Epoxy thermosensitive adhesive film for bonding ethylene propylene diene monomer and preparation method of epoxy thermosensitive adhesive film

Abstract

The invention discloses an epoxy thermosensitive adhesive film for bonding ethylene propylene diene monomer and a preparation method thereof, and the epoxy thermosensitive adhesive film comprises the following raw materials in parts by weight: 30-50 parts of acrylic resin, 10-15 parts of epoxy resin, 5-10 parts of tackifying resin, 2-5 parts of a curing agent and 20-30 parts of a solvent, the epoxy resin is formed by mixing bisphenol A type epoxy resin or bisphenol F type epoxy resin with biphenyl type epoxy resin. According to the adhesive film prepared by the preparation method disclosed by the invention, the raw materials comprise the acrylic resin, the epoxy resin, the tackifying resin, the curing agent and the solvent, and the components are matched, so that the thermosensitive adhesive film is easy to bond and high in bonding strength, and can well meet the sealing and bonding requirements of an ethylene propylene diene monomer rubber sealing strip for a vehicle.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of adhesive film, in particular to an epoxy heat-sensitive adhesive film for bonding ethylene-propylene-diene rubber and a preparation method thereof, which is mainly used for automobile sealing strips. BACKGROUND

[0002] Most of the automobile sealing strips are made of ethylene-propylene-diene rubber (EPDM) as the main raw material. The EPDM adhesive strip is formed by microwave vulcanization process at one time, has a smooth and beautiful surface, and has excellent properties such as good elasticity, compression deformation resistance, weather aging resistance, ozone resistance, chemical resistance, and a wide temperature range of use (-50-150℃), and has been widely used in automobile door and window curtain wall manufacturing industry.

[0003] Before bonding, the ethylene-propylene-diene rubber automobile sealing strip usually needs to be cleaned with a solvent for EPDM surface and polished, and then coated with a primer, and then bonded with the film surface of the heat-sensitive adhesive. This process flow needs to use a solvent, which is very harmful to the workers' body and the environment, and also has the disadvantages of long process flow, complex process, and low yield of finished products.

[0004] Therefore, how to solve the above technical problems and provide an epoxy heat-resistant adhesive film with high bonding strength, simple process and environmental protection is the research direction of the person skilled in the art. SUMMARY

[0005] The first object of the present application is to provide an epoxy heat-sensitive adhesive film for bonding ethylene-propylene-diene rubber to overcome the shortcomings of the prior art.

[0006] To achieve the above object, the technical scheme adopted by the present application is: an epoxy heat-sensitive adhesive film for bonding ethylene-propylene-diene rubber, which contains the following raw materials in parts by weight: 30-50 parts of acrylic resin, 10-15 parts of epoxy resin, 5-10 parts of tackifying resin, 2-5 parts of curing agent, and 20-30 parts of solvent, and the epoxy resin is a mixture of bisphenol A type epoxy resin or bisphenol F type epoxy resin and biphenyl type epoxy resin.

[0007] As a specific embodiment, the raw material of the acrylic resin includes 40-60 parts of acrylic hard monomer, 30-50 parts of acrylic soft monomer, and 10-20 parts of acrylic functional monomer in parts by weight.

[0008] As a specific embodiment, the acrylic hard monomer is selected from one or more of methyl acrylate, methyl methacrylate, isobornyl acrylate, isobornyl methacrylate, acrylamide, and acryloyl morpholine; the acrylic soft monomer is selected from butyl acrylate and / or isooctyl acrylate; and the acrylic functional monomer is selected from one or more of hydroxyethyl acrylate, hydroxybutyl acrylate, and hydroxypropyl acrylate.

[0009] As a specific embodiment, the tackifying resin is selected from any one or more of rosin resin, terpene resin and petroleum resin.

[0010] As a specific embodiment, the curing agent uses a mixture of isocyanate curing agent and hydrazide curing agent.

[0011] As a specific embodiment, the solvent uses one or more of ethyl acetate, isopropyl alcohol, toluene and heptane.

[0012] Another object of the present application is to provide the preparation method of the above-mentioned epoxy thermal adhesive film for bonding ethylene-propylene-diene rubber, and the specific steps are as follows: mixing acrylic resin, epoxy resin, tackifying resin, curing agent and solvent according to weight fraction, coating and drying to obtain the epoxy thermal adhesive film.

[0013] The present application has the following advantages: The epoxy thermal adhesive film for bonding ethylene-propylene-diene rubber provided by the present application is composed of acrylic resin, epoxy resin, tackifying resin, curing agent and solvent, and through the collocation of the above-mentioned components, the thermal adhesive film is easy to bond and has high bonding strength, which can well meet the requirements of vehicle sealing bonding of ethylene-propylene-diene rubber sealing strip. DETAILED DESCRIPTION

[0014] The technical solutions of the present application will be described in detail below through specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0015] The present application provides an epoxy thermal adhesive film for bonding ethylene-propylene-diene rubber, which contains the following raw materials according to weight fraction: 30-50 parts of acrylic resin, 10-15 parts of epoxy resin, 5-10 parts of tackifying resin, 2-5 parts of curing agent and 20-30 parts of solvent, and the epoxy resin is a mixture of bisphenol A type epoxy resin or bisphenol F type epoxy resin and biphenyl type epoxy resin.

[0016] The raw materials of the acrylic resin include 40-60 parts of acrylic hard monomer, 30-50 parts of acrylic soft monomer and 10-20 parts of acrylic functional monomer according to weight fraction.

[0017] Here, the acrylic hard monomer is selected from one or more of methyl acrylate, methyl methacrylate, isobornyl acrylate, isobornyl methacrylate, acrylamide and acryloyl morpholine; the acrylic soft monomer is selected from butyl acrylate and / or isooctyl acrylate; and the acrylic functional monomer is selected from one or more of hydroxyethyl acrylate, hydroxybutyl acrylate and hydroxypropyl acrylate.

[0018] Here, the tackifying resin is selected from any one or more of a rosin resin, a terpene resin and a petroleum resin.

[0019] Here, the curing agent is a mixture of an isocyanate curing agent and a hydrazide curing agent.

[0020] Here, the solvent is one or more of ethyl acetate, isopropyl alcohol, toluene and heptane. Example 1

[0021] Mix 55 g of methyl acrylate, 40 g of butyl acrylate and 10 g of hydroxyethyl acrylate thoroughly, add 122 g of ethyl acetate and dilute to 45% solid content. Add the mixture to a reactor, stir and continuously pass nitrogen protection, preheat to 60°C, add 0.2 g of azobisisopentyl cyanide initiator, control the temperature between 61-62°C, react for 16 hours, then raise the temperature to 75°C, add 0.4 g of azobisisopentyl cyanide, react for 8 hours, and ensure that the monomer conversion rate is greater than 98.5%. End the reaction and discharge.

[0022] Then take 50 g of acrylic resin, 5 g of bisphenol A epoxy resin, 6.5 g of biphenyl epoxy resin, 6 g of tackifying resin, 2 g of isocyanate curing agent, 1 g of hydrazide curing agent and 25 g of ethyl acetate, mix at room temperature for 40-50 min, coat on a commercially available release film of 50 pm, and finally dry in an oven at 90°C for 50 s, and wind up to obtain the epoxy heat-sensitive adhesive film.

[0023] Here, the bisphenol A epoxy resin is purchased from Nan Ya Electronic Materials Co., Ltd., with the model number NPES-901; The biphenyl epoxy resin is purchased from Hunan Sailve New Material Co., Ltd., with the model number HQ-3600S; The isocyanate curing agent is purchased from Zhejiang Wanhua, with the model number HT-600; The hydrazide curing agent is purchased from Wuhan Pusida Biological Technology Co., Ltd., with the model number 4080-95-9; The tackifying resin is a rosin resin, purchased from Guangxi Wuzhou Kawai Chemical Industry Co., Ltd., with the model number GA-AT. Example 2

[0024] The difference between this example and Example 1 is that the raw material components of the epoxy thermal adhesive film are different. In this example, the raw material of the epoxy thermal adhesive film comprises 45 g of acrylic resin, 6 g of bisphenol A type epoxy resin, 5 g of biphenyl type epoxy resin, 10 g of tackifying resin, 2 g of isocyanate curing agent, 1 g of hydrazide curing agent, and 30 g of ethyl acetate. Example 3

[0025] The difference between this example and Example 1 is that the raw material components of the epoxy thermal adhesive film are different. In this example, the raw material of the epoxy thermal adhesive film comprises 30 g of acrylic resin, 5 g of bisphenol A type epoxy resin, 5 g of biphenyl type epoxy resin, 8 g of tackifying resin, 2 g of isocyanate curing agent, 3 g of hydrazide curing agent, and 30 g of ethyl acetate. Example 4

[0026] The difference between this example and Example 1 is that the tackifying resin used in this example is a phenolic modified terpene resin, which is purchased from DRT Company and the brand is Dertophene T135.

[0027] Comparative Example 1 The difference between this example and Example 1 is that the raw material components of the epoxy thermal adhesive film are different. In this example, the raw material of the epoxy thermal adhesive film comprises 30 g of bisphenol A type epoxy resin, 30 g of biphenyl type epoxy resin, 10 g of tackifying resin, 3 g of isocyanate curing agent, and 30 g of ethyl acetate.

[0028] Comparative Example 2 The difference between this example and Example 1 is that the raw material components of the epoxy thermal adhesive film are different. In this example, the raw material of the epoxy thermal adhesive film comprises 45 g of acrylic resin, 12 g of bisphenol A type epoxy resin, 10 g of tackifying resin, 3 g of hydrazide curing agent, and 30 g of ethyl acetate.

[0029] Comparative Example 3 The difference between this example and Example 1 is that the raw material components of the epoxy thermal adhesive film are different. In this example, the raw material of the epoxy thermal adhesive film comprises 45 g of acrylic resin, 12 g of bisphenol A type epoxy resin, 10 g of tackifying resin, 3 g of hydrazide curing agent, and 30 g of ethyl acetate.

[0030] The performance of the above Examples 1-4 and Comparative Examples 1-3 is detected, and the detection data is shown in Table 1.

[0031] Table 1

[0032] As can be seen from the above table, the epoxy thermal adhesive film of the present application has good adhesion and peeling force, excellent holding adhesion, low VOC content, and is environmentally friendly.

[0033] The present application is described in detail above with reference to specific embodiments and exemplary examples, but these are not to be understood as limiting the present application. It is understood by a person skilled in the art that various equivalent substitutions, modifications or improvements can be made to the technical solutions of the present application and the embodiments thereof without departing from the spirit and scope of the present application, and these all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims.

Claims

1. An epoxy heat-sensitive adhesive film for bonding ethylene propylene diene rubber, characterized by, The raw materials include, by weight fraction, 30-50 parts of acrylic resin, 10-15 parts of epoxy resin, 5-10 parts of tackifying resin, 2-5 parts of curing agent, and 20-30 parts of solvent, the epoxy resin being a mixture of bisphenol A epoxy resin or bisphenol F epoxy resin and biphenyl epoxy resin.

2. The epoxy heat-sensitive adhesive film for bonding ethylene-propylene-diene rubber according to claim 1, characterized by, The raw materials of the acrylic resin include, by weight fraction, 40-60 parts of acrylic hard monomer, 30-50 parts of acrylic soft monomer, and 10-20 parts of acrylic functional monomer.

3. The epoxy hot-melt adhesive film for bonding EPDM rubber according to claim 2, characterized in that, The acrylic hard monomer is selected from one or more of methyl acrylate, methyl methacrylate, isobornyl acrylate, isobornyl methacrylate, acrylamide, and acryloyl morpholine; the acrylic soft monomer is selected from butyl acrylate and / or isooctyl acrylate; and the acrylic functional monomer is selected from one or more of hydroxyethyl acrylate, hydroxybutyl acrylate, and hydroxypropyl acrylate.

4. The epoxy thermal adhesive film for bonding EPDM rubber according to claim 1, characterized in that, The tackifying resin is selected from any one or more of rosin resin, terpene resin, and petroleum resin.

5. The epoxy thermal adhesive film for bonding ethylene propylene diene rubber according to claim 1, wherein The curing agent is a mixture of isocyanate curing agent and hydrazide curing agent.

6. The epoxy thermal adhesive film for bonding EPDM rubber according to claim 1, wherein The solvent is one or more of ethyl acetate, isopropyl alcohol, toluene, and heptane.

7. A method for producing an epoxy heat-sensitive adhesive film for bonding ethylene-propylene-diene rubber according to any one of claims 1 to 6, characterized by, The specific steps are as follows: the acrylic resin, epoxy resin, tackifying resin, curing agent, and solvent are mixed by weight fraction, coated, and dried to obtain the epoxy heat-sensitive adhesive film.

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