Metal film forming apparatus and metal film forming method
By using an aspiration device to draw in air and pressurize the plating solution while the mask material is in contact with the substrate, the problem of plastic deformation of the mask material is solved, and the pattern accuracy and uniformity of the metal film are achieved.
Patent Information
- Application Number
- CN202510856313.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-07-17
- Filing Date
- 2025-06-25
- Publication Date
- 2026-01-20
AI Technical Summary
In existing technologies, mask materials are prone to plastic deformation when repeatedly forming metal films, resulting in the inability to form the desired pattern.
A film-forming device is used, which uses an attraction device to draw air between the mask part and the electrolyte membrane through multiple grooves while the mask material is in contact with the substrate, and increases the pressure of the plating solution through a pressurizing mechanism to ensure that the plating solution is evenly pressed against the substrate to form a metal film.
It effectively suppresses the plastic deformation of the mask material, ensuring the pattern accuracy and uniformity of the metal film, and can form the desired pattern even with repeated use.
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Figure CN121363033A_ABST
Abstract
Citation Information
Patent Citations
Deposition method
JP2023139630A