often result in significant deviations between the test results and actual application scenarios due to impedance discontinuities and mode conversion losses introduced by interface conversion. Although design verification based on simulation software can partially replace physical testing, the simulation results may still differ significantly from the actual test results due to factors such as material parameters and process fluctuations, and cannot completely replace physical testing.

[0005] To address the aforementioned technical challenges, this invention proposes an innovative solution. By employing a precisely designed microstrip through-test circuit combined with advanced de-embedding calibration technology, high-precision evaluation of the RF performance of ceramic packaged circuits can be achieved. This not only significantly reduces testing costs but also substantially improves the accuracy and reliability of test results, providing strong technical support for the design, manufacturing, and quality control of high-frequency electronic packaging. Summary of the Invention

[0006] To address the aforementioned problems in the existing technology, the present invention aims to provide a low-cost, high-efficiency device and method for evaluating the transmission performance of ceramic-cased transceiver components. This method enables high-precision evaluation of the radio frequency performance of ceramic-cased components, significantly reducing testing costs and improving the accuracy and reliability of test results. It also provides strong technical support for the design, manufacturing, and quality control of high-frequency electronic packaging.

[0007] The technical solution adopted in this invention is as follows: A low-cost, high-efficiency transceiver component ceramic housing transmission performance evaluation device includes a ceramic housing test module. The ceramic housing test module includes a TR component ceramic housing and a ceramic dielectric-based microstrip circuit fixed inside the TR component ceramic housing. The characteristic impedance of the ceramic dielectric-based microstrip circuit is matched with the standard operating impedance of the TR component ceramic housing. The TR component ceramic housing is provided with input terminals and output terminals, which are respectively connected to the ceramic dielectric-based microstrip circuit through gold wires. It also includes a signal source and a vector network analyzer. The first VNA port of the vector network analyzer is connected to the input terminal through the input port transmission line, and the output terminal is connected to the second VNA port of the vector network analyzer through the output port transmission line. The test signal generated by the signal source is output through the first VNA port of the vector network analyzer and fed into the ceramic tube shell test module through the input port transmission line. The signal transmitted through the ceramic tube shell test module is led out through the output port transmission line and finally returned to the second VNA port of the vector network analyzer to complete the signal acquisition.

[0008] The ceramic housing test module of this invention adopts a two-layer structure design, including a TR component ceramic housing and a matching ceramic dielectric-based microstrip circuit. The ceramic dielectric-based microstrip circuit is fabricated using a thin-film deposition process, and its input and output terminals are interconnected with the input and output terminals of the TR component ceramic housing via gold wire bonding, respectively, achieving low-loss interconnection. During testing, the RF signal is introduced through the input terminal, transmitted through the gold wire to the ceramic dielectric-based microstrip circuit, and finally output through the output terminal, forming a complete through-test path. This structural design ensures the continuity of the signal transmission path and impedance matching characteristics, providing a reliable test platform for accurately evaluating the RF performance of the ceramic housing.

[0009] The test signal generated by the signal source is output through the first VNA port of the vector network analyzer and fed into the input terminal of the ceramic tube shell test module through the input port transmission line; the signal transmitted through the device under test is led out through the output port transmission line and finally returned to the second VNA port of the vector network analyzer to complete the signal acquisition.

[0010] After the system is assembled, the RF test program is started. The ceramic housing test module is subjected to full parameter scanning test by a vector network analyzer. Several key RF performance indicators, including voltage standing wave ratio (VSWR) and insertion loss, are collected and recorded in real time.

[0011] This invention, through an innovative passive testing system, completely eliminates the reliance on expensive active chips in traditional testing. Testing can be completed using only a precisely designed ceramic dielectric-based microstrip chip circuit, reducing the cost of a single test by more than 60% and significantly improving the economic efficiency of testing.

[0012] This invention, through its modular testing platform design and standardized operating procedures, reduces the time for a single test to less than 10 minutes and improves testing efficiency by more than 5 times, making it particularly suitable for rapid testing needs in mass production.

[0013] The innovative microstrip through-test structure of this invention can comprehensively evaluate the RF characteristics of ceramic housings over a wide frequency range, including key indicators such as VSWR, insertion loss, and return loss. The test frequency band coverage is three times wider than that of traditional methods.

[0014] This invention has good versatility and scalability. By replacing the ceramic dielectric-based microstrip circuit with one of different specifications, it can be applied to the testing of ceramic housings of TR components of various sizes and interface types, and has a wide range of applications.

[0015] As a preferred embodiment of the present invention, the ceramic dielectric-based microstrip circuit adopts a low-loss ceramic substrate material with a dielectric constant of 3.5±0.05 and a loss tangent of ≤0.002, ensuring that the influence of substrate dielectric loss on the test results is negligible.

[0016] As a preferred embodiment of the present invention, the characteristic impedance of the ceramic dielectric-based microstrip circuit is 50±0.5Ω, the microstrip line width of the ceramic dielectric-based microstrip circuit is 1.15±0.01mm, the microstrip line thickness of the ceramic dielectric-based microstrip circuit is 0.508±0.005mm, and the voltage standing wave ratio of the ceramic dielectric-based microstrip circuit is below 1.05.

[0017] As a preferred embodiment of the present invention, the ceramic dielectric-based microstrip circuit adopts a gold surface treatment process with a plating thickness ≥2μm, thereby controlling the insertion loss at an extremely low level of 0.02dB / cm@10GHz.

[0018] This near-ideal transmission characteristic design reduces the test error introduced by the ceramic dielectric microstrip circuit itself to a negligible range (<1%), thereby ensuring that the final test results (including S-parameters, group delay, and other indicators) can truly reflect the intrinsic RF performance of the TR component ceramic package, providing high-precision test data with an error of less than ±0.1dB for product development and quality control.

[0019] In a preferred embodiment of the present invention, a test base is also included, on which the ceramic tube shell test module is mounted. The test base serves as a system support platform, on which the ceramic tube shell test module is precisely mounted.

[0020] A method for evaluating the transmission performance of low-cost, high-efficiency transceiver components in ceramic tube housings includes the following steps: S1: Design a matching ceramic dielectric-based microstrip circuit based on the interface size of the ceramic housing of the TR component under test and the test frequency band requirements. S2: Fabricate ceramic dielectric-based microstrip circuits, matching the characteristic impedance of the ceramic dielectric-based microstrip circuits with the standard operating impedance of the ceramic housing of the TR component. S3: Align and fix the ceramic dielectric microstrip circuit inside the ceramic housing of the TR component, so that the two ends of the transmission line of the ceramic dielectric microstrip circuit are connected to the input terminal and the output terminal of the ceramic housing of the TR component, respectively, to form a complete direct signal path. S4: Perform pre-test calibration using a vector network analyzer; S5: Connect the assembled ceramic tube shell test module to the vector network analyzer, scan and measure the S-parameters in the target frequency band, and obtain key indicators including VSWR, insertion loss and return loss. S6: Compare the original test data with the background data of the de-embedded ceramic dielectric microstrip circuit to extract the independent RF characteristics of the TR component ceramic package.

[0021] This invention completely eliminates the reliance on expensive active chips in traditional testing through an innovative passive testing method. Testing can be completed using only a precisely designed microstrip test circuit, reducing the cost of a single test by more than 60% and significantly improving the economic efficiency of testing.

[0022] This invention employs a unique de-embedding calibration technique and impedance matching optimization design, which effectively eliminates errors introduced by the test system itself, improving the test accuracy to the ±0.05dB level, far exceeding the ±0.5dB accuracy of traditional methods, thus ensuring the reliability of the test results.

[0023] As a preferred embodiment of the present invention, in step S4, short-circuit-open-circuit-load-straight-through calibration is used to eliminate errors in the test cable and connector; the individual S-parameters of the microstrip sheet are measured as background data, and their influence is subsequently subtracted from the overall test results to isolate the true performance of the casing.

[0024] As a preferred embodiment of the present invention, step S6 specifically involves: firstly, performing a vector subtraction operation between the original test data obtained in step S5 and the pre-stored background data of the ceramic dielectric-based microstrip circuit after de-embedding processing to eliminate the systematic errors introduced by the test fixture and interconnect structure; then, using frequency domain de-embedding technology, performing data calibration processing point by point within the entire test frequency band from 1MHz to 40GHz, and finally extracting independent RF characteristic parameters that only reflect the performance of the ceramic housing of the TR component.

[0025] As a preferred embodiment of the present invention, the independent radio frequency characteristic parameters of the ceramic housing performance of the TR component include the intrinsic insertion loss of the housing, the characteristic impedance variation curve, and the equivalent dielectric constant.

[0026] As a preferred embodiment of the present invention, step S6 further includes: locating the position of the impedance discontinuity point inside the ceramic tube shell of the TR component through time-domain reflection analysis, comparing it with the design specifications, and determining whether the ceramic tube shell of the TR component meets the parameter requirements including standing wave ratio and loss within the frequency band.

[0027] The beneficial effects of this invention are as follows: 1. This invention, through an innovative passive testing system and method, completely eliminates the reliance on expensive active chips in traditional testing. Testing can be completed using only a precisely designed ceramic dielectric-based microstrip chip circuit, reducing the cost of a single test by more than 60% and significantly improving the economic efficiency of testing.

[0028] 2. This invention employs a unique de-embedding calibration technique and impedance matching optimization design, which effectively eliminates the errors introduced by the test system itself, improving the test accuracy to the ±0.05dB level, far exceeding the ±0.5dB accuracy of traditional methods, thus ensuring the reliability of the test results.

[0029] 3. Through modular testing platform design and standardized operating procedures, this invention reduces the testing time to less than 10 minutes per test and improves testing efficiency by more than 5 times, making it particularly suitable for rapid testing needs in mass production.

[0030] 4. The innovative microstrip through-test structure of this invention can comprehensively evaluate the RF characteristics of ceramic housings over a wide frequency range, including key indicators such as VSWR, insertion loss, and return loss. The test frequency band coverage is expanded by 3 times compared with traditional methods.

[0031] 5. This invention has good versatility and scalability. By replacing the ceramic dielectric-based microstrip circuit with one of different specifications, it can be applied to the testing of ceramic housings of TR components of various sizes and interface types, and has a wide range of applications. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a top view of the ceramic tube shell test module; Figure 3 yes Figure 2 A cross-sectional view along the AA direction.

[0033] In the diagram: 1-Ceramic tube housing test module; 2-Signal source; 3-First VNA port; 4-Second VNA port; 5-Input port transmission line; 6-Output port transmission line; 7-Test base; 8-Gold wire; 11-TR component ceramic tube housing; 12-Ceramic dielectric microstrip circuit; 111-Input terminal; 112-Output terminal. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the invention can be combined with each other.

[0036] like Figures 1-3 As shown, the low-cost, high-efficiency transceiver component ceramic housing transmission performance evaluation device of this embodiment includes a ceramic housing test module 1. The ceramic housing test module 1 includes a TR component ceramic housing 11 and a ceramic dielectric microstrip circuit 12 fixed inside the TR component ceramic housing 11. The characteristic impedance of the ceramic dielectric microstrip circuit 12 is matched with the standard operating impedance of the TR component ceramic housing 11. The TR component ceramic housing 11 is provided with an input terminal 111 and an output terminal 112. The input terminal 111 and the output terminal 112 are respectively connected to the ceramic dielectric microstrip circuit 12 through gold wires 8. It also includes a signal source 2 and a vector network analyzer. The first VNA port 3 of the vector network analyzer is connected to the input terminal 111 via the input port transmission line 5, and the output terminal 112 is connected to the second VNA port 4 of the vector network analyzer via the output port transmission line 6. The test signal generated by the signal source 2 is output through the first VNA port 3 of the vector network analyzer and fed into the ceramic tube shell test module 1 via the input port transmission line 5. The signal transmitted by the ceramic tube shell test module 1 is led out by the output port transmission line 6 and finally returned to the second VNA port 4 of the vector network analyzer to complete the signal acquisition. It also includes a test base 7, on which the ceramic tube shell test module 1 is mounted.

[0037] The ceramic housing test module 1 of this invention adopts a two-layer structure design, including a TR component ceramic housing 11 and a matching ceramic dielectric microstrip circuit 12. The ceramic dielectric microstrip circuit 12 is fabricated using a thin-film deposition process, and its input terminal 111 and output terminal 112 are bonded to the input terminal 111 and output terminal 112 of the TR component ceramic housing 11 via gold wires 8, respectively, achieving low-loss interconnection. During testing, the radio frequency signal is introduced through the input terminal 111, transmitted through the gold wires 8 to the ceramic dielectric microstrip circuit 12, and finally output through the output terminal 112, forming a complete through-test path. This structural design ensures the continuity of the signal transmission path and impedance matching characteristics, providing a reliable test platform for accurately evaluating the radio frequency performance of the ceramic housing.

[0038] The test signal generated by signal source 2 is output through the first VNA port 3 of the vector network analyzer and fed into the input terminal of ceramic tube shell test module 1 through the input port transmission line 5; the signal transmitted through the device under test is led out through the output port transmission line 6 and finally returned to the second VNA port 4 of the vector network analyzer to complete signal acquisition.

[0039] After the system is assembled, the RF test program is started. The ceramic housing test module 1 is subjected to full parameter scanning test by a vector network analyzer. Multiple key RF performance indicators, including voltage standing wave ratio (VSWR) and insertion loss, are collected and recorded in real time.

[0040] This invention, through an innovative passive testing system, completely eliminates the reliance on expensive active chips in traditional testing. Testing can be completed using only a precisely designed ceramic dielectric microstrip chip circuit 12, reducing the cost of a single test by more than 60% and significantly improving the economic efficiency of testing.

[0041] This invention, through its modular testing platform design and standardized operating procedures, reduces the time for a single test to less than 10 minutes and improves testing efficiency by more than 5 times, making it particularly suitable for rapid testing needs in mass production.

[0042] The innovative microstrip through-test structure of this invention can comprehensively evaluate the RF characteristics of ceramic housings over a wide frequency range, including key indicators such as VSWR, insertion loss, and return loss. The test frequency band coverage is three times wider than that of traditional methods.

[0043] This invention has good versatility and scalability. By replacing the ceramic dielectric-based microstrip circuit 12 with one of different specifications, it can be applied to the testing of TR component ceramic housings 11 of various sizes and interface types, and has a wide range of applications.

[0044] In this invention, the ceramic dielectric-based microstrip chip circuit 12 serves as a key test medium. Its core function is to construct a test channel that approximates an ideal transmission environment, thereby achieving accurate characterization of the RF performance of the TR component's ceramic housing 11. This microstrip chip circuit ensures test accuracy through the following technical means: 1) The ceramic dielectric-based microstrip circuit 12 uses a low-loss ceramic substrate material (dielectric constant 3.5±0.05, loss tangent ≤0.002) to ensure that the influence of substrate dielectric loss on the test results is negligible.

[0045] 2) Implement strict impedance control design (characteristic impedance 50±0.5Ω), and optimize the voltage standing wave ratio (VSWR) to below 1.05 by precisely controlling the microstrip line width (1.15±0.01mm) and thickness (0.508±0.005mm).

[0046] 3) By employing a gold surface treatment process (coating thickness ≥ 2 μm), the insertion loss is controlled at an extremely low level of 0.02 dB / cm @ 10 GHz.

[0047] This near-ideal transmission characteristic design reduces the test error introduced by the microstrip circuit itself to a negligible range (<1%), thereby ensuring that the final test results (including S-parameters, group delay, and other indicators) can truly reflect the intrinsic RF performance of the TR component ceramic housing 11, providing high-precision test data with an error of less than ±0.1dB for product development and quality control.

[0048] The transmission loss is reduced by optimizing parameters such as the microstrip line width and dielectric thickness of the ceramic dielectric-based microstrip circuit 12. Soldering areas or contact structures corresponding to the pins of the ceramic housing 11 of the TR component are provided at both ends of the microstrip of the ceramic dielectric-based microstrip circuit 12 to ensure reliable connection.

[0049] The testing system in this embodiment mainly includes the following components: Vector Network Analyzer (VNA): Model Keysight N5227B, test frequency range 10MHz~67GHz; Test base 7: Made of aluminum alloy and equipped with a precision positioning mechanism (positioning accuracy ±10μm). Ceramic dielectric-based microstrip circuit 12: Rogers 4350B high-frequency substrate (dielectric constant 3.48, thickness 0.508mm), microstrip line width 1.15mm (50Ω impedance matching); Calibration kit: Includes SOLT (Short-Open-Load-Straight) calibration kit; The ceramic housing 11 of the TR component under test.

[0050] The method for evaluating the transmission performance of low-cost, high-efficiency transceiver components in ceramic tube housings according to this embodiment includes the following steps: S1: Based on the interface size and test frequency band requirements of the ceramic housing 11 of the TR component under test, design a matching ceramic dielectric-based microstrip circuit 12; S2: Fabricate ceramic dielectric-based microstrip circuit 12, the characteristic impedance of ceramic dielectric-based microstrip circuit 12 is matched with the standard operating impedance of TR component ceramic housing 11; S3: Align and fix the ceramic dielectric microstrip circuit 12 inside the ceramic housing 11 of the TR component, so that the two ends of the transmission line of the ceramic dielectric microstrip circuit 12 are connected to the input terminal 111 and the output terminal 112 of the ceramic housing 11 of the TR component, respectively, to form a complete direct signal path. S4: Perform pre-test calibration using a vector network analyzer; S5: Connect the assembled ceramic tube shell test module 1 to the vector network analyzer, scan and measure the S-parameters in the target frequency band, and obtain key indicators such as standing wave ratio, insertion loss and return loss. S6: Compare the original test data with the background data of the de-embedded ceramic dielectric microstrip circuit 12 to extract the independent RF characteristics of the TR component ceramic housing 11.

[0051] This invention completely eliminates the reliance on expensive active chips in traditional testing through an innovative passive testing method. Testing can be completed using only a precisely designed microstrip test circuit, reducing the cost of a single test by more than 60% and significantly improving the economic efficiency of testing.

[0052] This invention employs a unique de-embedding calibration technique and impedance matching optimization design, which effectively eliminates errors introduced by the test system itself, improving the test accuracy to the ±0.05dB level, far exceeding the ±0.5dB accuracy of traditional methods, thus ensuring the reliability of the test results.

[0053] In step S3, the input and output terminals of the ceramic dielectric-based microstrip circuit 12 are interconnected with low loss via gold wire bonding to ensure signal transmission continuity. The ceramic dielectric-based microstrip circuit 12 is fabricated using a thin-film deposition process.

[0054] Basic RF performance tests were performed on the bare ceramic dielectric-based microstrip circuit 12 using a vector network analyzer. Background data of the ceramic dielectric-based microstrip circuit 12.

[0055] In step S4, short-circuit-open-load-straight-through calibration is used to eliminate errors in the test cables and connectors; the individual S-parameters of the microstrip are measured as background data, which are subsequently subtracted from the overall test results to isolate the true performance of the casing.

[0056] Step S6 specifically involves: First, performing vector subtraction between the raw test data obtained in step S5 and the pre-stored background data of the ceramic dielectric-based microstrip circuit 12 after de-embedding processing to eliminate systematic errors introduced by the test fixture and interconnect structure; then, employing frequency domain de-embedding technology, performing point-by-point data calibration processing across the entire test frequency band from 1MHz to 40GHz, and finally extracting independent RF characteristic parameters that reflect only the performance of the TR component ceramic housing 11. These independent RF characteristic parameters of the TR component ceramic housing 11 include the housing's intrinsic insertion loss, characteristic impedance variation curve, and equivalent dielectric constant.

[0057] Step S6 also includes: locating the position of the impedance discontinuity point inside the TR component ceramic housing 11 through time-domain reflection analysis, comparing it with the design specifications, and determining whether the TR component ceramic housing 11 meets the parameter requirements including in-band standing wave and loss.

[0058] This invention constitutes a low-cost, high-efficiency, and high-precision ceramic-cased radio frequency performance testing solution, providing strong technical support for the research, development, production, and quality control of TR components, and has significant economic benefits and application value.

[0059] This invention is not limited to the above-described optional embodiments. Anyone can derive other various forms of products under the guidance of this invention. However, regardless of any changes made in their shape or structure, any technical solution that falls within the scope of the claims of this invention shall be protected by this invention.

Claims

1. A low-cost, high-efficiency transceiver component ceramic tube shell transmission performance evaluation device, characterized in that: The ceramic package test module (1) comprises a TR component ceramic package (11) and a ceramic dielectric substrate microstrip circuit (12) fixed in the TR component ceramic package (11), and the characteristic impedance of the ceramic dielectric substrate microstrip circuit (12) is matched with the standard working impedance of the TR component ceramic package (11); the TR component ceramic package (11) is provided with an input terminal (111) and an output terminal (112), and the input terminal (111) and the output terminal (112) are connected with the ceramic dielectric substrate microstrip circuit (12) through gold wires (8) respectively; The signal source (2) and the vector network analyzer are further included, the first VNA port (3) of the vector network analyzer is connected with the input terminal (111) through the input port transmission line (5), and the output terminal (112) is connected with the second VNA port (4) of the vector network analyzer through the output port transmission line (6); the test signal generated by the signal source (2) is output through the first VNA port (3) of the vector network analyzer and fed into the ceramic package test module (1) through the input port transmission line (5); the signal transmitted through the ceramic package test module (1) is led out through the output port transmission line (6) and finally returned to the second VNA port (4) of the vector network analyzer to complete signal acquisition.

2. The low-cost high-efficiency transceiver package ceramic tube evaluation device of claim 1, wherein: The ceramic dielectric substrate microstrip circuit (12) adopts a low-loss ceramic substrate material, the dielectric constant of the low-loss ceramic substrate material is 3.5±0.05, and the loss tangent of the low-loss ceramic substrate material is ≤0.

002.

3. The low-cost high-efficiency transceiver package ceramic tube evaluation device of claim 1, wherein: The characteristic impedance of the ceramic dielectric substrate microstrip circuit (12) is 50±0.5Ω, the width of the microstrip line of the ceramic dielectric substrate microstrip circuit (12) is 1.15±0.01mm, the thickness of the microstrip line of the ceramic dielectric substrate microstrip circuit (12) is 0.508±0.005mm, and the voltage standing wave ratio of the ceramic dielectric substrate microstrip circuit (12) is 1.05 or less.

4. The low cost high efficiency transceiver package ceramic tube evaluation device of claim 1, wherein: The ceramic dielectric substrate microstrip circuit (12) adopts a gold surface treatment process, and the thickness of the plating layer is ≥2μm.

5. The low cost high efficiency transceiver package ceramic tube evaluation device of claim 1, wherein: The test base (7) is further included, and the ceramic package test module (1) is installed on the test base (7).

6. The method for evaluating the transmission performance of the low-cost high-efficiency transceiver assembly ceramic package, using the low-cost high-efficiency transceiver assembly ceramic package transmission performance evaluation device according to any one of claims 1 to 5, characterized in that: The following steps are included: S1: according to the interface size and test frequency band requirement of the TR component ceramic package (11) to be tested, a matched ceramic dielectric substrate microstrip circuit (12) is designed; S2: the ceramic dielectric substrate microstrip circuit (12) is manufactured, and the characteristic impedance of the ceramic dielectric substrate microstrip circuit (12) is matched with the standard working impedance of the TR component ceramic package (11); S3: the ceramic dielectric substrate microstrip circuit (12) is aligned and fixed in the TR component ceramic package (11), so that the transmission lines at both ends of the ceramic dielectric substrate microstrip circuit (12) are connected with the input terminal (111) and the output terminal (112) of the TR component ceramic package (11) respectively, and a complete straight signal path is formed; S4: the vector network analyzer is used for pre-test calibration. S5: the assembled ceramic package test module (1) is connected to a vector network analyzer, and S parameters are measured by scanning in a target frequency band to obtain key indicators including standing wave ratio, insertion loss and return loss; S6: original test data is compared with background data of the ceramic medium-based microstrip circuit (12) after de-embedding to extract independent radio frequency characteristics of the TR component ceramic package (11).

7. The method for evaluating the transmission performance of a low-cost high-efficiency transceiver assembly ceramic package according to claim 6, characterized in that: In step S4, short-circuit-open-load-through calibration is used to eliminate errors of test cables and connectors.

8. The method for evaluating the transmission performance of a low-cost high-efficiency transceiver package ceramic tube shell according to claim 6, characterized in that: Step S6 specifically includes: firstly, performing vector subtraction operation on the original test data obtained in step S5 and the pre-stored background data of the ceramic medium-based microstrip circuit (12) after de-embedding to eliminate system errors introduced by test fixtures and interconnection structures; then, using frequency domain de-embedding technology, data calibration processing is performed point by point in the whole test frequency band of 1 MHz-40 GHz, and finally independent radio frequency characteristic parameters reflecting only the performance of the TR component ceramic package (11) are extracted.

9. The method for evaluating the transmission performance of a low-cost high-efficiency transceiver package ceramic tube shell according to claim 8, characterized in that: The independent radio frequency characteristic parameters of the TR component ceramic package (11) include package intrinsic insertion loss, characteristic impedance variation curve and equivalent dielectric constant.

10. The method of claim 6, wherein the method further comprises: determining the transmission performance of the low-cost high-efficiency transceiver assembly ceramic package by: applying a voltage to the low-cost high-efficiency transceiver assembly ceramic package; and measuring the current through the low-cost high-efficiency transceiver assembly ceramic package. Step S6 further includes: locating the position of impedance discontinuity points in the TR component ceramic package (11) through time domain reflection analysis, comparing design indicators, and determining whether the TR component ceramic package (11) meets the parameter requirements including in-band standing wave and loss.

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