High-conductivity bending-resistant tellurium-copper alloy strip and preparation method and application thereof

Abstract

The invention discloses a high-conductivity bending-resistant tellurium-copper alloy strip as well as a preparation method and application thereof. The tellurium-copper alloy strip comprises the following components in percentage by mass: 0.003 to 0.10 percent of Te, 0.003 to 0.04 percent of Sn, 0.001 to 0.010 percent of P, 0.001 to 0.12 percent of M and the balance of copper and inevitable impurities, wherein the M is Sr and / or Ca; the tellurium-copper alloy strip comprises a second phase, the second phase is a Cu2Te phase, and the length-width ratio is 1.0-1.5. The tellurium-copper alloy strip has relatively high conductivity and excellent bending resistance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper alloy, in particular to a high-conductivity and bend-resistant tellurium-copper alloy strip, a preparation method and application thereof. BACKGROUND

[0002] The copper alloy material for automobile connectors generally should have the following properties. First, high electrical conductivity to ensure high speed and high efficiency of signal transmission of electronic systems, avoid signal delay or distortion. Second, good corrosion resistance and electrical erosion resistance, so that the connector can cope with high temperature, humidity, jolt and other working conditions during use, reducing the problems of poor contact, short circuit and other problems caused by corrosion or electrical erosion. Finally, good bending performance to meet the requirements of stamping, bending and other processes.

[0003] Therefore, the tellurium-copper alloy material is considered as an ideal automobile connector substrate due to its good electrical conductivity, thermal conductivity, excellent electrical erosion resistance and good corrosion resistance. However, there are two problems in the use process. First, although the addition of tellurium can improve the electrical erosion resistance of the material, the presence of hard and brittle tellurium-containing second phase particles makes the strip prone to cracking after bending, and the higher the tellurium content, the worse the bending performance. Second, the high-temperature softening temperature of the tellurium-copper alloy is slightly higher than that of red copper, but the improvement effect is limited, and high-temperature deformation is prone to occur during daily use of the automobile, affecting the reliability of the automobile connector.

[0004] The patent application with publication number CN117568654A discloses a tellurium-containing copper alloy strip, the mass percentage of each component is Te: 0.1-0.7wt%, P: 0.004-0.020wt%, O: 0.0003-0.0020wt%, Li+Mg+Ca: 0.02-0.04wt%, and the balance is copper and unavoidable impurities. The phase structure of the tellurium-containing copper alloy strip includes a copper matrix phase and a tellurium-containing second phase dispersed in the copper matrix phase, the tellurium-containing second phase is approximately cylindrical, and the cross section perpendicular to the rolling direction is approximately elliptical. The application also discloses a preparation method and application of the tellurium-containing copper alloy strip. The application uses copper-lithium intermediate alloy, copper-magnesium intermediate alloy, copper-calcium intermediate alloy and reducing gas blowing to realize the deoxidation treatment of the melt. The second phase is spheroidized by homogenization annealing, and combined with large processing rate cold rolling, the second phase is obtained in the form of a near-cylinder, so that the prepared tellurium-containing copper alloy strip has excellent hydrogen corrosion resistance and high-temperature softening resistance, and has a wide application prospect in automobile relays. However, the bending resistance and electrical conductivity of the tellurium-containing copper alloy strip provided by the application patent application need to be further improved.

[0005] The patent application with the publication number CN116083749A discloses a tellurium-copper alloy strip: the mass percentage composition of the tellurium-copper alloy is Te: 0.1-0.3 wt%, P: 0.008-0.012 wt%, RE: 0.01-0.05 wt%, RE is selected from Ce and / or La, and the balance is copper and inevitable impurities. Rare earth elements are added to the red copper matrix to refine the grains by enriching at the grain boundaries; by adding Te elements, the copper matrix is strengthened by second phase particles, avoiding the decrease of the plasticity of the strip during large processing rate processing, and finally realizing that the hardness of the tellurium-copper alloy strip is 90-120 HV1, the tensile strength is ≥280 MPa, the elongation is ≥15%, the electrical conductivity is ≥97% IACS, and the high-temperature softening resistance temperature is ≥400°C; under the condition of 90° bending, the strip meets R / t≤1.0 in the direction perpendicular to the rolling direction, and meets R / t≤1.0 in the direction parallel to the rolling direction. Although the patent application reduces the influence of the second phase containing tellurium on the bending resistance by controlling the content of Te, the influence still exists, and the bending resistance still has a certain space for improvement.

[0006] Therefore, it is urgent to prepare a tellurium-copper alloy strip with better bending performance and good electrical conductivity. SUMMARY

[0007] The present application provides a high-conductivity and bending-resistant tellurium-copper alloy strip, which has high electrical conductivity and excellent bending resistance.

[0008] The present application provides a high-conductivity and bending-resistant tellurium-copper alloy strip, which has high electrical conductivity and excellent bending resistance. The tellurium-copper alloy strip includes a second phase, and the second phase includes a Cu2Te phase, and the aspect ratio of the Cu2Te phase is 1.0-1.5.

[0009] Preferably, the second phase is a Cu2Te phase.

[0010] The present application controls the temperature during water cooling after hot rolling at a suitable Te content, so that the morphology of the Cu2Te phase after hot rolling is more close to spherical compared with the prior art, and then the second phase particles are obtained by the first annealing process. During subsequent annealing, the second phase particles in the strip do not change significantly due to the lower annealing temperature, and the second phase particles with approximate spherical shape, suitable size and dispersed distribution are more conducive to improving the bending performance.

[0011] The M element has the same number of intermediate electrons as the Mg element, can replace the Mg element in the tellurium-copper alloy, and the atomic radius of Ca is smaller than that of Cu, while the atomic radius of Sr is larger than that of Cu. The appropriate amount of M element can play a solid solution strengthening role, improve the mechanical properties of the tellurium-copper alloy, and increase the high-temperature softening temperature resistance.

[0012] Meanwhile, the appropriate amount of Sr and Ca can effectively remove harmful impurities (such as oxygen, hydrogen, etc.) in the copper melt, thereby reducing the content of P element, improving the electrical conductivity of the material, and preventing intergranular embrittlement. When the content of M is too high, a medium-temperature hard brittle phase is formed at the grain boundary, which will cause cold rolling cracking after the first annealing. When the content is low, the solid solution strengthening effect is weak, and the effect of replacing P element to remove harmful impurities is poor.

[0013] Although Sr and Ca can play the effects of deoxidizing and removing impurities in copper water, the burning loss is serious. Therefore, the present application provides an appropriate amount of P element, that is, an appropriate amount of phosphor copper alloy with smaller ablation is added at the beginning of melting, which can minimize the impact of P element on electrical conductivity and ensure the purification effect of the melt.

[0014] The appropriate amount of Sn element provided by the present application can be uniformly dispersed in the matrix after the first uniform annealing, avoiding segregation, but part of the Sn element remains in the grain boundary. Due to the presence of Sn element at the crystal, it is helpful to the size of the grain in the appropriate range when the strip is annealed, thereby improving the bending performance of the strip.

[0015] Preferably, the TC value of the (420) crystal plane of the tellurium-copper alloy strip is 0.10-0.18.

[0016] By controlling the TC value of the (420) crystal plane of the tellurium-copper alloy strip, the shear stress in the slip direction of the tellurium-copper alloy strip provided by the present application is larger, the work hardening is smaller, and the better bending resistance is ensured.

[0017] Preferably, the grain size of the tellurium-copper alloy strip is 15-35 μm.

[0018] The present application provides a suitable grain size of the tellurium-copper alloy strip, which can avoid the cracking along the second phase as much as possible. The reason is that by controlling the grain size, the number of grain boundaries is appropriate, the dislocation movement is hindered, the stress required for plastic deformation is not too high, and the binding force of the material itself containing the hard and brittle second phase is better under the appropriate stress, so as to avoid the cracking along the second phase as much as possible.

[0019] Meanwhile, the appropriate grain size does not concentrate in the plastic deformation zone during bending deformation, and the stress concentration area is avoided as much as possible.

[0020] Preferably, the size of the Cu2Te phase is 0.5-1 μm, and the distribution of the Cu2Te phase is 4-6*10 7 cm 2 .

[0021] Preferably, the tensile strength of the tellurium-copper alloy strip is 320-410 MPa, the electrical conductivity is above 92% IACS, and the high-temperature softening resistance temperature is greater than 380℃.

[0022] Preferably, the tellurium-copper alloy strip satisfies R / t≤1.5 without cracking under 180° bending conditions in both the perpendicular direction to the rolling direction and the parallel direction to the rolling direction, wherein R is the bending radius and t is the thickness of the strip.

[0023] In another aspect, the present application also provides a preparation method of a high-conductivity bending-resistant tellurium-copper alloy strip, which comprises the following process flow: melting → semi-continuous casting → hot rolling → first annealing → first cold rolling → second annealing → second cold rolling → third annealing → third cold rolling → stress relief annealing. The components of the tellurium-copper alloy strip are proportioned and melted according to the mass percentage. The temperature of the hot rolling is 750-850℃, and the holding time is 2-5h, and after the hot rolling, air cooling is performed, and then water cooling is performed. The temperature of the first annealing is 650-750℃.

[0024] The present application controls the temperature and time of the hot rolling, so that the size of the grains in the hot rolling stage is controlled at a suitable level, which provides conditions for the subsequent cold rolling process to refine the grains, and also avoids the phenomenon of hot rolling cracking due to the excessive precipitation of the tellurium-containing second phase in the hot rolling process caused by too low temperature and too short time, which leads to a sharp decrease in the plasticity of the material. In the present application, after the hot rolling, air cooling is performed to below 500℃, and then water cooling is performed, so that the aspect ratio of the tellurium-containing second phase after the hot rolling is close to 1-1.5, which is more close to a spherical shape compared with the prior art. In combination with the temperature control of the first annealing, the present application can form a tellurium-containing second phase that is approximately spherical, thereby improving the bending resistance.

[0025] The present application can also realize the homogenization of Sn elements by controlling the temperature of the first annealing, avoid segregation, and retain a part of Sn elements at the grain boundaries. Due to the retention of a part of Sn elements at the grain boundaries, in combination with the temperature of the first annealing, the grain size is 100-150 μm.

[0026] Preferably, the processing rate of the second cold rolling is 50-70%, and the temperature of the third annealing is 580-610℃.

[0027] The application can effectively control (220) the increase of the TC value of the crystal plane by controlling the processing rate of the second cold rolling. The texture is a deformation texture, and the bending performance is poor. Generally, it can be transformed into (420) through annealing processing. When the processing rate is too large, the subsequent annealing is difficult to transform; and when the processing rate is too small, the crystal grains cannot be effectively refined, resulting in a decrease in material strength. Then, through the third annealing, a part of (220) crystal plane is transformed into (420), which improves the bending performance of the material while ensuring the strength. In addition, due to the grain of the second annealing being much smaller than the grain of the first annealing, the interface of the high-angle grain boundary is more, thereby increasing the nucleation rate. The application controls the processing rate of the second cold rolling and the temperature and time of the third annealing, so that the size of the recrystallized grain is smaller, and the grain size is controlled in the range of 15-35 μm, thereby being beneficial to improving the bending performance of the material. Further, the holding time of the third annealing is 3-5 h.

[0028] Preferably, the process step of smelting is: in the smelting process, the electrolytic plate is first heated, after it is completely melted, the temperature is raised to 1250-1300 DEG C, the required tellurium block, tin ingot and phosphor copper intermediate alloy are added, after 0.5-1 h of holding, the temperature is lowered to 1150-1180 DEG C, then one or both of copper strontium and copper calcium intermediate alloy is added, after 10-15 min of holding, the casting is started. In order to ensure that elements such as Te and Sn are fully and uniformly melted, the application first adds tellurium blocks and tin ingots, then adds phosphor copper intermediate alloy for deoxidation. Since copper strontium and copper calcium intermediate alloy are easy to burn at high temperature, they are added last, and after they are melted, semi-continuous casting is immediately carried out, so as to reduce further burning loss.

[0029] Preferably, the processing rate of the first cold rolling is 70-85%. The application controls the processing rate of the first cold rolling, so that the coarse recrystallized grains formed by the first annealing are elongated along the rolling direction, and as the strip material is continuously processed, the grain boundary gradually becomes unclear, forming a deformation band along the rolling direction similar to kelp, and there are intersecting deformation bands in some areas due to the rotation of the grains. The first cold rolling mainly realizes the complete breaking of the grains, and lays a foundation for the subsequent grain refinement and organization regulation.

[0030] Preferably, the temperature of the second annealing is 610-680 DEG C. The application controls the temperature and holding time of the second annealing, so that the grains are fully recrystallized, the deformation structure of the cold rolling deformation disappears, and annealing twinning is formed. Through the above control, the size of the grains is controlled to be 40-60 μm, and the holding time is 3-5 h.

[0031] Preferably, the processing rate of the third cold rolling is 25%-40%. The application controls the processing rate of the third cold rolling, which can meet the tolerance requirements of the strip material, maintain the TC value of the (420) crystal plane, and avoid affecting the bending performance.

[0032] Preferably, the temperature of the stress relief annealing is 230-300℃, and the annealing time is 3-5h. By controlling the temperature and the annealing time of the stress relief annealing, the present application aims to eliminate the internal stress in the strip caused by the last processing, ensure the precision of the processed parts, and avoid the softening of the material, which affects the hardness and strength of the material.

[0033] In another aspect, the present application also provides the application of the tellurium-copper alloy strip in automobile connectors.

[0034] Compared with the prior art, the present application has the following beneficial effects: By controlling the size, distribution and aspect ratio of the second phase Cu2Te phase, the approximately spherical Cu2Te phase is dispersed in the matrix, which is more conducive to improving the bending performance compared with the columnar Cu2Te phase disclosed in the prior art. By adding M elements to replace part of the P elements, the influence of P elements on the electrical conductivity is minimized, so that the tellurium-copper alloy strip provided by the present application has high electrical conductivity.

[0035] In the preparation method provided by the present application, by controlling the temperature when the hot-rolled blank enters water cooling after air cooling, the morphology of the Cu2Te phase in the hot-rolled blank is more close to spherical compared with the prior art, and then the approximately spherical Cu2Te phase is obtained by the first annealing, so as to improve the bending performance. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 The Cu2Te phase morphology of the hot-rolled blank of Example 1; Figure 2 The Cu2Te phase morphology of the tellurium-copper alloy strip prepared in Example 1; Figure 3 The Cu2Te phase morphology of the hot-rolled blank provided in Comparative Example 5; Figure 4 The Cu2Te phase morphology of the tellurium-copper alloy strip prepared in Comparative Example 5; Figure 5 The TC value column chart of each crystal plane of the tellurium-copper alloy strips prepared in Example 1 and Example 2; wherein, Figure 5 (a) is the TC value column chart of each crystal plane of the tellurium-copper alloy strip prepared in Example 1, Figure 5 (b) is the TC value column chart of each crystal plane of the tellurium-copper alloy strip prepared in Example 2; Figure 6 The TC value column chart of each crystal plane of the tellurium-copper alloy strip prepared in Comparative Example 7; Figure 7A TC value column chart of each crystal plane of the tellurium-copper alloy strip prepared for Comparative Example 8; Figure 8 A TC value column chart of each crystal plane of the tellurium-copper alloy strip prepared for Comparative Example 9. DETAILED DESCRIPTION

[0037] The present application will be described below in combination with examples.

[0038] The present application selects 10 examples and 9 comparative examples for illustration, and the mass percentage content of the chemical components of the alloy strips of the examples and comparative examples is shown in Table 1. The preparation process of the tellurium-copper strips of the 10 examples is as follows: smelting→ semi-continuous casting→ hot rolling→ first annealing→ first cold rolling→ second annealing→ second cold rolling→ third annealing→ third cold rolling→ stress relief annealing.

[0039] (1) Smelting: first heat the electrolytic plate, after melting, heat to 1250-1300℃, add the required tellurium block, tin ingot and phosphor copper intermediate alloy, heat for 0.5-1h, then heat to 1150-1180℃, add one or both of copper strontium and copper calcium intermediate alloy, heat for 10 minutes, and then start casting.

[0040] (2) Semi-continuous casting: the casting temperature is 1130-1180℃, and the casting speed is 60-100mm / min.

[0041] (3) Hot rolling: the cast ingot is subjected to large deformation hot rolling processing, the hot rolling heating temperature is 750-850℃, the heat preservation time is 2-5h, first air cooling, then water cooling when the temperature is below 500℃, so as to control the morphology and size of the grains and the second phase.

[0042] (4) Milling: the upper and lower surfaces are milled to a thickness of 0.3-0.6mm, and then the oxide skin and other foreign matters on the surface of the hot rolled blank are removed.

[0043] (5) First annealing: the first annealing temperature is 650-750℃, and the heat preservation time is 3-5h.

[0044] (6) First cold rolling: the first cold rolling processing rate is 70-85%.

[0045] (7) Second annealing: the second annealing temperature is 610-680℃, and the heat preservation time is 3-5h, which is combined with subsequent processing to realize grain orientation control.

[0046] (8) Second cold rolling: the second cold rolling processing rate is 50-70%.

[0047] (9) Third annealing: the temperature of the third annealing is 580-610℃, and the holding time is 3-5h, which is coordinated with the processes (7, 8) to control the preferred orientation of the crystal grains.

[0048] (10) Third cold rolling: the processing rate of the third rolling is 25-40%, so as to control the tolerance of the strip.

[0049] (11) Stress relief annealing: the temperature of the stress relief annealing is 230-300℃, and the holding time is 3-5h.

[0050] The chemical composition of the tellurium-copper alloy of the present application is shown in Table 1, the key process operation parameters are shown in Table 2, and the performance test data of the alloy strip are shown in Table 3.

[0051] The difference between Comparative Example 1 and Example 1 is that no Sr element and Ca element are added, and the other chemical compositions are shown in Table 1.

[0052] The difference between Comparative Example 2 and Example 1 is that no Sn element is added, and the other chemical compositions are shown in Table 1.

[0053] The difference between Comparative Example 3 and Example 1 is that the content of P element is 0.1 wt%, and the other chemical compositions are shown in Table 1.

[0054] The difference between Comparative Example 4 and Example 1 is that the hot rolling temperature is 880℃.

[0055] The difference between Comparative Example 5 and Example 1 is that the hot rolling is reduced to 600℃ and then spraying is performed.

[0056] The difference between Comparative Example 6 and Example 1 is that the processing rate of the second cold rolling is 45%.

[0057] The difference between Comparative Example 7 and Example 1 is that the processing rate of the second cold rolling is 75%.

[0058] The difference between Comparative Example 8 and Example 1 is that the temperature of the third annealing is 500℃, and the holding time is 2h.

[0059] The difference between Comparative Example 9 and Example 1 is that the temperature of the third annealing is 700℃, and the holding time is 6h.

[0060] The conductivity, tensile strength, bending performance, high-temperature softening temperature, TC value of preferred grain orientation, second phase particles, and metallographic photos of the above examples and comparative examples are analyzed.

[0061] Conductivity detection: the test is performed according to the requirements of GB / T 32791-2016 Copper and Copper Alloy Conductivity Eddy Current Test Method, and the test strip size is 100mm x 100mm.

[0062] Tensile strength test: The room temperature tensile test was conducted on an electronic universal mechanical performance testing machine in accordance with GB / T 228.1-2010 Metallic materials, tensile testing - Part 1: Room temperature test method. The test specimen was dumbbell-shaped, the width of the tensile specimen was 20 mm, and the tensile speed was 5 mm / min.

[0063] Bending performance tests were conducted according to GB / T 232-2010 Metallic Materials Bending Test Method, with bending angles of 180° parallel to the rolling direction and perpendicular to the rolling direction, respectively. The width of the test strip was 10 mm and the length was 50 mm.

[0064] The high-temperature softening temperature test was conducted in accordance with the requirements of GB / T 33370-2016 Determination of softening temperature of copper and copper alloys, and the sample size was 40×40mm.

[0065] TC values ​​were analyzed using a Bruker D8 Focus X-ray diffractometer.

[0066] The size, distribution, and aspect ratio of the second-phase particles were measured using a field emission scanning electron microscope (FESEM) JSM-IT700HR. The size and distribution of the second-phase particles were retained to one significant figure.

[0067] Metallographic images were taken using a Leica DMi8 metallographic microscope. The sample width was 10 mm and the length was 10 mm.

[0068] Comparative analysis of the examples and comparative examples demonstrates that the chemical composition and processing technology of the present invention have a significant impact on the performance of the strip. Comparative Example 1 shows that without the addition of Sr and Ca elements, the alloy strip has a larger grain size, resulting in poor bending performance and a low high-temperature softening temperature.

[0069] Comparative Example 2 shows that when Sn is not added, the alloy strip has coarse grains and poor bending and high-temperature resistance.

[0070] Comparative Example 3 shows that when the P element content is high, the bending performance of the strip is poor and the conductivity also decreases significantly.

[0071] Comparative Example 4 shows that when the hot rolling temperature is 880℃, the grain size of the strip is larger, the size of the second phase is larger, and the bending performance and high temperature softening temperature are reduced.

[0072] Comparative Example 5 shows that when the hot rolling temperature is reduced to below 600°C before spraying, the alloy strip exhibits edge cracks during the first cold rolling.

[0073] Comparative Example 6 shows that when the processing rate of the second cold rolling is 45%, the strength value of the strip is relatively low.

[0074] Comparative Example 7 shows that when the processing rate of the second cold rolling is 75%, such as Figure 6 As shown, the TC value of strip (420) is 0.09, while the TC values ​​of (220) and (200) increase, indicating a decrease in the bending performance of the material.

[0075] As can be seen from Comparative Example 8, when the temperature of the third annealing is too low, such as... Figure 7 As shown, when the holding time is too short, the (220) crystal plane cannot be transformed into a sufficient (420) crystal plane orientation due to the low annealing temperature, resulting in poor bending performance of the material.

[0076] As can be seen from Example 9, such as Figure 8 As shown, when the temperature of the third annealing is too high and the holding time is too long, the proportion of the (420) crystal plane is too high, the TC value is large, the bending performance of the material is good, but the strength and high temperature resistance decrease.

[0077] like Figures 1-4 As shown, the morphology of the Cu2Te phase in the hot-rolled billet and the copper telluride alloy strip obtained in Example 1 is closer to spherical than that obtained in Comparative Example 5.

[0078] like Figure 5 As shown in (a), the processing technology of this embodiment is as follows: hot rolling temperature is 760°C, spraying temperature is 450°C, milling is followed by annealing at 680°C, then a first cold rolling with a processing rate of 76%, followed by annealing at 610°C for 4 hours; then a second cold working with a processing rate of 55%, followed by annealing at 590°C for 4 hours, followed by a third cold rolling with a processing rate of 30%. Because the second annealing temperature is low, the processing rate of the second cold rolling is small, and the third annealing temperature is low, the TC value of the (420) crystal plane is 0.100.

[0079] like Figure 5 As shown in (b), other processing techniques within the scope specified in the embodiment have a higher processing rate in the second cold rolling and a higher temperature in the third annealing, resulting in more complete recrystallization of the processed structure. At the same time, the TC value of the (420) crystal plane is also higher, with a value of 0.180.

[0080] Table 1. Composition of alloy strips in the examples and comparative examples Table 2 Key process control parameters for the examples and comparative examples Table 3 Properties of alloy strips of Examples and Comparative Examples As can be seen from Table 3, the alloy strips provided by Examples 1-10 of the present application have suitable tensile strength, electrical conductivity, bending property and high temperature softening resistance.

Claims

1. A highly conductive, bend-tolerant tellurium-copper alloy strip, characterized by, The Te-Cu alloy strip comprises the following components in mass percentage: Te: 0.003-0.100 wt%, Sn: 0.003-0.040 wt%, P: 0.001-0.010 wt%, M: 0.001-0.120 wt%, wherein M is Sr and / or Ca, and the balance is Cu and inevitable impurities. The Te-Cu alloy strip comprises a second phase, and the second phase comprises a Cu2Te phase, and the aspect ratio of the Cu2Te phase is 1.0-1.

5.

2. The highly conductive, bend-ductile tellurium copper alloy strip of claim 1, wherein, The TC value of the (420) crystal plane of the Te-Cu alloy strip is 0.10-0.

18.

3. The highly conductive, bend-ductile tellurium copper alloy strip of claim 1 wherein, The grain size of the Te-Cu alloy strip is 15-35 μm.

4. The highly conductive, bend-ductile tellurium copper alloy strip of claim 1 wherein, The size of the Cu2Te phase is 0.5-1 μm, and the distribution of the Cu2Te phase is 4-6 x 10 7 / cm 2 .

5. The highly conductive, bend-durable tellurium copper alloy strip of claim 1 wherein, The Te-Cu alloy strip has a tensile strength of 320-410 MPa, an electrical conductivity of 92% IACS or more, and a high-temperature softening resistance temperature of more than 380℃.

6. The highly conductive, bend-ductile tellurium copper alloy strip of claim 1 wherein, The Te-Cu alloy strip satisfies R / t≤1.5 without cracking under 180° bending conditions in the direction perpendicular to the rolling direction and in the direction parallel to the rolling direction, wherein R is the bending radius and t is the thickness of the strip.

7. A method of producing the high-conductivity, bend-resistant tellurium-copper alloy strip of any one of claims 1-6, characterized by, The preparation method comprises the following steps: The process flow of the preparation method comprises the following steps: melting, semi-continuous casting, hot rolling, first annealing, first cold rolling, second annealing, second cold rolling, third annealing, third cold rolling, and stress relief annealing. The components of the Te-Cu alloy strip are prepared according to the mass percentage. The hot rolling is performed at a temperature of 750-850℃ for 2-5 h, and then air cooling and water cooling are performed. The first annealing is performed at a temperature of 650-750℃.

8. The method of producing a highly conductive, bend- resistant tellurium copper alloy strip according to claim 7, characterized in that, The second cold rolling is performed at a processing rate of 50-70%, and the third annealing is performed at a temperature of 580-610℃.

9. The method for preparing the high conductivity and bending resistance tellurium copper alloy strip according to claim 7, characterized in that, The first cold rolling is performed at a processing rate of 70-85%.

10. Application of the high-conductivity bending-resistant Te-Cu alloy strip according to any one of claims 1-6 to an automobile connector.

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