Sealed case and computer equipment

Abstract

The invention provides a sealed case and computer equipment, and relates to the technical field of heat dissipation. The sealed case comprises a case body, a flow guide cover and at least one pipeline, the case body at least comprises a bottom plate, a first top plate and two first side plates, the pipeline is provided with a first opening formed in the first top plate and a second opening formed in the bottom plate, and the case body is provided with a plurality of first cavities separated by the at least one pipeline; the flow guide cover is connected to the box body through a plurality of connecting parts and located on the outer side of the box body, and a second cavity is defined by the first top plate, the two first side plates, the connecting parts and the flow guide cover; at least one gas pumping device is arranged in the second cavity, at least part of the gas pumping device is opposite to the first opening, and a preset distance is formed between the gas pumping device and the first opening; the flow guide cover is further provided with at least one first ventilation hole used for the gas pumping device to exhaust gas flow, and the first ventilation hole is opposite to the gas pumping device. According to the I-shaped air duct sealing case, the internal heat dissipation efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to a sealed machine case and a computer device. BACKGROUND

[0002] The sealed machine case can effectively protect the internal hardware of the machine case, especially in some extreme environments such as high temperature, low temperature, humidity or corrosive environment. The sealed machine case can provide additional protection to prevent environmental conditions from damaging the internal hardware of the machine case, reduce the probability of hardware failure, and provide better anti-vibration capability to ensure the normal operation of the control device in harsh environments.

[0003] With the application of high-power modules and other hardware devices, it is very difficult to dissipate heat inside the machine case under the premise of sealing. In the related art, a water-cooled machine case is used to balance sealing and heat dissipation, but it has obvious disadvantages, such as poor reliability, the need for external water supply, and high maintenance cost. With a traditional air-cooled machine case, the air duct is generally placed on the outside of the machine case, which is difficult to dissipate heat efficiently. SUMMARY

[0004] The purpose of the present application is to provide a sealed machine case and a computer device to solve the technical problem of low heat dissipation efficiency of the sealed machine case.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] In a first aspect, the present application provides a sealed machine case, comprising a case body, a flow guide cover and at least one pipe, the case body comprising at least a bottom plate, a first top plate and two first side plates, the pipe having a first opening formed in the first top plate and a second opening formed in the bottom plate, the case body having a plurality of first cavities separated by the at least one pipe;

[0007] The flow guide cover is connected to the case body by a plurality of connecting parts and is located on the outside of the case body. The first top plate, the two first side plates, the plurality of connecting parts and the flow guide cover enclose a second cavity.

[0008] At least one gas pumping device is provided in the second cavity, and at least part of the gas pumping device is opposite to the first opening, and the gas pumping device and the first opening have a predetermined distance.

[0009] The flow guide cover further has at least one first vent hole for the gas flow discharged by the gas pumping device, and the first vent hole is opposite to the gas pumping device.

[0010] According to at least one of the embodiments of the present application, the fairing has a second top plate and two second side plates, the two second side plates are respectively connected to two ends of the second top plate, wherein the second top plate is opposite to the first top plate, and each second side plate is opposite to a corresponding first side plate;

[0011] Each second side plate is provided with a second vent hole for introducing air flow into the second cavity.

[0012] According to at least one of the embodiments of the present application, the sealed machine box further comprises a first heat dissipation structure, which is attached to at least part of the outer surface of the first top plate and the outer surface of the two first side plates.

[0013] According to at least one of the embodiments of the present application, the first heat dissipation structure comprises one of a heat pipe or a heat dissipation fin.

[0014] According to at least one of the embodiments of the present application, the box body has two opposite third openings, and the box body further comprises two cover plates respectively covering the corresponding third openings, and the two cover plates are used to close the plurality of first cavities.

[0015] According to at least one of the embodiments of the present application, the box body further has two sealing grooves, each of which is located on the circumferential side of the corresponding third opening, and each cover plate cooperates with the corresponding sealing groove.

[0016] According to at least one of the embodiments of the present application, the pipe is a rectangular pipe, and the length of the pipe is the same as the length of the first cavity.

[0017] The length direction of the pipe and the length direction of the first cavity are both the distribution direction from one cover plate to another cover plate.

[0018] According to at least one of the embodiments of the present application, the box body further comprises a plurality of insertion grooves for fixing the board card, and the length direction of the insertion groove is the same as the length direction of the pipe.

[0019] According to at least one of the embodiments of the present application, the pipe is provided with a second heat dissipation structure.

[0020] According to at least one of the embodiments of the present application, the second heat dissipation structure comprises one of a corrugated plate or a heat dissipation fin.

[0021] According to at least one of the embodiments of the present application, the number of pipes is a plurality, and a plurality of pipes are distributed along a first direction.

[0022] The first direction refers to the distribution direction from one first side plate to another first side plate.

[0023] According to at least one embodiment of the present application, the second heat dissipation structure comprises one of a heat pipe, a heat dissipation fin or a corrugated plate.

[0024] According to at least one embodiment of the present application, the second heat dissipation structure is the corrugated plate, and the corrugated plate is a corrugated plate integrally formed by continuously bending a metal plate.

[0025] The corrugated plate has a plurality of U-shaped structures distributed along a second direction, each of the U-shaped structures comprising two opposite first plate segments and a second plate segment connecting the two first plate segments, each of the first plate segments being perpendicular to the second plate segment, and each of the second plate segments being in contact with a corresponding inner side wall of the pipe.

[0026] The second direction refers to a distribution direction from one cover plate to another cover plate.

[0027] According to at least one embodiment of the present application, the metal plate is one of an aluminum alloy or a copper alloy.

[0028] According to at least one embodiment of the present application, the thickness of the metal plate is 0.01mm-0.5mm.

[0029] According to at least one embodiment of the present application, the distance between two adjacent first plate segments is 2mm-5mm.

[0030] According to at least one embodiment of the present application, the width of the corrugated plate is 10mm-50mm.

[0031] The width direction of the corrugated plate is the first direction.

[0032] In the second aspect, the present application further provides a computer device comprising the sealed cabinet of the first aspect.

[0033] In one or more technical solutions provided in the exemplary embodiments of the present application, at least one of the following beneficial effects can be achieved.

[0034] An exemplary embodiment of the present invention provides a sealed enclosure with at least one pipe inside the enclosure, dividing the enclosure into multiple first cavities. The pipe forms a first opening on the top plate of the enclosure and a second opening on the bottom plate of the enclosure, that is, the bottom and top of the enclosure are connected by at least one pipe. At least one gas extraction device is provided above the first opening at a predetermined distance from the first opening. Because a flow guide shroud is also provided on the outside of the housing, the flow guide shroud, together with the first top plate, the two first side plates, and multiple connecting parts, encloses the second cavity. At least one first ventilation hole is provided at the location of the gas extraction device. When the gas extraction device draws in airflow, air at the bottom of the housing is drawn out through at least one pipe from the first opening and transported to the outside of the flow guide shroud through at least one first ventilation hole. When air enters the pipe at the bottom, since the pipe is located inside the housing, it exchanges heat with the heat source inside the housing through the air, thus only removing heat from the inside of the housing. Simultaneously, due to the presence of the flow guide shroud, air located on the outer surface of the two first side plates of the housing is also drawn out of the housing from the area between the first top plate and the flow guide shroud in the second cavity through the first ventilation hole under the suction effect. In other words, under the action of the flow guide shroud, heat in the second cavity and in the pipes is drawn out by the gas extraction device, thereby dissipating heat from the inside of the housing. Based on this, when there is a preset distance between the gas extraction device and the first opening, a certain amount of airflow is also generated on both sides of the gas extraction device. The flow guide can make full use of this airflow. If the flow guide is not added, the randomness of the airflow direction will increase, which will reduce the utilization rate of the airflow. Simulation results show that when using the flow guide, the maximum operating temperature of the module inside the box can be reduced by 1.3℃ compared with not using the flow guide, and the maximum operating temperature of other modules decreases even more.

[0035] Therefore, the sealed chassis of the exemplary embodiment of the present invention has higher heat dissipation efficiency. Furthermore, compared to liquid cooling and other heat dissipation methods, the use of a more mature air-cooling method offers higher reliability. Attached Figure Description

[0036] The accompanying drawings illustrate exemplary embodiments of the invention and, together with the description thereof, serve to explain the principles of the invention. These drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification.

[0037] Figure 1 This is a schematic diagram of a sealed enclosure (without cover) according to an embodiment of the present invention;

[0038] Figure 2 This is a schematic diagram of the exploded structure of a sealed enclosure according to an embodiment of the present invention;

[0039] Figure 3is a structure schematic diagram of a sealed machine case (without a fairing) according to an embodiment of the present application;

[0040] Figure 4 is a top view structure schematic diagram of a sealed machine case according to an embodiment of the present application;

[0041] Figure 5 is a fairing structure schematic diagram of a sealed machine case according to an embodiment of the present application;

[0042] Figure 6 is an air flow duct schematic diagram of a sealed machine case according to an embodiment of the present application;

[0043] Figure 7 is a simulation schematic diagram of a sealed machine case (without a fairing) according to an embodiment of the present application;

[0044] Figure 8 is a simulation schematic diagram of a sealed machine case according to an embodiment of the present application;

[0045] Figure 9 is a simulation schematic diagram of a sealed machine case (without a second heat dissipation structure) according to an embodiment of the present application;

[0046] Figure 10 is a second heat dissipation structure schematic diagram of a sealed machine case according to an embodiment of the present application;

[0047] Figure 11 is an enlarged view of A part of Figure 10 ;

[0048] Figure 12 is a structure schematic diagram of a sealed machine case (with a puller) according to an embodiment of the present application;

[0049] Figure 13 is a structure schematic diagram of a sealed machine case (puller unfolding) according to an embodiment of the present application;

[0050] Figure 14 is a puller structure schematic diagram of a sealed machine case according to an embodiment of the present application;

[0051] Figure 15 is a puller (without a rotating shaft) structure schematic diagram of a sealed machine case according to an embodiment of the present application.

[0052] Reference signs: 10, duct; 11, first opening; 20, fairing; 21, second top plate; 211, first vent hole; 22, second side plate; 221, second vent hole; 31, cover plate; 32, first side plate; 33, bottom plate; 34, slot; 40, second heat dissipation structure; 50, gas pumping device; 60, first heat dissipation structure; 70, connecting part; 80, board card. DETAILED DESCRIPTION

[0053] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clear, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0054] The conventional sealed machine case is usually composed of upper and lower cover plates, left and right side plates, front and rear cover plates and internal board cards. Under the premise of being sealed, it is difficult for the sealed machine case to dissipate heat for high-power modules; on the other hand, under the premise of meeting the heat dissipation demand of the modules, the machine case needs to be communicated with the external environment for ventilation and heat dissipation by a fan, and it is difficult to be sealed.

[0055] In order to take into account the sealing and heat dissipation of high-power modules of the sealed machine case, the water cooling method is used in the related art, but the reliability is poor, an external water source needs to be provided, and the maintenance cost is very high. In the air cooling method, the air duct is generally arranged outside the sealed machine case, and it is difficult to achieve efficient heat dissipation.

[0056] In view of the above problems, the sealed machine case provided by the exemplary embodiments of the present application is provided with a through pipeline inside the case body, so that the airflow at the bottom of the case body is sent to the top of the case body by the gas pumping device, and a flow guide cover is arranged outside the case body, a second cavity is formed between the case body and the flow guide cover, and the gas pumping device is arranged in the second cavity. The airflow with small randomness is formed in the pipeline and the second cavity, so that the airflow can be fully utilized for heat dissipation, and the heat dissipation efficiency is improved.

[0057] It should be noted that the machine case provided by the exemplary embodiments of the present application can provide sealing and heat dissipation of internal electronic elements for computers, industrial computers, PLCs and other controllers.

[0058] Embodiment 1

[0059] Figure 1 is a structural schematic view of a sealed machine case (without cover plate) according to an embodiment of the present application; Figure 3 is a structural schematic view of a sealed machine case (without flow guide cover) according to an embodiment of the present application. As Figure 1 and Figure 3As shown, the chassis provided by the exemplary embodiments of the present application comprises a box body, a fairing 20 and at least one duct 10, the box body comprises at least a bottom plate 33, a first top plate and two first side plates 32, the duct 10 has a first opening 11 formed in the first top plate and a second opening formed in the bottom plate 33, the box body has a plurality of first cavities separated by the at least one duct 10; the fairing 20 is connected to the box body by a plurality of connecting parts 70 and is located outside the box body, the first top plate, the two first side plates 32, the plurality of connecting parts 70 and the fairing 20 enclose a second cavity; at least one gas pumping device 50 is arranged in the second cavity, at least part of the gas pumping device 50 is opposite to the first opening 11, and the gas pumping device 50 has a preset distance from the first opening 11; the fairing 20 further has at least one first vent hole 211 for discharging airflow of the gas pumping device 50, and the first vent hole 211 is opposite to the gas pumping device 50.

[0060] In actual application, the box body is enclosed by the bottom plate 33, the first top plate and the two first side plates 32 to form a cavity for accommodating corresponding electronic components, one or more ducts 10 are arranged in the cavity along the direction from the bottom plate 33 to the first top plate, the duct 10 separates the cavity into a plurality of first cavities, for example, when the duct 10 is one, the cavity is separated into two first cavities, and when the duct 10 is two, the cavity is separated into three first cavities, and each first cavity is provided with one or more electronic components, such as a board card 80. The duct 10 has a first opening 11 formed in the first top plate and a second opening formed in the bottom plate 33, so that the bottom and the top of the box body can be communicated through the duct 10. Further, the fairing 20 is arranged outside the box body, a plurality of connecting parts 70 protruding from the box body are arranged at the corresponding edge positions of the box body, the connecting parts 70 are exemplarily plate-shaped structures, the fairing 20 has a certain distance from the first top plate and the two first side plates 32, so that the fairing 20, the first top plate, the two first side plates 32 and the corresponding plurality of connecting parts 70 collectively enclose a relatively closed second cavity. One or more gas pumping devices 50 corresponding to the first opening 11 are arranged in the second cavity, and the gas pumping device 50 has a certain preset distance h from the first opening 11, exemplarily, the number of the gas pumping devices 50 can be two, and at least part of the gas pumping devices 50 is opposite to the first opening 11. Exemplarily, the gas pumping device 50 can be a fan or an axial flow fan.

[0061] Figure 6 is a schematic diagram of an airflow duct of a sealed chassis according to an embodiment of the present application. As shown, the chassis comprises a box body, a fairing 20 and at least one duct 10, the box body comprises a bottom plate 33, a first top plate and two first side plates 32, the duct 10 has a first opening 11 formed in the first top plate and a second opening formed in the bottom plate 33, the box body has a plurality of first cavities separated by the at least one duct 10; the fairing 20 is connected to the box body by a plurality of connecting parts 70 and is located outside the box body, the first top plate, the two first side plates 32, the plurality of connecting parts 70 and the fairing 20 enclose a second cavity; at least one gas pumping device 50 is arranged in the second cavity, at least part of the gas pumping device 50 is opposite to the first opening 11, and the gas pumping device 50 has a preset distance from the first opening 11; the fairing 20 further has at least one first vent hole 211 for discharging airflow of the gas pumping device 50, and the first vent hole 211 is opposite to the gas pumping device 50. Figure 6As shown, when the gas pumping device 50 is in operation, on the one hand, the air at the bottom of the box is led out of the first opening 11 through the corresponding pipeline 10, and then discharged out of the second cavity through the gas pumping device 50 and the first vent hole 211 provided on the flow guide cover 20; on the other hand, due to the preset distance h between the gas pumping device 50 and the first opening 11, the air flow outside the two first side plates 32 of the box also rises along the first top plate to the two sides of the gas pumping device 50, and then is discharged out of the second cavity through the first vent hole 211. It can be seen that since the pipeline 10 is not in communication with the first cavity in the box, the sealing of the box will not be damaged, and the air flow in the pipeline 10 can take away the heat inside the box to achieve heat dissipation. Further, when the flow guide cover 20 is not provided outside the box, that is, the second cavity is not formed, the randomness of the air flow is relatively strong, and the air flow on both sides of the gas pumping device 50 cannot be fully utilized, thereby reducing the heat dissipation efficiency. When the flow guide cover 20 is provided, the air flow on both sides of the box can be fully utilized, so that the air flow outside the two first side plates 32 of the box, especially the upper half of the first side plate 32, can be fully convected with the air flow to improve the heat dissipation efficiency.

[0062] Figure 7 is a simulation schematic diagram of a sealed machine box (without a flow guide cover) according to an embodiment of the application; Figure 8 is a simulation schematic diagram of a sealed machine box according to an embodiment of the application. As Figure 7 and Figure 8 As shown, when there is no flow guide cover 20, the maximum working temperature of the board card 80 in the box is 90.4℃, and when there is a flow guide cover 20, the maximum working temperature of the board card 80 in the box is 89.1℃, which shows that the flow guide cover 20 can improve the heat dissipation effect.

[0063] As can be seen from the above, the second cavity formed by the flow guide cover 20 and the gas pumping device 50 provided in the second cavity can utilize the heat inside the box and the heat at the positions of the two first side plates 32 and the first top plate of the box by controlling the randomness of the air flow, so that the air flow can be fully utilized by the gas pumping device 50, thereby improving the heat dissipation effect. Further, since the gas pumping device 50 is provided in the second cavity, the flow guide cover 20 can also protect the gas pumping device 50.

[0064] Figure 2 is an explosion structure schematic diagram of a sealed machine box according to an embodiment of the application; Figure 5 is a flow guide cover structure schematic diagram of a sealed machine box according to an embodiment of the application. As Figure 2 and Figure 5As shown, the exemplary embodiment of the application provides a flow guide cover 20 in the sealed cabinet, which has a second top plate 21 and two second side plates 22, the two second side plates 22 are respectively connected to the two ends of the second top plate 21, wherein the second top plate 21 is opposite to the first top plate, and each second side plate 22 is opposite to the corresponding first side plate 32; each second side plate 22 is provided with a second air vent 221, which is used to introduce air flow into the second cavity.

[0065] Exemplarily, the flow guide cover 20 is a U-shaped structure, the second top plate 21 has a spacing between the first top plate, and the second side plate 22 also has a spacing between the first side plate 32 of the cabinet, so as to form a second cavity between the first top plate and the two first side plates 32 of the cabinet, so as to constrain the randomness of the air flow outside the cabinet. In order to further expand the heat dissipation efficiency and increase the air flow in the second cavity, the second air vent 221 is provided on each second side plate 22, so that the use of air flow on both sides of the gas pumping device 50 can be expanded, and the fresh air entering from the second air vent 221 can further improve the heat exchange efficiency with the cabinet. The second air vent 221 can be arranged at any position on the height of the second side plate 22, and optionally, the second air vent 221 can be arranged at the position close to the second top plate of the second side plate 22, that is, the position of the second air vent 221 can be arranged between the second top plate 21 and the first top plate, so that the air flow entering from the second air vent 221 can be introduced into the second cavity through the first air vent 211 of the first top plate, and then the air flow can be introduced into the gas pumping device 50 from the two sides of the gas pumping device 50, and then the air flow can be discharged from the first air vent 211, so as to achieve heat dissipation in the second cavity, and then reduce the temperature in the cabinet. Figure 8 The simulation calculation shows that the air flow at the position of the second air vent 221 is larger than that at other positions, so the second air vent 221 is arranged at the upper half of the second side plate 22, especially at the position close to the top, and the heat dissipation effect is the best.

[0066] In order to improve the heat dissipation of the first top plate and the two first side plates 32 of the cabinet, a first heat dissipation structure 60 is further arranged on the outside of the cabinet, for example, on the outer surface of the two first side plates 32 and at least part of the outer surface of the first top plate. Exemplarily, the first heat dissipation structure 60 is arranged on the first top plate except the first opening 11. The first heat dissipation structure 60 is arranged in the second cavity, and exemplarily, the height of the first heat dissipation structure 60 on the first top plate is also the preset spacing h, at this time, the bottom surface of the gas pumping device 50 can be fixed on the top surface of the first heat dissipation structure 60 away from the first top plate. Exemplarily, the first heat dissipation structure 60 can be one of a heat pipe or a heat dissipation fin, so that the first heat dissipation structure 60 has a plurality of gaps, through which the air flow can enter the second cavity from the positions of the two first side plates 32 and from the second air vent 221, enter the gas pumping device 50 from the two sides of the gas pumping device 50, and then be discharged from the first air vent 211, so as to achieve heat dissipation in the second cavity, and then reduce the temperature in the cabinet.

[0067] In some embodiments, asFigure 2 As shown, the box has two opposite third openings, and the box further comprises two cover plates 31 respectively covering the two third openings, and the two cover plates 31 are used to close the plurality of first cavities through the corresponding sealing grooves. It should be noted that, Figure 2 The rear cover plate 31 can be a single plate structure to close the rear third opening of the box, and the front cover plate 31 can be an assembly composed of an adapter plate and an aviation plug panel. The two third openings are used to install the electronic components in the box, and the two cover plates 31 are used to close the box after installation. Specifically, a recessed stepped groove is formed on the wall surface of the third opening, and the corresponding cover plate 31 has a protrusion matched with the stepped groove, so that a sealing ring is placed in the stepped groove. After the cover plate 31 is fixed in the stepped groove, it can seal the box, thereby sealing each electronic component in the box, i.e., the first cavity containing the electronic component is isolated from the external environment.

[0068] Figure 4 is a top view structure diagram of a sealed machine box according to an embodiment of the present application. As Figure 3 and Figure 4 As shown, the box has two opposite third openings, and the box further comprises two cover plates 31 respectively covering the two third openings, and the two cover plates 31 are used to close the plurality of first cavities through the corresponding sealing grooves. It should be noted that,

[0069] In some embodiments, the box further comprises a plurality of slots 34 for fixing the board card 80, and the length direction of the slot 34 is the same as the length direction of the pipe 10. When the board card 80 is fixed in the slot 34, its heat dissipation surface can be attached to the outer surface of the pipe 10. Therefore, the board card 80 attached to the outer surface of the pipe 10 can be the board card 80 with the largest power consumption and the largest heat dissipation, and the attached pipe 10 conducts heat and exchanges heat with the air in the pipe 10. For example, the slot 34 can be a pair of slots 34 respectively arranged on the first top plate and the bottom plate, thereby fixing the board card 80.

[0070] Exemplarily, the number of the pipes 10 is multiple, and the multiple pipes 10 are distributed along a first direction. The first direction refers to the distribution direction from one first side plate 32 to another first side plate 32. The multiple pipes 10 are distributed in intervals, and the inner part of the cabinet is divided into multiple first cavities. In each first cavity, multiple slots 34 can be arranged. For example, two pipes 10 can be arranged near the middle part of the cabinet. The board card 80 between the two pipes 10 can be the board card 80 with the largest heat generation. The two sides of the board card 80 are attached to the outer surfaces of the two pipes 10, so as to reduce the maximum working temperature of the board card 80 and the temperature in the cabinet. It should be understood that the outer surface of the pipe 10 is relative to the flow path of the air in the pipe 10. Based on this, when the heat generation of the multiple board cards 80 in the cabinet is large, more than two pipes 10 can be arranged to attach and dissipate heat from the two sides of the board card 80 with the largest heat generation, so as to reduce the temperature in the cabinet.

[0071] In some embodiments, as shown in Figure 1 Exemplarily, the pipe 10 of the sealed cabinet further comprises a second heat dissipation structure 40. Exemplarily, the second heat dissipation structure 40 comprises one of a corrugated plate or a heat dissipation fin.

[0072] Compared with the conventional understanding, the arrangement of the member in the pipe 10 reduces the air flow and the heat dissipation effect of the pipe 10. Exemplarily, the pipe 10 of the sealed cabinet further comprises a second heat dissipation structure 40. Exemplarily, the second heat dissipation structure 40 comprises one of a corrugated plate or a heat dissipation fin.

[0073] Figure 10 is a schematic view of the second heat dissipation structure of the sealed cabinet according to an embodiment of the present application; Figure 11 is Figure 10 is an enlarged view of A part of Figure 10 and Figure 11As shown, the corrugated plate is made of a continuous bending and integrally formed metal plate, which has a plurality of U-shaped structures formed by continuously bending 90° to form two first plate segments 41 and a second plate segment 42. The second plate segment 42 is formed at least partially as a side surface of the corrugated plate on both sides, and the other part is formed by the opening of the U-shaped structure. Since each second plate segment 42 on one side is located in the same plane, it can be attached to one of the inner side walls of the rectangular duct 10, so that the heat in the cavity of the duct 10, that is, the box, can be conducted to the first plate segment 41 through the second plate segment 42, and then the heat is evenly distributed in the entire duct 10, and then the heat is dissipated from the box in the upward flow of the airflow in the duct 10. The specific structure of the corrugated plate is described as follows: between every two first plate segments 41, the second plate segment 42 is connected, and in the same U-shaped structure, the second plate segment 42 is connected to the end of the same side of the two first plate segments 41, and the opening direction of the adjacent two U-shaped structures is opposite. When the corrugated plate is installed in the duct 10, each first plate segment 41 is arranged in the second direction, and the duct 10 is divided into a plurality of sub-chambers, and the plurality of sub-chambers are distributed along the second direction. The corrugated plate divides the flow passage of the duct 10 into a plurality of sub-chambers, so that the airflow is more evenly distributed in the flow passage of the entire duct 10, and the heat dissipation efficiency is higher.

[0074] Considering the weight of the entire box and the problem of heat dissipation efficiency, the thickness of the corrugated plate can be a relatively thin metal plate, for example, the thickness of the metal plate can be 0.01mm-0.5mm, for example, 0.1mm-0.3mm, and optionally 0.15mm-0.25mm.

[0075] In some embodiments, as shown, Figure 11 The distance d between the adjacent two first plate segments 41 in the corrugated plate is 2mm-5mm. In another aspect, the width of the second plate segment 42 in the second direction is d, and the width of the opening of the U-shaped structure in the second direction is also d. For example, d can also be 3mm-4mm, and optionally 3.3mm-3.8mm.

[0076] As shown, Figure 11 The width w of the corrugated plate is 10mm-50mm; and the width direction of the corrugated plate is the first direction. Since the two side walls of the corrugated plate are attached to the two opposite inner side walls of the duct 10, the width of the duct 10 is the same as the width of the corrugated plate. The use of the corrugated plate in this width range not only ensures the air flow of the airflow, but also ensures that the heat of the outer side wall of the duct 10 can be fully conducted to each part of the corrugated plate, thereby improving the heat dissipation efficiency. For example, the width w of the corrugated plate is 13mm-40mm; and optionally, the width w of the corrugated plate is 17mm-30mm; and optionally, the width w of the corrugated plate is 18mm-28.8mm.

[0077] In one specific embodiment, the thickness of the metal plate of the corrugated plate is 0.25 mm, the width is 18 mm, the pitch d is 3.75 mm, and the number of the pipe 10 and the corresponding corrugated plate is both 2. Figure 9 is a simulation schematic diagram of a sealed machine case (without a second heat dissipation structure) according to an embodiment of the present application. For the convenience of description, the second heat dissipation structure in the sealed machine case of the exemplary embodiment of the present application is introduced by taking a corrugated plate as an example. As shown in Figure 8 and Figure 9 When the pipe 10 in the sealed machine case is provided with the corrugated plate, the highest working temperature of the board card 80 in the case body is 89.1℃, while when the pipe 10 is not provided with the corrugated plate, the highest working temperature of the board card 80 in the case body reaches 96.7℃, and the temperature is increased by 7.6℃. Therefore, when the pipe 10 in the sealed machine case is provided with the corrugated plate, the heat dissipation effect of the entire machine case can be further improved.

[0078] As shown in Figure 6 Overall, the air flow channel of the sealed machine case provided by the exemplary embodiment of the present application is in the shape of an H-shaped beam, and can form a chimney effect by being combined with the gas pumping device 50, thereby improving the heat dissipation efficiency of the entire machine case.

[0079] In some embodiments, as shown in Figure 1 There are a total of 7 board cards 80 in the case body of the sealed machine case, and the three board cards with the relatively largest power consumption are arranged at the positions on both sides of each pipe 10. The main heat transfer path of the high-power board card 80 is chip→ heat-conducting silicone pad→ board card 80 shell→ heat sink plate→ outer surface of the pipe 10→ corrugated plate→ air. The remaining four board cards 80 are away from the two pipes 10, and the main heat transfer path thereof is chip→ heat-conducting silicone pad→ board card 80 shell→ heat sink plate→ first side plate 32 or first top plate→ first heat dissipation structure 60→ air. The board cards 80 with different power consumptions are arranged at different positions in the case body, and different heat transfer paths are used to ensure stable and reliable operation of all the high-power board cards 80.

[0080] Example 2

[0081] Based on the example 1, Figure 12 is a structural schematic diagram of a sealed machine case (with a puller) according to an embodiment of the present application; Figure 13Fig. 1 is a structural schematic diagram of a sealed machine case (puller unfolding) according to an embodiment of the present application. Since the sealed machine case has a plurality of plugs on the front cover plate 31, it is necessary to electrically connect the cover plate 31 to the board card 80 inside the sealed machine case through an adapter plate, so as to realize cable-free connection of the sealed machine case. The cover plate 31 with aviation plugs is inserted into the connector, such as an LRM connector, on the adapter plate through pins, and the pins on the adapter plate are connected to the connector on each board card 80. Therefore, when the cover plate 31 with aviation plugs is inserted into the adapter plate and the sealed case is formed, it is difficult to remove the cover plate 31 from the case. The exemplary embodiment of the present application is provided with a puller 90 on both sides of the cover plate 31 with aviation plugs. When the cover plate 31 is connected to the case, the puller 90 is attached to one side of the case. When the cover plate 31 needs to be removed, the puller 90 is manually moved, and then the cover plate 31 can be easily removed.

[0082] In an embodiment, Figure 14 Fig. 2 is a structural schematic diagram of a puller of a sealed machine case according to an embodiment of the present application. Figure 15 Fig. 3 is a structural schematic diagram of a puller (without rotating shaft) of a sealed machine case according to an embodiment of the present application. As shown in Figs. 2 and 3, Figure 14 and Figure 15 the case further comprises at least one puller 90 hinged to the cover plate 31 through a rotating shaft. The puller 90 has a handle part 91 and an abutting part 92, and the handle part 91 and the abutting part 92 are respectively located on both sides of the rotating shaft. The end of the abutting part 92 away from the handle part 91 has at least one protruding structure 921 protruding away from the surface of the abutting part 92. The protruding structure 921 is a semicircular structure.

[0083] When the cover plate 31 needs to be removed from the case, the handle part 91 can be manually unfolded to both sides of the case. At this time, the puller 90 rotates around the rotating shaft, and correspondingly, the protruding structure 921 of the abutting part 92 can abut against the first side plate 32 of the case. Since the protruding structure 921 is a semicircular structure, the protruding structure 921 rotates on the first side plate 32. During the rotation, the distance between the abutting surface of the first side plate 32 and the rotating shaft increases, so that the cover plate 31 moves away from the first side plate 32, and then the cover plate 31 is removed. Exemplarily, the abutting part 92 has two protruding structures 921 arranged on both ends of the rotating shaft.

[0084] The exemplary embodiment of the present application further provides a computer device comprising the sealed machine case of any of the above embodiments, wherein the sealed machine case is provided with a plurality of board cards 80.

[0085] Compared with the prior art, the computer device of the exemplary embodiment of the present application has the same advantages as the sealed machine case, which will not be repeated here.

[0086] Those skilled in the art should understand that the above-mentioned embodiments are only intended to clearly illustrate the present application, and are not intended to limit the scope of the present application. Other changes or modifications can be made on the basis of the above disclosure, and these changes or modifications are still within the scope of the present application.

Claims

1. A sealed enclosure, characterized by, The sealed machine case comprises a box and at least one pipe, the box comprises at least a bottom plate, a first top plate and two first side plates, the pipe has a first opening formed in the first top plate and a second opening formed in the bottom plate, the box has a plurality of first cavities separated by the at least one pipe; At least one gas pumping device is arranged in the second cavity, the gas pumping device is at least partially opposite to the first opening, and the gas pumping device has a preset distance from the first opening.

2. The sealed enclosure of claim 1, wherein, The sealed machine case further comprises a first heat dissipation structure, which is attached to at least part of the outer surface of the first top plate and the outer surface of the two first side plates.

3. The sealed enclosure of claim 2, wherein, The first heat dissipation structure comprises one of a heat pipe or a heat dissipation fin.

4. The sealed enclosure of claim 1, wherein, The box has two opposite third openings.

5. The sealed enclosure of claim 4, wherein, The box further comprises two cover plates respectively covering the corresponding third openings, and the two cover plates are used to close the plurality of first cavities.

6. The sealed enclosure of claim 5, wherein, The box further has two sealing grooves, each of which is located on the circumferential side of the corresponding third opening, and each of the cover plates cooperates with the corresponding sealing groove.

7. The sealed enclosure of claim 5, wherein, The pipe is a rectangular pipe, and the length of the pipe is the same as the length of the first cavity. The length direction of the pipe and the length direction of the first cavity are both the distribution direction from one cover plate to the other cover plate.

8. The sealed enclosure of claim 7, wherein, The box further comprises a plurality of slots for fixing board cards, and the length direction of the slots is the same as the length direction of the pipe.

9. The sealed enclosure of any of claims 1-8, wherein, The box further comprises at least one puller hinged to the cover plate through a rotating shaft.

10. A computer device, comprising: The sealed machine case comprises the sealed machine case according to any one of claims 1-9.

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