Preparation method of display panel and display panel

Abstract

The invention belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel, and the preparation method of the display panel comprises the following steps: providing a substrate, and forming a light-emitting functional layer and a packaging layer covering the light-emitting functional layer on the substrate; forming a patterned shading piece and a patterned filtering color resistor on the packaging layer, wherein the shading piece and the filtering color resistor are arranged adjacently; the shading part and the filtering color resistors are irradiated by laser, so that the shading part absorbs laser energy and generates heat energy, and the heat energy promotes the adjacent filtering color resistors to be cured. While the color filter layer is effectively cured, the damage to the light-emitting functional layer caused by the heat effect in the curing process is reduced, and the product performance and reliability are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. BACKGROUND

[0002] With the development of display technology, an organic light-emitting diode structure of Color Filter on Encapsulation (COE) is born on the thin film encapsulation layer. The structure aims to replace the polarizer with an integrated color filter, thereby significantly improving the light transmittance of the panel and helping to achieve better display effect and thinner product design.

[0003] However, there are significant challenges in the process of curing the color filter layer in the manufacturing process of the COE structure. The heat required in the curing process is extremely easy to cause thermal damage to the underlying light-emitting functional layer, which severely limits the range of available materials and the process window, thereby restricting the further development and application of the technology. SUMMARY

[0004] The purpose of the present application is to provide a preparation method of a display panel and the display panel, which can effectively cure the color filter layer while reducing the damage to the light-emitting functional layer caused by the thermal effect in the curing process, and improve the product performance and reliability.

[0005] The first aspect of the present application provides a preparation method of a display panel, comprising: providing a substrate, the substrate being formed with a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer; forming a patterned light-shielding member and a patterned light-filtering color resist on the encapsulation layer, the light-shielding member being arranged adjacent to the light-filtering color resist; irradiating the light-shielding member and the light-filtering color resist with laser light, so that the light-shielding member absorbs laser energy and generates heat energy, and the heat energy causes the light-filtering color resist adjacent thereto to be cured.

[0006] In an exemplary embodiment of the present application, in the step of laser irradiation, the laser light is irradiated at an inclined angle relative to the surface of the encapsulation layer, and the light-shielding member is configured to shield the laser light from irradiating the light-emitting functional layer.

[0007] In an exemplary embodiment of the present application, the angle between the irradiation direction of the laser light and the surface of the encapsulation layer is α, the height of the light-shielding member is h, and the distance between two adjacent light-shielding members is L, wherein α satisfies: .

[0008] In an exemplary embodiment of the present application, the step of forming the patterned light-blocking member on the encapsulation layer comprises: applying a light-blocking material on the encapsulation layer; performing a first solidification treatment on the applied light-blocking material to form a pre-solidified light-blocking material layer; performing a patterning treatment on the pre-solidified light-blocking material layer to form the patterned light-blocking member; and performing a second solidification treatment on the patterned light-blocking member by laser irradiation.

[0009] In an exemplary embodiment of the present application, the step of performing laser irradiation on the patterned light-blocking member comprises: performing a first laser irradiation on the light-blocking member at a first oblique angle; and performing a second laser irradiation on the light-blocking member at a second oblique angle; wherein the irradiation direction of the first laser irradiation is symmetrical to the irradiation direction of the second laser irradiation relative to the normal direction of the light-blocking member.

[0010] In an exemplary embodiment of the present application, the step of forming the patterned light-blocking member on the encapsulation layer comprises: applying a light-blocking material on the encapsulation layer; performing a first solidification treatment on the applied light-blocking material to form a pre-solidified light-blocking material layer; performing a patterning treatment on the pre-solidified light-blocking material layer to form the patterned light-blocking member; and performing a second solidification treatment on the patterned light-blocking member by laser irradiation.

[0011] In an exemplary embodiment of the present application, the step of performing laser irradiation on the patterned light-blocking member comprises: performing a first laser irradiation on the light-blocking member at a first oblique angle; and performing a second laser irradiation on the light-blocking member at a second oblique angle; wherein the irradiation direction of the first laser irradiation is symmetrical to the irradiation direction of the second laser irradiation relative to the normal direction of the light-blocking member.

[0012] In an exemplary embodiment of the present application, the step of providing a substrate having a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer comprises: forming a first inorganic encapsulation layer on the light-emitting functional layer; forming an organic encapsulation layer on the first inorganic encapsulation layer; performing a patterning treatment on the organic encapsulation layer to form a recessed portion in a region corresponding to the light-blocking member; and forming a second inorganic encapsulation layer on the organic encapsulation layer having the recessed portion; wherein the light-blocking member is formed in the recessed portion of the encapsulation layer.

[0013] In an example embodiment of the present application, in the step of forming the patterned light-blocking member and the patterned color filter resist on the encapsulation layer, the patterned light-blocking member and the patterned color filter resist are respectively subjected to pre-curing treatment; and the step of making the light-blocking member absorb laser energy and generate heat energy by laser irradiation is performed after the light-blocking member and the color filter resist are both subjected to pre-curing treatment.

[0014] The second aspect of the present application provides a display panel, comprising: a substrate; a light-emitting functional layer disposed on the substrate; an encapsulation layer covering the light-emitting functional layer; a color filter layer disposed on a side of the encapsulation layer away from the substrate, the color filter layer comprising a light-blocking member and a color filter resist located between adjacent light-blocking members; wherein the light-blocking member is configured to be able to absorb laser energy and generate heat energy, and the heat energy generated by the light-blocking member can be transmitted to the color filter resist adjacent thereto.

[0015] The display panel preparation method and the display panel of the present application have at least the following beneficial effects: The display panel preparation method provided by the present application uses laser to irradiate the patterned light-blocking member and the color filter resist adjacent thereto at the same time, so that the color filter resist can obtain the energy required for curing through two paths at the same time: one is to directly absorb part of the laser irradiation energy, and the other is to receive the heat energy converted and transmitted by the light-blocking member after absorbing the laser. This dual energy action mechanism significantly improves the curing efficiency and uniformity of the color filter resist, thereby ensuring that it can be fully and effectively cured. At the same time, due to the existence of the light-blocking member and its main absorption of laser energy, most of the heat is confined to the light-blocking member and its adjacent area, thereby efficiently completing the curing of the color filter resist while minimizing the thermal impact on the underlying heat-sensitive light-emitting functional layer, successfully reducing the core contradiction between the high-temperature curing process and the heat resistance of the light-emitting functional layer device. This method not only improves the reliability of the curing process, but also provides the possibility of using conventional filter materials with more stable performance, which is conducive to improving product yield and reducing production cost.

[0016] Other characteristics and advantages of the present application will become apparent from the following detailed description, or will be learned by practice of the present application.

[0017] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application. It is to be understood that the drawings are only illustrations of some embodiments of the application and that, to one of ordinary skill in the art, other embodiments can be clearly inferred from the drawings without paying creative labor.

[0019] Figure 1 A flowchart of a method for manufacturing a display panel is shown.

[0020] Figure 2 A flowchart of a method for manufacturing a light shielding member is shown.

[0021] Figure 3 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0022] Figure 4 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0023] Figure 5 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0024] Figure 6 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0025] Figure 7 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0026] Figure 8 A schematic diagram of a cross-sectional structure of a pixel unit in a display panel is shown.

[0027] Figure 9 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0028] Figure 10 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0029] Figure 11 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0030] Figure 12 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0031] Figure 13 A structural schematic diagram of an array of light-emitting functional layers provided by some embodiments is shown.

[0032] Labeling of the drawings: 100, display panel; 110, substrate; 120, light-emitting functional layer; 130, encapsulation layer; 131, first inorganic encapsulation layer; 132, organic encapsulation layer; 133, recessed part; 134, second inorganic encapsulation layer; 140, light-blocking member; 150, color filter; M, laser. DETAILED DESCRIPTION

[0033] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the examples set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the scope of example implementations to those skilled in the art.

[0034] In the present application, the terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0035] In the present application, unless otherwise explicitly specified and limited, the terms "assembly", "connection" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] In addition, the described features, structures or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to give a sufficient understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be used. In other cases, well-known methods, devices, implementations or operations are not shown or described in detail to avoid obscuring the aspects of the present application.

[0037] The preparation method of the display panel 100 provided by the embodiments of the present application effectively reduces the problem that the underlying light-emitting functional layer 120 is easily damaged when the color filter layer is cured at high temperature in the COE structure. Referring toFigure 1 As shown, it can include the following steps: In step S100, a substrate 110 is provided, on which a light-emitting functional layer 120 and an encapsulation layer 130 covering the light-emitting functional layer 120 are formed.

[0038] In step S200, a patterned light-blocking member 140 and a patterned light-filtering color resist 150 are formed on the encapsulation layer 130, with the light-blocking member 140 being adjacent to the light-filtering color resist 150.

[0039] In step S300, the light-blocking member 140 absorbs laser M energy and generates heat energy, which causes the light-filtering color resist 150 adjacent thereto to be cured.

[0040] The preparation method of the display panel 100 provided in the present application uses laser M to irradiate the patterned light-blocking member 140 and the light-filtering color resist 150 adjacent thereto at the same time, so that the light-filtering color resist 150 can obtain the energy required for curing through two paths at the same time: one is to directly absorb part of the laser M irradiation energy; the other is to receive the heat energy converted and transmitted by the light-blocking member 140 after absorbing the laser M. This double energy action mechanism significantly improves the curing efficiency and uniformity of the light-filtering color resist 150, thereby ensuring that it can be fully and effectively cured. At the same time, due to the existence of the light-blocking member 140 and its main absorption of laser M energy, most of the heat is confined to the light-blocking member 140 and its adjacent area, thereby efficiently completing the curing of the light-filtering color resist 150 while minimizing the thermal impact on the light-emitting functional layer 120 below, successfully reducing the core contradiction between the high-temperature curing process and the heat resistance of the light-emitting functional layer 120 device. This method not only improves the reliability of the curing process, but also provides the possibility of using conventional light-filtering materials with more stable performance, which is conducive to improving product yield and reducing production cost.

[0041] In step S100, the substrate 110 can be a glass substrate 110, a flexible polymer substrate 110, etc. On the substrate 110, a thin film transistor (TFT) array (not shown in the figure) is formed using mature semiconductor processes, and then the light-emitting functional layer 120 of the organic light-emitting diode is prepared on the thin film transistor array. The light-emitting functional layer 120 can include an anode, an organic light-emitting layer, and a cathode. Subsequently, a thin film encapsulation layer 130 is formed on the light-emitting functional layer 120 to block water and oxygen and protect the light-emitting functional layer 120. The encapsulation layer 130 is a single inorganic layer, or more commonly an inorganic / organic / inorganic multilayer structure.

[0042] In step S200, a patterned light shielding member 140 and a patterned color filter 150 are prepared on the encapsulation layer 130. The light shielding member 140 is arranged adjacent to the color filter 150. The light shielding member 140 can be a black matrix (BM) for separating different sub-pixels and preventing light crosstalk. The color filter 150 includes at least red (R), green (G), and blue (B) colors, corresponding to different sub-pixel regions, respectively.

[0043] In step S300, the region where the light shielding member 140 and the color filter 150 are located is irradiated by laser M, so that the color filter 150 obtains double curing energy: part of the energy directly comes from the laser M absorbed by itself, and the other part of the more major energy comes from the heat energy converted and transmitted by the light shielding member 140 after absorbing the laser M. The heat energy promotes the curing of the color filter 150 which is closely adjacent to it. This mechanism ensures that the color filter 150 can be fully and effectively cured. At the same time, since the laser M energy is mainly absorbed and converted by the light shielding member 140, and the heat energy transmission range is limited, the heat impact on the light-emitting functional layer 120 below is minimized, thereby achieving effective curing of the color filter 150 while protecting the material of the organic light-emitting layer in the heat-sensitive light-emitting functional layer 120.

[0044] In some embodiments, the laser M is irradiated at an inclined angle relative to the surface of the encapsulation layer 130. At the same time, the size and position of the light shielding member 140 are designed to completely block the directly incident laser M, so that it cannot directly irradiate the light-emitting functional layer 120 below, achieving physical light isolation.

[0045] For example, as shown in Figure 12 , the angle between the laser M irradiation direction and the surface of the encapsulation layer 130 is α, the height of the light shielding member 140 is h, and the distance between two adjacent light shielding members 140 (i.e. the sub-pixel opening width) is L, which satisfy the geometric relationship: . Among them, the maximum angle α of laser M irradiation satisfies This condition ensures that the laser M incident at this inclined angle α will be completely blocked by the side wall of the light shielding member 140, thereby providing reliable protection for the light-emitting functional layer 120 below.

[0046] It can be understood that the laser M used can be a pulsed laser or a continuous laser, and the wavelength can be selected in the near-infrared region (such as 808 nm, 850 nm, 940 nm).

[0047] Among them, referring to Figure 2 , the step of forming a patterned light shielding member 140 on the encapsulation layer 130 in step S200 includes: S210, coating a light shielding material on the encapsulation layer 130.

[0048] S220 is used to perform the first curing treatment on the coated light-shielding material to form a pre-cured light-shielding material layer.

[0049] S230, patterning the pre-cured light-shielding material layer to form a patterned light-shielding element 140.

[0050] S240, the patterned light-shielding component 140 is irradiated with laser M to cause the light-shielding component 140 to undergo a second curing.

[0051] The light-blocking material can be a black light-blocking material (such as black glue), which can be pre-cured at a low temperature of 80℃ (first curing) to initially set its shape. The patterning process can include exposure and development processes; that is, the pre-cured light-blocking material is used to form a patterned light-blocking part 140 through processes such as exposure and development.

[0052] Understandably, firstly, the low-temperature pre-curing at 80℃ (first curing) provides the necessary mechanical support for subsequent patterning processes such as exposure and development, while ensuring the safety of the heat-sensitive lower light-emitting functional layer 120. Secondly, the laser M irradiation after patterning can localize the energy to the light-shielding component 140 itself, achieving complete curing and stabilization of its material. This endows the light-shielding component 140 with excellent photothermal conversion characteristics, making it an efficient and controllable point heat source for the subsequent curing of adjacent color filter 150. On the other hand, it also reduces the risk of damage to the light-emitting device caused by the overall high-temperature baking process in related technologies. Thus, while ensuring the reliability of the entire process, it significantly broadens the range of material selection and improves process compatibility.

[0053] See Figure 3 and Figure 4 As shown, in step S240, the light-shielding member 140 can be irradiated twice symmetrically with laser M. For example, the step of irradiating the patterned light-shielding member 140 with laser M includes: Step S241: Perform the first irradiation at the first tilt angle.

[0054] Step S242: Perform a second irradiation at a second tilt angle.

[0055] Wherein, both the first tilt angle and the second tilt angle are related to the laser M irradiation tilt angle α defined above (i.e., satisfying...). The angles of the two laser beams are the same or substantially the same, and the irradiation direction of the first laser beam irradiation is symmetrical with respect to the normal direction of the light-shielding member 140. That is, the laser beam 140 can be symmetrically irradiated from two directions at the same controlled tilt angle α. This ensures that both opposite sidewalls of the light-shielding member 140 are fully irradiated by the laser beam 140 and absorb energy uniformly, thereby obtaining a consistent heating and curing effect, reducing the uneven curing or thermal stress problems that may be caused by unilateral irradiation, while strictly maintaining the shielding and protection function of the light-emitting functional layer 120 of the light-shielding member 140.

[0056] See Figure 5 As shown, after the light-shielding component 140 is prepared, color filters 150 are prepared and cured sequentially, which includes the following steps: Step S250: Coat the encapsulation layer 130 with a color filter material 150.

[0057] Step S260: Perform a first curing treatment on the coated color filter 150 material to form a pre-cured color filter 150 material layer.

[0058] Step S270: The pre-cured color filter 150 material layer is patterned to form a patterned color filter 150. The color filter 150 is located in the area between the light-shielding members 140 and is disposed adjacent to the light-shielding members 140.

[0059] In step S280, the light-shielding member 140 and the adjacent patterned color filter 150 are irradiated with laser M.

[0060] When laser M is irradiated, laser M is irradiated at an angle relative to the surface of the encapsulation layer 130, and the heat generated by the absorption of laser M energy by the light-shielding member 140 causes the color filter 150 to solidify.

[0061] For example, let's take red (R) color resist as an example: First, a red color filter material 150 is coated within the corresponding sub-pixel area defined by the light-shielding member 140. Then, the coated material undergoes a low-temperature pre-curing (first curing) treatment (e.g., at 80°C) to form a pre-cured red color filter material layer. Next, this pre-cured layer is processed using patterning processes such as exposure and development to form a patterned red color filter, which is located in the area between and adjacent to the light-shielding members 140. Then, the light-shielding member 140 and the adjacent patterned red color filter are irradiated with laser M. During this irradiation, the laser M irradiates at an angle relative to the surface of the encapsulation layer 130. Part of the laser M energy is absorbed by the light-shielding member 140, and the resulting heat is conducted to the adjacent red color filter through the sidewalls; another part of the laser M may also directly act on the color filter surface. Both actions work together to ensure the red color filter is fully cured, and the light-shielding member 140 effectively blocks the thermal influence of the laser M on the area below. Green (G) and blue (B) color resists can be prepared and cured sequentially according to the exact same steps (coating the corresponding material, low-temperature pre-curing, patterning, and laser M irradiation), ultimately completing the preparation of the light-shielding component 140 and each filter color resist 150, as follows. Figure 8 As shown.

[0062] Understandably, by introducing a low-temperature pre-curing step, the filter material only needs to undergo mild heat treatment during the patterning stage, thereby reducing the risk of thermal damage to the underlying light-emitting functional layer 120 caused by the high-temperature baking process in related technologies during patterning. Simultaneously, using laser irradiation as the curing method and utilizing the already cured light-shielding element 140 as a highly efficient heat absorber and directional heat source allows for highly concentrated and precise transfer of curing energy. This not only ensures the full and uniform curing of the color filter 150 itself but also strictly limits the diffusion of heat to the light-emitting functional layer 120 through the physical shielding effect of the light-shielding element 140, achieving precise local thermal management of the curing process. In other words, while ensuring high-quality curing of the filter layer, the requirements for the overall thermal budget of the device are significantly reduced, thereby broadening the range of selectable filter materials (e.g., conventional high-temperature curable materials) and improving the compatibility and reliability of the entire process for heat-sensitive devices.

[0063] Among them, see Figure 6 and Figure 7 As shown, in step S280, the step of irradiating the light-shielding member 140 and its adjacent color filter 150 with laser M includes: Step S281: Perform the first laser M irradiation at the third tilt angle.

[0064] Step S282: Perform a second laser M irradiation at the fourth tilt angle.

[0065] Among them, the third tilt angle and the fourth tilt angle are both consistent with the aforementioned laser M irradiation tilt angle α (i.e., satisfying...). The angles of the two laser beams are the same or substantially the same, and the irradiation direction of the first laser beam irradiation and the irradiation direction of the second laser beam irradiation are symmetrical with respect to the normal direction of the light-shielding member 140. That is, the laser beam irradiates the light-shielding member 140 symmetrically from two directions at the same controlled tilt angle α.

[0066] Understandably, employing two symmetrically tilted laser irradiations (M) enables more thorough and uniform curing of the color filter 150. On one hand, direct irradiation by laser M provides curing energy to the color filter 150 itself; on the other hand, this irradiation simultaneously heats the adjacent light-shielding element 140, causing it to absorb light energy and convert it into heat energy, which is then effectively transferred to the sidewalls of the color filter 150. This dual mechanism of direct and indirect heating, through directional heat transfer from the light-shielding element 140 to the adjacent interface of the color filter 150, significantly enhances the heating effect on the junction area and sidewalls of the color filter 150 and the light-shielding element 140, thereby ensuring a more complete and reliable curing quality at this critical interface location, and ultimately improving the overall curing uniformity and structural stability of the color filter 150.

[0067] Furthermore, the two-step method of pre-curing and final laser M curing effectively isolates thermal risks. The patterning step can be completed after low-temperature pre-curing, and this stage has minimal thermal impact on the underlying light-emitting functional layer 120. All subsequent higher heat inputs (from laser M) are applied to localized areas of the formed pattern, and the overall heating of the OLED is reduced through the physical shielding of the light-shielding element 140 and the design of the heat conduction path.

[0068] Secondly, see Figure 4 or Figure 7 As shown, two symmetrically tilted laser irradiations (M) on the same structure (light-shielding element 140 or color resist) are key to achieving uniform localized curing depth. Taking light-shielding element 140 as an example, the first irradiation (e.g., from the right side) causes its right side wall and adjacent areas to absorb energy and heat up for curing; the subsequent second symmetrical irradiation (from the left side) ensures that its left side wall also achieves equally sufficient curing. This design effectively overcomes the problem of uneven curing that may occur with unilateral irradiation due to the height of the light-shielding element 140 itself or the light absorption characteristics of the material, ensuring the overall performance consistency of its role as a subsequent heat source.

[0069] Furthermore, the sequence of the four irradiations produces a cumulative and synergistic effect. The first two irradiations thoroughly and uniformly solidify the light-shielding element 140 into a stable and efficient heat source. When the latter two irradiations are applied to the color resist 150, the laser M energy not only acts directly on the color resist but is also efficiently absorbed by the optimized adjacent light-shielding element 140 and uniformly conducted from both sides to the entire sidewall interface of the color resist. This ensures that the color resist, especially the critical edge areas that are usually difficult to completely solidify when bonded to the light-shielding element 140, can achieve deep and uniform solidification from the interface to the body, thereby greatly improving the overall density, adhesion, and optical reliability of the filter layer.

[0070] In other words, the first two laser irradiations laid a solid foundation for efficient heat conduction in the subsequent two irradiations, which in turn fully utilized this foundation to achieve interface strengthening and curing. The entire process ensured the absolute safety of the lower light-emitting functional layer 120 while achieving the curing effect of the upper filter layer.

[0071] In another embodiment, see Figure 9 and Figure 10 As shown, when forming the encapsulation layer 130, it includes: Step S110: A first inorganic encapsulation layer 131 is formed on the light-emitting functional layer 120.

[0072] Step S120: An organic encapsulation layer 132 is formed on the first inorganic encapsulation layer 131.

[0073] In step S130, the organic encapsulation layer 132 is patterned to form a recess 133 in the area corresponding to the light-shielding member 140.

[0074] In step S140, a second inorganic encapsulation layer 134 is formed on the organic encapsulation layer 132 having the recess 133.

[0075] The first inorganic encapsulation layer 131 can be made of a dense barrier material such as silicon nitride (SiNx) or silicon oxide (SiO2). An organic encapsulation layer 132 is then coated onto the first inorganic encapsulation layer 131, for example, using an acrylic resin with high light transmittance and easy film formation, or an organosilicon resin with better flexibility and thermal stability. After the organic encapsulation layer 132 is cured, a patterning process such as photolithography, imprinting, or laser ablation is used to pre-form a recess 133 of a certain depth in the corresponding area where the light-shielding element 140 will be formed. This depth typically does not exceed half the total thickness of the organic encapsulation layer 132 (e.g., the depth of the recess 133 is 5 μm) to ensure that the overall encapsulation effect is not affected. Then, a second inorganic encapsulation layer 134, such as SiNx or SiO2, is deposited, resulting in a complete encapsulation layer 130 with a regular recessed structure on its surface. When the light-shielding element 140 is fabricated on this structure, the light-shielding material will fill the recess 133. This allows the effective height of the light-shielding element 140 to be increased to h2 (h2 > h) while keeping the top surface of the light-shielding element 140 flush with the top surface of the color filter 150. (Refer to the relationship...) With a fixed subpixel pitch L, a larger h2 allows for a larger laser M tilt angle α2 (i.e., α2 > α1 in the figure, where α1 is the maximum angle of laser irradiation without a recess), thereby improving the utilization efficiency of laser M energy, the irradiation coverage, and the process alignment tolerance.

[0076] In some other embodiments, see Figure 12 As shown, the steps of forming a patterned light-shielding element 140 and a patterned color filter 150 on the encapsulation layer 130 include pre-curing the patterned light-shielding element 140 and the patterned color filter 150 respectively; and the step of causing the light-shielding element 140 to absorb the energy of the laser M and generate heat energy by irradiation with laser M is performed after both the light-shielding element 140 and the color filter 150 have completed the pre-curing treatment, and then the light-shielding element 140 and the color filter 150 are cured together by irradiation with laser M.

[0077] The complete curing process of the light-shielding component 140 and the color filter 150 is unified into the final stage. The steps include: First, see Figure 12As shown, patterned light-shielding elements 140 and patterned color filter color resists of all types (such as R, G, B) are sequentially fabricated on the encapsulation layer 130. This process includes pre-curing the light-shielding elements 140 and the color filter color resists 150 respectively. Subsequently, after the light-shielding elements 140 and all color filter color resists 150 have completed the pre-curing process, the light-shielding elements 140 and all color filter color resists 150 are finally cured together through a unified laser M irradiation step. The unified laser M irradiation step includes two tilted laser M irradiations. The irradiation directions of these two laser M irradiations are symmetrical about the normal of the light-shielding elements 140, and their irradiation tilt angles are the same as the tilt angle α defined in the aforementioned embodiment, that is, satisfying the condition... The relationship is shown in the diagram (where h is the height of the light-shielding component 140 and L is the distance between adjacent light-shielding components 140). During this irradiation process, the light-shielding component 140 absorbs the heat energy generated by the laser M and transfers it to all adjacent color resists, causing them to cure synchronously. This two symmetrical irradiations, while meeting the safety conditions of a uniform angle, ensure the high uniformity of heating and curing on both sides of the light-shielding component 140 and among each adjacent color resist. This process integrates multiple independent curing steps into a single symmetrical irradiation process that satisfies specific geometric relationships, significantly improving production efficiency while ensuring curing quality and the safety of underlying devices.

[0078] In other embodiments, to enhance the absorption efficiency of the light-shielding element 140 for laser M energy, microstructures can be constructed on its surface (e.g., sidewalls or top surface), such as by etching to form rough textures, groove arrays, or wrinkles. These structures can increase the optical path and absorption area, thereby improving photothermal conversion efficiency. Similarly, micromorphologies that facilitate light scattering or heat conduction can be designed on the surface of the color filter 150 or at the contact interface with the light-shielding element 140 to improve the uniformity and efficiency of heat transfer from the light-shielding element 140 to the color filter.

[0079] In other embodiments, a heating resistor (not shown in the figure) made of a transparent conductive material such as indium tin oxide (ITO) can be integrated inside or on the surface of the encapsulation layer 130. This resistor is arranged in a manner that combines optical and thermal design, and can be achieved through the following methods and steps: First, during the formation of the encapsulation layer 130, after the first inorganic encapsulation layer 131 is deposited, a continuous indium tin oxide (ITO) thin film is deposited on its surface using physical vapor deposition (such as magnetron sputtering) or chemical vapor deposition. Next, the ITO thin film is patterned using photolithography and wet / dry etching processes to form the required resistance wire arrangement pattern according to the design requirements.

[0080] The pattern can include: a grid-like arrangement, where the resistance wires are mainly placed in the non-opening areas corresponding to the edges of the light-shielding element 140 to minimize the impact on light transmission; or a wraparound arrangement, where the resistance wires are precisely traced along the predetermined contour of each light-shielding element 140 using high-precision photolithography, thereby concentrating the auxiliary heat to the light-shielding element 140 and the adjacent color resist interface; or the resistance wire pattern can be designed as multiple independently controlled heating blocks, with each block connected by independent conductive leads to achieve differentiated temperature control for different areas. After patterning is completed, the subsequent organic encapsulation layer 132 and the second inorganic encapsulation layer 134 are prepared, thereby embedding the resistance wires inside the encapsulation layer 130 or placing them on its surface.

[0081] These resistance wires, manufactured using the aforementioned microfabrication process with micron-level linewidth and spacing, ensure high light transmittance while allowing a small current to be supplied via an external circuit during laser irradiation or at specific stages. This generates uniform and controllable auxiliary heat. This heat effectively compensates for insufficient energy in areas that direct laser irradiation may not cover, thus achieving a more uniform and thorough curing effect in conjunction with the laser irradiation without significantly increasing the overall thermal budget.

[0082] In other embodiments, to provide a wider safety margin, a transparent heat insulation layer (not shown) can be added at a location between the light-emitting functional layer 120 and the color filter layer, for example, inside the encapsulation layer 130. This heat insulation layer can be made of a transparent material with low thermal conductivity (e.g., porous silica, a specific polymer), and its function is to further block residual heat conducted downward from the upper color filter layer region, providing additional protection for the heat-sensitive light-emitting functional layer 120.

[0083] See Figure 8 and Figure 13 As shown, this application embodiment also provides a display panel 100 manufactured by the above method. The display panel 100 includes a substrate 110, a light-emitting functional layer 120 disposed on the substrate 110, an encapsulation layer 130 covering the light-emitting functional layer 120, and a color filter layer disposed on the encapsulation layer 130. The color filter layer includes patterned light-shielding members 140 and various color filters 150 (such as R, G, B) located between adjacent light-shielding members 140.

[0084] The light-shielding element 140 is designed to absorb radiation energy of a specific wavelength band (such as the laser M wavelength mentioned above) and efficiently convert it into heat energy. The structure of the panel ensures that the heat energy generated by the light-shielding element 140 can be effectively transferred to the adjacent color filter 150.

[0085] In some embodiments, to enhance the absorption efficiency of the light-shielding member 140 for laser M energy, microstructures can be constructed on its surface (e.g., sidewalls or top surface), such as by etching to form rough textures, groove arrays, or wrinkles. These structures can increase the optical path and absorption area, thereby improving photothermal conversion efficiency. Similarly, micromorphologies that facilitate light scattering or heat conduction can be designed on the surface of the color filter 150 or at the contact interface with the light-shielding member 140 to improve the uniformity and efficiency of heat transfer from the light-shielding member 140 to the color filter.

[0086] In some embodiments, heating resistors (not shown) made of transparent conductive materials such as indium tin oxide (ITO) are integrated inside or on the surface of the encapsulation layer 130. These resistors are arranged in a manner co-designed by optics and thermality: for example, they are arranged in a grid pattern throughout the entire display area, with the resistance wires mainly positioned in the non-opening areas corresponding to the edges of the light-shielding element 140 to minimize the impact on light transmission; or they are arranged in a wraparound pattern, with the resistance wires precisely routed along the contour of each light-shielding element 140, thereby concentrating the auxiliary heat to the light-shielding element 140 and adjacent color resist interfaces; alternatively, the resistance wires can be divided into multiple independently controlled heating zones to achieve differentiated temperature control for different areas. These micron-level linewidths and spacing resistance wires, while ensuring high light transmittance, can pass a small current during laser irradiation or at specific stages, generating uniform and controllable auxiliary heat. This effectively compensates for insufficient energy in areas that direct laser irradiation may not cover, thus achieving a more uniform and thorough curing effect in conjunction with the laser irradiation without significantly increasing the overall thermal budget.

[0087] In some embodiments, a transparent heat insulation layer (not shown) is added at a location between the light-emitting functional layer 120 and the color filter layer, for example inside the encapsulation layer 130. This heat insulation layer may be made of a transparent material with low thermal conductivity (e.g., porous silica, a specific polymer), and its function is to further block residual heat conducted downward from the upper color filter layer region, providing additional protection for the heat-sensitive light-emitting functional layer 120.

[0088] The display panel 100 manufacturing method and the display panel 100 provided in this application achieve localized thermal management of the curing process by using laser M to irradiate the light-shielding member 140 and utilizing the heat energy generated therefrom to cure the adjacent color filter 150, thereby reducing the damage to the underlying heat-sensitive light-emitting functional layer 120 caused by overall high-temperature baking in related technologies. Secondly, by introducing tilted laser M irradiation and satisfying specific geometric relationships ( The design, combined with a two-directional symmetrical irradiation method, not only ensures reliable optical protection for the underlying devices but also significantly improves the uniformity and thoroughness of curing the light-shielding element 140 and the color filter 150. Furthermore, by optimizing the structure of the encapsulation layer 130 (e.g., by providing a recess 133) to increase the effective height of the light-shielding element 140, the process window for laser M irradiation is further widened, improving energy utilization efficiency. In addition, the proposed unified curing process and the integration of optional transparent auxiliary heating elements significantly improve production efficiency and enhance process robustness and controllability while ensuring curing quality. Ultimately, while ensuring the high reliability and excellent optical performance of the display panel 100, the process thermal budget is significantly reduced, and the range of selectable filter materials is broadened, thus demonstrating outstanding industrial application value and cost advantages.

[0089] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0090] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, wherein a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer are formed on the substrate; A patterned light-shielding element and a patterned color filter are formed on the encapsulation layer, wherein the light-shielding element and the color filter are disposed adjacent to each other; By irradiating the light-shielding component and the color filter with a laser, the light-shielding component absorbs the laser energy and generates heat, which causes the adjacent color filter to solidify.

2. The method for manufacturing a display panel according to claim 1, characterized in that, In the laser irradiation step, the laser irradiates at an angle relative to the surface of the encapsulation layer, and the light-shielding member is configured to block the laser irradiation onto the light-emitting functional layer.

3. The method for manufacturing a display panel according to claim 2, characterized in that, The angle between the laser irradiation direction and the surface of the encapsulation layer is α, the height of the light-shielding element is h, and the distance between two adjacent light-shielding elements is L, wherein α satisfies: .

4. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming a patterned light-shielding element on the encapsulation layer includes: A light-shielding material is coated onto the encapsulation layer; The coated light-shielding material is subjected to a first curing treatment to form a pre-cured light-shielding material layer; The pre-cured light-shielding material layer is patterned to form the patterned light-shielding component; The patterned light-shielding component is subjected to laser irradiation to cause a second curing of the light-shielding component.

5. The method for manufacturing a display panel according to claim 4, characterized in that, The step of laser irradiating the patterned light-shielding component includes: The light-shielding component is subjected to a first laser irradiation at a first tilt angle; The light-shielding component is subjected to a second laser irradiation at a second tilt angle; The irradiation direction of the first laser irradiation and the irradiation direction of the second laser irradiation are symmetrical with respect to the normal direction of the light-shielding component.

6. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming patterned color filter resist on the encapsulation layer includes: A color-filtering resist material is coated on the encapsulation layer; The coated color filter material is subjected to a first curing treatment to form a pre-cured color filter material layer. The pre-cured color filter material layer is patterned to form a patterned color filter, wherein the color filter is located in the area between the light-shielding elements and is disposed adjacent to the light-shielding elements. The light-shielding member and the adjacent patterned color filter are irradiated with laser light. During the laser irradiation, the laser is directed at an angle relative to the surface of the encapsulation layer, and the heat generated by the absorption of laser energy by the light-shielding component causes the color filter to solidify.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The step of laser irradiating the light-shielding member and the adjacent color filter includes: The first laser irradiation was performed at the third tilt angle; A second laser irradiation is performed at the fourth tilt angle; The directions of the first and second laser irradiations are symmetrical with respect to the normal direction of the light-shielding component.

8. The method for manufacturing a display panel according to claim 1, characterized in that, In the step of providing a substrate, wherein a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer are formed on the substrate, forming the encapsulation layer includes: A first inorganic encapsulation layer is formed on the light-emitting functional layer; An organic encapsulation layer is formed on the first inorganic encapsulation layer; The organic encapsulation layer is patterned to form a recess in the area corresponding to the light-shielding member; A second inorganic encapsulation layer is formed on the organic encapsulation layer having the recessed portion; The light-shielding element is formed within the recess of the encapsulation layer.

9. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming a patterned light-shielding element and a patterned color filter on the encapsulation layer includes pre-curing the patterned light-shielding element and the patterned color filter respectively. Furthermore, the step of causing the light-shielding component to absorb laser energy and generate heat energy by laser irradiation is performed after both the light-shielding component and the color filter have completed pre-curing treatment, by irradiating the light-shielding component and the color filter together with laser.

10. A display panel, characterized in that, include: substrate; A light-emitting functional layer is disposed on the substrate; An encapsulation layer that covers the light-emitting functional layer; A color filter layer is disposed on the side of the encapsulation layer away from the substrate, and the color filter layer includes a light-shielding element and a color filter element located between adjacent light-shielding elements; The light-shielding element is configured to absorb laser energy and generate heat, and the heat generated by the light-shielding element can be transferred to the adjacent color filter.

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