Optical device, lens module and electronic equipment

Abstract

The invention provides an optical device, a lens module and electronic equipment, the optical device comprises two conductive layers and a functional layer located between the two conductive layers, the thickness of at least one of the two conductive layers is not uniform, and the light transmittance of the functional layer can change along with the change of an electric field loaded on the functional layer. Different voltages or currents are loaded to different areas of the conducting layers through the multiple electrodes, the intensities of electric fields formed at different positions between the two conducting layers are different, and therefore the light transmittance at different positions on the functional layer is different. The non-uniform conductive layer is beneficial for increasing the difference of light transmittance at different positions on the functional layer, and the adjustment range of the optical device on imaging light in a shooting scene is expanded. According to the optical device, the lens module and the electronic equipment provided by the invention, the light transmittance of each position of the device can be adjusted according to the global or local light incoming amount of the shot picture, and the optical device, the lens module and the electronic equipment are widely applicable to various scenes, such as high-light-ratio scenes such as backlight portraits.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of terminal device hardware, in particular to an optical device, a lens module and an electronic device. BACKGROUND

[0002] In a shooting scene, light is an important factor affecting the quality of a photo or a video taken by an electronic device. In a strong light scene, the color in the shooting picture is bright and the contrast is high, but it is easy to cause high light overflow or loss of details in the shadow part; in a weak light scene, a longer exposure time may be needed in the shooting process, which may also introduce noise or limit the dynamic range.

[0003] How to improve the shooting capability of an electronic device such as a mobile phone or a tablet computer in different shooting scenes and improve the quality of a photo or a video taken by the device is a problem worth considering. SUMMARY

[0004] The present application provides an optical device, which includes a conductive layer with uneven thickness and a functional layer capable of adjusting light transmittance, the optical device has a large adjustment range for imaging light and strong adjustment capability, and a lens module including the optical device has high quality for a photo or a video taken in different scenes.

[0005] In a first aspect, an optical device is provided, including: a first conductive layer, a functional layer and a second conductive layer, the functional layer is located between the first conductive layer and the second conductive layer, the first conductive layer and the second conductive layer are respectively used to be electrically connected to different electrodes to form an electric field in the functional layer, the functional layer is configured to have light transmittance capable of changing in response to a change in the electric field; the thickness of a first part of the first conductive layer is different from the thickness of a second part of the first conductive layer.

[0006] In a possible implementation, the second conductive layer and the first conductive layer are both conductive layers with uneven thickness.

[0007] In a possible implementation, the functional layer includes one or more of the following materials: an electrochromic material, a liquid crystal material or a dye crystal.

[0008] In some scenarios, the above scheme can also be understood as: the first conductive layer includes a first conductive part and a second conductive part, which can be understood as two parts with different thicknesses on the first conductive layer.

[0009] In the technical solution, the thickness of the first conductive layer of the optical device is uneven, and in the case of energizing the first conductive layer, the distribution of voltage or current in the first conductive layer changes with the thickness at different positions, so that the voltage difference between different positions of the first conductive layer and the second conductive layer also changes, and the electric field intensity between the two conductive layers also changes accordingly. The implementation of the technical solution is conducive to realizing different voltage distributions on the conductive layer, different electric field intensity distributions between the two conductive layers, and different light transmittance distributions on the functional layer.

[0010] In combination with the first aspect, in some implementations of the first aspect, the first conductive layer includes a first surface and a second surface oppositely arranged along the thickness direction, and the first surface and / or the second surface is a continuous smooth surface.

[0011] In some scenarios, the first surface and / or the second surface being a continuous smooth surface can also be understood as that the first conductive layer is a continuous and non-segmented conductive layer, or in other words, the first conductive part and the second conductive part are continuous and non-segmented with each other.

[0012] In the technical solution, the first conductive layer is continuously and non-segmented, which is conducive to forming a continuous distribution of electric field between the first conductive layer and the second conductive layer, and conducive to making the light transmittance of different areas of the functional layer change continuously. In addition, the continuously and non-segmented first conductive layer is also conducive to reducing the probability of diffraction of imaging light on the first conductive layer, and reducing the adverse effects of the optical device on imaging quality.

[0013] In combination with the first aspect, in some implementations of the first aspect, the first surface faces the functional layer, the first surface is a continuous smooth surface, and the second surface is a plane.

[0014] In a possible implementation, the side of the second conductive layer facing the functional layer is also a continuous smooth surface.

[0015] In the technical solution, the surface of the first conductive layer faces the functional layer, which is conducive to making different parts of the functional layer have a certain thickness difference, expanding the difference in light transmittance between different parts of the functional layer, and improving the adjustment range of the optical device for light transmittance to a certain extent.

[0016] In combination with the first aspect, in some implementations of the first aspect, the thickness of the first conductive layer gradually decreases from the middle to both sides along the first direction, or the thickness of the first conductive layer gradually increases from the middle to both sides along the first direction.

[0017] In a possible implementation, the first direction can be the length direction or the width direction of the first conductive layer.

[0018] With reference to the first aspect, in some implementations of the first aspect, the first conductive layer comprises a first cross section, the first cross section is perpendicular to the first direction, and the first cross section has a top boundary intersecting the first surface and a bottom boundary intersecting the second surface, and the top boundary and the bottom boundary are parallel to each other.

[0019] In a case where the first direction is a length direction of the first conductive layer, the first cross section can be regarded as a cross section of the first conductive layer along a width direction; in a case where the first direction is a width direction of the first conductive layer, the first cross section can be regarded as a cross section of the first conductive layer along a length direction.

[0020] The technical solution can also be understood as follows: the thickness of the first conductive layer at different positions in the first direction can be different, and the thickness of the first conductive layer at different positions in a direction perpendicular to the first direction is substantially the same.

[0021] In the technical solution, the thickness of the first conductive layer changes only along the first direction, and the shape of the first conductive layer is relatively regular. The conductive layer with such a structure is conducive to the control of voltage distribution or current distribution on the conductive layer.

[0022] With reference to the first aspect, in some implementations of the first aspect, the maximum thickness h1 of the first conductive layer and the minimum thickness h2 of the first conductive layer satisfy:

[0023] In a possible case, under the same power supply mode, the greater the difference in thickness of the first conductive layer at different positions, the greater the voltage difference of the first conductive layer at different positions, the greater the difference in electric field intensity of the electric field formed between the first conductive layer and the second conductive layer at different positions, and further, the greater the difference in optical transmittance of the functional layer at different regions located in the two electric fields.

[0024] In the technical solution, the adjustment range of the transmittance of the optical device for imaging light is expanded, and the imaging capability of a lens module comprising the optical device is improved.

[0025] With reference to the first aspect, in some implementations of the first aspect, the optical device further comprises a first electrode group and a second electrode group, the first electrode group and the second electrode group each comprise M electrodes, M is an integer greater than or equal to 2, the M electrodes in the first electrode group are arranged at intervals and are each electrically connected to the first conductive layer, the M electrodes in the second electrode group are arranged correspondingly to the M electrodes in the first electrode group respectively, and the M electrodes in the second electrode group are each electrically connected to the second conductive layer; an electric field can be formed between any electrode in the first electrode group and the electrode arranged correspondingly in the second electrode group.

[0026] By arranging multiple electrodes at different positions on the conductive layer, different electrodes can be loaded with different voltages or currents, thereby facilitating the realization of multiple voltage distributions or current distributions on the conductive layer, facilitating the realization of multiple light transmittance distributions on the functional layer, and facilitating the improvement of the adjustment capability of the optical device to imaging light. An electric field can be formed between any two electrodes arranged oppositely between the two conductive layers, and different electrodes at different positions can be loaded with different voltages, so that the electric field intensity at different positions on the functional layer is different, and the corresponding light transmittance can also be different.

[0027] In combination with the first aspect, in some implementations of the first aspect, the M electrodes in the first electrode group are uniformly distributed on the outer periphery of the first conductive layer.

[0028] In a possible implementation, the M electrodes can be made of a conductive transparent material, such as indium tin oxide.

[0029] Arranging the electrodes on the first conductive layer facilitates the simplification of the circuit connection of the first conductive layer, arranging the electrodes on the outer periphery of the first conductive layer facilitates the electrical connection of the wires of the external power supply to the electrodes, and facilitates the reduction of the adverse effects of the connecting wires on the optical device.

[0030] In combination with the first aspect, in some implementations of the first aspect, the first electrode group includes a first electrode and a second electrode, the first electrode and the second electrode are located at two opposite ends of the first conductive layer, and are both located at positions of maximum thickness of the first conductive layer.

[0031] In this technical solution, the position of maximum thickness of the first conductive layer serves as the input position of the external power supply, and the position of minimum thickness of the first conductive layer is far away from the input position of the external power supply. In this case, the voltage at the position of maximum thickness is the maximum, and the voltage at the position of minimum thickness is the minimum. The implementation of this technical solution facilitates the expansion of the voltage difference at different positions on the first conductive layer, facilitates the expansion of the adjustment range of the light transmittance of the optical device to imaging light, and facilitates the improvement of the shooting capability of a lens module containing the optical device.

[0032] In a possible case, when the first electrode and the second electrode are arranged at the positions of maximum thickness of the first conductive layer in the manner of the present solution, the electric field formed between the first conductive layer and the second conductive layer can make the light transmittance at different positions on the functional layer be distributed in the following manner: in the direction of the line connecting the first electrode and the second electrode, the light transmittance at different positions on the functional layer is substantially the same, or in other words, the light transmittance of the functional layer is uniform in the direction of the line connecting the first electrode and the second electrode; in the direction perpendicular to the direction of the line connecting the first electrode and the second electrode, the light transmittance at different positions on the functional layer changes substantially uniformly, for example, the transmittance at different positions on the functional layer substantially increases from the middle to both sides along the direction.

[0033] With reference to the first aspect, in some implementations of the first aspect, the optical device further includes a first fixing sheet and a second fixing sheet, one side of the first conductive layer away from the second conductive layer is fixedly connected with the first fixing sheet, and one side of the second conductive layer away from the first conductive layer is fixedly connected with the second fixing sheet.

[0034] With reference to the first aspect, in some implementations of the first aspect, the first conductive layer is a film-shaped structure coated on one side of the first fixing sheet facing the second fixing sheet, and the second conductive layer is a film-shaped structure coated on one side of the second fixing sheet facing the first fixing sheet.

[0035] With reference to the first aspect, in some implementations of the first aspect, the optical device further includes a side wall, the side wall, the first fixing sheet and the second fixing sheet enclose a closed space.

[0036] The conductive layer and the functional layer are accommodated in the closed space in the optical device, which is conducive to reducing the pollution of dust and water vapor in the external environment to the conductive layer and the functional layer, and improving the stability of the optical device in adjusting the performance of the imaging light.

[0037] The second aspect provides a lens module, including a lens, a photosensitive element and the optical device in the first aspect and any possible implementation manner thereof arranged along an optical axis.

[0038] With reference to the second aspect, in some implementations of the second aspect, the optical device is located between the lens and the photosensitive element.

[0039] With reference to the second aspect, in some implementations of the second aspect, the lens module further includes an infrared cut filter, the infrared cut filter is located between the lens and the photosensitive element, and the fixing sheet of the optical device is included in the infrared cut filter.

[0040] In the technical solution, the fixing sheet on one side of the multiplexing optical device close to the lens or the fixing sheet on one side of the multiplexing optical device away from the lens is used as the infrared cut filter, which is conducive to reducing the space occupation of the lens module in the direction of the optical axis.

[0041] With reference to the second aspect, in some implementations of the second aspect, no other device is included between the optical device and the photosensitive element.

[0042] In the technical solution, no other device is arranged between the optical device and the photosensitive element, the imaging light adjusted by the optical device is not affected by other devices and can be directly captured by the photosensitive element for imaging, which is conducive to improving the imaging quality of the camera module.

[0043] With reference to the second aspect, in some implementations of the second aspect, the optical device is located on one side of the lens away from the photosensitive element.

[0044] In conjunction with the second aspect, in some implementations of the second aspect, the lens module also includes a lens cover plate, which includes a fixing piece for the optics on the side away from the lens.

[0045] In this technical solution, the fixing plate on the side of the optical device away from the lens is reused as the lens cover, which helps to reduce the space occupied by the lens module in the optical axis direction.

[0046] In conjunction with the second aspect, in some implementations of the second aspect, there are multiple lenses, and the optical components are located between the multiple lenses.

[0047] Thirdly, an electronic device is provided, comprising a battery module and a lens module in the second aspect and any possible implementation thereof, wherein the lens module is electrically connected to the battery module.

[0048] In one possible implementation, the electronic device may also include a mid-frame, with the lens module fixedly connected to the mid-frame. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of an electronic device provided in an embodiment of this application.

[0050] Figures 2 to 8 This is a schematic diagram of a lens module provided in an embodiment of this application.

[0051] Figure 9 This is a schematic diagram of the structure of an optical device provided in an embodiment of this application.

[0052] Figure 10 This is a schematic diagram showing how the light transmittance of the functional layer of the optical device provided in this application changes with voltage / current.

[0053] Figures 11 to 13 This is a schematic diagram of the structure of a conductive layer provided in an embodiment of this application.

[0054] Figures 14 to 16 This is a schematic diagram of another conductive layer structure provided in an embodiment of this application.

[0055] Figure 17 and Figure 18 This is a schematic diagram of another conductive layer provided in the embodiments of this application.

[0056] Figure 19 and Figure 20 This is a schematic diagram of another conductive layer provided in the embodiments of this application.

[0057] Figure 21 This is a schematic diagram of another conductive layer provided in the embodiments of this application.

[0058] Figure 22 yesFigure 9 A schematic diagram of a stereoscopic structure of an optical device.

[0059] Figure 23 A schematic diagram of another structure of an optical device provided by an embodiment of the present application.

[0060] Figure 24 A schematic diagram of another structure of an optical device provided by an embodiment of the present application.

[0061] Figure 25 A schematic diagram of another structure of an optical device provided by an embodiment of the present application.

[0062] Figure 26 A schematic diagram of a circuit connection of a conductive layer provided by an embodiment of the present application.

[0063] Figure 27 A schematic diagram of another circuit connection of a conductive layer provided by an embodiment of the present application.

[0064] Figure 28 A schematic diagram of a voltage distribution of a conductive layer and a light transmittance of different regions of a functional layer provided by an embodiment of the present application.

[0065] Figure 29 A schematic diagram of a voltage change curve of different positions of a conductive layer with distance to an electrode provided by an embodiment of the present application.

[0066] Figure 30 A schematic diagram of an adjustment result of a light transmittance of an optical device provided by an embodiment of the present application.

[0067] Figure 31 A schematic diagram of another adjustment result of a light transmittance of an optical device provided by an embodiment of the present application.

[0068] Figure 32 A schematic diagram of another adjustment result of a light transmittance of an optical device provided by an embodiment of the present application.

[0069] Figure 33 A schematic diagram of an effect of taking a photo by using a lens module provided by an embodiment of the present application. DETAILED DESCRIPTION

[0070] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings. In the drawings, the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions, different fill patterns are used to indicate different elements or different parts of the same element, and the material and the like of the elements can be referred to the content of the description. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0071] Unless otherwise defined, technical terms or scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like, as used in this description, refer to the orientation or position of the illustrated device or element as shown in the drawings and are merely used for convenience in providing reference for the description of the application and the pertinent drawings and are not intended to indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, or be used in a particular orientation, unless otherwise noted.

[0072] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" or "in other embodiments" or "in still other embodiments" in various places throughout this specification are not necessarily referring to the same embodiment, unless otherwise noted. The term "comprising" (and variations such as "comprise" or "comprises" or "including" or "includes" or "contain" or "contains") as used herein is used in the sense of "including, but not limited to," except where otherwise indicated.

[0073] Before formally introducing the embodiments of the present application, first, the terms that can be used in the following content are explained.

[0074] A photosensitive element, or image sensor, is a device that converts an optical image into an electronic signal, and is widely used in digital cameras and other electronic optical devices. Early image sensors used analog signals, such as video camera tubes. Today, image sensors are mainly divided into charge-coupled devices (CCD) and complementary metal-oxide semiconductor (CMOS) active pixel sensors.

[0075] An infrared cut filter, also known as an infrared filter or heat-absorbing filter, is a filter that is applied to filter the infrared waveband. For example, it can be installed on a device with an incandescent lamp (such as a slide projector or a projector) to block unnecessary heat from burning the lens, or it can be installed on a camera with a solid-state electronic device (CCD or CMOS) to prevent infrared light from passing through the camera lens and causing image distortion.

[0076] In order to improve the shooting capability of the electronic device in different scenes, one possible way is to equip the electronic device with multiple accessories that can have different light transmittance. In different shooting scenes, different accessories or the installation position and angle of the accessories are changed to match the shooting scenes with different light intensity distribution. For example, the aforementioned accessory can be a graduated neutral density filter. The user can manually or mechanically move the position of the filter or replace the filter with different gears to adjust the imaging effect.

[0077] The use of the above adjustment scheme in the electronic device will increase the size of the device. On the other hand, due to the limited number and performance of the accessories, the adaptability of the electronic device using the above adjustment scheme to various shooting scenes is often limited, and it is difficult to meet the light adjustment needs of various shooting scenes.

[0078] Therefore, the electronic device 10 provided in the embodiments of the present application can adjust the overall or partial transmittance of the imaging light according to the needs of the user in the shooting scene, thereby improving the adaptability of the electronic device to different shooting scenes and improving the quality of the photographed photos and videos in different scenes.

[0079] Figure 1 As shown in the schematic diagram of the electronic device 10, the electronic device 10 can include a middle frame 11, a display screen module 12, and a rear shell 13. The electronic device 10 can further include a front camera module 14 and / or a rear camera module 15. The front camera module 14 and the rear camera module 15 can be fixedly connected to the middle frame 11 of the electronic device 10, thereby being installed in the electronic device 10.

[0080] In one possible case, the front camera module 14 can be located below the display screen cover plate of the display screen module 12 of the electronic device 10.

[0081] In one possible case, the front camera module 14 and the rear camera module 15 of the electronic device 10 can both include the lens module provided in the embodiments of the present application. The user can adjust the transmittance of the lens to the imaging light according to the shooting scene when using the front camera module 14 and the rear camera module 15.

[0082] In some examples, the electronic device 10 can further include a circuit board assembly and a battery module. The circuit board assembly can include a processor and one or more sensors, such as an acceleration sensor, a distance sensor, and a gyroscope, etc. The battery module can be used to power the electronic components in the electronic device 10, such as the aforementioned front camera module 14 and rear camera module 15, the processor in the circuit board assembly, and the one or more sensors, etc.

[0083] Figures 2 to 8are different examples of the lens module 20 provided in the embodiments of the present application, which can be applied to the front camera module 14 of the electronic device 10 as described above, or the rear camera module 15 of the electronic device 10. The optical device 30 can be included in the plurality of lens modules 20, which can be used to adjust the transmittance of the imaging light on the lens module 20 in the shooting scene.

[0084] As shown in Figure 2 is an example of a lens module 20 provided in the embodiments of the present application, the lens module 20a, which can include the optical device 30, the lens 40 and the photosensitive element 50, for example. The optical axis of the lens 40 is the optical axis OO, which can also be referred to as the optical axis of the lens module 20a in some scenarios.

[0085] In order to make the imaging light adjusted by the optical device 30 no longer affected by other optical devices, it can be directly captured by the photosensitive element 50 and used for imaging. One possible case is that the optical device 30 can be arranged close to the photosensitive element 50, for example, the lens 40, the optical device 30 and the photosensitive element 50 can be arranged in sequence along the optical axis OO, or in other words, the optical device 30 can be located at the position P1 in Figure 2 , or in other words, the optical device 30 can be located between the lens 40 and the photosensitive element 50. In some scenarios, no other device can be arranged between the optical device 30 and the photosensitive element 50.

[0086] In order to improve the space utilization efficiency inside the lens module 20a, one possible case is that the optical device 30 can be located at the position P2 in Figure 2 , or in other words, the optical device 30 can be located on the side of the lens 40 away from the photosensitive element 50, or in other words, the optical device 30, the lens 40 and the photosensitive element 50 can be arranged in sequence along the optical axis OO.

[0087] One possible case is that the number of lenses 40 can be multiple, and the optical device 30 can be located between two adjacent lenses 40. For example, as shown in Figure 3 , the number of lenses 40 is 3, which are referred to as lens 41, lens 42 and lens 43, and the optical device 30 can be located between the lens 42 and the lens 43 (position P3 in the figure), or the optical device 30 can also be located between the lens 41 and the lens 42.

[0088] In order to better protect the lenses and other devices in the lens module, the embodiments of the present application provide a lens module 20b, which can include a lens cover plate 60, which can be located on the side of the lens module 20b close to the object to be shot and used to prevent water vapor, dust and other external environment from entering the inside of the lens module 20b.

[0089] In order to improve the protection capability of the lens cover plate 60 and reduce the influence of the lens cover plate 60 on the imaging quality of the lens module 20b, the lens cover plate 60 can be made of a material with high light transmittance, high wear resistance and high impact resistance. For example, but not limited to, the lens cover plate 60 can be composed of one or more of the following materials: high alumina silicate glass, alkali-free alumina borosilicate glass, sodium calcium silicate glass, or high-purity silicon dioxide, etc.

[0090] One possible case is that the optical device 30 can be located at position P4 in the figure, that is, the optical device 30 can be located between the lens cover plate 60 and the lens 40. In this case, the lens cover plate 60, the optical device 30, the lens 40 and the photosensitive element 50 can be arranged in sequence along the optical axis OO. Figure 4

[0091] In order to reduce the size of the lens module in the direction of the optical axis OO, it can be considered to multiplex part of the components of the optical device 30.

[0092] For example, but not limited to, the optical device 30 can be a multi-layer structure arranged in layers, and the thickness direction of the optical device 30 can be substantially parallel to the optical axis OO of the lens 40. For example, the functional layer 31 located at the outermost layer of the optical device 30 in the thickness direction can have similar functions as the aforementioned lens cover plate 60, that is, the functional layer 31 located on the outside of the optical device 30 can have similar structure and / or similar composition material as the lens cover plate 60.

[0093] Referring to Figure 5 The above scheme can also be understood as follows: the lens module 20b can include the optical device 30, the lens 40 and the photosensitive element 50, and the optical device 30 is located on the side of the lens 40 away from the photosensitive element 50. The side of the optical device 30 away from the lens 40 can be a functional layer 31, which can be used to reduce the pollution of pollutants in the environment to the devices in the lens module 20b. For example, but not limited to, the functional layer 31 can be composed of one or more of the following materials: high alumina silicate glass, alkali-free alumina borosilicate glass, sodium calcium silicate glass, or high-purity silicon dioxide, etc.

[0094] In order to reduce the adverse effects of infrared and other wavelengths in the imaging light on the imaging quality, so that the imaging color of the electronic device in the shooting scene is more realistic, in some examples, an infrared cut filter can also be included in the lens module, which can be used to filter infrared in the imaging light and improve the imaging quality of the lens module.

[0095] As Figure 6 ​The image shows a lens module 20c provided in an embodiment of this application. The lens module 20c may include a lens 40, an optical device 30, a photosensitive element 50, and an infrared cut-off filter 70. The infrared cut-off filter 70 may be composed of one or more of the following materials: blue glass, polycarbonate, and resin materials such as cyclic olefin polymers.

[0096] For example, the infrared cut-off filter 70 may be located between the lens 40 and the photosensitive element 50, and the optical device 30 may be located between the lens 40 and the infrared cut-off filter 70, or the optical device 30 may be located between the infrared cut-off filter 70 and the photosensitive element 50. In other words, referring to... Figure 6 Optical device 30 can be located at position P5 or position P6 in the figure.

[0097] Similarly, to reduce the size of the lens module along the optical axis OO, some components of the optical device 30 can be reused. For example, the optical device 30 can be a multi-layered structure with its thickness direction approximately parallel to the optical axis OO of the lens 40. For example, the outer functional layers 31a and / or 31b of the optical device 30 along its thickness direction can have similar functions to the aforementioned infrared cut-off filter 70; or, the outer functional layers 31a and / or 31b of the optical device 30 can have a similar structure to the infrared cut-off filter 70, and / or be made of similar materials.

[0098] As one possible implementation, refer to Figure 7 The lens module 20c may include an optical element 30, a lens 40, and a photosensitive element 50. The optical element 30 may be located between the lens 40 and the photosensitive element 50. The side of the optical element 30 closest to the lens 40 may be a functional layer 31a, which can be used to reduce the influence of infrared light and other light in the imaging light on the image quality. By way of example and not limitation, the functional layer 31a may be composed of resin materials such as blue glass, polycarbonate, and cyclic olefin polymers.

[0099] As one possible implementation, refer to Figure 8 The lens module 20c may include an optical element 30, a lens 40, and a photosensitive element 50. The optical element 30 may be located between the lens 40 and the photosensitive element 50. The side of the optical element 30 away from the lens 40 may be a functional layer 31b, which can be used to reduce the influence of infrared light and other light in the imaging light on the image quality. By way of example and not limitation, the functional layer 31b may be composed of resin materials such as blue glass, polycarbonate, and cyclic olefin polymers.

[0100] As a possible implementation, the optical device 30 can simultaneously include the aforementioned functional layer 31a and the functional layer 31b, both of which can have the function of the aforementioned infrared cut filter 70, and on this basis, the imaging light needs to pass through at least two infrared cut filters before being incident on the photosensitive element 50, the proportion of infrared light and other stray light in the imaging light is smaller, and the imaging quality of the lens module 20c is higher.

[0101] In some examples, the lens module 20 can simultaneously include the lens cover plate 60 and the infrared cut filter 70 in the aforementioned examples, and on this basis, the optical device 30 can be located at any one of the positions P1, P2, P3, P4, P5 and P6 in the aforementioned examples, which is not limited in the present application.

[0102] In some examples, more devices can also be included in the lens module 20, and the position of the optical device 30 in the lens module 20 is not limited to the positions provided in the above examples. Alternatively, the optical device 30 in the lens module 20 can be located on the propagation path of the imaging light, or in other words, the position of the optical device 30 in the lens module 20 satisfies that the imaging light can pass through the optical device 30.

[0103] The following will be described in detail Figures 9 to 25 The optical device 30 provided by the embodiments of the present application is described in detail. The light transmittance of the optical device 30 can change with the change of the applied voltage or the applied current, and accordingly the transmittance of the imaging light can be adjusted.

[0104] Figure 9 The structure of an optical device 30a provided by the embodiments of the present application is shown in the structural schematic diagram. The optical device 30a can include a conductive layer 100a, a conductive layer 100b and a functional layer 200 located between the conductive layer 100a and the conductive layer 100b.

[0105] In some examples, the transmittance of the functional layer 200 to the imaging light can change in response to the change of the electric field loaded on the functional layer 200.

[0106] As an example but not limitation, Figure 10 The curve C in the above figure roughly shows the change of the light transmittance of the functional layer 200 with the change of the current and / or voltage applied to the functional layer 200. As a possible case, the light transmittance of the functional layer 200 decreases from T1 to T2 during the increase of the applied voltage (or current) from S1 to S2. Exemplarily, the light transmittance of the functional layer 200 can change linearly with the change of the voltage (or current) in the interval from the voltage (or current) S1 to the voltage (or current) S2.

[0107] For example, the functional layer 200 can be composed of inorganic electrochromic materials and / or organic electrochromic materials, for example, the inorganic electrochromic materials can include one or more of tungsten trioxide, nickel oxide, or indium tin oxide, and the organic electrochromic materials can include one or more of viologen compounds, polythiophene polymers, polyaniline, or fullerene and its derivatives.

[0108] For example, the functional layer 200 can be composed of a dye liquid crystal material, specifically, the dye liquid crystal material can include a liquid crystal main body and a dye additive, where the liquid crystal main body can refer to a material whose arrangement manner changes correspondingly under the action of electric field, pressure, etc., for example, biphenyl liquid crystal, phenylcyclohexane liquid crystal, or lipid liquid crystal, etc. The dye additive can include azo dyes and / or anthraquinone derivatives, etc.

[0109] For example, the functional layer 200 can be composed of a photonic crystal, for example, one or more of a ferroelectric photonic crystal, an electrophoretic deposition photonic crystal, or an electrochemically active photonic crystal, etc.

[0110] Continuing to refer to Figure 9 In one possible case, the thickness (dimension in the direction D2 in the figure) of the functional layer 200 in different regions can be substantially equal, or in other words, the thickness of the functional layer 200 in different regions is uniform. In other words, the maximum value of the thickness of the functional layer 200 is denoted as L1, and the minimum value of the thickness of the functional layer 200 is denoted as L2, the values of L1 and L2 can satisfy: |L1-L2|≤δ, δ≥0, for example, L1=L2.

[0111] By way of example and not limitation, the thickness L of the functional layer 200 can be less than or equal to 1 mm, for example, L can be 0.9 mm, 0.6 mm, 0.3 mm, 0.1 mm, or 0.01 mm, etc. In the case where the thickness of the functional layer 200 is uniform, the aforementioned L1 and L2 can also be 0.9 mm, 0.6 mm, 0.3 mm, 0.1 mm, or 0.01 mm, etc., respectively.

[0112] Continuing to refer to Figure 9 In some examples, the thickness (dimension in the direction D2 in the figure) of the conductive layer 100a in different regions is different. In combination with Figure 11 In some examples, the conductive layer 100a can include a surface 100-1 and a surface 100-2, the surface 100-1 and the surface 100-2 are oppositely arranged along the thickness direction (direction D2 in the figure), the surface 100-1 can be away from the functional layer 200, and the surface 100-2 can face the functional layer 200. In some scenarios, the thickness of the conductive layer 100a in different regions being different can also be understood as the spacing between the surface 100-1 and the surface 100-2 at different positions in the direction D2 being different.

[0113] For example, the maximum thickness of the conductive layer 100a is denoted as h1, and the minimum thickness of the conductive layer 100a is denoted as h2. The values ​​of h1 and h2 can satisfy the following: For example, h1 = 10 × h2, h1 = 20 × h2, h1 = 40 × h2, h1 = 80 × h2, etc.

[0114] In other words, the conductive layer 100a includes at least two conductive portions with unequal thicknesses, wherein the thickness of the conductive portion with greater thickness can be h1, and the thickness of the conductive portion with less thickness can be h2, and the values ​​of h1 and h2 can satisfy the following:

[0115] In some examples, one of surfaces 100-1 and 100-2 is a curved surface, and the other is approximately planar. For example, refer to... Figures 11 to 14 Surface 100-1 is a plane, and surface 100-2 is a curved surface. For example, surface 100-1 can be a curved surface, and surface 100-2 can be a plane. The following example illustrates the case where surface 100-1 is a plane and surface 100-2 is a curved surface; however, the case where surface 100-1 is a curved surface and surface 100-2 is a plane can be referred to for implementation.

[0116] Figure 11 This can be viewed as a three-dimensional view of the conductive layer 100a. Figure 12 It can be regarded as Figure 11 A schematic diagram of surface 100-5 of the conductive layer 100a. One possible scenario is, as... Figure 11 and Figure 12 As shown, surface 100-2 can be a convex curved surface, or in other words, the distance between the middle region of surface 100-2 and surface 100-1 is relatively large, while the distance between the outer peripheral region of surface 100-2 and surface 100-1 is relatively small. Alternatively, the maximum thickness of conductive layer 100a is approximately located in the middle part of conductive layer 100a, and the minimum thickness of conductive layer 100a is approximately located in the outer peripheral part of conductive layer 100a.

[0117] References are provided as examples, not as limitations. Figure 11The conductive layer 100a may include sub-parts 110 and 120, which may be approximately mirror-symmetrical about the plane AA. Sub-parts 110 and 120 may be located on the left and right sides of the plane AA, respectively, and can be considered to be connected at the plane AA. The maximum thickness of the conductive layer 100a may be approximately located at the very center of the conductive layer 100a; in other words, in this case, the dimension of the plane AA in direction D2 may be approximately the maximum thickness h1 of the conductive layer 100a. The minimum thickness of conductive layer 100a can be approximately located at the edge of conductive layer 100a. Alternatively, conductive layer 100a can include side surface 100-3 and side surface 100-4. Side surface 100-3 is located on the opposite side of sub-part 110 from plane AA, and side surface 100-4 is located on the opposite side of sub-part 120 from plane AA. The dimensions of side surface 100-3 and side surface 100-4 in direction D2 can be approximately the minimum thickness h2 of conductive layer 100a. In some scenarios, side surface 100-3 and side surface 100-4 can be considered as the left and right sides of conductive layer 100a, respectively.

[0118] One possible scenario is, referencing Figure 11 Surface 100-2 can be a continuous, smooth curved surface. By way of example, and not limitation, the thickness of the conductive layer 100a generally decreases gradually from the middle portion towards the edges. By way of example, and not limitation, every point on the same line segment on surface 100-2 parallel to direction D3 is equidistant from surface 100-1; in other words, all line segments on surface 100-2 parallel to direction D3 are parallel to surface 100-1. Figure 13 The height (dimension in direction D2) of different positions on surface 100-3 is h2. Similarly, the height of different positions on surface 100-4 is also h2, and the height of different positions on plane AA is h1.

[0119] Figure 14 and Figure 15 Another possible structure of conductive layer 100a is shown. Figure 14 This can be viewed as a three-dimensional view of the conductive layer 100a. Figure 15 It can be regarded as Figure 14 A schematic diagram of surface 100-5 of the intermediate conductive layer 100a. (See diagram below.) Figure 14 and Figure 15 As shown, surface 100-2 can be a concave curved surface, or in other words, the distance between the middle region of surface 100-2 and surface 100-1 is small, while the distance between the outer peripheral region of surface 100-2 and surface 100-1 is large. Alternatively, the maximum thickness of conductive layer 100a is approximately located at the outer peripheral portion of conductive layer 100a, and the minimum thickness of conductive layer 100a is approximately located at the middle portion of conductive layer 100a.

[0120] References are provided as examples, not as limitations. Figure 14 The conductive layer 100a may include sub-parts 110 and 120, which are approximately mirror-symmetrical about the plane AA. Sub-parts 110 and 120 may be located on the left and right sides of the plane AA, respectively, and can be considered to be connected at the plane AA. The minimum thickness of the conductive layer 100a may be approximately located at the very center of the conductive layer 100a; in other words, in this case, the dimension of the plane AA in direction D2 may be approximately the minimum thickness h2 of the conductive layer 100a. The maximum thickness of conductive layer 100a can be approximately located at the edge of conductive layer 100a. Alternatively, conductive layer 100a can include side surface 100-3 and side surface 100-4. Side surface 100-3 is located on the opposite side of sub-part 110 from plane AA, and side surface 100-4 is located on the opposite side of sub-part 120 from plane AA. The dimensions of side surface 100-3 and side surface 100-4 in direction D2 can be approximately equal to the maximum thickness h1 of conductive layer 100a. In some scenarios, side surface 100-3 and side surface 100-4 can be considered as the left and right sides of conductive layer 100a, respectively.

[0121] One possible scenario is, referencing Figure 14 Surface 100-2 can be a continuous, smooth curved surface. By way of example, and not limitation, the thickness of the conductive layer 100a generally increases gradually from the middle portion towards the edges. By way of example, and not limitation, every point on the same line segment on surface 100-2 parallel to direction D3 is equidistant from surface 100-1; in other words, all line segments on surface 100-2 parallel to direction D3 are parallel to surface 100-1. Figure 16 The height (dimension in direction D2) of different positions on surface 100-3 is h1. Similarly, the height of different positions on surface 100-4 is also h1, and the height of different positions on plane AA is h2.

[0122] In some examples, both surfaces 100-1 and 100-2 of the conductive layer 100a can be curved surfaces.

[0123] For example, such as Figure 17 As shown, surfaces 100-1 and 100-2 can both be convex curved surfaces. In other words, with Figure 17Taking a plane Rf1 perpendicular to direction D2 as a reference, the distance from the middle region of surface 100-1 to plane Rf1 is greater than the distance from the outer periphery of surface 100-2 to plane Rf1. Similarly, the distance from the middle region of surface 100-2 to plane Rf1 is greater than the distance from the outer periphery of surface 100-2 to plane Rf1. Considering the thickness of conductive layer 100a, the thickness of the middle portion of conductive layer 100a is greater than the thickness of its outer periphery.

[0124] and Figure 11 or Figure 14 Surface 100-2 is similar. Figure 17 Surfaces 100-1 and 100-2 can both be continuous smooth surfaces.

[0125] One possibility is that surface 100-1 may include multiple points R1, each distance h11 from plane Rf1, where h11 is the maximum distance from surface 100-1 to plane Rf1. These points R1 may all lie on line Lr1, which may be parallel to the boundary of surface 100-1. In other words, in this case, the shape of surface 100-1 is approximately... Figure 11 The shape of surface 100-2 is consistent with that of the surface in the diagram. Similarly, surface 100-2 can also be approximately the same as the surface in the diagram. Figure 11 The shape of surface 100-2 is consistent.

[0126] One possible scenario is that surface 100-1 may include a point R1, the distance from point R1 to plane Rf1 being h11, where h11 is the maximum value of the distance from surface 100-1 to plane Rf1. In this case, as... Figure 18 As shown, surface 100-1 can be approximately convex in shape, similar to a convex mirror. Similarly, surface 100-2 can also be approximately convex in shape, similar to a convex mirror. Based on this, conductive layer 100a can be approximately... Figure 18 The shape of a convex lens, where both sides are convex.

[0127] For example, such as Figure 19 As shown, surfaces 100-1 and 100-2 can both be concave curved surfaces. In other words, with Figure 19 Taking a plane Rf2 perpendicular to direction D2 as a reference, the distance from the outer periphery of surface 100-1 to plane Rf2 is greater than the distance from the middle region of surface 100-2 to plane Rf2. Similarly, the distance from the outer periphery of surface 100-2 to plane Rf2 is greater than the distance from the middle region of surface 100-2 to plane Rf2. Considering the thickness of conductive layer 100a, the thickness of the outer periphery of conductive layer 100a is greater than the thickness of its middle portion.

[0128] One possible scenario is that surface 100-1 can include multiple points R2, each distance h12 from plane Rf2, where h12 is the minimum distance from surface 100-1 to plane Rf1. These points R2 can all lie on line Lr2, which can be parallel to the boundary of surface 100-1. In other words, in this case, the shape of surface 100-1 is approximately... Figure 14 The shape of surface 100-2 is consistent with that of the surface in the diagram. Similarly, surface 100-2 can also be approximately the same as the surface in the diagram. Figure 14 The shape of surface 100-2 is consistent.

[0129] One possible scenario is that surface 100-1 may include a point R2, the distance from point R2 to plane Rf2 being h12, where h12 is the minimum distance from surface 100-1 to plane Rf2. In this case, as... Figure 20 As shown, surface 100-1 can be approximately shaped like a concave mirror. Similarly, surface 100-2 can also be approximately shaped like a concave mirror. Based on this, conductive layer 100a can be approximately shaped like a concave mirror. Figure 20 The shape of a concave lens, where both sides are concave.

[0130] For example, one of surface 100-1 and surface 100-2 can be a convex surface, and the other can be a concave surface. One possibility is that both surface 100-1 and surface 100-2 are smooth surfaces, wherein the shape of the convex surface can be similar to that described above. Figure 11 The shape of surface 100-2 is similar to that of the surface mentioned earlier, or the shape of the convex curved surface can also be similar to that mentioned earlier. Figure 18 The shape of surface 100-1 in the text is similar; the shape of the concave curved surface can be similar to that in the previous text. Figure 14 The shape of surface 100-2 is similar to that of the concave curved surface mentioned earlier. Figure 20 The shape of surface 100-1 shown is similar. Related descriptions can be found in the preceding text and will not be repeated here.

[0131] The shapes of surfaces 100-1 and 100-2 in the above example are merely exemplary. Surfaces 100-1 and 100-2 may also have more shapes. For example, the left side of surface 100-1 may be a convex surface and the right side may be a concave surface. This application does not limit this.

[0132] The above example uses conductive layer 100a as an example for illustration. For relevant descriptions of the structure, shape, etc. of conductive layer 100b, please refer to the relevant content in conductive layer 100a.

[0133] Continue to refer to Figure 9In some examples, the optical device 30a may include an electrode 101a, which may be electrically connected to the conductive layer 100a and also electrically connected to a wire. When an external power source supplies power to the electrode 101a through the wire, current can flow through the conductive layer 100a. Similarly, the optical device 30a may also include an electrode 101b, which may be electrically connected to the conductive layer 100b and also electrically connected to a wire. When an external power source supplies power to the electrode 101b through the wire, current can flow through the conductive layer 100b.

[0134] When different currents are applied to conductive layers 100a and 100b respectively, or when different voltages are applied to conductive layers 100a and 100b respectively, the conductive layers 100a and 100b... Figure 9 The location of the functional layer 200 can form an electric field of a certain magnitude. Under the influence of the electric field, the transmittance of the functional layer 200 for imaging light can change accordingly.

[0135] To enable the generation of electric fields of varying intensities at different locations between conductive layers 100a and 100b, a feasible approach is to provide at least two electrodes 101a on conductive layer 100a and at least two electrodes 101b on conductive layer 100b. For example, the multiple electrodes 101a on conductive layer 100a and the multiple electrodes 101b on conductive layer 100b can be correspondingly arranged. The arrangement of electrodes 101a and 101b will be described in detail below and will not be elaborated upon here.

[0136] In some scenarios, the multiple electrodes 101a on the conductive layer 100a can be regarded as one electrode group, and the multiple electrodes 101b on the conductive layer 100b can be regarded as another electrode group. In this scenario, the multiple electrodes in the electrode group on the conductive layer 100a can be set to correspond with the multiple electrodes in the electrode group on the conductive layer 100b.

[0137] Continue to refer to Figure 9 In some examples, the optical device 30a may further include a fixing plate 300a and a fixing plate 300b, wherein the fixing plate 300a may be located on the side of the conductive layer 100a away from the functional layer 200, and the fixing plate 300b may be located on the side of the conductive layer 100b away from the functional layer 200. In other words, the fixing plates 300a and 300b can be considered to be located outside the optical device 30a, and the fixing plates 300a and 300b may be disposed opposite to each other.

[0138] Refer to the previous text Figure 5 According to the relevant description, in some scenarios, the aforementioned fixing plate 300a or fixing plate 300b can be regarded asFigure 5 In the functional layer 31 of the optical device 30, the fixing plate 300a or fixing plate 300b can be composed of one or more of the following materials: high aluminosilicate glass, alkali-free aluminoborosilicate glass, sodium-calcium silicate glass or high-purity silicon dioxide, etc.

[0139] Refer to the previous text Figure 7 and Figure 8 According to the relevant description, in some scenarios, the aforementioned fixing plate 300a or fixing plate 300b can be regarded as Figure 7 The functional layer 31a of the optical device 30, or the fixing plate 300a or fixing plate 300b, can be regarded as Figure 8 The functional layer 31b of the optical device 30. In this scenario, the fixing plate 300a or fixing plate 300b can be composed of resin materials such as blue glass, polycarbonate and cyclic olefin polymers.

[0140] In some examples, the optical element 30a may also include a sidewall 400, such as Figure 9 As shown, the sidewall 400 can be located on the outer periphery of the optical device 30a, or in other words, the sidewall 400 can surround the outside of the fixing plate 300a, the conductive layer 100a, the functional layer 200, the conductive layer 100b and the fixing plate 300b.

[0141] In one possible implementation, both conductive layer 100a and conductive layer 100b can be substantially film-shaped. Conductive layer 100a and conductive layer 100b can be formed by depositing films on two opposing surfaces of fixed sheet 300a and fixed sheet 300b. For example, conductive layer 100a can be formed on the surface of fixed sheet 300a by one or more of the following methods, and conductive layer 100b can be formed on the surface of fixed sheet 300b by one or more of the following methods: vacuum evaporation, chemical vapor deposition, ion-assisted deposition, ion beam sputtering, or sol-gel method, etc.

[0142] In one possible implementation, the aforementioned sidewall 400 may be formed by curing an adhesive material coated on the outer side of the fixing sheet 300a, conductive layer 100a, functional layer 200, conductive layer 100b, and fixing sheet 300b. Exemplarily, the sidewall 400 may be formed by curing one or more of the following adhesive materials: optically transparent adhesive, UV-curable adhesive, epoxy adhesive, or acrylic adhesive, etc.

[0143] To reduce the adverse effects of diffraction and other light rays on image quality when imaging light passes through the conductive layer 100a or conductive layer 100b of optical device 30a, and to ensure that a continuous electric field is formed between conductive layer 100a and conductive layer 100b, such as... Figure 11 , Figure 14 , Figure 18 andFigure 20 As shown, the conductive layers 100a and 100b of the optical device 30a can both be continuous wholes, or in other words, the conductive layers 100a and 100b do not include multiple separated and spaced parts, or in other words, there are no partitions inside the conductive layers 100a and 100b.

[0144] In some examples, to achieve control over the voltage or current in different regions of conductive layer 100a or conductive layer 100b, refer to Figure 21 The conductive layer 100a and / or the conductive layer 100b may include at least two mutually separated conductive portions, or the conductive layer 100a and / or the conductive layer 100b may be composed of a plurality of mutually spaced conductive portions.

[0145] For example, Figure 21 The illustration in Figure 21-1 This can be considered as the aforementioned Figure 11 or Figure 14 The figure shows a top view of the conductive layer 100a, which is composed of conductive portions 111, 112, 113, 114, and 115 spaced apart from each other. The top view of these conductive portions is generally rectangular, and a spacer Gd1 is provided between each adjacent conductive portion. One possibility is that the spacer Gd1 can be made of a conductive material, such as conductive adhesive or metal. Another possibility is that the spacer Gd1 can be trench-like, or that trenches or grooves can be formed between adjacent conductive portions. Yet another possibility is that the spacer Gd1 can be made of an insulating material; for example, the spacer Gd1 can be a long, raised structure, which can be formed by the outward protrusion of the main body of the fixing piece 300a connected to the conductive layer 100a. In other words, the spacer Gd1 can be made of the same material as the fixing piece 300a. For example, the spacer Gd1 can be composed of one or more of the following materials: high-alumina silicate glass, alkali-free aluminoborosilicate glass, sodium-calcium silicate glass, or high-purity silicon dioxide.

[0146] For example, Figure 21 The illustration in Figure 21-2 This can be considered as the aforementioned Figure 18 or Figure 20The figure shows a top view of the conductive layer 100a, which is composed of conductive portions 111, 112, and 113 spaced apart from each other. These conductive portions are generally circular or annular in plan view, with a spacer Gd2 between each adjacent conductive portion. One possibility is that the spacer Gd2 can be made of a conductive material, such as conductive adhesive or metal. Another possibility is that the spacer Gd2 can be trench-like, or a groove or channel can be formed between adjacent conductive portions. Yet another possibility is that the spacer Gd2 can be made of an insulating material; for example, the spacer Gd2 can be an annular protrusion formed by the main body of the fixing piece 300a connected to the conductive layer 100a protruding outwards. In other words, the spacer Gd2 can be made of the same material as the fixing piece 300a. For example, the spacer Gd2 can be composed of one or more of the following materials: high-alumina silicate glass, alkali-free aluminoborosilicate glass, soda-lime silicate glass, or high-purity silicon dioxide.

[0147] Figure 22 This is a three-dimensional structural schematic diagram of the aforementioned optical device 30 provided in the embodiments of this application, wherein, it is shown that... Figure 22-1 It can be regarded as Figure 11 A three-dimensional structural diagram of optical device 30a in the diagram, illustrating Figure 22-2 It can be regarded as Figure 11 Another three-dimensional structural schematic diagram of the optical device 30a, or, schematic diagram. Figure 22-2 It can be considered as including Figure 18 A three-dimensional structural schematic diagram of the optical device with a convex lens-shaped conductive layer 100a.

[0148] refer to Figure 22 In some scenarios, the structure of the optical device 30a can also be understood as follows: the fixing plates 300a and 300b, which are arranged opposite to each other, and the sidewall 400 can surround and form a receiving cavity, which can be used to accommodate the conductive layer 100a, the conductive layer 100b, and the functional layer 200. Alternatively, the fixing plates 300a and 300b, which are coated with the conductive layer 100a, and the sidewall 400 can surround and form a receiving cavity, which can be used to accommodate the functional layer 200. In one possible implementation, in order to reduce the adverse effects of particles and moisture in the external environment of the optical device 30 on the conductive layer 100a, the conductive layer 100b, and the functional layer 200, the aforementioned receiving cavity can be a closed receiving cavity.

[0149] Figure 9The present invention provides only one example of the structure of the optical device 30. The optical device 30 may have other structures. For example, the radial cross-sectional shape of the optical device 30 may also be elliptical, triangular or hexagonal, etc., and this application does not limit it. Figure 23 The image shown is an optical device 30b provided in an embodiment of this application. Figure 24 The image shown is an optical device 30c provided in an embodiment of this application. Figure 25 The image shown is an optical device 30d provided in an embodiment of this application.

[0150] Similar to the aforementioned optical device 30a, optical devices 30b, 30c, and 30d can all include a functional layer 200, a fixing plate 300a, a fixing plate 300b, and a sidewall 400. The functional layer 200 can be used to adjust the transmittance of imaging light incident on optical devices 30b, 30c, and 30d. The fixing plates 300a, 300b, and sidewall 400 can be used to form a receiving cavity to accommodate the conductive layers 100a and 100b, as well as the functional layer 200. Further details regarding these components can be found in the corresponding descriptions above and will not be repeated here.

[0151] Unlike the aforementioned optical device 30a, the two surfaces of the conductive layer 100a and conductive layer 100b in optical device 30b are both concave curved surfaces; the surface of the conductive layer 100b facing the conductive layer 100a in optical device 30c is approximately flat; and the surface of the conductive layer 100a facing the conductive layer 100b in optical device 30d is a concave curved surface, while the surface of the conductive layer 100b facing the conductive layer 100a is approximately flat.

[0152] Figure 26 and Figure 27 This is a schematic diagram of the conductive layer circuit connection in optical device 30. Figure 26 and Figure 27 The method of setting the electrodes in the optical device 30 is also shown. The electrodes on the conductive layer 100a can be set correspondingly to the electrodes on the conductive layer 100b. The following description focuses on the conductive layer 100a, while the conductive layer 100b can be referred to for implementation.

[0153] Through the electrodes on the conductive layer 100a (e.g. Figure 25 Electrode 101a) and corresponding electrodes on conductive layer 100b (e.g., in the conductive layer 100b) Figure 25 Different voltages are applied to the electrodes 101b) to generate a voltage difference between the two opposing electrodes. This voltage difference can generate an electric field between the two electrodes. The strength of this electric field can adjust the light transmittance of the portion of the functional layer 200 located between the two electrodes.

[0154] For example, a positive voltage can be applied to the electrode on conductive layer 100a, and correspondingly, a negative voltage can be applied to the corresponding electrode on conductive layer 100b. Also, for example, a negative voltage can be applied to the electrode on conductive layer 100a, and correspondingly, a positive voltage can be applied to the corresponding electrode on conductive layer 100b.

[0155] When multiple electrodes are provided on conductive layer 100a, the voltage applied to these electrodes can all be positive or negative. Similarly, when multiple electrodes are provided on conductive layer 100b, the voltage applied to these electrodes can all be negative or positive.

[0156] In some examples, for Figure 11 or Figure 14 The conductive layer 100a shown is a reference. Figure 26 The conductive layer 100a can be provided with multiple electrodes, and correspondingly, the conductive layer 100b can be provided with the same number of electrodes.

[0157] For example, conductive layer 100a may have electrodes 101-1 and 101-2, which can be electrically connected to the positive terminal of an external power supply. Correspondingly, conductive layer 100b may have two electrodes, corresponding to the aforementioned electrodes 101-1 and 101-2, respectively, and these two electrodes on conductive layer 100b can be electrically connected to the negative terminal of the external power supply. Alternatively, electrodes 101-1 and 101-2 of conductive layer 100a can be electrically connected to the negative terminal of the external power supply, and the two electrodes on conductive layer 100b can be electrically connected to the positive terminal of the external power supply. A closed loop can be formed between the external power supply, conductive layer 100a, functional layer 200, and conductive layer 100b. In this closed loop, a voltage difference exists between conductive layer 100a and conductive layer 100b, and an electric field can be generated between them at the location of functional layer 200.

[0158] One possibility is that, given the difference in thickness at different locations of the conductive layer 100a, the current or voltage supplied by the external power source to electrodes 101-1 and 101-2 may be unequal. A voltage difference can be formed between electrodes 101-1 and 101-2 in the conductive layer 100a, allowing the current or voltage supplied by the external power source to be redistributed across the conductive layer 100a. Based on this, the electric field strength between the conductive layers 100a and 100b will differ at different locations, and the transmittance of imaging light will also differ in different regions of the functional layer 200 located within the electric field.

[0159] To reduce adverse effects such as the obstruction of imaging light by the electrodes or the wires connected to the electrodes, the electrodes on the conductive layer 100a can be located on the outer periphery of the conductive layer 100a.

[0160] One possibility is that electrodes 101-1 and 101-2 can be located on opposite sides of the conductive layer 100a and close to the outer periphery of the conductive layer 100a. Another possibility is that electrodes 101-1 and 101-2 can be located on adjacent sides of the conductive layer 100a and close to the outer periphery of the conductive layer 100a. Yet another possibility is that electrodes 101-1 and 101-2 can be located on the same side of the conductive layer 100a and close to the outer periphery of the conductive layer 100a.

[0161] In some examples, more electrodes may be provided on conductive layer 100a, and a corresponding number of electrodes may be provided on conductive layer 100b.

[0162] For example, Figure 26 In the conductive layer 100a, electrodes 101-1, 101-2, 101-3, and 101-4 can be disposed, and these four electrodes can all be electrically connected to the positive terminal of an external power supply. Correspondingly, four electrodes can be disposed on the conductive layer 100b, and the four electrodes on the conductive layer 100b can all be electrically connected to the negative terminal of the external power supply. Alternatively, electrodes 101-1, 101-2, 101-3, and 101-4 can all be electrically connected to the negative terminal of the external power supply, and the four electrodes on the conductive layer 100b can all be electrically connected to the positive terminal of the external power supply. A closed loop can be formed between the external power supply, the conductive layer 100a, the functional layer 200, and the conductive layer 100b. In this closed loop, there is a voltage difference between the conductive layers 100a and 100b, and an electric field can be formed between them at the location of the functional layer 200.

[0163] One possible configuration is that electrode 101-1 is approximately located to the left of conductive layer 100a and near its edge; electrode 101-2 is approximately located to the upper part of conductive layer 100a and near its edge; electrode 101-3 is approximately located to the right of conductive layer 100a and near its edge; and electrode 101-4 is approximately located to the lower part of conductive layer 100a and near its edge. By way of example and not limitation, electrode 101-1 may be approximately located in the middle region of the left edge of conductive layer 100a; electrode 101-2 may be approximately located in the middle region of the upper edge of conductive layer 100a; electrode 101-3 may be approximately located in the middle region of the right edge of conductive layer 100a; and electrode 101-4 may be approximately located in the middle region of the lower edge of conductive layer 100a. The line connecting electrodes 101-1 and 101-3 is approximately perpendicular to the line connecting electrodes 101-3 and 101-4. Combination Figure 11Electrodes 101-2 and 101-4 are approximately located at the positions with the largest thickness values ​​on the conductive layer 100a, while electrodes 101-1 and 101-3 are approximately located at the positions with the smallest thickness values ​​on the conductive layer 100a.

[0164] Given the difference in thickness in different regions of the conductive layer 100a, by adjusting the current or voltage supplied by an external power source to electrodes 101-1, 101-2, 101-3, and 101-4, the voltage or current in different regions of the conductive layer 100a will differ. Based on this, the electric field strength between the conductive layer 100a and the conductive layer 100b will differ at different locations, and the transmittance of imaging light in different regions of the functional layer 200 located in the electric field will also differ.

[0165] In some examples, reference Figure 27 ,for Figure 18 or Figure 20 The conductive layer 100a shown can be provided with multiple electrodes, and correspondingly, the conductive layer 100b can be provided with the same number of electrodes.

[0166] For example, conductive layer 100a may have electrodes 101-1 and 101-2, which can be electrically connected to the positive terminal of an external power source. Correspondingly, conductive layer 100b may have two electrodes, corresponding to electrodes 101-1 and 101-2 respectively, which can be electrically connected to the negative terminal of the external power source. Alternatively, electrodes 101-1 and 101-2 can be electrically connected to the negative terminal of the external power source, and the two electrodes on conductive layer 100b can be electrically connected to the positive terminal of the external power source. A closed loop can be formed between the external power source, conductive layer 100a, functional layer 200, and conductive layer 100b. Within this closed loop, a voltage difference exists between conductive layer 100a and conductive layer 100b, creating an electric field at the location of functional layer 200.

[0167] One possibility is that, given the varying thickness of the conductive layer 100a at different locations, the current or voltage supplied by the external power source to electrode 101-1 may not be equal to the current or voltage supplied to electrode 101-2. A voltage difference can form between electrode 101-1 and electrode 101-2 in the conductive layer 100a, allowing the current or voltage supplied by the external power source to be redistributed across the conductive layer 100a. Consequently, the electric field strength between the conductive layers 100a and 100b will differ at different locations, causing changes in the transmittance of the functional layer 200 within the electric field for imaging light.

[0168] To reduce adverse effects such as the obstruction of imaging light by the electrodes or the wires connected to the electrodes, the electrodes on the conductive layer 100a can be located on the outer periphery of the conductive layer 100a.

[0169] Continue to refer to Figure 27 Let the positions of electrodes 101-1 and 101-2 on the conductive layer 100a be denoted as points A and B, respectively. Let the center point of the side of the conductive layer 100a facing the functional layer 200 be denoted as point O. An angle α can be formed between the line OA connecting point A and center point O and the line OB connecting point B and center point O. One possible scenario is that the angle α can satisfy: 0° < α < 360°. For example, the angle α can be 30°, 45°, 60°, 90°, 180°, and 270°, etc. For example, the angle α = 180°, or in other words, electrodes 101-1 and 101-2 are arranged approximately opposite each other and are both located on the outer periphery of the conductive layer 100a, and the line connecting electrodes 101-1 and 101-2 passes through the aforementioned center point, point O.

[0170] In some examples, more electrodes may be provided on conductive layer 100a, and a corresponding number of electrodes may be provided on conductive layer 100b.

[0171] For example, Figure 27 In the conductive layer 100a, electrodes 101-1, 101-2, 101-3, 101-4, 101-5, 101-6, 101-7, and 101-8 can be provided. Correspondingly, eight electrodes can be provided on the conductive layer 100b. Electrodes 101-1 to 101-8 can all be electrically connected to the positive terminal of an external power supply, and all eight electrodes on the conductive layer 100b can be electrically connected to the negative terminal of the external power supply. Alternatively, electrodes 101-1 to 101-8 can all be electrically connected to the negative terminal of the external power supply, and all eight electrodes on the conductive layer 100b can be electrically connected to the positive terminal of the external power supply. A closed loop can be formed between the external power supply, the conductive layer 100a, the functional layer 200, and the conductive layer 100b. Within this closed loop, a voltage difference exists between the conductive layers 100a and 100b, generating an electric field at the location of the functional layer 200.

[0172] One possibility is that the eight electrodes (electrode 101-1 to electrode 101-8) on the conductive layer 100a can be evenly distributed in the circumference of the conductive layer 100a. In other words, the angles formed by the lines connecting the positions of two adjacent electrodes to the center point O are equal (approximately 45°).

[0173] Given the difference in thickness in different regions of the conductive layer 100a, by adjusting the current or voltage supplied by an external power source to the eight electrodes (electrodes 101-1 to 101-8) on the conductive layer 100a, the voltage or current distribution in different regions of the conductive layer 100a will differ. Based on this, the electric field strength between the conductive layer 100a and the conductive layer 100b will differ at different locations, and the transmittance of imaging light in different regions of the functional layer 200 located in the electric field will change.

[0174] The above description focuses on the arrangement of multiple electrodes on conductive layer 100a. The arrangement of multiple electrodes on conductive layer 100b can be referenced from the above description.

[0175] In the process of adjusting the transmittance of imaging light using optical device 30, one feasible approach is that an external power supply can simultaneously supply current or apply voltage to conductive layer 100a and conductive layer 100b, so that a voltage difference is generated between the two ends of the functional layer 200 located between conductive layer 100a and conductive layer 100b, which are positioned opposite each other along the thickness direction. Figure 10 When the voltage difference between the two ends of the functional layer 200 arranged opposite each other along the thickness direction is different, the transmittance of imaging light through the functional layer 200 will be different.

[0176] As an example, Figure 11 The conductive layers 100a and 100b of the optical device 30a can be manufactured according to... Figure 26 The circuit is electrically connected to an external power source in the manner shown. The external power source energizes the electrodes of conductive layers 100a and 100b, so that the voltage difference between electrode 101-2 of conductive layer 100a and the corresponding electrode of conductive layer 100b is U1, the voltage difference between electrode 101-4 of conductive layer 100a and the corresponding electrode of conductive layer 100b is U1, the voltage difference between electrode 101-1 of conductive layer 100a and the corresponding electrode of conductive layer 100b is 0, and the voltage difference between electrode 101-3 of conductive layer 100a and the corresponding electrode of conductive layer 100b is 0.

[0177] Power the optical device 30a in the manner described above. Figure 28 The illustration in Figure 28-1 The voltage distribution on the conductive layer 100a is illustrated exemplarily. The highest voltage locations in the conductive layer 100a are approximately at electrodes 101-2 and 101-4, while the lowest voltage locations are approximately near the left and right edges of the conductive layer 100a. The voltage at different locations on the conductive layer 100a generally decreases from the positions of electrodes 101-2 and 101-4 towards the left and right edges.Figure 29 Curve C1 shows the variation of voltage at different locations on conductive layer 100a with distance from electrode 101-2 (or electrode 101-4) in direction D1. According to curve C1, the voltage difference between the maximum and minimum voltage points on conductive layer 100a is ΔU1. Curve C1 has a steep slope; in other words, the voltage difference between the maximum and minimum voltage points on conductive layer 100a decreases rapidly with increasing distance from the electrode.

[0178] Figure 28 The illustration in Figure 28-2 An exemplary illustration is shown in the schematic Figure 28-1 The distribution of light transmittance at different locations on the functional layer 200, located between conductive layers 100a and 100b, under the given voltage distribution is shown. The maximum light transmittance on the functional layer 200 is approximately located at the left and right edges of the functional layer 200, while the minimum light transmittance is approximately located in the middle of the upper and lower parts of the functional layer 200. In other words, the location of the maximum light transmittance on the functional layer 200 corresponds to the location of the minimum voltage on conductive layer 100a, and the location of the minimum light transmittance on the functional layer 200 corresponds to the location of the maximum voltage on conductive layer 100a. Furthermore, the difference between the maximum and minimum light transmittance on the functional layer 200 is approximately 0.8 units.

[0179] In addition, combined Figure 11 , Figure 26 and Figure 28 Electrodes 101-2 and 101-4 of conductive layer 100a are approximately located at the positions where the thickness of conductive layer 100a is greatest, along the line connecting electrodes 101-2 and 101-4. Figure 28 On the direction of D3, the thickness of the conductive layer 100a is basically the same, and in the direction perpendicular to the line connecting electrodes 101-2 and 101-4 ( Figure 28 Along direction D1, the thickness of the conductive layer 100a varies uniformly from the center to both sides. When the conductive layer 100a is powered by electrodes 101-2 and 101-4, reference... Figure 28 The illustration in Figure 28-2The light transmittance of functional layer 200 is basically the same at different positions in direction D3, while the light transmittance of functional layer 200 at different positions in direction D1 generally increases from the center to both sides along direction D1. In other words, the transmittance of functional layer 200 in direction D3 is roughly uniform, and the transmittance of functional layer 200 in direction D1 varies roughly uniformly and smoothly. Alternatively, in directions where the thickness of conductive layer 100a is uniform or roughly the same, the light transmittance of functional layer 200 is basically the same; in directions where the thickness of conductive layer 100a varies uniformly, the light transmittance of functional layer 200 varies roughly uniformly.

[0180] For example, to illustrate Figure 28-2 In the diagram, line segment Lv is parallel to direction D3, and the transmittance of functional layer 200 is basically the same at different positions on line segment Lv. Line segment Lh is parallel to direction D1. Reference point Pr1 is a reference point on functional layer 200 roughly located in the middle of line segment Lh, while reference points Pr2 and Pr3 are reference points on functional layer 200 roughly located at the ends of line segment Lh. On line segment Lh, the transmittance at different positions gradually increases from reference point Pr1 towards reference points Pr2 and Pr3.

[0181] In contrast, when the thickness of the conductive layers on both sides of the functional layer is uniform (e.g., the thickness is 0.5 × (h1 + h2)), a voltage is applied to the uniformly thick conductive layer in the manner described above for conductive layers 100a and 100b. Specifically, refer to... Figure 28 The illustration in Figure 28-3 The voltage difference applied between electrode W-2 of the uniform conductive layer 1 above the functional layer and the corresponding electrode of the uniform conductive layer 2 below the functional layer is U1. The voltage difference applied between electrode W-4 of the uniform conductive layer 1 and the corresponding electrode of the uniform conductive layer 2 is U1. The voltage difference applied between electrode W-1 of the uniform conductive layer 1 and the corresponding electrode of the uniform conductive layer 2 is 0. The voltage difference applied between electrode W-3 of the uniform conductive layer 1 and the corresponding electrode of the uniform conductive layer 2 is 0.

[0182] Figure 28 The illustration in Figure 28-3 The voltage distribution on the uniform conductive layer 1 is also shown when an optical device having a uniform conductive layer 1 and a uniform conductive layer 2 is powered according to the above power supply method. The highest voltage in the uniform conductive layer 1 is approximately located at electrodes W-2 and W-4, and the lowest voltage is approximately located in the central region of the uniform conductive layer 1. The voltage at different locations on the uniform conductive layer 1 generally decreases from the positions of electrodes W-2 and W-4 outwards. Figure 29Curve C2 in the figure shows how the voltage at different locations on the uniform conductive layer 1 varies with the distance from electrode W-2 (or electrode W-4) in direction D3. According to curve C2, the voltage difference between the maximum and minimum voltage points on the uniform conductive layer 1 is ΔU2. The slope of curve C2 is relatively gentle; in other words, the voltage between the maximum and minimum voltage points on the uniform conductive layer 1 decreases more slowly with increasing distance from the electrode.

[0183] Figure 28 The illustration in Figure 28-4 An exemplary illustration is shown in the schematic Figure 28-3 Under the condition of uniform voltage distribution, the light transmittance at different locations on the functional layer between uniformly conductive layer 1 and uniformly conductive layer 2 is analyzed. The maximum optical transmittance on the functional layer is approximately located in the central region of the functional layer, while the minimum light transmittance is approximately located in the middle region of the upper and lower parts of the functional layer. In other words, the location of the maximum light transmittance on the functional layer corresponds to the location of the minimum voltage on the conductive layer, and the location of the minimum light transmittance on the functional layer corresponds to the location of the maximum voltage on the conductive layer. Furthermore, the difference between the maximum and minimum light transmittance on the functional layer is approximately 0.4 units.

[0184] Combination Figure 28 and Figure 29 For the same power supply method, when the thickness of the conductive layer in the optical device is not uniform, the voltage difference at different positions on the conductive layer is large, and the difference in light transmittance at different positions on the functional layer is large; when the thickness of the conductive layer in the optical device is uniform, the voltage difference at different positions on the conductive layer is small, and the difference in light transmittance at different positions on the functional layer is small.

[0185] Combining the above text Figure 9 and Figure 11 The thickness of the conductive layer 100a is greatest approximately in the middle portion (where electrodes 101-2 and 101-4 are located), while its minimum thickness is approximately at the left and right edges. For a uniform conductive layer, the thickness is roughly the same at different locations. In other words, the thickness of the conductive layer 100a decreases approximately from the upper and lower middle regions towards the edges. The variation in thickness at different locations on the conductive layer 100a is similar to the variation in voltage at different locations on the conductive layer 100a and the variation in transmittance at different locations on the functional layer 200. Therefore, adjusting the thickness at different locations on the conductive layer 100a can, to some extent, increase the voltage difference at different locations on the conductive layer 100a and increase the difference in light transmittance at different locations on the functional layer 200.

[0186] When a conductive layer of uneven thickness is set on an optical device, the overall transmittance of the functional layer of the optical device to imaging light and the transmittance of different areas can be adjusted by applying different voltages or currents to different electrodes of the conductive layer. The following example illustrates this.

[0187] Taking the aforementioned optical device 30a as an example, combined with Figure 26 When the voltage difference between different electrodes of conductive layer 100a and conductive layer 100b is 0, such as Figure 30 The illustration in Figure 30-1 As shown, the transmittance of functional layer 200 for imaging light is approximately 100%; Figure 30 The illustration in Figure 30-2 As shown, when the voltage difference between different electrodes of conductive layer 100a and conductive layer 100b is V1, the transmittance of functional layer 200 for imaging light is approximately 50%; Figure 30 The illustration in Figure 30-3 As shown, when the voltage difference between different electrodes of conductive layer 100a and conductive layer 100b is 2×V1, the transmittance of functional layer 200 for imaging light is approximately 0.01%.

[0188] For ease of explanation, the following designations are used: Q1 is the voltage difference applied between electrode 101-1 of conductive layer 100a and the corresponding electrode on conductive layer 100b; Q2 is the voltage difference applied between electrode 101-2 of conductive layer 100a and the corresponding electrode on conductive layer 100b; Q3 is the voltage difference applied between electrode 101-3 of conductive layer 100a and the corresponding electrode on conductive layer 100b; and Q4 is the voltage difference applied between electrode 101-4 of conductive layer 100a and the corresponding electrode on conductive layer 100b. The light transmittance of functional layer 200 near electrode 101-2 of conductive layer 100a is K1; the light transmittance of the left side of the middle region in the width direction (direction D3) of functional layer 200 is K2; the light transmittance of the right side of the middle region in the width direction (direction D3) of functional layer 200 is K3; and the light transmittance of functional layer 200 near electrode 101-4 of conductive layer 100a is K4. Table 1 below roughly shows how the imaging light transmittance of functional layer 200 changes with the voltage difference between different regions of conductive layer 100a and conductive layer 100b.

[0189] Table 1

[0190]

[0191]

[0192] Compare with Table 1 Figure 31 The illustration in Figure 31-1 To indicateFigure 31-4 The greater the voltage difference Q2 applied between the electrode 101-2 of the conductive layer 100a and the corresponding electrode on the conductive layer 100b, the smaller the light transmittance K2 of the functional layer 200 near the position corresponding to the electrode 101-2 of the conductive layer 100a. The greater the difference between the voltage difference Q2 applied between the electrode 101-2 of the conductive layer 100a and the corresponding electrode on the conductive layer 100b and the voltage difference Q1 applied between the electrode 101-1 of the conductive layer 100a and the corresponding electrode on the conductive layer 100b, the more obvious the change in transmittance between the end of the functional layer 200 near the electrode 101-2 of the conductive layer 100a and the middle region in the width direction (direction D3) of the functional layer 200.

[0193] refer to Figure 31 The illustration in Figure 31-5 For example, when Q1 = 0, Q2 = Q4 = 0.5 × V2, and Q3 = V2, the light transmittance at different positions on the functional layer 200 generally decreases from left to right.

[0194] refer to Figure 31 The illustration in Figure 31-6 For example, when Q1 = V2, Q2 = 0.5 × V2, Q3 = 2 × V2, and Q4 = 3 × V2, the light transmittance at different positions on the functional layer 200 gradually decreases from the upper left corner to the lower right corner.

[0195] refer to Figure 31 The illustration in Figure 31-7 For example, when Q1 = Q3 = V2 and Q2 = Q4 = 0.5 × V2, the light transmittance at different positions on the functional layer 200 generally decreases gradually from the middle region in the width direction to the upper and lower parts.

[0196] Conductive layers 100a and 100b can be provided with more electrodes to achieve more precise control over the imaging light transmittance of different regions on the functional layer 200. For example, compared to the schematic diagram... Figure 31-7 When only electrode 101-1 is provided in the middle region of the left edge of the conductive layer 100a, and only electrode 101-3 is provided in the middle region of the right edge, two electrodes can be provided alternately in the middle region of the left edge of the conductive layer 100a, and two electrodes can also be provided in the middle region of the right edge of the conductive layer 100a. In this case, the voltage distribution between the two electrodes on the left edge and the two electrodes on the right edge in the width direction of the conductive layer 100a can be controlled more finely. Accordingly, the diagram shows... Figure 31-8 The width of the low light transmittance portion in the middle region of the 200-width functional layer can be greater than that shown in the diagram. Figure 31-7The width of the low light transmittance portion in the middle region of the 200-width functional layer is larger.

[0197] In previous articles Figure 21 The illustration in Figure 21-2 Taking the optical device shown as an example, combined with Figure 27 For ease of explanation, the following voltage differences are referred to as Q1, Q2, Q3, Q4, Q5, Q6, Q7, and Q8, respectively: the voltage difference between electrode 101-1 of conductive layer 100a and the corresponding electrode on conductive layer 100b; the voltage difference between electrode 101-2 and the corresponding electrode on conductive layer 100b; the voltage difference between electrode 101-3 and the corresponding electrode on conductive layer 100b; the voltage difference between electrode 101-4 and the corresponding electrode on conductive layer 100b; the voltage difference between electrode 101-5 and the corresponding electrode on conductive layer 100b; the voltage difference between electrode 101-6 and the corresponding electrode on conductive layer 100b; the voltage difference between electrode 101-7 and the corresponding electrode on conductive layer 100b; and the voltage difference between electrode 101-8 and the corresponding electrode on conductive layer 100b. Table 2 provides examples of several values ​​of the aforementioned voltage differences Q1 to Q8.

[0198] Table 2

[0199]

[0200]

[0201] Figure 32 The illustration in Figure 32-1 To indicate Figure 32-3 The table roughly illustrates the distribution of light transmittance in different regions of the functional layer within the optical device when the optical device is powered according to value methods 1 to 5 in Table 2. Figure 32 In the diagram, the bright line can be roughly regarded as the connecting line of each part of the functional layer with a light transmittance of 50%. In some scenarios, this bright line can be used as a characteristic line of the transmittance of the functional layer to the imaging light.

[0202] When the voltage difference between the conductive layers on the upper and lower sides of the functional layer is determined according to value selection method 1 in Table 2, as shown in the diagram. Figure 32-1 As shown, the feature lines are roughly parallel to direction D1. In other words, the transmittance of the functional layer for imaging light decreases roughly from bottom to top.

[0203] When the voltage difference between the conductive layers on the upper and lower sides of the functional layer is determined according to value selection method 2 in Table 2, as shown in the diagram. Figure 32-2As shown, the feature line forms an angle of approximately 45° with direction D1. In other words, the transmittance of the functional layer for imaging light decreases approximately from the lower left to the upper right.

[0204] When the voltage difference between the conductive layers on the upper and lower sides of the functional layer is determined according to value selection method 3 in Table 2, as shown in the diagram. Figure 32-3 As shown, the feature line forms an angle of approximately 90° with direction D1. In other words, the transmittance of the functional layer for imaging light decreases approximately from left to right.

[0205] Based on the above example, by adjusting the voltage difference between different electrodes of the conductive layer of the optical device, the transmittance of imaging light to different regions of the functional layer located between the two conductive layers can be controlled.

[0206] Figure 33 This roughly illustrates a lens module (e.g., one containing optical components 30) provided in this application. Figure 1 The effect of photos taken by camera module 14 or camera module 15. Figure 33 The illustration in Figure 33-1 The photo of Scene 1 was taken using a lens module that does not include optical components 30. Due to the large difference in brightness between the sky and the lake in Scene 1, details such as the clouds in the sky could not be captured by the camera. Figure 33 The illustration in Figure 33-2 For a photograph of scene 1 taken using the lens module containing optical element 30 provided in this application, adjusting the light transmittance of the sky portion in scene 1 through the optical element can prevent the sky portion from being overexposed, thereby preserving details such as clouds.

[0207] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An optical device (30), characterized in that, include: First conductive layer (100a), functional layer (200), and second conductive layer (100b), The functional layer (200) is located between the first conductive layer (100a) and the second conductive layer (100b). The first conductive layer (100a) and the second conductive layer (100b) are respectively used to electrically connect to different electrodes to form an electric field in the functional layer (200). The functional layer (200) is configured such that its light transmittance can change in response to changes in the electric field. The thickness of the first portion of the first conductive layer (100a) is different from the thickness of the second portion of the first conductive layer (100a).

2. The optical device (30) according to claim 1, characterized in that, The first conductive layer (100a) includes a first surface and a second surface disposed opposite to each other along the thickness direction, wherein the first surface and / or the second surface are continuous smooth curved surfaces.

3. The optical device (30) according to claim 2, characterized in that, The first surface faces the functional layer (200), the first surface is a continuous smooth curved surface, and the second surface is a plane.

4. The optical device (30) according to claim 2 or 3, characterized in that, The thickness of the first conductive layer (100a) gradually decreases from the middle to both sides along the first direction, or the thickness of the first conductive layer (100a) gradually increases from the middle to both sides along the first direction.

5. The optical device (30) according to claim 4, characterized in that, The first conductive layer (100a) includes a first cross section, which is perpendicular to the first direction, and the upper boundary of the first cross section intersecting the first surface and the lower boundary intersecting the second surface are parallel to each other.

6. The optical device (30) according to any one of claims 1 to 5, characterized in that, The maximum thickness h1 and the minimum thickness h2 of the first conductive layer (100a) satisfy the following:

7. The optical device (30) according to any one of claims 1 to 6, characterized in that, The optical device (30) further includes a first electrode group and a second electrode group, both of which include M electrodes, where M is an integer greater than or equal to 2. The first electrode group has M electrodes spaced apart and all electrically connected to the first conductive layer (100a). The second electrode group has M electrodes respectively corresponding to the M electrodes in the first electrode group. The M electrodes in the second electrode group are all electrically connected to the second conductive layer (100b). An electric field can be formed between any electrode in the first electrode group and the corresponding electrode in the second electrode group.

8. The optical device (30) according to claim 7, characterized in that, The M electrodes in the first electrode group are uniformly distributed on the outer periphery of the first conductive layer (100a).

9. The optical device (30) according to claim 8, characterized in that, The first electrode group includes a first electrode and a second electrode. The first electrode and the second electrode are located at opposite ends of the first conductive layer (100a) and are both located at the position of the maximum thickness of the first conductive layer (100a).

10. The optical device (30) according to any one of claims 1 to 9, characterized in that, The optical device (30) further includes a first fixing plate (300a) and a second fixing plate (300b), wherein the side of the first conductive layer (100a) away from the second conductive layer (100b) is fixedly connected to the first fixing plate (300a), and the side of the second conductive layer (100b) away from the first conductive layer (100a) is fixedly connected to the second fixing plate (300b).

11. The optical device (30) according to claim 10, characterized in that, The first conductive layer (100a) is a film structure coated on the side of the first fixing piece (300a) facing the second fixing piece (300b), and the second conductive layer (100b) is a film structure coated on the side of the second fixing piece (300b) facing the first fixing piece (300a).

12. The optical device (30) according to claim 10 or 11, characterized in that, The optical device (30) further includes a sidewall (400), which, together with the first fixing piece (300a) and the second fixing piece (300b), forms a closed space.

13. A lens module, characterized in that, It includes a lens (40) arranged along the optical axis, a photosensitive element (50), and an optical device (30) according to any one of claims 1 to 12.

14. The lens module according to claim 13, characterized in that, The optical device (30) is located between the lens (40) and the photosensitive element (50).

15. The lens module according to claim 14, characterized in that, The lens module also includes an infrared cut-off filter, which is located between the lens (40) and the photosensitive element (50), and the infrared cut-off filter includes a fixing plate of the optical device (30).

16. The lens module according to claim 15, characterized in that, No other devices are included between the optical device (30) and the photosensitive element (50).

17. The lens module according to claim 13, characterized in that, The optical device (30) is located on the side of the lens (40) away from the photosensitive element (50).

18. The lens module according to claim 17, characterized in that, The lens module also includes a lens cover plate, which includes a fixing piece on the side of the optical element (30) away from the lens (40).

19. The lens module according to claim 13, characterized in that, The number of lenses (40) is multiple, and the optical device (30) is located between the multiple lenses (40).

20. An electronic device, characterized in that, include: The battery module and the lens module according to any one of claims 13 to 19, wherein the lens module is electrically connected to the battery module.

Images