Wafer ring jacking locking mechanism

Abstract

The application discloses a wafer ring jacking locking mechanism, aiming to provide a wafer ring jacking locking mechanism with simple structure, which can effectively avoid deformation caused by lateral clamping during integrated circuit manufacturing process by supporting the bottom of the wafer ring through multiple sets of swing arms synchronously, and improve locking precision through multiple sets of linkage positioning devices. The application comprises a locking assembly, an adjusting assembly and a jacking assembly. The locking assembly comprises a rotating platform, two sets of cover plates, a rotating module and a plurality of sets of locking modules. The rotating module is connected with the movable end of the adjusting assembly. The rotating platform is rotationally matched with the rotating module. The two sets of cover plates are arranged on the two sides of the upper end face of the rotating platform. The plurality of sets of locking modules are arranged on the rotating platform and drive the fixed end of the wafer ring to be matched with the two sets of cover plates. The jacking assembly is arranged at the lower end of the locking assembly and is matched with the wafer ring tray end on the upper end face of the rotating platform through the avoiding opening in the middle part of the rotating platform. The application is applied to the technical field of product positioning.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of product positioning, and particularly relates to a wafer ring jacking locking mechanism. BACKGROUND

[0002] In the field of integrated circuit manufacturing, production of special photolithography machines, etching machines and other semiconductor device manufacturing equipment, with the development of the semiconductor industry towards higher efficiency, lower cost and higher yield, fully automated production lines have become an inevitable trend. In the semiconductor back-end process, wafer probe testing is a key link for testing the electrical performance of chips. In this process, the wafer is usually loaded on a wafer ring (or carrier) composed of a metal frame and a film for easy transportation and positioning, and then transported to the chuck of the prober for testing. The automatic loading and unloading process of the wafer ring from the cassette to the chuck of the prober is one of the core links to achieve this trend. In the semiconductor wafer processing flow, the wafer ring needs to be frequently loaded and unloaded between different equipment. The traditional wafer ring loading and unloading method relies partly on manual operation, which not only consumes a lot of labor cost, but also is difficult to ensure the accuracy and consistency of each loading and unloading due to human factors. Manual operation is relatively slow and cannot meet the rhythm of modern semiconductor manufacturing high-speed production, which seriously restricts the improvement of production efficiency. In addition, under the trend of the gradual popularization of automation production, some existing wafer ring automatic loading and unloading equipment has many technical defects. In terms of locking reliability, some mechanisms cannot ensure the tight connection between the wafer ring and the equipment under high-speed operation and complex environment, and the wafer ring is prone to loosen, displace or even fall, which not only damages the wafer, but also may cause equipment failure, increase production cost and production interruption risk. Moreover, the existing loading and unloading locking mechanism performs poorly in compatibility and can only be applied to wafer rings of specific size and specification, which cannot effectively meet the increasingly diversified product demand of the semiconductor industry. If a wafer ring jacking locking mechanism with simple structure, which can effectively avoid the deformation problem caused by lateral clamping by synchronously supporting the bottom of the wafer ring through multiple sets of swing arms during the integrated circuit manufacturing process, and improve the locking precision through multiple sets of linkage positioning devices, can be designed. SUMMARY

[0003] The technical problem to be solved by the present application is to overcome the shortcomings of the prior art and provide a wafer ring jacking locking mechanism with simple structure, which can effectively avoid the deformation problem caused by lateral clamping by synchronously supporting the bottom of the wafer ring through multiple sets of swing arms during the integrated circuit manufacturing process, and improve the locking precision through multiple sets of linkage positioning devices.

[0004] The technical scheme adopted by the present application is: the present application comprises a locking assembly, an adjusting assembly and a jacking assembly, the locking assembly comprises a rotating platform, two sets of cover plates, a rotating module and a plurality of sets of locking modules, the rotating module is connected with the movable end of the adjusting assembly, the rotating platform is rotationally connected with the rotating module, the two sets of cover plates are arranged on the upper end faces of the rotating platform on both sides, and a plurality of sets of locking modules are arranged on the rotating platform and drive the fixed end of the wafer ring to cooperate with the two sets of cover plates, and the jacking assembly is arranged at the lower end of the locking assembly and cooperates with the wafer ring tray end on the upper end face of the rotating platform through the avoiding opening in the middle of the rotating platform.

[0005] Further, the rotating module comprises a rotating bottom plate, a rotating motor, a rotating base and a rotating ring, the rotating bottom plate is connected with the movable end of the adjusting assembly, the rotating base is arranged in the middle of the rotating bottom plate, the rotating motor is arranged on one side of the rotating bottom plate and rotationally cooperates with the rotating ring through a transmission belt, and the rotating platform is connected with the upper end face of the rotating ring.

[0006] Further, the adjusting assembly comprises a horizontal linear module and a vertical linear module, the vertical linear module is connected with the movable end of the horizontal linear module, and the rotating bottom plate is connected with the movable end of the vertical linear module.

[0007] Further, the locking module comprises a side pushing cylinder, a side pushing block, a locking bottom plate, a locking push plate, a locking slide rail and an arm jacking plate, a plurality of sets of side pushing cylinders are arranged on the upper end face of the rotating bottom plate, a plurality of sets of locking bottom plates are arranged in the mounting groove on the upper end of the rotating platform close to the avoiding opening, the locking push plate is slidingly connected with the locking bottom plate through the locking slide rail, the hinge end of the arm jacking plate is hingedly connected with one end of the locking bottom plate close to the side pushing cylinder, the rolling wheel is arranged on the lower end of the jacking end of the arm jacking plate, one end of the locking push plate is connected with the movable end of the side pushing block, the jacking slope is arranged on the other end of the locking push plate, and the jacking slope cooperates with the rolling wheel.

[0008] Further, the side pushing block is provided with a side pushing roller on the upper end face, and the locking push plate is provided with an avoiding clamping groove corresponding to the side pushing block.

[0009] Further, the jacking end of the arm jacking plate is provided with a buffer pressing block on the upper end, and the buffer pressing block cooperates with the lower end face of the wafer ring.

[0010] Furthermore, a test component is provided above the locking component. The test component includes a test bracket, a test lifting module, and a test head. The test lifting module is connected to the fixed end of an external test machine. The fixed end of the test bracket is connected to the movable end of the test lifting module. The test head is connected to the test end of the test bracket and cooperates with the wafer ring tray end.

[0011] Furthermore, a rotation sensor is provided on one side of the upper surface of the rotating base plate, and a grating ruler is provided on the outer edge of the rotating ring. The rotation sensor and the grating ruler are in sensing cooperation.

[0012] Furthermore, the upper surface of the rotating base plate is provided with several stops, and the lower end of the rotating platform is provided with a limit block, which cooperates with the several stops.

[0013] Furthermore, the lifting assembly includes a lifting base, a lifting cylinder, and a lifting rod. The lifting base is connected to the lifting end of an external testing machine. The lifting cylinder is disposed on the upper surface of the lifting base. The lifting rod is connected to the movable end of the lifting cylinder. The lifting cylinder drives the lifting rod to cooperate with the wafer ring tray end.

[0014] The beneficial effects of this invention are as follows: The purpose of this invention is to provide an automatic wafer ring loading, unloading, lifting, and clamping solution. It supports the wafer ring from the bottom and applies a controllable locking force vertically, completely avoiding deformation caused by lateral clamping and ensuring the stability and integrity of the testing foundation. It offers higher positioning accuracy by optimizing the positioning structure and sensing system to ensure accurate positioning of the wafer ring after loading and unloading, meeting the high-precision semiconductor processing requirements. It also improves locking reliability by designing locking components adapted to the wafer ring structure, maintaining stable locking under complex conditions such as high-speed operation and environmental changes, preventing the wafer ring from loosening or falling. Furthermore, it enhances compatibility by adapting to wafer rings of different sizes and specifications through an adjustable mechanical structure and adaptive control logic, reducing the difficulty of component replacement and improving equipment versatility. Finally, it increases automation integration by constructing a fully automated mechanism from wafer ring feeding to precise positioning and reliable locking, requiring no manual intervention and seamlessly integrating into high-speed automated production lines, thereby improving overall production efficiency. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present invention;

[0016] Figure 2 This is an exploded view of the locking component;

[0017] Figure 3 This is a three-dimensional view of the locking module;

[0018] Figure 4 This is a three-dimensional view of another state of the locking module;

[0019] Figure 5 This is a perspective view of the rotating module;

[0020] Figure 6 This is a perspective view of the lifting assembly;

[0021] Figure 7 This is a three-dimensional view of the test component. Detailed Implementation

[0022] like Figures 1 to 6 As shown, in this embodiment, the present invention includes a locking component 1, an adjusting component 2, and a lifting component 3. The locking component 1 includes a rotating platform 4, two sets of cover plates 5, a rotating module 6, and several sets of locking modules 7. The rotating module 6 is connected to the movable end of the adjusting component 2. The rotating platform 4 and the rotating module 6 are rotatably engaged. The two sets of cover plates 5 are disposed on both sides of the upper surface of the rotating platform 4. Several sets of locking modules 7 are arrayed on the rotating platform 4 and drive the fixed end of the wafer ring 8 to engage with the two sets of cover plates 5. The lifting component 3 is disposed at the lower end of the locking component 1 and engages with the tray end of the wafer ring 8 on the upper surface of the rotating platform 4 through the clearance opening 9 in the middle of the rotating platform 4. Therefore, the locking module 7 supports the wafer ring 8 from the bottom, ensuring it fits snugly against the cover plates 5 and applies a controllable locking force vertically, completely avoiding deformation caused by lateral clamping and ensuring the stability and integrity of the test base. It maintains stable locking under complex conditions such as high-speed operation and environmental changes, preventing the wafer ring from loosening or falling off. Enhanced compatibility: Adjustable mechanical structure and adaptive control logic allow for adaptation to wafer rings of different sizes and specifications, reducing component replacement difficulty and improving equipment versatility. Increased automation integration: A fully automated mechanism is built from wafer ring feeding to precise positioning and reliable locking, requiring no manual intervention and seamlessly integrating into high-speed automated production lines to improve overall production efficiency.

[0023] like Figure 1 , Figure 2 as well as Figure 5 As shown, in this embodiment, the rotating module 6 includes a rotating base plate 61, a rotating motor 62, a rotating base 63, and a rotating ring 64. The rotating base plate 61 is connected to the movable end of the adjusting component 2. The rotating base 63 is located in the middle of the rotating base plate 61. The rotating motor 62 is located on one side of the rotating base plate 61 and rotates in cooperation with the rotating ring 64 via a transmission belt 65. The rotating platform 4 is connected to the upper surface of the rotating ring 64. Therefore, the rotating motor 62 can drive the rotating ring 64 to rotate at different speeds, making it suitable for different working conditions.

[0024] like Figure 1As shown, in this embodiment, the adjustment component 2 includes a horizontal linear module 21 and a vertical linear module 22. The vertical linear module 22 is connected to the movable end of the horizontal linear module 21, and the rotating base plate 61 is connected to the movable end of the vertical linear module 22. Therefore, the horizontal linear module 21 and the vertical linear module 22 can achieve position adjustment in a planar area, resulting in higher docking accuracy between the rotating platform and the external feeding mechanism.

[0025] like Figures 2 to 4 As shown, in this embodiment, the locking module 7 includes a side-push cylinder 71, a side-push block 72, a locking base plate 73, a locking push plate 74, a locking slide rail 75, and a swing arm lifting plate 76. Several sets of the side-push cylinders 71 are arrayed on the upper surface of the rotating base plate 61, and several sets of the locking base plates 73 are arrayed in the mounting groove 10 near the clearance opening 9 on the upper end of the rotating platform 4. The locking push plate 74 slides with the locking base plate 73 through the locking slide rail 75. The hinged end of the swing arm lifting plate 76 is hinged to the end of the locking base plate 73 near the side-push cylinder 71. A rolling wheel 77 is provided at the lower end of the lifting end of the swing arm lifting plate 76. One end of the locking push plate 74 cooperates with the movable end of the side-push block 72, and a lifting ramp 78 is provided at the upper end of the other end of the locking push plate 74. The lifting ramp 78 cooperates with the rolling wheel 77. Therefore, the extension or resetting of the movable end of the side-push cylinder 71 allows the rolling wheel 77 to slide on the lifting ramp 78, thereby realizing the rotation of the swing arm lifting plate 76. During the rotation, the contact point between the swing arm lifting plate 76 and the bottom of the wafer ring 8 is relatively fixed, which will not cause friction from lateral movement and can effectively avoid scratching the wafer ring.

[0026] like Figures 2 to 4 As shown, in this embodiment, the upper surface of the side push block 72 is provided with a side push roller 11, and the locking push plate 74 is provided with a clearance slot 12 at one end corresponding to the side push block 72. The side push roller 11 cooperates with the clearance slot 12. Therefore, when the swing arm lifting plate 76 lifts the wafer ring 8 and the rotating platform 4 drives the wafer ring 8 to rotate, the clearance slot 12 can achieve a clearance effect. Furthermore, the side push cylinder 71 can only drive the swing arm lifting plate 76 to unlock the wafer ring 8 when the side push roller 11 and the clearance slot 12 are precisely aligned.

[0027] like Figure 3 and Figure 4 As shown, in this embodiment, a buffer block 13 is provided at the upper end of the lifting end of the swing arm lifting plate 76, and the buffer block 13 cooperates with the lower end face of the wafer ring 8. Therefore, the buffer block 13 provides a buffering effect when lifting and locking the wafer ring 8, preventing scratches on the product.

[0028] like Figure 1 and Figure 7 As shown, in this embodiment, a test component 14 is disposed above the locking component 1. The test component 14 includes a test bracket 141, a test lifting module 142, and a test head 143. The test lifting module 142 is connected to the fixed end of an external testing machine. The fixed end of the test bracket 141 is connected to the movable end of the test lifting module 142. The test head 143 is connected to the test end of the test bracket 141 and cooperates with the tray end of the wafer ring 8. Therefore, when the wafer ring 8 is in the locked and positioned state, the test lifting module 142 can drive the test head 143 to test the wafer ring 8.

[0029] like Figure 2 and Figure 5 As shown, in this embodiment, a rotation sensor 15 is provided on one side of the upper surface of the rotating base plate 61, and a grating ruler 66 is provided on the outer edge of the rotating ring 64. The rotation sensor 15 and the grating ruler 66 are inductively coupled. Therefore, the rotation sensor 15 and the grating ruler 66 cooperate to ensure that the rotating platform 4 achieves precise rotation.

[0030] like Figure 5 As shown, in this embodiment, the upper surface of the rotating base plate 61 is provided with a plurality of stops 16, and the lower end of the rotating platform 4 is provided with a limit block 17, which cooperates with the plurality of stops 16. Therefore, the plurality of stops 16 can limit the rotation angle of the rotating platform 4, resulting in higher safety.

[0031] like Figure 1 and Figure 6 As shown, in this embodiment, the lifting assembly 3 includes a lifting base 31, a lifting cylinder 32, and a lifting rod 33. The lifting base 31 is connected to the lifting end of an external testing machine. The lifting cylinder 32 is disposed on the upper surface of the lifting base 31. The lifting rod 33 is connected to the movable end of the lifting cylinder 32. The lifting cylinder 32 drives the lifting rod 33 to cooperate with the tray end of the wafer ring 8. Therefore, the lifting rod 33 can lift the tray in the middle of the wafer ring 8, making the material handling equipment or testing equipment more stable during material handling or testing, preventing displacement or deformation.

[0032] The working principle of this invention is as follows: Before the equipment is started, the movable ends of the four sets of side-push cylinders 71 are in the pushed-out state, and the four sets of swing arm lifting plates 76 are in the low position state. The external feeding mechanism drives the wafer ring 8 to enter the space between the rotating platform 4 and the two sets of cover plates 5 laterally. After positioning with the help of the external visual inspection mechanism, the wafer ring 8 is placed in the middle of the rotating platform 4. After the feeding is completed, the rotating module 6 drives the rotating platform 4 to rotate, and the four sets of side-push rollers 11 fall into the corresponding avoidance slots 12. The movable ends of the side-push cylinders 71 are reset and drive the rollers 77 to roll upward on the lifting ramp 78, so that the swing arm lifting plates 76 are flipped upward and the wafer ring 8 is pressed and locked on the lower end face of the cover plate 5. The lifting component 3 lifts the tray in the middle of the wafer ring 8 to realize subsequent testing or material removal. After the testing or material removal is completed, each component is reset, the wafer ring to be tested is replaced, and the above steps are repeated to realize the lifting and locking of the wafer ring.

[0033] Although the embodiments of the present invention are described with reference to actual solutions, they do not constitute a limitation on the meaning of the present invention. Modifications to the embodiments and combinations with other solutions based on this specification will be obvious to those skilled in the art.

Claims

1. A wafer ring lifting and locking mechanism, comprising a locking assembly (1), an adjusting assembly (2), and a lifting assembly (3), characterized in that: The locking assembly (1) includes a rotating platform (4), two sets of cover plates (5), a rotating module (6), and several sets of locking modules (7). The rotating module (6) is connected to the movable end of the adjusting assembly (2). The rotating platform (4) and the rotating module (6) rotate in cooperation. The two sets of cover plates (5) are set on both sides of the upper surface of the rotating platform (4). Several sets of locking modules (7) are arrayed on the rotating platform (4) and drive the fixed end of the wafer ring (8) to cooperate with the two sets of cover plates (5). The lifting assembly (3) is set at the lower end of the locking assembly (1) and cooperates with the wafer ring (8) tray end on the upper surface of the rotating platform (4) through the clearance opening (9) in the middle of the rotating platform (4). The rotating module (6) includes a rotating base plate (61), a rotating motor (62), a rotating base (63), and a rotating ring (64). The rotating base plate (61) is connected to the movable end of the adjusting component (2). The rotating base (63) is located in the middle of the rotating base plate (61). The rotating motor (62) is located on one side of the rotating base plate (61) and rotates with the rotating ring (64) through a transmission belt (65). The rotating platform (4) is connected to the upper surface of the rotating ring (64). The locking module (7) includes a side-push cylinder (71), a side-push block (72), a locking base plate (73), a locking push plate (74), a locking slide rail (75), and a swing arm lifting plate (76). Several sets of the side-push cylinders (71) are arranged in an array on the upper surface of the rotating base plate (61), and several sets of the locking base plates (73) are arranged in an array in the mounting groove (10) near the clearance opening (9) on the upper end of the rotating platform (4). The locking push plate (74) is connected to the locking slide rail (76) via the side-push cylinder (71), a side-push block (72), a locking base plate (73), a locking push plate (74), a locking slide rail (75), and a swing arm lifting plate (76). 5) It slides with the locking base plate (73). The hinge end of the swing arm lifting plate (76) is hinged to the end of the locking base plate (73) near the side push cylinder (71). The lower end of the lifting end of the swing arm lifting plate (76) is provided with a rolling wheel (77). One end of the locking push plate (74) is engaged with the movable end of the side push block (72). The upper end of the other end of the locking push plate (74) is provided with a lifting ramp (78). The lifting ramp (78) is engaged with the rolling wheel (77).

2. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: The adjustment component (2) includes a horizontal linear module (21) and a vertical linear module (22). The vertical linear module (22) is connected to the movable end of the horizontal linear module (21), and the rotating base plate (61) is connected to the movable end of the vertical linear module (22).

3. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: The side push block (72) is provided with a side push roller (11) on its upper end surface. The locking push plate (74) is provided with a clearance slot (12) at one end corresponding to the side push block (72). The side push roller (11) cooperates with the clearance slot (12).

4. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: The upper end of the lifting plate (76) of the swing arm is provided with a buffer block (13), which is in contact with the lower end face of the wafer ring (8).

5. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: A test component (14) is provided above the locking component (1). The test component (14) includes a test bracket (141), a test lifting module (142), and a test head (143). The test lifting module (142) is connected to the fixed end of an external test machine. The fixed end of the test bracket (141) is connected to the movable end of the test lifting module (142). The test head (143) is connected to the test end of the test bracket (141) and cooperates with the tray end of the wafer ring (8).

6. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: A rotation sensor (15) is provided on one side of the upper surface of the rotating base plate (61), and a grating ruler (66) is provided on the outer edge of the rotating ring (64). The rotation sensor (15) and the grating ruler (66) are in sensing cooperation.

7. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: The upper surface of the rotating base plate (61) is provided with several stops (16), and the lower end of the rotating platform (4) is provided with a limit block (17), which cooperates with several stops (16).

8. The wafer ring lifting and locking mechanism according to claim 1, characterized in that: The lifting assembly (3) includes a lifting base (31), a lifting cylinder (32), and a lifting rod (33). The lifting base (31) is connected to the lifting end of an external testing machine. The lifting cylinder (32) is located on the upper surface of the lifting base (31). The lifting rod (33) is connected to the movable end of the lifting cylinder (32). The lifting cylinder (32) drives the lifting rod (33) to cooperate with the tray end of the wafer ring (8).

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