High-density and stress-stable semiconductor lead frame processing apparatus

Abstract

The application discloses high-density and stress-stable semiconductor lead frame processing equipment and relates to the technical field of semiconductor lead frames. The processing equipment comprises a processing unit, the processing unit comprises a bottom die plate, the side of the bottom die plate is provided with a clamping groove, the bottom die plate is sequentially provided with two blocking grooves from the center to the outside, and a cutting groove is arranged between adjacent blocking grooves; and a module unit is arranged on the top of the processing unit. The bottom die plate and the stamping frame are closed, the stamping strip one, the stamping strip two and the blocking groove are closed to form a groove, the groove increases the torque resistance of the pad body, the cutting groove and the stamping cavity are closed to form a forming groove, the intermittent beating of the pressing side plate is matched, the pad cross-section surface on the inside of the forming groove is more smooth, the upper and lower two forming grooves are closed to form a silver plating channel, the support strip embedded in the groove and the sealing plate are matched, silver plating liquid overflow to the surface of the pad body is reduced, and thus the formation of the cup bottom in the later period is affected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor lead frame, and particularly to a high-density and stress-stable semiconductor lead frame processing equipment. BACKGROUND

[0002] The lead frame is mainly formed by stamping a thin plate material, and then injection molding is performed to form a support cup at the bottom of the plate material, and then a chip is mounted on the surface of the solder pad formed by stamping and soldered.

[0003] Chinese patent CN118737838B discloses a kind of vehicle-mounted intelligent interaction display semiconductor preparation device and its product, it is related to the technical field of semiconductor, including: including: output unit, forming unit, further including: the surface of the film roll and plate roll is wound with film strip and plate material respectively, the film strip includes a plurality of interfaces that are uniformly arranged on its surface, the length side of the interface is fixedly connected by separation band and protection piece;Pretreatment unit, the pretreatment unit is arranged between output unit and forming unit.Make the protection piece of the length side of the upper and lower surface of the plate material be extruded closed, thereby providing protection for subsequent clamping and moving of the plate material, while the fixed protection piece will not be stacked to the inside of the stamping die cavity during stamping, and the plate material is clamped between the upper and lower protection pieces by the outer link bar one and link bar two, without using glue to fix, reduce the difficulty of subsequent external film cleaning, and reduce the residue of glue.

[0004] The above-mentioned patent and prior art have the following problems:

[0005] The silver plating of the electrical measurement pin in the above-mentioned patent leads to poor oxidation resistance, and the conductivity decreases after long-term use, and if the solder pad is separated by stamping and cutting on the surface of the plate material, the cross section of the electrical measurement pin is prone to form cutting wrinkles and burrs, and silver plating of the cross section will cause the silver plating liquid to adhere to the surface of the solder pad, thereby the silver plating of the solder pad surface will increase the smoothness of the surface, leading to a decrease in the adhesion degree of the cup body formed by injection molding, affecting the stress distribution of the frame and leading to a decrease in product quality. SUMMARY

[0006] This part aims to summarize some aspects of the embodiments of the present application and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract and title of the specification to avoid obscuring the purpose of this part, the abstract and the title, and such simplifications or omissions cannot be used to limit the scope of the present application.

[0007] To solve the above technical problems, the present application provides the following technical solutions:

[0008] The high-density and stress-stable semiconductor lead frame processing equipment comprises:

[0009] The processing unit comprises a bottom die plate, the side of the bottom die plate is provided with a clamping groove, the bottom die plate is sequentially provided with two blocking grooves from the center to the outside, and a cutting groove is arranged between adjacent blocking grooves;

[0010] The module unit is arranged on the top of the processing unit.

[0011] The module unit comprises an I-beam, the bottom of the I-beam is provided with a punching frame, the punching frame is sequentially provided with a punching strip one and a punching strip two from the center to the outside, a punching cavity is arranged between the punching strip one and the punching strip two, the punching cavity and the cutting groove extrude the plate material between them to form a forming groove for containing the flow of silver plating liquid, and the punching strip one and the punching strip two respectively extrude the blocking groove at the bottom thereof to form a groove for containing a supporting strip.

[0012] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing equipment, wherein:

[0013] The processing unit further comprises a base, the top of the base is fixedly connected with a back plate, one side of the back plate is installed with a guide rail, and the guide rail is arranged on the top of the base, and the other side of the back plate is installed with a horizontal moving force piece;

[0014] The output shaft of the horizontal moving force piece is fixedly connected with a power cavity which is in sliding connection with the surface of the guide rail through the back plate, and a pressing power piece is fixedly connected in the power cavity.

[0015] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing equipment, wherein:

[0016] A lifting power piece is installed in the base, the output shaft of the lifting power piece is fixedly connected with a bottom support plate, the top of the bottom support plate is fixedly connected with a supporting column, and the top of the supporting column is fixedly connected with the bottom die plate;

[0017] A plurality of guide columns are arranged on the top of the base, the top of the guide column is fixedly connected with a support plate, the support plate is movably embedded with the bottom die plate, and the top surfaces of the support plate and the bottom die plate jointly support a plate material, and the through hole of the side of the plate material is sleeved with the guide column.

[0018] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing equipment, wherein:

[0019] The module unit further comprises a top plate, the output shaft of the pressing power piece is fixedly connected with the top plate, the bottom of the top plate is fixedly connected with a plurality of I-beams, and the I-beams are fixedly connected through connecting columns and punching frames.

[0020] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing device,

[0021] The middle part of the stamping frame is provided with a containing cavity, an elastic piece one and an I-beam are fixedly connected to the top of a pressing block movably embedded in the containing cavity.

[0022] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing device,

[0023] The width of the blocking groove is greater than the width of the stamping strip one and the stamping strip two, and the inside of the cutting groove corresponds to the stamping cavity;

[0024] The side part of the stamping frame is provided with a protruding block corresponding to the clamping groove.

[0025] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing device,

[0026] The bottom outer contour of the stamping frame, the stamping strip one, the stamping strip two, the protruding block and the stamping cavity is wrapped with a blade strip, and the bottom surface of the pressing block is lower than the bottom surface of the stamping frame;

[0027] The bottom surface of the stamping frame is higher than the bottom surface of the stamping strip one, the stamping strip two and the stamping cavity;

[0028] The stamping strip one and the stamping strip two are arranged in the outer part of the stamping frame and are arranged in abutment with a supporting strip, the top of the supporting strip is provided with a sealing plate, and the sealing plate is threadedly connected through a fixing piece one and a threaded hole in the top of the stamping strip two.

[0029] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing device,

[0030] The stamping cavity is composed of a stamping bottom plate, a straight side plate and a pressing side plate, one side of the stamping bottom plate is fixedly connected with the straight side plate, and the other side of the stamping bottom plate is movably connected with the pressing side plate;

[0031] The side part of the pressing side plate is fixedly connected with a sliding rod.

[0032] As a preferred scheme of the high-density and stress-stable semiconductor lead frame processing device,

[0033] The top of the top plate is provided with a flattening power piece, the output shaft of the flattening power piece is fixedly connected with a connecting plate, the bottom of the connecting plate is provided with a plurality of folding rods, the bottom of the folding rod is movably arranged in the inside of the stamping cavity, and the surface of the folding rod arranged in the inside of the stamping cavity is fixedly connected with a mounting seat;

[0034] The mounting seat is movably connected through a connecting rod and a sliding rod, the sliding rod is elastically connected through elastic members two and a straight side plate, the bottom of the straight side plate is fixedly connected with an auxiliary rail, and the bottom of the sliding rod is slidably arranged in the inside of the auxiliary rail.

[0035] Another object of the present application is to provide a high-density and stress-stable semiconductor lead frame, which comprises the following steps:

[0036] The frame unit comprises a pad body, symmetrical pad sections are arranged on the left and right sides of the pad body, the surface of the pad body is wrapped with a cup bottom, and the surface of the pad section is provided with a silver plating layer.

[0037] The present application has the following beneficial effects:

[0038] By closing the bottom die plate and the stamping frame, the stamping strip one, the stamping strip two and the blocking groove are closed to form a groove, the groove increases the torsional moment capacity of the pad body, the cutting groove and the stamping cavity are closed to form a forming groove, the intermittent beating of the pressing side plate makes the surface of the pad section inside the forming groove more flat, and the two forming grooves are closed upward and downward to form a silver plating channel, cooperating with the support strip embedded in the groove and the sealing plate, reducing the overflow of silver plating liquid to the surface of the pad body, thereby affecting the formation of the cup bottom in the later period. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows:

[0040] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0041] Figure 2 It is a schematic diagram of the overall structure of the present application; Figure 1

[0042] Figure 3 It is a schematic diagram of the overall structure of the present application;

[0043] Figure 4 It is a schematic diagram of the overall structure of the present application;

[0044] Figure 5 It is a schematic diagram of the overall structure of the present application; Figure 4

[0045] Figure 6 It is a schematic diagram of the overall structure of the present application;

[0046] Figure 7 It is a schematic diagram of the overall structure of the present application; Figure 6

[0047] Figure 8 ​​​For Figure 7 Enlarged structural diagram of part D;

[0048] Figure 9 For the connection between the punch frame and the top structure of the pressing block of the present application;

[0049] Figure 10 For Figure 9 Enlarged structural diagram of part E;

[0050] Figure 11 For the connection between the punch frame and the bottom structure of the pressing block of the present application;

[0051] Figure 12 For the top structure of the combination of the plurality of solder pad bodies and the support strips of the present application;

[0052] Figure 13 For the bottom structure of the combination of the plurality of solder pad bodies and the support strips of the present application;

[0053] Figure 14 For Figure 13 Enlarged structural diagram of part F;

[0054] Figure 15 For the connection between the solder pad body and the shaped groove and the recess structure of the present application;

[0055] Figure 16 For the silver-plated channel formed by the upper and lower closure of the two shaped grooves of the present application;

[0056] Figure 17 For Figure 16 Enlarged structural diagram of part G;

[0057] Figure 18 For Figure 17 Enlarged structural diagram of part H;

[0058] Figure 19 For the connection between the lead frame structure of the present application.

[0059] In the figure:

[0060] 1, processing unit; 101, base; 1011, lifting power component; 1012, guide column; 102, back plate; 103, guide rail; 104, power cavity; 1041, downward pressing power component; 105, horizontal moving power component; 106, bottom support plate; 1061, support column; 107, support plate; 108, bottom mold plate; 1081, clamping groove; 1082, blocking groove; 1083, cutting groove; 109, plate;

[0061] 2, module unit; 201, top plate; 202, I-beam; 2021, connecting column; 2022, elastic piece one; 203, stamping frame; 2031, stamping strip one; 2032, stamping strip two; 2033, convex block; 2034, containing cavity; 2035, knife edge strip; 204, pressing block; 205, flattening power piece; 2051, connecting plate; 2052, folding rod; 20521, mounting seat; 20522, connecting rod; 206, stamping cavity; 2061, stamping bottom plate; 2062, straight side plate; 20621, auxiliary rail; 20622, elastic piece two; 2063, pressing side plate; 20631, sliding rod; 207, support strip; 2071, sealing plate; 2072, fixed piece one; 2073, fixed piece two; 2074, clamping plate;

[0062] 3, frame unit; 301, pad body; 302, shaped groove; 3021, groove bottom plate; 3022, pad section; 3023, groove vertical plate; 303, groove; 304, cup bottom. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0064] Embodiment one: the present embodiment is as Figures 1-18 As shown in the figure, the high-density and stress-stable semiconductor lead frame processing equipment comprises:

[0065] The processing unit 1 comprises a bottom die plate 108, the side of the bottom die plate 108 is provided with a clamping groove 1081, and the bottom die plate 108 is sequentially provided with two blocking grooves 1082 from the center to the outside, and a cutting groove 1083 is arranged between adjacent blocking grooves 1082;

[0066] The module unit 2 is arranged on the top of the processing unit 1.

[0067] The module unit 2 includes an I-beam 202, the bottom of the I-beam 202 is provided with a punching frame 203, the punching frame 203 is sequentially provided with a punching strip one 2031 and a punching strip two 2032 from the center to the outside, a punching cavity 206 is arranged between the punching strip one 2031 and the punching strip two 2032, the punching cavity 206 and the cutting groove 1083 are closed to extrude the plate 109 between the two to form a forming groove 302 for containing the flow of silver plating liquid, and the punching strip one 2031 and the punching strip two 2032 are respectively closed to extrude the recess groove 303 containing the support strip 207 with the barrier groove 1082 at the bottom thereof.

[0068] As shown in the figure, Figure 1 The processing unit 1 further includes a base 101, the top of the base 101 is fixedly connected with a back plate 102, one side of the back plate 102 is mounted with a guide rail 103, and the guide rail 103 is arranged on the top of the base 101, the other side of the back plate 102 is mounted with a horizontal moving force member 105.

[0069] The output shaft of the horizontal moving force member 105 is fixedly connected with a power cavity 104 which is in surface sliding with the guide rail 103 through the back plate 102, and the inside of the power cavity 104 is fixedly connected with a downward pressing power member 1041.

[0070] As shown in the figure, Figures 1-3 The inside of the base 101 is mounted with a lifting power member 1011, the output shaft of the lifting power member 1011 is fixedly connected with a bottom support plate 106, the top of the bottom support plate 106 is fixedly connected with a support column 1061, and the top of the support column 1061 is fixedly connected with a bottom mold plate 108.

[0071] The top of the base 101 is provided with a plurality of guide columns 1012, the top of the guide columns 1012 is fixedly connected with a support plate 107, the inside of the support plate 107 is movably embedded with the bottom mold plate 108, and when the two are embedded, the upper and lower surfaces of the two are coplanar, the top surfaces of the support plate 107 and the bottom mold plate 108 are commonly supported with a plate 109, and the through hole of the side of the plate 109 is sleeved with the guide column 1012.

[0072] As shown in the figure, Figures 6-9 The module unit 2 further includes a top plate 201, the output shaft of the downward pressing power member 1041 is fixedly connected with the top plate 201, the bottom of the top plate 201 is fixedly connected with a plurality of I-beams 202, the I-beams 202 are fixedly connected through connecting columns 2021 and punching frames 203, and the lifting power member 1011, the downward pressing power member 1041 and the horizontal moving force member 105 are preferably PLC-controlled oil cylinders.

[0073] As shown in the figure, Figures 6-9As shown, the middle part of the stamping frame 203 is provided with a receiving cavity 2034, the inside of which is movably embedded with a pressing block 204, the top of which is fixedly connected through an elastic piece one 2022 and an I-beam 202.

[0074] As shown, the pressing block 204 corresponds to the area between the adjacent blocking groove 1082 in the center of the bottom die plate 108, the width of the blocking groove 1082 is greater than the width of the stamping strip one 2031 and the stamping strip two 2032, and the inside of the cutting groove 1083 corresponds to the stamping cavity 206. Figures 1-12

[0075] The side part of the stamping frame 203 is provided with a protruding block 2033, which corresponds to the clamping groove 1081.

[0076] As shown, the bottom outer contour of the stamping frame 203, the stamping strip one 2031, the stamping strip two 2032, the protruding block 2033 and the stamping cavity 206 is provided with a blade strip 2035, and the bottom surface of the pressing block 204 is lower than the bottom surface of the stamping frame 203. Figures 6-18 The bottom surface of the stamping frame 203 is higher than the bottom surface of the stamping strip one 2031, the stamping strip two 2032 and the stamping cavity 206, that is, the bottom of the stamping strip one 2031, the stamping strip two 2032 and the stamping cavity 206 protrudes out of the stamping frame 203, so that the protruding part of the stamping strip one 2031, the stamping strip two 2032 and the stamping cavity 206 is closed and extruded in cooperation with the blocking groove 1082 and the cutting groove 1083, so that the forming groove 302 and the recess 303 are formed, and the blade strip 2035 cuts off the plate material inside and outside the stamping frame 203;

[0077] The stamping strip one 2031 and the stamping strip two 2032 are arranged in the outer part of the stamping frame 203 and are provided with a supporting strip 207, the top of the supporting strip 207 is provided with a sealing plate 2071, the sealing plate 2071 is threadedly connected through a fixing piece one 2072 and a threaded hole in the top of the stamping strip two 2032, and the cross section of the supporting strip 207 and the stamping strip two 2032 is matched.

[0078] When the solder pad body 301 is stamped, the bottom die plate 108 is lifted, the power cavity 104 is slid, the supporting plate 107 is slid and clamped into the inside of the recess 303 with the power cavity 104, and then a plurality of solder pad bodies 301 and the recess 303 on the side thereof are manually pushed to slide along the supporting strip 207 and contact and close, the bottom of the outermost supporting strip 207 is fixed through the fixing piece one 2072, and the fixing piece one 2072 limits the plurality of solder pad bodies 301 on the surface of the supporting strip 207 through the nut;

[0079]

[0080] ​​If the groove 303 on the side of the pad body 301 is closed up and down, the upper and lower support bars 207 and the sealing plate 2071 are closed, the part of the support bar 207 exposed from the pad body 301 is fixed by the second fixing part 2073, the support bar 207 and the clamping plate 2074 clamp and fix the groove 303, and the first fixing part 2072 and the second fixing part 2073 are preferably bolts, and the surface of the sealing plate 2071 is wrapped with a rubber layer.

[0081] As shown in Figures 8-18 The stamping cavity 206 is composed of a stamping bottom plate 2061, a straight side plate 2062 and a pressing side plate 2063. The straight side plate 2062 is fixedly connected to one side of the stamping bottom plate 2061. The pressing side plate 2063 is movably connected to the other side of the stamping bottom plate 2061. The pressing side plate 2063 is composed of a recessed section in the middle and straight plates on both sides, and is connected between the recessed section and the straight plates through an arc plate. The pressing side plate 2063 can be movably connected to the inner protrusion of the cutting groove 1083. The pressing side plate 2063 is movably arranged on the inner side of the stamping frame 203.

[0082] The side of the pressing side plate 2063 is fixedly connected with a sliding rod 20631.

[0083] As shown in Figures 8-18 The top plate 201 is provided with a flattening power component 205 on the top. The output shaft of the flattening power component 205 is fixedly connected with a connecting plate 2051. The bottom of the connecting plate 2051 is provided with a plurality of folding rods 2052. The bottom of the folding rod 2052 is movably arranged in the interior of the stamping cavity 206. The surface of the folding rod 2052 arranged in the interior of the stamping cavity 206 is fixedly connected with a mounting seat 20521.

[0084] The mounting seat 20521 is movably connected with a connecting rod 20522 and a sliding rod 20631. The sliding rod 20631 is elastically connected with an elastic component 20622 and a straight side plate 2062. The bottom of the straight side plate 2062 is fixedly connected with an auxiliary rail 20621. The bottom of the sliding rod 20631 is movably arranged in the interior of the auxiliary rail 20621. The elastic component 20622 and the elastic component 2022 are preferably springs. The flattening power component 205 is preferably a PLC-controlled air cylinder.

[0085] Operation process:

[0086] By placing the plate 109 to be processed on the surface of the support plate 107 and the bottom die plate 108, and then aligning the through hole on the surface of the plate 109 with the guide column 1012, the plate 109 is fixed in place. Then, the support bar 207 is aligned with the first punching bar 2031 and the second punching bar 2032, respectively. The sealing plate 2071 at the top of the support bar 207 is fixedly connected to the corresponding first punching bar 2031 and second punching bar 2032 through the fixing part 2072, thereby completing the preparation before processing.

[0087] The downward power element 1041 is started, which drives the punching frame 203 at the bottom of the downward power element 1041 to move towards the bottom die plate 108. The pressing block 204 first contacts the plate 109 on the top of the bottom die plate 108. The plate 109 between the bottom die plate 108 and the punching frame 203 is clamped by the pressing block 204 and the bottom die plate 108. With the downward movement of the downward power element 1041, the pressing block 204 moves into the accommodating cavity 2034 inside the punching frame 203. Then, the plate 109 is cut downward by the blade strip 2035, while the plate inside the punching frame 203 is fixed by the pressing block 204 in advance, thereby ensuring the stability of the plate cut by the blade strip 2035 and reducing the deviation during the cutting process.

[0088] During the process of cutting the plate 109 into small plates by the blade strip 2035, the first punching bar 2031 and the second punching bar 2032 on the side of the punching frame 203, as well as the punching cavity 206, the blocking groove 1082 and the cutting groove 1083 cooperate to form the pad body 301 and the recess 303 and the forming groove 302 on the side of the pad body 301. It should be noted that the first punching bar 2031 and the second punching bar 2032 between adjacent punching frames 203 are continuous and integral structures, which facilitate the formation of the recess 303 on the side of the pad body 301, thereby increasing the anti-distortion ability of the pad body 301 during subsequent transfer, reducing the tendency of the flat plate to warp and bend during transfer, and increasing the thickness and depth of the recess 303 to increase the anti-bending degree.

[0089] When the forming groove 302 is formed, the lifting power element 1011 drives the bottom die plate 108 to lift up, and the downward power element 1041 lifts up at the same rate, thereby maintaining the clamping and limiting of the plate cut by the bottom die plate 108, the punching frame 203 and the pressing block 204. When the bottom die plate 108 moves away from the plate 109 on the surface of the support plate 107;

[0090] The flat power element 205 is started, and the flat power element 205 drives the connecting plate 2051 to move back and forth, in the reciprocating movement of the connecting plate 2051, the folding rod 2052 moves back and forth in the inside of the stamping cavity 206, and then the folding rod 2052 moves forward in the inside of the stamping cavity 206, the folding rod 2052 drives the mounting seat 20521 to extrude the connecting rod 20522 to expand, the connecting rod 20522 is pushed outward, the connecting rod 20522 drives the sliding rod 20631 to move outward along the auxiliary rail 20621, and the pressure side plate 2063 hits the plate corresponding to the cutting groove 1083, that is, the solder pad section 3022, while the groove bottom plate 3021 and the groove vertical plate 3023 are still inside the cutting groove 1083.

[0091] And in the backward movement of the folding rod 2052, the pressure side plate 2063 is pulled to the inside of the stamping cavity 206, so that in the forward and backward movement of the folding rod 2052, the pressure side plate 2063 constantly hits the plate between the pressure side plate 2063 and the cutting groove 1083, that is, the solder pad section 3022, so that through the stamping of the stamping cavity 206 and the constant impact of the pressure side plate 2063, the solder pad section 3022 is constantly flattened, and through the cross section formed by stamping and the constant impact of the pressure side plate 2063, the flatness of the surface of the solder pad section 3022 is high, and it is not easy to produce wrinkles and burrs caused by cutting, which is convenient for subsequent silver plating of the surface of the solder pad section 3022, and then after the subsequent silver plating is completed, the inside of the forming groove 302 is cut from the bottom surface of the solder pad body 301, the bottom surface of the forming groove 302 is cut and flush with the bottom surface of the solder pad body 301 on the side of the groove 303, that is, the solder pad section 3022 is shortened, and the cutting process does not involve direct contact with the surface of the solder pad section 3022, that is, in this process, the solder pad section 3022 is not cut and will not produce burrs, and the setting of the groove 303 increases the anti-vibration ability of the solder pad section 3022 during the shortening process.

[0092] Further, when the pressing side plate 2063 is processed, the folding rod 2052 is moved backward, the pressing side plate 2063 continues to shrink to the inside of the stamping cavity 206, the protruding part of the pressing side plate 2063 is away from the pad section 3022, and finally the straight plate part of the pressing side plate 2063 is away from the pad section 3022, so that the stamping cavity 206 is separated, the downward power element 1041 controls the lifting of the top plate 201 by a predetermined distance, the stamping cavity 206 and the bottom die plate 108 are separated, the horizontal movement power element 105 is started, the horizontal movement power element 105 drives the power cavity 104 to move on the surface of the guide rail 103, so that the top plate 201 moves, and finally the support strip 207 on the side of the top plate 201 moves to the top of the groove 303, and the downward power element 1041 drives the downward movement of the top plate 201, so that the support strip 207 is clamped into the inside of the groove 303, reducing the additional butt joint of the subsequent clamping, and the support strip 207 is embedded into the inside of the groove 303, further increasing the strength of the entire pad body 301, further improving the anti-torque ability of the pad body 301 in the subsequent transfer, preventing the deformation of the frame after cutting;

[0093] Further, when the support strip 207 is clamped into the inside of the groove 303, the connection between the sealing plate 2071 and the stamping strip one 2031 and the stamping strip two 2032 is released, and the artificial pushes several pad bodies 301 and the side groove 303 along the support strip 207 to contact and close, so that the bottom of the support strip 207 is fixed by the first fixing element 2072, and the first fixing element 2072 limits the several pad bodies 301 on the surface of the support strip 207 by the nut. At this time, the connection of the several forming grooves 302 constitutes the silver plating liquid flow channel, and the forming groove 302 is placed on the plane during silver plating, and the silver plating liquid can be injected into the inside of the forming groove 302, so that the inside of the forming groove 302 is plated, thereby reducing the influence of the silver plating liquid flowing to the surface of the pad body 301 in the silver plating process of the pad section 3022 in the inside of the forming groove 302, thereby affecting the subsequent injection molding.

[0094] Of course, the upper and lower corresponding closing of the forming grooves 302 of the pad bodies 301 on the surfaces of the two stamping strips one 2031 can also be closed, that is, the opening side is closed, so that the upper and lower two support strips 207 and the sealing plates 2071 on the sides thereof are closed, the side closure of the upper and lower closed forming grooves 302 is completed, and the part of the support strip 207 exposed to the pad body 301 is fixed by the long second fixing element 2073, so that the support strip 207 and the clamping plate 2074 clamp and fix the groove 303, and the upper and lower forming grooves 302 form a closed chamber for the silver plating liquid to pass through Figure 16 and Figure 17As shown, the convenience of subsequent silver plating is reduced by the addition of silver plating liquid overflowing out of the forming groove 302, and after the upper and lower forming grooves 302 form a closed chamber, the support strip 207 and the sealing plate 2071 on the side form a closed barrier, reducing the overflow of silver plating liquid to the surface of the solder pad body 301 after the upper and lower forming grooves 302 form a closed chamber. After silver plating is completed and the solder pad section 3022 is cut to form an electric welding pin, the recess 303 on the side of the solder pad section 3022 is further increased in depth during the subsequent injection molding process with the cup bottom 304, which increases the injection molding space and allows the injection molding material to enter the interior of the recess 303 to form a more intimate bond, thereby improving the bonding strength of the cup bottom 304 and the solder pad body 301.

[0095] In summary, by closing the bottom mold plate 108 and the stamping frame 203, the stamping strip one 2031, the stamping strip two 2032 and the barrier groove 1082 are closed to form the recess 303, which increases the torsional strength of the solder pad body 301. The cutting groove 1083 and the stamping cavity 206 are closed to form the forming groove 302, which is intermittently struck by the pressing side plate 2063 to make the surface of the solder pad section 3022 inside the forming groove 302 more flat. The two forming grooves 302 are closed to form a silver plating channel, which is combined with the support strip 207 and the sealing plate 2071 embedded in the recess 303 to reduce the overflow of silver plating liquid to the surface of the solder pad body 301, thereby affecting the formation of the cup bottom 304 in the later stage.

[0096] Example two: The difference between this embodiment and the first embodiment is:

[0097] As Figure 19 shown, the frame unit 3 includes a solder pad body 301, the left and right sides of the solder pad body 301 are symmetrically provided with a solder pad section 3022, the surface of the solder pad body 301 is wrapped with a cup bottom 304, and the surface of the solder pad section 3022 is provided with a silver plating layer.

Claims

1. A high-density and stress-stable semiconductor lead frame processing equipment, characterized in that, include: The processing unit (1) includes a bottom template (108), the side of the bottom template (108) is provided with a clamping groove (1081), the bottom template (108) is provided with two blocking grooves (1082) from the center to the outside, and a cutting groove (1083) is provided between adjacent blocking grooves (1082). Module unit (2), said module unit (2) is disposed on top of processing unit (1); The module unit (2) includes an I-beam plate (202), and a stamping frame (203) is provided at the bottom of the I-beam plate (202). The stamping frame (203) is provided with stamping strip one (2031) and stamping strip two (2032) from the center to the outside. A stamping cavity (206) is provided between the stamping strip one (2031) and the stamping strip two (2032). The stamping cavity (206) and the cutting groove (1083) close and squeeze the plate (109) between them to form a forming groove (302) for accommodating the flow of silver plating liquid. The stamping strip one (2031) and the stamping strip two (2032) close and squeeze with the barrier groove (1082) at their bottom to form a groove (303) for accommodating the support strip (207).

2. The high-density and stress-stable semiconductor lead frame processing equipment as described in claim 1, characterized in that: The processing unit (1) also includes a base (101), a back plate (102) is fixedly connected to the top of the base (101), a guide rail (103) is installed on one side of the back plate (102), and the guide rail (103) is located on the top of the base (101). A transverse moving force member (105) is installed on the other side of the back plate (102). The output shaft of the lateral force member (105) passes through the back plate (102) and is fixedly connected to the power cavity (104) that slides on the surface of the guide rail (103). The power cavity (104) is fixedly connected to the inside of the downward force member (1041).

3. The high-density and stress-stable semiconductor lead frame processing equipment as described in claim 2, characterized in that: The base (101) is equipped with a lifting power component (1011), the output shaft of the lifting power component (1011) is fixedly connected to a bottom support plate (106), the top of the bottom support plate (106) is fixedly connected to a support column (1061), and the top of the support column (1061) is fixedly connected to a bottom template (108). The base (101) has several guide posts (1012) on its top. A support plate (107) is fixedly connected to the top of the guide posts (1012). A bottom template (108) is movably embedded inside the support plate (107). The top surfaces of the support plate (107) and the bottom template (108) jointly support a plate (109). The through holes on the side of the plate (109) are connected to the guide posts (1012).

4. The high-density and stress-stable semiconductor leadframe processing equipment as described in any one of claims 2-3, characterized in that: The module unit (2) also includes a top plate (201), the output shaft of the pressing power component (1041) is fixedly connected to the top plate (201), and a number of I-beams (202) are fixedly connected to the bottom of the top plate (201). The I-beams (202) are fixedly connected to the stamping frame (203) through connecting columns (2021).

5. The high-density and stress-stable semiconductor leadframe processing equipment as described in claim 4, characterized in that: The stamping frame (203) has a receiving cavity (2034) in the middle, and a pressure block (204) is movably embedded inside the receiving cavity (2034). The top of the pressure block (204) is fixedly connected to the I-beam (202) by an elastic element (2022).

6. The high-density and stress-stable semiconductor lead frame processing equipment as described in claim 5, characterized in that: The width of the barrier groove (1082) is greater than the width of stamping strip one (2031) and stamping strip two (2032), and the interior of the cutting groove (1083) corresponds to the stamping cavity (206); The side of the stamping frame (203) is provided with a protrusion (2033), which corresponds to the clamping groove (1081).

7. The high-density and stress-stable semiconductor lead frame processing equipment as described in claim 6, characterized in that: The bottom outer contour of the stamping frame (203), stamping strip one (2031), stamping strip two (2032), protrusion (2033) and stamping cavity (206) is wrapped with a blade strip (2035), and the bottom surface of the pressure block (204) is lower than the bottom surface of the stamping frame (203); The bottom surface of the stamping frame (203) is higher than the bottom surface of the first stamping strip (2031), the second stamping strip (2032), and the stamping cavity (206); The first stamping strip (2031) and the second stamping strip (2032) are disposed on the outer part of the stamping frame (203) and are connected to the support strip (207). The top of the support strip (207) is provided with a sealing plate (2071), and the sealing plate (2071) is threadedly connected to the first fixing member (2072) and the threaded hole at the top of the second stamping strip (2032).

8. The high-density and stress-stable semiconductor leadframe processing equipment as described in claim 7, characterized in that: The stamping cavity (206) is composed of a stamping base plate (2061), a straight side plate (2062), and a pressure side plate (2063). The straight side plate (2062) is fixedly connected to one side of the stamping base plate (2061), and the pressure side plate (2063) is movably connected to the other side of the stamping base plate (2061). A sliding rod (20631) is fixedly connected to the side of the pressure plate (2063).

9. The high-density and stress-stable semiconductor lead frame processing equipment as described in claim 8, characterized in that: A leveling power component (205) is installed on the top of the top plate (201). The output shaft of the leveling power component (205) is fixedly connected to the connecting plate (2051). Several folding rods (2052) are provided at the bottom of the connecting plate (2051). The bottom of the folding rods (2052) is movably disposed inside the stamping cavity (206). A mounting seat (20521) is fixedly connected to the surface of the folding rods (2052) disposed inside the stamping cavity (206). The mounting base (20521) is movably connected to the connecting rod (20522) and the sliding rod (20631). The sliding rod (20631) is elastically connected to the straight side plate (2062) through the elastic element (20622). The bottom of the straight side plate (2062) is fixedly connected to the auxiliary rail (20621), and the bottom of the sliding rod (20631) is slidably disposed inside the auxiliary rail (20621).

Images