Electrification temperature cycle test method, system and device of electronic device

Abstract

The invention provides an electronic device electrification temperature cycle test method, system and device, and belongs to the technical field of semiconductors. According to the electrification temperature cycle test method of the electronic device, after the temperature cycle test starting instruction is received, different control instructions are sent to the electronic device, and therefore the electronic device is controlled to be switched among different working states. Since the electronic device can realize self-heating and self-cooling in the process of switching between different working states, the defect of the electronic device can be possibly exposed, so that the test can be carried out without using a temperature circulation box, the space occupied by the test is reduced, a test environment does not need to be built in the temperature circulation box, and the test efficiency is improved. The test is carried out through self-heating and self-cooling of the electronic device, the electronic device does not need to fully reach the test temperature through holding time, and the power consumption of the test is reduced. In conclusion, according to the method provided by the embodiment of the invention, the test difficulty and cost are reduced, and the test efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a method, system and device for temperature cycling test of an electronic device under voltage. BACKGROUND

[0002] Electronic devices usually connect the circuit pins on the chip with external circuits through packaging materials. Due to the difference in the coefficient of thermal expansion (CTE) between materials and the change in weather temperature or working load, cracks and delamination may occur between materials in contact with each other, or the chip may crack and the packaging material may crack due to the inherent mechanical strength of the material itself, which may cause the electronic device to fail. Therefore, temperature cycling test needs to be performed on the electronic device to screen out electronic devices prone to failure.

[0003] In the related art, a temperature cycling box (i.e., a temperature cycling chamber) is used to perform temperature cycling test of an electronic device under voltage: a single board or a whole machine on which the electronic device is installed is placed in the temperature cycling box for operation, the temperature of the temperature cycling box alternates between high and low temperatures, the temperature of the single board or the whole machine alternates between the set high and low temperatures, and the single board or the whole machine needs to be kept at the set high or low temperature for a period of time after reaching the set high or low temperature each time, which is referred to as holding time, wherein the holding time is greater than the thermal equilibrium time of the single board or the whole machine.

[0004] However, in the above method, it is very complex and costly to build an environment for temperature cycling test under voltage at the device level, so temperature cycling test under voltage needs to be performed at the board level or the whole machine level. The temperature cycling chamber required for temperature cycling test under voltage at the board level or the whole machine level is large in size and high in power consumption, resulting in high cost of temperature cycling test. In addition, the thermal equilibrium time of the single board or the whole machine in the temperature cycling chamber is long, which results in long time consumption and low efficiency of temperature cycling test. SUMMARY

[0005] The embodiments of the present application provide a method, system and device for temperature cycling test of an electronic device under voltage, which can reduce the difficulty and cost of test and improve the efficiency of test. The technical solution is as follows.

[0006] In a first aspect, a method for temperature cycling test of an electronic device is provided. The method comprises: receiving a temperature cycling test start instruction; and in response to the temperature cycling test start instruction, sending a first control instruction and a second control instruction to the electronic device, respectively, so that the electronic device operates in a first working state and a second working state, respectively. The first control instruction is used to control the electronic device to operate in the first working state, and the second control instruction is used to control the electronic device to operate in the second working state. The temperature of the electronic device in the first working state when reaching a temperature stable state is a first temperature, and the temperature of the electronic device in the second working state when reaching the temperature stable state is a second temperature. In the process of the temperature of the electronic device changing between the first temperature and the second temperature, defects existing in the electronic device can be tested. The temperature stable state refers to that the temperature variation range of the electronic device is within a preset range.

[0007] Since the temperature of the electronic device is not constant, the electronic device only needs to reach a relatively stable temperature, and does not need to be at a specific temperature for a period of time to be considered to be in a stable state. The electronic device reaching the temperature stable state refers to that the temperature variation range of the electronic device is within a preset range, that is, the temperature of the electronic device reaches a certain temperature and the variation amplitude within a certain period of time is within a certain temperature threshold. The temperature of the electronic device reaching the temperature stable state in the first working state is the first temperature, which means that when the electronic device is in the first working state, the temperature of the electronic device reaches the first temperature within a first preset time period and the variation amplitude within the first preset time period is within a first temperature threshold. The temperature of the electronic device reaching the temperature stable state in the second working state is the second temperature, which means that when the electronic device is in the second working state, the temperature of the electronic device reaches the second temperature within a second preset time period and the variation amplitude within the second preset time period is within a second temperature threshold. The first preset time period and the second preset time period can be the same or different, and the first temperature threshold and the second temperature threshold can be the same or different, which are not limited in the embodiments of the present application. The temperature difference between the first temperature and the second temperature is large enough to test the defects existing in the electronic device in the process of the temperature of the electronic device changing between the first temperature and the second temperature.

[0008] The method for testing the electronic device in the temperature cycle provided in the embodiments of the present application can control the electronic device to switch between different working states by sending different control instructions to the electronic device after receiving the temperature cycle test starting instruction. Since the electronic device can generate heat and cool down by itself when switching between different working states, the electronic device may expose its defects, therefore, the method provided in the embodiments of the present application can perform the temperature cycle test without using the temperature cycle test box, thus reducing the space occupied by the test, and there is no need to build a test environment in the temperature cycle test box, and the test is performed by the self-heating and self-cooling of the electronic device, and there is no need to keep the time to make the electronic device reach the test temperature, thus reducing the power consumption of the test. In summary, the method provided in the embodiments of the present application reduces the difficulty and cost of the test, and improves the efficiency of the test.

[0009] In some embodiments, the above-mentioned sending the first control instruction and the second control instruction to the electronic device in response to the temperature cycle test starting instruction comprises: alternately sending the first control instruction and the second control instruction to the electronic device in response to the temperature cycle test starting instruction, so that the electronic device alternately runs in the first working state and the second working state. This process makes the working state of the electronic device constantly alternate between the first working state and the second working state, so that the temperature of the electronic device constantly cycles between high temperature and low temperature, which can more fully test the electronic device in the temperature cycle and improve the accuracy of the test results.

[0010] In some embodiments, the above-mentioned sending the first control instruction and the second control instruction to the electronic device in response to the temperature cycle test starting instruction comprises: sending the first control instruction to the electronic device in response to the temperature cycle test starting instruction; based on the temperature of the electronic device, when the electronic device reaches the temperature stable state in the first working state, sending the second control instruction to the electronic device; based on the temperature of the electronic device, when the electronic device reaches the temperature stable state in the second working state, sending the first control instruction to the electronic device. This process sends the next control instruction to the electronic device when the temperature of the electronic device reaches the temperature stable state, which can make the temperature of the electronic device fully reach the highest temperature that can be reached by self-heating or the lowest temperature that can be reached by self-cooling, thus increasing the temperature difference of the electronic device in the test process and improving the effectiveness of the test.

[0011] In some embodiments, the method further comprises at least one of: sending a third control instruction to the heat dissipation device when the electronic device is in the first working state, the third control instruction being used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stable state in the first working state less than the first temperature; and sending a fourth control instruction to the heat dissipation device when the electronic device is in the second working state, the fourth control instruction being used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stable state in the second working state greater than the second temperature. The process further adjusts the temperature of the electronic device by the heat dissipation device, so as to ensure the accuracy of the temperature and improve the effectiveness of the test while widening the temperature difference of the electronic device in the test.

[0012] In some embodiments, the first control instruction is used to control the electronic device to run in an idle state, and the second control instruction is used to control the electronic device to run in a full load state. In the idle state, the electronic device has no task to run, and thus can reach the lowest temperature that can be reached by self-cooling. In the full load state, the electronic device runs at a high speed, and thus can reach the highest temperature that can be reached by self-heating.

[0013] In some embodiments, the first control instruction is used to control the electronic device to run in an idle state, and the second control instruction is used to control the electronic device to refresh uninterruptedly. In the idle state, the electronic device can reach the lowest temperature that can be reached by self-cooling. When refreshing uninterruptedly, the electronic device can reach the highest temperature that can be reached by self-heating.

[0014] In a second aspect, a system for a hot temperature cycle test of an electronic device is provided. The system comprises a control device configured to: receive a temperature cycle test start instruction; and in response to the temperature cycle test start instruction, send a first control instruction and a second control instruction to the electronic device respectively, so that the electronic device runs in a first working state and a second working state respectively. The first control instruction is used to control the electronic device to run in the first working state, and the second control instruction is used to control the electronic device to run in the second working state. The temperature of the electronic device when reaching a temperature stable state in the first working state is a first temperature, and the temperature of the electronic device when reaching a temperature stable state in the second working state is a second temperature. In the process that the temperature of the electronic device changes between the first temperature and the second temperature, defects existing in the electronic device can be tested. The temperature stable state means that the temperature of the electronic device changes in a preset range.

[0015] In some embodiments, the control device is configured to: in response to the temperature cycle test start instruction, alternately send the first control instruction and the second control instruction to the electronic device, so that the electronic device alternately runs in the first working state and the second working state.

[0016] In some embodiments, the system further comprises a temperature measuring device; and the control device is configured to: in response to the temperature cycling test starting instruction, send a first control instruction to the electronic device; based on the temperature of the electronic device detected by the temperature measuring device, send a second control instruction to the electronic device when the electronic device reaches a temperature stable state in the first working state; and based on the temperature of the electronic device detected by the temperature measuring device, send the first control instruction to the electronic device when the electronic device reaches a temperature stable state in the second working state.

[0017] In some embodiments, the system further comprises a heat dissipation device; and the control device is further configured to at least one of: send a third control instruction to the heat dissipation device when the electronic device operates in the first working state, the third control instruction being configured to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stable state in the first working state less than the first temperature; and send a fourth control instruction to the heat dissipation device when the electronic device operates in the second working state, the fourth control instruction being configured to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stable state in the second working state greater than the second temperature.

[0018] In some embodiments, the first control instruction is configured to control the electronic device to operate in an idle state, and the second control instruction is configured to control the electronic device to operate at full load.

[0019] In some embodiments, the first control instruction is configured to control the electronic device to operate in an idle state, and the second control instruction is configured to control the electronic device to continuously refresh.

[0020] In a third aspect, a control device is provided for performing the above-mentioned method for performing a temperature cycling test on an electronic device under voltage. Specifically, the control device comprises a functional module for performing the above-mentioned method for performing a temperature cycling test on an electronic device under voltage of the first aspect or any of the optional manners of the first aspect.

[0021] In a fourth aspect, a computing device or a cluster of computing devices is provided, the computing device comprising a processor configured to execute program code to cause the computing device or the cluster of computing devices to perform operations performed by the above-mentioned method for performing a temperature cycling test on an electronic device under voltage.

[0022] In a fifth aspect, a computer-readable storage medium is provided, the storage medium storing at least one program code, the program code being read by a processor to cause a computing device to perform operations performed by the above-mentioned method for performing a temperature cycling test on an electronic device under voltage.

[0023] In a sixth aspect, a computer program product or computer program is provided, the computer program product or computer program comprising a program code stored in a computer readable storage medium, the program code being read by a processor of a computing device from the computer readable storage medium, the processor executing the program code causing the computing device to perform the method provided in the first aspect or any of the optional modes of the first aspect.

[0024] On the basis of the implementation manners of the above aspects, the application can be further combined to provide more implementation manners. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic diagram of an electronic device under test system provided by an embodiment of the application;

[0026] Figure 2 is a flowchart of an electronic device under test temperature cycling test method provided by an embodiment of the application;

[0027] Figure 3 is a schematic diagram of a memory module refresh duration and refresh period provided by an embodiment of the application;

[0028] Figure 4 is a schematic diagram of a memory module working state cycle provided by an embodiment of the application;

[0029] Figure 5 is a structural schematic diagram of a control device provided by an embodiment of the application;

[0030] Figure 6 is a structural schematic diagram of a computing device provided by an embodiment of the application;

[0031] Figure 7 is a structural schematic diagram of a computing device cluster provided by an embodiment of the application. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the application more clear, the embodiments of the application will be further described in detail below with reference to the drawings.

[0033] With the development of science and technology, electronic devices are widely used in various fields. In the application process of electronic devices, the electronic devices usually connect the circuit pins on the chip with the external circuit through the packaging material. Due to the difference in the coefficient of thermal expansion (CTE) between materials, cracks, delamination and other problems are prone to occur between the materials in contact with each other when the weather temperature or working load changes, or due to the inherent mechanical strength of the material itself, the chip cracks, the packaging material cracks and other problems, which will cause the electronic device to fail, so it is necessary to perform temperature cycle test on the electronic device, so as to screen out the electronic device prone to failure.

[0034] In the related art, a temperature cycle test of a single board or a whole machine is generally performed by using a temperature cycle box, that is, the single board or the whole machine installed with electronic devices is placed in the temperature cycle box for operation, and the temperature of the temperature cycle box alternately changes between high temperature and low temperature, so that the temperature of the single board or the whole machine alternately changes between the set high temperature and low temperature. In order to make the electronic devices in the temperature cycle box fully reach the set high temperature or low temperature, the temperature cycle box also needs to maintain the temperature for a period of time after the temperature in the temperature cycle box reaches the set high temperature or low temperature, which is called holding time. When the holding time is greater than the thermal equilibrium time of the single board or the whole machine, the electronic devices in the temperature cycle box can fully reach the set high temperature or low temperature. The above-mentioned temperature cycle test process has several problems. First, the temperature cycle box used in the above-mentioned test has a large volume, which leads to a large space occupied by the test, and the number of temperature cycle boxes that can be set in the limited space is limited, which makes it difficult to carry out large-scale temperature cycle test. Secondly, due to the long holding time required by the above-mentioned temperature cycle test process, the test time is long and the test efficiency is low, which also leads to high power consumption of the temperature cycle box and high test cost. In addition, the process of building a test environment for a single board in the temperature cycle box is relatively complex, which leads to high test difficulty.

[0035] To solve the above problems existing in the temperature cycle test using the temperature cycle box, an embodiment of the present application proposes a brand-new temperature cycle test method. Instead of using the temperature cycle box to adjust the temperature of the electronic device, the method sends different control instructions to the electronic device alternately according to the feature that the electronic device reaches different temperatures in different working states, controls the electronic device to switch between different working states, so that the electronic device generates heat or cools down spontaneously in the switching process of different working states, thereby switching the temperature of the electronic device between high temperature and low temperature. Here, the different control instructions are referred to as first control instructions and second control instructions, and sending the electronic device one first control instruction and one second control instruction is referred to as one round of alternation. The method provided in the embodiment of the present application makes the electronic device generate heat and cool down alternately for multiple times through multiple rounds of alternation, thereby adjusting the temperature of the electronic device for multiple times to complete the test. The method provided in the embodiment of the present application does not need to use the temperature cycle box, reduces the space occupied by the test, does not need additional holding time to make the electronic device reach the set temperature fully, has a shorter test time, improves the test efficiency, reduces the power consumption of the test, and reduces the test cost. In addition, the method provided in the embodiment of the present application does not need to build a test environment in the temperature cycle box, thereby reducing the test difficulty.

[0036] To implement the above-mentioned temperature cycle method of the electronic device, an embodiment of the present application provides a temperature cycle test system as shown in the following Figure 1 application embodiment provides the temperature cycle test method of the electronic device. Figure 1 is a structural schematic diagram of an electronic device temperature cycle test system provided by an embodiment of the present application, which is used to apply the temperature cycle test method of the electronic device provided by the embodiment of the present application. As Figure 1 shown, the temperature cycle test system 100 includes a control device 101, the control device 101 is connected with an electronic device 102, to realize the interaction between the temperature cycle test system 100 and the electronic device 102, thereby testing the electronic device 102.

[0037] The control device 101 can be a central processing unit (CPU) or a main chip. The control device 101 can be located on the same single board as the electronic device 102, or can be located on different single boards from the electronic device 102, for example, the two are located in different devices, for sending control instructions to the electronic device 102 to control the electronic device 102 to switch working states.

[0038] The electronic device 102 can be a dynamic random access memory (DRAM) type device, such as a memory module (memory stick), a DRAM particle, a low power double data rate SDRAM (LPDDR), a high bandwidth memory (HBM), or a dual-inline-memory-modules (DIMM), and the like. The electronic device 102 can also be other types of electronic devices, which are not limited by embodiments of the present application. The electronic device 102 is configured to receive an instruction issued by the control apparatus 101, and switch to a working state indicated by the instruction according to the instruction. The working state includes a first working state and a second working state. The first working state is an idle state, in which the electronic device 102 can reach a lowest temperature that can be reached by self-cooling. The second working state varies with the characteristics of the electronic device 102 itself or supported functions, and in the second working state, the electronic device 102 can reach a highest temperature that can be reached by self-heating. Taking the electronic device 102 as a memory module as an example, the first working state of the memory module is an idle state, and the second working state is an accelerated refresh state in which the memory module continuously refreshes. The idle state means that the memory module is in a standby state and does not perform any read / write operation or refresh operation, at which time the temperature of the memory module approaches the ambient temperature, which is the lowest temperature that can be reached by self-cooling of the memory module. The accelerated refresh state means that the refresh period of the memory module is equal to the refresh duration of the memory module during the refresh process of the memory module, that is, the memory module continuously refreshes to improve the number of concurrent accesses to the memory module per unit time, at which time the temperature of the memory module rises due to high access pressure. In the accelerated refresh state, the temperature of the memory module can reach the highest temperature that can be reached by self-heating. The refresh period of the memory module is the duration between the starting time point of a refresh and the starting time point of the next refresh, and the refresh duration of the memory module is the duration consumed by the memory module to perform a refresh. Taking the electronic device 102 as an HBM as another example, the first working state of the HBM is an idle state, and the second working state is a full load running state. The idle state of the HBM is the same as that of the memory module, and the full load running state of the HBM means that the HBM runs at full bandwidth, that is, the HBM reads and writes the maximum amount of data per unit time, at which time the temperature of the HBM rises due to high read / write pressure. In the full load running state, the temperature of the HBM can reach the highest temperature that can be reached by self-heating.The full load running state of the HBM refers to a full bandwidth running state, and for electronic devices other than the HBM, the full load running state can be other working states, which are not limited in the embodiments of the present application.

[0039] In the process of performing the temperature cycle test, after receiving the temperature cycle test starting instruction, the control device 101 sends different control instructions alternately in multiple rounds, that is, sends the first control instruction and the second control instruction alternately to the electronic device 102 multiple times, so that the electronic device 102 switches between the first working state and the second working state multiple times, and then the temperature of the electronic device 102 cycles between the low temperature and the high temperature multiple times, so as to complete the temperature cycle test. In one round of alternation, the control device 101 sends the first control instruction to the electronic device 102, so that the electronic device 102 is in the first working state, thereby reducing the temperature of the electronic device 102. When the control device 101 detects that the electronic device 102 reaches a temperature stable state, or when the time length after the control device 101 sends the first control instruction reaches the cooling time length, it indicates that the electronic device 102 reaches the lowest temperature that can be reached by self-cooling, and the control device 101 sends the second control instruction to the electronic device 102, so that the electronic device 102 is in the second working state, thereby increasing the temperature of the electronic device 102. When the control device 101 detects that the electronic device 102 reaches a temperature stable state, or when the time length after the control device 101 sends the second control instruction reaches the heating time length, it indicates that the electronic device 102 reaches the highest temperature that can be reached by self-heating, and the control device 101 sends the first control instruction to the electronic device 102 to perform the next round of alternation. The heating time length and the cooling time length are both preset time lengths, which can be the same time length or different time lengths, and the embodiments of the present application are not limited thereto. When the number of alternation rounds reaches the preset number of rounds, or when the test time length reaches the preset test time length, the alternation is stopped, and the temperature cycle test is completed. When the test is completed, if the electronic device 102 can still operate normally, the control device 101 outputs the test completion information, which indicates that the electronic device 102 completes the test. During the test, if the electronic device 102 operates abnormally, the control device 101 outputs the test interruption information, which indicates that the electronic device 102 operates abnormally. In some embodiments, the test interruption information also indicates the temperature of the electronic device 102 when the electronic device 102 operates abnormally.

[0040] In some embodiments, the temperature cycle test system further includes a temperature measuring device 103 and a heat dissipation device 104, and the control device 101 is connected to the electronic device 102, the temperature measuring device 103 and the heat dissipation device 104.

[0041] The temperature measuring device 103 can be a thermocouple or other type of temperature sensor, etc. The temperature measuring device 103 can be located on the same single board as the electronic device 102, can be located outside the electronic device 102, close to the electronic device 102, or can be located inside the electronic device 102, and the embodiments of the present application do not limit this. The temperature measuring device 103 is used to detect the temperature of the electronic device 102, and sends the temperature of the electronic device 102 to the control device 101 every certain time interval. The heat dissipation device 104 can be a heat dissipation fan or the like. The heat dissipation device 104 can be installed on the single board on which the electronic device 102 is located, or can be installed on the corresponding case of the single board on which the electronic device 102 is located, and the embodiments of the present application do not limit this. The heat dissipation device 104 is used to further adjust the temperature of the electronic device 102. Taking the heat dissipation device as a heat dissipation fan as an example, in the process of further adjusting the temperature of the electronic device 102, if the electronic device 102 is in the first working state, the speed of the heat dissipation fan is increased, the heat dissipation function of the heat dissipation fan is enhanced, so that the electronic device 102 reaches the minimum temperature faster, and if the electronic device 102 is in the second working state, the speed of the heat dissipation fan is reduced or turned off, the heat dissipation function of the heat dissipation fan is weakened or turned off, so that the electronic device 102 reaches the maximum temperature faster.

[0042] In the process of performing the temperature cycle test, the control device 101 completes the temperature cycle test through the above-mentioned multiple rounds of alternation after receiving the temperature cycle test start instruction. In the process of the test, the temperature measuring device 103 detects the temperature of the electronic device 102 and sends the temperature of the electronic device 102 to the control device 101 every certain time length. In a round of alternation, the control device 101 sends the first control instruction to the electronic device 102 to make the electronic device 102 in the first working state, so that the temperature of the electronic device 102 decreases. The control device 101 also sends the third control instruction to the heat dissipation device 104 to make the heat dissipation function of the heat dissipation device 104 stronger, so that the electronic device 102 reaches the lowest temperature faster. When the control device 101 analyzes that the electronic device 102 reaches the temperature stable state according to the temperature of the electronic device 102 sent by the temperature measuring device 103, it indicates that the electronic device 102 reaches the lowest temperature that can be reached by self-cooling, and the control device 101 sends the second control instruction to the electronic device 102 to make the electronic device 102 in the second working state, so that the temperature of the electronic device 102 increases. The control device 101 also sends the fourth control instruction to the heat dissipation device 104 to make the heat dissipation function of the heat dissipation device 104 weaker, so that the electronic device 102 reaches the highest temperature faster. When the control device 101 analyzes that the electronic device 102 reaches the temperature stable state according to the temperature of the electronic device 102 sent by the temperature measuring device 103, it indicates that the electronic device 102 reaches the highest temperature that can be reached by self-heating, and the control device 101 sends the first control instruction to the electronic device 102 to perform the next round of alternation. When the number of alternation rounds reaches the preset number of rounds, or when the test time length reaches the preset test time length, the alternation is stopped, and the temperature cycle test is completed. When the test is completed, if the electronic device 102 can still operate normally, the control device 101 outputs the test completion information, and the test completion information indicates that the electronic device 102 completes the test. In the process of the test, if the electronic device 102 cannot operate normally, the control device 101 outputs the test interruption information, and the test interruption information indicates that the electronic device 102 operates abnormally. In some embodiments, the test interruption information also indicates the temperature when the electronic device 102 operates abnormally.

[0043] The above Figure 1 The electronic device temperature cycle test system provided by the embodiments of the present application is described in detail, and the electronic device temperature cycle test method provided by the embodiments of the present application is described below. The temperature cycle test method is implemented through the above-mentioned temperature cycle test system.

[0044] Figure 2is a flowchart of a temperature cycling test method of an electronic device according to an embodiment of the present application. The following takes the electronic device to be tested as a memory module and takes one round of alternation in the test as an example to describe the temperature cycling test method. The first working state of the memory module corresponds to an idle state, and the second working state corresponds to an accelerated refresh state. It should be noted that before the temperature cycling test starts, the memory module can be in any working state, such as a standby state or a self-refresh state, and the embodiments of the present application do not limit this. As shown in FIG. Figure 2 The method comprises the following steps.

[0045] 201. The control device receives a temperature cycling test start instruction.

[0046] The temperature cycling test start instruction can carry a variety of information, and the embodiments of the present application do not limit the temperature cycling test start instruction. In some embodiments, the temperature cycling test start instruction carries the identification of the electronic device to be tested, indicating that the temperature cycling test is performed on the electronic device corresponding to the identification. The temperature cycling test start instruction can carry one or more identifications, and each identification corresponds to an electronic device. Accordingly, in the embodiments of the present application, the temperature cycling test start instruction carries the identification of a memory module, indicating that the temperature cycling test is performed on the memory module corresponding to the identification.

[0047] In other embodiments, the temperature cycling test start instruction carries the type of electronic device to be tested, indicating that the temperature cycling test is performed on the electronic device belonging to the type of electronic device. Optionally, the type of electronic device carried by the temperature cycling test start instruction is also used to determine the test method adopted by the temperature cycling test. Accordingly, in the embodiments of the present application, the type of electronic device carried by the temperature cycling test start instruction is a memory module type, indicating that the test method corresponding to the memory module type is adopted to perform the temperature cycling test on the memory module in the electronic device. The electronic device can be a single board or a whole machine, and the embodiments of the present application do not limit this.

[0048] In yet other embodiments, the temperature cycling test start instruction can also carry at least one of the test method, the preset number of rounds, the heating duration, and the cooling duration, and the embodiments of the present application do not limit this. The test method, the preset number of rounds, the heating duration, or the cooling duration can be a parameter pre-set in the control device. After receiving the temperature cycling test start instruction, the control device performs the temperature cycling test according to the pre-set parameter.

[0049] The control device receives the temperature cycle test start instruction in various ways. In some embodiments, the control device is connected to a computing device such as a terminal or a server via a network, and the control device receives the temperature cycle test start instruction sent by the computing device via the network. In other embodiments, the control device generates a temperature cycle test start instruction corresponding to a user's start operation in response to the user's start operation, and the present application does not limit this.

[0050] 202. The control device sends a first control instruction to the memory module in response to the temperature cycle test start instruction, and the first control instruction is used to control the memory module to run in an idle state.

[0051] The control device sends a first control instruction to the memory module in response to the temperature cycle test start instruction in various ways. In some embodiments, the control device obtains the identifier of the memory module from the temperature cycle test start instruction, obtains the address corresponding to the identifier according to the mapping relationship between the identifier and the device address, and sends the first control instruction to the memory module corresponding to the address. Alternatively, the control device also determines the test method to be used by the memory module corresponding to the identifier according to the mapping relationship between the identifier and the test method, and sends the first control instruction corresponding to the test method to the memory module corresponding to the address. The mapping relationship between the identifier and the device address and the mapping relationship between the identifier and the test method are pre-set. This process sends the first control instruction to one or more specified electronic devices, which can implement temperature cycle testing on the specified electronic devices and improve the refinement of temperature cycle testing.

[0052] In other embodiments, the control device obtains the memory module type from the temperature cycle test start instruction, obtains the address corresponding to the memory module according to the mapping relationship between the electronic device type and the device address, and sends the first control instruction to the memory module corresponding to the address. Alternatively, the control device also determines the test method to be used by the memory module according to the mapping relationship between the electronic device type and the test method, and sends the first control instruction corresponding to the test method to the memory module corresponding to the address. The mapping relationship between the electronic device type and the device address and the mapping relationship between the electronic device type and the test method are pre-set. This process sends the first control instruction to electronic devices of the same type, which can simultaneously perform temperature cycle testing on electronic devices of the same type and improve the efficiency of testing.

[0053] In some embodiments, before sending the first control command to the memory module, the control device sends a status query command to the memory module. Based on the status query command, the memory module returns its operating status to the control device. If the memory module's operating status is idle, the control device does not send the first control command; if the memory module's operating status is not idle, the control device sends the first control command. This process, by first querying the memory module's operating status and then deciding whether to send the first control command based on the query result, avoids issuing redundant first control commands and improves the effectiveness of the issued first control commands.

[0054] In some embodiments, the first control instruction carries the address corresponding to the memory module. The process of the control device sending the first control instruction to the memory module corresponding to the address includes: the control device sending the first control instruction to the bus; an electronic device connected to the bus identifying the address carried by the first control instruction; if the address matches the address of the electronic device itself, the electronic device receives the first control instruction; if the address does not match the address of the electronic device itself, the electronic device does not receive the first control instruction. The process of the control device sending a status query instruction to the memory module is the same as the process of the control device sending the first control instruction to the memory module, and will not be described again in this embodiment.

[0055] 203. The temperature measuring device detects the temperature of the memory module and sends the temperature of the memory module to the control device at regular intervals.

[0056] There are multiple ways for the temperature measuring device to detect the temperature of the memory module. In some embodiments, the temperature measuring device detects the temperature of the memory module in response to a first temperature measurement command. The first temperature measurement command is a command sent by the control device to the temperature measuring device in response to a temperature cycle test start command. This allows the temperature measuring device to detect the temperature of the memory module immediately after the test starts, so that the control device can obtain the temperature of the memory module in a timely manner, avoid missing test information, and improve the effectiveness of the test.

[0057] In some embodiments, the temperature detecting device detects the temperature of the memory module in response to the memory module starting to run. In this process, when the electronic device is powered on, the temperature detecting device detects the temperature of the memory module by default in response to the memory module starting to run. Alternatively, the temperature detecting device detects the temperature of the memory module in response to a second temperature detecting instruction. The sending process of the second temperature detecting instruction includes: when the memory module starts to run, the memory module sends running start information to the control device, where the running start information indicates that the memory module starts to run. The control device sends the second temperature detecting instruction to the temperature detecting device in response to the running start information. This process enables the temperature detecting device to detect the temperature of the memory module after the memory module starts to run, and enables the control device to obtain the temperature of the memory module during the test process and outside the test process, thereby providing more information for designing the temperature cycle test or analyzing the result of the temperature cycle test.

[0058] The above process describes the process of the temperature detecting device detecting the temperature of the memory module. In some embodiments, when the temperature cycle test ends, the control device sends a first temperature detecting stopping instruction to the temperature detecting device, and the temperature detecting device stops detecting the temperature of the memory module in response to the first temperature detecting stopping instruction. In other embodiments, the temperature detecting device stops detecting the temperature of the memory module in response to the memory module stopping to run. In this process, when the electronic device is powered off, the temperature detecting device stops detecting the temperature of the memory module by default in response to the memory module stopping to run. Alternatively, the temperature detecting device stops detecting the temperature of the memory module in response to a second temperature detecting stopping instruction. The sending process of the second temperature detecting stopping instruction includes: when the memory module stops to run, the memory module sends running stop information to the control device, where the running stop information indicates that the memory module stops to run. The control device sends the second temperature detecting stopping instruction to the temperature detecting device in response to the running stop information. The above process enables the temperature detecting device to stop detecting the temperature of the memory module, thereby reducing the energy consumed by the test and lowering the cost of the test.

[0059] Through the step 203, the control device can obtain the temperature of the memory module in real time and accurately, and then accurately determine whether the memory module reaches the temperature stable state, to determine whether to send the next control instruction to the memory module to switch the working state of the memory module, that is, through the step 203, the control device can perform the temperature cycle test according to the accurate temperature of the memory module, to ensure the accuracy of the test result. In addition, during the temperature cycle test, if the memory module has a running abnormality, through the step 203, the control device can also obtain the temperature at which the memory module has the running abnormality, to enrich the test result and improve the effectiveness of the test.

[0060] In the above process, the control device determines whether the memory module reaches the temperature stable state according to the temperature detected by the temperature measuring device. In some embodiments, the temperature cycling test system does not need to install the temperature measuring device, and the control device can also determine whether the memory module reaches the temperature stable state. Accordingly, the control device predicts whether the memory module reaches the temperature stable state according to the time length after the control instruction is issued. If the time length after the control device issues the first control instruction reaches the cooling time length, it indicates that the memory module reaches the temperature stable state in the idle state. If the time length after the control device issues the second control instruction reaches the heating time length, it indicates that the memory module reaches the temperature stable state in the accelerated refresh state. The cooling time length and the heating time length are both time lengths obtained through previous experiments, which can ensure that the memory module reaches the corresponding temperature stable state within the cooling time length or the heating time length. This way controls the sending of the first control instruction through the pre-set cooling time length and controls the sending of the second control instruction through the pre-set heating time length, without analyzing the temperature of the memory module, which can determine whether the memory module reaches the temperature stable state, reduces the calculation amount consumed by the temperature cycling test, and improves the efficiency of the temperature cycling test.

[0061] The heating time length and the cooling time length of the electronic device are related to multiple factors. By configuring the multiple factors, the heating time length and the cooling time length of the electronic device can be adjusted to adjust the time length consumed by the temperature cycling test, so that the temperature cycling test is more flexible. Taking a DRAM type electronic device as an example, the heating time length and the cooling time length are related to the power consumption of the electronic device itself, the number of electronic devices assembled on the single board, and the heat dissipation function of the heat dissipation device. The higher the power consumption of the electronic device itself, the more the number of electronic devices assembled on the single board, and the weaker the heat dissipation function of the heat dissipation device, the shorter the heating time length and the longer the cooling time length. The lower the power consumption of the electronic device itself, the fewer the number of electronic devices assembled on the single board, and the stronger the heat dissipation function of the heat dissipation device, the longer the heating time length and the shorter the cooling time length. By adjusting at least one of the power consumption of the DRAM type electronic device itself, the number of electronic devices assembled on the single board, and the heat dissipation function of the heat dissipation device, the heating time length and the cooling time length of the DRAM type electronic device can be adjusted to adjust the time length consumed by the temperature cycling test.

[0062] 204、The memory module operates in the idle state according to the first control instruction to reduce its temperature, and the temperature of the memory module when it reaches the temperature stable state in the idle state is a first temperature.

[0063] In the embodiments of the present application, the temperature of the memory module when it reaches the temperature stable state in the idle state is referred to as the first temperature. The first temperature is related to the ambient temperature of the environment in which the memory module is located. The higher the ambient temperature, the higher the first temperature, and the lower the ambient temperature, the lower the first temperature.

[0064] In some embodiments, after receiving the first control instruction, if the memory module is currently running in the idle state, the memory module continues to run in the idle state. If the memory module is currently running in a working state other than the idle state, the memory module switches to run in the idle state.

[0065] Optionally, if the memory module is currently running in a working state other than the idle state, and forcibly switching to the idle state will affect the work being performed by the memory module, the memory module returns test blocked information to the control device, the test blocked information indicating the working state of the memory module. After receiving the test blocked information, the control device sends a test continue instruction to the memory module in response to an instruction to continue the test. In response to the test continue instruction, the memory module switches to run in the idle state, or in response to the test continue instruction, the memory module waits for the current work to be completed and then switches to run in the idle state. Alternatively, after receiving the test blocked information, the control device sends a test stop instruction to the memory module in response to an instruction to stop the test. In response to the test stop instruction, the memory module continues to run in the current working state. This process can effectively reduce the impact of the temperature cycle test on the work of the memory module by returning the test blocked information to the control device.

[0066] The above describes the process of switching the memory module to run in the idle state. In some embodiments, after the memory module switches to run in the idle state, the memory module sends switching information to the control device, the switching information indicating that the memory module has successfully switched to the idle state. During the process of running in the idle state, the memory module sends running information of the memory module to the control device every certain running duration, the running information indicating the running condition of the memory module, including the read-write operation record of the memory module, etc. After receiving the running information, if the running information indicates that the memory module is running abnormally, the control device returns test interruption information according to the running information of the memory module sent by the temperature measuring device, the test interruption information indicating that the memory module is running abnormally in the idle state. The abnormal running can be an error in the read-write operation of the memory module, a mismatch between the refresh duration of the memory module and the set duration, or a mismatch between the refresh cycle of the memory module and the set cycle, etc., which are not limited in the embodiments of the present application. This process can enable the control device to discover the abnormality of the memory module in a timely manner and improve the accuracy of the test by feeding back the running condition of the memory module to the control device.

[0067] In addition to indicating that the memory module is running abnormally, in some embodiments, if the running information indicates that the memory module is running abnormally, the test interruption information returned by the control device also indicates the temperature of the memory module when the memory module is running abnormally, thereby enriching the information contained in the test result and improving the effectiveness of the test.

[0068] In some embodiments, if the running information indicates that the memory module is running abnormally, the test interruption information returned by the control device also indicates the duration for which the memory module has been running in the idle state before running abnormally, thereby enriching the information contained in the test result and improving the effectiveness of the test.

[0069] 205、The control device sends a third control instruction to the heat dissipation device when the memory module is running in the idle state, and the third control instruction is used to control the heat dissipation device to make the temperature of the memory module after reaching the temperature stable state in the idle state less than the first temperature.

[0070] The third control instruction carries content related to the heat dissipation device. In some embodiments, the third control instruction carries a first rotating speed of the heat dissipation fan, which is used to control the heat dissipation fan to run at the first rotating speed, or the third control instruction carries an acceleration step, which is used to control the heat dissipation fan to accelerate according to the acceleration step, or the third control instruction carries a first heat dissipation state, which is used to control the heat dissipation fan to run in the first heat dissipation state. The embodiments of the present application do not limit the way of controlling the heat dissipation ability of the heat dissipation device through the third control instruction. The first rotating speed is a pre-set rotating speed, which is related to the target temperature difference required by the temperature cycle test. The greater the target temperature difference, the faster the first rotating speed, and the lower the temperature of the memory module after reaching the temperature stable state in the idle state. The smaller the target temperature difference, the slower the first rotating speed, and the higher the temperature of the memory module after reaching the temperature stable state in the idle state. The heat dissipation state of the heat dissipation fan includes high-speed running state, medium-speed running state, low-speed running state, etc., which are not limited by the embodiments of the present application. After the heat dissipation fan adjusts its running state according to the third control instruction, the temperature of the memory module after reaching the temperature stable state in the idle state is less than the first temperature.

[0071] There are various manners for the control device to send the third control instruction to the heat dissipation device. In some embodiments, the control device sends the third control instruction to the heat dissipation device at a preset time. For example, the control device sends the third control instruction to the heat dissipation device at the same time when the control device sends the first control instruction to the memory module, so that the heat dissipation device enhances the heat dissipation function immediately after the memory module operates in the idle state, accelerates the cooling speed of the memory module, and improves the efficiency of the test. For another example, the control device sends the third control instruction to the heat dissipation device after the time length of sending the first control instruction to the memory module reaches the first sending time length. The heat dissipation function is enhanced after the memory module operates in the idle state for a period of time, which can reduce the energy consumed in the test, reduce the cost of the test, and at the same time, make the temperature difference of the memory module in the temperature cycle test process larger, and improve the effectiveness of the test. For yet another example, in the case that the control device obtains the temperature of the memory module through the temperature measuring device, the control device sends the third control instruction to the heat dissipation device when the temperature of the memory module is greater than or equal to the third temperature after the control device sends the first control instruction to the memory module, so that the heat dissipation device performs heat dissipation on the memory module when the temperature of the memory module is relatively high, and accelerates the cooling of the memory module, and stops performing heat dissipation on the memory module when the temperature of the memory module is relatively low, which improves the efficiency of the temperature cycle test while reducing the energy consumed in the test. The above processes can make the temperature of the memory module after reaching the temperature stable state lower, and improve the effectiveness of the test.

[0072] In some embodiments, in the case that the control device obtains the temperature of the memory module through the temperature measuring device, if the time length of the memory module operating in the idle state reaches the third operating time length and the temperature of the memory module is greater than or equal to the fifth temperature, the control device sends the third control instruction to the heat dissipation device, so that the heat dissipation device drives the memory module to reach the required temperature for the test when the memory module cannot reach the required temperature for the test through self-cooling. If the temperature of the memory module when the time length of the memory module operating in the idle state reaches the third operating time length is less than the fifth temperature, it indicates that the memory module can reach the required temperature for the test through self-cooling, and the control device no longer sends the third control instruction to the heat dissipation device, so as to reduce the energy consumed in the test.

[0073] The above process is one possible implementation manner for the control device to send the third control instruction to the heat dissipation device when the memory module operates in the idle state, and the third control instruction is used to control the heat dissipation device to make the temperature of the memory module after reaching the temperature stable state in the idle state less than the first temperature. In some embodiments, the control device can also send the third control instruction to the heat dissipation device first, and then send the first control instruction to the memory module, which is not limited in the embodiments of the present application.

[0074] 206、The heat dissipation device operates in the operating state indicated by the third control instruction according to the third control instruction.

[0075] In some embodiments, the heat dissipation device receives a third control instruction, and adjusts the heat dissipation function of the heat dissipation device according to the third control instruction, so as to enhance the heat dissipation function of the heat dissipation device, thereby adjusting the temperature of the memory module to reduce the temperature of the memory module. Taking the heat dissipation device as a heat dissipation fan, the third control instruction carries a first rotating speed, the heat dissipation fan receives the third control instruction, and operates at the first rotating speed indicated by the third control instruction according to the third control instruction, so as to enhance the heat dissipation function of the heat dissipation fan, thereby reducing the temperature of the memory module.

[0076] It should be noted that the above steps 205 to 206 are optional steps. Through the above steps 205 to 206, the temperature of the memory module when the memory module is running in the idle state and reaches the temperature stable state can be lower than the first temperature, so that the temperature difference that the memory module can reach during the temperature cycle test is larger. Through the test with a larger temperature difference, the problems existing in the memory module or the single board where the memory module is located can be effectively stimulated, thereby improving the effectiveness of the test. The problems existing in the single board include but are not limited to material matching defects of the single board. Through the above steps 205 to 206, the cooling speed of the memory module can also be improved, thereby improving the efficiency of the test. In some embodiments, the temperature cycle test system does not cool the memory module through the heat dissipation device, and can still perform the temperature cycle test, which can improve the simplicity of the test to a certain extent and reduce the energy consumption of the test.

[0077] 207、If the control device determines that the memory module reaches the temperature stable state in the idle state based on the temperature sent by the temperature measuring device, the control device sends a second control instruction to the memory module, and the second control instruction is used to control the memory module to run in an accelerated refresh state.

[0078] The second control instruction is used to control the memory module to run in an accelerated refresh state, and in the accelerated refresh state, the temperature of the memory module can reach the highest temperature that can be reached by self-heating. Correspondingly, the second control instruction carries the refresh period and the refresh time length of the memory module. The accelerated refresh state of the memory module means that the refresh period of the memory module is equal to the refresh time length of the memory module during the refresh of the memory module, that is, the memory module continuously refreshes. As shown in the figure, tREFI represents the refresh period of the memory module, and tRFC represents the refresh time length of the memory module. If tRFC = 350 ns, by configuring tREFI as 350 ns, tREFI = tRFC can be achieved, so that the memory module continuously refreshes, thereby increasing the refresh frequency of the memory module. By using the high parallel operation of 16 banks during refresh, the refresh of multiple rows can be simultaneously stimulated, thereby increasing the access frequency of the rows in the memory module per unit time, increasing the access pressure of the memory module, and further increasing the temperature of the memory module. Figure 3 As shown in the figure, tREFI represents the refresh period of the memory module, and tRFC represents the refresh time length of the memory module. If tRFC = 350 ns, by configuring tREFI as 350 ns, tREFI = tRFC can be achieved, so that the memory module continuously refreshes, thereby increasing the refresh frequency of the memory module. By using the high parallel operation of 16 banks during refresh, the refresh of multiple rows can be simultaneously stimulated, thereby increasing the access frequency of the rows in the memory module per unit time, increasing the access pressure of the memory module, and further increasing the temperature of the memory module.

[0079] The control device determines whether the memory module reaches the temperature stable state in the idle state according to the temperature sent by the temperature measuring device. In some embodiments, the control device obtains the highest temperature and the lowest temperature of the memory module in a first preset time period according to the temperature of the memory module sent by the temperature measuring device in the first preset time period every time, and calculates the difference between the highest temperature and the lowest temperature. If the difference is less than a first temperature threshold, it indicates that the memory module reaches the temperature stable state in the idle state, and the control device sends a second control instruction to the memory module to switch the memory module to the accelerated refresh state. In some embodiments, if the difference is greater than or equal to the first temperature threshold, the control device does not send the second control instruction to the memory module.

[0080] In other embodiments, the control device obtains a first preset number of temperatures sent by the temperature measuring device, and obtains the absolute value of the difference between the first preset position temperature and each other temperature in the first preset number of temperatures. If the absolute value is less than a first temperature threshold, it indicates that the memory module reaches the temperature stable state in the idle state, and the control device sends a second control instruction to the memory module to switch the memory module to the accelerated refresh state. In some embodiments, if there is an absolute value greater than or equal to the first temperature threshold, the control device does not send the second control instruction to the memory module. The first preset number of temperatures are obtained continuously, and the time consumed for obtaining the first preset number of temperatures is sufficient to determine whether the memory module reaches the temperature stable state.

[0081] The process of the control device sending the second control instruction to the memory module is the same as the process of the control device sending the first control instruction to the memory module, and the embodiments of the present application will not be repeated here.

[0082] The above process is a possible implementation of the control device sending a second control instruction to the memory module when the memory module reaches the temperature stable state in the idle state based on the temperature of the memory module detected by the temperature measuring device. The possible implementation is described by taking an electronic device as an example, and in some embodiments, the electronic device is an HBM electronic device, and the embodiments of the present application are not limited to this. Correspondingly, the second control instruction sent by the control device to the electronic device is related to the electronic device indicated by the identifier. If the temperature of the electronic device indicated by the identifier can reach the highest temperature that can be reached by self-heating when the electronic device is running at full load, the second control instruction is used to control the electronic device to run at full load. For example, the electronic device is an HBM, and the second control instruction is used to control the HBM to run at full bandwidth.

[0083] 208、the memory module runs in the accelerated refresh state according to the second control instruction to increase the temperature of the memory module, and the temperature of the memory module when the memory module reaches the temperature stable state in the accelerated refresh state is the second temperature; and the defects of the memory module can be tested in the process that the temperature of the memory module changes between the first temperature and the second temperature.

[0084] In the embodiment of the application, the temperature of the memory module when the memory module reaches the temperature stable state in the accelerated refresh state is referred to as the second temperature.

[0085] The process is the same as the process that the memory module runs in the idle state according to the first control instruction, and the embodiment of the application will not be described here. It should be noted that in the process that the memory module runs in the accelerated refresh state according to the second control instruction, the memory module refreshes according to the refresh time length and the refresh period carried in the second control instruction.

[0086] The steps 202 to 208 are a possible implementation that the control device sends the first control instruction and the second control instruction to the memory module respectively to make the memory module run in the idle state and the accelerated refresh state respectively in response to the temperature cycle test start instruction. The possible implementation makes the memory module switch between different working states through different control instructions, so that the memory module generates heat and cools down by itself. Through the self-heating and self-cooling of the memory module, the temperature cycle test can be performed without using a temperature cycle test box, which improves the test efficiency and reduces the test cost. In addition, the above process is described by taking the control device sending the first control instruction to the memory module as an example of the test starting point. In some embodiments, the control device can first send the second control instruction and then send the first control instruction, or the control device sends a state query instruction to the memory module, and the memory module returns the working state of the memory module to the control device according to the state query instruction. If the working state of the memory module is the idle state, the control device sends the second control instruction to the memory module, and if the working state of the memory module is other working state than the idle state, the control device sends the first control instruction to the memory module, so as to determine the test starting point according to the current working state of the memory module, avoid sending redundant control instructions, and improve the test efficiency. The sending order of different control instructions is not limited in the embodiment of the application.

[0087] 209、the control device sends a fourth control instruction to the heat dissipation device when the memory module runs in the accelerated refresh state, and the fourth control instruction is used to control the heat dissipation device to make the temperature of the memory module after reaching the temperature stable state in the accelerated refresh state greater than the second temperature.

[0088] The fourth control instruction is related to the heat dissipation device. In some embodiments, the fourth control instruction carries a second rotating speed of the heat dissipation fan, and is used to control the heat dissipation fan to run at the second rotating speed, which is slower than the first rotating speed. Alternatively, the fourth control instruction carries a deceleration step, and is used to control the heat dissipation fan to decelerate according to the deceleration step. Alternatively, the fourth control instruction carries a second heat dissipation state, and is used to control the heat dissipation fan to run at the second heat dissipation state. The embodiments of the present application do not limit the way of controlling the heat dissipation capability of the heat dissipation device through the fourth control instruction. The second rotating speed is a pre-set rotating speed, and is related to a target temperature difference required by the temperature cycle test. The greater the target temperature difference, the slower the second rotating speed, and the higher the temperature of the memory module after reaching the temperature stable state in the accelerated refresh state. The smaller the target temperature difference, the faster the second rotating speed, and the lower the temperature of the memory module after reaching the temperature stable state in the accelerated refresh state. After the heat dissipation fan adjusts its running state according to the fourth control instruction, the temperature of the memory module after reaching the temperature stable state in the accelerated refresh state is greater than the second temperature.

[0089] There are various ways for the control device to send the fourth control instruction to the heat dissipation device. In some embodiments, the control device sends the fourth control instruction to the heat dissipation device at a pre-set time. For example, the control device sends the fourth control instruction to the heat dissipation device at the same time when the second control instruction is sent to the memory module, so that the heat dissipation device immediately weakens the heat dissipation function after the memory module runs in the accelerated refresh state, accelerates the temperature rising speed of the memory module, improves the test efficiency, reduces the energy consumption of the test, and at the same time, makes the temperature of the memory module after reaching the temperature stable state higher, and improves the effectiveness of the test.

[0090] In some embodiments, when the control device obtains the temperature of the memory module through the temperature measuring device, if the running time of the memory module in the accelerated refresh state reaches the fourth running time and the temperature of the memory module is less than the sixth temperature, the control device sends the fourth control instruction to the heat dissipation device, so that the memory module reaches the required test temperature through the heat dissipation device when the memory module cannot reach the required test temperature through self-heating. If the temperature of the memory module when the running time of the memory module in the accelerated refresh state reaches the fourth running time is greater than or equal to the sixth temperature, it indicates that the memory module can reach the required test temperature through self-heating, and the control device no longer sends the fourth control instruction to the heat dissipation device.

[0091] The above process is a possible implementation of the control device sending a fourth control instruction to the heat dissipation device in the case that the memory module operates in the accelerated refresh state, and the fourth control instruction is used to control the heat dissipation device to make the temperature of the memory module in the accelerated refresh state greater than the second temperature after the memory module reaches the temperature stable state. In some embodiments, the control device can also send the fourth control instruction to the heat dissipation device first, and then send the second control instruction to the memory module, which is not limited in the embodiments of the present application.

[0092] 210. The heat dissipation device operates according to the fourth control instruction.

[0093] In some embodiments, the heat dissipation device receives the fourth control instruction, and adjusts the heat dissipation function of the heat dissipation device according to the fourth control instruction, so as to weaken the heat dissipation function of the heat dissipation device, thereby adjusting the temperature of the memory module to make the temperature of the memory module rise. Taking the heat dissipation device as a heat dissipation fan, for example, the fourth control instruction carries the second rotating speed, and the heat dissipation fan receives the fourth control instruction, and operates according to the second rotating speed indicated by the fourth control instruction, so as to weaken the heat dissipation function of the heat dissipation fan, thereby making the temperature of the memory module rise.

[0094] It should be noted that the above steps 209 to 210 are optional steps. Through the above steps 209 to 210, the temperature of the memory module when operating in the accelerated refresh state and reaching the temperature stable state can be higher than the second temperature, so that the temperature difference that the memory module can reach in the temperature cycle test is greater. Through the test with a greater temperature difference, the problems existing in the memory module or the single board where the memory module is located can be effectively triggered, thereby improving the effectiveness of the test. Through the above steps 209 to 210, the temperature rising speed of the memory module can also be improved, thereby improving the efficiency of the test. In some embodiments, the temperature cycle test system does not heat the memory module through the heat dissipation device, and can still perform the temperature cycle test, which can improve the simplicity of the test to a certain extent.

[0095] 211. If the control device determines that the memory module reaches the temperature stable state in the accelerated refresh state based on the temperature of the memory module sent by the temperature measuring device, the test completion information is output, and the test completion information indicates that the memory module completes the test.

[0096] The control device determines whether the memory module reaches the temperature stable state in the accelerated refresh state according to the temperature sent by the temperature measuring device. In some embodiments, the control device obtains the highest temperature and the lowest temperature of the memory module in a second preset time period according to the temperature of the memory module sent by the temperature measuring device in the second preset time period every second preset time period, and calculates the difference between the highest temperature and the lowest temperature. If the difference is less than a second temperature threshold, it indicates that the memory module reaches the temperature stable state in the accelerated refresh state, and the control device outputs the test completion information. In some embodiments, if the difference is greater than or equal to the second temperature threshold, the control device does not output the test completion information.

[0097] In some other embodiments, the control device obtains a second preset number of temperatures sent by the temperature measuring device, obtains the absolute value of the difference between the first preset number of temperatures and each other temperature, and if the absolute value is less than a second temperature threshold, it indicates that the memory module reaches the temperature stable state in the idle state, and the control device outputs the test completion information. In some embodiments, if there is an absolute value greater than or equal to the second temperature threshold, the control device does not output the test completion information. The second preset number of temperatures are obtained continuously, and the time consumed in obtaining the second preset number of temperatures is sufficient to determine whether the memory module reaches the temperature stable state.

[0098] The above process is described by taking the control device outputting the test completion information in one round of alternation as an example. In some embodiments, the temperature cyclic test process of the memory module includes multiple rounds of alternation. In addition to the last round of alternation, in the remaining alternation process, the control device sends a first control instruction to the memory module to perform the next round of alternation when the memory module reaches the temperature stable state in the second working state based on the temperature of the memory module detected by the temperature measuring device.

[0099] The method for the charged temperature cycle test of the electronic device provided in the embodiments of the present application can control the memory module to switch between different working states by sending different control instructions to the memory module after receiving a temperature cycle test starting instruction. Since the memory module can generate heat and cool down by itself when switching between different working states, the electronic device may be exposed to defects, therefore, the method provided in the embodiments of the present application can perform the temperature cycle test without using a temperature cycle test box, thereby reducing the space occupied by the test, and there is no need to build a test environment in the temperature cycle test box, and the test is performed by the self-heating and self-cooling of the memory module, and there is no need to keep the memory module at the test temperature for a long time, thereby reducing the power consumption of the test. In summary, the method provided in the embodiments of the present application reduces the difficulty and cost of the test, and improves the efficiency of the test. In summary, the method provided in the embodiments of the present application reduces the difficulty and cost of the test, and improves the efficiency of the test. In addition, the above process is described by taking the memory module as an example, and the single board assembled with the memory module is placed in a room temperature environment, and the above temperature cycle test method is run after power-on, so that the memory module is in the idle state and the accelerated refresh state for a period of time, so that the memory module reaches a temperature stable state in the idle state and the accelerated refresh state, respectively, thereby utilizing the self-heating and self-cooling of the memory module to achieve a large enough temperature difference and a short temperature cycle period in the test process. The self-heating and self-cooling of the memory module are used to replace the temperature cycle test box to perform the charged temperature cycle test, which can screen the process defects of the DRAM SWD (sub-word line driver) and the key transistors of the array, and screen the chips with abnormal semiconductor temperature drift, and also screen the stress mismatch and mechanical damage caused by the slicing, packaging or assembling process. If the above electronic device is an HBM, since the HBM structure is complex and the HBM is combined with the chip-on-wafer-on-substrate (CoWoS) on the main chip substrate, the mechanical stress is large, and the HBM is tested by the method for the charged temperature cycle test of the electronic device provided in the embodiments of the present application, which can more effectively stimulate the problems existing in the HBM or the single board where the HBM is located.

[0100] In the full-load condition of the server, the memory module is tested by using the above-mentioned temperature cycling test method of the electronic device. When the temperature cycling test method provided in the embodiment of the present application is tested, the temperature of the memory module is about 40℃ in the idle state of the server under the condition of room temperature. By adjusting the rotating speed of the cooling fan, the temperature of the memory module can be as low as 30℃. In the accelerated refresh state of the server under the condition of room temperature, the temperature of the memory module is about 80℃. By adjusting the rotating speed of the cooling fan, the temperature of the memory module can be as high as 90℃. In the above process, it takes 12 minutes for the server to switch from the idle state to the accelerated refresh state to reach the temperature stable state. It takes 12 minutes for the server to switch from the accelerated refresh state to the idle state to reach the temperature stable state.

[0101] The above experimental data show that the temperature difference that can be reached by the electronic device through self-heating and self-cooling is 40℃ to 50℃ when the electronic device is tested by using the temperature cycling test method of the electronic device provided in the embodiment of the present application. Since the method provided in the embodiment of the present application adjusts the temperature of the electronic device through self-heating and self-cooling of the electronic device, it is not necessary to have an additional holding time to ensure the thermal balance of the single board, so that the electronic device can fully reach the test temperature. The period of one temperature cycle of the method provided in the embodiment of the present application is 24 minutes, which is 11.25 times higher than 270 minutes required for one temperature cycle of 0℃ to 50℃ using a temperature cycling oven. In addition, the method provided in the embodiment of the present application does not require additional costs of the temperature cycling oven, site and power consumption, thereby reducing the test cost.

[0102] The above Figure 2 The temperature cycling test method of the electronic device shown in the above Figure 4 As shown in the above, the electronic device is continuously and cyclically operated in the first working state and the second working state. When the number of alternations reaches the preset number of alternations, or the test duration reaches the preset test duration, the alternation is stopped, and the control device outputs the above-mentioned test completion information.

[0103] The above introduces the method of the embodiment of the present application, and the device of the embodiment of the present application is introduced below. It should be understood that the device introduced below has any function of the computing device in the above-mentioned method. The above is combined with the above-mentioned method. Figures 2 to 4The method for testing the charging temperature cycle of the electronic device provided by the embodiments of the present application is described in detail. Based on the same inventive concept, the following device embodiments will be described in combination with Figure 5 The control device provided by the embodiments of the present application is described. It should be understood that the technical features described in the method embodiments are also applicable to the following device embodiments.

[0104] Referring to Figure 5 The control device provided by the embodiments of the present application is described. It should be understood that the technical features described in the method embodiments are also applicable to the following device embodiments.

[0105] The receiving module 501 is configured to receive a temperature cycle test start instruction.

[0106] The first control module 502 is configured to, in response to the temperature cycle test start instruction, send a first control instruction and a second control instruction to the electronic device respectively, so that the electronic device operates in a first working state and a second working state respectively. The first control instruction is used to control the electronic device to operate in the first working state, and the second control instruction is used to control the electronic device to operate in the second working state. The temperature of the electronic device when reaching a temperature stable state in the first working state is a first temperature, and the temperature of the electronic device when reaching the temperature stable state in the second working state is a second temperature. In the process that the temperature of the electronic device changes between the first temperature and the second temperature, defects existing in the electronic device can be tested.

[0107] The temperature stable state refers to that the temperature change range of the electronic device is within a preset range.

[0108] In some embodiments, the first control module 502 described above includes:

[0109] The control unit is configured to, in response to the temperature cycle test start instruction, alternately send the first control instruction and the second control instruction to the electronic device, so that the electronic device alternately operates in the first working state and the second working state.

[0110] In some embodiments, the control unit described above is configured to:

[0111] In response to the temperature cycle test start instruction, the first control instruction is sent to the electronic device.

[0112] Based on the temperature of the electronic device, when the electronic device reaches the temperature stable state in the first working state, the second control instruction is sent to the electronic device.

[0113] Based on the temperature of the electronic device, when the electronic device reaches the temperature stable state in the second working state, the first control instruction is sent to the electronic device.

[0114] In some embodiments, the control device described above further includes a second control module configured to perform at least one of the following:

[0115] In a case where the electronic device operates in the first working state, a third control instruction is sent to the heat dissipation device, and the third control instruction is used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stable state in the first working state less than the first temperature.

[0116] In a case where the electronic device operates in the second working state, a fourth control instruction is sent to the heat dissipation device, and the fourth control instruction is used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stable state in the second working state greater than the second temperature.

[0117] In some embodiments, the first control instruction is used to control the electronic device to operate in an idle state, and the second control instruction is used to control the electronic device to operate in a full load state.

[0118] In some embodiments, the first control instruction is used to control the electronic device to operate in an idle state, and the second control instruction is used to control the electronic device to continuously refresh.

[0119] It should be understood that each module in the control device and the above-mentioned other operations and / or functions are respectively used to implement various steps and methods implemented by the control device in the method embodiments, and specific details can be referred to the above-mentioned method embodiments, which will not be described here for brevity.

[0120] Figure 6 is a structural schematic diagram of a computing device provided by an embodiment of the present application. It should be understood that the computing device introduced below can implement any function in any of the following methods. Generally, the computing device 600 comprises a processor 601 and a memory 602.

[0121] The processor 601 can include one or more processing cores, such as a 4-core processor, an 8-core processor, and the like. The processor 601 can be implemented in at least one of a hardware form of a digital signal processing (DSP), a field-programmable gate array (FPGA), a programmable logic array (PLA). The processor 601 can also include a main processor and a coprocessor. The main processor is a processor for processing data in an awake state, also known as a central processing unit (CPU). The coprocessor is a low-power processor for processing data in a standby state. In some embodiments, the processor 601 can be integrated with a graphics processor (GPU) that is responsible for rendering and drawing content required to be displayed by the display screen. In some embodiments, the processor 601 can further include an artificial intelligence (AI) processor for processing computing operations related to machine learning.

[0122] The memory 602 can include one or more computer-readable storage media that can be non-transitory. The memory 602 can also include a high-speed random access memory, and a nonvolatile memory such as one or more disk storage devices, flash storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory 602 is used to store at least one program for being executed by the processor 601 to implement the charged temperature cycle test method of the electronic device provided by the method embodiments in the present application.

[0123] In some embodiments, the computing device 600 can also optionally include a peripheral device interface 603 and at least one peripheral device. The processor 601, the memory 602, and the peripheral device interface 603 can be connected through a bus or a signal line. Each peripheral device can be connected to the peripheral device interface 603 through a bus, a signal line, or a circuit board.

[0124] In the embodiments of the present application, the computing device 600 can be configured as a terminal or a server, and the terminal or the server is taken as an execution body to implement the technical solutions provided by the embodiments of the present application.

[0125] In some embodiments, computing device 600 may be a portable mobile terminal, such as a smartphone, tablet computer, Moving Picture Experts Group Audio Layer III (MP3) player, Moving Picture Experts Group Audio Layer IV (MP4) player, laptop computer, or desktop computer. Computing device 600 may also be referred to as user equipment, portable terminal, laptop terminal, desktop terminal, or other names.

[0126] In some embodiments, the computing device 600 may be a stand-alone physical server, or, implemented as such Figure 7 The computing device cluster shown refers to a server cluster composed of multiple physical servers or a distributed file system, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDNs), and big data and artificial intelligence platforms. Taking computing devices as cloud servers as an example, computing devices can also be called a cloud platform (short for cloud computing platform), which refers to services based on hardware and software resources that provide computing, network, and storage capabilities. Through the network "cloud," massive amounts of data are processed and analyzed remotely before being returned to the user, featuring large scale, distributed nature, virtualization, high availability, scalability, on-demand service, and security. Cloud platforms can achieve rapid deployment and release of configurable computing resources with relatively low management costs or low interaction complexity between users and service providers.

[0127] In an exemplary embodiment, a computer-readable storage medium is also provided, such as a memory including program code that can be executed by a processor in a computing device to perform the electrically charged temperature cycling test method for the electronic device in the above embodiments. For example, the computer-readable storage medium is a non-transitory computer-readable storage medium, such as a read-only memory (ROM), random access memory (RAM), compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device.

[0128] The embodiment of the present application further provides a computer program product or a computer program, the computer program product or the computer program comprising program codes, the computer instructions being stored in a computer readable storage medium, the processor in the computing device reading the program codes from the computer readable storage medium, and the processor executing the program codes to enable the computing device to execute the above-mentioned charged temperature cycle test method of the electronic device.

[0129] In addition, the embodiment of the present application further provides a device, which can be a chip, a component or a module. The device can comprise a processor and a memory connected to each other. The memory is used to store computer execution instructions. When the device is running, the processor can execute the computer execution instructions stored in the memory to enable the chip to execute the charged temperature cycle test method of the electronic device in the above-mentioned method embodiments.

[0130] The device, the apparatus, the computer readable storage medium, the computer program product or the chip provided by the embodiment can be used to execute the corresponding method provided above, and thus the beneficial effects thereof can refer to the beneficial effects of the corresponding method provided above, which will not be described herein again.

[0131] From the above description of the embodiments, those skilled in the art can understand that, for the convenience and brevity of description, only the division of the above functional modules is taken as an example for illustration. In actual application, the above functions can be completed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the charged temperature cycle test method of the electronic device provided in the above-mentioned embodiments belongs to the same concept, and the specific implementation process is described in the method embodiments, which will not be described herein again.

[0132] In the several embodiments provided by the present application, it should be understood that the disclosed device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. The division of the modules or units is only a logical function division, and there can be another division way in actual implementation. For example, a plurality of units or components can be combined or integrated into another device, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0133] The units described as separate components can or can not be physically separate, and the components shown as units can be one physical unit or multiple physical units, that is, can be located in one place, or can be distributed in multiple different places. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0134] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0135] When the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application essentially or the parts that make contributions to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The software product is stored in a storage medium, and includes a number of instructions for causing an apparatus (which can be a single-chip microcomputer, a chip, etc.) or a processor to perform all or part of the steps of the methods described in the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk, and various media that can store program codes.

[0136] In the description of the present application, unless otherwise specified, " / " means "or", for example, A / B can mean A or B. "And / or" in this document is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can mean that A exists alone, A and B exist together, and B exists alone. In addition, "at least one" means one or more, and "multiple" means two or more. "First", "second", etc. do not limit the quantity and execution order, and "first", "second", etc. do not necessarily mean different.

[0137] In the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or advantageous than other embodiments or design solutions. Rather, the use of "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0138] It should be noted that the information (including but not limited to user device information, user personal information, etc.), data (including but not limited to data for analysis, stored data, displayed data, etc.) and signals involved in the present application are all authorized by the user or fully authorized by all parties, and the collection, use and processing of related data need to comply with relevant laws, regulations and standards of relevant countries and regions. For example, the sensitive words involved in the present application are obtained under sufficient authorization.

[0139] All the optional technical solutions above can be combined to form optional embodiments of the present disclosure, and will not be repeated here.

[0140] The above is only optional embodiments of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for conducting charged temperature cycling tests on electronic devices, characterized in that, The method includes: Receive the temperature cycling test start command; In response to the temperature cycle test start command, a first control command and a second control command are sent to the electronic device, causing the electronic device to operate in a first working state and a second working state, respectively. Wherein, the first control command is used to control the electronic device to operate in the first working state, the second control command is used to control the electronic device to operate in the second working state, the temperature at which the electronic device reaches a temperature stable state in the first working state is the first temperature, the temperature at which the electronic device reaches a temperature stable state in the second working state is the second temperature, and the defects existing in the electronic device can be tested during the process of the temperature of the electronic device changing between the first temperature and the second temperature. The temperature stability state refers to the temperature variation range of the electronic device being within a preset range.

2. The method according to claim 1, characterized in that, The step of sending a first control command and a second control command to the electronic device in response to the temperature cycling test start command includes: In response to the temperature cycle test start command, the first control command and the second control command are alternately sent to the electronic device, causing the electronic device to alternately operate in the first operating state and the second operating state.

3. The method according to claim 2, characterized in that, The step of alternately sending the first control command and the second control command to the electronic device in response to the temperature cycle test start command includes: In response to the temperature cycle test start command, the first control command is sent to the electronic device; Based on the temperature of the electronic device, when the electronic device reaches a temperature stable state in the first working state, the second control command is sent to the electronic device. Based on the temperature of the electronic device, when the electronic device reaches a temperature stable state in the second operating state, the first control command is sent to the electronic device.

4. The method according to any one of claims 1 to 3, characterized in that, The method further includes at least one of the following: When the electronic device is operating in the first working state, a third control command is sent to the heat dissipation device. The third control command is used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stabilization state in the first working state lower than the first temperature. When the electronic device is in the second operating state, a fourth control command is sent to the heat dissipation device. The fourth control command is used to control the heat dissipation device to make the temperature of the electronic device after reaching a stable temperature state in the second operating state greater than the second temperature.

5. The method according to any one of claims 1 to 4, characterized in that, The first control command is used to control the electronic device to operate in an idle state, and the second control command is used to control the electronic device to operate at full load.

6. The method according to any one of claims 1 to 4, characterized in that, The first control command is used to control the electronic device to operate in an idle state, and the second control command is used to control the electronic device to continuously refresh.

7. A control device, characterized in that, The control device includes: The receiving module is used to receive the temperature cycling test start command; A first control module is configured to respond to the temperature cycle test start command by sending a first control command and a second control command to the electronic device, causing the electronic device to operate in a first working state and a second working state, respectively. The first control command is used to control the electronic device to operate in the first working state, and the second control command is used to control the electronic device to operate in the second working state. The temperature at which the electronic device reaches a temperature stabilization state in the first working state is defined as the first temperature, and the temperature at which the electronic device reaches a temperature stabilization state in the second working state is defined as the second temperature. During the process of the electronic device's temperature changing between the first temperature and the second temperature, defects existing in the electronic device can be detected. The phrase "achieving a stable temperature state" refers to the electronic device's temperature variation being within a preset range.

8. The control device according to claim 7, characterized in that, The first control module includes: The control unit is configured to, in response to the temperature cycle test start command, alternately send the first control command and the second control command to the electronic device, causing the electronic device to alternately operate in the first operating state and the second operating state.

9. The control device according to claim 8, characterized in that, The control unit is used for: In response to the temperature cycle test start command, the first control command is sent to the electronic device; Based on the temperature of the electronic device, when the electronic device reaches a temperature stable state in the first working state, the second control command is sent to the electronic device. Based on the temperature of the electronic device, when the electronic device reaches a temperature stable state in the second operating state, the first control command is sent to the electronic device.

10. The control device according to any one of claims 7 to 9, characterized in that, The control device further includes a second control module for at least one of the following: When the electronic device is operating in the first working state, a third control command is sent to the heat dissipation device. The third control command is used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stabilization state in the first working state lower than the first temperature. When the electronic device is in the second operating state, a fourth control command is sent to the heat dissipation device. The fourth control command is used to control the heat dissipation device to make the temperature of the electronic device after reaching a stable temperature state in the second operating state greater than the second temperature.

11. The control device according to any one of claims 7 to 10, characterized in that, The first control command is used to control the electronic device to operate in an idle state, and the second control command is used to control the electronic device to operate at full load.

12. The control device according to any one of claims 7 to 10, characterized in that, The first control command is used to control the electronic device to operate in an idle state, and the second control command is used to control the electronic device to continuously refresh.

13. A charged temperature cycling test system for electronic devices, characterized in that, The system includes a control device for: Receive the temperature cycling test start command; In response to the temperature cycle test start command, a first control command and a second control command are sent to the electronic device, causing the electronic device to operate in a first working state and a second working state, respectively. The first control command is used to control the electronic device to operate in the first working state, and the second control command is used to control the electronic device to operate in the second working state. The temperature at which the electronic device reaches a temperature stabilization state in the first working state is the first temperature, and the temperature at which the electronic device reaches a temperature stabilization state in the second working state is the second temperature. During the process of the temperature of the electronic device changing between the first temperature and the second temperature, defects existing in the electronic device can be detected. The phrase "achieving a stable temperature state" refers to the electronic device's temperature variation being within a preset range.

14. The system according to claim 13, characterized in that, The control device is used for: In response to the temperature cycle test start command, the first control command and the second control command are alternately sent to the electronic device, causing the electronic device to alternately operate in the first operating state and the second operating state.

15. The system according to claim 13, characterized in that, The system also includes a temperature measuring device; The control device is used for: In response to the temperature cycle test start command, the first control command is sent to the electronic device; Based on the temperature of the electronic device detected by the temperature measuring device, when the electronic device reaches a stable temperature state in the first working state, the second control command is sent to the electronic device; Based on the temperature of the electronic device detected by the temperature measuring device, when the electronic device reaches a stable temperature state in the second operating state, the first control command is sent to the electronic device.

16. The system according to any one of claims 13 to 15, characterized in that, The system also includes a heat dissipation device; The control device is also used for at least one of the following: When the electronic device is operating in the first working state, a third control command is sent to the heat dissipation device. The third control command is used to control the heat dissipation device to make the temperature of the electronic device after reaching a temperature stabilization state in the first working state lower than the first temperature. When the electronic device is in the second operating state, a fourth control command is sent to the heat dissipation device. The fourth control command is used to control the heat dissipation device to make the temperature of the electronic device after reaching a stable temperature state in the second operating state greater than the second temperature.

17. The system according to any one of claims 13 to 16, characterized in that, The first control command is used to control the electronic device to operate in an idle state, and the second control command is used to control the electronic device to operate at full load.

18. The system according to any one of claims 13 to 16, characterized in that, The first control command is used to control the electronic device to operate in an idle state, and the second control command is used to control the electronic device to continuously refresh.

19. A computer program product containing instructions, characterized in that, When the instruction is executed by the control device, the control device performs the charged temperature cycling test method for the electronic device as described in any one of claims 1 to 6.

20. A computer-readable storage medium, characterized in that, It includes computer program instructions, which, when executed by a control device, perform a method for testing the charged temperature cycle of an electronic device as described in any one of claims 1 to 6.

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