Method for manufacturing display panel and display panel

Abstract

The application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. The preparation method of the display panel comprises the following steps: providing a substrate, which is provided with an organic light emitting unit; forming an encapsulation layer on the organic light emitting unit, wherein the encapsulation layer comprises a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer which are sequentially arranged; forming a heating electrode on the second inorganic layer; forming a color filter layer on the heating electrode, wherein the color filter layer comprises a black matrix and a plurality of sub-pixel color resistors; and performing a curing treatment on the color filter layer, which comprises electrifying the heating electrode to make it heat to provide heat required for curing. The application can complete high-temperature curing of the color filter layer while protecting the light emitting unit.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. BACKGROUND

[0002] An organic light-emitting diode (OLED) display often adopts a structure of color filter on encapsulation (COE) on a thin film encapsulation to improve optical performance. However, the color filter usually needs a high-temperature curing process.

[0003] An organic light-emitting material has poor heat resistance and is prone to performance degradation when the temperature exceeds 100 DEG C. If a conventional high-temperature curing material is used, the device will be damaged; if a special low-temperature curing material is used, there are defects such as high cost, complex process and insufficient stability. SUMMARY

[0004] The present application aims to provide a preparation method of a display panel and the display panel, which can complete high-temperature curing of a color filter layer while protecting a light-emitting unit.

[0005] The present application provides a preparation method of a display panel, comprising: providing a substrate having an organic light-emitting unit formed thereon; forming an encapsulation layer on the organic light-emitting unit, the encapsulation layer comprising a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer which are sequentially stacked; forming a heating electrode on the second inorganic layer; forming a color filter layer on the heating electrode, the color filter layer comprising a black matrix and a plurality of sub-pixel color resistors; and performing a curing treatment on the color filter layer, comprising passing current through the heating electrode to generate heat to provide heat required for curing.

[0006] In an exemplary embodiment of the present application, the step of forming the color filter layer and performing the curing treatment comprises: coating a photoresist material; pre-curing the photoresist material at a first temperature to form a pre-cured photoresist layer; performing a patterning treatment on the pre-cured photoresist layer to form the black matrix and / or the sub-pixel color resistors; and performing curing again on the patterned black matrix and / or sub-pixel color resistors at a second temperature higher than the first temperature.

[0007] In an exemplary embodiment of the present application, the first temperature is lower than 100 DEG C, and the second temperature is higher than 180 DEG C.

[0008] In an example embodiment of the present application, the step of forming the color filter layer and performing the curing treatment comprises: after the patterning of the black matrix and the sub-pixel color resist is completed, the heating electrode is powered on, and the black matrix and the sub-pixel color resist are heated and cured.

[0009] In an example embodiment of the present application, the heating electrode comprises a first power line, a second power line, and a heating wire connected between the first power line and the second power line, and the heating wire comprises a plurality of continuous bending portions.

[0010] The second aspect of the present application provides a preparation method of a display panel, comprising: providing a substrate, wherein an organic light emitting unit and an encapsulation layer covering the organic light emitting unit are formed on the substrate, and the encapsulation layer comprises a first inorganic layer, an organic layer, a thermal insulation layer, and a second inorganic layer which are sequentially stacked; forming a color filter layer on the second inorganic layer by a step-by-step patterning method, and arranging a heating electrode in and covering the color filter layer; and performing a curing treatment on the color filter layer, including powering on the heating electrode to generate heat and provide heat required for curing.

[0011] In an example embodiment of the present application, the step-by-step patterning method comprises: forming a first partial pattern layer; forming the heating electrode on the first partial pattern layer; and forming a second partial pattern layer on the heating electrode, wherein the second partial pattern layer covers the heating electrode and the first partial pattern layer, and the first partial pattern layer and the second partial pattern layer together constitute the color filter layer.

[0012] In an example embodiment of the present application, the step of forming the first partial pattern layer and / or the second partial pattern layer comprises: coating a photoresist material, performing pre-curing, and exposing and developing to form a pattern.

[0013] The third aspect of the present application provides a display panel, comprising: a substrate; an organic light emitting unit arranged on the substrate; an encapsulation layer covering the organic light emitting unit, wherein the encapsulation layer comprises a first inorganic layer, an organic layer, a thermal insulation layer, and a second inorganic layer which are sequentially stacked; a heating electrode arranged on the second inorganic layer; and a color filter layer arranged on the heating electrode, wherein the color filter layer comprises a black matrix and a sub-pixel color resist.

[0014] The fourth aspect of the present application provides a display panel, comprising: a substrate; an organic light emitting unit arranged on the substrate; an encapsulation layer covering the organic light emitting unit, wherein the encapsulation layer comprises a first inorganic layer, an organic layer, a thermal insulation layer, and a second inorganic layer which are sequentially stacked; and a color filter layer arranged on the encapsulation layer, wherein the color filter layer comprises a black matrix and a sub-pixel color resist, and a heating electrode is embedded in the color filter layer.

[0015] The preparation method of the display panel and the display panel provided by the application have at least the following beneficial effects:

[0016] When forming the color filter layer, the application generates local high temperature by energizing the heating electrode to complete curing, and meanwhile, the heat is blocked from being transmitted downward by the heat insulation layer in the packaging structure. This scheme helps to alleviate the conflict between the high-temperature curing requirement in the related COE process and the heat sensitivity of the organic light-emitting unit, and can realize sufficient curing of the color filter layer, improve the display performance and stability, and at the same time, reduce the thermal influence of high temperature on the organic light-emitting unit. Thus, the dependence on special low-temperature curing materials is reduced, the material selection range is widened, and the comprehensive cost is reduced.

[0017] Other characteristics and advantages of the application will become apparent from the following detailed description, or will be learned by practice of the application.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the application and, together with the specification, serve to explain the principles of the application. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained from these drawings without creative labor for those skilled in the art.

[0020] Figure 1 A preparation method flowchart of a display panel provided by the first embodiment or the second embodiment of the application is shown.

[0021] Figure 2 A structure preparation flowchart of a display panel provided by the first embodiment of the application is shown.

[0022] Figure 3 A structure schematic diagram of a heating electrode provided by the first embodiment of the application is shown.

[0023] Figure 4 A cross-sectional structure schematic diagram of A-A' in Figure 3

[0024] Figure 5 A structure preparation flowchart of a display panel provided by the second embodiment of the application is shown.

[0025] Figure 6 A preparation method flowchart of a display panel provided by the third embodiment of the application is shown.

[0026] ​Figure 7 A preparation method flowchart of the heating electrode formed in the color filter layer is shown.

[0027] Figure 8 A preparation flowchart of the structure of the heating electrode formed in the color filter layer is shown.

[0028] Figure 9 A display panel structure diagram prepared according to the preparation method of embodiment three is shown.

[0029] Legend of reference signs:

[0030] 10, substrate; 11, encapsulation layer; 111, first inorganic layer; 112, organic layer; 113, second inorganic layer; 12, heat insulation layer; 13, heating electrode; 131, first power supply line; 132, second power supply line; 133, heating lead wire; 14, color filter layer; 141R, red sub-pixel color resist; 141G, green sub-pixel color resist; 141B, blue sub-pixel color resist; 142, black matrix; 14a, first partial pattern layer; 14b, second partial pattern layer. DETAILED DESCRIPTION

[0031] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the inventive aspects to those skilled in the art.

[0032] In the present application, the terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0033] In the present application, unless otherwise explicitly specified and limited, the terms "assembly", "connection" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the application can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the application.

[0035] Embodiment one

[0036] Referring to Figure 1 and Figure 2 Embodiment one of the present application provides a preparation method of a display panel, comprising the following steps:

[0037] Step S101, providing a substrate 10, on which an organic light emitting unit is formed.

[0038] Step S102, forming an encapsulation layer 11 on the organic light emitting unit, the encapsulation layer 11 comprising a first inorganic layer 111, an organic layer 112, a thermal insulation layer 12 and a second inorganic layer 113 which are sequentially stacked.

[0039] Step S103, forming a heating electrode 13 on the second inorganic layer 113.

[0040] Step S104, forming a color filter layer 14 on the heating electrode 13, the color filter layer 14 comprising a black matrix 142 and a plurality of sub-pixel color resistors.

[0041] Step S105, performing a curing treatment on the color filter layer 14, comprising energizing the heating electrode 13 to generate heat to provide the required heat for curing.

[0042] In step S101, the substrate 10 can be a glass substrate 10 or a flexible polymer substrate 10 (such as polyimide PI). A thin film transistor (TFT) driving circuit (not shown in the figure) is formed on the substrate 10 by a mature array process. Subsequently, a pixel definition layer is formed on the driving circuit, and an organic light emitting layer is formed in the pixel area defined by the pixel definition layer by means of evaporation or inkjet printing, thereby constituting the organic light emitting unit. The organic light emitting unit can comprise an anode, an organic light emitting layer and a cathode, the anode being electrically connected to the source or drain of the thin film transistor through a via hole to receive a driving signal. The organic light emitting layer is disposed on the anode. The cathode is disposed on the organic light emitting layer, adopting a top emission design so that the light emission is emitted from the front of the panel.

[0043] In step S102, referring to Figure 2As shown, an encapsulation layer 11 (TFE) is formed on the organic light emitting unit for protection. First, a first inorganic layer 111 is deposited by a method such as chemical vapor deposition (CVD), with a material such as silicon nitride (SiNx) or silicon oxide (SiOx). Subsequently, an organic layer 112 is coated, with a material such as polyimide or acrylic resin, and cured to form a planarization layer. Next, a thermal isolation layer 12 is formed on the organic layer 112. The material of the thermal isolation layer 12 can be a transparent titanium dioxide (TiO2) film, which has good thermal insulation properties and high transmittance of visible light, and can be formed by sputtering or atomic layer deposition (ALD) process. After that, a second inorganic layer 113 is deposited on the thermal isolation layer 12, with a material again being SiNx or SiOx. The second inorganic layer 113 completely covers the thermal isolation layer 12, preventing possible electrical conductivity of the thermal isolation layer 12 from interfering with subsequent processes, and together with the first inorganic layer 111 and the organic layer 112, forms a complete encapsulation layer 11. The thermal isolation layer 12 is located between the organic layer 112 and the second inorganic layer 113, and becomes part of the encapsulation structure.

[0044] It should be noted that the thermal isolation layer 12 is arranged between the organic layer 112 and the second inorganic layer 113. The main consideration for this is that the second inorganic layer 113 (such as silicon nitride SiNx) deposited on the thermal isolation layer 12 thereafter has excellent insulation and compactness. This layer can serve as a reliable insulation barrier, allowing the material of the thermal isolation layer 12 to be selected more for its thermal and optical properties (for example, using a high refractive index material to take into account the light extraction effect), without excessive concern about its own insulation being perfect. This design effectively reduces the risk of short circuiting of the upper heating electrode 13 due to possible insulation defects of the material of the thermal isolation layer 12.

[0045] In other embodiments, the material and structure of the thermal isolation layer 12 can be designed to have light extraction enhancement function, thereby improving the overall brightness of the display panel. For example, the material of the thermal isolation layer 12 can be selected as a transparent inorganic material with high refractive index (for example, refractive index n > 1.8), such as titanium dioxide (TiO2), niobium oxide (Nb2O5) or zirconium oxide (ZrO2), etc. These materials have good thermal stability and low thermal conductivity, which can meet the basic thermal insulation requirements. Due to the high refractive index characteristic, the thermal isolation layer 12 can act as an internal light extraction layer. When the light emitted from the organic light emitting unit passes through the encapsulation layer 11 to reach this high refractive index thermal isolation layer 12, refraction occurs at its interface, changing the critical angle of total reflection, so that more light that would otherwise be confined inside the panel can be coupled out, thereby improving the light extraction efficiency and display brightness.

[0046] To further enhance the effect, micro-nano structures, such as randomly distributed nanoparticles or periodically arranged micro-prisms, can be formed on the surface of the thermal insulation layer 12 (on the side facing the second inorganic layer 113 or on the side facing the organic layer 112). These structures can further scatter light, break the waveguide mode, and significantly improve the light extraction efficiency.

[0047] In step S103, a heating electrode 13 is formed on the second inorganic layer 113 by a patterning process. For example, a layer of transparent conductive material, such as indium tin oxide (ITO), graphene, or nanosilver wire (AgNW) film, is first deposited. Then, the film is patterned by photolithography and etching processes to form the desired electrode pattern.

[0048] In some embodiments, referring to Figure 3 As shown, the heating electrode 13 can include a first power line 131, a second power line 132, and a heating wire 133 connected between the two. The first power line 131 and the second power line 132 in the heating electrode 13 are parallel and spaced apart from each other, and are electrically connected by one or more continuous heating wires 133, thereby forming a complete series circuit loop. The heating wire 133 is designed as a serpentine or meandering trace with multiple continuous bends, which significantly increases the length and coverage area of the conductive path to increase the heating area.

[0049] It can be understood that when an external power source applies a voltage to the first power line 131 and the second power line 132 through the pads, the current will flow through the heating wire 133 between the two. Since the heating wire 133 itself has a specific resistance value, the current will generate heat (i.e., Joule heat) due to resistance when flowing through it. By controlling the size of the applied voltage or current, the amount of heat generated by the heating wire 133 can be precisely regulated to reach the second temperature required for the curing of the color filter layer 14. This design achieves a controllable and uniformly distributed planar heat source integrated inside the display panel.

[0050] In addition, the design of the heating wire 133, including its number, density, or trace path, can be adaptively adjusted according to the actual pattern area and distribution of different sub-pixel color resistors (such as R, G, B) or black matrix 142BM in the color filter layer 14. For example, for a color resistor area with a larger area, a larger number or higher density of heating wires 133 can be arranged to ensure that the area can obtain sufficient heating power; conversely, for a smaller area, it can be optimized accordingly. This flexible design strategy aims to achieve targeted heat distribution, thereby achieving a more uniform and controllable curing temperature field on the entire panel, further improving process consistency.

[0051] In steps S104 and S105, the color filter layer 14 is prepared and cured in steps.

[0052] The present step is described by taking the formation of the red sub-pixel color resist 141R as an example, and the preparation processes of other colors (G, B) and the black matrix 142 (BM) are similar to it.

[0053] First, referring to FIG. 1, a red photoresist material is coated on the heating electrode 13. Then, a first curing process is performed: the photoresist material is pre-cured at a first temperature. The first temperature needs to be controlled within a range that the organic light-emitting unit can safely withstand, for example, 75°C, 78°C or 80°C, aiming to preliminarily cure and shape the photoresist material, reducing its flow, but not reaching its final fully cross-linked state. Then, the pre-cured photoresist layer is subjected to a patterning process of exposure and development, forming a patterned red color resist R. Figure 2 After the patterning of the red color resist R is completed, a second curing process is performed: the heating electrode 13 is powered on. When the current flows through the heating wire 133, Joule heat is generated, causing its temperature to rise rapidly to a second temperature, for example, 220°C, 225°C or 230°C. This high temperature acts on the red color resist R above, causing the resin material of the red color resist R to undergo sufficient cross-linking reaction and reach full curing. In this process, the heat insulation layer 12 below effectively blocks most of the heat from being transferred to the organic light-emitting unit, and the thermal resistance of the encapsulation layer 11 itself causes the temperature of the area where the organic light-emitting unit is located to be much lower than its tolerance limit, thereby being protected. That is, while the heating electrode 13 is used to fully cure the color filter layer 14 at a high temperature, it also ensures that the heat will not be conducted downward, thereby effectively reducing the impact of high temperature on the organic light-emitting unit.

[0054] Finally, the coating, pre-curing, patterning process of step S104 and the power-on final curing process of step S105 are repeated to form the black matrix 142 (BM), the green sub-pixel color resist 141G and the blue sub-pixel color resist 141B in turn. Finally, these black matrix 142 and color sub-pixel color resist (R, G, B) together constitute the color filter layer 14 above the heating electrode 13. At this point, the main structure of the display panel is prepared, as shown in FIG. 1.

[0055] Figure 4 It can be understood that, in order to ensure that the color resist of different positions and different colors of the display panel can obtain uniform and consistent curing effect, and reduce the uneven performance of the material caused by local temperature difference, the layout and pattern of the heating electrode 13 need to be designed for uniform heating. For example, the pattern design of the heating electrode 13, especially the arrangement of the heating wire 133, needs to follow the principle of equalizing the heating area density.

[0056] It can be understood that, in order to ensure that the color resist of different positions and different colors of the display panel can obtain uniform and consistent curing effect, and reduce the uneven performance of the material caused by local temperature difference, the layout and pattern of the heating electrode 13 need to be designed for uniform heating. For example, the pattern design of the heating electrode 13, especially the arrangement of the heating wire 133, needs to follow the principle of equalizing the heating area density.

[0057] ​The specific design rules are as follows: the entire effective display area of the display panel is divided into a plurality of virtual basic heating unit grids with the same area in layout design. In each basic heating unit grid, the meandering heating wire 133 is arranged in the same path and line width / line spacing. This means that in any basic unit grid, the proportion of the area covered by the heating wire 133 to the total area of the unit grid (i.e. the heating area density) is a constant value.

[0058] When each sub-pixel (R, G, B) and the black matrix 142 (BM) pattern is prepared, the projection area thereof should cover at least one or more complete basic heating unit grids. Since the heating density of each grid is the same, the heating power obtained per unit area of the color resist or the black matrix 142 at any position, regardless of its color or location on the panel, is substantially consistent.

[0059] In addition, to further improve the temperature control accuracy, the entire panel heating electrode 13 can be divided into a plurality of independent heating blocks. Each block contains its own independent first power supply line 131 and second power supply line 132, and can be connected to an external control circuit. The control circuit can independently adjust the heating current or power-on time of the corresponding block according to the actual coating thickness of the color resist material on each block, the ambient temperature, or through the feedback of the temperature sensor integrated nearby, to realize dynamic temperature compensation at the pixel level or regional level, thereby obtaining an extremely uniform curing temperature field on the entire panel surface.

[0060] By directly integrating the heating electrode 13 inside the display panel and forming a specific up-down positional relationship with the color filter layer 14, combined with the heat blocking effect of the heat insulation layer 12 inside the packaging layer 11, the color filter layer 14 can be sufficiently and uniformly cured under the local high temperature generated by the heating electrode 13 being powered on, and the heat insulation layer 12 and the packaging structure can effectively block the downward heat transfer, thereby completing the high-temperature curing process while minimizing the thermal impact on the underlying organic light-emitting unit. This scheme not only reduces the dependence on special low-temperature curing materials, widens the material selection range and helps to reduce costs, but also provides a structural basis for achieving more uniform heating, higher process efficiency, and potential optical performance improvement (such as enhancing light extraction through a high-refractive-index heat insulation layer 12).

[0061] Embodiment Two

[0062] The main difference between this embodiment and Embodiment One is the curing process of the color filter layer 14, which aims to simplify the process steps.

[0063] Steps S101 to S103 of this embodiment are exactly the same as Embodiment One, i.e. the packaging layer 11 containing the heat insulation layer 12 and the heating electrode 13 are also formed.

[0064] Referring to Figure 5 As shown in FIG. 1, in step S104, the photoresist materials are coated in sequence (e.g., BM first, and then R, G, and B), and each layer of material is pre-cured and patterned at low temperature (75°C, 78°C, or 80°C). After the black matrix 142BM, the red color resist R, the green color resist G, and the blue color resist B are all patterned, a unified final curing is performed: the heating electrode 13 is powered to generate heat to high temperature (220°C, 225°C, or 230°C), and the black matrix 142 and the color sub-pixel color resist are heated at one time to complete curing. This scheme reduces the number of times of power heating, simplifies the process, and improves production efficiency.

[0065] Embodiment Three

[0066] This embodiment provides another method for manufacturing a display panel, which is characterized in that the color filter layer 14 is formed in steps and the heating electrode 13 is covered therein. Referring to Figure 6 As shown in FIG. 1, the method can include the following steps:

[0067] In step S301, a substrate 10 is provided, which has an organic light emitting unit and an encapsulation layer 11 covering the organic light emitting unit, and the encapsulation layer 11 includes a first inorganic layer 111, an organic layer 112, a thermal insulation layer 12, and a second inorganic layer 113 which are sequentially stacked.

[0068] In step S302, the color filter layer 14 is manufactured by forming patterns in steps on the second inorganic layer 113, and the heating electrode 13 is arranged and covered in the color filter layer 14.

[0069] In step S303, the color filter layer 14 is cured, including powering the heating electrode 13 to generate heat to provide heat required for curing.

[0070] In step S301, this step is consistent with S101 and S102 of Embodiment One, and the substrate 10 having the organic light emitting unit and the encapsulation layer 11 is provided, wherein the thermal insulation layer 12 is integrated in the encapsulation layer 11.

[0071] In step S302, referring to Figure 7 and Figure 8 As shown in FIG. 1, the method for forming patterns in steps includes the following steps:

[0072] In step S3021, a first part of the pattern layer 14a is formed.

[0073] In step S3022, the heating electrode 13 is formed on the first part of the pattern layer 14a.

[0074] Step S3023, a second partial pattern layer 14b is formed on the heating electrode 13, covering the heating electrode 13 and the first partial pattern layer 14a.

[0075] In step S3021, a photoresist material is coated on the encapsulation layer 11 (i.e. the second inorganic layer 113), but the coating thickness is controlled to be only half of the total thickness of the target color filter layer 14. Subsequently, the photoresist layer is pre-cured at a low temperature (75°C, 78°C or 80°C), and then subjected to exposure and development in sequence to form a patterned first partial pattern layer 14a. The first partial pattern layer 14a also contains the black matrix 142 and the sub-pixel color resist regions of partial thickness.

[0076] In step S3022, on the first partial pattern layer 14a, the heating electrode 13 with the first power supply line 131, the second power supply line 132 and the serpentine heating wire 133 is formed by using the same process as that in step S103 of the embodiment.

[0077] In step S3023, photoresist material is coated again on the heating electrode 13 and the first partial pattern layer 14a, and the thickness is controlled to fill up to the target total thickness of the color filter layer 14. After low-temperature pre-curing (75°C, 78°C or 80°C), exposure and development, the second partial pattern layer 14b is formed. The second partial pattern layer 14b covers the heating electrode 13 and fills the surrounding area, and in combination with the first partial pattern layer 14a, forms a complete color filter layer 14, so that the heating electrode 13 is completely covered inside the finally formed color filter layer 14.

[0078] In step S303, the covered color filter layer 14 is subjected to electrical heating curing.

[0079] The heating electrode 13 covered inside the color filter layer 14 is powered to generate heat to a high temperature (220°C, 225°C or 230°C). The heat is directly conducted from the inside to the color filter material surrounding it, with high heating efficiency. At the same time, since the heating electrode 13 is further away from the underlying organic light-emitting unit (separated by part of the color filter layer 14 and the complete encapsulation layer 11), its thermal influence is further reduced.

[0080] By directly integrating the heating electrode 13 inside the color filter layer 14 and combining the heat blocking effect of the heat insulation layer 12 inside the packaging layer 11, the color filter layer 14 can be fully and uniformly cured under the local high temperature generated by the energization of the heating electrode 13, and the heat insulation layer 12 and the packaging structure can effectively block the heat downward transmission, thereby completing the high-temperature curing process while minimizing the thermal impact on the underlying organic light-emitting unit. This scheme not only reduces the dependence on special low-temperature curing materials, widens the material selection range and helps to reduce costs, but also provides a structural basis for achieving more uniform heating, higher process efficiency and potential optical performance improvement (such as enhancing light extraction through high-refractive heat insulation layer 12).

[0081] Embodiment Four

[0082] Based on the above preparation method, as shown in Figure 4 or Figure 9 The display panel provided by the present application includes a substrate 10, an organic light-emitting unit disposed on the substrate 10, and a packaging layer 11 covering the organic light-emitting unit. The packaging layer 11 includes a first inorganic layer 111, an organic layer 112, a heat insulation layer 12, and a second inorganic layer 113 which are sequentially stacked. The display panel further includes a black matrix 142 and a color filter layer 14 of a plurality of sub-pixel color resistors. In the first display panel structure, the heating electrode 13 is disposed on the second inorganic layer 113, and the color filter layer 14 is disposed on the heating electrode 13. In the second display panel structure, the heating electrode 13 is embedded in the color filter layer 14 disposed on the packaging layer 11.

[0083] By directly integrating the heating electrode 13 inside the display panel and forming a specific up-down positional relationship with the color filter layer 14 (located below or embedded therein), and combining the heat blocking effect of the heat insulation layer 12 inside the packaging layer 11, the color filter layer 14 can be fully and uniformly cured under the local high temperature generated by the energization of the heating electrode 13, and the heat insulation layer 12 and the packaging structure can effectively block the heat downward transmission, thereby completing the high-temperature curing process while minimizing the thermal impact on the underlying organic light-emitting unit. This scheme not only reduces the dependence on special low-temperature curing materials, widens the material selection range and helps to reduce costs, but also provides a structural basis for achieving more uniform heating, higher process efficiency and potential optical performance improvement (such as enhancing light extraction through high-refractive heat insulation layer 12).

[0084] In the description of the specification, the description of the terms "some embodiments", "exemplarily" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0085] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application. Any changes or modifications made in accordance with the claims and specification of the present application shall be within the scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized in that, include: A substrate is provided on which organic light-emitting units are formed; An encapsulation layer is formed on the organic light-emitting unit, the encapsulation layer comprising a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer stacked sequentially; A heating electrode is formed on the second inorganic layer; A color filter layer is formed on the heating electrode, the color filter layer comprising a black matrix and multiple sub-pixel color resists; The color filter layer is cured by energizing the heating electrode to generate heat to provide the heat required for curing.

2. The preparation method according to claim 1, characterized in that, The steps of forming the color filter layer and performing a curing process include: Coating with photoresist material; The photoresist material is pre-cured at a first temperature to form a pre-cured photoresist layer; The pre-cured photoresist layer is patterned to form the black matrix and / or the sub-pixel color resist; At a second temperature higher than the first temperature, the patterned black matrix and / or the sub-pixel color resist are cured again.

3. The preparation method according to claim 2, characterized in that, The first temperature is below 100°C, and the second temperature is above 180°C.

4. The preparation method according to claim 1, characterized in that, The steps of forming the color filter layer and performing a curing process include: After completing the patterning of the black matrix and sub-pixel color resist, the heating electrode is energized to simultaneously heat and solidify the black matrix and sub-pixel color resist.

5. The preparation method according to claim 1, characterized in that, The heating electrode includes a first power line, a second power line, and a heating wire connected between the first power line and the second power line, the heating wire including a plurality of continuous bends.

6. A method for manufacturing a display panel, characterized in that, include: A substrate is provided on which an organic light-emitting unit and an encapsulation layer covering the organic light-emitting unit are formed. The encapsulation layer includes a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer stacked sequentially. On the second inorganic layer, a color filter layer is prepared by forming a pattern in steps, and a heating electrode is set and encapsulated in the color filter layer; The color filter layer is cured by energizing the heating electrode to generate heat to provide the heat required for curing.

7. The preparation method according to claim 6, characterized in that, The step-by-step pattern formation method includes: Forming the first pattern layer; The heating electrode is formed on the first portion of the patterned layer; A second partial pattern layer is formed on the heating electrode, the second partial pattern layer covering the heating electrode and the first partial pattern layer; The first part of the pattern layer and the second part of the pattern layer together constitute the color filter layer.

8. The preparation method according to claim 7, characterized in that, The steps of forming the first partial pattern layer and / or the second partial pattern layer include: coating a photoresist material, pre-curing, and exposure and development to form a pattern.

9. A display panel, characterized in that, include: substrate; Organic light-emitting units disposed on the substrate; An encapsulation layer covering the organic light-emitting unit, the encapsulation layer comprising a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer stacked sequentially; Heating electrodes disposed on the second inorganic layer; A color filter layer is disposed on the heating electrode, the color filter layer comprising a black matrix and sub-pixel color resists.

10. A display panel, characterized in that, include: substrate; Organic light-emitting units disposed on the substrate; An encapsulation layer covering the organic light-emitting unit, the encapsulation layer comprising a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer stacked sequentially; A color filter layer is disposed on the encapsulation layer, the color filter layer including a black matrix and sub-pixel color resists, and a heating electrode is embedded in the color filter layer.

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