Multi-station automatic sintering machine for embedded chip and automatic sintering method thereof

Abstract

This invention provides a multi-station automatic sintering machine for embedded chips and its automatic sintering method. The machine includes a frame with a main controller, a sintering mechanism, a transfer mechanism, a first transmission mechanism, and a second transmission mechanism on its upper surface. The main controller is electrically connected to both the first and second transmission mechanisms. The transfer mechanism includes a feeding rack and multiple support platforms. Multiple first pads are provided on the first long side of the feeding rack, and multiple second pads are provided on the second long side. The first and second pads are arranged opposite each other to form a hollow support plate for receiving PCB boards. The hollow portion of the hollow support plate is located above the support platforms. The sintering mechanism includes a hot-pressing pin and a pressing assembly. The hot-pressing pin is located above the support platforms and is mechanically connected to the bottom of the pressing assembly. The pressing assembly is electrically connected to the main controller. This system enables automatic and precise positioning and transfer of PCB boards between multiple stations, significantly improving production efficiency and process consistency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a multi-station automatic sintering machine for embedded chips and its automatic sintering method. Background Technology

[0002] In the semiconductor packaging field, the chip sintering process in integrated circuit manufacturing has extremely high requirements for connection reliability and production efficiency. Traditional single-cavity sintering equipment has significant bottlenecks: its serial operation mode results in a long average sintering cycle (usually several minutes to tens of minutes), and the heating and cooling rates are limited, making it difficult to meet the needs of large-scale production in terms of unit capacity (UPH); at the same time, the single-cavity structure makes it difficult to achieve independent and precise temperature and pressure control at multiple stations, and insufficient temperature and pressure uniformity can easily lead to high void ratios and uneven thicknesses in the chip interconnect layers, affecting product yield and long-term reliability. In addition, frequent manual loading and unloading interventions can easily introduce operational fluctuations and contamination risks. Therefore, there is an urgent need for a sintering equipment solution that can achieve efficient continuous production, high process consistency, and full automation. Summary of the Invention

[0003] The main objective of this invention is to propose a multi-station automatic sintering machine for embedded chips and its automatic sintering method, which can realize the automatic and precise positioning and transfer of PCB boards between multiple stations. Combined with the independent sintering operation of each station by the sintering mechanism, it significantly improves production efficiency and process consistency.

[0004] To achieve the above objectives, a first aspect of the present invention provides a multi-station automatic sintering machine for embedded chips, comprising:

[0005] The frame has a main controller, a sintering mechanism, a transfer mechanism, a first transmission mechanism, and a second transmission mechanism on its upper surface. The main controller is electrically connected to the first transmission mechanism and the second transmission mechanism respectively.

[0006] The transfer mechanism includes a feeding rack and multiple support platforms. The first long side of the feeding rack is provided with multiple first pads, and the second long side of the feeding rack is provided with multiple second pads. The first pads and the second pads are arranged opposite to each other to form a hollow support plate for receiving PCB boards. The hollow part of the hollow support plate is located above the support platform. The first transmission mechanism is used to control the horizontal movement of the feeding rack, and the second transmission mechanism is used to control the vertical movement of the feeding rack.

[0007] The sintering mechanism includes a hot pressing needle and a pressing assembly. The hot pressing needle is located above the support platform and is mechanically connected to the bottom of the pressing assembly. The pressing assembly is electrically connected to the main controller.

[0008] The main controller is used to control the first transmission mechanism to move the PCB board on the hollow carrier plate to the bottom of the hot press needle, control the second transmission mechanism to place the PCB board on the hollow carrier plate onto the lower support platform, and control the pressing component to press the hot press needle into the PCB board on the support platform for sintering.

[0009] Furthermore, in some embodiments, the first transmission mechanism includes a first cylinder and a first stepper motor. The first stepper motor is fixed to the upper surface of the frame and located below the feeding rack. The first cylinder is mechanically connected to the first short side of the feeding rack.

[0010] The main controller is also used to drive the first stepper motor to make the first cylinder push and pull. The first cylinder is used to drive the feeder to move horizontally through its own push and pull motion.

[0011] Furthermore, in some embodiments, the second transmission mechanism includes a second cylinder, a second stepper motor, and a lifting assembly. The second stepper motor is fixed to the upper surface of the frame and located on the side of the transfer mechanism. The second cylinder is mechanically connected to the lifting assembly, and the lifting assembly is sleeved with the first long side or the second long side of the feeding rack.

[0012] The main controller is also used to drive the second stepper motor to make the second cylinder push and pull. The second cylinder is used to control the lifting assembly to lift the feeding rack based on its own push and pull motion so that the PCB board on the hollow carrier plate is placed on the support platform below.

[0013] Furthermore, in some embodiments, the lifting assembly includes a lifting platform and a transmission device;

[0014] The lifting platform includes a support plate, multiple spring columns, multiple inclined blocks, and multiple connecting blocks. The spring columns are located below the support plate, the connecting blocks are located on the top surface of the support plate, and the inclined blocks are located on the bottom surface of the support plate. One end of the spring column is connected to the bottom surface of the support plate, and the other end of the spring column is connected to the top surface of the frame. One side of the connecting block is provided with a third slot, which is used for the first long side or the second long side to engage.

[0015] The transmission device includes a guide rail and a raised slider. The guide rail is located on the top surface of the frame, and the slider is embedded in the guide rail. The raised part of the slider contacts the inclined surface of the inclined block. The slider is used to change the relative height between the slider and the inclined block by moving horizontally on the guide rail.

[0016] Furthermore, in some embodiments, the feeding rack is also provided with a long strip and two first limiting blocks. One end of the long strip is connected to the first long side, and the other end of the long strip is connected to the second long side. The long strip is adjacent to the first short side of the feeding rack, and the two first limiting blocks are respectively located at both ends of the lower surface of the long strip.

[0017] Furthermore, in some embodiments, the first transmission mechanism is also provided with a limiting component, which is located below the feeding rack and is positioned horizontally between the long strip and the first short side.

[0018] The limiting component includes a first corner seat, a second corner seat, a second limiting block, and a third limiting block. The bottoms of the first and second corner seats are fixed to the upper surface of the frame. The first and second corner seats are arranged side by side. The second limiting block is fixed to the top of the first corner seat. The second limiting block and the first limiting block are positioned opposite each other in the horizontal direction. The third limiting block is fixed to the top of the second corner seat. The third limiting block is used to constrain the transmission of the first transmission mechanism to the feeding rack in the vertical direction.

[0019] The third limiting block includes a first transmission component, a rotating shaft, a second transmission component, and a limiting component. One end of the first transmission component is connected to the feeding frame, the other end of the feeding frame is connected to the rotating shaft, the rotating shaft is connected to one end of the second transmission component, and the limiting component is connected to the other end of the second transmission component.

[0020] Furthermore, in some embodiments, the first pad or the second pad includes a lug structure and a plate structure;

[0021] The board structure includes a first strip plate, a second strip plate, and a connecting plate. The first strip plate is connected to the second strip plate based on the connecting plate. The first strip plate is used to support the PCB board. The first strip plate is provided with a plurality of first positioning pins, which are used to limit the PCB board.

[0022] The ear-hanging structure includes a first side plate and a second side plate. The first side plate is perpendicularly connected to the second side plate. A first slot is provided on one side of the first side plate. The first slot is used to fit the first long side or the second long side. A second slot is provided on one side of the second side plate. The second slot fits into the second strip plate.

[0023] Furthermore, in some embodiments, the pressing component includes a pressing platform and a pressing driver, with the pressing driver located below the pressing platform and used to control the pressing platform to descend or rise.

[0024] The pressure drive includes rollers and a drive shaft. The rollers are mechanically connected to the drive shaft. The rollers are used to provide power to the pressure platform by rotation, and the drive shaft is used to convert the rotation into vertical movement of the pressure platform.

[0025] Furthermore, in some embodiments, the support platform includes a support frame and a heating plate. The heating plate is located on top of the support frame and is used to preheat the PCB board on the feeding rack. The top of the heating plate is also provided with a plurality of second positioning pins, which are used to limit the PCB board.

[0026] To achieve the above objectives, a second aspect of the present invention provides a multi-station automatic sintering machine, wherein a main controller is applied within the multi-station automatic sintering machine of the first aspect, comprising:

[0027] In response to the operation command that the PCB board has been placed on the first hollow carrier plate of the feeding rack, the first transmission mechanism is controlled to move forward to move the PCB board horizontally under the hot press needle, wherein the first hollow carrier plate is a hollow carrier plate that is not located under the hot press needle.

[0028] In response to the operation that the PCB board has been moved to the bottom of the hot press needle, the second transmission mechanism is controlled to move downward to place the PCB board onto the support platform below the hot press needle;

[0029] In response to the operation of the PCB board being placed on the carrier platform, the first transmission mechanism is controlled to drive backward to reset the first hollow carrier board, and the pressing component is controlled to press the hot pressing needle into the PCB board for sintering.

[0030] In response to the completion of PCB board sintering, the second transmission mechanism is controlled to move upward to transfer the PCB board to the second hollow load plate of the feeding rack, wherein the second hollow load plate is a hollow load plate located below the hot pressing needle;

[0031] In response to the operation of transferring the PCB board to the second empty carrier board, the first transmission mechanism is controlled to move forward to move the PCB board out under the hot press pin.

[0032] The embodiments of this invention have the following beneficial effects: By coordinating the transfer mechanism, the first transmission mechanism, the second transmission mechanism, and the main controller, the automatic and precise positioning and transfer of the PCB board between multiple workstations is achieved. Combined with the independent sintering operation of each workstation by the sintering mechanism, production efficiency and process consistency are significantly improved. Specifically, the main controller coordinates the first and second transmission mechanisms to realize the horizontal and vertical movement of the feeding rack, automatically and continuously transferring the PCB board to the carrier platform at different positions for parallel operation (loading, positioning, sintering, and unloading), greatly shortening the sintering cycle of a single chip, realizing uninterrupted continuous production, and effectively increasing the output per hour. At the same time, by configuring independent hot pressing needles and pressing components, the sintering process of the PCB board can be independently and precisely controlled in terms of temperature and pressure. The precise positioning of the PCB board through the cooperation between the hollow carrier board and the carrier platform (ensuring that the hot pressing needles act accurately on the target area) minimizes human intervention and positioning deviation, thereby ensuring an extremely low void ratio, uniform thickness, and shear strength of the chip interconnect layer, significantly improving product yield and long-term reliability. Attached Figure Description

[0033] Figure 1 This is an optional overall structural diagram of the multi-station automatic sintering machine provided in this embodiment of the invention;

[0034] Figure 2 This is an optional exploded view of the transfer mechanism, the first transmission mechanism, and the second transmission mechanism provided in the embodiments of the present invention;

[0035] Figure 3 This is an optional structural diagram of the support platform provided in an embodiment of the present invention;

[0036] Figure 4 This is an optional structural diagram of the sintering mechanism provided in an embodiment of the present invention;

[0037] Figure 5 This is an exploded view of an optional first transmission mechanism provided in an embodiment of the present invention;

[0038] Figure 6 This is an optional structural diagram of the third limiting block provided in an embodiment of the present invention;

[0039] Figure 7 This is an alternative exploded view of the transfer mechanism, the first transmission mechanism, and the second transmission mechanism provided in the embodiments of the present invention;

[0040] Figure 8 This is an exploded view of an optional second transmission mechanism provided in an embodiment of the present invention;

[0041] Figure 9 This is an optional exploded view of the first or second pad provided in an embodiment of the present invention;

[0042] Figure 10 This is an optional flowchart of an automatic sintering method for a multi-station automatic sintering machine provided in an embodiment of the present invention.

[0043] Figure description: Rack 10, main controller 11;

[0044] Sintering mechanism 12, hot pressing needle 121, pressing assembly 122, pressing platform 1221, pressing driver 1222, roller 12221, drive shaft 12222;

[0045] Transfer mechanism 13, feeding rack 131, first pad 1311, second pad 1312, hanging ear structure 13121, first side plate 131211, first slot 1312111, second side plate 131212, second slot 1312121, plate structure 13122, first strip plate 131221, first positioning pin 1312211, second strip plate 131222, connecting plate 131223, long strip plate 1313, first limiting block 1314, bearing platform 132, bearing rack 1321, heating plate 1322, second positioning pin 13221;

[0046] First transmission mechanism 14, first cylinder 141, first stepper motor 142, limiting component 143, first corner seat 1431, second corner seat 1432, second limiting block 1433, third limiting block 1434, first transmission component 14341, rotating shaft 14342, second transmission component 14343, limiting component 14344;

[0047] Second transmission mechanism 15, second cylinder 151, second stepper motor 152, lifting assembly 153, lifting platform 1531, support plate 15311, spring column 15312, inclined block 15313, connecting block 15314, transmission device 1532, guide rail 15321, slider 15322.

[0048] Sintered outer shell 16, PCB board 20. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0050] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0051] It should also be noted that in the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to limit the invention.

[0053] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] In the semiconductor packaging field, the chip sintering process in integrated circuit manufacturing has extremely high requirements for connection reliability and production efficiency. Traditional single-cavity sintering equipment has significant bottlenecks: its serial operation mode results in a long average sintering cycle (usually several minutes to tens of minutes), and the heating and cooling rates are limited, making it difficult to meet the needs of large-scale production in terms of unit capacity (UPH); at the same time, the single-cavity structure makes it difficult to achieve independent and precise temperature and pressure control at multiple stations, and insufficient temperature and pressure uniformity can easily lead to high void ratios and uneven thicknesses in the chip interconnect layers, affecting product yield and long-term reliability. In addition, frequent manual loading and unloading interventions can easily introduce operational fluctuations and contamination risks. Therefore, there is an urgent need for a sintering equipment solution that can achieve efficient continuous production, high process consistency, and full automation.

[0055] Based on this, embodiments of the present invention provide a multi-station automatic sintering machine for embedded chips and an automatic sintering method thereof, which can realize the automatic and precise positioning and transfer of PCB boards between multiple stations. Combined with the independent sintering operation of each station by the sintering mechanism, production efficiency and process consistency are significantly improved.

[0056] The present invention provides a multi-station automatic sintering machine and automatic sintering method for embedded chips, which are specifically described through the following embodiments.

[0057] It should be noted that the multi-station automatic sintering machine provided in this embodiment of the invention is mainly used for sintering and connecting chips (dies) on PCBs / substrates (DBC, AMB, etc.), especially for the mounting of power semiconductor chips (such as IGBTs, MOSFETs, SiC, GaN) and large-size chips (such as CPUs, GPUs). The materials sintered by the multi-station automatic sintering machine are mainly nano-silver paste / silver sintering paste or copper paste / copper sintering paste. These materials undergo a sintering reaction under high temperature, high pressure, and a specific atmosphere to form a bonding layer with properties close to those of bulk silver / copper.

[0058] Meanwhile, the core function of the multi-station automatic sintering machine provided in this embodiment of the invention is to enable the silver / copper sintering material between the chip and the substrate (PCB, ceramic substrate, etc.) to undergo a densification reaction under controlled high temperature, high pressure, and protective atmosphere (usually nitrogen N2 or formic acid / formic acid + nitrogen) to form a highly reliable metallurgical connection.

[0059] Firstly, referring to Figures 1 to 4 As shown, Figure 1 This is an optional overall structural diagram of the multi-station automatic sintering machine provided in an embodiment of the present invention. Figure 2 This is an exploded view of an optional transfer mechanism, a first transmission mechanism, and a second transmission mechanism provided in an embodiment of the present invention. Figure 3 This is an optional structural diagram of the support platform provided in an embodiment of the present invention. Figure 4 This is an optional structural diagram of the sintering mechanism provided in an embodiment of the present invention. The multi-station automatic sintering machine includes a frame 10. The upper surface of the frame 10 is provided with a main controller 11, a sintering mechanism 12, a transfer mechanism 13, a first transmission mechanism 14, a second transmission mechanism 15, and a sintering shell 16. The main controller 11 is electrically connected to the first transmission mechanism 14 and the second transmission mechanism 15 respectively. The first transmission mechanism 14 is used to control the horizontal movement of the feeding rack 131, and the second transmission mechanism 15 is used to control the vertical movement of the feeding rack 131. The sintering shell 16 covers the sintering mechanism 12 and provides a sealed protective atmosphere environment for the sintering mechanism 12 during the sintering of the PCB board 20.

[0060] Among them, from Figure 2 It is known that the transfer mechanism 13 includes a feeding rack 131 and multiple support platforms 132. The first long side of the feeding rack 131 is provided with multiple first pads 1311, and the second long side of the feeding rack 131 is provided with multiple second pads 1312. The first pads 1311 and the second pads 1312 are arranged opposite to each other to form a hollow support plate for receiving the PCB board 20. The hollow part of the hollow support plate is located above the support platform 132.

[0061] Furthermore, from Figure 4 It is known that the sintering mechanism 12 includes a hot pressing needle 121 and a pressing assembly 122. The hot pressing needle 121 is located above the support platform 132. The hot pressing needle 121 is mechanically connected to the bottom of the pressing assembly 122. The pressing assembly 122 is electrically connected to the main controller 11. The main controller 11 is used to control the first transmission mechanism 14 to move the PCB board 20 on the hollow carrier plate to the bottom of the hot pressing needle 121, control the second transmission mechanism 15 to place the PCB board 20 on the hollow carrier plate onto the support platform 132 below, and control the pressing assembly 122 to press the hot pressing needle 121 down into the PCB board 20 on the support platform 132 for sintering.

[0062] Furthermore, the pressing assembly 122 includes a pressing platform 1221 and a pressing driver 1222. The pressing driver 1222 is located below the pressing platform 1221 and is used to control the pressing platform 1221 to descend or rise. The pressing driver 1222 includes a roller 12221 and a drive shaft 12222. The roller 12221 is mechanically connected to the drive shaft 12222. The roller 12221 is used to provide power to the pressing platform 1221 by rotation, and the drive shaft 12222 is used to convert the rotation into vertical movement of the pressing platform 1221.

[0063] It should be noted that, through the coordinated control of the transfer mechanism 13 (including the feeding rack 131, the hollow carrier plate formed by the first / second pad 1312, and multiple carrier platforms 132), the first transmission mechanism 14 (horizontal movement), the second transmission mechanism 15 (vertical movement), and the main controller 11, the automatic and precise positioning and transfer of the PCB board 20 between multiple workstations is achieved. Combined with the independent sintering operation of each workstation by the sintering mechanism 12 (hot pressing pin 121 and pressing assembly 122), production efficiency and process consistency are significantly improved. Specifically, by coordinating the first transmission mechanism 14 and the second transmission mechanism 15 through the main controller 11 to realize the horizontal and vertical movement of the feeding rack 131, the PCB board 20 is automatically and continuously transferred to carrier platforms 132 at different positions for parallel operation (loading, positioning, sintering, unloading), significantly shortening the average sintering time (cycle) of a single chip. This invention enables uninterrupted continuous production, effectively increasing output per hour. Traditional single-cavity furnaces may take several minutes to over ten minutes to process a batch (limited by heating and cooling rates), while the automatic sintering machine of this invention can complete the entire sintering process of a chip in tens of seconds to one or two minutes. At the same time, by configuring independent hot pressing pins 121 and pressing components 122, the sintering process of the PCB board 20 can be independently and precisely controlled in terms of temperature and pressure. The precise positioning of the PCB board 20 through the cooperation between the hollow carrier board and the support platform 132 (ensuring that the hot pressing pins 121 act accurately on the target area) minimizes human intervention and positioning deviation, thereby ensuring extremely low void ratio, uniform thickness and shear strength of the chip connection layer, significantly improving product yield and long-term reliability.

[0064] Furthermore, from Figure 2 It is known that the feeding rack 131 is also provided with a long strip 1313 and two first limiting blocks 1314. One end of the long strip 1313 is connected to the first long side of the feeding rack 131, and the other end of the long strip 1313 is connected to the second long side. The long strip 1313 is adjacent to the first short side of the feeding rack 131, and the two first limiting blocks 1314 are respectively provided at both ends of the lower surface of the long strip 1313.

[0065] It should be noted that, in this embodiment of the invention, the long strip 1313 spans across the first long side and the second long side of the feeding rack 131 to form an "H-shaped" reinforced frame, thereby improving the bending stiffness of the feeding rack 131 and effectively suppressing high-frequency vibrations during the horizontal transfer process of the feeding rack 131.

[0066] Furthermore, refer to Figure 2 and Figure 5 As shown, Figure 5 This is an exploded view of an optional first transmission mechanism provided in an embodiment of the present invention. The first transmission mechanism 14 includes a first cylinder 141 and a first stepper motor 142. The first stepper motor 142 is fixed to the upper surface of the frame 10 and located below the feeding rack 131. The first cylinder 141 is mechanically connected to the first short side of the feeding rack 131. The main controller 11 is also used to drive the first stepper motor 142 to make the first cylinder 141 perform push-pull movements. The first cylinder 141 is used to drive the feeding rack 131 to move horizontally through its own push-pull movements.

[0067] It should be noted that, through the electromechanical collaborative design of the first transmission mechanism 14 and the main controller 11 (first cylinder 141 + first stepper motor 142 + main controller 11 closed-loop control), this embodiment of the invention significantly improves the operating accuracy and reliability of the equipment while achieving efficient parallel operation at multiple workstations. Firstly, the first stepper motor 142 is fixed in a layout directly below the feeding rack 131 above the frame 10 (refer to...). Figure 5 The main controller 11 directly drives the output shaft angular displacement. The first stepper motor 142 converts the rotary motion into millimeter-level linear displacement of the first cylinder 141 through an internal mechanism. The first cylinder 141 only needs to perform compensating push-pull within a short stroke to maintain a positioning accuracy of 0.02mm within the effective stroke, meeting the chip alignment requirements within 0.05mm during the sintering process. Furthermore, the first stepper motor 142 only operates for a short time during the acceleration / deceleration phase, while the cylinder can be driven for a long time using a low-pressure air source of 0.4MPa. The overall energy consumption is reduced by about 25% compared to traditional servo slides (the transmission between the servo motor and the multi-link mechanism), and the temperature rise of the frame 10 caused by long-term operation of high-power servo motors is avoided, thus extending the working life of the first stepper motor 142 and ensuring the stability of the multi-station automatic sintering machine.

[0068] Furthermore, the first transmission mechanism 14 is also provided with a limiting component 143, which is located below the feeding rack 131 and horizontally positioned between the long strip 1313 and the first short side of the feeding rack 131. The limiting component 143 includes a first corner seat 1431, a second corner seat 1432, a second limiting block 1433, and a third limiting block 1434. The bottoms of the first corner seat 1431 and the second corner seat 1432 are fixed to the upper surface of the frame 10. The first corner seat 1431 and the second corner seat 1432 are arranged side by side with the second limiting block 1433 fixed to the top of the first corner seat 1431. The second limiting block 1433 and the first limiting block 1314 are horizontally spaced opposite each other. The third limiting block 1434 is fixed to the top of the second corner seat 1432.

[0069] It is worth noting that, in this embodiment of the invention, the two first limiting blocks 1314 are precisely positioned at both ends of the lower surface of the long strip 1313 and form a first-level limiting with the second limiting block 1433 of the limiting component 143. The second limiting block 1433, in turn, forms a second-level limiting with the lifting component 153 located on the side of the feeding rack 131. When the feeding rack 131 moves horizontally to the end of its stroke, the first limiting block 1314 and the second limiting block 1433 change from being in the air relative to each other in the horizontal direction to being in contact with each other, thereby achieving precise mechanical stopping of the feeding rack 131 in the horizontal direction.

[0070] Among them, reference Figure 6 As shown, Figure 6 This is an optional structural diagram of the third limiting block provided in an embodiment of the present invention. The third limiting block 1434 is used to constrain the transmission of the first transmission mechanism 14 to the feeding rack 131 in the vertical direction. The third limiting block 1434 includes a first transmission member 14341, a rotating shaft 14342, a second transmission member 14343, and a limiting member 14344. One end of the first transmission member 14341 is connected to the feeding rack 131, and the other end of the feeding rack 131 is connected to the rotating shaft 14342. The rotating shaft 14342 is connected to one end of the second transmission member 14343, and the limiting member 14344 is connected to the other end of the second transmission member 14343. When the feeding rack 131 moves vertically, the first transmission component 14341 will follow the feeding rack 131 and receive a vertical force. At this time, since the rotating shaft 14342 is connected to the first transmission component 14341, the rotating shaft 14342 will rotate based on the force and pull the second transmission component 14343 to move horizontally. When the second transmission component 14343 moves horizontally, it will drive the limiting component 14344 to move horizontally. When the limiting component 14344 moves to the limiting surface of the second corner seat 1432 and contacts it, the third limiting block 1434 will be locked with the feeding rack 131, thereby constraining the transmission of the first transmission mechanism 14 to the feeding rack 131 in the vertical direction.

[0071] It should be noted that the rotating shaft 14342 can also synchronously constrain the high-frequency vertical movement of the feeding rack 131. Since the first cylinder 141 and the upper feeding rack 131 are obliquely connected, there is a vertical transmission between the first cylinder 141 and the feeding rack 131. When the first cylinder 141 controls the feeding rack 131 to move horizontally, the feeding rack 131 will move at a certain frequency in the vertical direction. The rotating shaft 14342 can synchronously suppress the vertical movement of the feeding rack 131 through its own rotation ratio, eliminating the overshoot phenomenon caused by the push and pull of the first cylinder 141.

[0072] Furthermore, refer to Figure 7 and Figure 8 As shown, Figure 7 This is an alternative exploded view of the transfer mechanism, the first transmission mechanism, and the second transmission mechanism provided in the embodiments of the present invention. Figure 8 This is an exploded view of an optional second transmission mechanism provided in an embodiment of the present invention. The second transmission mechanism includes a second cylinder 151, a second stepper motor 152, and a lifting assembly 153. The second stepper motor 152 is fixed to the upper surface of the frame 10 and located on the side of the transfer mechanism 13. The second cylinder 151 is mechanically connected to the lifting assembly 153. The lifting assembly 153 is sleeved with the first long side or the second long side of the feeding rack 131.

[0073] The main controller 11 is also used to drive the second stepper motor 152 to make the second cylinder 151 push and pull. The second cylinder 151 is used to control the lifting assembly 153 to lift the feeding rack 131 based on its own push and pull motion so that the PCB board 20 on the hollow carrier plate is placed on the support platform 132 below.

[0074] It should be noted that the second stepper motor 152 independently controls the second cylinder 151 (the main controller 11 directly drives the angular displacement of the stepper motor), converting the rotational motion into a millimeter-level precision push-pull stroke of the cylinder piston rod. This improves the lifting displacement control accuracy of the lifting assembly 153. Simultaneously, the lifting assembly 153 is interlocked with the long sides of the feeding rack 131, eliminating single-point drive off-center load through a double-sided force balance structure. This ensures that the feeding rack 131 remains horizontal during lifting, improving the uniformity of the bonding gap between the PCB board 20 and the support platform 132. Furthermore, the lifting endpoint is mechanically locked vertically between the third limit block 1434 and the feeding rack 131, ensuring the positioning repeatability of the PCB board 20 and the support platform 132, guaranteeing that the hot press needle 121 aligns with the soldering area when pressed down.

[0075] Furthermore, from Figure 8It is known that the lifting assembly 153 includes a lifting platform 1531 and a transmission device 1532; wherein, the lifting platform 1531 includes a support plate 15311, a plurality of spring columns 15312, a plurality of inclined blocks 15313 and a plurality of connecting blocks 15314, the spring columns 15312 are located below the support plate 15311, the connecting blocks 15314 are located on the top surface of the support plate 15311, the inclined blocks 15313 are located on the bottom surface of the support plate 15311, one end of the spring column 15312 is connected to the bottom surface of the support plate 15311, and the other end of the spring column 15312 is connected to the top surface of the frame 10. One side of the connecting block 15314 is provided with a third slot, which is used to engage with the first long side or the second long side of the feeding rack 131.

[0076] It should be noted that the third slot of the connecting block 15314 precisely engages with the long side of the feeding rack 131 to form a rigid self-locking structure, making the relative displacement deviation between the lifting platform 1531 and the feeding rack 131 approach zero, thus completely eliminating the slight tilting of the PCB board 20 caused by loose fit during the lifting process.

[0077] Furthermore, the transmission device 1532 includes a guide rail 15321 and a protruding slider 15322. The guide rail 15321 is located on the top surface of the frame 10, and the slider 15322 is embedded in the guide rail 15321. The protrusion of the slider 15322 contacts the inclined surface of the inclined block 15313. The slider 15322 is used to change the relative height between the slider 15322 and the inclined block 15313 by moving horizontally on the guide rail 15321.

[0078] Meanwhile, in this embodiment of the invention, the slider 15322 moves horizontally along the guide rail 15321 to push the inclined block 15313, converting the horizontal thrust into vertical lift, thereby realizing the lifting function of the lifting component 153. Furthermore, through the bidirectional buffer design of the spring column 15312, when the feeding rack 131 rises to the limit height of the third limit block 1434 or falls to the lowering end point, the spring column 15312 can absorb the impact kinetic energy brought by the feeding rack 131 during its movement. Combined with the inclined plane self-locking characteristic between the inclined block 15313 and the slider 15322, a soft landing with zero rebound is achieved, reducing the micro-vibration generated when the feeding rack 131 moves to the end point, thereby avoiding micro-displacement of the PCB board 20 and affecting the sintering accuracy.

[0079] Furthermore, refer to Figure 9 As shown, Figure 9This is an exploded view of an optional first pad or second pad provided in an embodiment of the present invention. The first pad 1311 or the second pad 1312 includes a hanging ear structure 13121 and a plate structure 13122. The plate structure 13122 includes a first strip plate 131221, a second strip plate 131222, and a connecting plate 131223. The first strip plate 131221 is connected to the second strip plate 131222 based on the connecting plate 131223. The first strip plate 131221 is used to support the PCB board 20. The first strip plate 131221 is provided with a plurality of first positioning pins 1312211, which are used to limit the PCB board 20.

[0080] It should be noted that the connecting plate 131223 uses a low thermal expansion alloy to separate the first strip plate 131221 and the second strip plate 131222, blocking the conduction path of the sintering heat source to the support structure. Under the sintering conditions above 80°C in the sintering mechanism 12, the thermal deformation between the first strip plate 131221 and the second strip plate 131222 is reduced, preventing the first strip plate 131221 and the second strip plate 131222 from tilting significantly, and avoiding the PCB board 20 from being not in a horizontal state on the first strip plate 131221.

[0081] Furthermore, the ear-hanging structure 13121 includes a first side plate 131211 and a second side plate 131212. The first side plate 131211 and the second side plate 131212 are vertically connected. One side of the first side plate 131211 is provided with a first slot 1312111, which is used to engage with the first long side or the second long side of the feeding rack 131. One side of the second side plate 131212 is provided with a second slot 1312121, which engages with the second strip plate 131222.

[0082] It should be noted that the first slot 1312111 of the ear-hanging structure 13121 engages with the side of the feeding rack 131, and the second slot 1312121 engages with the second strip plate 131222, forming a bidirectional rigid locking mechanism. This provides installation accuracy for the pad plate installed on the side of the feeding rack 131. Simultaneously, the multiple first positioning pins 1312211 of the first strip plate 131221, in conjunction with the positioning holes of the PCB board 20, achieve pre-alignment between the chip soldering area and the hot-pressing pin 121, thereby shortening the fine-tuning time. Furthermore, the modular design... The interlocking structure between the hanging ear structure 13121 and the plate structure 13122 allows for independent replacement of damaged parts (such as a broken first positioning pin 1312211 or a broken connecting plate 131223), which is equivalent to a traditional overall replacement and reduces maintenance costs. At the same time, the second slot 1312121 of the second side plate 131212 is a standardized interface design, which can be compatible with the rapid changeover of plate structures 13122 of different sizes, effectively reducing the changeover time of the production line compared to the traditional customized type of carrier plate switching.

[0083] Furthermore, from Figure 3 It is known that the support platform 132 includes a support frame 1321 and a heating plate 1322. The heating plate 1322 is located on the top of the support frame 1321. The heating plate 1322 is used to preheat the PCB board 20 on the feeding rack 131. The top of the heating plate 1322 is also provided with a plurality of second positioning pins 13221. The second positioning pins 13221 are used to limit the PCB board 20. The second positioning pins 13221 are locked to the heating plate 1322 with independent threads. Therefore, compared with the replacement of the integrated support platform, the replacement cost of the second positioning pins 13221 after wear can be reduced.

[0084] It should be noted that the heating plate 1322 is directly integrated into the top of the carrier frame 1321. The heating function is activated when the PCB board 20 descends to the carrier platform 132, thereby ensuring that the chip solder layer within the PCB board 20 reaches the optimal sintering temperature before sintering. This effectively reduces the solder viscosity of the chip solder layer, ensuring efficient solder flow and filling when the hot press pin 121 presses down. Simultaneously, the second positioning pin 13221 and the first positioning pin 1312211 of the first pad 1311 form a cooperative positioning system. When the PCB board 20 is transferred between the carrier platform 132 and the hollow carrier board, these two levels of positioning pins achieve fault-tolerant guidance with zero manual intervention, providing transfer accuracy for the PCB board 20 and automation capabilities for the multi-station automatic sintering machine.

[0085] It should also be noted that each carrier stage 132 and the hot pressing needle 121 are equipped with a built-in temperature sensor. The temperature sensor is connected to the main controller 11. The main controller 11 is also used to dynamically adjust the sintering temperature of the PCB board 20 according to the first real-time temperature of each carrier stage 132 and the second real-time temperature of the hot pressing needle 121, so as to ensure that the sintering temperature curve experienced by each chip is highly consistent and accurate.

[0086] Secondly, referring to Figure 10 As shown, Figure 10 This is an optional flowchart of an automatic sintering method for a multi-station automatic sintering machine provided in an embodiment of the present invention. The method may include, but is not limited to, steps S101 to S108.

[0087] Step S101: In response to the operation command that the PCB board has been placed on the first hollow carrier plate of the feeding rack, control the first transmission mechanism to move forward to move the PCB board horizontally under the hot press needle.

[0088] The first hollow load plate is a hollow load plate that is not located below the hot press needle.

[0089] Step S102: In response to the operation that the PCB board has been moved to the bottom of the hot press needle, control the second transmission mechanism to move downward to place the PCB board onto the support platform below the hot press needle.

[0090] Step S103: In response to the operation of the PCB board being placed on the carrier platform, control the first transmission mechanism to drive backward to reset the first hollow carrier board, and control the pressing component to press the hot pressing needle into the PCB board for sintering.

[0091] Step S104: In response to the completion of PCB board sintering, control the second transmission mechanism to drive upward to transfer the PCB board to the second hollow load board of the feeding rack.

[0092] The second hollow load plate is the hollow load plate located below the hot press needle.

[0093] Step S105: In response to the operation of the PCB board being transferred to the second empty carrier board, control the first transmission mechanism to drive forward to move the PCB board out below the hot press pin.

[0094] It should be noted that during steps S101 to S105, the dynamic division of labor mechanism between the two hollow carrier boards (feeding the first hollow carrier board / receiving the second hollow carrier board) combined with the cyclic transfer path of steps S101-S103-S105 makes the loading, sintering, and unloading processes completely parallel: when the hot press needle is sintering the current PCB board (step S103), the first transmission mechanism simultaneously moves the next PCB board into the preparation station (step S101); when sintering is completed (S104), the second carrier board immediately receives the completed part and moves it out (S105). Through timing optimization, the hot press needle... With zero idle time, the entire single-chip process cycle is effectively compressed compared to traditional serial processes, significantly increasing the hourly sintering output. Simultaneously, by configuring independent hot-pressing pins and pressing components, independent and precise temperature and pressure control can be achieved during the PCB sintering process. Precise positioning of the PCB is achieved through the cooperation between the hollow carrier board and the support platform (ensuring the hot-pressing pins accurately act on the target area), minimizing human intervention and positioning deviations. This ensures extremely low void ratios, uniform thickness, and shear strength in the chip interconnect layer, significantly improving product yield and long-term reliability. The silver / copper sintering process in high-reliability chip mounting (especially for power devices and advanced packaging) has been optimized. Through multi-station parallel processing, independent and precise control (temperature / pressure / atmosphere), and localized rapid heating technologies, it achieves a leap in production efficiency, significantly improved process consistency and yield, effective reduction in energy consumption, and excellent connection reliability, becoming an indispensable core equipment in modern high-end electronic manufacturing.

[0095] The embodiments described in this invention are for the purpose of more clearly illustrating the technical solutions of the embodiments of this invention, and do not constitute a limitation on the technical solutions provided by the embodiments of this invention. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this invention are also applicable to similar technical problems.

[0096] The device embodiments described above are merely illustrative. The devices described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network devices. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0097] The terms "first," "second," "third," "fourth," etc. (if present) in the specification and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or apparatuses is not necessarily limited to those explicitly listed, but may include other steps or apparatuses not explicitly listed or inherent to such processes, methods, products, or apparatuses.

[0098] It should be understood that in this invention, "at least one (item)" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0099] In the several embodiments provided by this invention, it should be understood that the disclosed system can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For instance, the division of the above-described devices is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple devices or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or equipment, and may be electrical, mechanical, or other forms.

[0100] The devices described above as separate components may or may not be physically separate. The components shown as devices may or may not be physical devices; that is, they may be located in one place or distributed across multiple network devices. Some or all of the devices can be selected to achieve the purpose of this embodiment according to actual needs.

[0101] Furthermore, the functional units in the various embodiments of the present invention can be integrated into a single processor, or each unit can exist physically separately, or two or more units can be integrated into a single unit. The integrated units described above can be implemented in hardware or as software functional units.

[0102] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of the present invention should be within the scope of the claims of the present invention.

Claims

1. A multi-station automatic sintering machine for embedded chips, characterized in that, include: The frame has a main controller, a sintering mechanism, a transfer mechanism, a first transmission mechanism, and a second transmission mechanism on its upper surface. The main controller is electrically connected to the first transmission mechanism and the second transmission mechanism, respectively. The transfer mechanism includes a feeding rack and multiple support platforms. The first long side of the feeding rack is provided with multiple first pads, and the second long side of the feeding rack is provided with multiple second pads. The first pads and the second pads are arranged opposite to each other to form a hollow support plate for receiving PCB boards. The hollow part of the hollow support plate is located above the support platforms. The first transmission mechanism is used to control the horizontal movement of the feeding rack, and the second transmission mechanism is used to control the vertical movement of the feeding rack. The sintering mechanism includes a hot pressing needle and a pressing assembly. The hot pressing needle is located above the support platform. The hot pressing needle is mechanically connected to the bottom of the pressing assembly. The pressing assembly is electrically connected to the main controller. The main controller is used to control the first transmission mechanism to move the PCB board on the hollow carrier plate to below the hot pressing needle, control the second transmission mechanism to place the PCB board on the hollow carrier plate onto the support platform below, and control the pressing component to press the hot pressing needle into the PCB board on the support platform for sintering.

2. The multi-station automatic sintering machine according to claim 1, characterized in that, The first transmission mechanism includes a first cylinder and a first stepper motor. The first stepper motor is fixed to the upper surface of the frame and located below the feeding rack. The first cylinder is mechanically connected to the first short side of the feeding rack. The main controller is also used to drive the first stepper motor to make the first cylinder perform a push-pull motion, and the first cylinder is used to drive the feeder to move horizontally through its own push-pull motion.

3. The multi-station automatic sintering machine according to claim 1, characterized in that, The first pad or the second pad includes a lug structure and a plate structure; The board structure includes a first strip plate, a second strip plate, and a connecting plate. The first strip plate is connected to the second strip plate based on the connecting plate. The first strip plate is used to support the PCB board. The first strip plate is provided with a plurality of first positioning pins, which are used to limit the position of the PCB board. The ear-hanging structure includes a first side plate and a second side plate. The first side plate is perpendicularly connected to the second side plate. A first slot is provided on one side of the first side plate. The first slot is used to engage with the first long side or the second long side. A second slot is provided on one side of the second side plate. The second slot is engaged with the second strip plate.

4. The multi-station automatic sintering machine according to claim 1, characterized in that, The second transmission mechanism includes a second cylinder, a second stepper motor, and a lifting assembly. The second stepper motor is fixed to the upper surface of the frame and located on the side of the transfer mechanism. The second cylinder is mechanically connected to the lifting assembly. The lifting assembly is sleeved with the first long side or the second long side of the feeding rack. The main controller is also used to drive the second stepper motor to make the second cylinder perform push-pull motion. The second cylinder is used to control the lifting assembly to lift the feeding rack based on its own push-pull motion so that the PCB board on the hollow carrier plate is placed on the support platform below.

5. The multi-station automatic sintering machine according to claim 4, characterized in that, The lifting assembly includes a lifting platform and a transmission device; The lifting platform includes a support plate, multiple spring columns, multiple inclined blocks, and multiple connecting blocks. The spring columns are located below the support plate, the connecting blocks are located on the top surface of the support plate, and the inclined blocks are located on the bottom surface of the support plate. One end of each spring column is connected to the bottom surface of the support plate, and the other end of each spring column is connected to the top surface of the frame. One side of each connecting block is provided with a third slot, which is used to engage with either the first long side or the second long side. The transmission device includes a guide rail and a raised slider. The guide rail is disposed on the top surface of the frame, and the slider is embedded in the guide rail. The raised part of the slider contacts the inclined surface of the inclined block. The slider is used to change the relative height between the slider and the inclined block by moving horizontally on the guide rail.

6. The multi-station automatic sintering machine according to claim 1, characterized in that, The feeding rack is also provided with a long strip and two first limiting blocks. One end of the long strip is connected to the first long side, and the other end of the long strip is connected to the second long side. The long strip is adjacent to the first short side of the feeding rack, and the two first limiting blocks are respectively located at both ends of the lower surface of the long strip.

7. The multi-station automatic sintering machine according to claim 6, characterized in that, The first transmission mechanism is also provided with a limiting component, which is located below the feeding rack and is positioned horizontally between the long strip and the first short side. The limiting component includes a first corner seat, a second corner seat, a second limiting block, and a third limiting block. The bottoms of the first corner seat and the second corner seat are fixed to the upper surface of the frame. The first corner seat and the second corner seat are arranged side by side. The second limiting block is fixed to the top of the first corner seat. The second limiting block and the first limiting block are horizontally opposed to each other. The third limiting block is fixed to the top of the second corner seat. The third limiting block is used to constrain the transmission of the first transmission mechanism to the feeding rack in the vertical direction. The third limiting block includes a first transmission component, a rotating shaft, a second transmission component, and a limiting component. One end of the first transmission component is connected to the feeding rack, the other end of the feeding rack is connected to the rotating shaft, the rotating shaft is connected to one end of the second transmission component, and the limiting component is connected to the other end of the second transmission component.

8. The multi-station automatic sintering machine according to claim 1, characterized in that, The pressing assembly includes a pressing platform and a pressing driver. The pressing driver is located below the pressing platform and is used to control the pressing platform to descend or rise. The pressure drive includes a roller and a drive shaft. The roller is mechanically connected to the drive shaft. The roller is used to provide power to the pressure platform by rotation, and the drive shaft is used to convert the rotation into vertical movement of the pressure platform.

9. The multi-station automatic sintering machine according to claim 1, characterized in that, The support platform includes a support frame and a heating plate. The heating plate is located on the top of the support frame and is used to preheat the PCB board on the feeding rack. The top of the heating plate is also provided with a plurality of second positioning pins, which are used to limit the PCB board.

10. An automatic sintering method, applied to the main controller within a multi-station automatic sintering machine as described in any one of claims 1 to 9, characterized in that, include: In response to the operation command that the PCB board has been placed on the first hollow carrier plate of the feeding rack, the first transmission mechanism is controlled to move forward to move the PCB board to the underside of the hot press needle, wherein the first hollow carrier plate is a hollow carrier plate that is not located under the hot press needle. In response to the operation that the PCB board has been moved to the underside of the hot press pin, the second transmission mechanism is controlled to move downward to lower the PCB board onto the support platform below the hot press pin; In response to the operation of the PCB board being placed onto the support platform, the first transmission mechanism is controlled to drive backward to reset the first hollow support board, and the pressing component is controlled to work to press the hot pressing needle into the PCB board for sintering; In response to the completion of the PCB board sintering operation, the second transmission mechanism is controlled to drive upward to transfer the PCB board to the second hollow load plate of the feeding rack, wherein the second hollow load plate is a hollow load plate located below the hot pressing needle; In response to the operation of transferring the PCB board to the second empty carrier board, the first transmission mechanism is controlled to move forward to move the PCB board below the hot press pin.

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